Automatic film expanding machine for wafer blue film installation

Abstract

The invention provides an automatic film expanding machine for wafer blue film installation, which comprises an installation table, a lower ring seat mechanism, an upper fixing table and an upper ring seat mechanism, and is characterized in that the lower ring seat mechanism is used for installing a wafer, a blue film and a lower installation ring, and the upper ring seat mechanism is used for installing an upper installation ring; the upper ring seat mechanism comprises a blue film pressing plate, a pressing plate driving mechanism, an upper mounting disc and an upper disc driving mechanism, the mode that the lower ring seat mechanism is positioned in advance, the upper ring seat mechanism firstly compresses and then performs film expanding and pressing is adopted, it is guaranteed that an upper mounting ring and a lower mounting ring are evenly expanded in the pressing process, and a blue film has a good expanding state; and the primary and secondary rings are pressed and fixed inside and outside in the state that the blue film is subjected to stable expansion force, so that the attaching quality of the blue film and the wafer is high, and the blue film packaging quality is relatively high.

Description

Technical Field

[0001] The invention relates to the field of discrete device packaging, and in particular to an automatic film expanding machine for installing a blue film on a wafer. Background Art

[0002] In the manufacturing process of discrete devices, the process of fixing and protecting the chips on the wafer with a carrier such as a blue film is called wafer-level packaging, also known as blue film packaging. Usually the package consists of a wafer, a blue film, and a frame. The frame is used to fix and support the blue film and wafer, providing sufficient support strength and stability to ensure that the wafer is stable in the frame.

[0003] In the prior art, the frame mostly adopts a mother-and-child ring structure, also known as a yin-yang ring or a quick-release ring. In the blue film packaging process using the mother-and-child ring structure, there are often problems such as poor blue film expansion effect leading to blue film breakage and abnormal deformation, poor adhesion between the blue film and the wafer, and poor blue film cutting and separation after wafer blue film packaging. Summary of the invention

[0004] The technical problem to be solved by the present invention is: the existing blue film packaging has packaging quality problems such as blue film damage and abnormal deformation, poor adhesion between the blue film and the wafer, and poor cutting and separation of the blue film after wafer blue film packaging. The present invention provides an automatic film expanding machine for wafer blue film installation to solve the above problems.

[0005] The technical solution adopted by the present invention to solve its technical problems is: an automatic film expanding machine for wafer blue film installation, comprising a mounting platform, a lower ring seat mechanism installed on the mounting platform, an upper fixed platform fixed to the mounting platform, and an upper ring seat mechanism installed on the upper fixed platform and located above the lower ring seat mechanism, the lower ring seat mechanism is used to install the wafer, the blue film and the lower mounting ring, the upper ring seat mechanism is used to install the upper mounting ring; the upper ring seat mechanism comprises a blue film pressing plate, a pressing plate driving mechanism, an upper mounting disk and an upper disk driving mechanism, the blue film pressing plate is arranged on The outer periphery of the upper mounting plate; the pressure plate driving mechanism drives the blue film pressure plate to move vertically so that the blue film pressure plate is pressed tightly against the mounting table; the lower ring seat mechanism includes a lower mounting plate and a lower plate driving mechanism, the lower mounting plate is arranged below the upper mounting plate, the lower mounting ring is mounted on the lower mounting plate, and the upper mounting ring is mounted on the upper mounting plate; the upper plate driving mechanism drives the upper mounting plate to move vertically so that the upper mounting plate is pressed against the lower mounting plate; the lower plate driving mechanism drives the lower mounting plate to move vertically.

[0006] Furthermore: a clamping platform is arranged on the lower mounting plate, the lower mounting ring is arranged on the clamping platform, a film cutting knife is arranged on the lower mounting plate, the film cutting knife is annular in shape and is coaxially arranged on the outer periphery of the clamping platform, and the top of the film cutting knife is serrated.

[0007] Furthermore: a plurality of outer ring clamping mechanisms are arranged on the upper mounting plate along the circumferential direction, and the outer ring clamping mechanism includes an outer clamping seat and an outer clamping claw; the middle part of the outer clamping claw is rotatably hingedly installed on the outer clamping seat, and its bottom has a clamping head for clamping the outer circumference of the upper mounting ring; on the upper mounting plate, an outer clamping spring is arranged at the top position corresponding to the outer clamping claw, and the outer clamping spring pushes the outer clamping claw outward.

