Brazed diamond fretsaw and manufacturing method thereof

Abstract

The invention discloses a brazed diamond fretsaw and a manufacturing method thereof, and belongs to the technical field of super-hard abrasive tool manufacturing. The method comprises the steps of powder mixing, adhesive coating, sintering and the like, and specifically comprises the steps that powdery brazing filler metal and diamond particles are evenly mixed according to a certain proportion, then adhesive is coated on a cleaned base material, the mixed powder is evenly bonded, finally, the base material is heated to 700-1000 DEG C in a vacuum or protective atmosphere, heat preservation is conducted for 1-60 min after the brazing filler metal is completely melted, and the diamond particles are sintered. And cooling to obtain the brazed diamond linear fretsaw or annular fretsaw. The fret saw manufactured through the method participates in cutting, the exposure height of abrasive particles is large, the chip containing space is large, blockage is not likely to happen in the cutting process, the cutting service life is longer, the cutting efficiency is higher, the production process is more environmentally friendly compared with traditional electroplating, and the fret saw can be applied to cutting machining of various hard and brittle materials such as silicon, crystals, graphite and stone.

Description

Technical Field

[0001] The invention belongs to the technical field of superhard abrasive tool manufacturing, and in particular relates to a brazed diamond wire saw and a manufacturing method thereof. Background Art

[0002] Electroplated diamond ring wire is currently used for cutting of various hard and brittle materials such as silicon, graphite, crystal, and stone. Electroplated diamond ring wire relies on the mechanical embedding of diamonds in the coating. The bonding strength between diamond and coating is low, and it is easy to fall off prematurely during cutting. The utilization rate of diamond abrasive is low, and the tool life is relatively short. Moreover, electroplating has hazardous waste treatment, which is not friendly to the environment.

[0003] In order to solve the problem of low holding strength of electroplated diamond tools and premature diamond shedding, in recent years, domestic and foreign research has been conducted on the use of brazing to make diamond tools. Since diamond abrasives react with active elements (such as Cr, Ti, etc.) in molten brazing materials to form a metallurgical alloy bond, the ability of molten brazing components to wet and climb on the surface of diamond abrasives is improved, the bonding strength to diamonds is enhanced, and the problem of insufficient holding force of diamond abrasives on tools is solved. It can not only increase the height of diamond blades, but also improve the holding force of diamonds, greatly improving the cutting efficiency and life of diamond tools.

[0004] In the prior art, it is common to pre-arrange diamond beads on a substrate before making a diamond circular wire saw, fix the diamond on the substrate by injection molding and other processes, and then consolidate the diamond and the substrate by brazing, electroplating and other processes. Although the spaced arrangement of diamonds on the substrate can promote the removal of debris during cutting, this spaced arrangement method will increase the shear stress between the diamond and the substrate in the transition area, reduce the working life of the wire saw, and this wire saw usually has complicated preparation steps; some other prior arts mix glue and brazing material and apply them on the substrate before arranging diamonds. The mixture of glue and brazing material will affect the wetting and spreading of the brazing material on the surface of the substrate, thereby causing the diamonds to agglomerate on the substrate, resulting in uneven laying of diamond particles, affecting the wire cutting performance. Summary of the invention

[0005] In order to overcome the shortcomings of the prior art that the shear stress between diamond and substrate is large and the mixture of glue and brazing material causes diamond to agglomerate on the substrate, the purpose of the present invention is to provide a brazed diamond wire saw and a method for manufacturing the same.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions: The first object of the present invention is to provide a method for manufacturing a brazed diamond wire saw, comprising the following steps: Mixed powder: Mix the powdered brazing material and diamond particles evenly to form a mixed powder; Glue-coated cloth: Glue is applied on the base material, and the mixed powder is evenly bonded on the glue-coated annular base material; Sintering: The substrate after the fabric is heated to completely melt the brazing material, and the brazed diamond wire saw is obtained after heat preservation and cooling.

