Module driving device

Abstract

Provided is a module drive device capable of achieving more efficient heat dissipation of an imaging element. A module drive device (MD) is provided with: a module holder (2) capable of holding an optical module (OM); a base member (18) provided so as not to move relative to a heat dissipation member (HR) that dissipates heat generated by an imaging element (IS); and a drive unit (DM) that moves the module holder (2) relative to the base member (18) by means of eight shape memory alloy wires (SA) provided between the module holder (2) and the base member (18). And a biasing mechanism (EG) that biases the module holder (2) toward the heat dissipation member (HR) side facing the lower surface of the substrate member (SB). The biasing mechanism (EG) biases the module holder (2) such that the inner portion (SB2) of the substrate member (SB) and the heat dissipation member (HR), which are separated from each other when the shape memory alloy wire (SA) is energized, approach or come into contact with each other when the shape memory alloy wire (SA) is not energized.

Description

Technical Field

[0001] The present application relates to a module drive device. Background Art

[0002] Conventionally, there is known an image pickup unit including a movable heat sink for dissipating heat generated in an image pickup element to the outside (see Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-217179 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] The above-mentioned imaging unit is configured so that the movable heat sink can be moved as necessary to thermally connect the movable heat sink and the imaging element.

[0008] However, the above-mentioned camera unit is equipped with an electromagnetic drive mechanism for moving the movable heat sink. Therefore, the above-mentioned camera unit needs to supply power to the electromagnetic drive mechanism when moving the movable heat sink, which may cause a large amount of power consumption for heat dissipation of the camera element.

[0009] Therefore, it is desirable to provide a module driving device that can achieve more efficient heat dissipation of an imaging element.

[0010] Means for solving technical problems

[0011] A module driving device according to one embodiment of the present application comprises: a movable side component, which includes a module holding body capable of holding an optical module, wherein the optical module has a lens body, a substrate component, and an imaging element mounted on the upper surface of the substrate component in a manner opposite to the lens body in the optical axis direction; a fixed side component, which is arranged to be non-movable relative to a heat dissipation component that dissipates heat generated by the imaging element; and a driving unit, which uses a plurality of shape memory alloy wires arranged between the fixed side component and the movable side component to move the movable side component relative to the fixed side component, and the module driving device also comprises a force applying mechanism, which applies force to the module holding body toward the side of the heat dissipation component opposite to the lower surface of the substrate component, and the force applying mechanism applies force to the module holding body in a manner that the substrate component and the heat dissipation component, which are separated from each other when the shape memory alloy wire is energized, approach or contact each other when the shape memory alloy wire is not energized.

[0012] Effects of the Invention

[0013] The module driving device described above can achieve more efficient heat dissipation of the imaging element. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional diagram of the heat dissipation component, the optical module, and the module driving device.

[0015] Figure 2 This is an exploded perspective view of the optical module and the module drive device.

[0016] Figure 3 A more detailed exploded perspective view of the module drive device.

[0017] Figure 4 This is a three-dimensional diagram of a module holder, a movable side metal component, a flexible metal component, an embedded metal component, a movable side conductive component, and a magnet.

[0018] Figure 5 This is a perspective view of the fixed-side metal component, the flexible metal component, the fixed-side embedded component, and the base component.

[0019] Figure 6 This is a front view of a metal component to which a shape memory alloy wire is mounted.

[0020] Figure 7 It is a three-dimensional diagram of a metal component, a flexible metal component, a movable-side conductive component, a fixed-side embedded component, and a shape memory alloy wire.

[0021] Figure 8 This is a three-dimensional view of the module holder, magnet, fixed-side embedded component, and base component.

[0022] Fig. 9 is a top view of the optical device.

[0023] Fig.10 is a cross-sectional view of the optical device.

[0024] Fig.11 is a functional block diagram of an optical device.

[0025] Fig.12 This is a flowchart showing an example of the flow of the operation mode switching process. DETAILED DESCRIPTION

[0026] Hereinafter, an optical device OD including a module driving device MD according to an embodiment of the present application will be described with reference to the drawings. The optical device OD is a device including a heat sink HR, an optical module OM, and a module driving device MD, and is mounted on a portable device such as a smartphone.

[0027] The module driving device MD is configured to be able to tilt the optical module OM. Figure 1 1 is a perspective view of the heat dissipation component HR, the optical module OM and the module driving device MD. Specifically, Figure 1 The upper figure (the figure located on the upper side of the hollow arrow) is a three-dimensional view of the module driving device MD in a state where the optical module OM is installed and arranged in the heat dissipation component HR. Figure 1 The lower figure (the figure located on the lower side of the hollow arrow) is a perspective view of the module driving device MD in a state where the optical module OM is taken out from the heat sink HR and disassembled. Figure 2 It is an exploded perspective view of the optical module OM and the module driving device MD. Figure 3 It is a more detailed exploded perspective view of the module drive device MD.

[0028] exist Figure 1 , Figure 2 ,as well as Figure 3 In , X1 represents one direction of the X axis constituting the three-dimensional orthogonal coordinate system, and X2 represents the other direction of the X axis. In addition, Y1 represents one direction of the Y axis constituting the three-dimensional orthogonal coordinate system, and Y2 represents the other direction of the Y axis. Similarly, Z1 represents one direction of the Z axis constituting the three-dimensional orthogonal coordinate system, and Z2 represents the other direction of the Z axis. Figure 1 , Figure 2 ,as well as Figure 3 In the figure, the X1 side of the module driving device MD corresponds to the front side (front side) of the module driving device MD, and the X2 side of the module driving device MD corresponds to the rear side (back side) of the module driving device MD. In addition, the Y1 side of the module driving device MD corresponds to the left side of the module driving device MD, and the Y2 side of the module driving device MD corresponds to the right side of the module driving device MD. In addition, the Z1 side of the module driving device MD corresponds to the upper side (the side of the object to be photographed) of the module driving device MD, and the Z2 side of the module driving device MD corresponds to the lower side (the side of the imaging element) of the module driving device MD. The same is true in other figures.

[0029] The optical module OM is a module including an optical element driving device for driving an optical element. In the illustrated example, the optical module OM includes a lens driving device LD as an example of an optical element driving device, and the lens driving device LD drives a lens body LS as an example of an optical element. The lens body LS is, for example, a cylindrical lens barrel having at least one lens, and is configured such that its central axis is along the optical axis OA.

[0030] Specifically, if Figure 2 As shown, the optical module OM includes a lens body LS, a lens driving device LD, an image pickup element IS, an image pickup element holder SH, and a substrate member SB.

[0031] The lens driving device LD is configured to be able to move the lens body LS at least in the optical axis direction (Z-axis direction) using a voice coil motor composed of a coil and a magnet. Fig.11). In addition, the optical axis direction includes the axial direction of the optical axis OA and the direction parallel to the axial direction of the optical axis OA. In addition, in the illustrated example, the lens driving device LD is configured to move the lens body LS using a voice coil motor, but it can also be configured to move the lens body LS using a component or mechanism other than a voice coil motor such as a shape memory alloy wire or a piezoelectric element. In addition, the autofocus driving unit AD can also be omitted. In this case, the optical device OD functions as a fixed focus camera with a shake correction function.

[0032] The lens driving device LD includes a movable side cover component 4 and a movable side base component 28. The movable side cover component 4 and the movable side base component 28 function as a movable side housing that covers the various components constituting the lens driving device LD. In the illustrated example, the movable side cover component 4 is formed of a non-magnetic metal such as austenitic stainless steel. However, the movable side cover component 4 may also be formed of a magnetic metal.

[0033] Specifically, if Figure 2 As shown, the movable side cover member 4 has a bottomless box-like shape that defines the storage portion 4S. In addition, the movable side cover member 4 has a rectangular cylindrical side plate portion 4A, and a rectangular ring-shaped and flat top plate portion 4B that is continuously provided with the upper end (the end on the Z1 side) of the side plate portion 4A. A roughly circular opening 4K is formed in the center of the top plate portion 4B. The side plate portion 4A includes a first side plate portion 4A1 to a fourth side plate portion 4A4. The first side plate portion 4A1 and the third side plate portion 4A3 are opposite to each other, and the second side plate portion 4A2 and the fourth side plate portion 4A4 are opposite to each other. Moreover, the first side plate portion 4A1 and the third side plate portion 4A3 extend perpendicularly relative to the second side plate portion 4A2 and the fourth side plate portion 4A4.

[0034] The movable-side base member 28 is a substantially rectangular frame-shaped member formed of synthetic resin, and is attached to the image pickup device holder SH attached to the substrate member SB.

