Automatic library building method for electronic component packaging design

Abstract

The invention belongs to the technical field of electronic design, and particularly discloses an automatic library building method for electronic component packaging design, which comprises the following steps: creating a packaging guide, and selecting a packaging library, classification and packaging types; in response to a packaging attribute parameter setting request, a packaging attribute parameter setting interface and a packaging view preview window are presented, and the intelligent engine automatically converts the input packaging attribute parameters into actual packaging elements and displays the actual packaging elements on the packaging view preview window; the intelligent engine instantly updates the encapsulation elements on the preview window of the encapsulation view according to the adjustment of the attribute parameters; after the attribute parameters are adjusted, the encapsulation view is observed in real time in the encapsulation view preview window, and after it is confirmed that the encapsulation view meets the design requirement, an encapsulation file and an encapsulation view display interface are generated through one key; and storing the packaging file in a packaging library. The intelligent degree of electronic component packaging design library building is improved, and the library building efficiency of a designer is improved. The method is suitable for packaging design of electronic components.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic design, and in particular to an automatic library building method for electronic component packaging design. Background Art

[0002] The electronic circuit design process is very complex, mainly including system specifications, architecture design, function and logic design, circuit design, physical design, physical verification, manufacturing, packaging and testing, etc. Before the physical design chip planning, layout and wiring operations, it is necessary to complete the component package library design, that is, to build the appearance of electronic components, including pins, dimensions, etc., for circuit board design.

[0003] The traditional EDA software method of creating package design libraries has some disadvantages, such as: (1) After changing the package size parameters, users cannot observe the updated changes of the package file in time and cannot get the required package feedback in time; (2) For some complex packages, attributes such as pads, shielding layers, Epads, thermal vias, etc. need to be manually added and adjusted to generate the corresponding package content. The operation steps are cumbersome and reduce the efficiency of designers in building libraries; (3) The generated package files are stored in random folders and lack effective management. When reusing the package files, it is impossible to quickly find and use the required package files. Summary of the invention

[0004] The purpose of the present invention is to provide an automated library building method for electronic component packaging design, so as to improve the intelligence level of electronic component packaging design library building and improve the efficiency of designers in library building.

[0005] In order to achieve the above-mentioned purpose, the technical methods adopted by the present invention are as follows: An automated library building method for electronic component packaging design comprises the following steps: S1. Create a package wizard. Select an existing package library or create a new package library according to your needs, select an existing level classification or create a new level classification, and then select the package type. S2. In response to a request to set package attribute parameters, a package attribute parameter setting interface and a package view preview window are presented. The package attribute parameters are input in the package attribute parameter setting interface. The intelligent engine automatically converts the input package attribute parameters into actual package elements and displays them in the package view preview window. When the attribute parameters are adjusted, the intelligent engine instantly updates the package elements in the package view preview window according to the adjustment of the attribute parameters. S3. After adjusting the attribute parameters, observe the package view in real time in the package view preview window. After confirming that the package view meets the design requirements, generate the package file and package view display interface with one click; S4. Save the package file to the selected package library or the newly created package library.

[0006] As a limitation: package types include but are not limited to DIP, PQFP, PFP, BGA, QFP, QFN, SOP, TSOP and SOIC packages.

[0007] As a limitation: Step S2 also includes that when adjusting the attribute parameters, the intelligent engine performs real-time verification on the adjusted attribute parameters to verify whether they exceed the attribute parameters set in the packaging file, and instantly updates the packaging view on the packaging view preview window according to the verified attribute parameters.

[0008] As a limitation: step S4 also includes directly accessing relevant attribute parameters of the package element by clicking on the package element in the package view in the package view display interface, so as to further adjust the package view.

[0009] As a limitation: the intelligent engine includes a data analysis module, an intelligent matching module, a high-precision drawing module, a verification optimization module, and an output module; The data parsing module uses regular expressions and semantic analysis technology to parse the Python script file to obtain the input package attribute parameters; The intelligent matching module uses an intelligent matching algorithm to intelligently match the package attribute parameters obtained by analysis according to the selected package type; The high-precision drawing module uses a vector graphics algorithm to draw and convert according to the selected package type and matching package attribute parameters, and displays it in the package view preview window or package view display interface, and ensures that the drawing accuracy reaches sub-millimeter level; The verification optimization module uses a rule-based verification mechanism to verify the adjusted attribute parameters to see if they exceed the attribute parameters set in the package file. If they do, the package file cannot be created and the package view cannot be displayed. The output module is used to generate package files that meet industry standards and automatically store them in the package library.

[0010] Due to the adoption of the above scheme, the present invention has the following beneficial effects compared with the prior art: The present invention provides an automated library building method for electronic component package design. The intelligent engine automatically converts input package attribute parameters into actual package elements and displays them in a package view preview window. The package elements in the package view preview window are updated in real time according to the adjustment of the attribute parameters. A package file is generated and saved in a package library. The package elements can be automatically generated according to the set attribute parameters, and the update changes of the package view can be observed in real time. The intelligent level of electronic component package design library building is improved, and the efficiency of designer library building is greatly improved. The package files are saved in the package library, and effective management of the package files is realized. When the package files are used again, the corresponding package files can be directly selected from the package library.