[0007] The method adopted by the present invention is to first apply glue on the substrate, and then arrange the mixed powder of powdered brazing material and diamond particles on the glue-coated substrate. This method can avoid chemical reactions or incompatibility that may occur during the mixing process of glue and brazing material, thereby reducing the generation of impurities and defects, and further avoiding the influence of these impurities and defects on the brazing quality and performance, resulting in the falling off of diamonds during the cutting process; secondly, the uniformly mixed powder of brazing material and diamond can be evenly laid on the substrate, ensuring the wetting and spreading of the brazing material on the substrate. At the same time, because only one layer of glue is applied on the wire substrate, only one side of the powdered material (diamond and brazing material mixture) is bonded to the wire by self-adhesive water, and there is no glue on the other sides, and the diamonds will not agglomerate and accumulate, thereby further ensuring the uniform distribution of diamonds on the substrate during the brazing process, avoiding the agglomeration of diamonds, thereby improving the cutting efficiency and cutting quality stability of the diamond wire saw, and reducing the falling off of diamonds during the cutting process.

[0008] Preferably, in the sintering step, the fabricated substrate is sintered under vacuum or protective atmosphere.

[0009] Further preferably, in the sintering step, the heating and insulation temperature is 700°C to 1000°C.

[0010] More preferably, in the sintering step, the insulation time is 1 to 60 min.

[0011] Preferably, in the powder mixing step, the weight ratio of the brazing material to the diamond particles is (5-20):1.

[0012] Preferably, in the powder mixing step, the particle size of the solder is in the range of 0.005 to 0.6 mm, and the particle size of the diamond particles is in the range of 0.005 to 0.6 mm.

[0013] Preferably, in the powder mixing step, the solder is selected from CuSnTi and / or AgCuSnTi.

[0014] Preferably, the substrate is made of carbon steel, tungsten wire, high-strength doped tungsten wire or molybdenum wire.

[0015] More preferably, the diameter of the substrate is 0.05 mm to 1 mm.

[0016] The second object of the present invention is to provide a brazed diamond linear wire saw or a diamond circular wire saw manufactured by the above-mentioned method for manufacturing the brazed diamond circular wire saw.

[0017] Compared with the prior art, the present invention has the following beneficial effects: The invention discloses a method for manufacturing a brazed diamond wire saw. The method comprises the following steps: firstly coating a substrate with glue, and then arranging a mixed powder of powdered brazing material and diamond particles on the coated substrate, so as to avoid chemical reaction or incompatibility between the glue and the brazing material in the mixing process, thereby reducing the generation of impurities and defects, and further avoiding the influence of these impurities and defects on the brazing quality and performance, which causes the diamond to fall off in the cutting process; at the same time, by adjusting the brazing material and the diamond component and the particle size distribution, the wire diameter is simply and efficiently guaranteed to be consistent, the powder single layer is not accumulated, the brazing material and the diamond mixed powder are promoted to be evenly laid on the substrate, and the brazing material is guaranteed to be wetted and spread on the substrate, thereby further ensuring the uniform distribution of the diamond on the substrate in the brazing process, avoiding the agglomeration of the diamond, thereby improving the cutting efficiency and cutting quality stability of the diamond wire saw, reducing the falling off of the diamond in the cutting process, and having high wire diameter consistency, low manufacturing cost and strong operability.

[0018] Furthermore, the present invention adopts carbon steel or high-strength doped tungsten wire strands as the substrate, and selects copper-based or silver-based active solder with low melting point active solder that matches the selected alloy substrate, so as to achieve a good brazing effect at a relatively low temperature, and has little effect on the strength of the alloy substrate, and can achieve effective brazing of diamonds in an environment of 700°C to 1000°C, and the obtained diamond tool layer is not easy to peel off, thereby greatly improving the service life of the diamond tool; at the same time, vacuum or protective atmosphere brazing can be used to avoid thermal damage to the diamond and the substrate, thereby achieving effective brazing.

