Solar silicon polished section splitting device with self-defined size

Abstract

The invention provides a size-custom solar silicon polished section splitting device. The size-custom solar silicon polished section splitting device comprises a fixed assembly, a rotating assembly and a sliding assembly, the fixing assembly comprises a fixing support and a fixing clamping module, the fixing support is provided with a fixing mounting groove, the rotating assembly comprises a rotating support, a rotating driving device and a rotating clamping module, and the rotating support is provided with a rotating mounting groove. The tail end of a silicon polished section is clamped through the sliding clamping block, the sliding driving device is used for driving, then a user-defined preset stroke can be pushed, the preset stroke corresponds to the splitting size of the silicon polished section, and the silicon polished section is split in the direction of the horizontal rotating shaft through hinge joint of the fixed support and the rotating support. And the fixed clamping module and the rotary clamping module are matched to clamp and fix at the two ends of the splitting position, so that the splitting stability is improved, and the efficient splitting of a plurality of polished silicon sheet units can be realized along with the driving propulsion of the sliding driving device and the rotation of the rotary bracket.

Description

Technical Field

[0001] The present invention relates to the technical field of solar silicon wafer production, and in particular to a solar silicon wafer splitting device with customizable sizes. Background Art

[0002] The slicing device is mainly used to separate the silicon wafers that are not completely cut after slicing by the dicing machine. In the current photovoltaic industry, as the required size of semiconductor silicon wafers varies, it is necessary to design according to the specifications of semiconductor silicon wafers and the number of slicing.

[0003] The existing silicon wafer splitting is usually designed according to its predetermined specifications and its corresponding splitting mold, so the splitting specifications of the silicon wafer splitting device are often fixed. However, as more types of products are applied to solar silicon wafers, the size of solar silicon wafers needs to be customized. Therefore, it is necessary to design a solar silicon wafer splitting device with customizable size to meet the needs of wide applicability and also take into account the needs of automation and high efficiency. Summary of the invention

[0004] The object of the present invention is to provide a solar silicon wafer splitting device with customizable dimensions.

[0005] In order to achieve the purpose of the present invention, the present invention provides a solar silicon wafer splitting device with customized size, including a fixed component, a rotating component and a sliding component; the fixed component includes a fixed bracket and a fixed clamping module, the fixed bracket is provided with a fixed installation groove extending along the horizontal propulsion direction, the fixed installation groove is used to load the solar silicon wafer, the fixed installation groove is provided with a fixed clamping end at the end of the horizontal propulsion direction, the fixed clamping module is located at the fixed clamping end, the fixed clamping module is used to clamp the solar silicon wafer located at the fixed clamping end, and the fixed bracket is provided with a first hinged portion at the fixed clamping end; the sliding component includes a sliding clamping block and a sliding drive device, the sliding clamping block is located on the fixed installation groove, the sliding clamping block is located on the other end of the horizontal propulsion direction relative to the fixed clamping end, the sliding clamping block is used to clamp the end of the solar silicon wafer, and the sliding drive device is connected to the sliding clamping block and drives the sliding The movable clamping block moves along the horizontal propulsion direction; the rotating assembly includes a rotating bracket, a rotating driving device and a rotating clamping module; the rotating bracket is provided with a rotating mounting groove extending along the horizontal propulsion direction; the rotating mounting groove is used to load the solar silicon optical wafer; the rotating mounting groove is provided with a rotating clamping end at the end in the horizontal propulsion direction; the rotating clamping end is close to the fixed clamping end; the rotating clamping module is located at the rotating clamping end; the rotating clamping module is used to clamp the solar silicon optical wafer located at the rotating clamping end; the rotating bracket is provided with a second hinged portion at the rotating clamping end; the second hinged portion is hinged to the first hinged portion and rotates around the horizontal rotation axis; the rotating driving device is connected to the rotating bracket and drives the rotating bracket to rotate around the horizontal rotation axis; in the propulsion state, the bearing bottom surface of the fixed mounting groove is coplanar with the bearing bottom surface of the rotating mounting groove; in the split state, the bearing bottom surface of the fixed mounting groove is skewed with the bearing bottom surface of the rotating mounting groove.

