Electronic module assembly and pressure sensor

Abstract

The invention discloses an electronic module assembly with good sealing performance and a pressure sensor comprising the electronic module assembly, and the electronic module assembly comprises a first substrate which is longitudinally arranged along the vertical direction in the thickness direction, and the upper side surface of the first substrate is provided with a signal processing circuit; the upper cover comprises an upper cover main body, and a circle of first enclosure wall and a circle of second enclosure wall which extend downwards from the upper cover main body and have the lower ends adhered to the upper side surface of the first substrate in a sealing manner; the second enclosure bulkhead surrounds the first enclosure bulkhead, and a first cavity for accommodating at least one part of electronic elements of the signal processing circuit is formed between the second enclosure bulkhead and the first enclosure bulkhead; a second cavity formed in the second enclosure bulkhead is communicated with the upper side of the upper cover main body through a hole formed in the upper cover main body, and the second cavity is communicated with the lower side of the first substrate through a via hole formed in the first substrate; the lower ends of the spring terminals are electrically contacted with the signal processing circuit, the edge of the lower end of the first retaining hole extends downwards to form a circle of third enclosure wall, and the lower end of the third enclosure wall is hermetically adhered to the upper side surface of the first substrate.

Description

Technical Field

[0001] The present application relates to the field of sensor technology, and in particular to an electronic module assembly and a pressure sensor. Background Art

[0002] In the ESC system (Electronic Stability Control) of a car, a pressure sensor is needed to measure the pressure of the brake medium. It is usually set on a hydraulic module with limited installation space, so it is required to have a small size, especially the lateral size. Usually, the circuit board is set horizontally, so the area where electronic components can be installed is small, and it is necessary to use multiple circuit boards set up vertically or set the circuit board vertically. Regardless of the setting method, the electrical connection between these components and the terminals is usually inconvenient and costly. For example, when the circuit board is set vertically, the lead bonding plane between it and the pressure-sensitive element will be perpendicular to each other, which is extremely inconvenient in terms of equipment or control; when multiple circuit boards arranged up and down are set, the fixation of these circuit boards and the electrical connection between them also increase the cost and process complexity.

[0003] On the other hand, this type of pressure sensor usually uses a metal elastic diaphragm as a pressure deformable body. A Wheatstone bridge composed of resistors such as thick film resistors or silicon strain gauges is attached to the surface of the metal elastic diaphragm away from the pressure medium to be measured to convert the strain of the metal elastic diaphragm into an electrical signal. These thick film resistors or silicon strain gauges need to be connected to the circuit board through leads. These leads and resistors are preferably covered with gel for protection. Therefore, it is usually necessary to fix a frame that can accommodate gel on the side of the circuit board away from the metal elastic diaphragm.

[0004] On the other hand, such pressure sensors usually use metal coil springs in electrical connectors as terminals for connecting to external devices, but such terminals cannot form a seal between the circuit part and the external environment due to their own shape. Moisture in the environment enters the sensor and there is a risk of corroding the internal circuit. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present application provides an electronic module assembly to solve at least one aspect of the above-mentioned defects.

[0006] To achieve the above objectives, the present application provides the following technical solutions: an electronic module assembly, comprising:

[0007] A first substrate having a thickness direction arranged longitudinally along the up-down direction, and a signal processing circuit arranged on an upper surface thereof;

[0008] The upper cover comprises an upper cover body, and a circle of first surrounding walls and a circle of second surrounding walls extending downward from the upper cover body and having a lower end sealed and bonded to the upper surface of the first substrate; the second surrounding wall surrounds the first surrounding wall and forms a first cavity for accommodating at least a part of the electronic components of the signal processing circuit between the second surrounding wall and the first surrounding wall; the second cavity formed inside the second surrounding wall is connected to the upper side of the upper cover body through a hole provided on the upper cover body, and the second cavity is connected to the lower side of the first substrate through a via hole provided on the first substrate;

[0009] The lower end of the spring terminals is electrically contacted to the signal processing circuit, and the lower part is held in a first holding hole which is through-hole arranged on the upper cover body, the lower end edge of the first holding hole extends downward to form a circle of third surrounding wall, and the lower end of the third surrounding wall is sealed and bonded to the upper surface of the first substrate.

[0010] Preferably, the third surrounding wall encloses an inner cavity of the third surrounding wall inside the first cavity, and the inner cavity of the third surrounding wall is isolated from other parts of the first cavity.

[0011] Preferably, an upper end edge of the first retaining hole protrudes upward to form an extension portion.

[0012] Preferably, the lower end surface of the second surrounding wall is provided with a circle of first grooves for accommodating sealant, the lower end surface of the third surrounding wall is provided with a circle of second grooves for accommodating sealant, and a plurality of the second grooves are transversely connected to the first grooves.

[0013] Preferably, the second surrounding wall and the third surrounding wall have at least one section in common.