[0035] The image pickup element holder SH is configured to accommodate and hold the image pickup element IS. In the example shown in the figure, the image pickup element holder SH is a substantially rectangular frame-shaped member formed of synthetic resin, and its upper surface is bonded to the lower surface of the movable side base member 28 by an adhesive. An opening SHK is formed in the image pickup element holder SH to expose the image pickup element IS. A concave portion that is open at the lower side and concave upward is formed on the lower surface of the image pickup element holder SH surrounding the opening SHK, and the image pickup element IS is arranged in the concave portion (not shown).

[0036] The substrate component SB is a component for realizing electrical connection between the module driving device MD and the lens driving device LD and the devices located outside the module driving device MD, such as the control unit CTR. In the illustrated example, the control unit CTR is a microcomputer having a CPU, a volatile storage device, and a non-volatile storage device. In addition, the substrate component SB is a flexible printed substrate, and has an outer portion SB1 fixed to the module driving device MD, an inner portion SB2 fixed to the image pickup element holder SH, and a connecting portion SB3 connecting the outer portion SB1 and the inner portion SB2. In addition, the connecting portion SB3 includes a left connecting portion SB3L and a right connecting portion SB3R.

[0037] The imaging element IS is mounted on the inner part SB2. Specifically, the imaging element IS is fixed to the inner part SB2 by a conductive adhesive or solder. In addition, the imaging element holder SH accommodates the imaging element IS in a state where the imaging surface of the imaging element IS is exposed from the opening SHK, and is bonded to the upper surface of the inner part SB2 by an adhesive. At least a part of the outer shape of the imaging element IS is held by the imaging element holder SH. That is, the imaging element holder SH functions as a spacing member arranged between the inner part SB2 and the lens driving device LD (movable side base member 28). In addition, a temperature sensor SR such as a thermistor for detecting the temperature of the imaging element IS is mounted on the inner part SB2. The substrate member SB may also be a combination of a rigid substrate on which the imaging element IS is mounted and a flexible printed substrate connected to the rigid substrate.

[0038] The heat dissipation member HR is a member that dissipates the heat generated by the imaging element IS and is formed of, for example, aluminum or copper alloy. In the illustrated example, the heat dissipation member HR is configured to be in contact with the substrate member SB and can dissipate the heat of the imaging element IS to the outside via the substrate member SB. Figure 1 As shown in the above figure, the heat dissipation component HR is accommodated together with the module drive device MD in the recess HC formed in the heat dissipation component HR. Moreover, the lower surface of the outer portion SB1 of the substrate component SB is fixed to the bottom surface of the recess HC by an adhesive. In addition, the heat dissipation component HR can also be a part of the housing of a portable device such as a smart phone.

[0039] like Figure 1 as well as Figure 2 As shown, the module drive device MD includes a cover member 1 as a part of a fixed side member FB provided so as not to be relatively movable with respect to the heat dissipation member HR. The cover member 1 is configured to function as a part of a housing HS covering the various members constituting the module drive device MD. In the example shown in the figure, the cover member 1 is formed of a non-magnetic metal such as austenitic stainless steel. However, the cover member 1 may also be formed of a magnetic metal.

[0040] Specifically, if Figure 2 As shown, the cover part 1 has a bottomless box-like appearance that defines the storage portion 1S. In addition, the cover part 1 has a rectangular cylindrical side plate portion 1A, and a rectangular ring-shaped and flat top plate portion 1B continuously provided with the upper end (end on the Z1 side) of the side plate portion 1A. A roughly rectangular opening 1K is formed in the center of the top plate portion 1B. The side plate portion 1A includes a first side plate portion 1A1 to a fourth side plate portion 1A4. The first side plate portion 1A1 and the third side plate portion 1A3 are opposite to each other, and the second side plate portion 1A2 and the fourth side plate portion 1A4 are opposite to each other. Moreover, the first side plate portion 1A1 and the third side plate portion 1A3 extend perpendicularly relative to the second side plate portion 1A2 and the fourth side plate portion 1A4.

[0041] like Figure 2 as well as Figure 3 As shown, the module holder 2, the metal part 5, the flexible metal part 6, the embedded metal part 7, the movable side conductive part 8, the magnet 9, the fixed side embedded part 10, the base part 18, and the shape memory alloy wire SA are housed in the cover part 1. The module holder 2 constitutes the movable side part MB, and the base part 18 constitutes the fixed side part FB. Figure 1 As shown, the cover member 1 is bonded to the base member 18 by an adhesive.

[0042] The module holder 2 is a rectangular frame-shaped member that holds the optical module OM and is formed by injection molding a synthetic resin such as a liquid crystal polymer (LCP). Figure 3 As shown in the figure, it has a frame portion 2A and a base portion 2D.

[0043] The frame 2A is composed of four extensions (first extension 2A1 to fourth extension 2A4) surrounding a rectangular opening 2K. The base 2D is a portion protruding radially outward from the frame 2A, and includes a first base 2D1 disposed at a corner on the right rear side of the frame 2A, and a second base 2D2 disposed at a corner on the left front side of the frame 2A.

[0044] The embedded metal component 7 is a metal component that is partially exposed from the surface of the module holder 2 and the rest is embedded in the module holder 2 in a manner that allows it to contact the optical module OM. In the present embodiment, the embedded metal component 7 is a component formed of a metal such as stainless steel or copper, and is partially embedded in the frame portion 2A of the module holder 2 by insert molding.

[0045] In the example shown in the figure, the embedded metal member 7 has an exposed portion 7C exposed on the inner peripheral surface of the frame portion 2A of the module holder 2 (the inner peripheral surface of each of the first extending portion 2A1 to the fourth extending portion 2A4). Figure 1As shown in FIG. 1 , the outer peripheral surface of the side plate portion 4A of the movable side cover member 4 of the optical module OM is configured to be bonded to the inner peripheral surface of the frame portion 2A of the module holding body 2 by an adhesive. Specifically, the outer peripheral surface of the side plate portion 4A is configured to be bonded to the exposed portion 7C by an adhesive at least in part. Therefore, this configuration can improve the bonding strength between the side plate portion 4A and the module holding body 2 compared to a configuration in which the embedded metal member 7 is not embedded in the module holding body 2. This is because the bonding strength between metals is higher than the bonding strength between metals and synthetic resin materials.

[0046] The movable-side conductive component 8 is a component that is partially exposed from the module holder 2 and the rest is embedded in the module holder 2 in such a manner that it can contact the metal component 5 and the flexible metal component 6. In the present embodiment, the movable-side conductive component 8 is a component formed of a metal such as stainless steel or copper, and is partially embedded in the base portion 2D of the module holder 2 by insert molding. In the illustrated example, the movable-side conductive component 8 includes a first movable-side conductive component 8A partially embedded in the first base portion 2D1, and a second movable-side conductive component 8B partially embedded in the second base portion 2D2.

[0047] The magnet 9 is a member constituting a biasing mechanism EG for biasing the module holder 2 along the optical axis direction. Figure 8 ), the recess 2R is formed in an opposing portion 2F of the module holder 2 that is opposed to the upper surface of the base member 18 in the optical axis direction (see Figure 8 ). In addition, the magnet constituting the urging mechanism EG may also be a magnet constituting the voice coil motor in the lens driving device LD. In this case, the magnet 9 may also be omitted.

[0048] The fixed side embedded member 10 is a member embedded in the fixed side member FB. In the present embodiment, the fixed side embedded member 10 is a member formed of a magnetic metal such as ferritic stainless steel or iron, and is partially embedded in the base member 18 by insert molding.

[0049] like Figure 2 As shown, the module driving device MD has a driving unit DM that rotates (oscillates) the module holder 2 around the first axis AX1 and the second axis AX2. In the example shown, the first axis AX1 and the second axis AX2 are arranged to intersect the optical axis OA at the center point of the imaging element IS in a plan view.

[0050] The driving unit DM is composed of a shape memory alloy wire SA as an example of a shape memory actuator. Figure 3As shown, the first wire SA1 to the eighth wire SA8 are included. When current flows, the temperature of the shape memory alloy wire SA rises, and the shape memory alloy wire SA contracts according to the temperature rise. The driving unit DM can swing the module holder 2 by utilizing the contraction of the shape memory alloy wire SA.

[0051] The base member 18 is formed by injection molding using a synthetic resin such as a liquid crystal polymer (LCP). Figure 3 As shown, the base member 18 has a substantially rectangular outer shape in a plan view and has an opening 18K in the center. Specifically, the base member 18 has a rectangular ring-shaped base portion 18B arranged so as to surround the substantially rectangular opening 18K. The base portion 18B includes a first base portion 18B1 to a fourth base portion 18B4.

