Semiconductor product packaging and feeding mode
By using linear vibrators, vacuum suction technology and rotating mechanisms during the packaging and feeding of semiconductor products, combined with precise control systems and suitable adhesives and packaging materials, the problem of insufficient automation in the prior art is solved, and an efficient and stable packaging and feeding process is achieved.
Patent Information
- Application Number
- CN202510356578.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2025-05-06
AI Technical Summary
The existing semiconductor product packaging and feeding methods have insufficient automation, resulting in low production efficiency, poor logistics efficiency and high component losses.
The semiconductor product is vibrated and adsorbed onto the turntable by using linear vibrator and vacuum suction technology. The product is rotated onto the carrier tape through a rotating mechanism and precise control system, and the appropriate adhesive and packaging materials are selected for packaging and implantation.
It realizes a high degree of automation of packaging materials for semiconductor products, improves production efficiency and logistics efficiency, reduces component losses, and improves packaging stability and reliability.
Smart Images
Figure CN119929256A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor product packaging and feeding, and in particular to a semiconductor product packaging and feeding method. Background Art
[0002] Semiconductor product packaging is to protect the manufactured semiconductor bare chip through a series of physical and chemical means, and provide an interface to connect to the external circuit so that it can be used in a circuit board or other system. The packaging process not only protects the chip, but also creates a path for the chip to exchange signals with the external circuit. Therefore, the packaging technology of semiconductor products has an important impact on the performance, reliability and service life of the product. With the continuous advancement of semiconductor technology and changes in market demand, the packaging and feeding methods of semiconductor products are also constantly evolving. From the initial simple packaging to today's diversified and automated packaging, it has undergone many innovations. These innovations not only improve packaging efficiency, but also reduce costs and meet the needs of different customers. For this reason, this application now proposes a packaging and feeding method for semiconductor products. Summary of the invention
[0003] Technical Solution To achieve the above object, the present invention provides the following technical solution: a semiconductor product packaging feeding method, comprising the following steps: S1, linear vibrator vibrates the product to the turntable end; S2. The product near the turntable end is sucked into the turntable using vacuum; S3, the front product of the suction turntable is isolated by blowing; S4, the product rotates to the top of the carrier belt; S5. Select adhesives and packaging materials for semiconductor product packaging and implantation.
[0004] Preferably, in step S1, the connection and fit between the linear vibrator and the turntable end are ensured to be appropriate. This may include adjusting the position and angle of the vibrator to ensure that the product can slide smoothly from the vibrator to the turntable, and the amplitude, frequency and vibration direction of the vibrator are adjusted according to the characteristics and requirements of the product.
[0005] Preferably, the vacuum suction technology into the turntable in step S2 mainly relies on the negative pressure effect generated by the vacuum pump. Tiny suction holes or suction nozzles are designed at specific positions on the turntable. These suction holes are connected to the vacuum pump system. When the product approaches the specified position on the turntable, the control system activates the vacuum pump to form a negative pressure at the suction holes, thereby tightly adsorbing the product on the turntable. As the turntable rotates, the product is safely and stably transferred to the next process. When the target position is reached, the negative pressure is released by turning off the vacuum pump or activating the blowing device, and the product is released.
[0006] Preferably, in the step S3, in the front area of the turntable, when the product reaches the designated position, the negative pressure generated by the vacuum pump tightly adsorbs the product to a specific position on the turntable. When the product needs to be isolated or transferred from one area to another, the control system activates the blowing device, and the blowing device generates sufficient airflow by blowing compressed air to the bottom or side of the product to release the product from the vacuum adsorption state and push it to move forward or to the designated isolation area. The product is pushed to the target position by the blowing device, and the vacuum pump can be activated again to fix the product in the new position and continue to the next production process.
[0007] Preferably, in step S4, the product is rotated by a turntable in cooperation with a rotating mechanism. During the rotation process, the position and rotation angle of the product are monitored in real time through precise sensors and control systems. When the product reaches a predetermined position, the control system issues a command to stop the rotating mechanism and proceed to the next step. The carrier is moved to the predetermined position through a conveying system. The moving speed and position of the carrier are also precisely controlled by sensors and control systems. When the product rotates above the carrier and the positions of the two are precisely aligned, the control system triggers the placement mechanism to remove the product from the rotating mechanism and place it on the carrier.
