Novel high-speed optical module design scheme based on glass through hole plate

Abstract

The invention discloses a novel high-speed optical module design scheme based on a glass through hole adapter plate. The novel high-speed optical module design scheme based on the glass through hole adapter plate comprises the glass through hole adapter plate (TGVI: Through Glass Via Interposer) and a common organic material board (Printed Circuit Board Assembly (PCBA): Printed Circuit Board Assembly). A key high-speed signal line on a high-speed optical module is arranged on a glass substrate, low-speed signals such as a power supply and control are arranged on a common organic material board, and then the two boards are organically combined through BGA (Ball Grid Array) welding, routing, flat cable or a connector and the like. The performance of a key high-speed signal line on the optical module is improved by utilizing the natural high-frequency characteristic of the glass through hole plate, and meanwhile, the glass through hole plate is used for replacing an expensive high-frequency organic material plate, so that the material cost of the optical module is reduced.

Description

Technical Field

[0001] The present invention relates to a through glass via interposer (TGVI), a co-packaged optoelectronics (CPO), laser bonding, wire bonding, and a high-speed optical module. Background Art

[0002] like Figure 1 The schematic diagram of the design scheme of the high-speed optical module using the existing glass through hole adapter board CPO optical engine is composed of the CPO optical engine glass through hole adapter board 100 TGVI and the organic material board 101 PCBA (Printed Circuit Board Assembly). Most of the key high-speed signal components are placed on the glass through hole adapter board 100 TGVI, including the driver chip 200 Driver, the trans-impedance amplifier chip 201 TIA (Trans-Impedance Amplifier) ​​and the optical chip 202 PIC (Photonics Integration Circuit), with high-speed signal routing and optical signal input and output interfaces. The key high-speed chips of the high-speed optical module, such as the digital signal processor 203 DSP (Digital Signal Processor) and 204 MCU (Micro Control Unit), are placed on the 101 PCBA, and the control, power supply and other low-speed signal components are arranged with high-speed signal routing and low-speed signal routing. The external electrical interface gold fingers 200 Finger 1 and 201 Finger 2 have high-speed and low-speed signal routing. The 100 TGVI and 101 PCBA are connected together through flip chip (FC).

[0003] The existing 101 PCBA has both low-speed signals and high-speed signals, which introduces key disadvantages: High cost: Because 101 PCBA has both low-speed and high-speed signals, the PCB (Printed Circuit Board) of 101 PCBA needs to be made of materials with high-frequency characteristics, such as Megtron 7 and Megtron 8. These materials are expensive, have complex manufacturing processes, and have low yields, which increases the cost of high-speed optical modules.

[0004] High-speed optical module design is difficult: In addition to purchasing the core optical engine 100 TGVI, high-speed optical module companies also need to design 101 PCBA. In addition to low-speed control, power supply and other components and signals, 101 PCBA also has 203 DSP high-speed chips and high-speed signal lines, which places high demands on designers. High-speed signal simulation is required to prevent high-speed signal loss and crosstalk, which can easily lead to revisions with poor performance, resulting in longer design cycles and increased design costs.

[0005] The above contents are only used to assist in understanding the technical solution of the present invention and do not constitute an admission that the above contents are prior art. Summary of the invention

[0006] The main purpose of the implementation of the present invention is to provide a new high-speed optical module design based on a through-glass plate, aiming to solve the problems of increased design difficulty and increased cost caused by the high-speed devices and high-speed signals in the existing solution being dispersed in the through-glass plate TGVI and the organic material plate PCBA.

[0007] In order to solve the above problems, the present invention provides a novel design of a high-speed optical module based on a through-glass plate.

[0008] The schematic diagram of the scheme of the present invention is as follows Figure 2 :It consists of two CPO optical engine glass through-hole adapter boards 10 TGVI1 and 11TGVI2 and a common material board 12 PCBA. Among them, all key high-speed signal components are placed on 10 TGVI1, including digital signal processor 20 DSP, driver chip 21 Driver, transimpedance amplifier 22 TIA and optical chip 23 PIC. At the same time, most of the high-speed signal traces and electrical signal interface gold finger 30 Finger 1 with high-speed signals are arranged, and the optical signal input and output interface is led out. 11 TGVI2 mainly arranges electrical signal interface gold finger 31 Finger 2 with high-speed signals. Only low-speed signal components and low-speed signal traces such as control and power supply of 24 MCU are placed on 12 PCBA, and ordinary low-frequency boards such as FR4 can be directly used, with low process and cost. 10 TGVI1 and 11 TGVI2 are interconnected through through glass via TGV (Through Glass Via) bonding, 10 TGVI1 and 12 PCBA are interconnected through flip package FC and wire bonding 40 Wire Bond 1, and 11 TGVI2 and 12 PCBA are also interconnected through wire bonding 41 Wire Bond 2.