[0014] Preferably, the lower end of the second surrounding wall elastically abuts against the first substrate.

[0015] Preferably, the upper cover further comprises at least one circle of thin shell-shaped connecting parts whose radial inner and outer side edges are connected to the upper end of the second surrounding wall and the upper cover body in a one-to-one correspondence.

[0016] Preferably, a circle of step surface for bearing downward pressing force is formed on the upper cover body.

[0017] The present application also claims protection for a pressure sensor comprising:

[0018] The housing comprises a metal cylindrical shell extending longitudinally, a metal pressure interface sealedly fixed to the lower end of the cylindrical shell, and an electrical connector with a lower end extending into the cylindrical shell; a pressure introduction channel is provided on the pressure interface; a second holding hole for holding the upper part of the spring terminal and pressing the upper part of the spring terminal downward is provided in the electrical connector;

[0019] A pressure sensitive element disposed inside the housing and fixedly sealed at one end of the inner side of the pressure introduction channel, wherein the upper surface of the pressure sensitive element is close to the lower surface of the first substrate and a gap is left between the lower surface of the first substrate, and the pressure sensitive element is electrically connected to the signal processing circuit through a lead passing through the via hole;

[0020] A support seat disposed inside the housing and fixed to the pressure interface;

[0021] And the electronic module assembly as claimed in any one of claims 1 to 3, which is fixed on the support base; the spring terminal is pressed downward by the electrical connector and electrically connected to the signal processing circuit.

[0022] Preferably, the pressure sensitive element includes a horizontally extending metal elastic diaphragm and a pressure sensing circuit arranged on the upper surface of the metal elastic diaphragm and electrically connected to the signal processing circuit through the lead, and the second cavity is filled with a gel covering the lead, and the gel partially overflows into the gap to at least partially cover the pressure sensing circuit.

[0023] The electronic module assembly and pressure sensor described above can have high sealing performance while being connected to external equipment through spring terminals, greatly reducing the risk of corrosion of electronic components. In addition, the pressure sensor described above further provides two upper and lower substrates for arranging circuits, and the lower substrate utilizes the space around the connecting flange, thereby increasing the arrangement area of ​​the electronic components and saving space in the housing; at the same time, the circuits on the two substrates can be conveniently electrically connected through the conductive coil spring. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a perspective view of the electronic module assembly of the first embodiment;

[0025] Figure 2 is a longitudinal sectional view of the electronic module assembly of the first embodiment;

[0026] Figure 3 A bottom view of the upper cover of the first embodiment;

[0027] Figure 4 is an exploded view of the electronic module assembly of the first embodiment;

[0028] Figure 5 is a longitudinal sectional view of the pressure sensor of the first embodiment;

[0029] Figure 6 A longitudinal sectional view of a pressure sensor according to a first variation of the first embodiment;

[0030] Figure 7A longitudinal sectional view of a pressure sensor according to a second variation of the first embodiment;

[0031] Figure 8 is a perspective view of an electronic module assembly according to a second embodiment;

[0032] Fig. 9 is a longitudinal sectional view of an electronic module assembly according to a second embodiment;

[0033] Fig.10 A bottom view of an upper cover of a pressure sensor according to a second embodiment;

[0034] Fig.11 is a longitudinal sectional view of an electronic module assembly according to a third embodiment;

[0035] Fig.12 is a schematic structural diagram of a spring terminal according to a third embodiment;

[0036] Fig.13 is a longitudinal cross-sectional view of an electronic module assembly according to a first variation of the third embodiment;

[0037] Fig.14 is a longitudinal sectional view of a pressure measurement assembly according to a fourth embodiment;

[0038] Fig.15 A three-dimensional diagram of a partial structure of a pressure measurement assembly according to a fourth embodiment;

[0039] Fig.16 A longitudinal sectional view of a pressure measurement assembly of a first variation of the fourth embodiment;

[0040] Fig.17 is a longitudinal sectional view of a pressure sensor according to a fourth embodiment;

[0041] Fig.18 is a longitudinal sectional view of a pressure sensor according to a fifth embodiment;