[0052] A base portion 18D is formed on the upper surface of the base member 18, which is the surface on the imaging subject side (the surface on the Z1 side). The base portion 18D includes a first base portion 18D1 extending upward from the first base portion 18B1 and the second base portion 18B2 and having an L-shape in a plan view, and a second base portion 18D2 extending upward from the third base portion 18B3 and the fourth base portion 18B4 and having an L-shape in a plan view. The first base portion 18D1 and the second base portion 18D2 are arranged to face each other with the optical axis OA interposed therebetween.

[0053] The flexible metal component 6 is configured to connect the fixed side component FB (base component 18) and the movable side component MB (module holding body 2). In the present embodiment, the flexible metal component 6 is a conductive connecting component (leaf spring) connecting the module holding body 2 and the base component 18, and is formed of a metal plate mainly made of, for example, copper alloy, titanium-copper alloy (titanium-copper), or copper-nickel alloy (nickel-tin-copper).

[0054] Specifically, the flexible metal component 6 includes an inner portion 6N fixed to the module holder 2, an outer portion 6E fixed to the base member 18, and an elastic arm portion 6G connecting the inner portion 6N and the outer portion 6E. Figure 3 As shown in the figure, the first flexible metal component 6A and the second flexible metal component 6B are included. Moreover, the first flexible metal component 6A has a first inner portion 6N1, a first outer portion 6E1, and a first elastic arm portion 6G1, and the second flexible metal component 6B has a second inner portion 6N2, a second outer portion 6E2, and a second elastic arm portion 6G2. In addition, the inner portion 6N is riveted to the upper end surface of the base portion 2D of the module holding body 2, and the outer portion 6E is riveted to the upper end surface of the base portion 18D of the base component 18. In addition, the connection between the flexible metal component 6 and the module holding body 2 and the base component 18, respectively, can also be achieved by an adhesive.

[0055] In this way, the flexible metal component 6 is configured to connect the upper surface of the base portion 2D of the module holder 2 and the upper surface of the base portion 18D of the base component 18. Specifically, the flexible metal component 6 is configured such that the first flexible metal component 6A connects the upper surfaces of the first base portion 2D1 and the second base portion 2D2 to the upper surface of the first base portion 18D1, and the second flexible metal component 6B connects the upper surfaces of the first base portion 2D1 and the second base portion 2D2 to the upper surface of the second base portion 18D2.

[0056] The metal component 5 is a component for fixing the end of the shape memory alloy wire SA. In the present embodiment, the metal component 5 is a component formed of a non-magnetic metal such as phosphor bronze, and includes a fixed side metal component 5F and a movable side metal component 5M. The fixed side metal component 5F is configured to be fixed to the base component 18, and the movable side metal component 5M is configured to be fixed to the module holder 2.

[0057] More specifically, the fixed side metal component 5F is also called a fixed side connection plate, and includes a first fixed side metal component 5F1 to an eighth fixed side metal component 5F8. The movable side metal component 5M is also called a movable side connection plate, and includes a first movable side metal component 5M1 to a fourth movable side metal component 5M4.

[0058] One end of each of the first wire SA1 to the eighth wire SA8 is fixed to the fixed-side metal component 5F by crimping or welding, etc., and the other end is fixed to the movable-side metal component 5M by crimping or welding, etc. Moreover, each of the first wire SA1 to the eighth wire SA8 is configured to be linear along the outer surface of the frame portion 2A of the module holder 2 when current flows, so that the movable-side component MB (module holder 2) can be swung relative to the fixed-side component FB (cover component 1 and base component 18).

[0059] Next, refer to Figure 4 The positional relationships among the module holding body 2, the movable-side metal member 5M, the flexible metal member 6, the embedded metal member 7, and the movable-side conductive member 8 will be described. Figure 4 2 is a perspective view of the module holder 2, the movable side metal component 5M, the flexible metal component 6, the embedded metal component 7, the movable side conductive component 8, and the magnet 9. Specifically, Figure 4 The upper figure (the figure located on the upper side of the hollow arrow) is a three-dimensional view of the module holding body 2, the movable side metal component 5M, the flexible metal component 6, the embedded metal component 7, the movable side conductive component 8, and the magnet 9 in the separated state. Figure 4The lower figure (the figure located on the lower side of the hollow arrow) is a three-dimensional view of the module holding body 2 in which the movable side metal component 5M, the flexible metal component 6, and the magnet 9 are installed, and the embedded metal component 7 and the movable side conductive component 8 are buried.

[0060] In the illustrated example, the first movable side metal component 5M1 is joined by welding to the front exposed portion 8B1 of the second movable side conductive component 8B buried in the second seat portion 2D2 of the module holder 2. The second movable side metal component 5M2 is joined by welding to the right exposed portion 8A1 of the first movable side conductive component 8A buried in the first seat portion 2D1 of the module holder 2. The third movable side metal component 5M3 is joined by welding to the rear exposed portion 8A2 of the first movable side conductive component 8A buried in the first seat portion 2D1 of the module holder 2. The fourth movable side metal component 5M4 is joined by welding to the left exposed portion 8B2 of the second movable side conductive component 8B buried in the second seat portion 2D2 of the module holder 2. With this configuration, the adhesive for fixing the movable side metal component 5M to the seat portion 2D can also be omitted.

[0061] In addition, one of the two first inner portions 6N1 in the first flexible metal component 6A is joined by welding to the upper right exposed portion 8A3 of the first movable-side conductive component 8A buried in the first seat portion 2D1 of the module holder 2, and the other of the two first inner portions 6N1 in the first flexible metal component 6A is joined by welding to the upper front exposed portion 8B3 of the second movable-side conductive component 8B buried in the second seat portion 2D2 of the module holder 2. Similarly, one of the two second inner portions 6N2 in the second flexible metal component 6B is joined by welding to the upper rear exposed portion 8A4 of the first movable-side conductive component 8A buried in the first seat portion 2D1 of the module holder 2, and the other of the two second inner portions 6N2 in the second flexible metal component 6B is joined by welding to the upper left exposed portion 8B4 of the second movable-side conductive component 8B buried in the second seat portion 2D2 of the module holder 2.

[0062] The embedded metal component 7 includes an embedded portion 7E embedded in the frame portion 2A of the module holder 2, and an exposed portion 7C exposed on the inner peripheral surface of the frame portion 2A of the module holder 2. The embedded metal component 7 is formed by punching and bending a metal plate. In the illustrated example, the exposed portion 7C includes a first exposed portion 7C1 exposed on the inner peripheral surface of the first extension portion 2A1, a second exposed portion 7C2 exposed on the inner peripheral surface of the second extension portion 2A2, a third exposed portion 7C3 exposed on the inner peripheral surface of the third extension portion 2A3, and a fourth exposed portion 7C4 exposed on the inner peripheral surface of the fourth extension portion 2A4.

[0063] The magnet 9 includes a first magnet 9A and a second magnet 9B, which are substantially cubic two-pole permanent magnets. The first magnet 9A is embedded in the facing portion 2F (see FIG. 2 ) of the module holder 2. Figure 8 ) is a part of the opposing portion 2F and is formed in a first recess 2R1 on the lower surface of the first seat portion 2D1 and is fixed by an adhesive, and the second magnet 9B is embedded in a second recess 2R2 which is another part of the opposing portion 2F and is formed in the lower surface of the second seat portion 2D2 and is fixed by an adhesive.

[0064] Next, refer to Figure 5 , the positional relationships among the base member 18, the fixed-side metal member 5F, the flexible metal member 6, and the fixed-side embedded member 10 will be described. Figure 5 1 is a perspective view of the fixed-side metal component 5F, the flexible metal component 6, the fixed-side embedded component 10, and the base component 18. Specifically, Figure 5 The upper figure (the figure located on the upper side of the hollow arrow) is a three-dimensional view of the fixed side metal component 5F, the flexible metal component 6, the fixed side embedded component 10, and the base component 18 in a separated state. Figure 5 The lower figure (the figure located on the lower side of the hollow arrow) is a perspective view of the base member 18 in which the fixed-side metal member 5F and the flexible metal member 6 are mounted and the fixed-side embedded member 10 is embedded.

[0065] The fixed side embedded component 10 is a component embedded in the fixed side component FB. In the present embodiment, the fixed side embedded component 10 is formed of a magnetic metal such as iron, and is embedded in the base component 18 in a manner partially exposed from the surface of the base component 18. In the illustrated example, the fixed side embedded component 10 includes a first fixed side embedded component 10A to a tenth fixed side embedded component 10J, which are components for electrically connecting the fixed side metal component 5F and the flexible metal component 6 to the substrate component SB, respectively, and an eleventh fixed side embedded component 10K and a twelfth fixed side embedded component 10L including a magnetic component MG constituting the urging mechanism EG.