[0006] It can be seen from the above scheme that the end of the silicon photonic wafer is clamped by the sliding clamping block, and the sliding drive device is used to drive it to a custom preset stroke, which corresponds to the size of the silicon photonic wafer. The silicon photonic wafer is split along the horizontal axis by hinged connection of the fixed bracket and the rotating bracket, and the fixed clamping module and the rotating clamping module are used to clamp and fix the two ends of the splitting position, thereby improving the stability of the split. With the driving advancement of the sliding drive device and the rotation of the rotating bracket, efficient splitting of multiple silicon photonic wafer units can be achieved.

[0007] A further solution is that the edge of the fixed installation groove at the fixed clamping end is arranged colinearly with the horizontal rotation axis direction.

[0008] As can be seen from the above, by aligning the edge with the horizontal axis, the position and size of the silicon wafer cracks can be made more accurate.

[0009] A further solution is that the bearing bottom surface of the fixed installation groove is provided with a slide groove extending along the horizontal propulsion direction, a slider is provided in the slide groove, a sliding drive device is connected to the slider and drives the slider to move along the horizontal propulsion direction, and a sliding clamping block is provided on the slider and moves with the slider.

[0010] A further solution is that the slider is provided with a positioning step in the fixed installation groove, and the sliding assembly also includes a sliding clamping drive device, the positioning step is used to support the end of the solar silicon optical wafer, and the sliding clamping drive device is connected to the sliding clamping block and drives the sliding clamping block to move toward the positioning step.

[0011] As can be seen from the above, by pushing the slider in the slide groove, the silicon photonic wafer can be pushed forward more smoothly and steadily. With the clamping of the positioning step and the sliding clamping block, the silicon photonic wafer can be stably pushed forward while achieving clamping.

[0012] A further solution is that the fixed clamping module includes a fixed clamping plate and a fixed clamping drive device, the fixed clamping drive device is connected to the fixed clamping plate, and the fixed clamping drive device drives the fixed clamping plate to move toward the bearing bottom surface of the fixed installation groove.

[0013] A further solution is that the rotating clamping module includes a rotating clamping plate and a rotating clamping driving device, the rotating clamping driving device is connected to the rotating clamping plate, and the rotating clamping driving device drives the rotating clamping plate to move toward the bearing bottom surface of the rotating mounting groove.

[0014] As can be seen from the above, by driving the fixed clamping plate and the rotating clamping plate, the automatic clamping of the silicon wafer splitting position can be achieved, thereby improving the stability during splitting to improve the yield rate.

[0015] A further solution is that the rotating clamping module includes a negative pressure generating device, the bearing bottom surface of the rotating mounting groove is provided with a negative pressure hole, and the negative pressure generating device is connected to the negative pressure hole.

[0016] As can be seen from the above, negative pressure holes can also be used on the rotating bracket to adsorb and fix the silicon photonic chip, which can achieve relative fixation of the silicon photonic chip.

[0017] A further solution is that a stop bevel is provided below the rotating clamping end of the rotating bracket, and the stop bevel is arranged at an acute angle to the bearing bottom surface of the rotating mounting groove; in the split state, the stop bevel is adjacent to the fixed bracket.

[0018] As can be seen from the above, by arranging the stop bevel, excessive rotation of the rotating bracket can be avoided, thereby improving the operating stability of the equipment.

[0019] A further solution is that a plurality of fixed ribs extending along the horizontal thrust direction are arranged in the fixed installation groove, and a fixed sub-groove is formed between two adjacent fixed ribs. The sliding assembly includes a plurality of sliding clamping blocks, and a sliding clamping block is located on a fixed sub-groove and clamps the end of the solar silicon wafer located on the fixed sub-groove.

[0020] A further solution is that a plurality of rotating ribs extending along the horizontal advancing direction are arranged in the rotating installation groove, and a rotating sub-groove is formed between two adjacent rotating ribs.

[0021] It can be seen from the above that through the arrangement of fixed ribs and rotating ribs, the splitting device can perform a second split on the long silicon optical wafer after the first split, and also cooperate with the customized propulsion stroke of the sliding drive device, thereby realizing customized splitting of length and width. The fixed ribs and rotating ribs can also be used to limit the movement of the silicon optical wafer, making the movement and propulsion of the silicon optical wafer smoother and more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural diagram of an embodiment of a solar silicon wafer splitting device of the present invention.

[0023] Figure 2 It is a structural diagram of an embodiment of the solar silicon wafer splitting device of the present invention from another perspective.

