Modified nickel-plated diamond micro powder and electroplated diamond wire

Abstract

The invention relates to modified nickel-plated diamond micro-powder and an electroplated diamond wire. The modified nickel-plated diamond micro-powder comprises a nickel-plated diamond micro-powder base body, an organic sealing layer and polyepichlorohydrin amine, wherein the surface of the nickel-plated diamond micro-powder base body is coated with the organic sealing layer, and the polyepichlorohydrin amine is adsorbed to the surface of the organic sealing layer through hydrogen bonds. The modified nickel-plated diamond micro-powder not only has a good dispersion effect in a plating solution and higher sanding capacity, but also can avoid hard embrittlement of a plating layer and reduce the risk of wire breakage, so that the production cost of an electroplated diamond wire is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of electroplated gold steel wires, in particular to modified nickel-plated diamond micropowder and electroplated gold steel wires. Background Art

[0002] Electroplated gold wire is widely used in cutting hard and brittle materials, among which nickel-plated diamond powder is one of the key raw materials for electroplated gold wire. Plating a thin and dense layer of nickel metal on the surface of diamond can improve the interfacial bonding ability between diamond and nickel matrix, thereby reducing the diamond shedding during the cutting process and improving the cutting force of electroplated gold wire. The industry generally adopts chemical plating or composite plating (chemical plating followed by electroplating) to construct nickel-plated diamond powder. The chemical nickel plating layer has a low density and is easily corroded, so it is often densely electroplated on the basis of chemical plating to form a composite coating. This composite nickel-plated powder has a longer service life than chemical nickel-plated powder, so it is widely used in nickel-plated diamond powder. However, this high-density electroplated nickel increases the weight of the powder and reduces the suspension of the powder, resulting in the need for more nickel-plated diamond powder in the upper sand trough, which undoubtedly increases production costs.

[0003] At present, the industry adds polymer organic additives to the plating solution, and uses the adsorption of polymers on the surface of micropowders to charge the surface of micropowders, thereby enhancing the dispersibility of micropowders in the plating solution. However, this polymer organic additive itself or its redox decomposition products are easily mixed in the coating, which not only reduces the purity of the coating, but also causes the coating to become brittle due to organic inclusions, thereby increasing the risk of wire breakage during cutting of the diamond wire. Based on this, the additive content in the plating solution is controlled at a low level to reduce the impact on the coating, resulting in a low amount of additives adsorbed on the surface of the micropowder and a limited surface charge, that is, the dispersion ability of the micropowder is limited, resulting in the need for a high content of nickel-plated diamond micropowder in the plating solution of the electroplating diamond wire section, which is not conducive to reducing production costs. Summary of the invention

[0004] Based on this, it is necessary to provide a modified nickel-plated diamond powder and electroplated gold steel wire to address the above problems; the modified nickel-plated diamond powder not only has a good dispersion effect in the plating solution and a stronger sanding ability, but also can avoid hardening and brittleness of the coating and reduce the risk of wire breakage, thereby reducing the production cost of the electroplated gold steel wire.

[0005] A modified nickel-plated diamond micropowder comprises a nickel-plated diamond micropowder matrix, an organic closed layer coated on the surface of the nickel-plated diamond micropowder matrix, and polyepichlorohydrin amine adsorbed on the surface of the organic closed layer through hydrogen bonds.

[0006] In one embodiment, the absolute value of the Zeta potential of the organic sealing layer is 30 mV-80 mV.

[0007] In one embodiment, the hydrogen bond content in the organic sealing layer is 1%-10%.

[0008] In one embodiment, the mass of the organic sealing layer is 0.01%-2% of the mass of the nickel-plated diamond powder matrix.

[0009] In one embodiment, the organic sealing layer includes a polymer film formed by the reaction of a double-bond organic monomer, a cross-linking agent, a accelerator, and an initiator.

[0010] In one embodiment, the double bond organic monomer includes at least one of acrylamide and acrylic acid.

[0011] In one embodiment, the organic sealing layer includes a polymer film formed by a silane coupling agent.

[0012] In one embodiment, the mass of the polyepichlorohydrin amine is 0.01%-2% of the mass of the nickel-plated diamond powder matrix.

[0013] In one embodiment, the porosity of the modified nickel-plated diamond powder is 0.01%-0.5%.

