Full-automatic silicon rod adhering device and method

Abstract

The invention relates to the technical field of silicon rod splicing, in particular to a full-automatic silicon rod bonding device and method, and the method comprises the steps: obtaining the rod length information of a silicon rod, and obtaining the plane inclination information of the silicon rod; determining a first silicon rod and a second silicon rod which are suitable for rod splicing; gluing operation is conducted on the silicon rod; the two silicon rods are transferred into an upper clamping jaw and a lower clamping jaw of a rod splicing machine respectively; after the two silicon rods are placed into the upper clamping jaw and the lower clamping jaw, crystal line position information on the silicon rods is obtained for the second time; aligning the crystal lines on the two silicon rods; after the crystal lines of the two silicon rods are aligned, the adjacent end faces of the two silicon rods are controlled to be attached through a rod splicing machine; the technical problem that the automatic execution efficiency of the silicon rod adhering device is low is solved, and the technical effect that the automatic execution efficiency of the silicon rod adhering device is improved is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon rod splicing, and in particular to a fully automatic silicon rod bonding device and method. Background Art

[0002] There are some short silicon rods in the process of silicon rod drawing. The usual practice is manual or semi-automatic gluing and splicing to glue short silicon rods of the same specification and grade together to form a rod of qualified length, so as to facilitate the subsequent silicon rod processing process.

[0003] At present, the semi-automatic silicon rod sticking device only uses a robot to replace manual handling of silicon rods, so that the silicon rods are sequentially put in and out of each device according to the manual sticking process. The layout of each device is not adjusted based on the robot, and the stick sticking process is not adjusted based on the robot. The advantages of the robot in handling silicon rods are not fully utilized, and the automation execution efficiency is low.

[0004] Therefore, the technical problem of the prior art is that the automation execution efficiency of the silicon rod bonding device is low. Summary of the invention

[0005] The present application provides a fully automatic silicon rod sticking device and method, which solves the technical problem of low automation execution efficiency of the silicon rod sticking device and achieves the technical effect of improving the automation execution efficiency of the silicon rod sticking device.

[0006] The present application provides a fully automatic silicon rod bonding method and device, which adopts the following technical solutions:

[0007] A fully automatic silicon rod bonding method, comprising: obtaining rod length information of the silicon rod, and obtaining surface inclination information of the silicon rod; determining a first silicon rod and a second silicon rod suitable for splicing rods based on the rod length information and the surface inclination information; obtaining crystal line position information on the first silicon rod and the second silicon rod for the first time; applying glue to the end face to be spliced ​​of one of the silicon rods that meets the rod length requirements based on the rod length information of the two silicon rods; transferring the two silicon rods to the upper clamping claw and the lower clamping claw of the splicing machine respectively; obtaining the crystal line position information on the silicon rod for the second time after the two silicon rods are placed in the upper clamping claw and the lower clamping claw; adjusting the crystal line position of the silicon rod on the upper clamping claw based on the crystal line position information obtained for the second time And / or adjust the crystal line position of the silicon rod on the lower clamping claw so that the crystal lines on the two silicon rods are aligned; after the crystal lines of the two silicon rods are aligned, control the adjacent end faces of the two silicon rods to fit together through a rod splicing machine; wherein, based on the crystal line position information acquired for the first time, before the silicon rod is transferred to the rod splicing machine, adjust the position of the silicon rod so that the crystal lines of the silicon rod on the rod splicing machine are within the detection range of the crystal line position information acquired for the second time; or, after the silicon rod is transferred to the rod splicing machine, adjust the position of the silicon rod on the rod splicing machine based on the crystal line position information acquired for the first time, so that the crystal lines of the silicon rod on the rod splicing machine are within the detection range of the crystal line position information acquired for the second time.

[0008] Preferably, the step of obtaining the rod length information of the silicon rod comprises: obtaining, by means of a distance determining device, a first distance from the distance determining device to a first end face of the silicon rod; controlling the rotation of the silicon rod so that a second end face of the silicon rod faces a second distance finder; obtaining, by means of the second distance finder, a second distance from the second distance finder to the second end face of the silicon rod; and determining the rod length of the silicon rod based on the first distance, the second distance, and a third preset value corresponding to the incoming channel in which the silicon rod is located.

[0009] Preferably, the step of controlling the rotation of the silicon rod comprises: obtaining the grasping position of the central manipulator based on the distance determination device, and adjusting the position of the central manipulator grasping the silicon rod; after adjusting the position of the central manipulator grasping the silicon rod, controlling the central manipulator to grasp and rotate the silicon rod.

[0010] Preferably, the step of obtaining the face tilt information of the silicon rod comprises: obtaining the distance from the distance sensor to a plurality of measuring points on an end face of the silicon rod by means of a distance sensor, and determining the face tilt information of the silicon rod based on the difference between the positions of the plurality of measuring points on the end face and the distances corresponding to the plurality of measuring points.

[0011] Preferably, the step of obtaining the rod length information of the silicon rod and the step of obtaining the surface tilt information of the silicon rod are completed in two steps; or, the step of obtaining the rod length information of the silicon rod and the step of obtaining the surface tilt information of the silicon rod include: when executing the step of obtaining the surface tilt information of the silicon rod, limiting the position of the silicon rod, and determining the rod length information after simultaneously or successively measuring the surface tilt information of the two end surfaces of the silicon rod.

[0012] Preferably, the step of calculating the rod length information after simultaneously or successively measuring the surface inclination information of the two end faces of the silicon rod comprises: a distance sensor measures the distances A1 and A2 from two specific positions at both ends of the silicon rod to the two end faces of the silicon rod respectively, and the spacing between the two specific positions of the distance sensor is A, and the rod length information L=A-A1-A2.

[0013] Preferably, the first acquisition of the crystal line position information on the silicon rod and the glue coating operation are performed sequentially at the same workstation, or the two are performed simultaneously; or, the glue coating operation is performed after the silicon rod is transferred to the rod assembly machine.

[0014] Preferably, the step of obtaining the crystal line position information on the silicon rods for the second time after the two silicon rods are placed in the upper clamping jaws and the lower clamping jaws includes: after the central manipulator transports the two silicon rods to the rod assembly machine, the central manipulator adjusts the posture and / or position so that the two silicon rods are within the recognition range of the first visual part configured by the central manipulator, and obtains the crystal line position information on the silicon rods through the first visual part.

[0015] A fully automatic silicon rod bonding device comprises: a central manipulator, the central manipulator having a gripping and releasing range for clamping the silicon rod; a silicon rod feeder, at least part of which is arranged within the gripping and releasing range; a measuring surface glue coating machine, the measuring surface glue coating machine is arranged within the gripping range, the measuring surface glue coating machine comprises: a measuring surface component; a crystal line component, the crystal line component is arranged on one side of the measuring surface component, and the crystal line component or the measuring surface component has a space allowing the central manipulator to clamp the silicon rod through, so that the central manipulator places the silicon rod on the other component mentioned above after passing through the crystal line component or the measuring surface component; and a glue coating component, the glue coating component is arranged above the crystal line component to perform glue coating operations on the end faces of the silicon rods on the crystal line component; a rod splicing machine, the rod splicing machine is arranged within the gripping range.