[0066] Specifically, the first fixed side embedded member 10A embedded in the first seat portion 18D1 has a first exposed portion 10AP exposed on the front side of the first seat portion 18D1. The first fixed side metal member 5F1 is joined to the first exposed portion 10AP by welding and is electrically connected to the substrate member SB via the first fixed side embedded member 10A.

[0067] The second fixed side embedded member 10B embedded in the first seat portion 18D1 has a second exposed portion 10BP exposed on the front side of the first seat portion 18D1. The second fixed side metal member 5F2 is joined to the second exposed portion 10BP by welding and is electrically connected to the substrate member SB via the second fixed side embedded member 10B.

[0068] The third fixed side embedded component 10C embedded in the first seat portion 18D1 has a third exposed portion 10CP exposed on the right side surface of the first seat portion 18D1. The third fixed side metal component 5F3 is joined to the third exposed portion 10CP by welding and is electrically connected to the substrate member SB via the third fixed side embedded component 10C.

[0069] The fourth fixed side embedded member 10D embedded in the first seat portion 18D1 has a fourth exposed portion 10DP exposed on the right side surface of the first seat portion 18D1. The fourth fixed side metal member 5F4 is joined to the fourth exposed portion 10DP by welding and is electrically connected to the substrate member SB via the fourth fixed side embedded member 10D.

[0070] The fifth fixed side embedded member 10E embedded in the second seat portion 18D2 has a fifth exposed portion 10EP exposed at the rear side of the second seat portion 18D2. The fifth fixed side metal member 5F5 is joined to the fifth exposed portion 10EP by welding and is electrically connected to the substrate member SB via the fifth fixed side embedded member 10E.

[0071] The sixth fixed side embedded member 10F embedded in the second seat portion 18D2 has a sixth exposed portion 10FP exposed at the rear side of the second seat portion 18D2. The sixth fixed side metal member 5F6 is joined to the sixth exposed portion 10FP by welding and is electrically connected to the substrate member SB via the sixth fixed side embedded member 10F.

[0072] The seventh fixed side embedded member 10G embedded in the second seat portion 18D2 has a seventh exposed portion 10GP exposed on the left side surface of the second seat portion 18D2. The seventh fixed side metal member 5F7 is joined to the seventh exposed portion 10GP by welding and is electrically connected to the substrate member SB via the seventh fixed side embedded member 10G.

[0073] The eighth fixed side embedded member 10H embedded in the second seat portion 18D2 has an eighth exposed portion 10HP exposed on the left side surface of the second seat portion 18D2. The eighth fixed side metal member 5F8 is joined to the eighth exposed portion 10HP by welding and is electrically connected to the substrate member SB via the eighth fixed side embedded member 10H.

[0074] The ninth fixed side embedded component 10I embedded in the first seat portion 18D1 has a ninth exposed portion 10IP exposed on the upper surface of the first seat portion 18D1. The first outer portion 6E1 of the first flexible metal component 6A is welded to the ninth exposed portion 10IP and is electrically connected to the substrate member SB via the ninth fixed side embedded component 10I.

[0075] The tenth fixed side embedded component 10J embedded in the second seat portion 18D2 has a tenth exposed portion 10JP exposed on the upper surface of the second seat portion 18D2. The second outer portion 6E2 of the second flexible metal component 6B is welded to the tenth exposed portion 10JP and is electrically connected to the substrate member SB via the tenth fixed side embedded component 10J.

[0076] The eleventh fixed-side embedded component 10K has an eleventh exposed portion 10KP, which is exposed on the upper surface of the base component 18 in a manner opposite to the first magnet 9A at a distance. The eleventh exposed portion 10KP functions as the first metal plate MG1, which is one of the magnetic components MG constituting the urging mechanism EG. Similarly, the twelfth fixed-side embedded component 10L has a twelfth exposed portion 10LP, which is exposed on the upper surface of the base component 18 in a manner opposite to the second magnet 9B at a distance. The twelfth exposed portion 10LP functions as the second metal plate MG2, which is another of the magnetic components MG constituting the urging mechanism EG.

[0077] The base member 18 is configured to function as a wire support member that supports one end of each of the first wire SA1 to the eighth wire SA8. With this configuration, the movable side member MB is supported by the first wire SA1 to the eighth wire SA8 in a state where it can swing around the first axis AX1 and the second axis AX2, respectively. In addition, the axial direction of the first axis AX1 and the axial direction of the second axis AX2 are perpendicular to each other.

[0078] Next, refer to Figure 6 The metal member 5 to which the shape memory alloy wire SA is attached will be described. Figure 6 1 is a front view of the first fixed-side metal member 5F1, the second fixed-side metal member 5F2, the first movable-side metal member 5M1, the first line SA1, and the second line SA2. Specifically, Figure 6 The positional relationship of the components shown in the above figure corresponds to the positional relationship when the module driving device MD is assembled and current is supplied to the first line SA1 and the second line SA2 respectively so that the first line SA1 and the second line SA2 are respectively in a straight line shape. Figure 6 The positional relationship of the components shown in the following figure corresponds to the positional relationship when the module driving device MD is assembled and the first wire SA1 and the second wire SA2 are in a relaxed state because current is not supplied to the first wire SA1 and the second wire SA2. Figure 6 In the figure, other parts are omitted for clarity. Figure 6The following description is about the combination of the first line SA1 and the second line SA2, but is also applicable to the combination of the third line SA3 and the fourth line SA4, the combination of the fifth line SA5 and the sixth line SA6, and the combination of the seventh line SA7 and the eighth line SA8.

[0079] Specifically, one end of the first wire SA1 is fixed to the first fixed side metal component 5F1 at the holding portion J1 of the first fixed side metal component 5F1, and the other end of the first wire SA1 is fixed to the first movable side metal component 5M1 at the holding portion J2 on the lower side (Z2 side) of the first movable side metal component 5M1. Similarly, one end of the second wire SA2 is fixed to the second fixed side metal component 5F2 at the holding portion J3 of the second fixed side metal component 5F2, and the other end of the second wire SA2 is fixed to the first movable side metal component 5M1 at the holding portion J4 on the upper side (Z1 side) of the first movable side metal component 5M1.

[0080] The retaining portion J1 is formed by bending a portion of the first fixed-side metal component 5F1. Specifically, a portion of the first fixed-side metal component 5F1 is riveted while clamping the end (one end) of the first wire SA1 to form the retaining portion J1. In addition, the coating is peeled off the end (one end) of the first wire SA1 before being clamped by the retaining portion J1. Moreover, the end (one end) of the first wire SA1 is fixed to the retaining portion J1 by welding. Thereafter, the end (one end) of the first wire SA1 may also be protected by a protective resin. The same applies to the retaining portions J2 to J4.

[0081] In addition, the first wire SA1 and the second wire SA2 are arranged in a manner such that they are twisted relative to each other when current is supplied. That is, the first wire SA1 and the second wire SA2 are arranged in a manner such that they do not contact each other (non-contact) when current is supplied. Specifically, Figure 6 As shown in the upper figure, when viewed from the X1 side (a direction perpendicular to the plate surface of the first fixed-side metal member 5F1), the first line SA1 and the second line SA2 are arranged to intersect with each other.

[0082] Next, refer to Figure 7 The path of the current flowing through the shape memory alloy wire SA will be described. Figure 7 It is a perspective view of the metal member 5 , the flexible metal member 6 , the movable-side conductive member 8 , the fixed-side embedded member 10 , and the shape memory alloy wire SA.

[0083] If the first terminal portion 10AT of the first fixed side embedded component 10A is connected to a high potential and the ninth terminal portion 10IT of the ninth fixed side embedded component 10I is connected to a low potential, the current flows into the first fixed side metal component 5F1 through the first terminal portion 10AT. Then, the current flows through the first wire SA1 and further through the first movable side metal component 5M1. Then, the current flows through the front exposed portion 8B1 and the upper front exposed portion 8B3 of the second movable side conductive component 8B, through the first inner portion 6N1 on the left front side of the first flexible metal component 6A, the first elastic arm portion 6G1 on the front side, and the first outer portion 6E1, and then flows into the ninth terminal portion 10IT through the ninth exposed portion 10IP of the ninth fixed side embedded component 10I.

[0084] If the second terminal portion 10BT of the second fixed side embedded component 10B is connected to a high potential and the ninth terminal portion 10IT of the ninth fixed side embedded component 10I is connected to a low potential, the current flows into the second fixed side metal component 5F2 through the second terminal portion 10BT. Then, the current flows through the second wire SA2 and further through the first movable side metal component 5M1. Then, the current flows through the front exposed portion 8B1 and the upper front exposed portion 8B3 of the second movable side conductive component 8B, through the first inner portion 6N1 on the left front side of the first flexible metal component 6A, the first elastic arm portion 6G1 on the front side, and the first outer portion 6E1, and then flows into the ninth terminal portion 10IT through the ninth exposed portion 10IP of the ninth fixed side embedded component 10I.