[0024] Figure 3 It is a structural diagram of the fixed component and the sliding component in the embodiment of the solar silicon wafer splitting device of the present invention.

[0025] Figure 4 It is a structural diagram of the rotating assembly in the embodiment of the solar silicon wafer splitting device of the present invention.

[0026] Figure 5 It is a cross-sectional view of an embodiment of the solar silicon wafer splitting device of the present invention in a propelled state.

[0027] Figure 6 It is a cross-sectional view of an embodiment of the solar silicon wafer splitting device of the present invention in a clamped and fixed state.

[0028] Figure 7 yes Figure 6 Enlarged view of point A in the middle.

[0029] Figure 8 It is a cross-sectional view of an embodiment of the solar silicon wafer splitting device of the present invention in a splitting state.

[0030] Fig. 9 yes Figure 8 Enlarged view of point B in the middle.

[0031] Fig.10 It is a structural diagram of another embodiment of the solar silicon wafer splitting device of the present invention.

[0032] Fig.11 It is a structural diagram of another embodiment of the solar silicon wafer splitting device of the present invention at another viewing angle.

[0033] Fig.12 It is a structural diagram of a fixed component and a sliding component in another embodiment of the solar silicon wafer splitting device of the present invention.

[0034] Fig.13 It is a structural diagram of the rotating assembly in another embodiment of the solar silicon wafer splitting device of the present invention.

[0035] The present invention is further described below in conjunction with the accompanying drawings and embodiments. DETAILED DESCRIPTION

[0036] The first embodiment of the solar silicon wafer splitting device: Reference Figures 1 to 9 The solar silicon optical wafer 101 splitting device includes a fixed component 1, a rotating component 2 and a sliding component 3. The fixed component 1 includes a fixed bracket 11 and a fixed clamping module. The fixed bracket 11 is arranged in a rectangular frame and is provided with a mounting cavity 114 along the horizontal propulsion direction X. The fixed bracket 11 is provided with a fixed mounting groove 111 extending along the horizontal propulsion direction X at the top. The fixed mounting groove 111 is used to load the solar silicon optical wafer 101. The fixed mounting groove 111 is provided with positioning ribs on both sides in the width direction. A slide groove 112 extending along the horizontal propulsion direction X is provided in the middle of the bearing bottom surface of the fixed mounting groove 111. The fixed mounting groove 111 is provided with a fixed clamping end 113 at the end of the horizontal propulsion direction X. The fixed clamping module is located at the fixed clamping end 113. The fixed clamping module is used to clamp the solar silicon optical wafer 101 located at the fixed clamping end 113.

[0037] The fixed clamping module includes a fixed clamping plate 12 and two fixed clamping driving devices 13. The fixed clamping plate 12 is arranged in a right-angle U shape, that is, the lower end of the fixed clamping plate 12 has a pressing flat plate. The two fixed clamping driving devices 13 are respectively located at the two ends of the fixed clamping plate 12 based on the horizontal rotation axis direction Y. The fixed clamping driving devices 13 are connected to the two ends of the fixed clamping plate 12. The fixed clamping plate 12 is located above the fixed clamping end 113. The fixed clamping driving device 13 drives the fixed clamping plate 12 to move toward the bearing bottom surface of the fixed installation groove 111, and then uses the driving pressing at both ends to improve the pressing stability. The fixed bracket 11 is provided with a first hinge 14 at the fixed clamping end 113, and the first hinge 14 is arranged in a reaming hole.

[0038] The sliding assembly 3 includes a sliding clamping block 31, a slider 33, a sliding clamping drive device 32 and a sliding drive device 34. The sliding drive device 34 is arranged as a linear drive device and is arranged in the installation cavity 114. The slider 33 is arranged in the slide groove 112. The sliding drive device 34 is connected to the slider 33 and drives the slider 33 to move along the horizontal propulsion direction X. The sliding clamping block 31 is arranged on the slider 33 and moves with the slider 33. The slider 33 is provided with a positioning step 331 in the fixed installation groove 111. The positioning step 331 is arranged in an L shape. The positioning step 331 is used to carry the end of the solar silicon optical wafer 101. The sliding clamping drive device 32 is connected to the sliding clamping block 31 and drives the sliding clamping block 31 to move toward the positioning step 331. The sliding clamping block 31 is located on the other end of the fixed clamping end 113 in the horizontal propulsion direction X. The sliding clamping block 31 is used to clamp the end of the solar silicon optical wafer 101, thereby clamping and pushing the solar silicon optical wafer 101 to move along the horizontal propulsion direction X.

