Chip routing photographing detection device

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a chip routing photographing detection device which comprises a machine shell, a belt conveying assembly used for conveying chips is arranged on the machine shell, and three partition plates are slidably connected to the top of the machine shell from left to right at intervals so as to divide the interior of the machine shell into three cavities. A lifting assembly for driving the partition plate to ascend and descend is arranged on the top of the machine shell, a supporting table for supporting a chip is connected to the left side of the bottom of the inner side of the machine shell, and a routing photographing mechanism is arranged in the left cavity. An image of the surface of the chip is reflected to the second reflective mirror through the first reflective mirror, and then the image of the surface of the chip on the second reflective mirror is shot through the first camera. The second motor can drive the mirror base to drive the second reflectors to rotate to be sequentially aligned with the first reflectors on the uppermost side of the periphery, so that the first camera can shoot images of the surface of the periphery of the chip, comprehensive shooting detection of the outer surface of the chip is achieved, the detection comprehensiveness is improved, and the accuracy and reliability of the detection result are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a chip wire bonding photographing detection device. Background Art

[0002] As electronic components are rapidly developing towards miniaturization, chip-based and high-performance, chip appearance defect detection has become an important part of electronic component quality assurance. Usually, after the chip is implanted and soldered, the chip appearance needs to be inspected. Appearance inspection is an important part of chip production. Functional defects caused by chip appearance defects can be avoided through appearance inspection.

[0003] After searching, Chinese patent with patent publication number CN108709894A discloses a chip wire bonding detection method, and Chinese patent with patent publication number CN114950991A discloses a detection mechanism and a corresponding IC chip detection device.

[0004] Although the above patent can detect the appearance of the chip, during the chip wire bonding inspection process, the light source shines on the chip surface from top to bottom to form different reflections on the chip surface. The camera is tilted from one side to shoot and collect data. It can only capture the surface image of one side of the chip, and cannot fully capture the outer surface of the wire bonding inspection chip, resulting in insufficient data collection, affecting the comprehensiveness of the inspection, and thus affecting the accuracy and reliability of the inspection results. Summary of the invention

[0005] The purpose of the present invention is to provide a chip bonding camera inspection device capable of comprehensively photographing and inspecting the outer surface of the chip in order to solve the above-mentioned problem.

[0006] The present invention achieves the above-mentioned purpose through the following technical solutions: a chip wire bonding camera detection device, including a housing, a belt conveyor assembly for conveying chips is provided on the housing, three partitions are slidably connected at intervals from left to right on the top of the housing to divide the inside of the housing into three chambers, a lifting assembly for driving the partitions to rise and fall is provided on the top of the housing, a support table for supporting chips is connected to the left side of the bottom of the inner side of the housing, a wire bonding camera mechanism is provided in the left chamber, the wire bonding camera mechanism includes a connecting frame connected to the top of the inner side of the left chamber, a pipe rack is connected to the upper part of the connecting frame, and the outer sides of the pipe rack are all connected to the mounting shell, Reflector 1 is installed around the inside of the tube rack and in the mounting shell. There are two upper and lower reflectors around the inside of the tube rack. Motor 2 is installed on the upper part of the connecting frame. The output shaft of motor 2 is connected to a mirror seat located in the tube rack. Reflector 2 is installed in the mirror seat. Reflector 2 is flush with the upper reflector 1 in the tube rack. The mounting shell, reflector 1 and reflector 2 form an angle of 45° with the horizontal plane. Camera 1 is installed in the tube rack and is located directly above reflector 2. A fixing plate is connected to the bottom of the connecting frame, a ring light source is installed at the bottom of the fixing plate, and a cube light source located at the center of the ring light source is installed at the bottom of the fixing plate.