[0016] Preferably, the measuring surface assembly comprises: a measuring surface frame; a measuring surface portion, in which a plurality of distance sensors are arranged, and the end face inclination of the silicon rod is calculated through the distance measurement results of the plurality of distance sensors; wherein, there are two measuring surface portions, the two measuring surface portions are arranged on opposite sides of the measuring surface frame, and the action directions of the distance sensors in the two measuring surface portions are arranged relatively to each other, so as to form a measuring surface space.

[0017] Preferably, the measuring surface assembly is located between the central robot and the wafer alignment assembly, and the measuring surface space is open on both sides of the central robot and the wafer alignment assembly.

[0018] Preferably, the silicon rod feeding machine comprises: a feeding part, the feeding part comprises: a feeding channel, the feeding channel carries silicon rods; a distance determining device, the distance determining device is located at one end of the feeding channel, and the distance determining device corresponds to the feeding channel, and the distance determining device is used to measure the distance from the distance determining device to the first end face of the silicon rod; a distance measuring part, the distance measuring part is arranged on one side of the feeding part, and a second distance meter is arranged on the distance measuring part; the second distance meter faces and acts on a plurality of the feeding parts, and the silicon rods on the feeding part are detected by the second distance meter.

[0019] Different from the prior art, the beneficial effects of this application are:

[0020] By designing a fully automatic silicon rod sticking method divided into multiple steps, it is convenient for automated equipment to implement operations in steps, and the correlation between each step and the difficulty of execution by automated equipment are taken into consideration, so that the beat connection when using automated equipment to execute the method is smooth, thereby solving the technical problem of low automation execution efficiency of the silicon rod sticking device and achieving the technical effect of improving the automation execution efficiency of the silicon rod sticking device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the top view layout of the fully automatic silicon rod bonding device in the present application;

[0022] Figure 2 Schematic diagram of the structure of the silicon rod feeding machine in the present application from a top view;

[0023] Figure 3 This is a schematic diagram of a first stage of the silicon rod feeding machine measuring the distance of the silicon rods in the first embodiment from a top view;

[0024] Figure 4 yes Figure 3 The following is a schematic diagram of the two-stage overhead view of the silicon rod feeder measuring the distance of the silicon rods;

[0025] Figure 5 is a top view schematic diagram of the central manipulator grabbing the silicon rod at another position in the first embodiment;

[0026] Figure 6 This is a schematic diagram of a first stage of the silicon rod feeder measuring the distance of the silicon rods in the second embodiment;

[0027] Figure 7 yes Figure 6 Schematic diagram of the two-stage top view when the silicon rod feeder measures the distance of the silicon rod;

[0028] Figure 8 It is an exploded schematic diagram of the measuring surface gluing mechanism in this application;

[0029] Fig. 9 It is a schematic diagram of the axial measurement of the surface gluing machine in this application;

[0030] Fig.10 It is a schematic diagram of the axial direction measurement of the measuring portion of the measuring surface assembly in this application;

[0031] Fig.11 It is a schematic diagram of the main view of the surface measurement component in this application;

[0032] Fig.12 It is a schematic diagram of the axial direction of the stick-splitting machine in the present application;

[0033] Fig.13 yes Fig.12 An enlarged schematic diagram of the rotating assembly;

[0034] Fig.14 is a side cross-sectional schematic diagram of the transmission part in the present application;

[0035] Fig.15 It is a side view schematic diagram of the central manipulator in the present application when assembling sticks.

[0036] Description of reference numerals:

[0037] 100, central manipulator; 110, central clamping claw; 120, first visual part; 200, silicon rod feeding machine; 210, feeding part; 211, first distance meter; 212, feeding channel; 213, distance meter; 220, distance meter; 221, second distance meter; 300, measuring surface glue coating machine; 310, measuring surface assembly; 311, measuring surface frame; 312, measuring surface part; 312a, first measuring surface part; 312b, second measuring surface part; 3121, measuring surface base; 3122, measuring surface bracket; 3123, distance sensor; 313, measuring surface space; 320, crystal line assembly; 321, crystal line base; 322, crystal line rotating seat; 323, second visual unit; 330, glue coating assembly; 400, rod assembly machine; 410, rod assembly frame; 420, rotating assembly; 421, rotating source; 422, transmission unit; 4221, first gear; 4222, second gear; 4223, slewing support; 423, rotating substrate; 424, pad; 425, oil tray; 430, lower clamping claw; 440, upper clamping claw; 500, silicon rod; 510, crystal line; 600, glue coating layer. DETAILED DESCRIPTION

[0038] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0039] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0041] The present application embodiment provides a fully automatic silicon rod bonding device, referring to Figure 1 The fully automatic silicon rod bonding device is used to bond two short silicon rods 500 into a long silicon rod 500 that meets the slicing requirements. The fully automatic silicon rod bonding device includes a central manipulator 100, a silicon rod feeder 200, a surface glue coating machine 300, and a rod assembly machine 400. The central manipulator 100 has a gripping and releasing range for clamping the silicon rod 500. The silicon rod feeder 200, the surface glue coating machine 300, and the rod assembly machine 400 are located within the gripping range of the aforementioned central manipulator 100, so that the central manipulator 100 can move between various devices with the silicon rod 500.

[0042] The embodiment of the present application also provides a fully automatic silicon rod bonding method, the fully automatic silicon rod bonding method comprising:

[0043] S100, obtaining rod length information of the silicon rod 500, and obtaining surface inclination information of the silicon rod 500;

[0044] S200, determining a first silicon rod 500 and a second silicon rod 500 suitable for assembly based on the rod length information and the surface inclination information;

[0045] S300, acquiring position information of the crystal wires 510 on the first silicon rod 500 and the second silicon rod 500 for the first time;

[0046] S400, based on the rod length information of the two silicon rods 500, a glue coating operation is performed on the end surface to be spliced ​​of one of the silicon rods 500 that meets the rod length requirement;

[0047] S500, transferring two silicon rods 500 to the upper clamping claw 440 and the lower clamping claw 430 of the rod assembly machine 400 respectively;

[0048] S600, after the two silicon rods 500 are placed into the upper clamping jaws 440 and the lower clamping jaws 430, the position information of the crystal wires 510 on the silicon rods 500 is obtained for the second time;

[0049] S700, based on the crystal wire 510 position information obtained for the second time, adjusting the position of the crystal wire 510 of the silicon rod 500 on the upper clamping jaw 440 and / or adjusting the position of the crystal wire 510 of the silicon rod 500 on the lower clamping jaw 430, so that the crystal wires 510 on the two silicon rods 500 are aligned;

[0050] S800 , after the crystal lines 510 of the two silicon rods 500 are aligned, the adjacent end faces of the two silicon rods 500 are controlled to fit together by the rod assembly machine 400 .

[0051] It is understandable that the step numbering in this application does not limit the order of the steps, but is for the purpose of explaining the steps clearly. In the case where there is no obvious logical chain between the steps, the order of the steps can be adjusted.