[0008] Furthermore: a plurality of inner ring clamping mechanisms are arranged on the clamping platform in the circumferential direction, and the inner ring clamping mechanism includes an inner clamping seat, an inner clamping spring is arranged radially on the inner clamping seat, an inner clamping ball is arranged on the top of the inner clamping spring, and the inner clamping spring pushes the inner clamping ball outward.

[0009] Further: the pressure plate driving mechanism includes a pressure plate cylinder, a pressure plate guide column and a pressure plate guide sleeve; the pressure plate guide sleeve is vertically fixed on the upper fixed platform, the pressure plate guide column is inserted into the pressure plate guide sleeve and its bottom is fixedly connected to the blue film pressure plate; the pressure plate cylinder is vertically fixed on the upper fixed platform, and its piston rod is connected to the blue film pressure plate.

[0010] Further: the upper plate driving mechanism includes an upper plate cylinder, an upper plate guide column and an upper plate guide sleeve; the upper plate guide sleeve is vertically fixed on the upper fixed platform, the upper plate guide column is passed through the upper plate guide sleeve and its bottom is fixedly connected to the upper mounting plate; the upper plate cylinder is vertically fixed on the upper fixed platform, and its piston rod is connected to the upper mounting plate.

[0011] Further: the lower plate driving mechanism includes a motor base fixedly arranged on the mounting platform, a lower plate driving motor vertically fixedly arranged on the motor base, a lower plate driving screw arranged on the output end of the lower plate driving motor, a lower plate driving nut installed on the lower plate driving screw, a lower movable platform, a lower plate guide column and a lower plate guide sleeve, the lower plate guide sleeve is vertically fixedly arranged on the mounting platform, and the lower plate guide column is passed through the lower plate guide sleeve; the upper end of the lower plate guide column is fixedly connected to the lower mounting plate, and the lower end thereof is fixedly connected to the lower movable platform, and the lower plate driving nut is fixedly connected to the lower movable platform.

[0012] Furthermore: the upper surface of the lower mounting plate is provided with an exhaust hole, and the exhaust hole is connected to the vacuum tube; the lower mounting plate is also provided with a heating rod and a temperature sensor.

[0013] Furthermore: the bottom surface of the upper mounting plate is provided with embossing, and the upper mounting plate is also provided with a plurality of vacuum suction cups.

[0014] The beneficial effect of the present invention is that an automatic film expanding machine for wafer blue film installation adopts a lower ring seat mechanism for pre-positioning, and the upper ring seat mechanism is first tightened and then the film is expanded and pressed to ensure that the upper and lower mounting rings are evenly expanded during the pressing process, and the blue film has a good expansion state. The inner and outer press-fitting of the mother and child rings is carried out under the state of stable expansion force on the blue film, and the attachment quality of the blue film to the wafer is high; at the same time, the blue film is automatically peeled off after the mother and child rings are fixed, and the incision is smooth, with high blue film packaging quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 It is a schematic diagram of the overall structure of an automatic film expanding machine for wafer blue film installation according to the present invention; Figure 2 yes Figure 1 The schematic diagram of the mechanism of the upper ring seat mechanism is omitted; Figure 3 is a partial schematic diagram of the expansion film pressing portion where the upper mounting ring is to be pressed against the lower mounting ring; Figure 4 It is a partial schematic diagram of the expanded membrane pressing part where the upper mounting ring and the lower mounting ring are pressed together; Figure 5 and Figure 6 It is a structural schematic diagram of the lower ring seat mechanism installed on the mounting platform from different angles; Figure 7 , Fig. 9 Schematic diagram of the local structure of the lower ring seat mechanism from different angles; Figure 8 yes Figure 7 A local enlarged view of point B in FIG. Fig.10 and Fig.11 It is a structural diagram of the upper ring seat mechanism from different angles; Fig.12 yes Fig.10 The structural schematic diagram of the blue film pressing plate and the installation structure is omitted; Fig.13 yes Fig.11 The schematic diagram of the structure of the blue film pressing plate is omitted; Fig.14 This is the installation diagram of the outer ring clamping mechanism; Fig.15 yes Fig.14 A partial enlarged view of point A in the figure.