[0019] The wire saw produced by the method of the present invention has a large exposed height of abrasive particles involved in cutting, a large chip holding space, is not easily blocked during the cutting process, has a longer cutting life and higher cutting efficiency, and the production process is more environmentally friendly than traditional electroplating. It can be applied to the cutting of various hard and brittle materials such as silicon, crystal, graphite, and stone. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention are clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0021] The method for manufacturing a brazed diamond wire saw proposed by the present invention specifically comprises the following steps: Providing a tool substrate. In some embodiments of the present invention, the substrate may be a braided annular substrate, a single metal wire linear substrate, or a linear substrate braided by multiple metal wires; Mixed powder: Mix the powdered brazing material and diamond particles evenly to form a mixed powder; Distributing the material: applying glue on the base material, and evenly distributing the mixed powder on the base material after the glue is applied; The adhesive material is pressure-sensitive resin adhesive or special adhesive for brazing, which can be applied with a brush. There are many ways to spread the mixed powder on the substrate, as long as the mixed powder is evenly spread on the substrate, such as using a special diamond spreading machine, or passing the mixed powder through the substrate after the glue is applied, or directly sprinkling the mixed powder on the surface of the substrate after the glue is applied. After spreading, micro-vibrate to remove excess mixed powder.

[0022] Sintering: The substrate after the fabric is heated to completely melt the brazing material, and the brazed diamond circular wire saw is obtained after heat preservation and cooling.

[0023] In the sintering step, the substrate after the fabrication is sintered in a vacuum or protective atmosphere. In the embodiment of the present invention, the protective atmosphere includes one or more of ammonia decomposition gas, hydrogen, inert gas, etc., but is not limited thereto.

[0024] In the sintering step, the heating and holding temperature is 700°C~1000°C.

[0025] In the sintering step, after the brazing material is completely melted, it is kept warm for 1 to 60 minutes, and then cooled naturally to complete the sintering step.

[0026] In the powder mixing step, the weight ratio of the brazing material to the diamond particles is (5-20):1.

[0027] In the powder mixing step, the particle size range of the brazing material is 0.005-0.6 mm, and the particle size range of the diamond particles is 0.005-0.6 mm.

[0028] In some embodiments of the present invention, in combination with the expected distribution density of diamonds on the substrate, or the exposure of diamonds after brazing, diamonds of different particle sizes can be mixed with brazing materials of different particle sizes. The exposure of diamonds can also be further adjusted by adjusting the amount of brazing material and diamonds, thereby easily producing a distributed diamond wire saw.

[0029] Specifically, in the powder mixing step, the solder is selected from low-temperature solders such as silver-based solders and copper-based solders, and specifically includes CuSnTi and / or AgCuSnTi.

[0030] Low melting point brazing filler metal has good fluidity. During the brazing process, the brazing filler metal can more easily fill the joint gap and form a good bond with the base material, which is conducive to the reliability of diamond brazing. Since the melting temperature of low melting point brazing filler metal is low, the required brazing temperature is also relatively low, which helps to reduce heat input, thereby reducing the impact on the base material's organization and mechanical properties, reducing the oxidation or decarburization of the base material, and further protecting the base material's performance.

[0031] Specifically, in some embodiments of the present invention, the material of the metal wire is selected from carbon steel, tungsten wire, high-strength doped tungsten wire or molybdenum wire.

[0032] In some embodiments of the present invention, the diameter of the metal wire used in the step of weaving the annular substrate is 0.05 mm to 1 mm.

[0033] In some embodiments of the present invention, the annular substrate is prepared by the following method: First, a metal core wire is wound into a ring core according to the required ring size, and then another metal wire is taken as a winding wire and wound around the ring core at a certain lay length. n Loop, weld the ends of the core wire, weld the ends of the winding wire, and form ( n +1) A multi-strand twisted circular base material.

[0034] The present invention is described in further detail below in conjunction with embodiments: Example 1 Step 1: Weave a 0.31mm loop wire and take a 3m long wire with a diameter of 0.11mm as the core wire loop. Take a 18m long wire with a diameter of 0.1mm and wrap it around the core wire 6 times at a certain lay length to form a 3m long 7-strand loop wire coil.

[0035] Step 2: ultrasonically clean the toroidal coil in a degreasing aqueous solution for 3 to 5 minutes, then clean it in pure water for 1 to 3 times and dry it.

