Circuit board solder paste printing equipment with automatic positioning function
By introducing the second electric push rod and the sliding plate clamping mechanism in the solder paste printing equipment, the shaking problem of the circuit board during the pushing process is solved, and the cleaning method of combining the wipe roller on the sliding block with the push rod reset action is improved, printing quality and production efficiency are improved.
Patent Information
- Application Number
- CN202510272102.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2045-03-10
AI Technical Summary
When the electric push rod pushes the circuit board upward, existing solder paste printing equipment is prone to shaking, causing printing position to shift and affect printing quality; at the same time, the prior art requires an additional cleaning mechanism to clean the steel mesh and reduce production efficiency.
An automatic positioning circuit board solder paste printing device is designed. Through the cooperation of the second electric push rod and the sliding plate, the circuit board is clamped and positioned to avoid shaking. At the same time, the steel mesh is cleaned before and after the circuit board printing by using the wipe roller on the sliding block, and combined with the reset action of the push rod, there is no need for an additional cleaning process.
It effectively solves the problem of shaking of the circuit board during the pushing process, improves the stability of the printing position and printing quality; at the same time, through a cleaning method combined with the push rod reset action, production efficiency is improved and additional cleaning steps are reduced.
Smart Images

Figure CN119928408A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of circuit board production, and in particular to an automatically positioned circuit board solder paste printing device. Background Art
[0002] Solder paste printing is one of the key processes in surface mount technology (SMT), which is used to accurately deposit solder paste on circuit boards for subsequent component placement and soldering.
[0003] The existing solder paste printing is that after the conveyor belt transports the circuit board to the specified position, the circuit board is first intercepted and corrected, and then the circuit board is pushed up by the electric push rod to make the circuit board contact with the lower surface of the steel mesh, and then the scraper is controlled to print. However, in the process of the electric push rod pushing the circuit board upward, the circuit board is prone to shaking, and the solder paste printing point of the circuit board is small. A slight shaking will cause a large deviation in the printing position of the circuit board; Furthermore, in the prior art, in order to ensure that the steel mesh is clean and dust-free and to ensure the quality of solder paste printing, an additional cleaning mechanism is required to clean the steel mesh immediately after each printing is completed to prevent the solder paste from drying up and affecting the quality of the next printing. However, during the printing process, the conveyor belt is continuously conveying, resulting in the cleaning mechanism not being completed when the next circuit board has been conveyed to its place, thereby reducing production efficiency. Summary of the invention
[0004] In order to overcome the disadvantage that the circuit board is prone to shake during the process of the electric push rod pushing the calibrated circuit board upward, causing the printing position to shift and affecting the printing effect, the present invention provides an automatically positioned circuit board solder paste printing device.
[0005] The technical implementation scheme of the present invention is: an automatically positioned circuit board solder paste printing equipment, including a solder paste printer, a conveying pull line and a protective door; a conveying pull line is arranged in the solder paste printer; the solder paste printer is movably connected with the protective door; it also includes a printing component, a second electric push rod, a sliding plate, a tensioning wheel, a pull rope, a fixed block, a linear optical axis, a limit block, a sliding block, a first spring, a wiping roller and a clamping block; a printing component for printing solder paste on a circuit board is connected in the solder paste printer; a second electric push rod is fixedly connected in the solder paste printer; a sliding plate is fixedly connected to the output end of the second electric push rod; the sliding plate, the conveying pull line and the printing component are all connected It is connected to a tensioning wheel; the printing component is connected to two front-to-back symmetrical fixed blocks; the two fixed blocks are commonly fixedly connected to two left-to-right symmetrical linear optical axes; the two linear optical axes are commonly slidably connected to a sliding block for clamping and positioning the circuit board in the front-to-back direction; the printing component and the sliding block are commonly connected to a pull rope, and the pull rope is C-shaped under the limit of the three tensioning wheels; a number of first springs are fixedly connected between the sliding block and the fixed block on the front side; two left-to-right symmetrical clamping blocks for clamping and positioning the circuit board in the left-to-right direction are fixedly connected to the rear side of the sliding block; a limiting block is fixedly connected to the rear of the lower side of the steel mesh; a wiping roller for wiping the steel mesh is rotatably connected to the sliding block.