[0039] The rotating assembly 2 includes a rotating bracket 21, a rotating driving device 25 and a rotating clamping module. The rotating bracket 21 is provided with a rotating mounting groove 211 extending along the horizontal propulsion direction X. The rotating mounting groove 211 is used to load the solar silicon optical wafer 101. The rotating mounting groove 211 is provided with a rotating clamping end 213 at the end of the horizontal propulsion direction X. The rotating clamping end 213 is close to the fixed clamping end 113. The rotating mounting groove 211 is respectively provided with positioning ribs 216 at both ends of the horizontal rotation axis direction Y. The rotating clamping module is located at the rotating clamping end 213. The rotating clamping module is used to clamp the solar silicon optical wafer 101 located at the rotating clamping end 213.

[0040] The rotating clamping module includes a rotating clamping plate 22, a rotating clamping driving device 23 and a negative pressure generating device (not shown). The rotating clamping plate 22 is arranged in a right-angle U shape, that is, the lower end of the rotating clamping plate 22 has a pressing plate, and two rotating clamping driving devices 23 are respectively located at the two ends of the rotating clamping plate 22 based on the horizontal rotation axis direction Y. The rotating clamping driving device 23 is connected to the two ends of the rotating clamping plate 22. The rotating clamping plate 22 is located above the rotating clamping end 213. The rotating clamping driving device 23 drives the rotating clamping plate 22 to move toward the bearing bottom surface of the rotating installation groove 211, and then uses the driving pressing at both ends to improve the pressing stability. The two ends of the rotating clamping plate 22 are respectively provided with positioning grooves 221, and the positioning grooves 221 are positioned by gap matching with the positioning ribs 216. The rotating bracket 11 is provided with a second hinge 24 at the rotating clamping end 213, and the second hinge 24 is arranged in a hinge column.

[0041] The bearing bottom surface of the rotating installation groove 211 is provided with a plurality of negative pressure holes 214, and the plurality of negative pressure holes 214 are connected to the air nozzle 215. The negative pressure generating device is connected to the negative pressure hole 214 through the air nozzle 215, and then the negative pressure is generated for the negative pressure hole 214, so as to adsorb and fix the solar silicon optical sheet 101. The rotating bracket 21 is provided with a stop bevel 218 below the rotating clamping end 213, and the stop bevel 218 is arranged at an acute angle with the bearing bottom surface of the rotating installation groove 211. The rotating bracket 21 is provided with a connecting portion 217 at the bottom of the rotating installation groove 211, and the rotating driving device 25 adopts a linear telescopic driving device and is arranged in the installation cavity 114, and the driving end of the rotating driving device 25 is hinged to the connecting portion 217. The second hinged portion 24 is hinged to the first hinged portion 14 and rotates around the horizontal rotation axis direction Y, and then the rotating driving device 25 is connected to the rotating bracket 21 and drives the rotating bracket 21 to rotate around the horizontal rotation axis.

[0042] Reference Figure 5 When splitting the solar silicon optical sheet 101, first install the solar silicon optical sheet 101 into the fixed installation groove 111, and clamp the end of the solar silicon optical sheet 101 through the sliding clamping block 31. As the sliding clamping block 31 moves, the solar silicon optical sheet 101 is pushed to move along the horizontal propulsion direction X toward the fixed clamping plate 12.

[0043] Reference Figure 6 and Figure 7 As the solar silicon photonic wafer 101 is advanced by a preset distance, in the advanced state, the bearing bottom surface of the fixed mounting groove 111 is coplanar with the bearing bottom surface of the rotating mounting groove 211, so that part of the solar silicon photonic wafer 101 is located in the rotating mounting groove 211, and the part of the solar silicon photonic wafer 101 located in the rotating mounting groove 211 is a preset length, and then the solar silicon photonic wafer 101 is clamped on both sides by the fixed clamping plate 12 and the rotating clamping plate 22, and the edge of the fixed mounting groove 111 at the fixed clamping end 113 is arranged colinearly with the horizontal rotation axis direction Y.

