Wafer dispergation control method and device, electronic equipment and storage medium
By obtaining and updating the degluing status of the wafer on the semiconductor packaging production line, the problem of understanding the easily confusing of the glue status is solved, and the control particle size and production efficiency of the production line are improved, and production losses are reduced.
Patent Information
- Application Number
- CN202411956533.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-27
- Publication Date
- 2025-05-06
AI Technical Summary
In traditional semiconductor packaging processes, the deglassing state of wafers is easily confused and leads to production losses.
By obtaining the wafer number, wafer degluing properties and wafer degluing status of the wafer in the wafer queue of the current batch on the production line, if the glue is degluing and the glue has not been deglued, it will be sent to the degluing station for update status; if there is no degluing or degluing, it will be sent to the core station to recycle and store the degluing properties and status of the remaining wafers.
The particle size of the wafer is improved during semiconductor packaging, eliminates the problem of manual recording and identification of degluing status prone to errors, and reduces production losses.
Smart Images
Figure CN119943714A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a wafer debonding control method, device, electronic device and storage medium. Background Art
[0002] In the semiconductor packaging manufacturing process, wafers, as a raw material, are usually fixed on UV (Ultra-Violet) film or blue film. This film has good viscosity. When the wafer is cut and diced, it can keep the wafer intact, reduce the wafer breakage caused by the cutting process, and ensure that the wafer will not shift or fall during normal cutting and transmission. Before the cut wafer is taken out and cored, the wafer using blue film does not need UV debonding, while the wafer using UV film needs UV debonding (UV process). By irradiating the wafer using UV film with UV light, the viscosity of the UV film can be appropriately reduced to a suitable range, so that during the operation of taking the chip from the wafer, the chip will not fly out, fall or shift due to the vibration of the equipment operation due to the low viscosity of the UV film, nor will it cause abnormal chip removal or glue residue on the back of the chip due to the high viscosity of the UV film. Usually, for products produced on a single wafer, one wafer is a production batch. However, in some packaging processes, the number of products in a production batch is large, and multiple chips are used in one product. Therefore, one production batch will correspond to the use of multiple wafers. After a production batch is completed, there will be remaining wafers. For the next new production batch, there will be multiple newly allocated new wafers that have not been debonded, and there will also be wafers that have been debonded from the previous production batch. It is easy to confuse whether the wafers have been debonded. Summary of the invention
[0003] The main technical problem solved by the implementation methods of the present application is that the debonding state of wafers in the traditional semiconductor packaging process is easily confused, resulting in production losses.
[0004] To solve the above technical problems, the first technical solution adopted in the implementation mode of the present application is: to provide a wafer degumming control method, including: obtaining the wafer number, wafer degumming properties and wafer degumming status of the wafers in the current batch of wafers in the production line; if the wafer degumming property is that degumming is required and the wafer degumming status is not degummed, then sending the corresponding wafer to the degumming station on the production line; updating the wafer degumming status of the wafer after being processed by the degumming station to degummed; if after the update, the wafer degumming property is that degumming is not required, or the wafer degumming property is that degumming is required and the wafer degumming status is degummed, then sending the corresponding wafer to the loading station on the production line; recovering the wafers remaining after being processed by the loading station, and storing the wafer degumming properties and wafer degumming status of the remaining wafers according to the wafer number.
[0005] Optionally, before the step of obtaining the wafer number, wafer debonding properties and wafer debonding status of the wafers in the current batch of wafers queue on the production line, it also includes: obtaining the wafer number of the newly-entered wafer and the material number of the newly-entered wafer; according to the processing procedure corresponding to the material number, setting the wafer debonding property of the newly-entered wafer to require debonding, or not require debonding; if the wafer debonding property of the newly-entered wafer is that debonding is required, setting the wafer debonding status of the newly-entered wafer to not debonded; after receiving the online instruction, sending the corresponding newly-entered wafer to the production line according to the online instruction and the wafer number.