[0008] Preferably, the adhesive in step S5 is a mixture of epoxy resin, silicone resin and polyurethane resin. When selecting adhesives and packaging materials for semiconductor product packaging and implantation, it is necessary to comprehensively consider the working environment, performance requirements, cost and processability of the product. By selecting adhesives and packaging materials that are compatible with the product, the stability and reliability of the semiconductor product can be improved.
[0009] Compared with the prior art, the present invention provides a semiconductor product packaging feeding method, which has the following beneficial effects: 1. The packaging and feeding method of semiconductor products. The packaging and feeding method of modern semiconductor products is usually highly automated, which can greatly reduce manual operations and thus improve production efficiency. Automated equipment can quickly and accurately complete the steps of sorting, placing, fixing and protecting components, reducing human errors and delays. Through standardized operating procedures and packaging materials, the consistency and repeatability of each step can be ensured, thereby improving overall production efficiency. Standardized packaging forms also help to improve the compatibility and efficiency of mounting equipment.
[0010] 2. The packaging and feeding method of the semiconductor product. The appropriate packaging and feeding method can make the semiconductor product easier to transport. Both tape packaging and pallet packaging are convenient for mechanized handling and stacking, thereby improving logistics efficiency and reducing losses: Through effective packaging and fixing technology, the loss of components caused by vibration, collision, etc. during transportation can be reduced, thereby reducing production costs and customer losses. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a schematic diagram of the blowing and suction impurity removal of the packaging feeding air pipe of the present invention. DETAILED DESCRIPTION
[0012] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0013] A semiconductor product packaging feeding method includes the following steps: S1, linear vibrator vibrates the product to the turntable end; S2. The product near the turntable end is sucked into the turntable using vacuum; S3, the front product of the suction turntable is isolated by blowing; S4, the product rotates to the top of the carrier belt; S5. Select adhesives and packaging materials for semiconductor product packaging and implantation.
[0014] Furthermore, in step S1, the connection and fit between the linear vibrator and the turntable end are ensured to be appropriate. This may include adjusting the position and angle of the vibrator to ensure that the product can slide smoothly from the vibrator to the turntable, and the amplitude, frequency and vibration direction of the vibrator are adjusted according to the characteristics and requirements of the product.
[0015] Furthermore, the vacuum suction technology in the turntable in step S2 mainly relies on the negative pressure effect generated by the vacuum pump. Tiny suction holes or suction nozzles are designed at specific positions on the turntable. These suction holes are connected to the vacuum pump system. When the product approaches the specified position on the turntable, the control system activates the vacuum pump to form a negative pressure at the suction holes, thereby tightly adsorbing the product on the turntable. As the turntable rotates, the product is safely and stably transferred to the next process. When the target position is reached, the negative pressure is released by turning off the vacuum pump or activating the blowing device, and the product is released.
[0016] Furthermore, in step S3, in the front area of the turntable, when the product reaches the specified position, the negative pressure generated by the vacuum pump will tightly adsorb the product to a specific position on the turntable. When the product needs to be isolated or transferred from one area to another, the control system will activate the blowing device. The blowing device will generate sufficient airflow by blowing compressed air to the bottom or side of the product to release the product from the vacuum adsorption state and push it forward or to reach the designated isolation area. The product is pushed to the target position by the blowing device, and the vacuum pump can be activated again to fix the product in the new position and continue to the next production process.
[0017] Furthermore, in step S4, the product is rotated by a turntable in cooperation with a rotating mechanism. During the rotation process, the position and rotation angle of the product are monitored in real time through precise sensors and control systems. When the product reaches a predetermined position, the control system issues a command to stop the rotating mechanism and proceed to the next step. The carrier is moved to the predetermined position through a conveying system. The moving speed and position of the carrier are also precisely controlled by sensors and control systems. When the product rotates above the carrier and the positions of the two are precisely aligned, the control system triggers the placement mechanism to remove the product from the rotating mechanism and place it on the carrier.
[0018] Furthermore, in step S5, the adhesive is selected to be a mixture of epoxy resin, silicone resin and polyurethane resin. When selecting adhesives and packaging materials for semiconductor product packaging and implantation, it is necessary to comprehensively consider the working environment, performance requirements, cost and processability of the product. By selecting adhesives and packaging materials that are compatible with the product, the stability and reliability of the semiconductor product can be improved.