[0007] Preferably, a cleaning mechanism for cleaning chips is provided on the right side of the casing, the cleaning mechanism includes two left and right rotating shafts rotatably connected to the upper right side of the casing, the rotating shaft is located to the right of the right partition, and two front and rear flat belts are arranged between the two rotating shafts through a pulley, and a mounting plate is connected between the two flat belts at uniform intervals along their movement trajectory, and three lifting rods are arranged on the mounting plate from front to back, and a sponge rod is connected to the bottom end of the lifting rod, and a pushing assembly for pushing the lifting rod to rise and fall is provided in the chamber on the right, and the belt conveying assembly is connected to the right rotating shaft through a transmission assembly to drive the right rotating shaft to rotate, and two front and rear jet pipes are connected in the chamber on the right, the front jet pipe sprays toward the rear and downward, and the rear jet pipe sprays toward the front and downward, and a circulating pump is installed on the right front side of the casing, and the circulating pump is connected to the jet pipe through an air supply pipe.

[0008] Preferably, the pushing assembly includes two left and right connecting plates connected in the chamber on the right side, three groups of wave rods are connected between the two connecting plates at intervals from front to back, a contact rod is connected to the top of the lifting rod, the three rows of contact rods from the front to the back are respectively in contact with the three groups of wave rods from the front to the back, the raised ends on each group of wave rods are arranged alternately, and a spring is connected between the lifting rod and the mounting plate.

[0009] Preferably, the transmission assembly includes a transmission shaft rotatably connected to the right front side of the casing, the transmission shaft is transmission-connected to the belt conveyor assembly through a belt transmission assembly, and the transmission shaft is transmission-connected to the right rotating shaft through a gear set.

[0010] Preferably, a dust hood is installed in the chamber on the right side, and the dust hood is connected to the circulation pump through an exhaust pipe.

[0011] Preferably, a blocking net that can be pulled out backwards is provided in the dust hood, and the blocking net is used to block impurities.

[0012] Preferably, a correction mechanism is provided on the support platform, which is located in the middle chamber. The correction mechanism includes a glass plate embedded on the right side of the top of the support platform, a mounting cover is connected to the right side of the inner bottom of the support platform, and a camera 2 is installed on the inner bottom of the mounting cover, which is located directly below the glass plate. A three-axis moving platform is provided on the right side of the top of the support platform, a motor 3 is installed on the three-axis moving platform, an electric suction cup is installed on the output shaft of the motor 3, light strips are installed around the bottom of the lifting platform of the three-axis moving platform, and the conveyor belt on the belt conveyor assembly is made of transparent material.

[0013] Preferably, the lifting assembly comprises an electric push rod installed on the top of the casing, a lifting plate is connected to the telescopic rod of the electric push rod, and the lifting plate is connected to the upper part of the three partitions.

[0014] Preferably, brushes are connected at intervals to the inner bottom of the housing, and the brushes are used to clean the conveyor belt on the belt conveyor assembly.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The image of the chip surface is reflected to the second reflector through the first reflector, and then the chip surface image on the second reflector is photographed by the second camera. The second motor can drive the mirror seat to drive the second reflector to rotate, and align with the topmost first reflector on the surrounding sides in turn, so that the first camera can capture the image of the surface of the chip around, realize the comprehensive shooting and detection of the outer surface of the chip, improve the comprehensiveness of the detection, and thus improve the accuracy and reliability of the detection results.

[0017] 2. Through the cooperation of the jet pipe, circulation pump, dust hood and barrier net, the chip can be cleaned before being transported to the detection area to prevent impurities from affecting the accuracy of chip imaging and the accuracy of detection results, thereby further improving the accuracy and reliability of the detection results.

[0018] 3. The cooperation of camera 2, three-axis mobile platform, motor 3 and electric suction cup can correct the position of the chip before transporting it to the detection area, avoiding the influence of chip position deviation on the accuracy of the detection result, thereby further improving the accuracy and reliability of the detection result. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0020] Figure 2 It is a partial three-dimensional structural schematic diagram of the present invention.

[0021] Figure 3 It is a schematic diagram of the installation of the wire-bonding and photographing mechanism of the present invention.

[0022] Figure 4 It is a three-dimensional structural schematic diagram of the wire-punching and photographing mechanism of the present invention.

[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the fixing plate, the cubic light source and the ring light source of the present invention.

[0024] Figure 6 It is a three-dimensional structural schematic diagram of the cleaning mechanism of the present invention.