[0006] Optionally, before the step of obtaining the wafer number, wafer degumming properties and wafer degumming status of the wafers in the current batch of wafers in the wafer queue on the production line, it also includes: obtaining the inventory wafers currently in the warehouse and the material numbers corresponding to the inventory wafers according to the stored wafer numbers; setting the wafer degumming properties of the inventory wafers to require degumming or not require degumming according to the processing steps corresponding to the material numbers; setting the wafer degumming status of the inventory wafers to degummed or not degummed according to the current degumming status of the inventory wafers; after receiving the online instruction, sending the corresponding inventory wafers to the production line according to the online instruction and the wafer number.
[0007] Optionally, after the step of sending the corresponding wafer to the debonding station on the production line, it also includes: continuing to detect the wafer debonding properties and wafer debonding status of the wafers in the wafer queue of the current batch; if the wafer debonding property of the detected wafer is that no debonding is required, or the wafer debonding property is that debonding is required and the wafer debonding status is that debonded has been performed, then the wafer being detected is sent to the core loading station on the production line.
[0008] Optionally, after the step of sending the corresponding wafer to the core loading station on the production line, it also includes: continuing to detect the wafer degumming properties and wafer degumming status of the updated wafer; if the wafer degumming properties of the updated wafer are that degumming is required and the wafer degumming status is not degummed, then sending the corresponding updated wafer to the degumming station on the production line.
[0009] Optionally, after the step of storing the wafer debonding properties and wafer debonding status of the remaining wafers according to the wafer number, it also includes: when a new batch of the production line is executed, according to the material number and wafer number contained in the new batch, obtaining the corresponding remaining wafers as wafers to be put online; and sending the wafers to be put online to the wafer queue of the new batch.
[0010] Optionally, after the step of storing the wafer degumming properties and wafer degumming status of the remaining wafers according to the wafer number, it also includes: when a wafer information query instruction is received, parsing the wafer information query instruction to obtain wafer query parameters; according to the wafer query parameters, returning the current wafer degumming properties and wafer degumming status of the queried wafer, as well as the entry time, degumming time, and exit time of the queried wafer at the degumming station.
[0011] In order to solve the above technical problems, the second technical solution adopted in the implementation mode of the present application is: to provide a wafer degumming control device, including: a wafer information acquisition module, used to obtain the wafer number, wafer degumming properties and wafer degumming status of the wafers in the current batch of wafers in the production line; a degumming station inspection module, used to send the corresponding wafer to the degumming station on the production line if the wafer degumming property is that degumming is required and the wafer degumming status is not degummed; a first information update module, used to update the wafer degumming status of the wafer after being processed by the degumming station to degummed; a core loading station inspection module, used to send the corresponding wafer to the core loading station on the production line if the wafer degumming property is that degumming is not required after the update, or the wafer degumming property is that degumming is required and the wafer degumming status is degummed; a second information update module, used to recover the remaining wafers after being processed by the core loading station, and store the wafer degumming properties and wafer degumming status of the remaining wafers according to the wafer number.
[0012] To solve the above technical problems, the third technical solution adopted in the implementation mode of the present application is: to provide an electronic device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the wafer debonding control method as described above.
[0013] In order to solve the above-mentioned technical problems, the fourth technical solution adopted in the implementation mode of the present application is: providing a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores computer-executable instructions. When the computer-executable instructions are executed by an electronic device, the electronic device executes the wafer debonding control method as described above.
[0014] Different from the related art, the present application obtains the wafer number, wafer degumming properties and wafer degumming status of the wafers in the current batch of wafers queue on the production line; if the wafer degumming property is that degumming is required and the wafer degumming status is not degummed, the corresponding wafer is sent to the degumming station on the production line; the wafer degumming status of the wafer after being processed by the degumming station is updated to degummed; if after the update, the wafer degumming property is that degumming is not required, or the wafer degumming property is that degumming is required and the wafer degumming status is degummed, the corresponding wafer is sent to the core loading station on the production line; the remaining wafers after being processed by the core loading station are recovered, and the wafer degumming properties and wafer degumming status of the remaining wafers are stored according to the wafer number; through the above method, the control granularity of wafers in the semiconductor packaging process is improved, which not only eliminates the error-prone problem of traditional manual recording and identification of wafer degumming status, but also further reduces the production loss of the semiconductor packaging process. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.
[0016] Figure 1 It is a schematic diagram of the operating environment of the wafer degumming control method provided in an embodiment of the present application.
[0017] Figure 2 It is a schematic diagram of the execution flow of the wafer degumming control method provided in an embodiment of the present application.