[0014] An electroplated gold steel wire comprises the modified nickel-plated diamond micropowder as described above.

[0015] The modified nickel-plated diamond micropowder of the present invention is beneficial to increasing the surface charge of the nickel-plated diamond micropowder matrix, improving the suspension of the micropowder, and improving the dispersion effect of the micropowder in the plating solution through the synergistic effect of the organic closed layer coated on the surface of the nickel-plated diamond micropowder matrix and the polyepichlorohydrin amine adsorbed by hydrogen bonds, thereby enhancing the adsorption of the micropowder on the surface of the steel wire during the electroplating sanding process, thereby making the modified nickel-plated diamond micropowder have a stronger sanding ability, which is beneficial to reducing the usage of the modified nickel-plated diamond micropowder. At the same time, it can also avoid the hardening and brittleness of the coating and reduce the risk of wire breakage.

[0016] Therefore, the modified nickel-plated diamond powder of the present invention is used to prepare electroplated gold steel wire, which can reduce the production cost while ensuring the high quality of the electroplated gold steel wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1Schematic diagram of the structure of modified nickel-plated diamond powder in one embodiment of the present invention.

[0019] Among them, 10, modified nickel-plated diamond powder; 101, nickel-plated diamond powder matrix; 102, organic sealing layer; 103, hydrogen bond; 104, polyepichlorohydrin amine. DETAILED DESCRIPTION

[0020] For ease of understanding of the present invention, the present invention will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. On the contrary, the purpose of providing these embodiments or examples is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific implementation methods or embodiments, and are not intended to limit the present invention. The optional scope of the term "and / or" used herein includes any one of two or more related listed items, and also includes any and all combinations of related listed items, and the combinations include any two related listed items, any more related listed items, or all related listed items.

[0022] In the present invention, when it comes to numerical ranges, unless otherwise specified, the above numerical ranges are deemed to be continuous and include the minimum and maximum values ​​of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values ​​of the range is included. In addition, when multiple ranges are provided to describe features or characteristics, the ranges can be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges included therein.

[0023] Combination Figure 1 As shown, the modified nickel-plated diamond powder 10 of the present invention includes a nickel-plated diamond powder matrix 101, an organic closed layer 102 coated on the surface of the nickel-plated diamond powder matrix 101, and polyepichlorohydrin amine 104 adsorbed on the surface of the organic closed layer 102 through hydrogen bonds 103.

[0024] The modified nickel-plated diamond powder 10 of the present invention, through the synergistic effect of the organic closed layer 102 coated on the surface of the nickel-plated diamond powder substrate 101 and the polyepichlorohydrinamine 104 adsorbed by the hydrogen bond 103, is conducive to increasing the surface charge of the nickel-plated diamond powder substrate 101, improving the suspension of the powder, and improving the dispersion effect of the powder in the plating solution, thereby enhancing the adsorption of the powder on the surface of the steel wire during the electroplating sanding process, thereby making the modified nickel-plated diamond powder 10 have a stronger sanding ability, which is conducive to reducing the usage of the modified nickel-plated diamond powder 10. At the same time, it can also avoid the hardening and brittleness of the coating and reduce the risk of wire breakage, thereby reducing the production cost of the electroplated gold steel wire while ensuring the high quality of the electroplated gold steel wire.

[0025] In one embodiment of the present invention, the absolute value of the Zeta potential of the organic sealing layer 102 is 30mV-80mV. By regulating the charge on the surface of the organic sealing layer 102, it is beneficial to improve the adsorption effect of the organic sealing layer 102 on polyepichlorohydrin amine 104, further increase the surface charge of the nickel-plated diamond micropowder matrix 101, reduce the amount of additives in the plating solution, and thus avoid the coating being hard and brittle.

[0026] It is understandable that the absolute value of the Zeta potential of the organic sealing layer 102 includes but is not limited to any point value among 30mV, 40mV, 50mV, 60mV, 70mV, 80mV or a range value between any two of them. More preferably, the absolute value of the Zeta potential of the organic sealing layer 102 is 50mV-70mV.

[0027] In one embodiment of the present invention, the hydrogen bond content in the organic sealing layer 102 is 1%-10%. By regulating the hydrogen bond content in the organic sealing layer 102, it is beneficial to further improve the adsorption effect of the organic sealing layer 102 on the polyepichlorohydrin amine 104, and enhance the adsorption of the micropowder on the surface of the steel wire during the electroplating sanding process, so that the modified nickel-plated diamond micropowder 10 has a stronger sanding ability, thereby reducing the usage of the modified nickel-plated diamond micropowder 10 and reducing the production cost.