[0011] The invention is suitable for the packaging design of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0013] Figure 1 This is a flow chart of an automated library building method for electronic component packaging design according to an embodiment of the present invention; Figure 2 4 is a structural block diagram of the intelligent engine in an embodiment of the present invention. DETAILED DESCRIPTION

[0014] The present invention is further described below in conjunction with embodiments, but those skilled in the art should understand that the present invention is not limited to the following embodiments, and any improvements and equivalent changes made based on the specific embodiments of the present invention are within the scope of protection of the claims of the present invention.

[0015] Embodiment A method for automatically building a library for electronic component packaging design An automated library building method for electronic component packaging design, such as Figure 1 As shown, the following steps are included: S1. Create a package wizard. Select an existing package library or create a new package library according to your needs. Select an existing level classification in the package library or create a new level classification to facilitate classification and management of package files. Then select the package type. The package types include but are not limited to DIP, PQFP, PFP, BGA, QFP, QFN, SOP, TSOP and SOIC packages. S2. In response to a request to set package attribute parameters, a package attribute parameter setting interface and a package view preview window are presented. Package attribute parameters are input in the package attribute parameter setting interface. The intelligent engine automatically converts the input package attribute parameters into actual package elements and displays them in the package view preview window. When adjusting the attribute parameters, the intelligent engine performs real-time verification on the adjusted attribute parameters to verify whether they exceed the attribute parameters set in the package file, and instantly updates the package elements on the package view preview window according to the verified attribute parameters. S3. After adjusting the attribute parameters, observe the package view in real time in the package view preview window. After confirming that the package view meets the design requirements, generate the package file and package view display interface with one click. By clicking the package element in the package view in the package view display interface, directly access the relevant attribute parameters of the package element and make further adjustments. S4. After completing all adjustments, save the package file to the selected package library or the newly created package library. After closing the package view display interface, in the subsequent circuit design process, directly click on the package file in the package library and place it on the PCB diagram for circuit design.

[0016] The structural block diagram of the intelligent engine of this embodiment is as follows Figure 2 As shown, it includes a data parsing module, an intelligent matching module, a high-precision drawing module, a verification optimization module and an output module. The data parsing module parses the Python script file through regular expressions and semantic analysis technology to obtain the input package attribute parameters; the intelligent matching module adopts an intelligent matching algorithm to intelligently match the package attribute parameters obtained by parsing according to the selected package type; the high-precision drawing module adopts a vector graphics algorithm to draw and convert according to the selected package type and the matched package attribute parameters, and displays them in the package view preview window or the package view display interface, and ensures that the drawing accuracy reaches the sub-millimeter level; the verification optimization module adopts a rule-based verification mechanism to verify the adjusted attribute parameters to verify whether they exceed the attribute parameters set in the package file. If they exceed, the package file cannot be created and the package view cannot be displayed; the output module is used to generate package files that meet industry standards and automatically store them in the package library.

Claims

1. A method for automatically building a library for electronic component packaging design, characterized in that: The following steps are involved: S1. Create a package wizard. Select an existing package library or create a new package library according to your needs, select an existing level classification or create a new level classification, and then select the package type. S2. In response to a request to set package attribute parameters, a package attribute parameter setting interface and a package view preview window are presented. The package attribute parameters are input in the package attribute parameter setting interface. The intelligent engine automatically converts the input package attribute parameters into actual package elements and displays them in the package view preview window. When the attribute parameters are adjusted, the intelligent engine instantly updates the package elements in the package view preview window according to the adjustment of the attribute parameters. S3. After adjusting the attribute parameters, observe the package view in real time in the package view preview window. After confirming that the package view meets the design requirements, generate the package file and package view display interface with one click; S4. Save the package file to the selected package library or the newly created package library.

2. The method for automatically building a library for electronic component packaging design according to claim 1, characterized in that: Package types include but are not limited to DIP, PQFP, PFP, BGA, QFP, QFN, SOP, TSOP and SOIC packages.

3. The method for automatically building a library for electronic component packaging design according to claim 1 or 2, characterized in that: Step S2 also includes that when adjusting the attribute parameters, the intelligent engine performs real-time verification on the adjusted attribute parameters to verify whether they exceed the attribute parameters set in the packaging file, and instantly updates the packaging view on the packaging view preview window according to the verified attribute parameters.

4. The method for automatically building a library for electronic component packaging design according to claim 1 or 2, characterized in that: Step S4 also includes directly accessing relevant attribute parameters of the package element by clicking on the package element in the package view in the package view display interface, and further adjusting the package view.

5. The method for automatically building a library for electronic component packaging design according to claim 1 or 2, characterized in that: The intelligent engine includes data analysis module, intelligent matching module, high-precision drawing module, verification optimization module and output module; The data parsing module uses regular expressions and semantic analysis technology to parse the Python script file to obtain the input package attribute parameters; The intelligent matching module uses an intelligent matching algorithm to intelligently match the package attribute parameters obtained by analysis according to the selected package type; The high-precision drawing module uses a vector graphics algorithm to draw and convert according to the selected package type and matching package attribute parameters, and displays it in the package view preview window or package view display interface, and ensures that the drawing accuracy reaches sub-millimeter level; The verification optimization module uses a rule-based verification mechanism to verify the adjusted attribute parameters to see if they exceed the attribute parameters set in the package file. If they do, the package file cannot be created and the package view cannot be displayed. The output module is used to generate package files that meet industry standards and automatically store them in the package library.

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