[0085] If the third terminal portion 10CT of the third fixed side embedded component 10C is connected to a high potential and the ninth terminal portion 10IT of the ninth fixed side embedded component 10I is connected to a low potential, the current flows into the third fixed side metal component 5F3 through the third terminal portion 10CT. Then, the current flows through the third wire SA3 and further through the second movable side metal component 5M2. Then, the current flows through the right exposed portion 8A1 and the upper right exposed portion 8A3 of the first movable side conductive component 8A, through the first inner portion 6N1 on the right rear side of the first flexible metal component 6A, the first elastic arm portion 6G1 on the right side, and the first outer portion 6E1, and then flows into the ninth terminal portion 10IT through the ninth exposed portion 10IP of the ninth fixed side embedded component 10I.

[0086] If the fourth terminal portion 10DT of the fourth fixed side embedded component 10D is connected to a high potential and the ninth terminal portion 10IT of the ninth fixed side embedded component 10I is connected to a low potential, the current flows into the fourth fixed side metal component 5F4 through the fourth terminal portion 10DT. Then, the current flows through the fourth wire SA4 and further through the second movable side metal component 5M2. Then, the current flows through the right exposed portion 8A1 and the upper right exposed portion 8A3 of the first movable side conductive component 8A, through the first inner portion 6N1 on the right rear side of the first flexible metal component 6A, the first elastic arm portion 6G1 on the right side, and the first outer portion 6E1, and then flows into the ninth terminal portion 10IT through the ninth exposed portion 10IP of the ninth fixed side embedded component 10I.

[0087] When either the first terminal portion 10AT or the second terminal portion 10BT is connected to a high potential, the path of the current flowing from the first movable-side metal member 5M1 to the ninth terminal portion 10IT of the ninth fixed-side embedded member 10I is the same. Also, when either the third terminal portion 10CT or the fourth terminal portion 10DT is connected to a high potential, the path of the current flowing from the second movable-side metal member 5M2 to the ninth terminal portion 10IT of the ninth fixed-side embedded member 10I is the same.

[0088] Similarly, when the tenth terminal portion 10JT of the tenth fixed side embedded component 10J is connected to a low potential, if the fifth terminal portion 10ET, the sixth terminal portion 10FT, the seventh terminal portion 10GT, and the eighth terminal portion 10HT are connected to a high potential, current flows into the fifth line SA5, the sixth line SA6, the seventh line SA7, and the eighth line SA8, respectively.

[0089] The control unit CTR (see Figure 1 ) By controlling the voltages applied to the first terminal portion 10AT to the tenth terminal portion 10JT, the contraction of each of the first wire SA1 to the eighth wire SA8 can be controlled individually. In addition, the first terminal portion 10AT to the tenth terminal portion 10JT are electrically connected to the conductor pattern located on the outer portion SB1 of the substrate member SB by spray welding or the like. In addition, the control unit CTR can also be configured to detect the resistance value of each of the first wire SA1 to the eighth wire SA8 to perform feedback control on the contraction amount of each of the first wire SA1 to the eighth wire SA8. In this case, the control unit CTR can derive the position and posture of the module retaining body 2 based on the resistance value of each of the first wire SA1 to the eighth wire SA8. In addition, the control unit CTR can also be configured in the module driving device MD. In addition, the control unit CTR can also be a component of the module driving device MD.

[0090] With such a configuration, the control unit CTR can swing the module holder 2 around the first axis line AX1 and the second axis line AX2 using the driving force generated by the contraction of the shape memory alloy wire SA as the driving unit DM.

[0091] Next, refer to Figure 7 , based on the module holding body 2 (in the Figure 7 The swing of the movable side metal member 5M mounted on the module holding body 2 in the following description corresponds to the swing of the module holding body 2.

[0092] The control unit CTR typically supplies current to eight shape memory alloy wires SA (first wire SA1 to eighth wire SA8) having the same effective length, respectively, to realize the neutral state of the module driving device MD. The neutral state of the module driving device MD is, for example, a state in which the module holding body 2 is located in the middle of the movable range in each of the three orthogonal axial directions (X-axis direction, Y-axis direction, and Z-axis direction). Typically, in the neutral state of the module driving device MD, the module holding body 2 is located in the center of the movable range in each of the three axial directions.

[0093] Afterwards, the control unit CTR supplies a current larger than the current supplied to the remaining shape memory alloy wires SA to a portion of the eight shape memory alloy wires SA (the first wire SA1 to the eighth wire SA8) by the method disclosed in International Publication No. 2022 / 219984, thereby swinging the module holder 2 (the movable side metal component 5M). At this time, typically, a portion of the eight shape memory alloy wires SA contracts, and the remaining shape memory alloy wires SA extend.

[0094] Specifically, the control unit CTR can swing the movable-side metal member 5M in the direction indicated by the arrow AR1 around the first axis line AX1 by contracting the second wire SA2 , the third wire SA3 , the fourth wire SA4 , and the fifth wire SA5 .

[0095] Furthermore, the control unit CTR can swing the movable-side metal member 5M in the direction indicated by the arrow AR2 around the first axis line AX1 by contracting the first wire SA1 , the sixth wire SA6 , the seventh wire SA7 , and the eighth wire SA8 .

[0096] Furthermore, the control unit CTR can swing the movable-side metal member 5M in the direction indicated by the arrow AR3 around the second axis line AX2 by contracting the first wire SA1 , the second wire SA2 , the fourth wire SA4 , and the seventh wire SA7 .

[0097] Furthermore, the control unit CTR can swing the movable-side metal member 5M in the direction indicated by the arrow AR4 around the second axis line AX2 by contracting the third wire SA3 , the fifth wire SA5 , the sixth wire SA6 , and the eighth wire SA8 .

[0098] Next, refer to Figure 8 The positional relationship between the magnet 9 and the magnetic component MG constituting the urging mechanism EG is described. The magnet 9 includes a first magnet 9A embedded in a first recess 2R1 formed on the lower surface of the module retaining body 2, and a second magnet 9B embedded in a second recess 2R2 formed on the lower surface of the module retaining body 2. The magnetic component MG includes a first metal plate MG1 as an eleventh exposed portion 10KP of an eleventh fixed side embedded component 10K, and a second metal plate MG2 as a twelfth exposed portion 10LP of a twelfth fixed side embedded component 10L, the eleventh fixed side embedded component 10K being one of the fixed side embedded components 10, and the twelfth fixed side embedded component 10L being another of the fixed side embedded components 10. Figure 8 The positional relationship between the magnets 9 (the first magnet 9A and the second magnet 9B) mounted on the module holding body 2 and the fixed side embedded components 10 (the eleventh fixed side embedded component 10K and the twelfth fixed side embedded component 10L) embedded in the base component 18 in the neutral state of the module driving device MD is shown. Specifically, Figure 8 The upper figure is a three-dimensional view of the module holder 2 and the magnet 9 from below. Figure 8 The central figure is a top perspective view of the magnet 9 and the fixed side embedded component 10. Figure 8 The lower figure is a top perspective view of the magnet 9, the fixed-side embedded component 10, and the base component 18.

[0099] The magnetic member MG is a member for generating a magnetic attraction force between the magnet 9 attached to the module holder 2. Figure 8 In the example shown, the magnetic component MG includes a first metal plate MG1 and a second metal plate MG2. The first metal plate MG1 and the second metal plate MG2 are both formed of magnetic metal. Specifically, the first metal plate MG1 forms a part of the eleventh fixed side embedded component 10K, and the second metal plate MG2 forms a part of the twelfth fixed side embedded component 10L. However, the magnetic component MG does not need to be a magnetic metal as long as it can generate magnetic attraction between it and the magnet 9. In this case, the magnetic component MG may also be a magnet. In addition, the magnetic component MG may also be configured as a component independent of the fixed side embedded component 10. In this case, the fixed side embedded component 10 may also be formed of non-magnetic materials such as non-magnetic metals. In addition, the magnetic component MG does not need to be embedded in the base component 18, and may also be adhered to the base component 18.

[0100] In the neutral state of the module drive device MD, if Figure 8 The central image and Figure 8 As shown in the lower figure, the magnet 9 is arranged in a recess 2R formed on the lower surface of the module holder 2 so as to be located directly above the magnetic member MG while being separated from the magnetic member MG by a predetermined distance.