[0052] For a detailed description of step S100, in one embodiment, refer to Figure 3 and Figure 4 The step of obtaining the rod length information of the silicon rod 500 includes: S110, obtaining a first distance from the distance determining device to the first end face of the silicon rod 500 through the distance determining device; S120, controlling the silicon rod 500 to rotate so that the second end face of the silicon rod 500 faces the second distance finder 221; S130, obtaining a second distance from the second distance finder 221 to the second end face of the silicon rod 500 through the second distance finder 221; S140, determining the rod length of the silicon rod 500 based on the first distance, the second distance and the third preset value corresponding to the incoming channel 212 where the silicon rod 500 is located.

[0053] Define the first distance as X, the second distance as Y, and the third preset value as Z; Figure 3 In the example, the first distance is X1; Figure 4 , after rotating the silicon rod 500, the second distance is measured to be Y1, then the length of the silicon rod 500 is L = Z1-X1-Y1. When the central manipulator 100 grabs the silicon rod 500 at the positioning point, no matter what the first distance is, the calculation formula L = ZXY in this application is valid; specific comparison Figure 3 ,refer to Figure 5 , Figure 5 The first distance X2 in the silicon rod 500 is Figure 3 X1 measured in the state, but Figure 5 The second distance Y2 of the silicon rod 500 in this state will increase accordingly to compensate for the reduced portion of the first distance.

[0054] Specifically, the step of controlling the rotation of the silicon rod 500 in step S120 includes: S121, obtaining the grasping position of the central manipulator 100 based on the distance determination device, and adjusting the position of the central manipulator 100 grasping the silicon rod 500; S122, after adjusting the position of the central manipulator 100 grasping the silicon rod 500, controlling the central manipulator 100 to grasp and rotate the silicon rod 500. The grasping position of the central manipulator 100 is identified and adjusted by the distance determination device, so that the grasping position of the central manipulator 100 is accurate each time, ensuring that the silicon rod 500 grasped and rotated by the central manipulator 100 can be aligned with the second rangefinder 221, ensuring that the expected distance value can be accurately measured based on the second rangefinder 221, and ensuring that the solution of reducing the number of rangefinders set by detecting the movement of the silicon rod 500 in this application can be stably executed.

[0055] Regarding the third preset value described in step S140, the third preset value is determined in advance, and there are multiple ways to determine it. In one embodiment, the step of obtaining the third preset value corresponding to the incoming channel 212 includes: S141, after transporting the standard silicon rod 500 of known rod length to the incoming channel 212, obtaining the first distance between the distance determination device and the first end face of the standard silicon rod 500 through the distance determination device; S142, controlling the standard silicon rod 500 to rotate around the positioning point until the second end face faces the second rangefinder 221; S143, obtaining the second distance between the second rangefinder 221 and the second end face of the standard silicon rod 500 through the second rangefinder 221; S144, setting the sum of the first distance, the second distance and the rod length of the standard silicon rod 500 as the third preset value corresponding to the incoming channel 212. The aforementioned steps of obtaining the third preset value are quick, and the method of determining the third preset value by actual measurement using the standard silicon rod 500 has few variables. The error in the grasping rotation process of the central manipulator 100 can be compensated, and the measured relative third preset value is accurate.

[0056] In another embodiment, the step of obtaining the third preset value corresponding to the incoming channel 212 includes: S141, determining the position of the positioning point on the incoming channel 212, and setting a benchmark at the positioning point; wherein the positioning point is the distance measurement intersection point of the distance determination device and the second rangefinder 221; S142, obtaining the third distance between the distance determination device and the benchmark through the distance determination device; S143, obtaining the fourth distance between the second rangefinder 221 and the benchmark through the second rangefinder 221; S144, setting the sum of the third distance and the fourth distance as the third preset value corresponding to the incoming channel 212. In this step of obtaining the third preset value, the measured point position is accurate, and the measured third preset value is precise.

[0057] In addition, regarding step S100, in one embodiment, the step of obtaining the face tilt information of the silicon rod 500 includes: S150, obtaining the distance from the distance sensor 3123 to multiple measuring points on one end face of the silicon rod 500 through the distance sensor 3123, and determining the face tilt information of the silicon rod 500 based on the difference between the positions of the multiple measuring points on the end face and the distances corresponding to the multiple measuring points. It can be understood that the face tilt information is used to determine whether the end face of the subsequent silicon rod 500 is suitable for rod assembly. In order to improve the accuracy of multi-point face tilt detection, the central manipulator 100 can also perform a secondary rotation with the central axis of the silicon rod 500 after the surface measuring component 310 detects the face tilt information of the silicon rod 500 for the first time, so that the distance sensor 3123 on the surface measuring component 310 detects different positions on the end face of the same silicon rod 500, that is, one distance sensor 3123 detects points at multiple different positions on the end face of a silicon rod 500, thereby improving the detection accuracy of the face tilt information of the end face of the silicon rod 500.

[0058] It can be understood that in step S100, the step of obtaining the rod length information of the silicon rod 500 and the step of obtaining the surface slope information of the silicon rod 500 are divided into two steps and completed independently. For example, the rod length information of the silicon rod 500 is obtained in the silicon rod feeder 200, and the surface slope information of the silicon rod 500 is obtained in the surface measuring glue coating machine 300. Alternatively, the rod length information and the surface slope information in S100 are completed in one operation step, specifically, when executing the step of obtaining the surface slope information of the silicon rod 500, the position of the silicon rod 500 is limited, and the rod length information is determined after the surface slope information of the two end faces of the silicon rod 500 is measured simultaneously or successively. It can be understood that the step of calculating the rod length information after simultaneously or successively measuring the surface inclination information of the two end faces of the silicon rod 500 includes: the distance sensor 3123 measures the distances A1 and A2 from the two specific positions at the two ends of the silicon rod 500 to the two end faces of the silicon rod 500 respectively, and the distance between the two specific positions where the distance sensor 3123 is located is A, and the rod length information L = A-A1-A2. A1 and A2 can be values ​​obtained from a single measurement point, or can be values ​​obtained by averaging multiple measurement points.

[0059] Regarding step S200, since the finished long silicon rod 500 in the present application is composed of two short silicon rods 500 spliced ​​together, there are requirements for the length information of the two short silicon rods 500 and the surface inclination information of the splicing surface of the short silicon rods 500. Specifically, after the rod length information and the surface inclination information are obtained in step S100, in step S200, a pairing strategy between the short silicon rods 500 is formulated by the central processor set in the fully automatic silicon rod bonding device or the external central processor to select the first silicon rod 500 and the second silicon rod 500 suitable for pairing. Silicon rods 500 that are not suitable for the current splicing operation can be placed on a vacant splicing station or returned to the silicon rod 500 storage point.

[0060] Regarding step 300, obtaining the position of the crystal line 510 of the silicon rod 500 is preferably performed in the surface glue coating machine 300, preferably the silicon rod 500 is placed on a rotatable station so that the silicon rod 500 can rotate relative to other execution components, that is, the side of the silicon rod 500 can be observed through the second visual part 323 when the silicon rod 500 has the ability to rotate relatively; or the end surface of the silicon rod 500 can be glued by the glue coating component 330 when the silicon rod 500 has the ability to rotate relatively. It can be understood that obtaining the position information of the crystal line 510 of the first silicon rod 500 and obtaining the position information of the crystal line 510 of the second silicon rod 500 can be achieved by setting a plurality of rotatable stations to synchronously identify the position information of the crystal line 510 on the two silicon rods 500, or the first silicon rod 500 and the second silicon rod 500 can be successively placed on the rotatable station to perform the crystal line 510 identification operation.