[0042] Explanation of the reference numerals: 100, pressure introduction channel; 111, support plate; 11a, groove; 11, connecting flange; 1a, step surface; 1b, step surface; 1c, flange portion; 1d, upper end surface; 1f, lower end surface; 1, pressure interface; 200, pressure sensing circuit; 201, gap; 20, metal elastic diaphragm; 21, support wall; 22, expansion portion; 2, pressure sensitive element; 311, pressing edge; 31, pressing portion; 321, anti-slip portion; 32, fixing portion; 33a, clearance hole; 33b, holding hole; 33, main body; 3, support seat; 400, gel; 411, electrical contact portion; 412, electrical contact portion; 41a, through hole; 41, substrate; 42a, clearance hole; 42, substrate; 431, electronic component; 43, signal processing circuit; 44, electrical connector; 451, electrical contact portion; 45, signal processing Circuit; 501, waterproof breathable membrane; 511, extension; 51a, holding hole; 51, upper cover body; 52, surrounding wall; 531, connecting part; 53, surrounding wall; 5a, cavity; 5b, cavity; 5c, step surface; 5d, hole; 5, upper cover; 61, pressing edge; 6, cylinder shell; 71, supporting flange; 7a, step surface; 7b, holding hole; 7, electrical connector; 8, spring terminal; 91, sealing ring; 92, sealing ring; 10, electronic module assembly; 30, pressure measurement assembly; 413, electrical contact portion; 432, conditioning chip; 511a, notch; 51b, groove; 51c, positioning protrusion; 51d, surrounding wall; 52a, groove; 53a, groove; 5e, arc-shaped groove; 81a, first part; 81b, second part; 81c, transition part; 81, upper section; 82a, elastic part; 82, lower section; 83, transition section. DETAILED DESCRIPTION

[0043] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The following embodiments are exemplary and are only used to explain the present application, and cannot be interpreted as limiting the present application. In the following description, the same symbols are used to represent the same or equivalent elements, and repeated descriptions are omitted.

[0044] In the description of the present application, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or the directions or positional relationships in which the products of the present application are usually placed when in use, or the directions or positional relationships usually understood by those skilled in the art, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the equipment or components referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limitations on the present application. In addition, the prepositive terms "first", "second", "third", etc. are only used to distinguish the modified objects, and cannot be understood as indicating or implying relative importance.

[0045] In addition, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] It should be further understood that the term “and / or” used in the specification and corresponding claims of this application refers to any and all possible combinations of one or more of the listed items.

[0047] Please refer to Figure 1 to Figure 4 In the first embodiment, the electronic module assembly 10 includes a substrate 41, an upper cover 5 and a plurality of spring terminals 8. The thickness direction of the first substrate 41 is longitudinally arranged along the up-down direction, and a first signal processing circuit 43 is arranged on its upper surface. The upper cover 5 includes an upper cover body 51 and a circle of surrounding walls 52 and a circle of surrounding walls 53 extending downward from the upper cover body 51 and forming a lower end sealed and bonded to the upper surface of the first substrate 41. The surrounding wall 53 surrounds the outer side of the surrounding wall 52 and forms a cavity 5a between the surrounding wall 52. The cavity 5b formed inside the surrounding wall 53 is connected to the upper side of the upper cover body 51 through the hole 5d provided on the upper cover body 51. The cavity 5b is connected to the lower side of the substrate 41 through the through hole 41a provided on the substrate 41. The upper cover body 51 is provided with a retaining hole 51a corresponding to the above-mentioned spring terminal 8 and penetrating from top to bottom. The lower end edge of the retaining hole 51a extends downward to form a circle of surrounding walls 51d. The lower end of the surrounding wall 51 d is bonded to the upper surface of the substrate 41 in a sealing manner.

[0048] Among them, cavity 5a is used to accommodate electronic components of the signal processing circuit 43 that need to be protected, such as the conditioning chip 432 and the electronic component 431; the cavity 5a can be used to fill with gel 400 to protect the pressure sensitive element 2 and related leads, which will be described in detail below; the retaining hole 51a is used to retain the lower part of the corresponding spring terminal 8 therein, and the lower end of the spring terminal 8 is electrically contacted to the electrical contact portion 411 of the signal processing circuit 43 located at the bottom of the retaining hole 51a, and the upper end of the spring terminal 8 is used to form an electrical connection with an external device, etc.

[0049] In this way, the electronic module assembly 10 can protect the electronic components that need protection in the cavity 5a while being conveniently electrically connected to the external device through the spring terminal 8; in addition, the leads connecting the pressure sensitive element and the substrate 41 can be protected by filling the inner cavity of the surrounding wall 53 with gel.

[0050] The bottoms of the surrounding walls 52, 53 and 51d may form a circle groove 52a, a circle groove 53a and a circle groove 51b respectively. When the lower end surface of the upper cover 5 is bonded to the upper surface of the substrate 41 by the sealant, the upper cover 5 may be inverted first, and then the sealant is injected into the above-mentioned grooves 52a, 53a and 51b, and then the substrate 41 is inverted on the upper cover 5 for bonding. For example, the lower end surface of the surrounding wall 52 may be bonded to a circle of annular area S1 on the upper surface of the substrate 41, the lower end surface of the surrounding wall 53 may be bonded to a circle of annular area S2 on the upper surface of the substrate 41, and the lower end surfaces of the plurality of surrounding walls 51d may be bonded to a circle of area S3 on the upper surface of the substrate 41. Thus, the surrounding wall 51d may enclose an inner cavity of the surrounding wall 51d inside the cavity 5a, and the inner cavity of the surrounding wall 51d is isolated from other parts of the cavity 5a. Preferably, the grooves 51b are in transverse communication with the grooves 53a. For example, the surrounding wall 53 and the surrounding wall 51d may have at least one common portion, which makes it easier to inject the sealant.