[0101] Moreover, if Figure 8 As shown in the figure below, the force-applying mechanism EG (magnet 9 and magnetic component MG) is configured so that the area of ​​the lower surface of the magnet 9 facing the magnetic component MG is approximately equal to the area of ​​the upper surface of the magnetic component MG facing the magnet 9. This is because when the area of ​​the lower surface of the magnet 9 and the area of ​​the upper surface of the magnetic component MG are significantly different, the magnet 9 is attracted to the magnetic component MG due to the magnetic attraction force generated between the magnet 9 and the magnetic component MG, and the positional relationship between the magnet 9 and the magnetic component MG at rest is deviated.

[0102] Specifically, if Figure 8 As shown in the figure below, the first magnet 9A and the first metal plate MG1 are configured such that the area of ​​the lower surface of the first magnet 9A opposite to the first metal plate MG1 is substantially equal to the area of ​​the upper surface of the first metal plate MG1 opposite to the first magnet 9A. In addition, the second magnet 9B and the second metal plate MG2 are configured such that the area of ​​the lower surface of the second magnet 9B opposite to the second metal plate MG2 is substantially equal to the area of ​​the upper surface of the second metal plate MG2 opposite to the second magnet 9B.

[0103] In addition, Figure 8 In the example shown, the magnet 9 has a substantially cubic shape, but may also have other shapes such as a cylinder or a hexagonal prism. Figure 8 In the example shown, the lower surface of the magnet 9 has a rectangular outer shape, but may have another outer shape such as a circular or hexagonal shape. In this case, the upper surface of the magnetic member MG is preferably configured to have the same outer shape as the lower surface of the magnet 9 .

[0104] Next, refer to Fig. 9 as well as Fig.10 , the function of the force applying mechanism EG is explained. Fig. 9 is a top view of the optical device OD. Specifically, Fig. 9 The above figure is a top view of the optical device OD in which the lens driving device LD is installed on the module driving device MD. Fig. 9 The lower figure is a top view of the optical device OD in a state where the lens driving device LD is detached from the module driving device MD. Fig.10 is a cross-sectional view of the optical device OD, indicating Fig. 9The cross section of the optical device OD in the virtual plane perpendicular to the XY plane and including the single-point dashed line L1 in the figure below. Specifically, Fig.10 The left figure shows the state when no current is supplied to the shape memory alloy wire SA. Fig.10 The right figure of shows a state when current is supplied to the shape memory alloy wire SA and the module driving device MD is in a neutral state.

[0105] In the neutral state of the module drive device MD, if Fig.10 As shown in the right figure of , the center point CP of the inner part SB2 of the substrate part SB on which the imaging element IS is mounted is located at a distance GP1 away from the heat dissipation part HR in the optical axis direction (Z-axis direction). That is, the inner part SB2 is not in contact with the heat dissipation part HR and is in a floating state. In addition, in the illustrated example, the center point CP of the inner part SB2 is the intersection of the lower surface of the inner part SB2 and the optical axis OA. At this time, the magnet 9 embedded in the recess 2R of the module holder 2 is located at a distance DS1 away from the magnetic part MG in the optical axis direction (Z-axis direction).

[0106] If the supply of current to the shape memory alloy wire SA is stopped, the force applying mechanism EG applies force to the module retaining body 2 downward in such a manner that the inner portion SB2 of the substrate component SB and the heat dissipation component HR approach or contact each other. The approach of the inner portion SB2 to the heat dissipation component HR means, for example, that the distance between the center point CP of the inner portion SB2 and the heat dissipation component HR becomes smaller than the distance between the center point CP of the inner portion SB2 and the heat dissipation component HR when the module driving device MD is in a neutral state. Specifically, the magnet 9 and the magnetic component MG constituting the force applying mechanism EG approach each other in such a manner that they attract each other through magnetic force. This is because the shape memory alloy wire SA, which has shrunk and become a straight line due to the supply of current, is brought closer to the heat dissipation component HR due to the cessation of the supply of current. Figure 6 As shown in the figure below, the module holder 2 becomes relaxed and the force lifting the module holder 2 disappears. In other words, when the current is supplied, the shape memory alloy wire SA constituting the driving part DM overcomes the magnetic force (attractive force) acting between the magnet 9 constituting the urging mechanism EG and the magnetic component MG to lift the module holder 2.

[0107] In the example shown in the figure, if the current supply to the shape memory alloy wire SA is stopped, Fig.10As shown in the left figure, the lower surface of the inner part SB2 is in contact with the upper surface of the heat dissipation component HR. That is, the distance between the center point CP of the inner part SB2 and the heat dissipation component HR becomes zero. At this time, the magnet 9 embedded in the recess 2R of the module retaining body 2 approaches the magnetic component MG in the optical axis direction (Z-axis direction) until it is at a position away from the magnetic component MG by a distance DS2. That is, in the illustrated example, even when the supply of current to the shape memory alloy wire SA is stopped, the magnet 9 and the magnetic component MG will not contact each other. This is to prevent the upward movement of the module retaining body 2 from being excessively hindered by the magnetic force (adsorption force) when the supply of current to the shape memory alloy wire SA is started again. In addition, the distance DS2 is the value obtained by subtracting the distance GP1 from the distance DS1. In addition, the module retaining body 2 and the base component 18 will not contact each other. This is to prevent the generation of wear powder due to the contact between the module retaining body 2 and the base component 18.

[0108] Specifically, if Fig.10 As shown in the left figure of , the lower surface of the inner part SB2 is in contact with the upper surface of the heat dissipation member HR as a whole. As a result, the heat generated by the imaging element IS mounted on the upper surface of the inner part SB2 is transferred to the heat dissipation member HR via the lower surface of the inner part SB2 as a whole, and is released to the outside via the heat dissipation member HR. In addition, as long as the heat dissipation of the imaging element IS can be efficiently achieved, the optical device OD can also be configured so that when the current supply to the shape memory alloy wire SA is stopped, the lower surface of the inner part SB2 and the upper surface of the heat dissipation member HR are opposite to each other with a small gap. That is, the inner part SB2 and the heat dissipation member HR do not necessarily need to be in contact.

[0109] In this way, the urging mechanism EG composed of the magnet 9 and the magnetic member MG can move the movable side member MB (module holder 2) downward in such a manner that the lower surface of the inner portion SB2 and the upper surface of the heat dissipation member HR are close to or in contact with each other when the current supply to the shape memory alloy wire SA is stopped. Therefore, when the current supply to the shape memory alloy wire SA is stopped, the urging mechanism EG releases the heat generated by the imaging element IS to the outside through the substrate member SB and the heat dissipation member HR.

[0110] Next, refer to Fig.11 as well as Fig.12 A description will be given of a process in which the control unit CTR switches the operation mode of the module driving device MD (hereinafter referred to as “operation mode switching process”). Fig.11 It is a functional block diagram of the optical device OD. Fig.12 2 is a flowchart showing an example of the flow of the operation mode switching process. The control unit CTR repeatedly executes the operation mode switching process in a predetermined control cycle when power is supplied to the imaging element IS.

[0111] like Fig.11 As shown, the control unit CTR is electrically connected to the driving unit DM of the module driving device MD, the temperature sensor SR mounted on the substrate member SB constituting the optical module OM, and the autofocus driving unit AD of the lens driving device LD constituting the optical module OM.

[0112] First, the control unit CTR determines whether the temperature of the imaging element IS exceeds a predetermined upper limit temperature (step ST1). In the illustrated example, the control unit CTR measures the temperature of the imaging element IS based on the output of the temperature sensor SR mounted near the imaging element IS on the upper surface of the inner portion SB2 of the substrate member SB. The control unit CTR compares the measured temperature of the imaging element IS with a first threshold temperature stored in the nonvolatile storage device of the control unit CTR, and determines that the temperature of the imaging element IS exceeds the predetermined upper limit temperature when the measured temperature of the imaging element IS exceeds the first threshold temperature.

[0113] When it is determined that the temperature of the imaging element IS does not exceed the prescribed upper limit temperature (No in step ST1), the control unit CTR continues to measure the temperature of the imaging element IS. On the other hand, when it is determined that the temperature of the imaging element IS exceeds the prescribed upper limit temperature (Yes in step ST1), the control unit CTR switches the operation mode of the module driving device MD to the high temperature mode (step ST2). In the illustrated example, the control unit CTR allows the supply of current to the coil of the autofocus driving unit AD constituting the lens driving device LD, and stops the supply of current to the shape memory alloy wire SA constituting the driving unit DM of the module driving device MD. That is, the control unit CTR can make the autofocus function available and stop the shake correction function.

[0114] If the current supply to the shape memory alloy wire SA is stopped, the force applying mechanism EG will Fig.10 As shown in the left figure of FIG. 2 , the module holder 2 is forced downward in such a manner that the inner portion SB2 of the substrate member SB and the heat sink HR come into contact with each other. That is, the magnet 9 embedded in the recess 2R of the module holder 2 is attracted by the magnetic member MG, and the inner portion SB2 of the substrate member SB constituting the optical module OM held by the module holder 2 comes into contact with the heat sink HR. Therefore, the control unit CTR can start to dissipate heat from the imaging element IS via the substrate member SB and the heat sink HR. When the heat dissipation of the imaging element IS starts, the temperature of the imaging element IS decreases.