[0044] Reference Figure 8 and Fig. 9, and then the splitting is performed. The rotating support 21 is rotated downward by the driving of the rotating driving device 25. Then, in the splitting state, the bearing bottom surface of the fixed installation groove 111 is not in the same plane as the bearing bottom surface of the rotating installation groove 211. Since the fixed clamping plate 12 and the rotating clamping plate 22 are located on both sides to clamp the solar silicon optical wafer 101, the edge of the solar silicon optical wafer 101 at the fixed clamping end 113 is broken, and the first splitting of the solar silicon optical wafer 101 has been achieved. At the same time, in the splitting state, the stop bevel 218 is adjacent to the fixed support 11. At the same time, through vacuum adsorption, the negative pressure hole 114 is used to adsorb and fix the already split silicon optical wafer 101. Then, the already split silicon optical wafer 101 is taken away by the loading and unloading transfer equipment, and then the rotating support 21 is reset. With the silicon optical wafer 101 being pushed forward again and clamped and fixed, the silicon optical wafer 101 of the preset length can be split again.

[0045] Second embodiment of solar silicon wafer splitting device: Reference Figures 10 to 13 Based on the first embodiment, the second embodiment mainly improves the fixed ribs 17 and the rotating ribs 27. The first embodiment is used for the first splitting of the silicon photonic wafer 101. The split silicon photonic wafer 102 is arranged in long strips, and the second embodiment can be used for the second splitting.

[0046] Based on the first embodiment of the solar silicon wafer splitting device, a plurality of fixed ribs 17 extending along the horizontal thrust direction X are arranged in the fixed mounting groove 111, and a fixed sub-groove 1110 is formed between two adjacent fixed ribs 17, each fixed sub-groove 1110 is used to carry the silicon wafer 102, and each fixed sub-groove 1110 is provided with a slide groove 112, and the sliding assembly 3 includes a plurality of sliding clamping blocks 31, and a sliding clamping block 31 is located on a fixed sub-groove 1110 and clamps the end of the solar silicon wafer 102 located on the fixed sub-groove 1110.

[0047] In addition, a plurality of rotating ribs 27 extending along the horizontal advancing direction X are arranged in the rotating installation groove 211, and a rotating sub-groove 2110 is formed between two adjacent rotating ribs 27. The rotating sub-groove 2110 is used to carry part of the solar silicon optical wafer 102. The rotating clamping plate 22 is provided with a plurality of positioning grooves 221, and one positioning groove 221 is gap-matched with one fixed rib 17. The solar silicon optical wafer 102 is clamped by the fixed clamping plate 12 and the rotating clamping plate 22 on both sides. Therefore, through the same splitting step of the first embodiment, the edges of the plurality of solar silicon optical wafers 102 are broken at the fixed clamping end 113, and the second splitting of the solar silicon optical wafer 102 is achieved.

[0048] Of course, the above embodiments are only preferred embodiments of the present case, and may have more variations in specific applications. For example, the fixed clamping module and the rotating clamping module may have more forms. For example, spring clips, elastic parts, pressure blocks, or slits for clearance fit may be used to position the silicon wafer to improve the accuracy of the splitting. Each driving module may be driven electrically, pneumatically, or hydraulically. The above changes all fall within the scope of protection of the present invention.

[0049] As can be seen from the above, the end of the silicon photonic wafer is clamped by the sliding clamping block, and the sliding drive device is used to drive it to a custom preset stroke, which corresponds to the size of the silicon photonic wafer. The silicon photonic wafer is split along the horizontal axis by hinged connection of the fixed bracket and the rotating bracket, and the fixed clamping module and the rotating clamping module are used to clamp and fix the two ends of the splitting position, thereby improving the stability of the split. With the driving advancement of the sliding drive device and the rotation of the rotating bracket, efficient splitting of multiple silicon photonic wafer units can be achieved.