[0028] It is understandable that the hydrogen bond content in the organic sealing layer 102 includes but is not limited to any point value of 1%, 2%, 3%, 5%, 7%, 9%, 10% or any range value between two of them. More preferably, the hydrogen bond content in the organic sealing layer 102 is 2%-5%.

[0029] The inventors have found through long-term research that the traditional diamond surface electroplating corrosion resistance technology usually adopts the method of chemical plating plus electroplating layer. Due to the inevitable presence of pores on the surface of the electroplating layer, the electroplating layer not only fails to achieve the expected role of protecting the base metal, but also accelerates the corrosion of the base metal. This porous uneven electroplating layer seriously affects the application performance of the electroplated gold steel wire. Although increasing the thickness of the electroplating layer is helpful to reduce the generation of pores to a certain extent, the increase in the thickness of the electroplating layer will reduce the mechanical properties of the steel wire. In the case of strict requirements on size, the steel wire with too thick electroplating layer may not meet the use requirements of the product, and the too thick electroplating layer has poor adhesion and is very easy to fall off and crack.

[0030] Based on this, the present invention coats the surface of the nickel-plated diamond powder substrate 101 with an organic sealing layer 102, and utilizes the high permeability of small molecule organic monomers to enable them to enter the gaps in the nickel layer. When the small molecule organic monomers are polymerized by heat, they can form dense polymers and effectively seal the pores. The formed organic film can effectively block corrosion.

[0031] In one embodiment of the present invention, the organic sealing layer 102 includes a polymer film formed by the reaction of a double-bond organic monomer, a cross-linking agent, a accelerator, and an initiator.

[0032] It should be noted that the present invention does not limit the manner in which double-bond organic monomers, cross-linking agents, promoters and initiators react to form a polymer film, and existing processes may be used. For example, double-bond organic monomers, cross-linking agents, promoters and initiators are placed in a solvent, stirred to react in a cold water bath to form a treatment liquid, and then the nickel-plated diamond powder substrate 101 is placed in the treatment liquid, stirred in a cold water bath, and filtered and dried to obtain the nickel-plated diamond powder substrate 101 coated with an organic sealing layer 102.

[0033] In one embodiment of the present invention, the double-bond organic monomer includes but is not limited to at least one of acrylamide and acrylic acid. By selecting a double-bond organic monomer with a strong adsorptive functional group such as an amino group or a hydroxyl group, it is beneficial to further improve the adsorption effect of the organic sealing layer 102 on the polyepichlorohydrin amine 104.

[0034] It is to be understood that the present invention does not limit the specific types of cross-linking agents, accelerators and initiators. Specifically, cross-linking agents include but are not limited to N,N-methylenebisacrylamide (BIS, gel cross-linking agent); accelerators include but are not limited to N,N,N',N'-tetramethyldiethylamine (TEMED, gel accelerator); initiators include but are not limited to potassium persulfate (gel initiator).

[0035] In one embodiment of the present invention, the organic sealing layer 102 includes a polymer film formed by a silane coupling agent.

[0036] It should be noted that the present invention does not limit the method of forming the polymer film with the silane coupling agent, and the existing process can be used. For example, the silane coupling agent is placed in an organic solvent containing water to be fully hydrolyzed as a treatment liquid, and then the nickel-plated diamond powder substrate 101 is placed in the treatment liquid and stirred, and the nickel-plated diamond powder substrate 101 coated with the organic sealing layer 102 is obtained after filtering and drying.

[0037] It is to be understood that the present invention does not limit the specific type of silane coupling agent, including but not limited to γ-aminopropyltriethoxysilane (KH550) and the like.

[0038] In one embodiment of the present invention, the mass of the organic sealing layer 102 is 0.01%-2% of the mass of the nickel-plated diamond powder substrate 101, including but not limited to any point value among 0.01%, 0.05%, 0.2%, 0.5%, 0.7%, 1% or any range value between two of them, and is further preferably 0.05%-2%.

