Medical reagent bin refrigerating system
By designing the combination of the cold end of the semiconductor refrigeration part, the thermally conductive part and the protective box in the medical refrigeration bin refrigeration system, the problem of dust adhesion on the hot end of the semiconductor refrigeration sheet is solved, and efficient refrigeration and energy consumption are achieved.
Patent Information
- Application Number
- CN202510445347.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-10
- Publication Date
- 2025-05-06
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Due to the lack of effective protective measures on the hot end of existing semiconductor refrigeration sheets, dust is prone to adhere to, resulting in reduced refrigeration efficiency and increased energy consumption.
A medical reagent bin refrigeration system is designed. By setting the cold end of the semiconductor refrigeration member on the outer wall of the box, and a heat conduction member and a protective box are provided at its hot end to form a sealing chamber, and using air-cooling components to transfer heat outward through the cooling channel to avoid dust adhesion.
It effectively avoids dust adhesion, maintains the efficient working state of semiconductor refrigeration parts, reduces energy consumption, and ensures the normal operation of the refrigeration system.
Smart Images
Figure CN119934750A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of medical equipment, and in particular to a refrigeration system for a medical reagent warehouse. Background Art
[0002] During storage and use, medical reagents need to maintain stability and activity within a certain temperature range. If the temperature is too high, the reagents may deteriorate, affecting experimental results and medical effects. Therefore, medical reagent warehouses need to have a more reliable refrigeration system. Semiconductor refrigeration technology, as an emerging refrigeration method, does not require the use of refrigerants and does not have the problem of refrigerant leakage. It also has the advantages of high quietness, fast response speed, and easy control, and is widely used in the medical industry.
[0003] The core component of semiconductor refrigeration is the semiconductor cooling plate. Currently, when the semiconductor cooling plate is in use, its cold end is in contact with the component to be cooled, and the hot end is the heat dissipation surface, which is used to transfer the heat absorbed from the component to be cooled to the outside. When working, the hot end of the semiconductor cooling plate is usually exposed to the external environment. Over time, a layer of dust will be attached to its surface. On the one hand, the adhesion of dust hinders the dissipation of heat. On the other hand, in order to maintain the cooling effect, the cooling plate needs to consume more electrical energy to overcome the additional thermal resistance caused by the dust, resulting in increased energy consumption. Summary of the invention
[0004] The object of the present invention is to provide a medical reagent warehouse refrigeration system for solving the problem in the prior art that the hot end of the semiconductor refrigeration plate lacks effective protection measures, which makes it easy for dust to accumulate and leads to reduced refrigeration efficiency and increased energy consumption.
[0005] In order to achieve the above-mentioned purpose, the embodiment of the present application provides a medical reagent warehouse refrigeration system, comprising: A box body, wherein the box body has a cooling cavity for storing a coolant; A cooling pipeline, both ends of which are connected to the cooling cavity respectively, a pump assembly is connected between the cooling cavity and the cooling pipeline, and the pump assembly allows the coolant to circulate between the cooling pipeline and the cooling cavity; A plurality of semiconductor refrigeration components are provided, and the plurality of semiconductor refrigeration components are evenly arranged around the outer peripheral wall of the box body, and the cold end of the semiconductor refrigeration component is closely connected to the outer wall of the box body; The heat conducting member is arranged to match the number of the semiconductor refrigeration members, and the heat conducting member is attached to the hot end of the semiconductor refrigeration member; A protection box connected to the outer peripheral wall of the box body, wherein a sealed cavity is formed between the protection box and the outer peripheral wall of the box body, and the hot end of the semiconductor refrigeration element and the heat conducting element are both accommodated in the sealed cavity; and A cooling channel is arranged in the heat conducting member, one end of the cooling channel is connected to the outside, and the other end of the cooling channel is connected to an air cooling component.
[0006] In some embodiments of the present application, the medical reagent warehouse refrigeration system further includes a shell connected to the outer peripheral wall of the box body, the shell is arranged around the outer periphery of the box body, and an isolation cavity is formed between the shell and the outer peripheral wall of the box body; The protection box is connected to the outer peripheral wall of the shell, and the sealing cavity is formed between the protection box and the outer peripheral wall of the shell; The shell has a through hole matching the semiconductor refrigeration element, and the semiconductor refrigeration element is inserted into the through hole so that the cold end of the semiconductor refrigeration element is placed in the isolation cavity and abuts against the outer wall of the box body, and the hot end of the semiconductor refrigeration element is placed in the sealed cavity.
[0007] In some embodiments of the present application, the cooling channel passes through the heat conducting member from top to bottom, and first openings are respectively provided at positions corresponding to the cooling channel on the upper and lower walls of the protection box; One end of the cooling channel is in communication with the outside through one of the first openings, and the other end of the cooling channel is in communication with the air cooling component through another of the first openings.
[0008] In some embodiments of the present application, there are multiple cooling channels, and the multiple cooling channels are arranged at intervals along the length direction of the heat conductor, the upper ends of the multiple cooling channels are connected to one of the first openings, and the lower ends of the multiple cooling channels are connected to another first opening.
[0009] In some embodiments of the present application, the semiconductor refrigeration element has a first direction perpendicular to the plane where the cold end of the semiconductor refrigeration element is located, and the heat conductive element is moved along the first direction to be connected to the sealed cavity, and the upper and lower ends of the heat conductive element are in contact with the upper and lower walls of the sealed cavity; The heat conducting member has a first working position abutting against the cold end of the semiconductor refrigeration member and a second working position away from the cold end of the semiconductor refrigeration member on the moving track of the first direction; The heat conducting member moves from the first working position to the second working position, so that a first air passage is formed between the heat conducting member and the cold end of the semiconductor refrigeration member. One end of the first air passage is connected to the outside through one of the first openings, and the other end is connected to the air cooling component through another first opening.
[0010] In some embodiments of the present application, the heat conducting member has a groove disposed in a staggered manner with respect to the cooling channel, and the groove penetrates through the side wall of the heat conducting member toward the semiconductor refrigeration member; A first heat-conducting part is provided in the groove, the first heat-conducting part is connected to the groove by movement along the first direction, and the outer peripheral wall of the first heat-conducting part is in contact with the inner wall of the groove; an elastic rod is provided in the groove that can be extended and retracted along the first direction, one end of the elastic rod is connected to the first heat-conducting part, and the other end of the elastic rod is connected to the heat-conducting member; The heat conductive part moves from the first working position to the second working position, and the elastic rod drives the first heat conductive part to extend out of the groove and be placed in the first air passage; the heat conductive part moves from the second working position to the first working position, and the hot end of the semiconductor refrigeration part pushes the first heat conductive part and compresses the elastic rod, so that the hot end of the semiconductor refrigeration part is accommodated in the groove.