[0017] In the figure, 1, mounting table, 2, upper fixing table, 3, wafer, 4, blue film, 5, lower mounting ring, 6, upper mounting ring, 7, blue film pressure plate, 8, upper mounting plate, 9, lower mounting plate, 10, clamping table, 11, film cutting knife, 12, outer ring clamping mechanism, 13, outer clamping seat, 14, outer clamping claw, 15, outer clamping spring, 16, inner ring clamping mechanism, 17, inner clamping seat, 18, inner clamping spring, 19, inner clamping ball, 20, pressure plate cylinder , 21. Pressure plate guide pin, 22. Pressure plate guide sleeve, 23. Upper plate cylinder, 24. Upper plate guide pin, 25. Upper plate guide sleeve, 26. Motor seat, 27. Lower plate drive motor, 28. Lower plate drive screw, 29. Lower plate drive nut, 30. Lower movable table, 31. Lower plate guide pin, 32. Lower plate guide sleeve, 33. Exhaust hole, 34. Vacuum tube, 35. Heating rod, 36. Temperature sensor, 37. Embossing, 38. Vacuum suction cup. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limitations of the present invention. On the contrary, embodiments of the present invention include all changes, modifications and equivalents that fall within the spirit and connotation of the appended claims.

[0019] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0020] In addition, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0021] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention belong.

[0022] like Figures 1 to 15 As shown, the present invention provides an automatic film expanding machine for wafer blue film installation, comprising a mounting platform 1, a lower ring seat mechanism installed on the mounting platform 1, an upper fixed platform 2 fixed to the mounting platform 1, and an upper ring seat mechanism installed on the upper fixed platform 2 and located above the lower ring seat mechanism, the lower ring seat mechanism is used to install a wafer 3, a blue film 4 and a lower mounting ring 5, the upper ring seat mechanism is used to install an upper mounting ring 6; the upper ring seat mechanism comprises a blue film pressing plate 7, a pressing plate driving mechanism, an upper mounting disk 8 and an upper disk driving mechanism, the blue film pressing plate 7 is arranged on the upper mounting disk 8 the outer periphery of the blue film pressing plate 7; the pressing plate driving mechanism drives the blue film pressing plate 7 to move vertically so that the blue film pressing plate 7 is pressed tightly against the mounting table 1; the lower ring seat mechanism includes a lower mounting plate 9 and a lower plate driving mechanism, the lower mounting plate 9 is arranged below the upper mounting plate 8, the lower mounting ring 5 is mounted on the lower mounting plate 9, and the upper mounting ring 6 is mounted on the upper mounting plate 8; the upper plate driving mechanism drives the upper mounting plate 8 to move vertically so that the upper mounting plate 8 is pressed against the lower mounting plate 9; the lower plate driving mechanism drives the lower mounting plate 9 to move vertically.

[0023] The automatic film expansion machine is used in the installation of the mother-child ring and the wafer 3. The child ring is smaller and can be used to fix the edge of the wafer 3. The mother ring is larger and can be put on the outside of the child ring. The two are tightly fixed together by pressing, thereby fixing the wafer 3. The wafer 3 that has completed the blue film encapsulation through the ring structure can ensure that the wafer 3 remains stable during processing, transportation and storage, and will not move or be damaged. In this application, the child ring is the lower mounting ring 5, and the mother ring is the upper mounting ring 6.

[0024] The automatic film expanding machine of the present application is used for expanding the blue film 4 and pressing and installing the parent and child rings. The processing process is: the upper ring seat mechanism and the lower ring seat mechanism are now in a state of being separated up and down. When preparing for installation, the wafer 3 is placed on the upper surface of the lower mounting plate 9, and then the lower mounting ring 5 is installed on the lower mounting plate 9, and the surface of the lower mounting ring 5 and the wafer 3 is covered with the blue film 4, and then the upper mounting ring 6 is installed on the upper mounting plate 8.

