Grinding head detection system for chemical mechanical grinding

Abstract

The invention relates to a grinding head detection system for chemical mechanical grinding, which comprises a base, the top of the base is provided with a fluid inlet regulator, and the fluid inlet regulator is provided with a valve nozzle which corresponds to a fluid inlet arranged on the bottom surface of an elastic film of a grinding head and is used for supplying fluid pressure so as to enter fluid into the elastic film; the detection unit is provided with a pressure sensing assembly, the pressure sensing assembly is arranged on the top surface of the grinding head so as to detect the adaptive state of the elastic film and the maintaining frame after the grinding head receives the fluid, and the pressure sensing assembly is connected with a connecting port; and the connecting port is connected with a signal transmission line and is electrically connected with a computer unit. Therefore, when the grinding head is actually contacted with the wafer, the possible state of the elastic film can be mastered in advance, and the quality of the elastic film can be controlled and managed.

Description

Technical Field

[0001] The present invention relates to a grinding head detection device, in particular to a grinding head detection system for chemical mechanical grinding. Background Art

[0002] Chemical-Mechanical Planarization (CMP) is a grinding process and operation flow that is usually performed using abrasive slurry or agents. It uses contact with chemical slurry or agents and mechanical grinding. It is often used in the process of wafer substrates or high and low thicknesses that meet standards (elimination or subtraction). When a grinding head is grinding a wafer with chemical mechanical grinding, in order to prevent the wafer from sliding and displacing during the grinding or polishing process, and to increase the tight pressure between the grinding head and the wafer, the grinding head is usually equipped with an elastic film that can strongly adsorb the wafer. One side of the elastic film is in contact with the wafer for adsorption, and the other side is adsorbed by a vacuum system. However, when the polishing head is actually in contact with the wafer, the flatness and fit of the elastic membrane, various deformations and possible aging (elastic fatigue) caused by the actual adaptation state of vacuum pressure, and the assembly state between the elastic membrane and the frame that protects the elastic membrane are not fully understood. If the process is applied rashly, it may slip from the wafer due to poor adsorption, thereby affecting the yield and process. Summary of the invention

[0003] In view of the problems of the background technology, the inventors believe that there should be an improved system, and for this purpose, a polishing head detection system for chemical mechanical polishing (CMP) is designed, comprising: a base, a fluid inlet regulator is provided on the top of the base, and the fluid inlet regulator is provided with a valve nozzle for corresponding to a fluid inlet provided on the bottom surface of an elastic membrane of a polishing head, and supplies fluid pressure to the elastic membrane to thereby allow fluid to enter (with the inlet fluid reversely simulating vacuum adsorption during future use); and a detection unit, the detection unit is provided with a pressure sensing component, the pressure sensing component is provided on the top surface of the polishing head to detect the adaptability state of the elastic membrane after the polishing head receives the inlet fluid (such as the flatness and fit of the elastic membrane and various deformations and possible aging (elastic fatigue) caused by the adaptability state of the actual inlet fluid pressure, and the assembly state between the elastic membrane and a retaining frame for protecting the elastic membrane, and the pressure sensing component is connected to a connection port, and the connection port is connected to a signal transmission line and a computer unit to form an electrical connection.

[0004] The beneficial effect of the present invention is that when the grinding head actually contacts the wafer, the possible flatness and fit of the elastic membrane, as well as various deformations and possible aging (elastic fatigue) produced during actual use, and other related information can be detected in advance, thereby eliminating the grinding heads that do not meet the requirements, or improving the vacuum pressure equipment in the process to avoid slipping from the wafer due to poor adsorption, which affects the improvement of yield and process. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 A three-dimensional schematic diagram of the present invention

[0006] Figure 2 This is a three-dimensional exploded view of the present invention

[0007] Figure 3 Schematic diagram of the front and back sides of the grinding head of the present invention

[0008] Figure 4 Schematic diagram of the present invention in the open cover state

[0009] Figure 5 Schematic diagram of the present invention with a grinding head mounted

[0010] Figure 6 Schematic diagram of the detection state of the present invention

[0011] Figure 7 Schematic diagram of the side view of the present invention

[0012] Figure 8 This is a schematic diagram of the signal conversion tone unit of the present invention presenting the tone on the screen.

[0013] Description of the figure number:

[0014] 1 Base

[0015] 11 Fluid enters the regulator

[0016] 111 Valve nozzle

[0017] 12 Human Machine Interface Unit

[0018] 2 Grinding head

[0019] 20 Keep Frame

[0020] 21 Elastic membrane

[0021] 211 Fluid inlet

[0022] 3 Detection unit

[0023] 31. Pressure sensing component

[0024] 32 Ports

[0025] 33 Computer Unit

[0026] 34 Signal connector

[0027] 4 Capping

[0028] 5 Signal conversion tone unit

[0029] 6 screens. DETAILED DESCRIPTION

[0030] See also Figure 1 ,Cooperate Figure 2 and Figure 7 As shown, the present invention relates to a CMP (Chemical-Mechanical Planarization) polishing head detection system, comprising:

[0031] A base 1 is provided with a fluid inlet regulator 11 at the top of the base 1. The fluid inlet regulator 11 is provided with a valve nozzle 111 to communicate with an external pump to generate fluid (including gas or liquid, the liquid includes water but is not limited to water) pressure for a fluid inlet 211 provided on the bottom surface of the elastic membrane 21 of a grinding head 2 to correspond (match) Figure 3 As shown), (with Figure 3 and Figure 8 As shown, a retaining frame 20 is provided at the outer edge of the elastic membrane 21 of the polishing head 2, and fluid pressure is supplied to the elastic membrane 21 so as to allow fluid to enter; and a detection unit 3 is provided, and the detection unit 3 is provided with a pressure sensing component 31, and the pressure sensing component 31 is provided on the top surface of the polishing head 2 to detect the adaptability state of the elastic membrane 21 after the polishing head 2 receives the fluid, and the pressure sensing component 31 is connected to a connection port 32, and the connection port 32 is connected to a signal transmission line 34 and a computer unit 33 to form an electrical connection.