[0025] Figure 7 It is a partial three-dimensional structural schematic diagram of the cleaning mechanism of the present invention.

[0026] Figure 8 It is a schematic diagram of the installation of the deviation correction mechanism of the present invention.

[0027] Fig. 9 The figure is a connection diagram of the three-axis mobile platform, the motor and the electric suction cup of the present invention.

[0028] Fig.10 It is a connection diagram of the motor and the electric suction cup of the present invention.

[0029] Fig.11 The figure is a connection diagram of the three-axis mobile platform, the motor, the electric suction cup and the annular light strip of the present invention.

[0030] Serial numbers in the figure: 1- housing, 2- partition, 21- support platform, 22- brush, 31- electric push rod, 32- lifting plate, 41- rotating shaft, 42- conveyor belt, 43- motor 1, 51- connecting frame, 52- pipe rack, 521- vertical pipe, 522- Z-shaped pipe, 53- installation shell, 54- reflector 1, 55- motor 2, 56- mirror seat, 57- reflector 2, 58- camera 1, 59- fixing plate, 510- cube light source, 511- ring light source, 61- rotating shaft, 62- flat belt , 63-mounting plate, 64-lifting rod, 65-sponge rod, 66-connecting plate, 67-wave rod, 68-contact rod, 69-spring, 610-drive shaft, 611-belt drive assembly, 612-gear set, 613-jet pipe, 614-circulation pump, 615-air pipe, 71-dust hood, 72-exhaust pipe, 73-barrier net, 81-glass plate, 82-mounting cover, 83-camera two, 84-three-axis mobile platform, 85-motor three, 86-electric suction cup, 87-light strip. DETAILED DESCRIPTION

[0031] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0032] See also Figure 1-Figure 5 A chip wire bonding camera detection device includes a housing 1, a belt conveyor assembly for conveying chips is provided on the housing 1, the belt conveyor assembly includes two rotating shafts 41 rotatably connected to the outside of the left and right sides of the housing 1, a conveyor belt 42 is sleeved between the two rotating shafts 41 through a pulley, a motor 43 is installed on the left front side of the housing 1, the output shaft of the motor 43 is connected to the left rotating shaft 41, three partitions 2 are connected to the top of the housing 1 from left to right in a sliding manner to divide the inside of the housing 1 into three chambers, a lifting assembly for driving the partition 2 to rise and fall is provided on the top of the housing 1, and the lifting assembly includes an electric push rod 3 installed on the top of the housing 1 1, a lifting plate 32 is connected to the telescopic rod of the electric push rod 31, and the shape of the lifting plate 32 is H-shaped. The lifting plate 32 is connected to the upper part of the three partitions 2 and is located above the casing 1. The left side of the bottom of the inner side of the casing 1 is connected to a support table 21 for supporting chips. The top of the conveyor belt 42 is located on the upper side of the support table 21 and contacts the support table 21. The lower side of the conveyor belt 42 passes through the support table 21. A wire bonding and photographing mechanism is provided in the left chamber. The wire bonding and photographing mechanism includes a connecting frame 51 connected to the top of the inner side of the left chamber. The upper part of the connecting frame 51 is connected to a pipe rack 52. The pipe rack 52 includes a vertical pipe 521 and a Z-shaped pipe 522. The vertical pipe 521 is connected to the left chamber. The upper part of the connecting frame 51 is connected to the outer wall of the vertical tube 521. The lower part of the Z-shaped tube 522 away from the vertical tube 521 is connected to the mounting shell 53. The mounting shell 53 and the Z-shaped tube 522 are both installed with a reflector 1 54. The reflector in the Z-shaped tube 522 is provided with two upper and lower ones. The upper part of the connecting frame 51 is installed with a motor 2 55. The output shaft of the motor 2 55 is connected to a mirror seat 56 located in the vertical tube 521. The mirror seat 56 is installed with a reflector 2 57. The reflector 2 57 is flush with the upper reflector 1 54 in the vertical tube 521. The mounting shell 53, the reflector 1 54 and the reflector 2 57 are aligned with the horizontal plane. The angles are all 45°. A camera 58 is installed in the vertical tube 521, which is located just above the reflector 2 57. A fixing plate 59 is connected to the bottom of the connecting frame 51. A ring-shaped light source 511 is installed at the bottom of the fixing plate 59. A cube light source 510 located at the center of the ring-shaped light source 511 is installed at the bottom of the fixing plate 59. The light emitted by the cube light source 510 forms an angle of 90° with the horizontal plane. First lamp beads are evenly distributed on the outer circle of the ring-shaped light source 511, and the light emitted by the first lamp beads forms an angle of 90° with the horizontal plane. Second lamp beads are evenly distributed on the inner circle of the ring-shaped light source 511, and the light emitted by the first lamp beads forms an angle of 15° with the horizontal plane.