[0039] In one embodiment of the present invention, the mass of the polyepichlorohydrin amine 104 is 0.01%-2% of the mass of the nickel-plated diamond powder matrix 101, including but not limited to any point value among 0.01%, 0.05%, 0.2%, 0.5%, 0.7%, 1% or any range value between two of them, and is further preferably 0.05%-2%.

[0040] By regulating the quality of the organic sealing layer 102 and the polyepichlorohydrin amine 104, it is beneficial to further balance the sanding ability of the modified nickel-plated diamond powder 10 and the risk of hardening and brittleness of the coating, thereby reducing the production cost of the electroplated gold steel wire while ensuring the high quality of the electroplated gold steel wire.

[0041] In one embodiment of the present invention, the porosity of the modified nickel-plated diamond powder 10 is 0.01%-0.5%, which is beneficial to improving the corrosion resistance of the coating, thereby increasing the service life of the electroplated gold steel wire.

[0042] It can be understood that the porosity of the modified nickel-plated diamond powder 10 includes but is not limited to any point value among 0.01%, 0.05%, 0.08%, 0.1%, 0.2%, 0.5% or any range value between two of them. More preferably, the porosity of the modified nickel-plated diamond powder 10 is 0.1%-0.5%.

[0043] It should be noted that the present invention does not limit the preparation method of the modified nickel-plated diamond powder 10, and the conventional preparation process can be used to sequentially place the nickel-plated diamond powder substrate 101 in a treatment solution containing an organic sealing layer 102 and a treatment solution containing polyepichlorohydrin amine 104 for treatment. Preferably, before placing the nickel-plated diamond powder substrate 101 in the treatment solution containing an organic sealing layer 102 for treatment, the nickel-plated diamond powder substrate 101 is firstly acid-washed and activated.

[0044] The present invention also provides an electroplated gold steel wire, comprising the modified nickel-plated diamond micropowder as described above.

[0045] By electroplating the modified nickel-plated diamond micropowder described in the present invention on the surface of the metal wire substrate, not only the electroplated gold steel wire has high hardness and wear resistance, which is beneficial to reducing the shedding of the modified nickel-plated diamond micropowder during the cutting process and improving the cutting force of the electroplated gold steel wire, but also the corrosion resistance of the electroplated gold steel wire is significantly improved, and the oxidation, corrosion and rust of the electroplated gold steel wire can be effectively prevented, and the service life is extended. At the same time, the present invention also reduces the production cost of the electroplated gold steel wire, which is beneficial to the promotion and application of the electroplated gold steel wire.

[0046] It should be noted that the present invention does not limit the specific preparation process of the electroplated gold steel wire, and it can be prepared using existing conventional processes.

[0047] The modified nickel-plated diamond powder and electroplated gold wire will be further described below by the following specific examples. However, those skilled in the art will appreciate that the following examples are only used to illustrate the present invention and should not be considered to limit the scope of the present invention. If no specific conditions are specified in the examples, the conventional conditions or the conditions recommended by the manufacturer are followed. If the manufacturer of the reagents or instruments used is not specified, they are all conventional products that can be purchased commercially.

[0048] Example 1 In 100 mL of aqueous solution, add 10 g of acrylic acid, 0.1 g of N,N-methylenebisacrylamide (BIS, gel crosslinker), 0.1 g of N,N,N',N'-tetramethyldiethylamine (TEMED, gel accelerator), and 0.1 g of potassium persulfate (gel initiator), and stir vigorously in a cold water bath for 30 minutes to prepare a first treatment solution.

[0049] 25g of the acid-washed activated nickel-plated diamond micropowder matrix was placed in the first treatment solution and vigorously stirred for 30 minutes in a cold water bath. After stopping the stirring, the wet micropowder was obtained by suction filtration, and then dried at 120°C for 4 hours to obtain a nickel-plated diamond micropowder matrix coated with an organic sealing layer.

[0050] In 100 mL of aqueous solution, 1 g of polyepichlorohydrin amine was added and stirred to obtain a second treatment solution. The nickel-plated diamond micropowder substrate coated with the organic sealing layer was placed in the second treatment solution and stirred for 60 minutes. The solution was then filtered and dried at 60°C to obtain modified nickel-plated diamond micropowder.

[0051] Example 2 1 g of silane coupling agent KH550 was added to 100 mL of a mixed solution of ethanol and water (the mass ratio of ethanol to water was 95:5), and the mixture was stirred vigorously for 1 hour to fully hydrolyze the silane coupling agent, thereby preparing a first treatment solution.