[0051] Figure 5 The overall structure of the pressure sensor of the first embodiment is shown. The pressure sensor includes a pressure measurement assembly and a housing. The housing may include a metal cylindrical shell 6 extending longitudinally, a metal pressure interface 1 sealedly fixed to the lower end of the cylindrical shell 6, and an electrical connector 7 extending into the cylindrical shell 6 at the lower end. A pressure introduction channel 100 is provided on the pressure interface 1. A retaining hole 7b is provided in the electrical connector 7 for retaining the upper part of the spring terminal 8 and pressing the upper part of the spring terminal 8 downward. Exemplarily, the spring terminal 8 can be a known stepped coil spring, for example, it can include an upper section 81 with a smaller outer diameter, a lower section 82 with a larger outer diameter, and a transition section 83 connecting the two. The upper section 81 and the lower section 82 are coaxially arranged. The upper section 81 and the surrounding wall 53 are preferably tightly coiled and given sufficient rigidity to facilitate plugging with external equipment and being pressed downward by the retaining hole 7b of the electrical connector 7), and the retaining hole 7b can be a stepped hole accordingly and have a pressing surface for pressing the transition section of the spring terminal 8 downward.

[0052] In addition to the above-mentioned electronic module assembly 10, the pressure measurement assembly also includes a pressure sensitive element 2 that is sealed at one end of the inner side of the pressure introduction channel 100 to generate a corresponding electrical signal in response to the pressure of the medium to be measured in the pressure introduction channel 100. The electronic module assembly 10 is used to process the above-mentioned electrical signal. The pressure sensitive element 2 may include a metal elastic diaphragm 20 that extends horizontally and has a pressure sensing circuit 200 disposed on the upper surface. The upper surface of the metal elastic diaphragm 20 is close to the lower surface of the substrate 41 and a gap 201 is left between the metal elastic diaphragm 20 and the lower surface of the substrate 41. The metal elastic diaphragm 20 is electrically connected to the electrical contact portion 413 of the signal processing circuit 43 located in the cavity 5b through a plurality of leads passing through the via 41a. The cavity 5b is filled with a gel 400 that covers the leads. The gel 400 partially overflows into the gap 201 to at least partially cover the pressure sensing circuit 200. The height of the gap 201 is preferably as small as possible, for example, 1.5 mm to 3 mm, while allowing the metal elastic diaphragm 20 to deform upwards to a predetermined extent.

[0053] The pressure measurement assembly may further include a support seat 3 for fixing the electronic module assembly 10 inside the housing. For example, the upper portion of the cylindrical shell 6 may be bent inward to form a pressing edge 61, and the pressing edge 61 is pressed downwardly against a circle of stepped surface 7a formed on the electrical connector 7. A sealing ring 92 may be provided between the pressing edge 61 and the stepped surface 7a, and / or a sealant may be applied between the pressing edge 61 and the outer wall of the electrical connector 7. The lower end edge of the electrical connector 7 may extend downwardly to form a supporting flange 71, and the supporting flange 71 presses the support seat 3 downwardly to the pressure interface 1. A sealing ring 92 may be provided between the pressing edge 61 and the stepped surface 7a. Alternatively or additionally, the lower end of the support seat 3 may also be directly snap-fitted or welded to the pressure interface 1; more preferably, the support seat 3 may include a circle of metal fixing portion 32 extending longitudinally, and the lower end of the fixing portion 32 is sealingly welded to a circle of step surface 1b formed on the pressure interface 1. In this case, the upper part of the cylinder shell 6 may not be provided with a pressing edge, but is fixed to the electrical connector 7 by being molded into the electrical connector 7.

[0054] The support seat 3 may also include a circle of main body 33, and the upper end of the fixing portion 32 may be sealed and molded in the main body 33. The bottom edge of the substrate 41 may be directly bonded and fixed to the upper end surface of the main body 33. Alternatively or additionally, the support seat 3 may also include a circle of metal pressing portion 31 whose lower end is molded in the main body 33, and the upper end of the pressing portion 31 may be bent inward to form a pressing edge 311, and the pressing edge 311 may press and fix the upper cover 5 downward to the upper end surface of the main body 33. Preferably, a circle of step surface 5c for bearing the downward pressing force of the pressing edge 311 may be formed on the upper cover body 51, and a sealing ring 91 may be provided between the pressing edge 311 and the step surface 5c. In some modified embodiments, the lower portion of the fixing portion 32 may be divided into a plurality of parts in the circumferential direction, and these parts may be snapped onto the side wall of the flange portion 1c formed by the inner side of the step surface 1b protruding upwards; in this case, the fixing portion 32 may not be made of metal and molded into the main body 33, but may instead be integrally connected to the main body 33 and made of plastic. In some other schemes, the clamping portion 31 and the fixing portion 32 may not be a complete circle, but may be divided into a plurality of parts spaced apart in the circumferential direction. When the fixing portion 32 is divided into a plurality of parts spaced apart in the circumferential direction, the fixing portion 32 may be snapped onto the outer wall of the flange portion 1c formed by the inner side of the step surface 1b protruding upwards accordingly.