[0025] The pressure plate driving mechanism drives the blue film pressure plate 7 to move vertically, pressing the blue film pressure plate 7 tightly against the surface of the blue film 4 on the mounting table 1, so that the blue film 4 is tightly attached to the lower mounting ring 5 and the surface of the wafer 3. This process expands the blue film 4. After the film expansion operation is completed, it is adhered to the wafer 3 and pressed tightly against each other, so that the blue film 4 is expanded and stretched on the wafer 3.

[0026] Then the upper disk driving mechanism drives the upper mounting disk 8 to move vertically, and the upper mounting disk 8 is pressed against the lower mounting disk 9, and the upper mounting ring 6 on the upper mounting disk 8 can be pressed against the outer periphery of the lower mounting ring 5, and because the blue film 4 was originally covered on the lower mounting ring 5 and the wafer 3, the blue film 4 is naturally embedded between the lower mounting ring 5 and the upper mounting ring 6, so that the blue film 4 in the expanded state and the wafer 3 are fixed to each other, and the blue film package is installed. In the process of the upper mounting ring 6 pressing the lower mounting ring 5 downward, the upper mounting ring 6 presses downward to expand the blue film 4, and the blue film 4 is evenly expanded at all places, ensuring the expansion effect of the blue film 4, and at the same time, the upper mounting ring 6 and the lower mounting ring 5 can be pressed and fixed to each other after the expansion is completed. The blue film 4 is installed under continuous expansion to complete the mother-and-child ring installation, and the internal expansion force does not change. The state of the blue film 4 is stable, and it has a good attachment effect on the wafer 3.

[0027] Finally, the lower plate driving mechanism drives the lower mounting plate 9 to move vertically, and the lower mounting plate 9 rises, tearing and peeling off the blue film of the wafer that has completed the blue film packaging from the whole blue film 4, thus completing the entire film expansion packaging process.

[0028] The lower mounting plate 9 is provided with a clamping platform 10, the lower mounting ring 5 is sleeved on the clamping platform 10, and the lower mounting plate 9 is provided with a film cutting knife 11, the film cutting knife 11 is annular in shape and is coaxially arranged on the outer periphery of the clamping platform 10, and the top of the film cutting knife 11 is serrated.

[0029] The lower mounting ring 5 is sleeved and installed on the outer periphery of the clamp table 10, and the wafer 3 is placed on the table of the clamp table 10. When the upper mounting plate 8 is pressed against the lower mounting plate 9, the upper mounting ring 6 is installed and sleeved on the lower mounting ring 5. During this installation process, the upper mounting ring 6 is pressed on the top of the blue film 4 and the blue film 4 is pressed against the top surface of the film cutting knife 11. The serrated shape on the top of the film cutting knife 11 will pierce the blue film 4 from bottom to top, forming a pin-shaped small hole on the blue film 4, so that a circular cutting track composed of several pins can be pierced on the blue film 4; finally, when the lower mounting plate 9 rises, the blue film of the wafer that has completed the film expansion package will be peeled off from the whole piece of blue film 4, and it will be easily peeled off from the above-mentioned cutting track. This method of pre-piercing the cutting track with the film cutting knife 11 can facilitate peeling on the one hand, and on the other hand, it can ensure the flatness of the peeling fracture on the blue film 4, without generating burrs, and will not cause the blue film 4 to be stretched and deformed, thereby improving the packaging quality of the wafer 3.

[0030] A plurality of outer ring clamping mechanisms 12 are arranged on the upper mounting plate 8 along the circumferential direction, and the outer ring clamping mechanism 12 includes an outer clamping seat 13 and an outer clamping claw 14; the middle part of the outer clamping claw 14 is rotatably hingedly installed on the outer clamping seat 13, and the bottom thereof has a chuck for clamping the outer periphery of the upper mounting ring 6; on the upper mounting plate 8, an outer clamping spring 15 is arranged at the top position corresponding to the outer clamping claw 14, and the outer clamping spring 15 pushes the outer clamping claw 14 outward.