[0061] Regarding the execution timing of step S400, it can be understood that since the identification of the position of the crystal line 510 is to identify the side of the silicon rod 500, and the glue coating operation is performed on the end face of the silicon rod 500, the two operations correspond to two faces; the other steps are similar, so the order switching between the steps can be adjusted. Step S400 only needs to be executed between step S200 and step S800. Exemplarily, step S400 is executed before or after or at the same time as step S300, that is, step S300 can be executed first, or step S400 can be executed first; or step S300 and step S400 are executed synchronously. In addition, step S300 and step S400 are preferably at the same station, and are both completed on the surface glue coating machine 300. Exemplarily, step S400 is performed during the execution of step S500, or step S400 is performed after step S500, that is, step S400 is performed after the silicon rod 500 is transferred to the rod assembly machine 400.

[0062] For details about step S600, refer to Fig.15 In one embodiment, step S600 includes: S610, after the central manipulator 100 transports the two silicon rods 500 to the rod assembly machine 400, the central manipulator 100 adjusts its posture and / or position so that the two silicon rods 500 are within the recognition range of the first visual unit 120 configured by the central manipulator 100, and obtains the position information of the crystal line 510 on the silicon rod 500 through the first visual unit 120. It should be noted that the aforementioned adjustment of the posture and / or position of the central manipulator 100 is to allow the recognition range of the first visual unit 120 on the central manipulator 100 to cover the silicon rods 500 on the rod assembly machine 400. Regarding the details of the central robot 100 identifying the position information of the crystal line 510 on the silicon rod 500, the first visual unit 120 may identify the position of the crystal line 510 of the first silicon rod 500 and the position of the crystal line 510 of the second silicon rod 500 at one time; or the first visual unit 120 may identify the position of the crystal line 510 of one silicon rod 500, and then the first visual unit 120 adjusts its posture and / or position and then identifies the position of the crystal line 510 of the second silicon rod 500.

[0063] Regarding the timing and location of obtaining the position information of the crystal wire 510 of the silicon rod 500 for the second time in step S600, based on the position information of the crystal wire 510 obtained for the first time, before the silicon rod 500 is transported to the stick assembly machine 400, the position of the silicon rod 500 is adjusted so that the crystal wire 510 of the silicon rod 500 located on the stick assembly machine 400 is within the detection range of the second acquisition of the position information of the crystal wire 510; or, after the silicon rod 500 is transported to the stick assembly machine 400, based on the position information of the crystal wire 510 obtained for the first time, the position of the silicon rod 500 is adjusted on the stick assembly machine 400 so that the crystal wire 510 of the silicon rod 500 located on the stick assembly machine 400 is within the detection range of the second acquisition of the position information of the crystal wire 510.

[0064] Regarding the description of the rod assembly machine 400 controlling the adjacent end faces of the two silicon rods 500 to fit together in step S800, the positions of the first silicon rod 500 and the second silicon rod 500 in the rod assembly machine 400 are set up and down. In other words, the adjacent end faces of the two silicon rods 500 mentioned above fit together refers to the upper end face of the first silicon rod 500 and the lower end face of the second silicon rod 500 fitting together. The specific action process of fitting together the adjacent end faces can be that the upper clamping claw 440 brings the second silicon rod 500 to move downward toward the first silicon rod 500, or that the lower clamping claw 430 brings the first silicon rod 500 to move upward toward the second silicon rod 500. Of course, it is also feasible that the upper clamping claw 440 and the lower clamping claw 430 act simultaneously.

[0065] The fully automatic silicon rod bonding method of the present application can be specifically applied to the fully automatic silicon rod bonding device of the present application.

[0066] Regarding the configuration quantity and configuration layout of each device in a specific fully automatic silicon rod bonding device, the number of devices or the number of stations of the silicon rod feeder 200, the measuring surface glue coating machine 300 and the rod assembly machine 400 are configured according to the processing rhythm of each device. For example, a central manipulator 100 cooperates with a three-station silicon rod feeder 200, a double-station measuring surface glue coating machine 300 and a four-station rod assembly machine 400. After determining the configuration quantity of each device, the layout of the silicon rod feeder 200, the measuring surface glue coating machine 300 and the rod assembly machine 400 is preferably arranged in a clockwise or counterclockwise order on the periphery of the central manipulator 100, so that the central manipulator 100 can carry the silicon rod 500 and perform operations on the silicon rod feeder 200, the measuring surface glue coating machine 300 and the rod assembly machine 400 in turn.

[0067] The present application also provides a silicon rod feeder 200, which is the silicon rod feeder 200 in the fully automatic silicon rod bonding device. Figure 2 The silicon rod feeding machine 200 is used to input the silicon rods 500 and measure the length of the input silicon rods 500.

[0068] The silicon rod feeding machine 200 includes a feeding part and a distance measuring part. The feeding part 210 includes a feeding channel 212 and a distance determining device. The feeding channel 212 carries silicon rods 500; the distance determining device is located at one end of the feeding channel 212, and the distance determining device corresponds to the feeding channel 212, and the distance determining device is used to measure the distance from the distance determining device to the first end face of the silicon rod 500; the distance measuring part 220 is arranged on one side of the feeding part 210, and a second distance measuring device 221 is arranged on the distance measuring part 220; the second distance measuring device 221 faces and acts on a plurality of the feeding parts 210, and the silicon rods 500 on the feeding part 210 are detected by the second distance measuring device 221.

[0069] In one embodiment, the silicon rod feeder 200 includes a feeder portion 210 and a distance measuring portion 220, wherein the feeder portion 210 is provided with a plurality of strips, and the plurality of feeder portions 210 are arranged side by side; the feeder portion 210 includes a feeder channel 212 and a distance determining device, wherein the feeder channel 212 is used to transport the silicon rod 500, and the feeder channel 212 is provided with a positioning point; the silicon rod 500 includes a first end face and a second end face opposite to each other, wherein the first end face is the end face of the silicon rod 500 close to the end of the transport path of the feeder channel 212; the distance determining device is arranged on the feeder channel 212, and ... The device is used to obtain the first distance between the end of the transport path of the incoming material channel 212 and the first end face of the silicon rod 500; the distance measuring part 220 is arranged on the same side of all the incoming material channels 212, and the distance measuring part 220 is provided with a second distance measuring device 221, and the second distance measuring device 221 faces and acts on the incoming material channel 212; wherein, when the silicon rod 500 is controlled to rotate around the positioning point until the second end face faces the second distance measuring device 221, the second distance between the second distance measuring device 221 and the second end face of the silicon rod 500 is obtained by the second distance measuring device 221. It can be understood that the silicon rod incoming material machine 200 includes a plurality of incoming material parts 210 and distance measuring parts 220, the incoming material parts 210 are used to transport the silicon rods 500, and the plurality of incoming material parts 210 cooperate with the distance measuring parts 220 to measure the length of the silicon rods 500 on each incoming material part 210. In addition, in order to facilitate the distance measurement with the distance measuring unit 220, the plurality of incoming material portions 210 are preferably arranged side by side, the distance measuring unit 220 is arranged on the same side of all the incoming material portions 210, and a second distance measuring device 221 is arranged on the distance measuring unit 220, and the second distance measuring device 221 faces the incoming material portions 210, so that the distance measuring range of the second distance measuring device 221 covers all the incoming material portions 210.