[0006] More preferably, the printing assembly includes an electric guide rail, a controller, a printer, a fixed plate, a steel mesh, a first electric push rod, a support plate and a visual sensor; an electric guide rail is arranged in the solder paste printer; a controller is slidably connected to the electric guide rail; a printer is slidably connected to the lower side of the controller; a fixed plate is fixedly connected in the solder paste printer; the upper side of the sliding plate, the front side of the conveying pull wire and the lower side of the fixed plate are all fixedly connected to the corresponding tensioning wheel; the lower side of the fixed plate is fixedly connected to the fixed block; the steel mesh is fixedly connected to the inner side of the fixed plate; the printer is in contact with the upper surface of the steel mesh; a number of first electric push rods are fixedly connected in the solder paste printer, and the first electric push rods pass through the sliding plate; the telescopic ends of all the first electric push rods are commonly fixedly connected to a support plate for pressing the circuit board against the lower side of the steel mesh; the support plate is located below the conveying pull wire, and the lower side of the support plate and the front side of the sliding block are both fixedly connected to the pull rope; a visual sensor is fixedly connected in the solder paste printer.
[0007] More preferably, the front side of the clamping block is arranged in an inclined shape.
[0008] More preferably, the linear optical axis is a chrome-plated optical axis.
[0009] More preferably, a groove is formed between the middle portion of the fixing plate and the upper surface of the steel mesh.
[0010] More preferably, explosion-proof glass is provided in the middle of the protective door.
[0011] More preferably, a heat sink is further included; a plurality of heat sinks are fixedly connected to the rear side of the solder paste printer.
[0012] More preferably, it also includes an air inlet pipe and a connecting pipe; an air suction port is opened on the front side of the sliding block, an air blowing port is opened on the rear side of the sliding block, the wiping roller is located between the air suction port and the air blowing port, and an air pump is arranged in the solder paste printer; an air inlet pipe is connected between the sliding block and the air pump; a connecting pipe is connected between the air inlet pipe and the air suction port and the air blowing port; solenoid valves are arranged at the connections between the connecting pipe and the air suction port and the air blowing port.
[0013] More preferably, it also includes an air intake cavity, a clamping plate and a second spring; an air intake cavity is opened in each clamping block; the air intake cavity is connected to the connecting pipe, and an electromagnetic valve is provided at the connection point between the air intake cavity and the connecting pipe; the two clamping blocks are slidably connected with clamping plates on the opposite sides; a plurality of second springs are fixedly connected between the clamping plates and the clamping blocks; the sliding end of each clamping plate passes through the corresponding clamping block and is located in the corresponding air intake cavity.
[0014] More preferably, a conductive sheet is also included; a conductive sheet for removing static electricity from the surface of the steel mesh is arranged on the contact surface between each sliding block and the steel mesh, and the conductive sheet is grounded.
[0015] The beneficial effects of the present invention are as follows: the positioning assembly clamps and positions the circuit board after the first electric push rod lifts the supporting plate and the circuit board upward, thereby solving the problem in the prior art that after the circuit board is corrected and positioned first, when the first electric push rod drives the supporting plate and the corrected circuit board to move upward, the circuit board is prone to shaking and deflection, causing subsequent solder paste printing to deflect and affect printing quality; Furthermore, in the process of lifting the supporting plate and the circuit board upward by the first electric push rod, the upward movement of the supporting plate will drive the sliding block to move forward, and the wiping roller on the upper side of the sliding block will contact the lower surface of the steel mesh, thereby wiping the lower surface of the steel mesh before the circuit board is printed; when the first electric push rod and the second electric push rod are retracted and reset, the sliding block will move backward and reset, thereby wiping the lower surface of the steel mesh after the circuit board is printed, thereby combining the cleaning action of the steel mesh with the resetting action of the first electric push rod and the second electric push rod, without the need for an additional cleaning process, thereby greatly improving production efficiency; When the sliding block moves forward, suction force is generated through the air intake port, thereby removing dust and impurities on the lower surface of the steel mesh before printing; when the sliding block moves backward and resets, air is blown upward through the air intake port, thereby blowing the solder paste in the mesh holes of the steel mesh upward to the upper surface of the steel mesh, so that the solder paste can be subsequently drawn back for recycling through the solder paste suction device in the printer, and the residual solder paste in the mesh holes of the steel mesh can be cleaned after printing is completed.