[0009] In order to solve the above problems, the present invention also proposes a corresponding new production process flow as follows Figure 3: 1001 to 1003 and 1101 to 1103 are the manufacturing process of the glass through hole adapter board of 10 TGVI1 and 11 TGVI2 - TGV punching, RDL (Re-Distribution Layer) wiring and Bump solder joints, 1201 to 1202 are the manufacturing process of the 12 PCBA board, 2001 is the bonding of 10TGVI1 and 11 TGVI2, 2002 is the die bonding, eutectic welding and wire bonding of the key high-speed optoelectronic chips on 10 TGVI1, 3001 is the FC welding of 10 TGVI1 and 12 PCBA, 3002 is the wire bonding of 10 TGVI1 and 12 PCBA, 3003 is the wire bonding of 11TGVI2 and 12 PCBA, and the subsequent processes 3004 to 3007 are consistent with the existing solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the design scheme of the existing high-speed optical module using the through-glass hole adapter plate CPO optical engine; Figure 2 This is a schematic diagram of a high-speed optical module design using a through-glass hole adapter plate CPO optical engine of the present invention; Figure 3 It is a process flow chart of the design scheme of a high-speed optical module using a through-glass hole adapter plate CPO optical engine of the present invention.

[0011] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0012] In order to facilitate those skilled in the art to understand and implement the present invention, embodiments of the present invention are now described in conjunction with the accompanying drawings.

[0013] like Figure 2 As shown, according to the present invention, the novel high-speed optical module design based on the through glass hole adapter board of the present invention includes: through glass hole adapter boards 10 TGVI1, 11 TGVI2 and 12 PCBA of ordinary FR4 board material.

[0014] The present invention has two glass through hole adapter boards, namely 10 TGVI1 and 11 TGVI2, which are designed and produced using existing process flows, and process links such as TGV punching, RDL wiring and Bump solder joints are performed to make glass through hole carrier boards. Among them, 10 TGVI1 has 20 DSP digital signal processing chips, 21 Driver driving electrical chips, 22 TIA transimpedance amplifier chips, 23 PIC optical chips, etc., which can be all of these chips or several of these chips, or other chips, etc. These chips can be Wire Bond wire packaging, FC flip chip packaging, or a mixed packaging of Wire Bond and FC. 11 TGVI2 only has high-speed signal routing, low-speed signal routing and high-speed and low-speed mixed signal gold fingers of the electrical interface, and no components. After the two glass through hole carrier boards are manufactured, they need to be assembled together by laser bonding or the like, and then the eutectic, solid crystal welding and / or wire bonding of each optoelectronic chip are performed on 10 TGVI1 to make a complete CPO optical engine for use in optical modules.

[0015] The next step is to design a high-speed optical module based on the specifications of the CPO optical engine. The design of 12 PCBA is relatively simple. 12PCBA is all low-speed signals such as MCU microcontroller control and power supply. It is connected to 10 TGVI1 through solder joints and wiring 40 Wire Bond 1, and connected to 11 TGVI2 through wiring 41 Wire Bond 2 to form a complete optical module circuit.

[0016] The glass through hole adapter plates 10 TGVI1 and 11 TGVI2 of the present invention form a CPO light engine, which can be composed of one TGVI, two TGVIs or more TGVIs. Even with the development of technology, the cost of TGVI is reduced, and 12 PCBA may not be needed, and the functions and circuits can be directly made on the TGVI. In addition, the combination between TGVIs can be realized by Bump, BGA, FC, laser bonding, gluing, etc., and the TGVI and PCBA can be connected by BGA, FC, Wire Bond, connector, wiring, etc.

[0017] The optoelectronic chips on the through glass via adapter board TGVI of the present invention may include all or several of the digital signal processor DSP chip, the driver Driver chip, the transimpedance amplifier TIA chip, the PIC optical chip, etc., and may also include chips with other functions, such as thin film lithium niobate TFLN chip, etc. The chip may be in each TGVI, or on one and / or several of them.

[0018] The number of channels of the high-speed optical module of the present invention can be any value, depending on the specifications, and can be 1 channel, 2 channels, 4 channels, 8 channels, 16 channels, 32 channels or other values. The number of channels will determine the number of pins of the electrical interface gold fingers on the TGVI, and will also affect the shape structure of the optical module, such as QSFP112, QSFP112-DD or OSFP.

[0019] The rate of each channel of the high-speed optical module of the present invention is also determined by the specifications, and can be 10Gbps, 25Gbps, 56Gbps, 112Gbps, 224Gbps, 448Gbps or other rates.