[0011] In some embodiments of the present application, a second heat conducting portion is connected to a side of the heat conducting member facing away from the semiconductor refrigeration member, the second heat conducting portion is tapered, and the second heat conducting portion has a small diameter end connected to the heat conducting member and a large diameter end away from the heat conducting member; Along the first direction, the side wall of the protection box and the corresponding area of the large diameter end have a second opening connected to the outside and the sealed cavity, and the second opening is matched with the large diameter end; When the heat conducting member is in the first working position, the large diameter end seals the second opening, and when the heat conducting member is in the second working position, the second opening is opened.
[0012] In some embodiments of the present application, the heat conductive member is in the second working position, and the side of the heat conductive member facing the second opening is spaced apart from the inner wall of the sealed cavity away from the semiconductor refrigeration member, so that the gap between the heat conductive member and the inner wall of the sealed cavity forms a second air passage, and the second air passage is connected to the first air passage.
[0013] In some embodiments of the present application, a driving member is provided in the sealed cavity, and the driving member is used to drive the heat conductive member to move along the first direction; a temperature sensor is provided in the sealed cavity, and the temperature sensor and the driving member are both electrically connected to a control system; The temperature sensor is used to collect the temperature parameter of the hot end of the semiconductor refrigeration component. When the temperature parameter is higher than a predetermined value, the control system controls the driving component to drive the heat conductive component to move from the first working position to the second working position; when the temperature parameter is lower than a predetermined value, the control system controls the driving component to drive the heat conductive component to move from the second working position to the first working position.
[0014] In some embodiments of the present application, the air cooling assembly includes air ducts, and the number of the air ducts matches the number of the heat conducting members; One end of the air duct is connected to the first opening, and the other ends of all the air ducts are commonly connected to a collecting chamber. The bottom of the collecting chamber has a third opening connected to the outside, and a cooling fan is arranged in the third opening.
[0015] Compared with the prior art, a medical reagent warehouse refrigeration system according to an embodiment of the present invention has the following beneficial effects: in this scheme, the cold end of the semiconductor refrigeration component is bonded and connected to the outer wall of the box body, so as to realize cooling of the coolant in the cooling chamber; a protective box is provided so as to form a sealed chamber with the outer peripheral wall of the box body; the semiconductor refrigeration component is accommodated in the sealed chamber and a heat-conducting component bonded to the hot end of the semiconductor refrigeration component is provided in the sealed chamber; when the semiconductor refrigeration component is working, the heat generated at the hot end is quickly transferred to the heat-conducting component; a cooling channel is provided in the heat-conducting component and the cooling channel is connected to an air-cooling component; an airflow with a lower outside temperature is transported into the cooling channel through the air-cooling component, so as to realize the transfer of the heat transferred to the heat-conducting component to the outside, so that the semiconductor refrigeration component is in a relatively sealed environment, effectively avoiding the dust in the outside environment from adhering to its surface (so that the semiconductor refrigeration component is maintained in a high-efficiency working state); at the same time, the heat generated at the hot end of the semiconductor refrigeration component is continuously transferred to the outside through the cooperation of the heat-conducting component, the cooling channel and the air-cooling component, so as to ensure the normal operation of the semiconductor refrigeration component. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the overall structure of a medical reagent warehouse refrigeration system of the present invention; Figure 2 It is a schematic diagram of the overall structure of a medical reagent warehouse refrigeration system of the present invention from another perspective; Figure 3 This is a schematic cross-sectional view of the overall structure of a medical reagent warehouse refrigeration system of the present invention; Figure 4 For the present invention Figure 3 The enlarged schematic diagram of the structure section at A in the middle; Figure 5 This is a schematic diagram of the heat conducting element of the present invention being in the first working position; Figure 6 It is a schematic diagram of the separation of the heat conducting member and the first heat conducting part of the present invention; Figure 7 It is a schematic diagram of the heat conducting member and the first heat conducting part of the present invention separated from another viewing angle; Figure 8 It is a schematic diagram of the heat conducting member of the present invention being in the second working position; Fig. 9 This is a schematic diagram of the second heat conducting portion of the present invention extending outward; Fig.10 It is a top view schematic diagram of the heat conducting member of the present invention in the second working position; Fig.11It is a top view schematic diagram of the heat conducting member of the present invention in the first working position; Fig.12 For the present invention Fig.10 Enlarged schematic diagram of the structure at point B in the middle.
[0017] In the figure, 1, box body; 11, cooling chamber; 12, liquid inlet pipe; 13, liquid outlet pipe; 2. Pump liquid assembly; 3. Semiconductor refrigeration component; 31. Cold end; 32. Hot end; 4. heat conducting member; 41. cooling channel; 42. groove; 43. first heat conducting portion; 44. elastic rod; 45. second heat conducting portion; 451. small diameter end; 452. large diameter end; 46. elastic heat conducting portion; 5. Protective box; 51. Sealed cavity; 52. First opening; 53. First air passage; 54. Second opening; 55. Second air passage; 6. air cooling assembly; 61. air guide tube; 62. collecting chamber; 621. third opening; 63. cooling fan; 7. driving member; 8. shell; 81. through hole; 82. isolation cavity; 9. third heat conducting part; X, first direction; Y, second direction. DETAILED DESCRIPTION
[0018] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0019] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a hindrance to the present invention. It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.
[0020] like Figure 1-Figure 12 As shown, the embodiment of the present application provides a medical reagent warehouse refrigeration system, including a box body 1, a cooling pipeline, a semiconductor refrigeration component 3, a heat conducting component 4 and a protective box 5, as shown in FIG. Figure 3As shown, the box body 1 has a cooling chamber 11 for storing coolant; a pump liquid assembly 2 is connected between the cooling chamber 11 and the cooling pipeline, and the pump liquid assembly 2 allows the coolant to circulate between the cooling pipeline and the cooling chamber 11. An inlet pipe 12 and an outlet pipe 13 are provided at the upper end of the box body 1, and a pump liquid assembly 2 (which is a pump body) is provided on the inlet pipe 12. The inlet pipe 12 and the outlet pipe 13 are respectively connected to the cooling pipeline, so that the cooling pipeline and the cooling chamber 11 form a circulation channel, and the cooling pipeline is arranged in a medical reagent warehouse (no longer shown in the figure). The cooling pipeline is made of a material with high thermal conductivity (such as copper, aluminum, etc.). In specific implementation, it can be arranged accordingly according to the structure of the medical reagent warehouse. The pump liquid assembly 2 pumps the coolant from the outlet pipe 13 into the cooling pipeline, flows through the cooling pipeline and finally flows back to the cooling chamber 11 through the inlet pipe 12. The coolant flows in the cooling pipeline, thereby achieving the effect of cooling the medical reagent warehouse.