[0016] The present invention also has the following beneficial effects: The linear optical axis is chrome-plated, with high assembly precision, low friction coefficient, reliable operation and long service life; A groove is formed between the middle of the fixed plate and the upper surface of the steel mesh to prevent the solder paste on the surface of the steel mesh from flowing outward and spreading, causing waste; An explosion-proof glass is installed in the middle of the protective door, which is convenient for workers to observe the internal operation of the machine through the explosion-proof glass during the operation of the solder paste printer; A radiator is provided at the rear side of the solder paste printer to quickly dissipate the heat generated by the solder paste printer during operation, thereby preventing the internal temperature of the solder paste printer from being too high, causing the solder paste to solidify and affecting the printing effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the automatic positioning circuit board solder paste printing equipment of the present invention; Figure 2 It is a schematic diagram of the internal structure of the solder paste printer of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the first electric push rod, the supporting plate, the second electric push rod and the sliding plate of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the second electric push rod, the sliding plate, the tensioning wheel, the pull rope, the fixed block, the linear optical axis, the limit block and the sliding block of the present invention; Figure 5 It is a schematic diagram of the combined three-dimensional structure of the sliding block, the air inlet pipe, the connecting pipe and the clamping block of the present invention; Figure 6 It is a schematic diagram of the combined three-dimensional structure of the clamping block, the clamping plate and the second spring of the present invention.
[0018] The above drawings include the following reference numerals: 1-solder paste printer, 2-conveying wire, 3-protective door, 3001-explosion-proof glass, 101-electric guide rail, 102-controller, 103-printer, 104-fixed plate, 10401-groove, 105-steel mesh, 106-first electric push rod, 107-supporting plate, 108-visual sensor, 109-radiator, 201-second electric push rod, 202-sliding plate, 203-tensioning wheel, 204-pull rope, 205-fixed block, 206-linear optical axis, 207-limiting block, 208-sliding block, 20801-air suction port, 20802-air blowing port, 209-first spring, 301-wiping roller, 302-air inlet pipe, 303-connecting pipe, 304-clamping block, 30401-air inlet cavity, 305-clamping plate, 306-second spring, 307-conductive sheet, 555-circuit board. DETAILED DESCRIPTION
[0019] The present invention will be further described below in conjunction with specific embodiments. The illustrative embodiments and descriptions of the present invention are used to explain the present invention but are not intended to limit the present invention.
[0020] Example 1 An automatic positioning circuit board solder paste printing device, such as Figure 1-Figure 5 As shown, it includes a solder paste printer 1, a conveying pull wire 2 and a protective door 3; the solder paste printer 1 is provided with a conveying pull wire 2; the solder paste printer 1 is hinged with a protective door 3; It also includes a printing assembly, a second electric push rod 201, a sliding plate 202, a tensioning wheel 203, a pull rope 204, a fixed block 205, a linear optical axis 206, a limit block 207, a sliding block 208, a first spring 209, a wiping roller 301 and a clamping block 304; the solder paste printer 1 is connected with a printing assembly; the solder paste printer 1 is fixed with a second electric push rod 201; the output end of the second electric push rod 201 is fixed with a sliding plate 202; the sliding plate 202, the conveying pull wire 2 and the printing assembly are all connected with a tensioning wheel 203; the printing assembly is connected with two front-to-back symmetrical fixed blocks 205; the two fixed blocks 205 are commonly fixed with two left-to-right symmetrical The linear optical axis 206; the two linear optical axes 206 are slidably connected with a sliding block 208; the printing component and the sliding block 208 are connected with a pull rope 204, and the pull rope 204 is C-shaped under the limit of the three tensioning wheels 203; two first springs 209 are fixedly connected between the sliding block 208 and the fixed block 205 on the front side; two left-right symmetrical clamping blocks 304 are fixedly connected to the rear side of the sliding block 208; the rear part of the lower side of the steel mesh 105 is fixedly connected with a limiting block 207, and in the initial state, the sliding block 208 is pushed by the first spring 209 to contact the limiting block 207; the sliding block 208 is rotatably connected with a wiping roller 301, and the wiping roller 301 is made of sponge material.
[0021] The printing assembly includes an electric guide rail 101, a controller 102, a printer 103, a fixed plate 104, a steel mesh 105, a first electric push rod 106, a support plate 107 and a visual sensor 108; the electric guide rail 101 is arranged in the solder paste printer 1; the controller 102 is slidably connected to the electric guide rail 101; the printer 103 is slidably connected to the lower side of the controller 102; the fixed plate 104 is fixedly connected in the solder paste printer 1; the upper side of the sliding plate 202, the front side of the conveying pull wire 2 and the lower side of the fixed plate 104 are all fixedly connected to the corresponding tensioning wheel 203; The lower side of the fixed plate 104 is fixedly connected to the fixed block 205; the inner side of the fixed plate 104 is fixedly connected to the steel mesh 105; the printer 103 is in contact with the upper surface of the steel mesh 105; four first electric push rods 106 are fixedly connected in the solder paste printer 1, and the first electric push rods 106 pass through the sliding plate 202; the telescopic ends of all the first electric push rods 106 are commonly fixedly connected to a supporting plate 107; the supporting plate 107 is located below the conveying pull wire 2, and the lower side of the supporting plate 107 and the front side of the sliding block 208 are fixedly connected to the pull rope 204; a visual sensor 108 is fixedly connected in the solder paste printer 1.