[0070] Incoming Materials Department 210, Reference Figure 2, used to transport silicon rods 500 and measure a first distance related to the rod length information of silicon rods 500. The incoming material part 210 includes an incoming material channel 212 and a distance determination device. The incoming material channel 212 is used to transport silicon rods 500, and the incoming material channel 212 is provided with a positioning point; the silicon rod 500 includes a first end face and a second end face opposite to each other, and the first end face is the end face of the silicon rod 500 close to the end of the transport path of the incoming material channel 212. The distance determination device is provided on the incoming material channel 212, and the distance determination device is used to obtain a first distance between the end of the transport path of the incoming material channel 212 and the first end face of the silicon rod 500.

[0071] The distance measuring unit 220 refers to Figure 2 The distance measuring unit 220 is used to measure the second distance related to the rod length information of the silicon rod 500. In one embodiment, the second distance measuring device 221 provided on the distance measuring unit 220 is located on the same straight line as the positioning points of all the incoming material channels 212, so that after the central manipulator 100 grabs the silicon rod 500 according to the positioning point and rotates, no matter which silicon rod 500 on the incoming material unit 210 is, the second end face of the silicon rod 500 faces the second distance measuring device 221, so that the second distance measuring device 221 can stably measure the distance. In addition, by configuring only one distance measuring unit 220 for multiple incoming material units 210, one second distance measuring device 221 can measure the distance of the silicon rods 500 on several incoming material units 210. Compared with the traditional solution of configuring two laser distance measuring devices for one incoming material unit 210, the number of distance measuring devices used in this solution is small.

[0072] There are two forms of distance determination means. In one embodiment, reference Figure 3The distance determination device includes a first rangefinder 211. Exemplarily, the first rangefinder 211 is an infrared rangefinder or a laser rangefinder. The first rangefinder 211 is arranged at the end of the transportation path of the incoming material channel 212, so that the first rangefinder 211 can directly measure the distance of the first end face of the silicon rod 500 stationary on the incoming material channel 212. Further, the distance measurement direction of the first rangefinder 211 is parallel to the transportation direction of the incoming material channel 212, and the distance measurement direction of the second rangefinder 221 and the transportation direction of the incoming material channel 212 have a preset angle, so that after the first rangefinder 211 measures the distance of the first end face of the silicon rod 500 stationary on the incoming material channel 212, it is convenient for the silicon rod 500 to rotate the preset angle based on the central manipulator 100 so that the second rangefinder 221 can measure the distance of the second end face of the silicon rod 500, so as to ensure that the second rangefinder 221 can measure the silicon rod 500 on each incoming material portion 210. The preset angle can be set to 0 to 90°. It is understandable that the preset angle can be set according to the requirements. In one embodiment, the preset angle is 90°, that is, the distance measurement direction of the first distance meter 211 is parallel to the transportation direction of the incoming material channel 212, and the distance measurement direction of the second distance meter 221 is perpendicular to the transportation direction of the incoming material channel 212, so that after the first distance meter 211 measures the distance of the first end face of the silicon rod 500 stationary on the incoming material channel 212, it is convenient for the silicon rod 500 to be measured based on the center After the central manipulator 100 rotates 90°, the second rangefinder 221 can measure the distance of the second end surface of the silicon rod 500, ensuring that the second rangefinder 221 can measure the silicon rod 500 on each incoming material part 210; in another embodiment, the preset angle is 30° or 45°, so that the silicon rod 500 will not interfere with other incoming material parts 210 after the central manipulator 100 rotates 30° or 45°, so that the design of the silicon rod incoming material machine 200 can be more compact and reduce space occupation. In another embodiment, refer to Figure 6 and Figure 7The distance determining device includes a distancer 213, which is arranged on the transport path of the incoming material channel 212 and is used to limit the position of the silicon rod 500 on the incoming material channel 212 so that the first distance is a first preset value. Exemplarily, the distancer 213 is a liftable baffle. Specifically, the distancer 213 is located between the end of the transport path of the incoming material channel 212 and the positioning point, and the distance between the distancer 213 and the end of the transport path of the incoming material channel 212 is the first preset value. Therefore, the distancer 213 can be used to limit the position of the silicon rod 500 to achieve the distance measurement of the first end face of the silicon rod 500 on the incoming material channel 212, and it is convenient for the central manipulator 100 to drive the silicon rod 500 to rotate after grabbing the silicon rod 500 at the positioning point. In one embodiment, the distance device 213 has two states relative to the incoming channel 212. In the first state, the distance device 213 limits the movement of the silicon rod 500, that is, the silicon rod 500 moves toward the distance device 213 and contacts the distance device 213, so that the distance between the silicon rod 500 and the distance device 213 stably reaches a preset first preset value; in the second state, the distance device 213 avoids the movement of the silicon rod 500 to leave a rotation space for the silicon rod 500, so that the central robot 100 can grab the silicon rod 500 and drive the silicon rod 500 to rotate. It should be noted that when the distance device 213 is used, if Figure 7 The first preset value is a fixed value and can be directly deducted when setting the third preset value Z. That is, the silicon rod 500 rod length L=ZXY previously proposed in this application can be simplified to the silicon rod 500 rod length L=Z2-Y3.

[0073] The present application also provides a silicon rod material distance measurement method, which is applied to the silicon rod material feeding machine 200 of any of the above embodiments. Figure 3 and Figure 4 The specific silicon rod incoming material distance measurement method is as follows: S110, after the silicon rod 500 is transported to the incoming material channel 212, a first distance between the end of the transport path of the incoming material channel 212 and the first end face of the silicon rod 500 is obtained by a distance determination device; S120, the silicon rod 500 is controlled to rotate around the positioning point until the second end face faces the second distance meter 221; S130, the second distance between the second distance meter 221 and the second end face of the silicon rod 500 is obtained by the second distance meter 221; S140, based on the first distance, the second distance and the third preset value corresponding to the incoming material channel 212 where the silicon rod 500 is located, the rod length of the silicon rod 500 is determined.

[0074] The present application also provides a surface glue coating machine 300, which is the surface glue coating machine 300 of the above-mentioned fully automatic silicon rod bonding device, Figure 8 and Fig. 9The surface measuring glue coating machine 300 is used to measure the surface inclination information of the end face of the silicon rod 500, obtain the position information of the crystal line 510 on the side of the silicon rod 500, and perform the glue coating operation on the end face of the silicon rod 500. The surface measuring glue coating machine 300 includes a surface measuring component 310, and the surface measuring component 310 includes a surface measuring frame 311 of a frame structure and a surface measuring portion 312. The surface measuring portion 312 is provided with a plurality of distance sensors 3123, and the end face inclination of the silicon rod 500 is calculated by the distance measurement results of the plurality of distance sensors 3123; wherein, the surface measuring portion 312 is provided with two, and the two surface measuring portions 312 are arranged on opposite sides of the surface measuring frame 311, and the action directions of the distance sensors (3123) in the two surface measuring portions 312 are arranged oppositely to form a surface measuring space 313.