[0021] like Fig.11 As shown, the semiconductor refrigeration element 3 is provided with a plurality of semiconductor refrigeration elements 3, and the plurality of semiconductor refrigeration elements 3 are evenly arranged around the outer peripheral wall of the box body 1, and the cold end 31 of the semiconductor refrigeration element 3 is connected to the outer wall of the box body 1. In this scheme, the box body 1 is described as a square (it can also be set to a circular or other shape), and at least one semiconductor refrigeration element 3 is provided on each side wall of the box body 1. In order to improve the uniformity of the cooling effect of the semiconductor refrigeration element 3, a third heat conducting portion 9 (a ceramic heat conducting sheet or other heat conducting material) is provided between the cold end 31 of the semiconductor refrigeration element 3 and the outer wall of the box body 1. ), the third heat conducting part 9 is fixed to the outer wall of the box body 1 by gluing or other installation methods, the cold end 31 of the semiconductor refrigeration component 3 is fixedly connected to the third heat conducting part 9 by gluing or other methods, and the size of the third heat conducting part 9 is larger than the size of the cold end 31 of the semiconductor refrigeration component 3, so that the coldness of the cold end 31 of the semiconductor refrigeration component 3 can be diffused to a wider range through the third heat conducting part 9, so as to achieve more uniform cooling of the coolant in the box body 1, and at the same time, the third heat conducting part 9 (ceramic heat conducting sheet) has multi-directional heat dissipation, which can conduct the coldness to the coolant in the cooling cavity 11 more quickly.
[0022] The number of heat-conducting parts 4 (ceramic heat-conducting sheets or other heat-conducting materials) and semiconductor cooling parts 3 is matched, and the heat-conducting parts 4 are in contact with the hot end 32 of the semiconductor cooling parts 3; the protection box 5 is connected to the outer peripheral wall of the box body 1, and the protection box 5 is arranged around the outer periphery of the box body 1, so that a sealed cavity 51 is formed between the protection box 5 and the outer peripheral wall of the box body 1, and the semiconductor cooling parts 3 and the heat-conducting parts 4 are both accommodated in the sealed cavity 51, which is used to provide a relatively sealed environment for the semiconductor cooling parts 3; Figure 6 , Figure 7As shown, a cooling channel 41 is provided in the heat conductive member 4. When the heat conductive member 4 is accommodated in the sealed cavity 51, one end of the cooling channel 41 is connected to the external environment, and the other end is connected to the air cooling component 6. The air cooling component 6 transports air with a lower temperature in the external environment into the cooling channel 41. Since the heat conductive member 4 has a high thermal conductivity, the heat conductive member 4 can quickly transfer the heat generated by the hot end 32 of the semiconductor refrigeration member 3 to the cold air flow flowing through the cooling channel 41, and transfer the heat outward with the flow of the cold air flow, thereby achieving the effect of cooling the hot end 32 of the semiconductor refrigeration member 3.
[0023] During the specific implementation of the embodiment of the present application, the coolant in the cooling box circulates between the cooling pipeline and the cooling chamber 11 under the action of the pump liquid component 2. When the coolant flows back from the cooling pipeline to the cooling chamber 11, the coolant absorbs the heat in the medical reagent chamber, causing the temperature of the coolant to rise. At this time, the cold ends 31 of the multiple semiconductor refrigeration components 3 that are attached to the outer wall of the box body 1 continuously absorb the heat in the coolant to cool the coolant. The heat absorbed by the cold ends 31 of the semiconductor refrigeration components 3 is transferred to the hot ends 32 of the semiconductor refrigeration components 3, and is quickly conducted to the cold air flow flowing through the cooling channel 41 through the heat conducting component 4, thereby achieving the effect of cooling and dissipating the hot ends 32 of the semiconductor refrigeration components 3. The refrigeration component 3 is in a sealed cavity 51, so that it will not be contaminated by dust in the external environment when working, ensuring the cleanliness of the surface of the semiconductor refrigeration component 3, helping to maintain it in a high-efficiency working state, and under the same cooling temperature, it can effectively reduce its energy consumption. At the same time, a heat conductive component 4 is provided in the sealed cavity 51 and a cooling channel 41 is provided in the heat conductive component 4. Through the cooperation of the cooling channel 41 and the air cooling component 6, the heat absorbed by the heat conductive component 4 from the hot end 32 of the semiconductor refrigeration component 3 is quickly transferred to the external environment, ensuring the effective control of the heat of the hot end 32 of the semiconductor refrigeration component 3, so that the heat of the hot end 32 of the semiconductor refrigeration component 3 is transferred outward in time to avoid affecting the normal operation of the semiconductor refrigeration component 3.
[0024] In some embodiments of the present application, Figure 3 As shown, in order to further improve the heat preservation effect of the cooling chamber 11, the medical reagent warehouse refrigeration system in this solution also includes a shell 8 connected to the outer peripheral wall of the box body 1, and the shell 8 is arranged around the outer periphery of the box body 1, so that an isolation chamber 82 is enclosed between the shell 8 and the outer peripheral wall of the box body 1. Figure 4 , Figure 5As shown, a through hole 81 is provided on the shell 8, and the semiconductor refrigeration component 3 is penetrated in the through hole 81 (the outer wall of the semiconductor refrigeration component 3 is sealed and connected to the inner wall of the through hole 81), so that the cold end 31 of the semiconductor refrigeration component 3 is placed in the isolation cavity 82 and abuts on the third heat conducting part 9, so that the hot end 32 of the semiconductor refrigeration component 3 is placed in the sealed cavity 51 (for contacting with the heat conducting component 4 and transferring the heat generated by the hot end 32 of the semiconductor refrigeration component 3), and the outer periphery of the semiconductor refrigeration component 3 is fitted and connected to the through hole 81 (can be connected by gluing); in this embodiment, by adding an isolation cavity 82 between the cooling cavity 11 and the external environment, the thermal insulation effect of the cooling cavity 11 is effectively improved, because air is a poor conductor of heat, and the heat in the external environment is effectively reduced. Conducting into the cooling cavity 11 in the form of heat transfer is effectively reduced, and the loss of cooling liquid in the cooling cavity 11 is reduced as much as possible, which helps to reduce the power consumption of the equipment.
[0025] In some embodiments of the present application, Figure 5 As shown, Figure 5 The schematic diagram of the cross-sectional structure of the heat-conducting member 4 at the location where the cooling channel 41 is provided, the cooling channel 41 penetrates the heat-conducting member 4 up and down along the height direction of the heat-conducting member 4, and first openings 52 are respectively provided on the upper and lower walls of the protective box 5 at positions corresponding to the cooling channel 41, so that the upper end of the cooling channel 41 is connected to the outside through the first opening 52 located at the top, and the lower end of the cooling channel 41 is connected to the air-cooling component 6 through the first opening 52 located at the bottom. When the air-cooling component 6 is working, the cold air flow in the external environment is drawn into the cooling channel 41 through the first opening 52 located at the top, and is discharged to the outside through the first opening 52 located at the bottom. During the flow in the cooling channel 41, the heat transferred from the hot end 32 of the semiconductor refrigeration component 3 to the heat-conducting component 4 is absorbed (the heat is conducted from the heat-conducting component 4 to the cold air flow), and transferred outward with the movement of the air flow, thereby achieving the effect of cooling and dissipating the heat-conducting component 4; the air flow in the external environment moves in the channel formed by the first opening 52, the cooling channel 41, and the first opening 52. When dissipating the heat-conducting component 4, the air flow will not contact the semiconductor refrigeration component 3, thereby ensuring the cleanliness of the surface of the semiconductor refrigeration component 3 while satisfying the cooling and heat dissipation of the hot end 32 of the semiconductor refrigeration component 3.