[0055] The main body 33 is provided with a first clearance hole 33a to allow the pressure sensitive element 2 to pass upward and downward, so that the upper surface of the metal elastic diaphragm 20 can pass upward through the clearance hole 33a and then approach a side surface of the substrate 41. The pressing part 31 and the fixing part 32 can be connected as one piece.

[0056] In some other embodiments, the pressure sensor may further include a substrate 42 located directly below the substrate 41, and a signal processing circuit 45 is disposed on the upper surface of the substrate 42. The signal processing circuit 45 is elastically electrically contacted to a first electrical contact portion 412 disposed on the lower surface of the substrate 41 and electrically connected to the first signal processing circuit 43 through an electrical connector 44, wherein the electrical contact portion 412 may be electrically connected to the signal processing circuit 43 through a metallized via (Via) passing through both sides of the substrate 41. A clearance hole 33a is disposed on the substrate 42 to allow the pressure sensitive element 2 to pass through. The electrical connector 44 may be a conductive coil spring that is electrically contacted and squeezed to a compressed state by the electrical contact portion 412 disposed on the lower surface of the substrate 41 and the electrical contact portion 451 disposed on the upper surface of the substrate 42, and the conductive coil spring may be retained in a retaining hole 33b disposed in the main body 33. The substrate 42 may be provided with a clearance hole 42a for making way for the pressure sensitive element 2, which may be bonded to the lower end surface of the main body 33.

[0057] The edge of the metal elastic diaphragm 20 may extend downward to form a circle of support wall 21, and the support wall 21 may be sealed and welded to the connecting flange 11 formed by extending upward from the upper end surface 1d of the pressure interface 1 at the inner end of the pressure introduction channel 100. More preferably, the middle part of the connecting flange 11 expands outward to form a circle of support disk 111, and the lower end of the support wall 21 may be supported and welded on the support disk 111, and a circle of groove 11a is correspondingly formed between the support disk 111 and the upper end surface 1d of the pressure interface 1. The upper end of the support wall 21 may expand radially outward to form an expansion portion 22 to increase the rigidity of the edge portion of the metal elastic diaphragm 20. At this time, the through hole 41a of the substrate 42 should at least be able to allow the support plate 111 to pass through. When the substrate 42 is installed, it can first pass over the support plate 111 downward before the pressure sensitive element 2 is welded to the connecting flange 11; when the through hole 41a can allow the support plate 111 and the pressure sensitive element 2 to pass up and down, the substrate 42 can also be assembled together with the support seat 3, passing over the support plate 111 and the expansion portion 22 downward after the pressure sensitive element 2 is welded to the connecting flange 11.

[0058] When the conditioning chip 432 is an unpackaged bare chip, it can also be disposed in the cavity 5b and electrically connected to the signal processing circuit 43 through other leads. The conditioning chip 432 and its related leads can also be covered by the gel 400 for protection.

[0059] The electronic module assembly 10 of this embodiment can isolate the electronic components that need to be protected from the external environment in the cavity 5a, and chemically and mechanically protect the leads of the pressure sensitive element 2 in the cavity 5b through the gel; when connected to an external device through the spring terminal 8, only the electrical contact portion 411 is exposed to the external environment, so it has good sealing. In addition, by providing two laterally extending substrates as the substrate of the circuit, the area where the electronic components can be installed is guaranteed under the premise of relatively low lateral dimensions.

[0060] See also Figure 6. Compared with the first embodiment, in the pressure sensor shown in the first variation of the first embodiment, the fixing portion 32 and the main body 33 can be made of the same material as a whole. The fixing portion 32 is divided into a plurality of circumferentially spaced portions, and the fixing portion 32 is clamped on the flange portion 1c. The sealing ring 91 can be omitted, so that the pressure edge 311 can be directly pressed downward to the step surface 5c. The upper cover 5 also includes at least one circle of thin shell-shaped connecting portions 531 whose radial inner and outer side edges are respectively connected to the upper end of the surrounding wall 53 and the upper cover body 51. In this way, the surrounding wall 53 and the connecting portion 531 can have a relatively high longitudinal expansion and contraction deformation capacity as a whole, so that the lower end of the surrounding wall 53 elastically abuts against the upper side surface of the substrate 41, so as to avoid excessive pressure and excessive deformation of the substrate 41 when the lower end edge of the surrounding wall 53 abuts against the upper side surface of the substrate 41. In addition, the clearance hole 42a not only allows the support plate 111 to pass longitudinally, but also allows the expansion portion 22 to pass longitudinally, so that the edge portion of the upper surface of the substrate 42 can be pre-bonded to the lower surface of the main body 33 and then assembled to the pressure interface 1 together with the support seat 3.