[0033] The control motor 1 43 drives the rotating shaft 41 to rotate intermittently, thereby driving the conveyor belt 42 to rotate intermittently, so as to intermittently convey the chip to be tested to the left directly below the fixed plate 59. Before conveying the chip to the left, the control electric push rod 31 drives the lifting plate 32 to drive the partition 2 to move up to prevent the partition 2 from blocking the chip from being conveyed to the left. After the chip stops conveying, the control electric push rod 31 drives the lifting plate 32 to drive the partition 2 to move down and reset. The chip can be illuminated by the cube light source 510 and the ring light source 511 to ensure uniform illumination on the chip surface. The reflector 1 54 reflects the image of the chip surface to the reflector 2 57, and then the image of the chip surface on the reflector 2 57 is photographed by the camera 1 58, and the image information is transmitted to the background for comparison and detection. When the reflector 2 57 is aligned with the reflector 1 54 at the upper front, the reflector 2 57 displays the image of the front side of the chip. The control motor 2 55 drives the mirror holder 56 to rotate, so as to drive the reflector 2 57 to rotate, and align it with the reflector 1 54 at the upper left, upper rear and upper right in turn. The reflector 2 57 can display the images of the left side, rear side and right side of the chip in turn, so that the camera 1 58 can capture the images of the surrounding surfaces of the chip, realize comprehensive shooting and detection of the outer surface of the chip, improve the comprehensiveness of the detection, and thus improve the accuracy and reliability of the detection results.

[0034] See also Figure 1 , Figure 2 , Figure 6 and Figure 7A cleaning mechanism for cleaning the chips is provided on the right side of the housing 1. The cleaning mechanism includes two left and right rotating shafts 61 rotatably connected to the upper right side of the housing 1. The rotating shaft 61 is located on the right side of the right partition 2. Two front and rear flat belts 62 are sleeved between the two rotating shafts 61 through a pulley. A mounting plate 63 is evenly spaced between the two flat belts 62 along their motion trajectory. Three lifting rods 64 are slidably provided on the mounting plate 63 from front to back. A sponge rod 65 is connected to the bottom end of the lifting rod 64. A sponge rod 65 is provided in the chamber on the right side for pushing the lifting rod 6 The lifting and lowering push assembly includes two left and right connecting plates 66 connected to the chamber on the right side. Three groups of wave rods 67 are connected between the two connecting plates 66 from front to back. The number of each group of wave rods 67 is two. The two wave rods 67 in each group are arranged front and back. The top of the lifting rod 64 is connected to a contact rod 68. The three rows of contact rods 68 from front to back are respectively in contact with the three groups of wave rods 67 from front to back. The convex ends of each group of wave rods 67 are arranged in a staggered manner. The lifting rod 64 is covered with a spring 69. Both ends of the spring 69 The right rotating shaft 41 is connected to the right rotating shaft 61 through a transmission assembly, and the transmission assembly includes a transmission shaft 610 rotatably connected to the right front side of the housing 1. The transmission shaft 610 is connected to the right rotating shaft 41 through a belt transmission assembly 611. The belt transmission assembly 611 consists of two pulleys and a belt. The two pulleys are respectively connected to the front sides of the transmission shaft 610 and the right rotating shaft 41. The belt is sleeved between the two pulleys. The transmission shaft 610 is connected to the right rotating shaft 41 through a gear set 612. The driving shaft 61 is connected for transmission, and the gear set 612 consists of two gears, which are respectively connected to the front side of the transmission shaft 610 and the right rotating shaft 61, and the two gears are meshed. The right chamber is connected with two front and rear jet pipes 613, the front jet pipe 613 sprays toward the rear and downward, and the rear jet pipe 613 sprays toward the front and rear and downward. A circulation pump 614 is installed on the right front side of the casing 1, and the circulation pump 614 is connected to the jet pipe 613 through an air pipe 615. There is a gap between the conveyor belt 42 and the inner walls on the front and rear sides of the casing 1 for impurities to fall.