[0115] After that, the control unit CTR determines whether the temperature of the imaging element IS is lower than a predetermined lower limit temperature (step ST3). In the illustrated example, the control unit CTR measures the temperature of the imaging element IS based on the output of the temperature sensor SR. Furthermore, the control unit CTR compares the measured temperature of the imaging element IS with a second threshold temperature stored in the nonvolatile storage device of the control unit CTR, and when the measured temperature of the imaging element IS is lower than the second threshold temperature, determines that the temperature of the imaging element IS is lower than the predetermined lower limit temperature. In addition, the second threshold temperature is a temperature lower than the first threshold temperature.

[0116] When it is determined that the temperature of the imaging element IS is not lower than the prescribed lower limit temperature (No in step ST3), the control unit CTR continues to measure the temperature of the imaging element IS. On the other hand, when it is determined that the temperature of the imaging element IS is lower than the prescribed lower limit temperature (Yes in step ST3), the control unit CTR switches the operation mode of the module driving device MD to the normal mode (step ST4). In the illustrated example, the control unit CTR allows the supply of current to the coil of the autofocus driving unit AD constituting the lens driving device LD, and allows the supply of current to the shape memory alloy wire SA constituting the driving unit DM of the module driving device MD. That is, the control unit CTR can enable the autofocus function and enable the shake correction function.

[0117] If the current is supplied to the shape memory alloy wire SA again, the shape memory alloy wire SA will Fig.10 As shown in the right figure of FIG. 1 , the module holder 2 is moved upward (floated) so that the inner portion SB2 of the substrate member SB and the heat dissipation member HR are separated from each other. Therefore, the control unit CTR can swing the optical module OM held by the module holder 2 around the first axis AX1 and the second axis AX2.

[0118] In this way, the control unit CTR can switch the operation mode of the module driving device MD between the normal mode and the high temperature mode according to the temperature of the imaging element IS. Therefore, when the temperature of the imaging element IS exceeds a predetermined upper limit temperature, the control unit CTR can stop the shake correction function but continue the autofocus function. In addition, after stopping the shake correction function, the control unit CTR can restart the shake correction function when the temperature of the imaging element IS falls below a predetermined lower limit temperature.

[0119] As mentioned above, Figure 1 as well as Figure 2As shown, the module driving device MD of the embodiment of the present application comprises: a movable side part MB, which includes a module holding body 2 capable of holding an optical module OM, wherein the optical module OM has a lens body LS, a substrate part SB, and an imaging element IS mounted on the upper surface (the surface on the Z1 side) of the substrate part SB in a manner opposite to the lens body LS in the optical axis direction; a fixed side part FB which is arranged to be non-movable relative to a heat dissipation part HR for dissipating heat generated by the imaging element IS; and a driving part DM for moving the movable side part MB relative to the fixed side part FB by using a plurality of shape memory alloy wires SA provided between the fixed side part FB and the movable side part MB. In addition, as Figure 3 As shown in FIG. 1 , the module driving device MD further includes a biasing mechanism EG for biasing the module holding body 2 toward the side (Z2 side, lower side) of the heat sink HR facing the lower surface (Z2 side surface) of the substrate member SB. The biasing mechanism EG is configured to bias the module holding body 2 in such a manner that the substrate member SB (inner portion SB2) and the heat sink HR, which are separated from each other when the shape memory alloy wire SA is energized, approach or contact each other when the shape memory alloy wire SA is not energized.

[0120] This structure stops the power supply to the shape memory alloy wire SA when the temperature of the imaging element IS becomes high, so that the substrate member SB (inner part SB2) and the heat dissipation member HR are close to or in contact with each other. Therefore, this structure can dissipate the heat generated by the imaging element IS mounted on the substrate member SB to the outside via the substrate member SB (inner part SB2) and the heat dissipation member HR. Therefore, this structure does not require a separate driving mechanism for moving the heat dissipation member HR. In addition, since this structure does not move the heat dissipation member HR, it is easy to increase the size of the heat dissipation member HR (easy to improve the heat dissipation effect) compared with a structure having a driving mechanism for moving the heat dissipation member HR.

[0121] In addition, the urging mechanism EG may also be composed of a magnet 9 provided on one side of the movable side part MB or the optical module OM and the fixed side part FB, and a magnetic component MG provided on the other side of the movable side part MB or the optical module OM and the fixed side part FB. In the illustrated example, the urging mechanism EG includes a magnet 9 provided on the movable side part MB (module retaining body 2), and a magnetic component MG (a first metal plate MG1 (the eleventh exposed portion 10KP of the eleventh fixed side embedded part 10K) and a second metal plate MG2 (the twelfth exposed portion 10LP of the twelfth fixed side embedded part 10L)) provided on the fixed side part FB (base part 18). However, the urging mechanism EG may also be composed of a magnet provided on the optical module OM, such as a magnet of a voice coil motor constituting the autofocus drive unit AD.

[0122] This configuration brings about an effect that the urging mechanism EG can be realized with a simple structure.

[0123] In addition, the fixed side part FB may also include a base part 18. In this case, the module holder 2 may also have an opposing portion 2F that is opposed to the upper surface of the base part 18 in the optical axis direction. Moreover, in a top view along the optical axis direction, a plurality of magnets 9 may also be provided at different positions in the opposing portion 2F. Moreover, a plurality of magnetic parts MG are provided opposite to the plurality of magnets 9 and are embedded in the base part 18. In the example shown in the figure, the magnets 9 are as shown in FIG. Figure 8 As shown in the above figure, it includes a first magnet 9A and a second magnet 9B, the first magnet 9A is embedded in a first recess 2R1 formed on the lower surface of the first seat portion 2D1 as a part of the opposing portion 2F and fixed by an adhesive, and the second magnet 9B is embedded in a second recess 2R2 formed on the lower surface of the second seat portion 2D2 as another part of the opposing portion 2F and fixed by an adhesive. In addition, the magnetic component MG includes a first metal plate MG1 and a second metal plate MG2, the first metal plate MG1 is a part of the eleventh fixed side embedded component 10K embedded in the base component 18, and is exposed from the upper surface of the base component 18 in a manner opposite to the first magnet 9A, and the second metal plate MG2 is a part of the twelfth fixed side embedded component 10L embedded in the base component 18, and is exposed from the upper surface of the base component 18 in a manner opposite to the second magnet 9B.

[0124] This configuration brings about an effect that the urging mechanism EG can more reliably urge the module holding body 2 .

[0125] In addition, the driving unit DM may be configured to swing the module holder 2 around two axes intersecting the optical axis OA. In addition, the two axes are not physical rotation axes. Figure 2 As shown in the figure, the module holder 2 is configured to be able to swing around the first axis AX1 and the second axis AX2 which are virtual lines.

[0126] This configuration has an effect of being able to cope with larger shakes than the shake correction function achieved by parallel movement of the module holder 2 in the X-axis direction and the Y-axis direction.

[0127] In addition, if Figure 7 As shown, the driving part DM may be composed of eight shape memory alloy wires SA (first wire SA1 to eighth wire SA8).

[0128] This configuration brings about an effect of being able to improve the response speed of the shake correction function compared to a case where the drive unit is constituted by a smaller number of shape memory alloy wires SA.

[0129] In addition, if Fig.10 As shown in the right figure of , the force applying mechanism EG may also be configured to apply force to the module holder 2 in such a manner that the substrate member SB (inner portion SB2) and the heat dissipation member HR, which are separated from each other when the temperature of the imaging element IS is below a predetermined temperature, approach or contact each other when the temperature of the imaging element IS exceeds a predetermined temperature. Fig.10 In the example shown in the left figure of FIG. , when the temperature of the imaging element IS exceeds a predetermined temperature, the urging mechanism EG urges the module holder 2 downward so that the inner portion SB2 of the substrate member SB and the heat dissipation member HR come into contact with each other.

[0130] This configuration has an effect of being able to suppress the high temperature state of the imaging element IS from continuing.

[0131] In addition, the temperature of the imaging element IS may also be monitored by a temperature sensor SR (see Figure 2 ) detection.

[0132] This configuration brings about an effect that the temperature sensor SR can be provided near the imaging element IS. In addition, this configuration brings about an effect that the temperature of the imaging element IS can be easily measured.

[0133] Furthermore, the energization of the shape memory alloy wire SA may be stopped when the temperature of the imaging element IS exceeds a predetermined temperature.