[0061] Preferably, the radial inner edge and radial outer edge of the connecting portion 531 are at different upper and lower heights, and the lower edge of the connecting portion 531 is connected to the upper cover body 51, and the upper edge of the connecting portion 531 is connected to the upper end of the surrounding wall 53, thereby further improving the longitudinal expansion and contraction deformation capacity of the surrounding wall 53 and the connecting portion 531 as a whole.

[0062] See also Figure 7 Compared with the first embodiment, in the pressure sensor shown in the second variation of the first embodiment, the upper edge of the holding hole 51a protrudes upward to form an extension portion 511, thereby increasing the longitudinal height of the holding hole 51a to better hold the spring terminal 8. In particular, when the height of the holding hole 51a is sufficient, the spring terminal 8 can be inserted into the holding hole 51a first, and the spring terminal 8 can be held in a vertical state through the holding hole 51a. In addition, the clearance hole 42a not only allows the support plate 111 to pass longitudinally, but also allows the expansion portion 22 to pass longitudinally, so that the edge portion of the upper side surface of the substrate 42 can be pre-fixed to the lower side surface of the main body 33, and then assembled to the pressure interface 1 together with the support seat 3. Among them, the anti-slip portion 321 protruding radially inward can be formed on the fixing portion 32 by pressing or the like, so that the substrate 42 is pressed to the lower end surface 1f of the main body 33 by the anti-slip portion 321. At this time, it is preferable to construct the anti-detachment portion 321 into a plurality of circumferentially spaced portions, so that when the substrate 42 is mounted to the main body 33, the anti-detachment portion 321 is easily elastically deformed to allow the substrate 42 to pass over the anti-detachment portion 321. In addition, the upper end edge of the retaining hole 51a may protrude upward to form an extension portion 511, and a recess 7c for accommodating the extension portion 511 is correspondingly formed in the electrical connector 7.

[0063] It is easy to understand that the pressure sensitive element 2 can also use an elastic diaphragm made of ceramic or other suitable materials instead of a metal elastic diaphragm, and the upper surface of the elastic diaphragm is insulated with a thick film resistor or a semiconductor strain gauge or other types of piezoresistive pressure sensing circuit 200; other capacitive pressure sensitive elements, such as ceramic capacitive pressure sensitive elements, can also be used. These elastic diaphragms can be sealed and fixed to the inner end of the pressure introduction channel 100 by pressure sealing or adhesive sealing. These pressure sensitive elements preferably have a suitable area to receive the gel overflowing into the gap 201, just like the above-mentioned metal elastic diaphragm 20.

[0064] In some other solutions, preferably, the lower side surface of the substrate 42 can be bonded to the upper end surface 1 d instead of being bonded or clamped to the lower end surface of the main body 33 .

[0065] See also Figure 8 to Figure 10 . Compared with the electronic module assembly 10 of the first embodiment, in the second embodiment, the electronic module assembly 10, the surrounding wall 51d surrounds the inner cavity of the surrounding wall 53 on the periphery of the cavity 5a, so that the inner cavity of the surrounding wall 53 is isolated from the cavity 5a, instead of the surrounding wall 51d surrounding the inner cavity of the surrounding wall 51d inside the cavity 5a as in the first embodiment. Compared with the first embodiment, the retaining hole 51a and the surrounding wall 51d of this embodiment are relatively arranged at the edge position of the upper cover body 51. Moreover, the radial inner side of the surrounding wall 51d shares at least a part with the surrounding wall 52, so that the groove 51b can be omitted. The advantage of doing so is that the complexity of gluing and the amount of sealant used can be reduced.

[0066] More preferably, a notch 511a is provided on the side wall of one side of the radial outer end of the retaining hole 51a, which passes through from top to bottom and has a circumferential angle less than half a circle. In this way, while the retaining hole 51a retains the lower part of the spring terminal 8, the available area of ​​the substrate 41 can be relatively increased, further reducing the complexity of gluing and the amount of sealant used.

[0067] See also Figure 11-12 Compared with the electronic module assembly 10 of the second embodiment, in the third embodiment, the spring terminal 8 may include an upper section 81 and a lower section 82 whose axes are both vertically arranged. The upper section 81 is located radially inside the lower section 82. The spring terminal 8 also includes a transition section 83 for integrally connecting the upper section 81 and the lower section 82 in the radial direction. The lower section 82 includes at least one sparsely coiled elastic portion 82a, and the upper section 81 may include a first portion 81a with a smaller outer diameter, a second portion 81b with a larger outer diameter located below the first portion 81a, and a transition portion 81c that transitionally connects the two. Preferably, the first portion 81a and the transition portion 81c are tightly coiled and have a certain rigidity, and the second portion 81b is sparsely coiled and has a certain elasticity.