[0075] In one embodiment, the surface measuring and gluing machine 300 includes, in addition to the surface measuring component 310, a wafer alignment component 320 and a gluing component 330. The surface measuring component 310 and the wafer alignment component 320 are independently arranged, and preferably, the surface measuring component 310 and the wafer alignment component 320 are located under a movement path of the central robot 100, so that the silicon rod 500 can be transported to the wafer alignment component 320 after surface measuring; and the gluing component 330 is located above the wafer alignment component 320, so as to facilitate the gluing operation on the silicon rod 500 located in the wafer alignment component 320.

[0076] Surface measuring component 310, reference Fig.10 and Fig.11 , used for multi-point distance measurement of the end face of the silicon rod 500. The measuring surface assembly 310 is located between the central robot 100 and the wafer alignment assembly 320, and the measuring surface space 313 is open relative to both sides of the central robot 100 and the wafer alignment assembly 320, so that the central robot 100 can carry the silicon rod 500 through the measuring surface assembly 310 for measuring the surface and then go to the wafer alignment assembly 320, thereby optimizing the movement path of the central robot 100 carrying the silicon rod 500 between the measuring surface assembly 310 and the wafer alignment assembly 320.

[0077] The measuring surface assembly 310 comprises a measuring surface frame 311 and a measuring surface portion 312, wherein a plurality of distance sensors 3123 are arranged in the measuring surface portion 312, and the end face inclination of the silicon rod 500 is calculated through the distance measurement results of the plurality of distance sensors 3123; wherein two measuring surface portions (312) are arranged, and the two measuring surface portions (312) are arranged on opposite sides of the measuring surface frame (311), and the action directions of the distance sensors (3123) in the two measuring surface portions (312) are arranged relative to each other to form a measuring surface space (313).

[0078] Specifically, in one embodiment, the surface measuring component 310 includes a surface measuring frame 311 and a surface measuring portion 312. The surface measuring frame 311 is hollow and the front and rear sides or the left and right sides of the surface measuring frame 311 are preferably open to construct a motion path of the central manipulator 100 in the surface measuring space 313. The surface measuring portion 312 includes a plurality of distance sensors 3123. Two surface measuring portions 312 are provided. The two surface measuring portions 312 are arranged on the upper side and the lower side of the surface measuring frame 311, and the action directions of the distance sensors 3123 in the two surface measuring portions 312 are arranged oppositely to form a surface measuring space 313 with a through form in the front and rear directions. After the silicon rod 500 enters the surface measuring space 313, the two end faces of the silicon rod 500 correspond to the two oppositely arranged surface measuring portions 312 respectively. The surface measuring portion 312 obtains the surface inclination information of the silicon rod 500 through the distance measurement results of the plurality of distance sensors 3123 thereon.

[0079] It can be understood that the plurality of distance sensors 3123 on the measuring portion 312 are divided into two groups, the distance sensors 3123 in the first group are centrally arranged, and the distance sensors 3123 in the second group are arranged around the periphery of the distance sensors 3123 in the first group. Fig.10 , exemplarily, the number of the distance sensor 3123 in the first group is one; the number of the distance sensor 3123 in the second group is four, and the four distance sensors 3123 are arranged at equal angles. Fig.11 The two measuring parts 312 are divided into a first measuring part 312a and a second measuring part 312b, and the distance sensors 3123 on the first measuring part 312a and the distance sensors 3123 on the second measuring part 312b are respectively arranged one by one. Specifically, in one embodiment, the first measuring part 312a and the second measuring part 312b are arranged on the upper and lower sides of the measuring frame 311 in the vertical direction, so that the silicon rod 500 passes through the measuring space 313 in an upright state.

[0080] It should also be noted that the measuring portion 312 also includes a measuring surface base 3121 and a measuring surface bracket 3122. The measuring surface base 3121 is used to connect to the measuring surface frame 311. A plurality of measuring surface brackets 3122 are arranged on the measuring surface base 3121. Each measuring surface bracket 3122 is used to connect and fix one or more distance sensors 3123. The measuring surface bracket 3122 is used to allow adjustment space for the position of the distance sensor 3123 relative to the measuring surface base 3121. The direction of the distance sensor 3123 toward the silicon rod 500 can be controlled based on the measuring surface bracket 3122.

[0081] For the crystal line assembly 320, refer to Fig. 9, used to accommodate the silicon rod 500 and rotate with the silicon rod 500 within the recognition range of the second visual part 323. The wafer alignment assembly 320 is arranged on one side of the measuring surface assembly 310, and the wafer alignment assembly 320 is located on the extension section of the path where the central robot 100 moves toward the measuring surface assembly 310, and the wafer alignment assembly 320 or the measuring surface assembly 310 has a space that allows the central robot 100 to pass through while holding the silicon rod 500, so that the central robot 100 places the silicon rod 500 on the other assembly mentioned above after passing through the wafer alignment assembly 320 or the measuring surface assembly 310. Among them, regarding the setting position of the wafer alignment assembly 320, it is preferred that the wafer alignment assembly 320 is located on the extension section of the path where the central robot 100 moves linearly toward the measuring surface assembly 310. Specifically, the crystal alignment assembly 320 includes a crystal alignment base 321, a crystal alignment rotating seat 322 and a second visual portion 323. The crystal alignment rotating seat 322 and the second visual portion 323 are both arranged on the crystal alignment base 321, and the second visual portion 323 faces the silicon rod accommodating area of ​​the crystal alignment rotating seat 322, so as to identify the crystal wire 510 thereon when the silicon rod 500 rotates on the crystal alignment rotating seat 322.

[0082] Glue coating assembly 330, reference Fig. 9 , with freedom of movement, for applying glue to the end surface of the silicon rod 500 to form a glue layer 600. The glue application assembly 330 is arranged above the wafer assembly 320 to apply glue to the end surface of the silicon rod 500 on the wafer assembly 320. In one embodiment, the glue application assembly 330 has three-axis freedom, so as to flexibly move to apply glue to the end surface of the silicon rod 500 located below.

[0083] The present application also provides a rod assembly machine 400, which is the rod assembly machine 400 in the above-mentioned fully automatic silicon rod bonding device. Fig.12 and Fig.15 The rod assembly machine 400 is used to clamp two silicon rods 500 and control the adjacent end faces of the two to fit together.

[0084] The rod assembly machine 400 includes: a rod assembly frame 410; a lower clamping claw 430, which is arranged below the rod assembly frame 410 and is used to clamp the first silicon rod 500; an upper clamping claw 440, which is arranged above the rod assembly frame 410 and is used to clamp the second silicon rod 500; and a rotating assembly 420, which is arranged on the rod assembly frame 410; the rotating assembly 420 includes: a rotating source 421; a rotating base plate 423, a pad 423 and The rotating source 421 is connected by transmission, and the rotating substrate 423 is connected to the lower claw 430 or one of the lower claws 440, so that the lower claw 430 and the lower claw 430 can rotate relative to each other; wherein the lower claw 430, the upper claw 440 and the rotating assembly 420 are located together on a vertical axis, and the lower claw 430 and / or the upper claw 440 have the freedom to move along the axis, so that the first silicon rod 500 on the lower claw 430 and the second silicon rod 500 on the upper claw 440 are spliced ​​together.