[0031] The outer ring clamping mechanism 12 is arranged on the upper mounting plate 8 and is used to clamp the upper mounting ring 6. The outer clamping spring 15 pushes the top of the outer clamping claw 14 outward, so that the bottom end of the outer clamping claw 14 is inclined inward, so that the multiple outer clamping claws 14 arranged along the circumferential direction are combined to form a contracted clamping claw combination. When the upper mounting ring 6 is placed in this contracted clamping claw combination, the outer clamping spring 15 can push the outer clamping claw 14 outward so that the outer clamping claw 14 can reliably grasp the upper mounting ring 6.

[0032] At the same time, the clamping force provided by the outer clamping spring 15 is limited. When the upper mounting ring 6 and the lower mounting ring 5 are pressed together, due to the reliable connection relationship and binding force between the upper mounting ring 6 and the lower mounting ring 5, when the upper mounting plate 8 is lifted upward, the outer clamping claw 14 will not be able to continue to clamp the upper mounting ring 6, that is, the outer clamping claw 14 is disengaged from the upper mounting ring 6, and the upper mounting ring 6 is left on the outer periphery of the lower mounting ring 5, completing the pressing of the mother-and-child rings. This clamping claw structure that is clamped and positioned before pressing and can be freely disengaged from the outside of the upper mounting ring 6 after pressing meets the pressing requirements of the mother-and-child rings.

[0033] A plurality of inner ring clamping mechanisms 16 are arranged on the clamping platform 10 along the circumferential direction, and the inner ring clamping mechanism 16 includes an inner clamping seat 17, and an inner clamping spring 18 is arranged radially on the inner clamping seat 17. An inner clamping ball 19 is arranged at the top end of the inner clamping spring 18, and the inner clamping spring 18 pushes the inner clamping ball 19 outward.

[0034] The lower mounting ring 5 is mounted on the clamping platform 10, which is circular. The lower mounting ring 5 can be positioned, and the inner ring clamping mechanism 16 clamps the inner ring of the lower mounting ring 5. The inner clamping spring 18 presses the inner clamping ball 19 against the inner ring of the lower mounting ring 5, and the inner clamping ball 19 can roll to adjust the contact position, so that the inner ring of the lower mounting ring 5 is reliably pressed.

[0035] The inner ring clamping mechanism 16 plays a positioning role on the lower mounting ring 5, preventing the lower mounting ring 5 from moving. In this way, after the wafer 3 is placed on the clamping table 10 and the blue film 4 is expanded, it can be ensured that the positions of the blue film 4 will not change during the expansion process, thereby improving the position accuracy of the blue film 4 and the wafer 3 after packaging and improving the packaging quality.

[0036] The pressure plate driving mechanism includes a pressure plate cylinder 20, a pressure plate guide column 21 and a pressure plate guide sleeve 22; the pressure plate guide sleeve 22 is vertically fixed on the upper fixed platform 2, the pressure plate guide column 21 is inserted into the pressure plate guide sleeve 22 and its bottom is fixedly connected to the blue film pressure plate 7; the pressure plate cylinder 20 is vertically fixed on the upper fixed platform 2, and its piston rod is connected to the blue film pressure plate 7.

[0037] The upper plate driving mechanism includes an upper plate cylinder 23, an upper plate guide column 24 and an upper plate guide sleeve 25; the upper plate guide sleeve 25 is vertically fixed on the upper fixed platform 2, the upper plate guide column 24 is inserted into the upper plate guide sleeve 25 and its bottom is fixedly connected to the upper mounting plate 8; the upper plate cylinder 23 is vertically fixed on the upper fixed platform 2, and its piston rod is connected to the upper mounting plate 8.

[0038] The structure of guide pins and guide sleeves can achieve precise guidance in the linear direction, improve the movement accuracy of the blue film pressure plate 7 and the upper mounting plate 8, and use cylinders as power sources. The control is convenient and the movement is sensitive, and efficient linear drive can be performed, thereby improving the utilization efficiency of the equipment.