[0019] Working principle: According to the type, size, weight, transportation and storage conditions of the semiconductor product, select the appropriate packaging form, prepare the corresponding tape, rod or tray according to the selected packaging form, put the semiconductor components into the prepared tape, rod or tray in the prescribed order and position, use appropriate fixing methods (such as tape, buckle, etc.) to fix the components on the packaging material, and perform necessary protective treatment (such as adding foam, air cushion, etc.). The purpose of this step is to prevent the components from being damaged due to vibration, collision, etc. during transportation and storage. Load the prepared tape, rod or tray onto the placement feeder and install the air pipe blowing and suction equipment; Load the prepared tape, rod or tray onto the placement feeder and install the air pipe blowing and suction equipment. For some semiconductor products that require additional protection (such as high-precision, high-value or easily damaged products), add a packaging shell to the outside. The packaging shell is usually made of materials with good protective properties, which can withstand adverse factors such as external impact, vibration and corrosion, thereby protecting the integrity and reliability of semiconductor products. The packaged semiconductor products are subjected to quality inspection, including appearance inspection, performance testing, etc. According to the test results, the products are divided into different grades to ensure that only products that meet the quality standards can enter the market, and the products that pass the quality inspection are packed into the corresponding packaging boxes according to the quantity and specifications required by the customer. The packaging box needs to have good protective performance and adaptability to ensure that the product will not be damaged during transportation and storage. At the same time, labels and barcodes are affixed to the packaging boxes for tracking and management. These identification information helps to ensure product traceability and quality control Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor product packaging feeding method, characterized by: The following steps are involved: S1, linear vibrator vibrates the product to the turntable end; S2. The product near the turntable end is sucked into the turntable using vacuum; S3, the front product of the suction turntable is isolated by blowing; S4, the product rotates to the top of the carrier belt; S5. Select adhesives and packaging materials for semiconductor product packaging and implantation.
2. A semiconductor product packaging feeding method according to claim 1, characterized in that: In step S1, the connection and fit between the linear vibrator and the turntable end are ensured to be appropriate. This may include adjusting the position and angle of the vibrator to ensure that the product can slide smoothly from the vibrator to the turntable, and the amplitude, frequency and vibration direction of the vibrator are adjusted according to the characteristics and requirements of the product.
3. A semiconductor product packaging feeding method according to claim 1, characterized in that: The vacuum suction technology in step S2 mainly relies on the negative pressure effect generated by the vacuum pump. Tiny suction holes or nozzles are designed at specific positions on the turntable. These suction holes are connected to the vacuum pump system. When the product approaches the specified position on the turntable, the control system activates the vacuum pump to form negative pressure at the suction holes, thereby tightly adsorbing the product on the turntable. As the turntable rotates, the product is safely and stably transferred to the next process. When the target position is reached, the negative pressure is released by turning off the vacuum pump or activating the blowing device, and the product is released.
4. A semiconductor product packaging feeding method according to claim 1, characterized in that: In the step S3, in the front area of the turntable, when the product reaches the specified position, the negative pressure generated by the vacuum pump tightly adsorbs the product to a specific position on the turntable. When the product needs to be isolated or transferred from one area to another, the control system activates the blowing device. The blowing device blows compressed air to the bottom or side of the product to generate sufficient airflow to release the product from the vacuum adsorption state and push it forward or to reach the specified isolation area. The product is pushed to the target position by the blowing device, and the vacuum pump can be activated again to fix the product in the new position and continue to the next production process.
5. A semiconductor product packaging feeding method according to claim 1, characterized in that: In step S4, the product is rotated by the turntable in cooperation with the rotating mechanism. During the rotation process, the position and rotation angle of the product are monitored in real time through precise sensors and control systems. When the product reaches the predetermined position, the control system issues a command to stop the rotating mechanism and proceed to the next step. The carrier is moved to the predetermined position through the conveying system. The moving speed and position of the carrier are also precisely controlled by sensors and control systems. When the product rotates above the carrier and the positions of the two are precisely aligned, the control system triggers the placement mechanism to remove the product from the rotating mechanism and place it on the carrier.
6. A semiconductor product packaging feeding method according to claim 1, characterized in that: In step S5, the adhesive is selected from a mixture of epoxy resin, silicone resin and polyurethane resin. When selecting adhesives and packaging materials for semiconductor product packaging and implantation, it is necessary to comprehensively consider the working environment, performance requirements, cost and processability of the product. By selecting adhesives and packaging materials that are compatible with the product, the stability and reliability of the semiconductor product can be improved.