[0022] The front side of the clamping block 304 is arranged to be inclined, so as to facilitate the circuit board 555 to enter between the two clamping blocks 304 .
[0023] The linear optical axis 206 is a chrome-plated optical axis with high assembly precision, low friction coefficient, reliable operation and long service life.
[0024] A groove 10401 is formed between the middle of the fixing plate 104 and the upper surface of the steel mesh 105 to prevent the solder paste on the surface of the steel mesh 105 from flowing outward and spreading, causing waste.
[0025] An explosion-proof glass 3001 is provided in the middle of the protective door 3 to facilitate workers to observe the operating conditions inside the machine through the explosion-proof glass 3001 during the operation of the solder paste printer 1.
[0026] It also includes a radiator 109; six radiators 109 are fixedly connected to the rear side of the solder paste printer 1, and the heat generated by the solder paste printer 1 during operation is quickly dissipated through the radiator 109 to prevent the internal temperature of the solder paste printer 1 from being too high, causing the solder paste to solidify and affecting the printing effect.
[0027] The working principle of the above embodiment is as follows: The following descriptions are based on Figure 1 As the viewing angle reference, the side where the solder paste printer 1 is marked is the front side; first, Figure 1-Figure 3 As shown: the circuit board 555 is sent into the solder paste printer 1 from left to right through the conveyor wire 2. When the visual sensor 108 detects that the circuit board 555 reaches directly above the support plate 107, the conveyor wire 2 stops transmitting, and then the telescopic end of the first electric push rod 106 will extend upward, thereby lifting the support plate 107 and the circuit board 555 upward, so that the upper surface of the circuit board 555 contacts the lower surface of the steel mesh 105, and then the electric guide rail 101 will drive the controller 102 to move forward, and then the solder paste on the surface of the steel mesh 105 is squeezed into the upper surface of the circuit board 555 through the mesh holes in the middle of the steel mesh 105 through the printer 103. It should be noted that the holes in the middle of the steel mesh 105 correspond one-to-one to the solder paste printing points on the circuit board 555; and then the circuit board 555 is printed with solder paste by this method; after printing is completed, the circuit board 555 is sent out of the solder paste printer 1 through the conveyor wire 2.
[0028] However, in the process of conveying the circuit board 555 by the conveying wire 2, the circuit board 555 may shake and deviate. Therefore, in the prior art, after the circuit board 555 reaches directly above the supporting plate 107, the circuit board 555 needs to be corrected and positioned, and then the supporting plate 107 and the corrected circuit board 555 are lifted upward by the first electric push rod 106 to make the upper surface of the circuit board 555 contact with the lower surface of the steel mesh 105, and then the subsequent printing operation is carried out. However, when the first electric push rod 106 drives the supporting plate 107 and the circuit board 555 to move upward, the circuit board 555 is prone to shaking, and the solder paste printing point of the circuit board 555 is small, and a slight shaking will cause a large deviation in the printing position. Therefore, the circuit board 555 needs to be clamped and aligned after the circuit board 555 contacts the steel mesh 105 to prevent the circuit board 555 from deviating and affecting the printing quality. Figure 3-Figure 5As shown: in the initial state, the first spring 209 is in an extended state, at this time, the sliding block 208 is pushed backward by the first spring 209 to fit with the limit block 207, and the pull rope 204 is in a C shape under the limit of the three tensioning wheels 203, and is in a tensioned state; when the visual sensor 108 detects that the circuit board 555 is transmitted to the top of the supporting plate 107, the transmission pull line 2 stops transmitting, and then the first electric push rod 106 will lift the supporting plate 107 and the circuit board 555 upwards, and as the supporting plate 107 moves upward, the supporting plate 107 will pull the pull rope 204 upwards. At this time, the pull rope 204 is limited by the three tensioning wheels 203 and moves in a C shape, so when When one end of the pull rope 204 is pulled upward by the supporting plate 107, the other end of the pull rope 204 will pull the sliding block 208 to move forward on the linear optical axis 206. At this time, the first spring 209 is compressed and contracted. When the circuit board 555 is about to contact the steel mesh 105, the sliding block 208 has been pulled in front of the circuit board 555, that is, the circuit board 555 is located between the limit block 207 and the sliding