[0085] In one embodiment, the rod assembly machine 400 includes a rod assembly frame 410, a rotating assembly 420, a lower clamping claw 430 for clamping the first silicon rod 500, and an upper clamping claw 440 for clamping the second silicon rod 500; wherein the rotating assembly 420 is located below the lower clamping claw 430, and the lower clamping claw 430 is indirectly configured below the rod assembly frame 410 by being fixed to the rotating assembly 420, and the lower clamping claw 430 has the ability to rotate through the rotating assembly 420; the upper clamping claw 440 is configured on the rod assembly frame 410; the lower clamping jaw 430 and / or the upper clamping jaw 440 have the freedom to move along the axis, and the upper clamping jaw 440, the lower clamping jaw 430 and the rotating assembly 420 are jointly located on a vertical axis; to ensure that after the lower clamping jaw 430 rotates the first silicon rod 500, the position of the crystal line 510 of the first silicon rod 500 can correspond to the position of the crystal line 510 of the second silicon rod 500, so as to facilitate the subsequent first silicon rod 500 and the second silicon rod 500 to be relatively close to each other for splicing together, thereby ensuring the quality of the spliced ​​rods.

[0086] Stick frame 410, reference Fig.12 , used as a connection basis for other components. The splicing rod frame 410 has a first connection surface and a second connection surface, the first connection surface is a horizontal surface, and the first connection surface is used to connect the splicing frame and the rotating component 420; the second connection surface is a vertical surface, and the second connection surface is located above the side of the first connection surface; the second connection surface is used to connect the splicing frame and the upper claw 440. Exemplarily, the splicing rod frame 410 is an L-shaped structure, the horizontal surface in the L-shaped structure is used to connect the rotating component 420, and the vertical surface in the L-shaped structure is used to connect the upper claw 440.

[0087] Rotating assembly 420, reference Fig.12 and Fig.13, which is used to drive the lower clamping claw 430 to rotate, so as to change the position of the crystal line 510 of the first silicon rod 500 relative to the second silicon rod 500. The rotating assembly 420 also includes: a transmission part 422, which connects the rotating substrate 423 and the rotating source 421, and rotates the rotating substrate 423 through the transmission part 422. In addition, in order to protect and avoid damage to the silicon rods and collect waste oil, the rotating assembly 420 also includes: a pad 424, which is arranged on the rotating substrate 423, and the pad corresponds to the lower clamping claw 430 for clamping the silicon rod 500 below the clamping area; an oil receiving pan 425, which is sleeved on the periphery of the pad 424, and the oil receiving pan 425 has a flange to form an oil receiving space.

[0088] Specifically, in one embodiment, the rotating assembly 420 is arranged below the rod skeleton 410, and the rotating assembly 420 includes a rotating source 421, a transmission part 422, a rotating base plate 423 and a pad 424. The transmission part 422 is respectively connected to the rotating source 421 and the rotating base plate 423, and the rotating base plate 423 is rotated by the rotating source 421. The rotating base plate 423 is respectively connected to the lower clamping claw 430 and the pad 424 that prevents the silicon rod 500 from being damaged after falling, so that the first silicon rod 500 can rotate relative to the upper clamping claw 440 when clamped by the lower clamping claw 430. It should be noted that in the process of the lower clamping claw 430 clamping the first silicon rod 500 to rotate, there is no contact between the lower end surface of the first silicon rod 500 and the pad 424. The function of the pad 424 is that if the clamping of the lower clamping claw 430 fails, the pad 424 can support the falling silicon rod 500 to avoid damage to the silicon rod 500. It is understandable that an oil receiving pan 425 may be provided above the rotating base plate 423 and below the pad 424 to receive impurities and dirt generated by the clamping parts of the upper clamping claw 440 and the lower clamping claw 430 and the silicon rod 500. Specifically, the oil receiving pan 425 is sleeved on the periphery of the pad 424, and the oil receiving pan 425 has a flange to form an oil receiving space.

[0089] Transmission 422, reference Fig.12, used to drive the silicon rod 500 to rotate. In one embodiment, the transmission part 422 is a set of gear sets, and the rotation accuracy of the rotating substrate 423 is controlled by the transmission part 422. Exemplarily, the transmission part 422 is a set of meshing gear set structure, and the transmission part 422 includes a first gear 4221, a second gear 4222 and a slewing support 4223. The first gear 4221 is an internal gear, and the first gear 4221 is connected to the rotation source 421; the second gear 4222 is an external gear connected to the rotating substrate 423, and the second gear 4222 is limited in position based on the slewing support 4223 arranged on its periphery. The second gear 4222 is sleeved outside the first gear 4221, and the second gear 4222 is meshed with the first gear 4221. The second gear 4222 is driven by the rotation of the first gear 4221 to rotate the rotating substrate 423. The deceleration design of the transmission part 422 is conducive to increasing the torque and meeting the precise rotation of the heavy silicon rod 500, so that the alignment operation of the crystal wire 510 of the first silicon rod 500 and the second silicon rod 500 is convenient, and the situation that the crystal wire 510 of the second silicon rod 500 cannot be aligned due to rotation error after the first silicon rod 500 rotates is avoided.

[0090] The lower jaw 430 and the upper jaw 440, refer to Fig.12 The upper clamping claw 440 and the lower clamping claw 430 have basically the same structure, both of which include two claw bodies and an actuator, and the actuator connects the two claw bodies in a pair, and the two claw bodies are synchronized by the actuator. The two claw bodies are symmetrically arranged on both sides with the vertical axis where the lower clamping claw 430, the upper clamping claw 440 and the pad 424 are located as the center line, and the inner side of the claw body is provided with a pad, and the pad is used to make the claw body evenly apply force when contacting the silicon rod 500.

[0091] In one embodiment, the lower clamping jaw 430 has the freedom to move along the axis relative to the rotating base plate 423, so that the lower clamping jaw 430 can adjust the distance between the short silicon rod and the pad 424, and also facilitate the lower clamping jaw to clamp the middle part of the short silicon rod.

[0092] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0093] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A fully automatic silicon rod bonding method, characterized in that: include: Obtaining rod length information of the silicon rod (500) and obtaining surface inclination information of the silicon rod (500); Based on the rod length information and the face tilt information, determining a first silicon rod (500) and a second silicon rod (500) suitable for rod assembly; Acquiring position information of the crystal lines (510) on the first silicon rod (500) and the second silicon rod (500) for the first time; Based on the rod length information of the two silicon rods (500), a glue coating operation is performed on the end surface to be spliced ​​of one of the silicon rods (500) that meets the rod length requirements; The two silicon rods (500) are respectively transferred to the upper clamping claw (440) and the lower clamping claw (430) of the rod assembly machine (400); After the two silicon rods (500) are placed in the upper clamping jaws (440) and the lower clamping jaws (430), the position information of the crystal wires (510) on the silicon rods (500) is obtained for a second time; Based on the crystal line (510) position information acquired for the second time, adjusting the crystal line (510) position of the silicon rod (500) on the upper clamping jaw (440) and / or adjusting the crystal line (510) position of the silicon rod (500) on the lower clamping jaw (430) so that the crystal lines (510) on the two silicon rods (500) are aligned; After the crystal lines (510) of the two silicon rods (500) are aligned, the adjacent end faces of the two silicon rods (500) are controlled to fit together by a rod assembly machine (400); Wherein, based on the crystal line (510) position information obtained for the first time, before the silicon rod (500) is transferred to the stick assembly machine (400), the position of the silicon rod (500) is adjusted so that the crystal line (510) of the silicon rod (500) located on the stick assembly machine (400) is within the detection range of the crystal line (510) position information obtained for the second time; or, after the silicon rod (500) is transferred to the stick assembly machine (400), based on the crystal line (510) position information obtained for the first time, the position of the silicon rod (500) is adjusted on the stick assembly machine (400) so that the crystal line (510) of the silicon rod (500) located on the stick assembly machine (400) is within the detection range of the crystal line (510) position information obtained for the second time.