[0026] In some embodiments of the present application, in order to improve the cooling effect of the heat conducting member 4, a plurality of cooling channels 41 may be provided, such as Figure 6 , Figure 7 As shown, a plurality of cooling channels 41 are arranged at intervals along the length direction of the heat conducting member 4 (eg Fig.11 As shown, the length of the heat conducting member 4 extends along the second direction Y); Figure 1As shown, the two first openings 52 provided on the upper and lower walls of the protective box 5 are both configured to be long strips, so that the upper ends of the plurality of cooling channels 41 are connected to the first openings 52 located above, and the lower ends of the plurality of cooling channels 41 are connected to the first openings 52 located below; when the air cooling component 6 is started, the cold air in the external environment flows through the first openings 52 and can flow through the plurality of cooling channels 41 arranged at intervals, thereby increasing the contact area between the inside of the heat conductor 4 and the cold air flow, and further improving the heat dissipation efficiency of the heat conductor 4.
[0027] In some embodiments of the present application, in order to improve the reliability and stability of the refrigeration system, it is necessary to ensure that the heat at the hot end 32 of the semiconductor refrigeration component 3 can be transferred in a timely and rapid manner. If the heat at the hot end 32 of the semiconductor refrigeration component 3 cannot be dissipated in time, it will cause heat accumulation at the hot end 32, thereby reducing the refrigeration efficiency of the cold end 31 of the semiconductor refrigeration component 3. At this time, cooling and dissipating the heat at the hot end 32 of the semiconductor refrigeration component 3 has become a primary factor; this situation generally occurs due to the failure of the sealing measures of the medical reagent warehouse, or the frequent opening of the medical reagent warehouse resulting in internal cold air leakage; at this time, the semiconductor refrigeration component 3 needs to work frequently. If the heat dissipation of the hot end 32 of the semiconductor refrigeration component 3 is not timely, the temperature of the hot end 32 of the semiconductor refrigeration component 3 will rise to a high level, resulting in a serious attenuation of the refrigeration efficiency of the semiconductor refrigeration component 3 at this time; at this time, the hot end 32 of the semiconductor refrigeration component 3 needs to be cooled. 2 to quickly dissipate heat, so as to reduce the temperature of the hot end 32 of the semiconductor refrigeration component 3 as much as possible in a relatively short time and restore it to a normal range; at this time, the hot end 32 of the semiconductor refrigeration component 3 is no longer indirectly dissipated (that is, the air cooling component 6 drives the cold air flow to move in the cooling channel 41, and dissipates heat from the heat-conducting component 4 to achieve cooling and cooling of the hot end 32 of the semiconductor refrigeration component 3), but the hot end 32 of the semiconductor refrigeration component 3 is directly dissipated (because at this time, it is the primary task to quickly reduce the temperature of the hot end 32 of the semiconductor refrigeration component 3 to a normal range. If the hot end 32 of the semiconductor refrigeration component 3 is at a high temperature for a long time, on the one hand, the refrigeration efficiency of the cold end 31 of the semiconductor refrigeration component 3 is reduced, and on the other hand, the semiconductor refrigeration component 3 is damaged. At this time, the temperature management of the hot end 32 of the semiconductor refrigeration component 3 is more important), as follows: like Figure 4 , Figure 5 , Fig.11 As shown, the semiconductor refrigeration element 3 has a first direction X perpendicular to the plane where the cold end 31 of the semiconductor refrigeration element 3 is located, and the first direction X is perpendicular to the second direction Y. The heat conducting element 4 is moved along the first direction X and connected to the sealed cavity 51. The upper and lower ends of the heat conducting element 4 are respectively attached to the upper and lower walls of the sealed cavity 51. The heat conducting element 4 has a first working position (such as Figure 4 , Figure 5), and a second working position away from the hot end 32 of the semiconductor refrigeration element 3 (as Figure 8 as shown); Figure 4 ( Figure 4 Schematic diagram of the cross-sectional structure where the heat conducting member 4 is not provided with the cooling channel 41), Figure 5 As shown, when the heat conducting member 4 is in the first working position, the upper end of the cooling channel 41 provided in the heat conducting member 4 corresponds to and is connected with the first opening 52 located above, and the lower end of the cooling channel 41 corresponds to and is connected with the first opening 52 located below. This working mode is used to cool down and dissipate the heat of the hot end 32 of the semiconductor refrigeration member 3 when the temperature of the hot end 32 of the semiconductor refrigeration member 3 is within a normal range.
[0028] like Figure 8 As shown, when the temperature of the hot end 32 of the semiconductor refrigeration element 3 is too high and exceeds the normal range, it is necessary to quickly dissipate the heat of the hot end 32 of the semiconductor refrigeration element 3 so that its temperature can be restored to the normal range in the shortest possible time (whether the dust in the external environment will pollute the semiconductor refrigeration element 3 is not the main consideration at this time). At this time, the heat conducting element 4 is controlled to move from the first working position to the second working position, that is, Figure 4 Move the position shown in Figure 8 As shown in the position, the cooling channel 41 provided in the heat-conducting member 4 no longer corresponds to the first opening 52, and the heat-conducting member 4 toward the side of the hot end 32 of the semiconductor refrigeration member 3 and the interval between the hot end 32 of the semiconductor refrigeration member 3 form a first air passage 53, and the upper and lower ends of the first air passage 53 are respectively connected to the two first openings 52. At this time, the air-cooling component 6 allows the cold air flow in the external environment to flow directly through the first air passage 53 through the first opening 52. When the cold air flow flows through the first air passage 53, it directly contacts the hot end 32 of the semiconductor refrigeration member 3 and performs heat exchange, so that the heat accumulated in the semiconductor hot end 32 is quickly transferred and dissipated to the outside world along with the cold air flow flowing through the first air passage 53, thereby improving the heat dissipation efficiency of the hot end 32 of the semiconductor refrigeration member 3; preferably, a filter screen can be provided in the two first openings 52 to filter dust and other debris in the cold air flow, and reduce the amount of dust entering the sealed cavity 51 as much as possible to reduce the pollution to the semiconductor refrigeration member 3.