block 208. At this time, the first electric push rod 106 stops extending, and then the sliding plate 202 is pushed upward by the second electric push rod 201. At this time, the tensioning wheel 203 on the sliding plate 202 will also move upward. In this process, the tensioning wheel 203 on the sliding plate 202 3. The tension of the pull rope 204 is reduced, the pull rope 204 is loosened to transport the pull wire 2, the first spring 209 is stretched and reset, and then the sliding block 208 is pulled to move backward, and then the sliding block 208 will contact the circuit board 555 and push the circuit board 555 backward, so that the rear side of the circuit board 555 contacts the limit block 207, and then the circuit board 555 is clamped and positioned in the front and rear directions by the limit block 207 and the sliding block 208; and when the sliding block 208 contacts the front side of the circuit board 555, two clamping blocks 304 are added to the sliding block 208, so that the circuit board 555 enters between the two clamping blocks 304, and then the clamping blocks 304 are used to clamp the circuit board 555. The circuit board 555 is clamped and fixed in the left and right directions, and the front side of the clamping block 304 is set to an inclined shape, so that the circuit board 555 can enter between the two clamping blocks 304; it should be noted that the circuit board 555 has not yet contacted the steel mesh 105, so that the sliding block 208 and the clamping block 304 can clamp and position the circuit board 555; after the circuit board 555 is positioned, the first electric push rod 106 and the second electric push rod 201 are controlled to extend upward together, so that the circuit board 555 and the lower surface of the steel mesh 105 are fitted together, so as to prevent the calibrated circuit board 555 from shaking and deviating in the process of moving upward to contact the steel mesh 105, thereby affecting the subsequent printing effect; Furthermore, although most of the printers 103 in the existing equipment already have a cleaning function and can clean the upper surface of the steel mesh 105, they cannot clean the lower surface of the steel mesh 105. Therefore, in order to ensure that the steel mesh 105 is clean and dust-free and to ensure the quality of solder paste printing; after each printing is completed, it is necessary to use an additional cleaning mechanism to clean the lower surface of the steel mesh 105. The process is cumbersome and greatly reduces the production efficiency; therefore, by arranging a wiping roller 301 on the upper side of the sliding block 208, when the support plate 107 moves upward and drives the sliding block 208 forward through the pull rope 204, the wiping roller 301 on the upper side of the sliding block 208 will contact the lower surface of the steel mesh 105, and then wipe the lower surface of the steel mesh 105 before printing the circuit board 555; printing After completion, when the first electric push rod 106 and the second electric push rod 201 shrink and reset, the support plate 107 and the sliding plate 202 move downward and reset, and the first spring 209 of the conveying pull wire 2 pulls the sliding block 208 to move backward and reset, and then the lower surface of the steel mesh 105 is wiped after the printing of the circuit board 555 is completed, and the wiping roller 301 is made of sponge material. After the sponge wiping roller 301 contacts the surface of the steel mesh 105, it will be squeezed and then enter the mesh on the steel mesh 105 to remove the residual solder paste in the mesh, which is beneficial to ensure the cleanliness of the lower surface of the steel mesh 105; and the cleaning action of the steel mesh 105 is combined with the resetting action of the first electric push rod 106 and the second electric push rod 201, without the need for additional cleaning process, which greatly improves production efficiency.
[0029] On the basis of the above technical effects, the present invention also has the following advantages: The linear optical axis 206 is a chrome-plated optical axis with high assembly precision, low friction coefficient, reliable operation and long service life; A groove 10401 is formed between the middle of the fixing plate 104 and the upper surface of the steel mesh 105 to prevent the solder paste on the surface of the steel mesh 105 from flowing outward and spreading, causing waste; An explosion-proof glass 3001 is provided in the middle of the protective door 3, so that workers can observe the operation status inside the machine through the explosion-proof glass 3001 during the operation of the solder paste printer 1; A heat sink 109 is disposed at the rear side of the solder paste printer 1 to quickly dissipate the heat generated by the solder paste printer 1 during operation, thereby preventing the internal temperature of the solder paste printer 1 from being too high, causing the solder paste to solidify and affecting the printing effect.