[0018] Figure 3 It is a schematic diagram of the execution flow of processing newly-input wafers in the wafer degumming control method provided in an embodiment of the present application.
[0019] Figure 4 It is a schematic diagram of the execution flow of processing inventory wafers in the wafer degumming control method provided in an embodiment of the present application.
[0020] Figure 5 It is a schematic diagram of the system structure of the wafer degumming control device provided in an embodiment of the present application.
[0021] Figure 6It is a schematic diagram of the hardware structure of an electronic device for executing the wafer debonding control method provided in an embodiment of the present application. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0023] It should be noted that, if there is no conflict, the various features in the embodiments of the present application can be combined with each other, all within the scope of protection of the present application. In addition, although the functional modules are divided in the device schematic diagram and the logical order is shown in the flow chart, in some cases, the steps shown or described can be performed in a different order than the module division in the device schematic diagram or the order in the flow chart.
[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.
[0025] To facilitate understanding of this embodiment, firstly, a wafer dissolution control method disclosed in the embodiment of the present application is described in detail. Figure 1 , Figure 1 Schematic diagram of the operating environment of the wafer dissolution control method provided in the embodiment of the present application, such as Figure 1 As shown, the execution subject of the wafer dissolution control method provided in the embodiment of the present application is generally an electronic device with certain computing capabilities, such as a computer device. In some possible implementations, the wafer dissolution control method can be implemented by a processor calling a computer-readable instruction stored in a memory. Figure 1 The computer device in the term can be a server. The server can be an independent server or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms. It can be understood that Figure 1 The number of computer devices in the figure is only for reference and can be expanded to any number according to actual needs.
[0026] Please continue reading Figure 2 , Figure 2is a schematic diagram of the execution flow of the wafer dissolution control method provided in the embodiment of the present application, such as Figure 2 As shown, the process includes the following steps S1 to S5.
[0027] S1. Obtain the wafer number, wafer disassembly attribute and wafer disassembly status of the wafers in the wafer queue of the current batch on the production line.
[0028] Among them, the wafer number is a number used to uniquely identify each wafer in the semiconductor manufacturing process, which runs through the entire production cycle of the wafer, from the raw materials being put into production to the final packaging and testing. When a chip has a quality problem, the wafer number can be used to trace back to which wafer the chip was cut from, and then the relevant records in the wafer production process can be found, including the quality of raw materials, the status of production equipment, and processing parameters, to determine the root cause of the quality problem. For example, if the chip has abnormal electrical performance, the wafer number can be used to trace back to the wafer production link, and it is found that the equipment fails in a certain photolithography step, resulting in insufficient pattern accuracy, which affects the chip performance. From wafer cutting, grinding, and cleaning to chip photolithography, etching, doping and other processes, each step can record the wafer in and out of the warehouse, processing time, operator and other information through the wafer number, so that production managers can clearly know the location and status of each wafer on the production line, which is convenient for reasonable production planning and improving production efficiency. For example, according to the wafer number, it can be known that a certain wafer has completed the photolithography process, and it should be arranged to enter the etching process equipment for processing. In the inventory management of wafers and chips, the wafer number is an important identifier that can help warehouse managers accurately record information such as inventory quantity, location, and storage time, and classify and store and manage wafers of different types (such as different sizes and different process stages) to ensure the effective implementation of inventory management principles such as first-in-first-out. At the same time, when handing over products to customers or upstream and downstream companies, the wafer number is also an important basis for checking the quantity and quality of products.
[0029] As an optional implementation, please continue to refer to Figure 3 , Figure 3 : is a schematic diagram of the execution flow of processing newly-entered wafers in the wafer dissolution control method provided in the embodiment of the present application, such as Figure 3 As shown, the following steps S21 to S24 may be included.
[0030] S21. Obtain the wafer number of the newly stored wafer and the material number of the newly stored wafer.