[0029] When the temperature of the hot end 32 of the semiconductor refrigeration element 3 returns to a normal range, the heat-conducting element 4 moves from the second working position to the first working position again. At this time, the two first openings 52 are connected to the cooling channel 41 provided in the heat-conducting element 4 again, and the hot end 32 of the semiconductor refrigeration element 3 is indirectly cooled by the cooperation of the two first openings 52 and the cooling channel 41. At this time, the sealed cavity 51 is no longer connected to the external environment. In this embodiment, when the temperature of the hot end 32 of the semiconductor refrigeration element 3 is within a normal range, the hot end 32 of the semiconductor refrigeration element 3 is indirectly cooled by the sealed cavity 51. While meeting the refrigeration demand, dust in the external environment is prevented from invading the sealed cavity 51 and polluting the surface of the semiconductor refrigeration element 3. When the temperature of the hot end 32 of the semiconductor refrigeration element 3 is too high, the hot end 32 of the semiconductor refrigeration element 3 is directly cooled by the sealed cavity 51. The heat dissipation method is used to quickly transfer the heat of the hot end 32 of the semiconductor refrigeration component 3 so as to restore the temperature of the hot end 32 of the semiconductor refrigeration component 3 to a normal range in the shortest possible time. On the one hand, it is used to improve the refrigeration efficiency of the semiconductor refrigeration component 3, and on the other hand, it is used to avoid damage to the hot end 32 of the semiconductor refrigeration component 3 due to overheating. This solution minimizes the pollution of the semiconductor refrigeration component 3 by dust in the external environment while ensuring that the semiconductor refrigeration component 3 performs high-efficiency refrigeration and the semiconductor refrigeration component 3 can be used safely (due to the low frequency of the above situation, the temperature of the hot end 32 of the semiconductor refrigeration component 3 is within the normal temperature range in most of the time period, and the method of directly dissipating the heat of the hot end 32 of the semiconductor refrigeration component 3 is adopted, which is only used when the temperature of the hot end 32 of the semiconductor refrigeration component 3 is too high).
[0030] like Fig.10 , Fig.11 As shown, in order to further improve the uniformity of heat conduction between the various heat-conducting parts 4, an elastic heat-conducting part 46 (which can be heat-conducting silicone) can be connected between the ends of two adjacent heat-conducting parts 4, so that the heat transferred from the hot end 32 of the semiconductor refrigeration part 3 can be more evenly distributed in the multiple heat-conducting parts 4, avoiding the situation where the temperature of a certain heat-conducting part 4 is too high. The setting of the elastic heat-conducting part 46 can make the elastic heat-conducting part 46 produce a certain elastic deformation when the heat-conducting part 4 moves to cooperate with the movement of the heat-conducting part 4.
[0031] In some embodiments of the present application, Figure 7 As shown, the heat conducting member 4 has a groove 42, and the groove 42 penetrates the heat conducting member 4 toward the semiconductor cooling member 3. A first heat conducting portion 43 is provided in the groove 42, and the first heat conducting portion 43 is connected to the groove 42 by movement along the first direction X. The outer peripheral wall of the first heat conducting portion 43 is in contact with the inner wall of the groove 42, and the outer periphery of the first heat conducting portion 43 is in sliding contact with the inner wall of the groove 42, as shown in FIG. Figure 4As shown, the elastic rod 44 can be extended and retracted along the first direction X; specifically, the elastic rod 44 includes a rod body connected to the first heat conducting portion 43, a sliding cavity for accommodating the rod body is provided in the heat conducting member 4, so that the rod body is slidably assembled in the sliding cavity, and a spring (such as Figure 6 As shown, two elastic rods 44 are provided); Figure 4 As shown, when the heat conducting member 4 is in the first working position, the hot end 32 of the semiconductor refrigeration member 3 is accommodated in the groove 42 and pressed against the first heat conducting portion 43, so that the first heat conducting portion 43 is away from the hot end 32 of the semiconductor refrigeration member 3 and fits the inner wall of the groove 42. At this time, the spring connected to the rod body is in a compressed state. The cross-sectional size of the groove 42 along the first direction X in this scheme should meet the requirements that when the heat conducting member 4 moves from the second working position to the first working position, the hot end 32 of the semiconductor refrigeration member 3 can enter the groove 42. Preferably, the cross-sectional size of the groove 42 along the first direction X matches the cross-sectional size of the hot end 32 of the semiconductor refrigeration member 3, so that when the hot end 32 of the semiconductor refrigeration member 3 is accommodated in the groove 42, the five surfaces (four side surfaces and one surface facing the groove 42) of the hot end 32 of the semiconductor refrigeration member 3 are all wrapped by the heat conducting material, thereby improving the efficiency of heat conduction from the hot end 32 of the semiconductor refrigeration member 3 to the heat conducting member 4, and improving the heat dissipation effect of the hot end 32 of the semiconductor refrigeration member 3.
[0032] When the temperature of the hot end 32 of the semiconductor refrigeration element 3 is too high (at this time, the temperature of the first heat conducting portion 43 and the heat conducting element 4 is also at a relatively high state), the heat conducting element 4 moves from the first working position to the second working position. Figure 8As shown, during the movement of the heat-conducting member 4 from the first working position to the second working position, the pressure of the first heat-conducting portion 43 from the hot end 32 of the semiconductor cooling member 3 gradually decreases, so that the hot end 32 of the semiconductor cooling member 3 withdraws from the groove 42. At this time, as the heat-conducting member 4 continues to move, the first heat-conducting portion 43 extends outward from the groove 42 under the action of the elastic rod 44 and is placed in the first air passage 53. At this time, the first heat-conducting portion 43 and the hot end 32 of the semiconductor cooling member 3 are both exposed in the first air passage 53, and the air-cooling component 6 drives the external cold air flow from the upper first opening 52 into the first air passage 53 and passes through the lower first opening During the process of discharging the cold air from the first heat conducting part 43 to the outside, the cold air flow simultaneously realizes the heat dissipation of the hot end 32 of the semiconductor refrigeration element 3 and the first heat conducting part 43; because when the heat conducting part 4 is in the first working position, the first heat conducting part 43 is the main component in contact with the hot end 32 of the semiconductor refrigeration element 3, most of the heat of the hot end 32 of the semiconductor refrigeration element 3 is transferred to the first heat conducting part 43, and then transferred to the heat conducting part 4 through the first heat conducting part 43 and transferred to the outside, so when the temperature of the hot end 32 of the semiconductor refrigeration element 3 is too high, the temperature of the first heat conducting part 43 is bound to be in a high state, and at this time, the first heat conducting part 43 is synchronously cooled by the cold air flow flowing through the first air passage 53. It is helpful to quickly reduce the temperature of the first heat-conducting part 43 (if only the hot end 32 of the semiconductor refrigeration element 3 is quickly cooled, and the first heat-conducting part 43 is still contracted in the groove 42, the temperature of the hot end 32 of the semiconductor refrigeration element 3 may be lower than the temperature of the first heat-conducting part 43, resulting in the first heat-conducting part 43 being unable to dissipate heat for the semiconductor refrigeration element 3 when the heat-conducting part 4 is moved to the first working position again later); when the heat-conducting part 4 is moved from the second working position to the first working position again, the hot end 32 of the semiconductor refrigeration element 3 contacts the first heat-conducting part 43 again, and the lower the temperature of the first heat-conducting part 43, the easier it is to dissipate heat for the hot end 32 of the semiconductor refrigeration element 3 later. During the thermal process, the heat from the hot end 32 of the semiconductor refrigeration component 3 is transferred to the first heat conducting part 43 more strongly (during the heat transfer process, the greater the temperature difference between the heat source and the heat conducting component, the stronger the heat transfer between the heat source and the heat conducting component, and vice versa, the weaker the heat transfer, because the existence of the temperature difference forms a thermal gradient, driving the heat from the high temperature zone to the low temperature zone, the greater the temperature difference between the first heat conducting part 43 and the hot end 32 of the semiconductor refrigeration component 3, the greater the thermal gradient between the two, which helps to speed up the efficiency of heat transfer from the hot end 32 of the semiconductor refrigeration component 3 to the first heat conducting part 43), thereby avoiding the situation where the temperature of the hot end 32 of the semiconductor refrigeration component 3 is too high again in a short time.