[0052] 25g of the acid-washed activated nickel-plated diamond micropowder matrix was placed in the first treatment solution and stirred at room temperature for 1 hour. After stopping the stirring, the wet micropowder was obtained by suction filtration, and then dried at 120°C for 4 hours to obtain the nickel-plated diamond micropowder matrix coated with an organic sealing layer.

[0053] In 100 mL of aqueous solution, 1 g of polyepichlorohydrin amine was added and stirred to obtain a second treatment solution. The nickel-plated diamond micropowder substrate coated with the organic sealing layer was placed in the second treatment solution and stirred for 60 minutes. The solution was then filtered and dried at 60°C to obtain modified nickel-plated diamond micropowder.

[0054] Example 3 In 100 mL of aqueous solution, add 5 g of acrylamide, 0.05 g of N,N-methylenebisacrylamide (BIS, gel crosslinker), 0.05 g of N,N,N',N'-tetramethyldiethylamine (TEMED, gel accelerator), and 0.05 g of potassium persulfate (gel initiator), and stir vigorously in a cold water bath for 30 minutes to prepare a first treatment solution.

[0055] 25g of the acid-washed activated nickel-plated diamond micropowder matrix was placed in the first treatment solution and vigorously stirred for 30 minutes in a cold water bath. After stopping the stirring, the wet micropowder was obtained by suction filtration, and then dried at 120°C for 4 hours to obtain a nickel-plated diamond micropowder matrix coated with an organic sealing layer.

[0056] In 100 mL of aqueous solution, 1 g of polyepichlorohydrin amine was added and stirred to obtain a second treatment solution. The nickel-plated diamond micropowder substrate coated with the organic sealing layer was placed in the second treatment solution and stirred for 60 minutes. The solution was then filtered and dried at 60°C to obtain modified nickel-plated diamond micropowder.

[0057] Example 4 5 g of silane coupling agent KH590 was added to 100 mL of a mixed solution of ethanol and water (the mass ratio of ethanol to water was 95:5), and the mixture was vigorously stirred for 1 hour to fully hydrolyze the silane coupling agent, thereby preparing a first treatment solution.

[0058] 10g of the acid-washed activated nickel-plated diamond micropowder matrix was placed in the first treatment solution and stirred at room temperature for 1 hour. After stopping the stirring, wet micropowder was obtained by suction filtration, and then dried at 120°C for 4 hours to obtain a nickel-plated diamond micropowder matrix coated with an organic sealing layer.

[0059] In 100 mL of aqueous solution, 5 g of polyepichlorohydrin amine was added and stirred to obtain a second treatment solution. The nickel-plated diamond micropowder substrate coated with the organic sealing layer was placed in the second treatment solution and stirred for 60 minutes. The solution was then filtered and dried at 60°C to obtain modified nickel-plated diamond micropowder.

[0060] Example 5 The difference between Example 5 and Example 1 is that the amount of acrylic acid used is 0.5 g.

[0061] Comparative Example 1 In 100 mL of aqueous solution, add 10 g of acrylic acid, 0.1 g of N,N-methylenebisacrylamide (BIS, gel crosslinker), 0.1 g of N,N,N',N'-tetramethyldiethylamine (TEMED, gel accelerator), and 0.1 g of potassium persulfate (gel initiator), and stir vigorously in a cold water bath for 30 minutes to prepare a first treatment solution.

[0062] 25g of the acid-washed activated nickel-plated diamond micropowder matrix was placed in the first treatment solution and vigorously stirred for 30 minutes in a cold water bath. After stopping the stirring, the wet micropowder was obtained by suction filtration, and then dried at 120°C for 4 hours to obtain a nickel-plated diamond micropowder matrix coated with an organic sealing layer.

[0063] Comparative Example 2 In 100 mL of aqueous solution, 1 g of polyepichlorohydrin amine was added and stirred to obtain a second treatment solution. 25 g of nickel-plated diamond powder substrate was placed in the second treatment solution and stirred for 30 minutes. The solution was then filtered and dried at 120° C. for 4 hours to obtain modified nickel-plated diamond powder.

[0064] Comparative Example 3 The difference between Comparative Example 3 and Example 1 is that an equal amount of polydiallyldimethylammonium chloride is used to replace polyepichlorohydrinamine. Since there is no functional group with hydrogen bond in the structure of polydiallyldimethylammonium chloride, the micropowder has low adsorption force to it, and the micropowder cannot achieve effective adsorption and charging.