[0020] like Figure 3 As shown, the entire process flow corresponding to the present invention, compared with the process flow of the existing solution, mainly has an additional process of a through-glass via adapter plate and the changes in the processes introduced thereby. Processes 1001 to 1004 are the production processes of the first through-glass via adapter plate 10 TGVI1, and 1001 to 1003 complete the tape-out process TGV holes, RDL wiring and Bump ball planting of 10 TGVI1. Processes 1101 to 1103 are the production processes of the second through-glass via adapter plate 11 TGVI2, completing TGV holes, RDL wiring and Bump ball planting. After 10 TGVI1 and 11 TGVI2 are completed, they need to be laser bonded together through process 2001 to form a whole. After the through-glass via technology is developed, 10 TGVI1 and 11 TGVI2 can be completed in one process, which is just one TGVI, and the process flow will be simpler at that time. Because 10 TGVI1 has high-speed optoelectronic chips and other components, the 2002 process will complete the eutectic, die bonding and wire bonding of these optoelectronic chips. However, 11 TGVI2 does not have any components and does not require any welding or wire bonding. At this point, the entire CPO optical engine tape-out assembly process is completed and can be handed over to the optical module company for use. After the optical module company completes the design of the PCBA, the production of the 1201 process and the assembly of the 1202 process, the CPO optical engine and PCBA are assembled, the 3001 process performs BGA, FC and other welding on 10 TGVI1 and 12 PCBA, the 3002 process performs the wire bonding process on 10 TGVI1 and 12 PCBA, and the 3003 process performs the wire bonding process on 11 TGVI2 and 12 PCBA. The remaining process flows 3004 to 3007 are consistent with the processes of the existing solution, completing the final optical path coupling, assembly test and packaging and shipment of the optical module.

[0021] The optical module company uses the high-speed optical module design solution based on the through-glass adapter plate of the present invention to design a high-speed optical module. The design difficulty and high-speed design are concentrated on the CPO optical engines TGVI1 and TGVI2, while the PCBA only has a low-speed signal design. Therefore, compared with the existing solution, the optical module company purchases the CPO optical engine and designs the PCBA by itself. Because there are no high-speed signals on the PCBA, only low-speed signals, the design difficulty is greatly reduced, the requirements for designers are reduced, and there is no need to perform signal simulation. It is not easy to revise due to design errors. The entire design cycle is shortened, and the design cost is reduced accordingly. On the other hand, because there are no high-speed components and high-speed signals on the PCBA, the selected PCB board material can use ordinary low-frequency FR4 material, the procurement cycle is shortened, the procurement cost is reduced, and the processing technology of the FR4 board material is more mature, the yield rate is higher, and the overall material cost and manufacturing cost of the optical module are reduced accordingly.

[0022] Although the present invention has been described by way of example, it will be apparent to those skilled in the art that many changes and modifications may be made to the present invention without departing from the spirit and substance of the present invention, the scope of which is defined by the appended claims.

Claims

1. A novel high-speed optical module based on a through-glass adapter plate, comprising: Through Glass Via Interposer (TGVI) and ordinary organic material board are characterized by glass-based materials, an adapter board based on through glass hole technology, advanced packaging technology is used to integrate optical chips and electrical chips on the adapter board, and the high-speed signal lines of the high-speed optical module are all arranged on the through glass hole adapter board, and low-speed signals such as power supply and control are arranged on the ordinary organic material board PCBA (Printed Circuit Board Assembly). The through glass hole adapter board TGVI and the ordinary organic material board PCBA are combined into a high-speed optical module.

2. The novel high-speed optical module based on glass through hole adapter plate according to claim 1 is characterized in that: The high-speed optical module integrates an optical chip, an electrical chip, a through-glass via adapter board TGVI, a PCBA board, and has an electrical interface and an optical interface to the outside.

3. The novel high-speed optical module based on glass through hole adapter plate according to claim 2 is characterized in that: The number of the through glass via adapter plates TGVI can be 2, which can be integrated into one or divided into 3 or more.

4. The novel high-speed optical module based on glass through hole adapter plate according to claim 2 is characterized in that: The electric chip includes one or a combination of multiple chips such as a digital signal processor DSP (Digital Signal Processor), a driver Driver, a trans-impedance amplifier TIA (Trans-Impedance Amplifier), a single-chip computer MCU (Micro Control Unit), an electrically erasable programmable read-only memory EEPROM (Electrically Erasable Programmable Read Only Memory), and can also integrate electric chips with other functions.

5. The novel high-speed optical module based on glass through hole adapter plate according to claim 2 is characterized in that: The optical chip PIC (Photonics Integration Circuit) can be a III-V chip (such as InP), a silicon photonic chip SiPh (Silicon Photonics), a thin-film lithium niobate chip TFLN (Thin-Film Lithium Niobate) or any other chip or a combination of multiple chips, or an optical chip integrating other functions.

6. The novel high-speed optical module based on glass through hole adapter plate according to claim 1 is characterized in that: The combination of the through glass via adapter board TGVI and the ordinary organic material board PCBA can be through BGA (Ball Grid Array) welding, Wire Bond bonding, direct connector interconnection, flat cable connection, or a combination of multiple methods.

7. The novel high-speed optical module based on glass through hole adapter plate according to claim 1 is characterized in that: The external structure and size of the high-speed optical module is not specific, and it can be SFP, QSFP, OSFP, QSFP-DD, or other sizes.

8. The novel high-speed optical module based on glass through hole adapter plate according to claim 1 is characterized in that: The number of channels of the high-speed optical module is not limited, and can be 1 channel, 2 channels, 4 channels, 8 channels, 16 channels or other number of channels.

9. The novel high-speed optical module based on glass through hole adapter plate according to claim 8 is characterized in that: The rate of each channel of the high-speed optical module is not limited and can be 10Gbps, 25Gbps, 100Gbps, 200Gbps, 400Gbps or other rates.

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