[0035] During the wire bonding detection process, there may be floating dust or impurities attached to the chip surface. These impurities will cause obstruction during the shooting process, resulting in unclear imaging, affecting the accuracy of chip imaging, and further affecting the accuracy of the detection results. The circulating pump 614 is controlled to work to input gas into the jet pipe 613 through the gas pipe 615. The jet pipe 613 then sprays gas to the chip, and uses the airflow to blow away the impurities on the chip surface to achieve the cleaning of the impurities on the chip surface. In this way, the device can clean the chip before transporting the chip to the detection area to prevent impurities from affecting the accuracy of chip imaging and the accuracy of detection results, thereby further improving the accuracy and reliability of the detection results. The right-side rotating shaft 41 rotates through the belt transmission assembly 611 to drive the transmission shaft 610 to rotate, and the transmission shaft 610 rotates through the gear set 612 to drive the right-side rotating shaft 61 to rotate, and the right-side rotating shaft 61 rotates to drive the flat belt 62 to rotate, and the flat belt 62 rotates through the mounting plate 63 to drive the lifting rod 64 to move along the wave rod 67. When the contact rod 68 moves to the raised end of the wave rod 67, the contact rod 68 is pushed upward by the raised end of the wave rod 67, thereby driving the lifting rod 64 upward and stretching the spring 69. When the contact rod 68 moves to the recessed end of the wave rod 67, under the reset action of the spring 69, the lifting rod 64 is pulled down with the sponge rod 65 to press the chip and fix it on the conveyor belt 42, so as to prevent the chip from being displaced by the wind. In this way, through the cooperation of the wave rod 67 and the contact rod 68, the sponge rod 65 can be intermittently lifted to avoid the generation of cleaning dead corners, and because the raised ends on each group of wave rods 67 are arranged in a staggered manner, the sponge rod 65 can be lifted in batches to ensure that the chip is effectively fixed on the conveyor belt 42.

[0036] See also Figure 2 and Figure 6 A dust hood 71 located on the inner side of the conveyor belt 42 is installed in the chamber on the right side. The dust hood 71 is connected to the circulation pump 614 through an exhaust pipe 72. A blocking net 73 that can be pulled out backwards is slidably provided in the dust hood 71.

[0037] The circulation pump 614 can draw the gas in the right chamber into the dust hood 71, and the impurities enter the dust hood 71 and are blocked by the blocking net 73. The clean gas filtered by the blocking net 73 is input into the jet pipe 613 through the gas pipe 615, so that the impurities can be filtered and collected to prevent the jet pipe 613 from spraying the impurities back onto the chip, thereby ensuring that the dust or impurities on the surface of the chip are cleaned.

[0038] See also Figure 2 , Figure 8 , Fig. 9 , Fig.10 and Fig.11As shown, a correction mechanism is provided on the support platform 21, and the correction mechanism is located in the middle chamber. The correction mechanism includes a glass plate 81 embedded in the top right side of the support platform 21, and a mounting cover 82 is connected to the right side of the inner bottom of the support platform 21. A camera 2 83 located directly below the glass plate 81 is installed on the inner bottom of the mounting cover 82. A three-axis moving platform 84 is provided on the top right side of the support platform 21, and a motor 3 85 is installed on the three-axis moving platform 84. The three-axis moving platform 84 can drive the motor 3 85 to move in three axes: up, down, front, back, left, and right. An electric suction cup 86 is installed on the output shaft of the motor 3 85. Light strips 87 are installed around the bottom of the lifting platform of the three-axis moving platform 84, and the conveyor belt 42 is a PCV transparent conveyor belt.