[0033] In this solution, the first heat conducting part 43 is connected to the heat conducting member 4 via an elastic rod 44 which can be extended and retracted along the first direction X. When the heat conducting member 4 is in the first working position, that is, the hot end 32 of the semiconductor refrigeration member 3 is accommodated in the groove 42, the first heat conducting part 43 can be closely fitted with the hot end 32 of the semiconductor refrigeration member 3 under the elastic force of the elastic rod 44, so that there is a high degree of fit between the two to ensure the efficiency of heat conduction; when the heat conducting member 4 is in the second working position, the first heat conducting part 43 is pushed out from the groove 42 under the action of the elastic rod 44 and placed in the first air passage 53, so that the first heat conducting part 43 can be dissipated synchronously.
[0034] In some embodiments of the present application, Figure 6 As shown, a second heat conducting part 45 is connected to the side of the heat conducting member 4 away from the semiconductor refrigeration member 3. A plurality of second heat conducting parts 45 are provided, and the plurality of second heat conducting parts 45 are arranged at intervals along the length direction of the heat conducting member 4. The second heat conducting part 45 is arranged in a conical shape, and has a small diameter end 451 connected to the heat conducting member 4 and a large diameter end 452 away from the heat conducting member 4. The second heat conducting part 45 is also a ceramic heat conducting sheet or other heat conducting material; Figure 8 As shown, the wall of the protection box 5 is provided with second openings 54 corresponding to the second heat conducting parts 45 (the number of the second openings 54 matches the number of the second heat conducting parts 45). When the heat conducting member 4 is in the first working position, as shown in FIG. Figure 4 , Figure 5 As shown, the large diameter end 452 of the second heat conducting portion 45 just achieves blocking of the corresponding second opening 54. When the heat conducting member 4 is in the second working position, part of the second heat conducting portion 45 extends outward from the second opening 54 to the protection box 5, and the second opening 54 is opened (as shown in FIG. Figure 8 , Fig. 9 as shown).
[0035] The reason why the conical second heat-conducting part 45 and the second opening 54 matching the second heat-conducting part 45 are provided in the present embodiment is that when the heat-conducting member 4 moves from the first working position to the second working position, the multiple second heat-conducting parts 45 connected to the main body of the heat-conducting member 4 are simultaneously extended outward from the protective box 5, thereby increasing the contact area between the second heat-conducting part 45 and the outside air, which is helpful for efficiently dissipating the heat of the heat-conducting member 4 with a higher temperature at this time. The second heat-conducting part 45 is set to be conical (that is, one end is the large-diameter end 452, and the other end is the small-diameter end 451), which can effectively increase the contact area between the second heat-conducting part 45 and the outside air when the second heat-conducting part 45 extends outward from the protective box 5, so as to improve the heat conduction efficiency with the outside air; when the heat-conducting member 4 moves from the second working position to the first working position again, the large-diameter end 452 of the second heat-conducting part 45 blocks the second opening 54 again (such as Figure 4 , Figure 5As shown), ensure the sealing performance of the sealing cavity 51 when the hot end 32 of the semiconductor refrigeration element 3 is normally cooled (the temperature of the hot end 32 of the semiconductor refrigeration element 3 is within the normal range).
[0036] In some embodiments of the present application, Figure 8 As shown, when the heat conducting member 4 is in the second working position, the heat conducting member 4 is spaced apart from the inner wall of the sealed cavity 51 on the side facing the second opening 54, so that the interval between the heat conducting member 4 and the inner wall of the sealed cavity 51 forms a second gas passage 55, and the second gas passage 55 is connected to the first gas passage 53. The communication modes between the first gas passage 53 and the second gas passage 55 can be divided into two types: Fig.10 , Fig.12 As shown, the length of the heat-conducting member 4 is smaller than the side length of the side wall of the protective box 5. When the heat-conducting member 4 is in the second working position (the second opening 54 is opened), the second air passage 55 and the first air passage 53 are connected through the gap between the two ends of the heat-conducting member 4 along the length direction and the inner wall of the protective box 5, or a connecting hole (not shown in the figure) is directly provided on the heat-conducting member 4 along the first direction X, and the connecting hole and the cooling channel 41 provided in the heat-conducting member 4 are staggered (this connection method is preferred); Figure 8 As shown, when the heat-conducting member 4 is in the second working position, the second air passage 55 between the side of the heat-conducting member 4 facing the second opening 54 and the wall of the protection box 5 is connected to the first air passage 53, so that when the air-cooling component 6 is working, the cold air flow in the external environment enters the sealed cavity 51 and is divided into two paths, one of which is: the external cold air flows through the first opening 52, the first air passage 53, and the first opening 52 to be discharged outward (for heat dissipation of the hot end 32 of the semiconductor refrigeration member 3 and the first heat-conducting portion 43); the other path is: the external cold air flows through the gap between the second heat-conducting portion 45 and the second opening 54 to first enter the second air passage 55, and then enters the first through the second air passage 55 through the connecting hole provided on the heat-conducting member 4. The air is finally discharged outward through the first opening 52 located at the bottom (for heat dissipation of the heat-conducting element 4); thereby, when the heat-conducting element 4 is in the second working position, the hot end 32 of the semiconductor refrigeration element 3, the heat-conducting element 4, the first heat-conducting part 43, and the second heat-conducting part 45 can be quickly cooled at the same time, so that the temperature of the heat-conducting element 4, the first heat-conducting part 43, and the second heat-conducting part 45 as a whole can be effectively reduced. When the hot end 32 of the semiconductor refrigeration element 3 returns to a normal range (at this time, the heat-conducting element 4 is in the first working position), the heat conduction efficiency between the hot end 32 of the semiconductor refrigeration element 3 and the heat-conducting element 4, the first heat-conducting part 43, and the second heat-conducting part 45 can be improved (to avoid the situation where the temperature of the hot end 32 of the semiconductor refrigeration element 3 is too high again in a short time).