[0068] During assembly, the upper portion of the upper section 81 is held in the holding hole 7b of the electrical connector 7, and at least a portion of the lower section 82 is held in the holding hole 51a of the upper cover body 51. The advantage of this is that the radially outer electrical contact portion 411 can have a radially inner plugging position when connected to an external device through the spring terminal 8 having several sections with different radial positions, so as to better meet the existing standards.

[0069] like Fig.13 As shown, in a variation, preferably, a support portion for supporting the upper section 81 and / or the transition section 83 upward is formed on the upper cover body 51. More preferably, a positioning portion for positioning the upper section 81 and / or the transition section 83 on a horizontal plane is formed on the upper cover body 51, and the positioning portion may include a positioning groove formed at the top end of the upper cover body 51 to surround the outside of the lower end of the upper section 81. The positioning portion includes a positioning protrusion 51c formed at the top end of the upper cover body 51 to extend into the lower end of the upper section 81. In addition, in order to enable the step surface 5c to form a full circle in the circumferential direction so as to better form a better seal with the pressure edge 311 through the sealing ring 91, the upper cover body 51 forms an arc-shaped groove 5e on the radial inner side of the retaining hole 51a. The bottom surface of the arc-shaped groove 5e constitutes a part of the upper cover body 51.

[0070] Please refer to Figure 14-15 Compared with the first embodiment, in the fourth embodiment, the pressure sensitive element 2 is a small pressure sensitive element, such as a semiconductor pressure sensitive element (such as a pressure chip) or a surface mounted pressure sensitive element, or other pressure sensitive elements suitable for being mounted on the substrate 41. The electronic module assembly 10 and the pressure sensitive element 2 can be collectively referred to as a pressure measurement assembly 30.

[0071] At this time, the lead connecting the pressure sensitive element 2 and the electrical contact portion 413 on the upper surface of the substrate 41 is completely located on the upper side of the substrate 41. Therefore, there is no need to set a gap between the upper surface of the pressure sensitive element 2 and the lower surface of the substrate 41 as in the first embodiment to avoid the deformation of the metal elastic diaphragm. At this time, the size of the via 41a mainly depends on the lateral size of the pressure sensitive element 2, and the gel 400 is only filled in the cavity 5b, not in the via 41a. A signal conditioning module can also be integrated in the pressure chip. Among them, the substrate 41 can be a ceramic plate, so that it can be used as a substrate with suitable mechanical strength suitable for installing the pressure sensitive element 2, and can also be used as a substrate for a printed circuit.

[0072] See also Fig.16The signal processing circuit disposed on the substrate may refer to a circuit directly printed on the surface of the substrate, or may be indirectly disposed on the substrate. For example, a dielectric layer or an intermediate substrate 414 may be disposed on the substrate, and the circuit may be directly disposed on the dielectric layer or the intermediate substrate. In addition, a waterproof and breathable membrane 501 may be bonded to the upper end surface of the hole 5d. While preventing water vapor from entering the cavity 5b, the hole 7b is connected to the environment through the gap between the electrical connector 7 and the upper cover 5, so as to introduce an environmental reference pressure on the upper surface of the metal elastic diaphragm 20, thereby measuring the relative pressure of the pressure medium to be measured relative to the environment, that is, the gauge pressure.

[0073] See also Fig.17 . The pressure sensor of the fourth embodiment includes a housing, the housing includes an electrical connector 7 and a pressure interface 1, and the pressure interface 1 is provided with a pressure introduction channel 100 for connecting to the interior of the housing. The pressure interface 1 can be made of metal, and its edge extends upward to form a circle of cylindrical shell 6, and the pressing edge formed on the upper end of the cylindrical shell 6 presses downward on an upward step surface 7a formed on the electrical connector 7. The electrical connector 7 presses the step surface 5c of the upper cover 5 downward, thereby pressing the substrate 41 downward. The lower side surface of the substrate 41 is sealedly connected to the through hole 41a at one end of the pressure introduction channel 100 of the substrate 41 through a sealing ring 94 in a circle of sealing grooves provided on the pressure interface 1.

[0074] See also Fig.17 The pressure sensor of the fifth embodiment, based on the fourth embodiment, provides downward pressing force on the upper cover 5 through a cylindrical shell 60 disposed inside the cylindrical shell 6. The lower end of the cylindrical shell 60 can be integrally connected to the pressure interface 1, and the upper end of the cylindrical shell 60 can be bent inward to form a pressing edge 601 for pressing the step surface 5c downward.

[0075] In some other solutions, the pressure interface 1 may also be made of plastic, and the electrical connector 7 is connected to the pressure interface 1 via a snap-fit ​​connection to provide a downward pressing force on the upper cover 5 .