[0134] This configuration brings about the effect that when the temperature of the imaging element IS exceeds a predetermined temperature, the substrate member SB (inner portion SB2) on which the imaging element IS is mounted can be more reliably brought close to or in contact with the heat dissipation member HR. Therefore, this configuration brings about the effect that further heat generation of the imaging element IS can be suppressed.

[0135] In addition, the optical module OM may also include a lens holder LH for holding the lens body LS (see Figure 2 ), and an autofocus drive unit AD (see Fig.11 Furthermore, the urging mechanism EG may be configured to urge the module holder 2 so that the substrate member SB and the heat sink member HR are close to or in contact with each other when the shape memory alloy wire SA is not energized, regardless of whether the autofocus drive unit AD is operable.

[0136] This configuration enables the autofocus function to continue to be used even when the image stabilization function is temporarily unavailable, thereby achieving an effect of enabling shooting for a long period of time.

[0137] The preferred embodiments of the present invention are described in detail above. However, the present invention is not limited to the above embodiments. Various modifications and substitutions can be applied to the above embodiments without departing from the scope of the present invention. In addition, the various features described with reference to the above embodiments can be appropriately combined as long as there is no technical contradiction.

[0138] For example, in the above embodiment, the urging mechanism EG is composed of the magnet 9 and the magnetic member MG, but may be composed of a spring. That is, in the above embodiment, the urging mechanism EG is composed to utilize magnetic force, but may be composed to utilize the restoring force of the spring.

[0139] Description of Reference Numerals

[0140] 1…cover component, 1A…side plate portion, 1A1…first side plate portion, 1A2…second side plate portion, 1A3…third side plate portion, 1A4…fourth side plate portion, 1B…top plate portion, 1K…opening, 1S…storage portion, 2…module holding body, 2A…frame portion, 2A1…first extension portion, 2A2…second extension portion, 2A3…third extension portion, 2A4…fourth extension portion, 2D…base portion, 2D1…first base portion, 2D2…second base portion, 2F…opposing portion, 2K…opening, 2R…recessed portion, 2R1…first recessed portion, 2R2…second recessed portion, 4…movable side cover component, 4A…side plate portion, 4A1…first side plate portion, 4A2…second side plate portion, 4A3…third side plate portion, 4A4…fourth side plate portion, 4B …top plate portion, 4K…opening, 4S…storage portion, 5…metal part, 5F…fixed side metal part, 5F1…first fixed side metal part, 5F2…second fixed side metal part, 5F3…third fixed side metal part, 5F4…fourth fixed side metal part, 5F5…fifth fixed side metal part, 5F6…sixth fixed side metal part, 5F7…seventh fixed side metal part, 5F8…eighth fixed side metal part, 5M…movable side metal part, 5M1…first movable side metal part, 5M2…second movable side metal part, 5M3…third movable side metal part, 5M4…fourth movable side metal part, 6…flexible metal part, 6A…first flexible metal part, 6B…second flexible metal part, 6 E…outer portion, 6E1…first outer portion, 6E2…second outer portion, 6G…elastic arm portion, 6G1…first elastic arm portion, 6G2…second elastic arm portion, 6N…inner portion, 6N1…first inner portion, 6N2…second inner portion, 7…buried metal component, 7C…exposed portion, 7C1…first exposed portion, 7C2…second exposed portion, 7C3…third exposed portion, 7C4…fourth exposed portion, 7E…buried portion, 8…movable side conductive component, 8A…first movable side conductive component, 8A1…right side exposed portion, 8A2…rear side exposed portion, 8A3…upper right side exposed portion, 8A4…upper rear side exposed portion, 8B…second movable side conductive component, 8B1…front side exposed portion, 8B2…left side exposed portion , 8B3…upper front side exposed portion, 8B4…upper left side exposed portion, 9…magnet, 9A…first magnet, 9B…second magnet, 10…fixed side embedded component, 10A…first fixed side embedded component, 10AP…first exposed portion, 10AT…first terminal portion, 10B…second fixed side embedded component, 10BP…second exposed portion, 10BT…second terminal portion, 10C…third fixed side embedded component, 10CP…third exposed portion, 10CT…third terminal portion, 10D…fourth fixed side embedded component, 10DP…fourth exposed portion, 10DT…fourth terminal portion, 10E…fifth fixed side embedded component, 10EP…fifth exposed portion, 10ET…fifth terminal portion, 10F…sixth fixed side embedded component,10FP…sixth exposed portion, 10FT…sixth terminal portion, 10G…seventh fixed side embedded component, 10GP…seventh exposed portion, 10GT…seventh terminal portion, 10H…eighth fixed side embedded component, 10HP…eighth exposed portion, 10HT…eighth terminal portion, 10I…ninth fixed side embedded component, 10IP…ninth exposed portion, 10IT…ninth terminal portion, 10J…tenth fixed side embedded component, 10JP…tenth exposed portion, 10JT…tenth terminal portion part, 10K...eleventh fixed side embedded part, 10KP...eleventh exposed part, 10L...twelfth fixed side embedded part, 10LP...twelfth exposed part, 18...base part, 18B...base, 18B1...first base, 18B2...second base, 18B3...third base, 18B4...fourth base, 18D...seat part, 18D1...first seat part, 18D2...second seat part, 18K...opening, AX1...first axis, AX2...second axis Wire, CTR…control unit, DM…driving unit, EG…force applying mechanism, FB…fixed side component, HC…recess, HS…housing, HR…heat dissipation component, IS…imaging element, J1~J4…holding unit, LD…lens driving device, LH…lens holding body, LS…lens body, MB…movable side component, MD…module driving device, MG…magnetic component, MG1…first metal plate, MG2…second metal plate, OA…optical axis, OD…optical device, OM…optical module, SA…shape memory alloy wire, SA1…first wire, SA2…second wire, SA3…third wire, SA4…fourth wire, SA5…fifth wire, SA6…sixth wire, SA7…seventh wire, SA8…eighth wire, SB…substrate component, SB1…outer part, SB2…inner part, SB3…connecting part, SB3L…left connecting part, SB3R…right connecting part, SH…imaging element holding body, SHK…opening, SR…temperature sensor. ,

Claims

1. A module driving device, comprising: a movable side member including a module holder capable of holding an optical module, the optical module having a lens body, a substrate member, and an imaging element mounted on an upper surface of the substrate member so as to face the lens body in an optical axis direction; a fixed side component, which is arranged to be non-movable relative to a heat dissipation component, and the heat dissipation component dissipates heat generated by the imaging element; and a driving unit that moves the movable side member relative to the fixed side member by using a plurality of shape memory alloy wires disposed between the fixed side member and the movable side member, The module driving device is characterized in that: A biasing mechanism is further provided for biasing the module holding body toward the heat dissipation component side facing the lower surface of the substrate component. The urging mechanism urges the module holding body so that the substrate member and the heat dissipation member, which are separated from each other when the shape memory alloy wire is energized, come close to or contact each other when the shape memory alloy wire is not energized.

2. The module driving device according to claim 1, characterized in that: The urging mechanism includes a magnet provided on one of the movable-side member or the optical module and the fixed-side member, and a magnetic member provided on the other of the movable-side member or the optical module and the fixed-side member.

3. The module driving device according to claim 2, characterized in that: The fixed side part includes a base part, The module holding body has an opposing portion that is opposed to the upper surface of the base member in the optical axis direction. The plurality of magnets are disposed at different positions in the opposing portion when viewed from above along the optical axis. A plurality of the magnetic members are provided so as to face the plurality of magnets and are embedded in the base member.

4. The module driving device according to claim 2, characterized in that: The driving unit causes the module holding body to swing around two axes intersecting the optical axis.

5. The module driving device according to claim 4, characterized in that: The driving unit is composed of eight shape memory alloy wires.

6. The module driving device according to any one of claims 1 to 5, characterized in that: The urging mechanism urges the module holding body so that the substrate member and the heat dissipation member, which are separated from each other when the temperature of the imaging element is equal to or lower than a predetermined temperature, come close to or contact each other when the temperature of the imaging element exceeds a predetermined temperature.

7. The module driving device according to claim 6, characterized in that: The temperature of the imaging element is detected by a temperature sensor provided on the substrate member.

8. The module driving device according to any one of claims 1 to 5, characterized in that: The energization of the shape memory alloy wire may be stopped when the temperature of the imaging element exceeds a predetermined temperature.

9. The module driving device according to claim 1, characterized in that: The optical module includes a lens holder for holding the lens body, and an autofocus drive unit for moving the lens holder in the optical axis direction relative to the imaging element. Regardless of whether the autofocus drive unit is operable, the urging mechanism urges the module holder so that the substrate member and the heat dissipation member are brought into proximity or contact with each other when no current is supplied to the shape memory alloy wire.

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