[0039] When the chip to be tested is placed on the conveyor belt 42 and transported to the left, the chip is prone to deflection, resulting in position deviation. The chip position deviation will affect the accuracy of the test results and the reliability and comparability of the data. When the chip to be tested is transported to the left to the top of the glass plate 81, the chip above the glass plate 81 is photographed by the second camera 83, and the image information is transmitted to the background for comparison. The chip is illuminated by the light strip 87 to ensure that the camera 2 83 takes a clear picture. If the chip to be tested is deflected, the controller controls the three-axis mobile platform 84 to drive the motor three 85 with the electric suction cup 86 to move down and contact the chip. The controller is not shown in the figure. The controller is a prior art and is not repeated here. Then the controller controls the electric suction cup 86 to suck the chip, and then the controller controls the three-axis mobile platform 84 to drive the motor three 85 with the electric suction cup 86 to move up to drive the chip to move up. Then the controller controls the three-axis mobile platform 84 to drive the motor three 85 with the electric suction cup 86 to adjust the position in the left and right and front and back directions to correct the chip so that the chip position is centered. If the chip is skewed, the controller controls the motor three 85 to drive the electric suction cup 86 to rotate, and the rotation of the electric suction cup 86 drives the chip to rotate and align, thereby achieving the correction, alignment and centering of the chip. After the chip is corrected, the controller controls the three-axis mobile platform 84 to drive the motor three 85 with the electric suction cup 86 to move down, and put the corrected chip back on the conveyor belt 42. Then the controller controls the electric suction cup 86 to release the chip. Finally, the controller controls the three-axis mobile platform 84 to drive the motor three 85 with the electric suction cup 86 to move and reset to the initial state. If the position of the chip to be detected is correct, the controller will not control the three-axis mobile platform 84, the motor three 85 and the electric suction cup 86 to work. In this way, the device can correct the position of the chip before conveying it to the detection area to avoid the chip position deviation affecting the accuracy of the detection result, thereby further improving the accuracy and reliability of the detection result.

[0040] See also Figure 2Four brushes 22 are connected to the inner bottom of the casing 1 at intervals from left to right. The brushes 22 are located on the lower side of the conveyor belt 42 and in contact with the conveyor belt 42. When the conveyor belt 42 rotates, the conveyor belt 42 can be cleaned by the brushes 22 to ensure the cleanliness of the surface of the conveyor belt 42 and avoid affecting operations such as light transmission and lighting.

[0041] The above-mentioned embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for those skilled in the art, several modifications, improvements and substitutions can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A chip bonding camera inspection device, comprising a housing (1), on which a belt conveyor assembly for conveying chips is provided, characterized in that: The top of the housing (1) is connected with three partitions (2) in a sliding manner from left to right to separate the inside of the housing (1) into three chambers. The top of the housing (1) is provided with a lifting assembly for driving the partitions (2) to rise and fall. The left side of the bottom of the inner side of the housing (1) is connected with a support table (21) for supporting chips. The left chamber is provided with a wire bonding and photographing mechanism. The wire bonding and photographing mechanism includes a connecting frame (51) connected to the top of the inner side of the left chamber. The upper part of the connecting frame (51) is connected with a pipe frame (52). The outer sides of the pipe frame (52) are connected with a mounting shell (53). The inner sides of the pipe frame (52) and the mounting shell (53) are all provided with a reflector (54). The inner sides of the pipe frame (52) and the mounting shell (53) are provided with two upper and lower reflectors. The connecting frame (51) is provided with a reflector (54). A second motor (55) is installed on the upper part, and a mirror seat (56) located in the pipe frame (52) is connected to the output shaft of the second motor (55), and a second reflector (57) is installed in the mirror seat (56). The second reflector (57) is flush with the first reflector (54) on the upper side of the pipe frame (52), and the angles between the mounting shell (53), the first reflector (54) and the second reflector (57) and the horizontal plane are all 45 degrees. A camera (58) located directly above the second reflector (57) is installed in the pipe frame (52), and a fixing plate (59) is connected to the bottom of the connecting frame (51), and an annular light source (511) is installed at the bottom of the fixing plate (59), and a cubic light source (510) located at the center of the annular light source (511) is installed at the bottom of the fixing plate (59).