[0076] The clearance hole 42a, the connecting flange 11, the supporting plate 111, the metal elastic diaphragm 20, and the clearance hole 33a may be circular in cross-sectional shape on the transverse plane and are all concentrically arranged.

[0077] The scope of the disclosure is defined not by the detailed description but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents are construed as being included in the disclosure.

Claims

1. An electronic module assembly, characterized in that: include: A first substrate (41) is arranged longitudinally along the up-down direction in its thickness direction, and a signal processing circuit (43) is arranged on its upper surface; The upper cover (5) comprises an upper cover body (51) and a circle of first surrounding walls (52) and a circle of second surrounding walls (53) extending downward from the upper cover body (51) and having a lower end sealed and bonded to the upper surface of the first substrate (41); the second surrounding wall (53) surrounds the first surrounding wall (52) and forms a first cavity (5a) for accommodating at least a part of the electronic components (431) of the signal processing circuit (43) between the second surrounding wall (53) and the first surrounding wall (52); the second cavity (5b) formed inside the second surrounding wall (53) is connected to the upper side of the upper cover body (51) through a hole (5d) provided on the upper cover body (51), and the second cavity (5b) is connected to the lower side of the first substrate (41) through a via hole (41a) provided on the first substrate (41); The lower end of the spring terminal (8) is electrically contacted to the signal processing circuit (43), and the lower part is retained in a first retaining hole (51a) which is provided on the upper cover body (51) and passes through the upper and lower parts. The lower end edge of the first retaining hole (51a) extends downward to form a circle of third surrounding wall (51d), and the lower end of the third surrounding wall (51d) is sealed and bonded to the upper surface of the first substrate (41).

2. The electronic module assembly according to claim 1, characterized in that: The third surrounding wall (51d) encloses an inner cavity of the third surrounding wall (51d) inside the first cavity (5a), and the inner cavity of the third surrounding wall (51d) is isolated from other parts of the first cavity (5a).

3. The electronic module assembly according to claim 1, characterized in that: The upper end edge of the first retaining hole (51a) protrudes upward to form an extension portion (511).

4. The electronic module assembly according to claim 1, characterized in that: The lower end surface of the second surrounding wall (53) is provided with a circle of first grooves (53a) for accommodating sealant, and the lower end surface of the third surrounding wall (51d) is provided with a circle of second grooves (51b) for accommodating sealant, and a plurality of the second grooves (51b) are laterally connected to the first grooves (53a).

5. The electronic module assembly according to claim 4, characterized in that: The second surrounding wall (53) and the third surrounding wall (51d) have at least one common portion.

6. The electronic module assembly according to claim 1, characterized in that: The lower end of the second surrounding wall (53) elastically abuts against the first base plate (41).

7. The electronic module assembly according to claim 6, characterized in that: The upper cover (5) further comprises at least one circle of thin shell-shaped connecting parts (531) whose radial inner and outer side edges are connected one-to-one to the upper end of the second surrounding wall (53) and the upper cover body (51).

8. The electronic module assembly according to any one of claims 1 to 7, characterized in that: The upper cover body (51) is formed with a circle of stepped surface (5c) for bearing downward pressing force.

9. A pressure sensor, characterized in that: include: The housing comprises a metal cylindrical shell (6) extending longitudinally, a metal pressure interface (1) sealedly fixed to the lower end of the cylindrical shell (6), and an electrical connector (7) whose lower end extends into the cylindrical shell (6); a pressure introduction channel (100) is provided on the pressure interface (1); a second retaining hole (7b) is provided in the electrical connector (7) for retaining the upper part of the spring terminal (8) and pressing the upper part of the spring terminal (8) downward; A pressure sensitive element (2) disposed inside the housing and fixedly sealed at one end of the inner side of the pressure introduction channel (100), the upper surface of which is close to the lower surface of the first substrate (41) and a gap (201) is left between the lower surface of the first substrate (41), and the pressure sensitive element (2) is electrically connected to the signal processing circuit (43) via a lead passing through the via hole (41a); A support seat (3) disposed inside the housing and fixed to the pressure interface (1); And the electronic module assembly as claimed in any one of claims 1 to 8, which is fixed on the support base (3); the spring terminal (8) is pressed downward by the electrical connector (7) and electrically connected to the signal processing circuit (43).

10. The pressure sensor according to claim 9, characterized in that: The pressure sensitive element (2) comprises a horizontally extending metal elastic diaphragm (20) and a pressure sensing circuit (200) arranged on the upper surface of the metal elastic diaphragm (20) and electrically connected to the signal processing circuit (43) through the lead wire, and the second cavity (5b) is filled with a gel (400) covering the lead wire, and the gel (400) partially overflows into the gap (201) to at least partially cover the pressure sensing circuit (200).

Images