[0031] Among them, the newly stored wafers are all in a state of filming and not debonding. The surface of the wafer is a highly precise structure. Extremely small particles, scratches or chemical contamination may have a serious impact on subsequent chip manufacturing. The adhesive layer can serve as a physical barrier to prevent the wafer from directly contacting the external environment during transportation and storage. For example, during transportation, pollutants such as dust and water vapor may be encountered. The adhesive layer can effectively prevent these substances from contacting the surface of the wafer to ensure the cleanliness of the wafer surface. Wafers are usually very thin and brittle, and are prone to displacement or cracking during movement. The adhesive layer can also firmly fix the wafer on a specific carrier (such as a slot or tray inside a wafer box) to keep the position of the wafer stable, which can prevent the wafer from changing position due to shaking, vibration, etc. during transportation, warehousing or inventory management, thereby avoiding collisions between wafers or collisions with the container wall, reducing the risk of wafer damage.
[0032] S22. According to the processing procedure corresponding to the material number, the wafer debonding attribute of the newly-entered wafer is set to require debonding or not require debonding.
[0033] S23. If the wafer debonding attribute of the newly-entered wafer is that debonding is required, the wafer debonding state of the newly-entered wafer is set to undebonded.
[0034] S24. After receiving the online instruction, the corresponding newly stored wafers are sent to the production line according to the online instruction and the wafer number.
[0035] Among them, the online instruction generally includes the current production batch information, and the production batch information includes the material number required for the product corresponding to the current production batch, and the material number can be further associated with at least one corresponding wafer number.
[0036] As another optional implementation, please continue to refer to Figure 4 , Figure 4 is a schematic diagram of the execution flow of processing inventory wafers in the wafer dissolution control method provided in the embodiment of the present application, such as Figure 4 As shown, the following steps S31 to S34 may be included.
[0037] S31. Obtain the inventory wafers currently in stock and the material numbers corresponding to the inventory wafers according to the stored wafer numbers.
[0038] S32. According to the processing procedure corresponding to the material number, the wafer debonding attribute of the inventory wafer is set to require debonding or not require debonding.
[0039] S33. According to the current debonding state of the inventory wafers, the wafer debonding state of the inventory wafers is set to be debonded or undebonded.
[0040] S34. After receiving the online instruction, send the corresponding inventory wafers to the production line according to the online instruction and the wafer number.
[0041] Among them, the debonding of newly-entered wafers and wafers already in the warehouse or on the production line are all controlled, and the debonding status of all wafers can be recorded in the system, so that the system can follow up on the debonding properties and debonding status of each wafer, avoiding the confusion of manual records in the inventory and production process, and thus avoiding production accidents caused by manual recording errors.
[0042] S2. If the wafer disassembly attribute is that disassembly is required, and the wafer disassembly status is not disassembly, the corresponding wafer is sent to the disassembly station on the production line. For the wafer that fails to enter the disassembly station, the corresponding entry prohibition reason and result are also recorded, and the corresponding alarm record can also be generated.
[0043] Among them, in production lines such as semiconductor production lines that involve the use of adhesive materials for processing, the debonding station is a work area or equipment combination specifically used to reduce or eliminate the stickiness of the material, usually located before the process where the parts fixed by the adhesive (such as wafers) need to be removed and subsequently processed. For example, in wafer manufacturing, it is after wafer cutting and before chip core loading, and is a key node connecting wafer cutting and chip packaging.
[0044] As an optional implementation, after the above step S2, for other wafers in the wafer queue of the current batch on the production line, continue to detect the wafer debonding properties and wafer debonding status of the wafers in the wafer queue of the current batch.
[0045] S3. Update the wafer debonding status of the wafer after being processed by the debonding station to debonded.
[0046] S4. If after the update, the wafer disassembly attribute is that disassembly is not required, or the wafer disassembly attribute is that disassembly is required and the wafer disassembly status is that disassembly has been performed, the corresponding wafer is sent to the core loading station on the production line. Among them, for the wafers that fail to enter the core loading station, the corresponding reasons and results of the prohibition are also recorded, and the corresponding alarm records can also be generated.