[0032] Through the present invention, when the polishing head 2 is actually in contact with the wafer, the possible flatness and fit of the elastic membrane 21, various deformations and possible aging (elastic fatigue) produced during actual use, and the assembly state between the elastic membrane and the retaining frame that protects the elastic membrane (for example, whether the elastic membrane 21 and the retaining frame 20 deviate from the normal shape (commonly known as tilted head) after receiving the fluid) can be obtained in advance, so as to know the quality of the product in future use and make replacements or changes. It is possible to detect in advance and then eliminate the polishing heads 2 that do not meet the requirements, or to improve the vacuum pressure equipment in the process to avoid slipping or poor assembly with the wafer due to poor adsorption, which affects the improvement of yield and process.

[0033] In a preferred embodiment of the present invention, the pressure sensing component 31 is an array pressure sensor, which utilizes the dense matrix orientation of the array to provide a more specific adaptation state of the pressure distribution at each point.

[0034] In a preferred embodiment of the present invention, the base 1 is provided with a human-machine interface unit 12, which can utilize the pressure adjustment of the fluid entering the regulator 11 to achieve the fluid pressure regulation required for the relevant detection of the grinding head 2 through the operation of the human-machine interface unit 12, thereby enabling the pressure sensing component 31 to sense whether the grinding head 2 is in a fluid adaptation state and whether the unit pressure is uniform.

[0035] In a preferred embodiment of the present invention, the pressure sensing component 31 is an array pressure sensor, which utilizes the dense matrix orientation of the array to provide a more specific adaptation state of the pressure distribution at each point.

[0036] In a preferred embodiment of the present invention, the base is provided with a sealing cover 4 to protect the internal environment during the detection.

[0037] See also Figure 4 , when the cover 4 is opened, as Figure 5 As shown, the grinding head 2 can be allowed to be placed on the fluid inlet regulator 11 provided on the top of the base 1, and the operating human-machine interface unit 12 can be connected to an external pump to generate pressure for the incoming fluid, so that the fluid enters the elastic membrane 21 of the grinding head 2 through the valve mouth 111 of the fluid inlet regulator 11.

[0038] Depend on Figure 6 It can be observed that the pressure sensing component 31 is provided on the top surface of the polishing head 2, and can detect the adaptability state of the elastic membrane of the polishing head 2 after receiving the fluid. The pressure sensing component 31 can sense the adaptability state of the elastic membrane of the polishing head 2 after the elastic membrane 21 receives the fluid. For example, an array pressure sensor can use the dense matrix orientation of the array to provide pressure at each point. The adaptability state can be more clear, and then the pressure signal measured by the pressure sensor is connected to a connection port 32, and then the signal is transmitted to the computer unit 33 through the connection port 32 and the signal transmission line 34.

[0039] See also Figure 8 As shown, the computer unit 33 is provided with a signal conversion color tone unit 5, through which the pressure signal can be converted into a color tone and displayed on the screen 6, so that the operator can quickly understand whether the color tone distribution is uniform after the elastic membrane 21 of the grinding head 2 receives the fluid and the adaptive state of the elastic membrane 21 is uniform (the greater the color difference, the more uneven the display), and then judge and decide whether to use or replace. And with the Figure 3 and Figure 8 As shown, the retaining frame 20 is framed by the outer edge of the elastic membrane 21 of the grinding head 2, and cooperates with the observation Figure 8 The adaptive state of the elastic membrane 21 after receiving the fluid is presented in a tonal display, and the outer edge contour of the elastic membrane 21 (relative to the inner edge of the retaining frame) can be observed by color difference. Therefore, in addition to detecting the body of the elastic membrane 21, this case can also be used to relatively observe whether the elastic membrane 21 and the retaining frame 20 deviate from the normal shape (commonly known as tilted head) after receiving the fluid, so as to know in advance the quality of the product in future use and make replacements or adjustments.

Claims

1. A chemical mechanical polishing polishing head detection system, characterized in that: include: A base, a fluid inlet regulator is disposed on the top of the base, and a valve is disposed on the fluid inlet regulator to correspond to a fluid inlet disposed on the bottom surface of an elastic membrane of a grinding head, and to supply fluid pressure to the elastic membrane to enter the fluid; And a detection unit, the detection unit is provided with a pressure sensing component, the pressure sensing component is provided on the top surface of the polishing head to detect the adaptability state of the elastic membrane after the polishing head receives fluid, and the assembly state between the elastic membrane and the retaining frame that frames the elastic membrane, and the pressure sensing component is connected to a connection port, and the connection port is connected to a signal transmission line to form an electrical connection with a computer unit.

2. The chemical mechanical polishing head detection system according to claim 1, characterized in that: The pressure sensing component is an array pressure sensor.

3. The chemical mechanical polishing head detection system according to claim 1, characterized in that: The base is provided with a human-machine interface unit.

4. The chemical mechanical polishing head detection system according to claim 1, characterized in that: The base is provided with a cover.

5. The chemical mechanical polishing head detection system according to claim 1, characterized in that: A signal conversion tone unit is arranged inside the computer unit to convert the pressure signal into tone through the signal conversion tone unit.

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