2. A chip bonding camera detection device according to claim 1, characterized in that: A cleaning mechanism for cleaning the chips is provided on the right side of the housing (1), the cleaning mechanism comprising two left and right rotating shafts (61) rotatably connected to the upper right side of the housing (1), the rotating shaft (61) being located to the right of the right partition (2), two front and rear flat belts (62) being sleeved between the two rotating shafts (61) via a belt pulley, a mounting plate (63) being evenly spaced apart between the two flat belts (62) along their motion trajectory, three lifting rods (64) being spaced apart from front to back on the mounting plate (63), a sponge rod ( 65), a pushing assembly for pushing the lifting rod (64) to move up and down is provided in the right chamber, a belt conveying assembly is connected to the right rotating shaft (61) through a transmission assembly to drive the right rotating shaft (61) to rotate, two front and rear jet pipes (613) are connected to the right chamber, the front jet pipe (613) jets toward the rear and downward, and the rear jet pipe (613) jets toward the front and downward, and a circulation pump (614) is installed on the right front side of the housing (1), and the circulation pump (614) is connected to the jet pipe (613) through an air pipe (615).

3. A chip bonding camera detection device according to claim 2, characterized in that: The pushing assembly includes two left and right connecting plates (66) connected in the chamber on the right side, three groups of wave rods (67) are connected between the two connecting plates (66) at intervals from front to back, a contact rod (68) is connected to the top of the lifting rod (64), the three rows of contact rods (68) from front to back are respectively in contact with the three groups of wave rods (67) from front to back, the raised ends on each group of wave rods (67) are arranged in a staggered manner, and a spring (69) is connected between the lifting rod (64) and the mounting plate (63).

4. A chip bonding camera detection device according to claim 3, characterized in that: The transmission assembly comprises a transmission shaft (610) rotatably connected to the right front side of the housing (1); the transmission shaft (610) is transmission-connected to the belt conveyor assembly via a belt transmission assembly (611); and the transmission shaft (610) is transmission-connected to the right rotating shaft (61) via a gear set (612).

5. A chip bonding camera detection device according to claim 4, characterized in that: A dust hood (71) is installed in the right chamber, and the dust hood (71) is connected to the circulation pump (614) through an exhaust pipe (72).

6. A chip bonding camera detection device according to claim 5, characterized in that: A blocking net (73) that can be drawn out backwards is arranged in the dust hood (71), and the blocking net (73) is used to block impurities.

7. A chip bonding camera detection device according to claim 6, characterized in that: A correction mechanism is provided on the support platform (21), and the correction mechanism is located in the middle chamber. The correction mechanism includes a glass plate (81) embedded and installed on the right side of the top of the support platform (21). A mounting cover (82) is connected to the right side of the inner bottom of the support platform (21). A second camera (83) located directly below the glass plate (81) is installed on the inner bottom of the mounting cover (82). A three-axis moving platform (84) is provided on the right side of the top of the support platform (21). A third motor (85) is installed on the three-axis moving platform (84). An electric suction cup (86) is installed on the output shaft of the third motor (85). Light strips (87) are installed around the bottom of the lifting platform of the three-axis moving platform (84). The conveyor belt (42) on the belt conveyor assembly is made of transparent material.

8. The chip bonding camera detection device according to claim 1, characterized in that: The lifting assembly comprises an electric push rod (31) mounted on the top of the housing (1), a lifting plate (32) is connected to the telescopic rod of the electric push rod (31), and the lifting plate (32) is connected to the upper parts of the three partitions (2).

9. A chip bonding camera detection device according to claim 8, characterized in that: The inner bottom of the housing (1) is connected with brushes (22) at intervals, and the brushes (22) are used to clean the conveyor belt (42) on the belt conveyor assembly.

Images