[0047] Among them, the core loading station is a key process in the semiconductor packaging production line. Its main function is to accurately place the chip from the wafer (after cutting, degumming and other pre-processes) onto the packaged substrate or lead frame and other carriers. This process is like installing a tiny and precise "heart" (chip) into the corresponding "body" (package carrier). It is an important link in the chip packaging process and is directly related to the subsequent electrical connection and overall performance of the chip. In addition, the degumming state of the wafer also affects the core loading process. If the wafer is not fully degummed and the viscosity of the glue is too high, it will be very difficult to pick up the chip. For example, when using a vacuum nozzle to pick up the chip, too high viscosity may cause the chip to be unable to be sucked up, or it may be damaged during the suction process. Because the nozzle needs to overcome the adhesive force of the glue to separate the chip from the wafer, too high viscosity may cause the chip to break or have surface scratches during the separation process, affecting the quality and performance of the chip. On the contrary, if the glue is excessively dissolved and the viscosity of the glue is too low, the chip may be in an unstable state on the wafer. During the chip picking operation, slight vibrations or airflow from the nozzle may cause the chip to shift, making it impossible for the nozzle to accurately pick up the chip. Moreover, this unstable state may cause the chips to collide with each other, increasing the probability of chip damage.
[0048] As an optional implementation, after the above step S4, continue to detect the wafer debonding properties and wafer debonding status of the updated wafer; if the wafer debonding properties of the updated wafer are that debonding is required and the wafer debonding status is not debonded, then send the corresponding updated wafer to the debonding station on the production line.
[0049] S5. Recover the remaining wafers after being processed by the core loading station, and store the wafer debonding properties and wafer debonding states of the remaining wafers according to the wafer numbers.
[0050] As a preferred embodiment, after the above step S5, when a new batch of the production line is executed, the corresponding remaining wafers are obtained as wafers to be put online according to the material number and wafer number contained in the new batch, and then the wafers to be put online are sent to the wafer queue of the new batch.
[0051] As another preferred implementation, when a wafer information query instruction is received, the wafer information query instruction is parsed to obtain wafer query parameters. Then, according to the wafer query parameters, the current wafer dissolution properties and wafer dissolution status of the queried wafer are returned, as well as the entry time, dissolution time, and exit time of the queried wafer at the dissolution station, so as to achieve a full-cycle system record of the dissolution status and process of all wafers, and further improve the granularity of wafer dissolution control.
[0052] The wafer degumming control method provided in the embodiment of the present application obtains the wafer number, wafer degumming attribute and wafer degumming status of the wafers in the wafer queue of the current batch on the production line; if the wafer degumming attribute is that degumming is required and the wafer degumming status is not degummed, the corresponding wafer is sent to the degumming station on the production line; the wafer degumming status of the wafer after being processed by the degumming station is updated to be degummed; if after the update, the wafer degumming attribute is that degumming is not required, or the wafer degumming attribute is that degumming is required and the wafer degumming status is already degummed, the corresponding wafer is sent to the core loading station on the production line; the wafers remaining after being processed by the core loading station are recovered, and the wafer degumming attributes and wafer degumming status of the remaining wafers are stored according to the wafer number; through the above method, the control granularity of the wafers in the semiconductor packaging process is improved, which not only eliminates the error-prone problem of traditional manual recording and identification of wafer degumming status, but also further reduces the production loss of the semiconductor packaging process.
[0053] Please continue reading Figure 5 , Figure 5 is a schematic diagram of the system structure of the wafer dissolution control device provided in an embodiment of the present application, such as Figure 5 As shown, the wafer debonding control device 50 includes: a wafer information acquisition module 51, a debonding station inspection module 52, a first information update module 53, a core loading station inspection module 54 and a second information update module 55.
[0054] The wafer information acquisition module 51 is used to obtain the wafer number, wafer disassembly attribute and wafer disassembly status of the wafers in the wafer queue of the current batch on the production line.
[0055] The debonding station inspection module 52 is used to send the corresponding wafer to the debonding station on the production line if the wafer debonding attribute is that debonding is required and the wafer debonding status is that debonding is not yet completed.
[0056] The first information updating module 53 is used to update the wafer debonding status of the wafer after being processed by the debonding station to debonded.
[0057] The core loading station inspection module 54 is used to send the corresponding wafer to the core loading station on the production line if the wafer debonding attribute is that debonding is not required after updating, or the wafer debonding attribute is that debonding is required and the wafer debonding status is that debonding has been performed.
[0058] The second information updating module 55 is used to recycle the wafers remaining after being processed by the core loading station, and store the wafer debonding properties and wafer debonding states of the remaining wafers according to the wafer numbers.