2. A fully automatic silicon rod bonding method according to claim 1, characterized in that: The step of obtaining the rod length information of the silicon rod (500) comprises: Acquiring, by means of a distance determining device, a first distance from the distance determining device to a first end face of a silicon rod (500); Controlling the silicon rod (500) to rotate so that the second end surface of the silicon rod (500) faces the second distance meter (221); Acquiring, by means of the second distance meter (221), a second distance from the second distance meter (221) to a second end surface of the silicon rod (500); The rod length of the silicon rod (500) is determined based on the first distance, the second distance, and a third preset value corresponding to the incoming channel (212) where the silicon rod (500) is located.

3. A fully automatic silicon rod bonding method according to claim 2, characterized in that: The step of controlling the rotation of the silicon rod (500) comprises: Acquiring the grasping position of the central manipulator (100) based on the distance determination device, and adjusting the position of the central manipulator (100) grasping the silicon rod (500); After adjusting the position of the central robot (100) for grabbing the silicon rod (500), the central robot (100) is controlled to grab and rotate the silicon rod (500).

4. A fully automatic silicon rod bonding method according to claim 1, characterized in that: The step of obtaining the face tilt information of the silicon rod (500) comprises: The distance from the distance sensor (3123) to a plurality of measuring points on an end face of a silicon rod (500) is obtained by a distance sensor (3123), and the surface inclination information of the silicon rod (500) is determined based on the difference between the positions of the plurality of measuring points on the end face and the distances corresponding to the plurality of measuring points.

5. A fully automatic silicon rod bonding method according to claim 1, characterized in that: The step of obtaining the rod length information of the silicon rod (500) and the step of obtaining the surface slope information of the silicon rod (500) are completed in two steps; or, The steps of obtaining the rod length information of the silicon rod (500) and obtaining the surface slope information of the silicon rod (500) include: When executing the step of obtaining the surface inclination information of the silicon rod (500), the position of the silicon rod (500) is limited, and the rod length information is determined after the surface inclination information of the two end surfaces of the silicon rod (500) is measured simultaneously or successively.

6. A fully automatic silicon rod bonding method according to claim 5, characterized in that: The step of calculating the rod length information after simultaneously or successively measuring the surface inclination information of the two end surfaces of the silicon rod (500) comprises: The distance sensor (3123) measures the distances A1 and A2 from two specific positions at both ends of the silicon rod (500) to the two end surfaces of the silicon rod (500), respectively, and the spacing between the two specific positions of the distance sensor (3123) is A, and the rod length information L = A-A1-A2.

7. The fully automatic silicon rod bonding method according to claim 1, characterized in that: The first acquisition of the position information of the crystal wire (510) on the silicon rod (500) and the glue coating operation are performed sequentially at the same workstation, or the two are performed synchronously; Alternatively, the glue coating operation is performed after the silicon rods (500) are transported to the rod assembly machine (400).

8. The fully automatic silicon rod bonding method according to claim 1, characterized in that: The step of obtaining the position information of the crystal wire (510) on the silicon rod (500) for the second time after the two silicon rods (500) are placed in the upper clamping claw (440) and the lower clamping claw (430) comprises: After the central robot (100) transports the two silicon rods (500) to the rod assembly machine (400), the central robot (100) adjusts its posture and / or position so that the two silicon rods (500) are within the recognition range of the first visual unit (120) configured for the central robot (100), and obtains the position information of the crystal line (510) on the silicon rod (500) through the first visual unit (120).

9. A fully automatic silicon rod bonding device, characterized in that: include: A central robot (100), wherein the central robot (100) has a gripping and releasing range for gripping the silicon rod (500); A silicon rod feeding machine (200), at least a portion of the silicon rod feeding machine (200) is arranged within the grabbing and placing range; A surface glue coating machine (300), wherein the surface glue coating machine (300) is arranged in the grabbing range, and the surface glue coating machine (300) comprises: A surface measuring component (310); A crystal alignment assembly (320), the crystal alignment assembly (320) being arranged on one side of the measuring surface assembly (310), and the crystal alignment assembly (320) or the measuring surface assembly (310) having a space allowing the central robot (100) to pass through the silicon rod (500) held by the central robot (100), so that the central robot (100) can place the silicon rod (500) on the other assembly mentioned above after passing through the crystal alignment assembly (320) or the measuring surface assembly (310); as well as A glue coating component (330), the glue coating component (330) being arranged above the crystal pairing component (320) to perform a glue coating operation on the end surface of the silicon rod (500) on the crystal pairing component (320); A stick-assembling machine (400), wherein the stick-assembling machine (400) is arranged within the grabbing range.

10. The fully automatic silicon rod bonding device according to claim 9, characterized in that: The measuring surface component (310) comprises: Surface measurement frame (311); A measuring portion (312), wherein a plurality of distance sensors (3123) are arranged in the measuring portion (312), and the end face inclination of the silicon rod (500) is calculated through the distance measurement results of the plurality of distance sensors (3123); wherein two measuring portions (312) are arranged, and the two measuring portions (312) are arranged on opposite sides of the measuring surface frame (311), and the action directions of the distance sensors (3123) in the two measuring portions (312) are arranged relative to each other to form a measuring surface space (313).

11. The fully automatic silicon rod bonding device according to claim 10, characterized in that: The measuring surface assembly (310) is located between the central robot (100) and the wafer alignment assembly (320), and the measuring surface space (313) is open to both sides of the central robot (100) and the wafer alignment assembly (320).

12. The fully automatic silicon rod bonding device according to claim 9, characterized in that: The silicon rod feeding machine (200) comprises: The incoming material section (210) comprises: An incoming material channel (212), wherein the incoming material channel (212) carries a silicon rod (500); a distance determining device, the distance determining device being located at one end of the incoming material channel (212), and the distance determining device corresponding to the incoming material channel (212), and the distance determining device being used to measure the distance from the distance determining device to the first end face of the silicon rod (500); A distance measuring part (220) is provided on one side of the incoming material part (210), and a second distance measuring device (221) is provided on the distance measuring part (220); the second distance measuring device (221) faces and acts on a plurality of the incoming material parts (210), and the silicon rods (500) on the incoming material part (210) are detected by the second distance measuring device (221).

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