[0030] Example 2 On the basis of Example 1, Figure 3-Figure 6As shown, it also includes an air inlet pipe 302 and a connecting pipe 303; an air suction port 20801 is opened on the front side of the sliding block 208, and an air blowing port 20802 is opened on the rear side of the sliding block 208, the wiping roller 301 is located between the air suction port 20801 and the air blowing port 20802, and an air pump is arranged in the solder paste printing machine 1; an air inlet pipe 302 is connected between the sliding block 208 and the air pump; a connecting pipe 303 is connected between the air inlet pipe 302 and the air suction port 20801 and the air blowing port 20802; solenoid valves are arranged at the connection between the connecting pipe 303 and the air suction port 20801 and the air blowing port 20802.
[0031] It also includes an air intake cavity 30401, a clamping plate 305 and a second spring 306; an air intake cavity 30401 is opened in each clamping block 304; the air intake cavity 30401 is connected to the connecting pipe 303, and a solenoid valve is provided at the connection point between the air intake cavity 30401 and the connecting pipe 303; the two clamping blocks 304 are slidably connected with clamping plates 305 on the opposite sides; three second springs 306 are fixedly connected between the clamping plates 305 and the clamping blocks 304; the sliding end of each clamping plate 305 passes through the corresponding clamping block 304 and is located in the corresponding air intake cavity 30401.
[0032] It also includes a conductive sheet 307; a conductive sheet 307 is provided on the contact surface between each sliding block 208 and the steel mesh 105, and the conductive sheet 307 is grounded.
[0033] The working principle of the above embodiment is as follows: In the embodiment 1, after the dust impurities on the lower surface of the steel mesh 105 and the residual solder paste in the mesh are cleaned by the sponge wiping roller 301, the dust impurities and the residual solder paste will adhere to the surface of the wiping roller 301, causing the workers to frequently replace and clean the wiping roller 301, affecting the production efficiency; therefore, when the sliding block 208 moves left and right, the air pump in the solder paste printer 1 sucks air into the air inlet pipe 302, so that the suction port 20801 generates a suction force, and then the dust impurities and the residual solder paste that are easy to fall off the lower surface of the steel mesh 105 are sucked through the suction port 20801, and then the dust impurities and the residual solder paste with strong adhesion are wiped by the wiping roller 301, and the dust impurities and the residual solder paste wiped off are sucked away at the same time, so as to improve the cleaning effect and avoid the adhesion of more dust impurities and the residual solder paste on the surface of the wiping roller 301; however, sucking the residual solder paste through the suction port 20801 will waste a lot of solder paste and increase the production cost, so as Figure 5As shown: when printing is completed, the first electric push rod 106 drives the supporting plate 107 and the circuit board 555 to move downward and reset, and then drives the sliding block 208 to move backward and reset. At this time, the steel mesh 105 has just been printed, and there will be residual solder paste in the mesh. At this time, the air pump in the solder paste printer 1 is used to blow air into the air inlet pipe 302. At this time, the solenoid valve at the connecting pipe 303 and the blowing port 20802 is opened, and the solenoid valve at the connecting pipe 303 and the air intake port 20801 is closed, so that the gas is blown upward from the blowing port 20802 through the connecting pipe 303, and then the solder paste in the mesh is blown upward. Blow to the upper surface of the steel mesh 105, and it should be noted here that when the first electric push rod 106 is retracted and reset to drive the sliding block 208 to move backward, the electric guide rail 101 also drives the printer 103 to move backward and reset synchronously. The existing printer 103 is usually provided with a solder paste suction device, and the residual solder paste on the surface of the steel mesh 105 is sucked back into the printer 103 for recycling through the solder paste suction device, and then the solder paste blown into the mesh of the steel mesh 105 on the upper surface of the steel mesh 105 is sucked, and then the subsequent recycling is carried out, thereby reducing the waste of solder paste and reducing the production cost; and then in the next When printing a circuit board 555, the first electric push rod 106 pushes the supporting plate 107 and the circuit board 555 upward, driving the sliding block 208 to move forward, and the air pump in the solder paste printer 1 sucks air into the air inlet pipe 302. At this time, the solenoid valve at the connecting pipe 303 and the air blowing port 20802 is closed, and the solenoid valve at the connecting pipe 303 and the air suction port 20801 is opened, so that the gas enters the air suction port 20801 through the connecting pipe 303, so that the air suction port 20801 generates a suction force, and then the dust and impurities on the lower surface