[0037] In some embodiments of the present application, Fig.10 , Fig.12 As shown, a driving member 7 (an electric push rod including a cylinder body and a telescopic rod) is provided in the sealed cavity 51. The driving member 7 is used to drive the heat conducting member 4 to move along the first direction X. Fig.12 As shown, the cylinder body of the electric push rod can be arranged in the isolation chamber 82 and part of the cylinder body extends from the isolation chamber 82 into the sealed chamber 51, the telescopic rod extends from one end of the cylinder body, and the other end is connected to the heat-conducting member 4; a temperature sensor is provided in the sealed chamber 51, and the temperature sensor is used to collect the temperature of the hot end 32 of the semiconductor refrigeration member 3 (the temperature sensor is PT100, and PT100 is in contact with the hot end 32 of the semiconductor refrigeration member 3), or the temperature sensor directly collects the temperature in the sealed chamber 51, because when the temperature of the hot end 32 of the semiconductor refrigeration member 3 is high, the temperature in the sealed chamber 51 changes synchronously therewith (the temperature change in the sealed chamber 51 can also reflect the temperature change of the hot end 32 of the semiconductor refrigeration member 3); when the temperature sensor detects that the temperature is higher than the normal range (predetermined value), the control system controls the driving member 7 to extend a certain distance and drive the heat-conducting member 4 to move from the first working position to the second working position; when the temperature sensor detects that the temperature is within the normal range (lower than the predetermined value), the control system controls the driving member 7 to shrink a certain distance and drive the heat-conducting member 4 to move from the second working position to the first working position.
[0038] In this solution, one heat conducting member 4 can be configured to be driven by two driving members 7 ( Fig.10 Only the installation position of the driving member 7 is shown, and the number of the driving members 7 is not shown). The two driving members 7 are respectively located at the two ends of the heat conducting member 4 along its length direction.
[0039] In some embodiments of the present application, Figure 2 , Figure 3 As shown, the air cooling assembly 6 includes an air duct 61, the number of the air duct 61 matches the number of the heat conducting parts 4, one end of the air duct 61 is connected to the first opening 52, and the other ends of all the air ducts 61 are commonly connected to a collecting chamber 62, the bottom of the collecting chamber 62 has a third opening 621 connected to the outside, and a cooling fan 63 is provided in the third opening 621.
[0040] like Figure 2 As shown, one end of the air duct 61 connected to the collecting chamber 62 is a rectangular shape with a regular cross-section, and one end of the air duct 61 connected to the first opening 52 is set to an inverted trapezoidal shape, so that the end with a larger opening is connected and coordinated with the first opening 52, and the heat dissipation fan 63 is set as an exhaust fan, that is, the outside air enters the collecting chamber 62 from the first opening 52 through the cooling channel 41 (the first air passage 53, the second air passage 55), the second opening 54, and the air duct 61 in sequence, and is discharged to the outside through the third opening 621 set at the bottom of the collecting chamber 62, so as to achieve the effect of transferring heat to the outside.
[0041] The working process of the present invention is as follows: when the temperature in the sealed cavity 51 is within the normal range (or the temperature of the hot end 32 of the semiconductor refrigeration element 3 is within the normal range), the heat-conducting element 4 is in the first working position, and the air-cooling component 6 is started to allow the cold air flow in the external environment to enter the collecting cavity 62 through the first opening 52, the cooling channel 41, the first opening 52, and the air guide pipe 61 in sequence and finally be discharged outward from the third opening 621, so as to realize the transfer and dissipation of the heat of the hot end 32 of the semiconductor refrigeration element 3 (indirect heat dissipation of the hot end 32 of the semiconductor refrigeration element 3); when the temperature in the sealed cavity 51 is too high (or the temperature of the hot end 32 of the semiconductor refrigeration element 3 is too high), the control system controls the driving element 7 to bring The heat-conducting member 4 moves from the first working position to the second working position, and the air-cooling assembly 6 starts to flow the cold air in the external environment into the first air passage 53 and the second air passage 55 through the first opening 52 and the second opening 54 in sequence, and finally enters the collecting chamber 62 through the first opening 52 connected with the air pipe 61, and finally discharges outward through the third opening 621, so as to achieve rapid heat dissipation (direct heat dissipation) of the hot end 32 of the semiconductor refrigeration member 3 and the heat-conducting member 4, the first heat-conducting part 43, and the second heat-conducting part 45, so as to restore the temperature of the hot end 32 of the semiconductor refrigeration member 3 to the normal range in the shortest possible time, and ensure the refrigeration efficiency and use safety of the semiconductor refrigeration member 3. When the temperature returns to the normal range, the control system controls the driving member 7 to drive the heat-conducting member 4 to move from the second working position to the first working position.
[0042] In summary, the embodiment of the present invention provides a refrigeration system for a medical reagent warehouse. In this solution, the cold end 31 of the semiconductor refrigeration component 3 is connected to the outer wall of the box body 1 to realize cooling the coolant in the cooling chamber 11. By setting a protective box 5, it forms a sealed chamber 51 with the outer peripheral wall of the box body 1, and the semiconductor refrigeration component 3 is accommodated in the sealed chamber 51. A heat-conducting component 4 that is in contact with the hot end 32 of the semiconductor refrigeration component 3 is provided in the sealed chamber 51. When the semiconductor refrigeration component 3 is working, the heat generated by the hot end 32 is quickly transferred to the heat-conducting component 4. A cooling channel 41 is provided in the heat-conducting component 4, and the cooling channel 41 is connected to an air-cooling component 6. The air-cooling component 6 transports an airflow with a lower external temperature into the cooling channel 41 to realize the transfer of heat transferred to the heat-conducting component 4 to the outside, so that the semiconductor refrigeration component 3 can be cooled. The cooling element 3 is in a relatively sealed environment, which effectively prevents dust in the external environment from adhering to its surface (so that the semiconductor cooling element 3 is maintained in a highly efficient working state). At the same time, the heat generated by the hot end 32 of the semiconductor cooling element 3 is continuously transferred to the outside through the cooperation of the heat conductive element 4, the cooling channel 41, and the air cooling component 6, so as to ensure the normal operation of the semiconductor cooling element 3 (indirect heat dissipation of the hot end 32 of the semiconductor cooling element 3); when the temperature of the hot end 32 of the semiconductor cooling element 3 is too high, the heat conductive element 4 is controlled to move from the first working position to the second working position, so as to realize highly efficient direct heat dissipation of the hot end 32 of the semiconductor cooling element 3, so as to ensure the cooling efficiency and safety of the semiconductor cooling element 3, and improve the controllability of the temperature management of the hot end 32 of the semiconductor cooling element 3.
[0043] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.