[0039] The lower plate driving mechanism includes a motor base 26 fixedly arranged on the mounting platform 1, a lower plate driving motor 27 vertically fixedly arranged on the motor base 26, a lower plate driving screw 28 arranged at the output end of the lower plate driving motor 27, a lower plate driving nut 29 installed on the lower plate driving screw 28, a lower movable platform 30, a lower plate guide column 31 and a lower plate guide sleeve 32, the lower plate guide sleeve 32 is vertically fixedly arranged on the mounting platform 1, and the lower plate guide column 31 is penetrated in the lower plate guide sleeve 32; the upper end of the lower plate guide column 31 is fixedly connected to the lower mounting plate 9, and the lower end thereof is fixedly connected to the lower movable platform 30, and the lower plate driving nut 29 is fixedly connected to the lower movable platform 30.

[0040] The linear drive mode in which a motor drives the lead screw and further drives the nut has high linear drive control accuracy and can realize the precise control of the lower movable table 30. Because the lower movable table 30 is moved after the blue film 4 is expanded and the upper mounting ring 6 is pressed, its main purpose is to peel off the encapsulated wafer 3 and the mounting ring as a whole from the original blue film 4. If a linear actuator such as a cylinder is used, the driving speed and stroke are uncontrollable. This process requires the lower movable table 30 to perform upward peeling movement at a stable moving speed. Therefore, this driving mode can meet the requirements and achieve a better peeling effect, avoiding deformation of the blue film 4.

[0041] The upper surface of the lower mounting plate 9 is provided with an air extraction hole 33, and the air extraction hole 33 is connected to a vacuum tube 34; the lower mounting plate 9 is also provided with a heating rod 35 and a temperature sensor 36. The air extraction hole 33 can form a negative pressure between the lower mounting plate 9 and the blue film 4, ensuring that the blue film 4 can be stably and reliably attached to the lower mounting plate 9 and the surface of the wafer 3, and at the same time, the existence of air holes on the surface of the blue film 4 and the wafer 3 is eliminated, thereby improving the packaging quality of the blue film.

[0042] The heating rod 35 and the temperature sensor 36 can be used to reliably heat the lower mounting plate 9, which can promote the softening of the blue film 4, facilitate the expansion and pressing of the blue film 4, improve the fit with the surface of the wafer 3, and improve the packaging quality.

[0043] The bottom surface of the upper mounting plate 8 is provided with embossing 37, and the upper mounting plate 8 is also provided with a plurality of vacuum suction cups 38. The embossing 37 increases the contact friction force of the upper mounting plate 8 on the surface of the blue film 4, and the vacuum suction cups 38 can stabilize the blue film 4 on the lower mounting table 1, and press the blue film 4 stably and reliably around, so that the position displacement of the blue film 4 can be avoided during the film expansion process in the middle, and the packaging quality of the film expansion and the surface of the wafer 3 is improved.

[0044] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0045] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An automatic film expander for wafer blue film installation, characterized in that: The invention comprises a mounting platform (1), a lower ring seat mechanism mounted on the mounting platform (1), an upper fixing platform (2) fixed to the mounting platform (1), and an upper ring seat mechanism mounted on the upper fixing platform (2) and located above the lower ring seat mechanism. The lower ring seat mechanism is used to mount a wafer (3), a blue film (4) and a lower mounting ring (5), and the upper ring seat mechanism is used to mount an upper mounting ring (6); The upper ring seat mechanism comprises a blue film pressing plate (7), a pressing plate driving mechanism, an upper mounting plate (8) and an upper plate driving mechanism, wherein the blue film pressing plate (7) is arranged on the outer periphery of the upper mounting plate (8); the pressing plate driving mechanism drives the blue film pressing plate (7) to move vertically so that the blue film pressing plate (7) is pressed tightly against the mounting platform (1); The lower ring seat mechanism comprises a lower mounting plate (9) and a lower plate driving mechanism, the lower mounting plate (9) being arranged below the upper mounting plate (8), the lower mounting ring (5) being mounted on the lower mounting plate (9), and the upper mounting ring (6) being mounted on the upper mounting plate (8); The upper plate driving mechanism drives the upper mounting plate (8) to move vertically so that the upper mounting plate (8) is pressed against the lower mounting plate (9); and the lower plate driving mechanism drives the lower mounting plate (9) to move vertically.