of the steel mesh 105 are sucked out; it should be noted here that before printing, , the solder paste in the mesh of the steel mesh 105 has been blown out during the previous printing action. There is an interval between the two printing actions. At this time, static electricity may be generated on the steel mesh 105 due to friction, which absorbs dust and impurities. Therefore, it is necessary to remove the dust and impurities on the lower surface of the steel mesh 105. When printing is completed, the first electric push rod 106 shrinks and resets. At this time, the circuit board 555 has just left the lower surface of the steel mesh 105. Therefore, the lower surface of the steel mesh 105 has not absorbed dust and impurities, but there will be residual solder paste in the mesh of the steel mesh 105. Therefore, it is necessary to blow the residual solder paste in the mesh of the steel mesh 105 upward to the upper surface of the steel mesh 105; Furthermore, when the circuit board 555 is small, the circuit board 555 cannot be clamped by the clamping block 304. Therefore, when the circuit board 555 is clamped and positioned by the clamping block 304, Figure 5 and 6As shown: when the second electric push rod 201 moves upward, air is blown into the air inlet pipe 302 through the air pump in the solder paste printer 1. At this time, the solenoid valve at the connecting pipe 303 and the blowing port 20802 is closed, the solenoid valve at the connecting pipe 303 and the air suction port 20801 is closed, and the solenoid valve at the connecting pipe 303 and the air inlet cavity 30401 is opened, and then the gas is blown into the air inlet cavity 30401. Then the air pressure in the air inlet cavity 30401 increases and squeezes the clamping plate 305. Then the second spring 306 is compressed and contracted, and the two clamping plates 305 approach each other, thereby clamping and positioning the circuit board 555 to the left and right positions, and adapting to circuit boards 555 of different sizes.
[0034] On the basis of the above technical effects, the present invention also has the following advantages: Conductive sheets 307 are provided on the contact surfaces of the sliding block 208 and the steel mesh 105, and the conductive sheets 307 are grounded; when the sliding block 208 slides left and right, the static electricity generated by the friction on the surface of the steel mesh 105 is absorbed by the conductive sheets 307 and introduced into the ground, thereby removing the static electricity on the surface of the steel mesh 105 and reducing the static electricity generated on the surface of the steel mesh 105 during the friction process to absorb surrounding dust, thereby affecting the subsequent solder paste printing quality.
[0035] Although the present disclosure has been described with respect to only a limited number of embodiments, those skilled in the art having benefit of this disclosure will appreciate that various other embodiments can be devised without departing from the scope of the present invention. Accordingly, the scope of the present invention should be limited only by the appended claims.
Claims
1. An automatic positioning circuit board solder paste printing device, characterized in that it includes A solder paste printer (1), a conveying pull wire (2) and a protective door (3); the solder paste printer (1) is provided with a conveying pull wire (2); the solder paste printer (1) is movably connected to the protective door (3); it also includes a printing assembly, a second electric push rod (201), a sliding plate (202), a tensioning wheel (203), a pull rope (204), a fixed block (205), a linear optical axis (206), a limit block (207), a sliding block (208), a first spring (209), a wiping roller (301) and a clamping block (304); the solder paste printer (1) is connected with a printing assembly for printing solder paste on a circuit board (555); the solder paste printer (1) is fixedly connected with a second electric push rod (201); the output end of the second electric push rod (201) is fixedly connected with a sliding plate (202); the sliding plate (202), the conveying pull wire (2) and the printing assembly are all connected with the tensioning wheel (203); the printing assembly Two front-to-back symmetrical fixed blocks (205) are connected; the two fixed blocks (205) are fixedly connected to two left-to-right symmetrical linear optical axes (206); a sliding block (208) is slidably connected to the two linear optical axes (206) for clamping and positioning the circuit board (555) in the front-to-back direction; the printing component and the sliding block (208) are connected to a pull rope (204), and the pull rope (204) is C-shaped under the limit of three tensioning wheels (203); a plurality of first springs (209) are fixedly connected between the sliding block (208) and the front fixed block (205); two left-to-right symmetrical clamping blocks (304) are fixedly connected to the rear side of the sliding block (208) for clamping and positioning the circuit board (555) in the left-to-right direction; a limit block (207) is fixedly connected to the rear portion of the lower side of the steel mesh (105); and a wiping roller (301) for wiping the steel mesh (105) is rotatably connected to the sliding block (208).