Claims
1. A medical reagent warehouse refrigeration system, characterized in that: include: A box (1), wherein the box (1) has a cooling chamber (11) for storing cooling liquid; A cooling pipeline, both ends of which are respectively connected to the cooling cavity (11); a pumping assembly (2) is connected between the cooling cavity (11) and the cooling pipeline; the pumping assembly (2) allows the coolant to circulate between the cooling pipeline and the cooling cavity (11); A semiconductor refrigeration element (3), wherein a plurality of semiconductor refrigeration elements (3) are evenly arranged around the outer peripheral wall of the box body (1), and a cold end (31) of the semiconductor refrigeration element (3) is closely connected to the outer wall of the box body (1); The heat conducting element (4) is arranged to match the number of the semiconductor refrigeration element (3), and the heat conducting element (4) is in contact with the hot end (32) of the semiconductor refrigeration element (3); A protection box (5) is connected to the outer peripheral wall of the box body (1), a sealed cavity (51) is formed between the protection box (5) and the outer peripheral wall of the box body (1), and the hot end (32) of the semiconductor refrigeration element (3) and the heat conducting element (4) are both accommodated in the sealed cavity (51); and A cooling channel (41) is arranged in the heat conducting member (4), one end of the cooling channel (41) is connected to the outside, and the other end of the cooling channel (41) is connected to an air cooling component (6).
2. The medical reagent warehouse refrigeration system according to claim 1, characterized in that: The medical reagent warehouse refrigeration system further comprises a shell (8) connected to the outer peripheral wall of the box body (1), the shell (8) is arranged around the outer periphery of the box body (1), and an isolation cavity (82) is formed between the shell (8) and the outer peripheral wall of the box body (1); The protection box (5) is connected to the outer peripheral wall of the shell (8), and the sealing cavity (51) is formed between the protection box (5) and the outer peripheral wall of the shell (8); The shell (8) has a through hole (81) matching the semiconductor refrigeration element (3), and the semiconductor refrigeration element (3) is inserted into the through hole (81), so that the cold end (31) of the semiconductor refrigeration element (3) is placed in the isolation cavity (82) and abuts against the outer wall of the box body (1), and the hot end (32) of the semiconductor refrigeration element (3) is placed in the sealed cavity (51).
3. The medical reagent warehouse refrigeration system according to claim 1, characterized in that: The cooling channel (41) passes through the heat conducting member (4) from top to bottom, and first openings (52) are respectively provided at positions on the upper and lower walls of the protection box (5) corresponding to the cooling channel (41); One end of the cooling channel (41) is in communication with the outside world via one of the first openings (52), and the other end of the cooling channel (41) is in communication with the air cooling component (6) via another of the first openings (52).
4. The medical reagent warehouse refrigeration system according to claim 3, characterized in that: There are a plurality of cooling channels (41), and the plurality of cooling channels (41) are arranged at intervals along the length direction of the heat conducting member (4); The upper ends of the plurality of cooling channels (41) are all in communication with one of the first openings (52), and the lower ends of the plurality of cooling channels (41) are all in communication with another of the first openings (52).
5. The medical reagent warehouse refrigeration system according to claim 3, characterized in that: The semiconductor refrigeration element (3) has a first direction (X) perpendicular to the plane where the cold end (31) of the semiconductor refrigeration element (3) is located, and the heat conducting element (4) is movable along the first direction (X) and connected to the sealed cavity (51), and the upper and lower ends of the heat conducting element (4) are in contact with the upper and lower walls of the sealed cavity (51); The heat conducting element (4) has a first working position abutting against the cold end (31) of the semiconductor refrigeration element (3) and a second working position away from the cold end (31) of the semiconductor refrigeration element (3) on the moving track of the first direction (X); The heat conducting element (4) moves from the first working position to the second working position, so that a first air passage (53) is formed between the heat conducting element (4) and the cold end (31) of the semiconductor refrigeration element (3); one end of the first air passage (53) is connected to the outside through one of the first openings (52), and the other end is connected to the air cooling component (6) through another first opening (52).
6. The medical reagent warehouse refrigeration system according to claim 5, characterized in that: The heat conducting element (4) has a groove (42) therein, and the groove (42) penetrates the side wall of the heat conducting element (4) toward the side of the semiconductor refrigeration element (3); A first heat-conducting portion (43) is provided in the groove (42), the first heat-conducting portion (43) is connected to the groove (42) by movement along the first direction (X), and the outer peripheral wall of the first heat-conducting portion (43) is in contact with the inner side wall of the groove (42); an elastic rod (44) is provided in the groove (42) and can be extended and retracted along the first direction (X), one end of the elastic rod (44) is connected to the first heat-conducting portion (43), and the other end of the elastic rod (44) is connected to the heat-conducting member (4); The heat conducting component (4) moves from the first working position to the second working position, and the elastic rod (44) drives the first heat conducting part (43) to extend out of the groove (42) and be placed in the first air passage (53); the heat conducting component (4) moves from the second working position to the first working position, and the hot end (32) of the semiconductor cooling component (3) pushes the first heat conducting part (43), compressing the elastic rod (44), so that the hot end (32) of the semiconductor cooling component (3) is accommodated in the groove (42).
7. The medical reagent warehouse refrigeration system according to claim 5, characterized in that: A second heat conducting portion (45) is connected to the side of the heat conducting element (4) facing away from the semiconductor refrigeration element (3); the second heat conducting portion (45) is tapered and has a small diameter end (451) connected to the heat conducting element (4) and a large diameter end (452) away from the heat conducting element (4); Along the first direction (X), the side wall of the protection box (5) and the corresponding area of the large diameter end (452) have a second opening (54) connected to the outside and the sealed cavity (51), and the second opening (54) is matched with the large diameter end (452); When the heat conducting member (4) is in the first working position, the large diameter end (452) seals the second opening (54); when the heat conducting member (4) is in the second working position, the second opening (54) is opened and communicated with the outside.
8. The medical reagent warehouse refrigeration system according to claim 7, characterized in that: When the heat-conducting member (4) is in the second working position, the side of the heat-conducting member (4) facing the second opening (54) is spaced apart from the inner wall of the sealed cavity (51) away from the semiconductor refrigeration member (3), so that the space between the heat-conducting member (4) and the inner wall of the sealed cavity (51) forms a second air passage (55), and the second air passage (55) is connected to the first air passage (53).
9. The medical reagent warehouse refrigeration system according to claim 5, characterized in that: A driving member (7) is provided in the sealed cavity (51), and the driving member (7) is used to drive the heat-conducting member (4) to move along the first direction (X); a temperature sensor is provided in the sealed cavity (51), and the temperature sensor and the driving member (7) are both electrically connected to a control system; The temperature sensor is used to collect the temperature parameter of the hot end (32) of the semiconductor refrigeration element (3); when the temperature parameter is higher than a predetermined value, the control system controls the driving element (7) to drive the heat conducting element (4) to move from the first working position to the second working position; when the temperature parameter is lower than the predetermined value, the control system controls the driving element (7) to drive the heat conducting element (4) to move from the second working position to the first working position.
10. The medical reagent warehouse refrigeration system according to any one of claims 3 to 9, characterized in that: The air cooling component (6) comprises an air guide pipe (61), and the number of the air guide pipes (61) matches the number of the heat conducting components (4) matched therewith; One end of the air guide tube (61) is in communication with the first opening (52), and the other ends of all the air guide tubes (61) are in communication with a collecting chamber (62). The bottom of the collecting chamber (62) has a third opening (621) in communication with the outside, and a cooling fan (63) is provided in the third opening (621).