[0059] As an optional implementation, the wafer information acquisition module 51 is also used to obtain the wafer number of the newly-arrived wafer and the material number of the newly-arrived wafer; according to the processing procedure corresponding to the material number, the wafer debonding attribute of the newly-arrived wafer is set to require debonding, or no debonding is required; if the wafer debonding attribute of the newly-arrived wafer is that debonding is required, the wafer debonding status of the newly-arrived wafer is set to undebonded; after receiving the online instruction, the corresponding newly-arrived wafer is sent to the production line according to the online instruction and the wafer number.
[0060] As an optional implementation, the wafer information acquisition module 51 is also used to obtain the inventory wafers currently in the warehouse and the material numbers corresponding to the inventory wafers according to the stored wafer numbers; according to the processing steps corresponding to the material numbers, the wafer degumming properties of the inventory wafers are set to require degumming or do not require degumming; according to the current degumming status of the inventory wafers, the wafer degumming status of the inventory wafers is set to have been degummed or not degummed; after receiving the online instruction, the corresponding inventory wafers are sent to the production line according to the online instruction and the wafer number.
[0061] As an optional implementation, the degumming station inspection module 52 is also used to continue to detect the wafer degumming properties and wafer degumming status of the wafers in the current batch of wafer queues; if the wafer degumming property of the inspected wafer is that no degumming is required, or the wafer degumming property is that degumming is required and the wafer degumming status is that degumming has been performed, the wafer currently being inspected is sent to the core loading station on the production line.
[0062] As an optional implementation, the core station inspection module 54 is also used to continue to detect the wafer debonding properties and wafer debonding status of the updated wafer; if the wafer debonding properties of the updated wafer are that debonding is required and the wafer debonding status is not debonded, the corresponding updated wafer is sent to the debonding station on the production line.
[0063] As an optional embodiment, the second information update module 55 is also used to obtain the corresponding remaining wafers as wafers to be put online according to the material number and wafer number contained in the new batch when a new batch of the production line is executed; and send the wafers to be put online to the wafer queue of the new batch.
[0064] As an optional implementation, the second information update module 55 is also used to parse the wafer information query instruction when it receives the wafer information query instruction, and obtain the wafer query parameters; according to the wafer query parameters, return the current wafer degumming properties and wafer degumming status of the queried wafer, as well as the entry time, degumming time, and exit time of the queried wafer at the degumming station.
[0065] It should be noted that the above-mentioned wafer disintegration control device can execute the wafer disintegration control method provided in the embodiment of the present application, and has the corresponding functional modules and beneficial effects of the execution method. For technical details not fully described in the embodiment of the wafer disintegration control device, please refer to the wafer disintegration control method provided in the embodiment of the present application.
[0066] Please continue reading Figure 6 , Figure 6 is a schematic diagram of the hardware structure of an electronic device 600 for executing a wafer dissolution control method provided in an embodiment of the present application, such as Figure 6 As shown, the electronic device 600 includes:
[0067] One or more processors 610 and memory 620, Figure 6 A processor 610 is taken as an example.
[0068] The processor 610 and the memory 620 may be connected via a bus or other means. Figure 6 The example of connecting through bus is taken in the following.
[0069] The memory 620 is a non-volatile computer-readable storage medium that can be used to store non-volatile software programs, non-volatile computer executable programs and modules, such as program instructions / modules corresponding to the wafer dissolution control method in the embodiment of the present application. The processor 610 executes various functional applications and data processing of the server by running the non-volatile software programs, instructions and modules stored in the memory 620, that is, realizing the wafer dissolution control method in the above method embodiment.
[0070] The memory 620 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created according to the use of the wafer dissolution control device, etc. In addition, the memory 620 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 620 may optionally include a memory remotely arranged relative to the processor 610, and these remote memories may be connected to the wafer dissolution control device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.
[0071] The one or more modules are stored in the memory 620, and when executed by the one or more processors 610, the wafer disassembly control method in any of the above method embodiments is executed, for example, the above described Figure 2 Steps S1 to S5 of the method, Figure 3 Steps S21 to S24 of the method, Figure 4 Steps S31 to S34 of the method are implemented Figure 5 The functions of modules 51-55 in.