2. According to the automatic positioning circuit board solder paste printing equipment of claim 1, it is characterized in that: The printing assembly comprises an electric guide rail (101), a controller (102), a printer (103), a fixed plate (104), a steel mesh (105), a first electric push rod (106), a support plate (107) and a visual sensor (108); the electric guide rail (101) is arranged inside the solder paste printer (1); the controller (102) is slidably connected to the electric guide rail (101); the printer (103) is slidably connected to the lower side of the controller (102); the fixed plate (104) is fixedly connected inside the solder paste printer (1); the upper side of the sliding plate (202), the front side of the conveying pull wire (2) and the lower side of the fixed plate (104) are all fixedly connected to the corresponding tensioning wheel (203); the lower side of the fixed plate (104) is fixedly connected to the corresponding tensioning wheel (203); the lower side of the fixed plate (104) is fixedly connected to the corresponding tensioning wheel (203); the lower side of the fixed plate (104) is fixedly connected to the corresponding tensioning wheel (203); the upper side of the sliding plate (202), the front side of the conveying pull wire (2) and the lower side of the fixed plate (104) are ... upper side of the sliding plate ( The fixing block (205) is fixed; a steel mesh (105) is fixedly connected to the inner side of the fixing plate (104); the printer (103) contacts the upper surface of the steel mesh (105); a plurality of first electric push rods (106) are fixedly connected to the inside of the solder paste printer (1), and the first electric push rods (106) pass through the sliding plate (202); the telescopic ends of all the first electric push rods (106) are commonly fixedly connected to a supporting plate (107) for pressing the circuit board (555) against the lower side of the steel mesh (105); the supporting plate (107) is located below the conveying pull wire (2), and the lower side of the supporting plate (107) and the front side of the sliding block (208) are both fixedly connected to the pull wire (204); a visual sensor (108) is fixedly connected to the inside of the solder paste printer (1).
3. The automatic positioning circuit board solder paste printing device according to claim 1 is characterized in that: The front side of the clamping block (304) is arranged in an inclined shape.
4. The automatic positioning circuit board solder paste printing device according to claim 1 is characterized in that: The linear optical axis (206) is a chrome-plated optical axis.
5. The automatic positioning circuit board solder paste printing device according to claim 2 is characterized in that: A groove (10401) is formed between the middle portion of the fixing plate (104) and the upper surface of the steel mesh (105).
6. The automatic positioning circuit board solder paste printing device according to claim 1 is characterized in that: An explosion-proof glass (3001) is arranged in the middle of the protective door (3).
7. The automatic positioning circuit board solder paste printing device according to claim 1 is characterized in that: It also includes a heat sink (109); a plurality of heat sinks (109) are fixedly connected to the rear side of the solder paste printer (1).
8. The automatic positioning circuit board solder paste printing device according to claim 1 is characterized in that: The invention also comprises an air intake pipe (302) and a connecting pipe (303); an air suction port (20801) is provided on the front side of the sliding block (208); an air blowing port (20802) is provided on the rear side of the sliding block (208); the wiping roller (301) is located between the air suction port (20801) and the air blowing port (20802); an air pump is arranged in the solder paste printer (1); an air intake pipe (302) is connected between the sliding block (208) and the air pump; a connecting pipe (303) is connected between the air intake pipe (302) and the air suction port (20801) and the air blowing port (20802); and electromagnetic valves are arranged at the connection points between the connecting pipe (303) and the air suction port (20801) and the air blowing port (20802).
9. The automatic positioning circuit board solder paste printing device according to claim 8, characterized in that: It also includes an air intake cavity (30401), a clamping plate (305) and a second spring (306); each clamping block (304) is provided with an air intake cavity (30401); the air intake cavity (30401) is communicated with the connecting pipe (303), and a solenoid valve is provided at the connection point between the air intake cavity (30401) and the connecting pipe (303); the two clamping blocks (304) are slidably connected with the clamping plates (305) on the opposite sides; a plurality of second springs (306) are fixedly connected between the clamping plates (305) and the clamping blocks (304); the sliding end of each clamping plate (305) passes through the corresponding clamping block (304) and is located in the corresponding air intake cavity (30401).
10. The automatic positioning circuit board solder paste printing device according to claim 8, characterized in that: It also includes a conductive sheet (307); a conductive sheet (307) for removing static electricity on the surface of the steel mesh (105) is provided on the contact surface between each sliding block (208) and the steel mesh (105), and the conductive sheet (307) is grounded.
Citation Information
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