2. The automatic film expander for wafer blue film installation according to claim 1, characterized in that: The lower mounting plate (9) is provided with a clamping platform (10), the lower mounting ring (5) is sleeved on the clamping platform (10), and the lower mounting plate (9) is provided with a film cutting knife (11), the film cutting knife (11) is annular in shape and is coaxially arranged on the outer periphery of the clamping platform (10), and the top of the film cutting knife (11) is serrated.

3. The automatic film expander for wafer blue film installation according to claim 2, characterized in that: A plurality of outer ring clamping mechanisms (12) are arranged on the upper mounting plate (8) along the circumferential direction, and the outer ring clamping mechanism (12) includes an outer clamping seat (13) and an outer clamping claw (14); the middle part of the outer clamping claw (14) is rotatably hingedly mounted on the outer clamping seat (13), and the bottom part thereof has a clamping head for clamping the outer circumference of the upper mounting ring (6); on the upper mounting plate (8), an outer clamping spring (15) is arranged at a position corresponding to the top of the outer clamping claw (14), and the outer clamping spring (15) pushes the outer clamping claw (14) outward.

4. The automatic film expander for wafer blue film installation according to claim 3, characterized in that: A plurality of inner ring clamping mechanisms (16) are arranged on the clamping platform (10) along the circumferential direction. The inner ring clamping mechanism (16) includes an inner clamping seat (17). An inner clamping spring (18) is arranged on the inner clamping seat (17) along the radial direction. An inner clamping ball (19) is arranged at the top end of the inner clamping spring (18). The inner clamping spring (18) pushes the inner clamping ball (19) outward.

5. The automatic film expander for wafer blue film installation according to claim 3, characterized in that: The pressure plate driving mechanism comprises a pressure plate cylinder (20), a pressure plate guide column (21) and a pressure plate guide sleeve (22); the pressure plate guide sleeve (22) is vertically fixedly arranged on the upper fixed platform (2), the pressure plate guide column (21) is inserted into the pressure plate guide sleeve (22) and its bottom is fixedly connected to the blue film pressure plate (7); the pressure plate cylinder (20) is vertically fixedly arranged on the upper fixed platform (2), and its piston rod is connected to the blue film pressure plate (7).

6. The automatic film expander for wafer blue film installation according to claim 5, characterized in that: The upper plate driving mechanism comprises an upper plate cylinder (23), an upper plate guide column (24) and an upper plate guide sleeve (25); the upper plate guide sleeve (25) is vertically fixedly arranged on the upper fixed platform (2), the upper plate guide column (24) is inserted into the upper plate guide sleeve (25) and its bottom is fixedly connected to the upper mounting plate (8); the upper plate cylinder (23) is vertically fixedly arranged on the upper fixed platform (2), and its piston rod is connected to the upper mounting plate (8).

7. The automatic film expander for wafer blue film installation according to claim 6, characterized in that: The lower plate driving mechanism comprises a motor base (26) fixedly mounted on the mounting platform (1), a lower plate driving motor (27) vertically fixedly mounted on the motor base (26), a lower plate driving screw (28) arranged at the output end of the lower plate driving motor (27), a lower plate driving nut (29) mounted on the lower plate driving screw (28), a lower movable platform (30), a lower plate guide column (31) and a lower plate guide sleeve (32), wherein the lower plate guide sleeve (32) is vertically fixedly mounted on the mounting platform (1), and the lower plate guide column (31) is inserted into the lower plate guide sleeve (32); the upper end of the lower plate guide column (31) is fixedly connected to the lower mounting platform (9), and the lower end thereof is fixedly connected to the lower movable platform (30), and the lower plate driving nut (29) is fixedly connected to the lower movable platform (30).

8. The automatic film expander for wafer blue film installation according to claim 4, characterized in that: An air extraction hole (33) is provided on the upper surface of the lower mounting plate (9), and the air extraction hole (33) is connected to a vacuum tube (34); a heating rod (35) and a temperature sensor (36) are also provided on the lower mounting plate (9).

9. The automatic film expander for wafer blue film installation according to claim 4, characterized in that: The bottom surface of the upper mounting plate (8) is provided with embossing (37), and the upper mounting plate (8) is also provided with a plurality of vacuum suction cups (38).

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