[0036] Step 3, CuSnTi solder and diamond are mixed evenly in a weight ratio of 10:1, and the particle sizes of diamond and solder are both 5~45μm.

[0037] Step 4: Apply glue evenly to the metal wire loop rope.

[0038] Step 5: The glue-coated ring-shaped wire passes evenly through the powdery mixture, and the powdery mixture is evenly bonded to a layer on the surface of the metal wire ring.

[0039] Step 6, heat the loop wire with the brazing material in a vacuum furnace until the brazing material melts, raise the temperature to the melting point of the brazing material 890°C, keep the temperature for 10 minutes to completely melt the brazing material, and fix it to the surface of the metal wire by diamond brazing after cooling.

[0040] Example 2 Step 1: Weave a 0.25mm loop wire and take a 3m long 0.09mm diameter metal wire as the core wire loop. Take a 18m long 0.08mm diameter metal wire and wrap it around the core wire 6 times at a certain lay length to form a 3m long 7-strand loop wire coil.

[0041] Step 2: ultrasonically clean the toroidal coil in a degreasing aqueous solution for 3-5 minutes, then clean it in pure water for 1-3 times and dry it.

[0042] Step 3, AgCuSnTi solder and diamond are mixed evenly in a weight ratio of 10:1. The particle sizes of diamond and solder are both 38-63 μm.

[0043] Step 4: Apply glue evenly to the metal wire loop rope.

[0044] Step 5: The glue-coated ring-shaped wire passes evenly through the powdery mixture, and the powdery mixture is evenly bonded to a layer on the surface of the metal wire ring.

[0045] Step 6, heat the loop wire with the brazing material in an argon atmosphere furnace until the brazing material melts, raise the temperature to the brazing melting temperature of 800°C, keep it warm for 5 minutes to completely melt the brazing material, and fix it to the surface of the metal wire by diamond brazing after cooling.

[0046] The above contents are only for explaining the technical idea of ​​the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A method for manufacturing a brazed diamond wire saw, characterized in that: The following steps are involved: Mixed powder: Mix the powdered brazing material and diamond particles evenly to form a mixed powder; Glue-coated fabric: applying glue on the base material, and evenly bonding the mixed powder on the glue-coated base material; Sintering: The substrate after the fabric is heated to completely melt the brazing material, and the brazed diamond wire saw is obtained after heat preservation and cooling.

2. The method for manufacturing a brazed diamond wire saw according to claim 1, characterized in that: In the sintering step, the fabricated substrate is sintered under vacuum or protective atmosphere.

3. The method for manufacturing a brazed diamond wire saw according to claim 1 or 2, characterized in that: In the sintering step, the heating and insulation temperature is 700°C to 1000°C.

4. The method for manufacturing a brazed diamond wire saw according to claim 1 or 2, characterized in that: In the sintering step, the heat preservation time is 1 to 60 minutes.

5. The method for manufacturing a brazed diamond wire saw according to claim 1, characterized in that: In the powder mixing step, the weight ratio of the brazing material to the diamond particles is (5-20):

1.

6. The method for manufacturing a brazed diamond wire saw according to claim 1, characterized in that: In the powder mixing step, the particle size of the solder is in the range of 0.005 to 0.6 mm, and the particle size of the diamond particles is in the range of 0.005 to 0.6 mm.

7. The method for manufacturing a brazed diamond wire saw according to claim 1, characterized in that: In the powder mixing step, the solder is selected from CuSnTi and / or AgCuSnTi.

8. The method for manufacturing a brazed diamond wire saw according to claim 1, characterized in that: The material of the substrate is carbon steel, tungsten wire, high-strength doped tungsten wire or molybdenum wire.

9. The method for manufacturing a brazed diamond circular wire saw according to claim 1 or 8, characterized in that: The diameter of the substrate is 0.05 mm to 1 mm.

10. A brazed diamond wire saw manufactured by the manufacturing method of a brazed diamond circular wire saw according to any one of claims 1 to 9, wherein the brazed diamond wire saw is a linear wire saw or a circular wire saw.