[0065] The micropowders prepared in all the embodiments and all the comparative examples were tested, and the results are shown in Table 1.

[0066] Table 1 Application Examples The micro powders prepared in all the embodiments and all the comparative examples were made into plating solutions to prepare electroplated gold steel wires, and the performance was tested. The results are shown in Table 2.

[0067] Preparation method: Electroplating production verification was carried out on a horizontal sanding diamond wire machine. The busbar was made of 37-micron diameter carbon steel, the amount of sanding micro powder was 500g, and the production line speed was 40m / min. Under the same voltage, 10 kilometers of diamond wire were continuously produced.

[0068] Preparation of conventional diamond wire: Add 0.3g / L of polyepichlorohydrin amine to the sanding plating solution, and select untreated powder for sanding. Other conditions are the same as the above preparation method. The preparation of conventional diamond wire requires the addition of polyepichlorohydrin amine to the plating solution to improve the sanding activity of diamond, so as to achieve a sufficient edge rate to meet basic cutting requirements.

[0069] Test method: (1) Take samples of the diamond wire after it is unloaded from the machine, and use a Kobel tester to detect the edge rate of the micropowder, so as to evaluate the sand-carrying ability of the micropowder through the edge rate. Edge rate: Diamond particles electroplated on the surface of the diamond wire per unit area. Under the same production speed, the higher the edge rate of the diamond wire, the higher the surface charge of the micropowder and the stronger its sand-carrying ability; (2) Take samples of the diamond wire after it is unloaded from the machine, and use a mechanical tensile machine to detect the knotting breaking force of the diamond wire, so as to evaluate the coating quality through the knotting breaking force, where the knotting breaking force is represented by the breaking tensile force of the diamond wire after knotting; adding organic additives to the plating solution will cause the organic matter to be coated in the coating, making the coating hard and brittle, and then reducing the toughness of the diamond wire, resulting in a decrease in the knotting breaking force; the high knotting breaking force of the diamond wire proves that the coating quality is good, the toughness of the diamond wire is good, and the risk of wire breakage is small.

[0070] Table 2 According to Table 1 and Table 2, compared with the comparative example and conventional diamond wire, the modified nickel-plated diamond powder provided in all embodiments not only has excellent sanding ability, but also has a lower risk of wire breakage, which significantly reduces the production cost of electroplated gold steel wire and is conducive to market application.

[0071] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A modified nickel-plated diamond powder, characterized in that: The modified nickel-plated diamond micropowder comprises a nickel-plated diamond micropowder matrix, an organic closed layer coated on the surface of the nickel-plated diamond micropowder matrix, and polyepichlorohydrin amine adsorbed on the surface of the organic closed layer through hydrogen bonds.

2. The modified nickel-plated diamond powder according to claim 1, characterized in that: The absolute value of the Zeta potential of the organic sealing layer is 30mV-80mV.

3. The modified nickel-plated diamond powder according to claim 1, characterized in that: The hydrogen bond content in the organic sealing layer is 1%-10%.

4. The modified nickel-plated diamond powder according to claim 1, characterized in that: The mass of the organic sealing layer is 0.01%-2% of the mass of the nickel-plated diamond micropowder matrix.

5. The modified nickel-plated diamond powder according to claim 1, characterized in that: The organic sealing layer comprises a polymer film formed by the reaction of a double-bond organic monomer, a cross-linking agent, a accelerator and an initiator.

6. The modified nickel-plated diamond powder according to claim 5, characterized in that: The double bond organic monomer includes at least one of acrylamide and acrylic acid.

7. The modified nickel-plated diamond powder according to claim 1, characterized in that: The organic sealing layer includes a polymer film formed by a silane coupling agent.

8. The modified nickel-plated diamond powder according to claim 1, characterized in that: The mass of the polyepichlorohydrin amine is 0.01%-2% of the mass of the nickel-plated diamond micropowder matrix.

9. The modified nickel-plated diamond powder according to claim 1, characterized in that: The porosity of the modified nickel-plated diamond micropowder is 0.01%-0.5%.

10. An electroplated gold steel wire, characterized in that: It comprises the modified nickel-plated diamond micropowder as described in any one of claims 1 to claim 9.

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