Claims

1. A solar silicon wafer splitting device with customizable size, characterized in that: It includes a fixed component, a rotating component and a sliding component; The fixing assembly comprises a fixing bracket and a fixing clamping module, the fixing bracket is provided with a fixing installation groove extending in a horizontal advancing direction, the fixing installation groove is used to load a solar silicon optical sheet, the fixing installation groove is provided with a fixing clamping end at an end in the horizontal advancing direction, the fixing clamping module is located at the fixing clamping end, the fixing clamping module is used to clamp the solar silicon optical sheet located at the fixing clamping end, and the fixing bracket is provided with a first hinged portion at the fixing clamping end; The sliding assembly comprises a sliding clamping block and a sliding driving device, wherein the sliding clamping block is located on the fixed installation groove, the sliding clamping block is located on the other end of the horizontal propulsion direction relative to the fixed clamping end, the sliding clamping block is used to clamp the end of the solar silicon optical wafer, and the sliding driving device is connected to the sliding clamping block and drives the sliding clamping block to move along the horizontal propulsion direction; The rotating assembly comprises a rotating bracket, a rotating driving device and a rotating clamping module, the rotating bracket is provided with a rotating mounting groove extending along the horizontal propulsion direction, the rotating mounting groove is used to load the solar silicon optical slice, the rotating mounting groove is provided with a rotating clamping end at the end of the horizontal propulsion direction, the rotating clamping end is close to the fixed clamping end, the rotating clamping module is located at the rotating clamping end, the rotating clamping module is used to clamp the solar silicon optical slice located at the rotating clamping end, the rotating bracket is provided with a second hinged portion at the rotating clamping end, the second hinged portion is hinged to the first hinged portion and rotates around the horizontal rotation axis, the rotating driving device is connected to the rotating bracket and drives the rotating bracket to rotate around the horizontal rotation axis; In the advancing state, the bearing bottom surface of the fixed installation groove is coplanar with the bearing bottom surface of the rotating installation groove; In the split state, the bearing bottom surface of the fixed installation groove is not aligned with the bearing bottom surface of the rotating installation groove.

2. The solar silicon wafer splitting device according to claim 1, characterized in that: The edge of the fixed installation groove at the fixed clamping end is arranged colinearly with the horizontal rotation axis direction.

3. The solar silicon wafer splitting device according to claim 1, characterized in that: The bearing bottom surface of the fixed installation groove is provided with a slide groove extending along the horizontal propulsion direction, a slider is provided in the slide groove, the sliding drive device is connected to the slider and drives the slider to move along the horizontal propulsion direction, and the sliding clamping block is provided on the slider and moves with the slider.

4. The solar silicon wafer splitting device according to claim 3, characterized in that: The slider is provided with a positioning step in the fixed installation groove, and the sliding assembly also includes a sliding clamping drive device, the positioning step is used to support the end of the solar silicon optical wafer, and the sliding clamping drive device is connected to the sliding clamping block and drives the sliding clamping block to move toward the positioning step.

5. The solar silicon wafer splitting device according to claim 1, characterized in that: The fixed clamping module comprises a fixed clamping plate and a fixed clamping driving device, wherein the fixed clamping driving device is connected to the fixed clamping plate and drives the fixed clamping plate to move toward the bearing bottom surface of the fixed installation groove.

6. The solar silicon wafer splitting device according to claim 1, characterized in that: The rotating clamping module comprises a rotating clamping plate and a rotating clamping driving device, wherein the rotating clamping driving device is connected to the rotating clamping plate and drives the rotating clamping plate to move toward the bearing bottom surface of the rotating mounting groove.

7. The solar silicon wafer splitting device according to claim 1, characterized in that: The rotating clamping module comprises a negative pressure generating device, a negative pressure hole is arranged on the bearing bottom surface of the rotating mounting groove, and the negative pressure generating device is connected to the negative pressure hole.

8. The solar silicon wafer splitting device according to claim 1, characterized in that: The rotating bracket is provided with a stop bevel below the rotating clamping end, and the stop bevel is arranged at an acute angle with the bearing bottom surface of the rotating mounting groove; In the split state, the retaining bevel abuts against the fixing bracket.

9. The solar silicon wafer splitting device according to any one of claims 1 to 8, characterized in that: A plurality of fixed ribs extending along the horizontal propulsion direction are arranged in the fixed installation groove, and a fixed sub-groove is formed between two adjacent fixed ribs. The sliding assembly includes a plurality of sliding clamping blocks, and one of the sliding clamping blocks is located on one of the fixed sub-groove and clamps the end of the solar silicon wafer located on the fixed sub-groove.

10. The solar silicon wafer splitting device according to claim 9, characterized in that: A plurality of rotating ribs extending along the horizontal propulsion direction are arranged in the rotating installation groove, and a rotating sub-groove is formed between two adjacent rotating ribs.

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