[0072] The above-mentioned product can execute the method provided in the embodiment of the present application, and has the functional modules and beneficial effects corresponding to the execution method. For technical details not fully described in this embodiment, please refer to the method provided in the embodiment of the present application.
[0073] The embodiment of the present application provides a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are executed by one or more processors, such as Figure 6 A processor 610 in the embodiment may enable the one or more processors to execute the wafer dissolution control method in any of the above method embodiments, for example, to execute the above described Figure 2 Steps S1 to S5 of the method, Figure 3 Steps S21 to S24 of the method, Figure 4 Steps S31 to S34 of the method are implemented Figure 5 The functions of modules 51-55 in.
[0074] The present application provides a computer program product, wherein the computer program product includes a computer program stored on a non-volatile computer-readable storage medium, wherein the computer program includes program instructions, and when the program instructions are executed by the electronic device, the electronic device is enabled to execute the wafer disassembly control method in any of the above method embodiments, for example, to execute the above described Figure 2 Steps S1 to S5 of the method, Figure 3 Steps S21 to S24 of the method, Figure 4 Steps S31 to S34 of the method are implemented Figure 5 The functions of modules 51-55 in.
[0075] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0076] Through the description of the above implementation methods, ordinary technicians in this field can clearly understand that each implementation method can be implemented by means of software plus a general hardware platform, and of course, it can also be implemented by hardware. Ordinary technicians in this field can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing related hardware through a computer program, and the program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM), etc.
[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Under the concept of the present application, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present application as described above, which are not provided in detail for the sake of simplicity. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A wafer dissolution control method, characterized in that: include: Obtain the wafer number, wafer disassembly attribute and wafer disassembly status of the wafers in the wafer queue of the current batch on the production line; If the wafer debonding attribute is that debonding is required, and the wafer debonding state is that debonding is not yet completed, the corresponding wafer is sent to a debonding station on the production line; updating the wafer debonding state of the wafer after being processed by the debonding station to debonded; If after the update, the wafer debonding attribute is that debonding is not required, or the wafer debonding attribute is that debonding is required and the wafer debonding state is that debonding has been completed, the corresponding wafer is sent to the core loading station on the production line; Recover the remaining wafers after being processed by the core loading station, and store the wafer debonding properties and wafer debonding states of the remaining wafers according to the wafer numbers.
2. The wafer dissolution control method according to claim 1, characterized in that: Before the step of obtaining the wafer number, wafer disassembly attribute and wafer disassembly status of the wafers in the wafer queue of the current batch on the production line, the step further includes: Obtaining the wafer number of the newly stored wafer and the material number of the newly stored wafer; According to the processing procedure corresponding to the material number, the wafer debonding attribute of the newly stored wafer is set to require debonding or not require debonding; If the wafer debonding attribute of the newly stored wafer is that debonding is required, setting the wafer debonding state of the newly stored wafer to undebonded; After receiving the online instruction, the corresponding newly stored wafer is sent to the production line according to the online instruction and the wafer number.
3. The wafer dissolution control method according to claim 1, characterized in that: Before the step of obtaining the wafer number, wafer disassembly attribute and wafer disassembly status of the wafers in the wafer queue of the current batch on the production line, the step further includes: Obtain the inventory wafers currently in stock and the material numbers corresponding to the inventory wafers according to the stored wafer numbers; According to the processing procedure corresponding to the material number, setting the wafer debonding attribute of the inventory wafer to require debonding or not require debonding; According to the current debonding state of the inventory wafer, setting the wafer debonding state of the inventory wafer to debonded or undebonded; After receiving the online instruction, the corresponding inventory wafer is sent to the production line according to the online instruction and the wafer number.
4. The wafer dissolution control method according to claim 1, characterized in that: After the step of sending the corresponding wafer to the debonding station on the production line, the method further includes: Continue to detect the wafer debonding properties and wafer debonding states of the wafers in the wafer queue of the current batch; If the wafer debonding property of the inspected wafer is that debonding is not required, or the wafer debonding property is that debonding is required and the wafer debonding status is that debonding has been completed, the currently inspected wafer is sent to the core loading station on the production line.
5. The wafer dissolution control method according to claim 1, characterized in that: After the step of sending the corresponding wafer to the core loading station on the production line, the method further includes: Continue to detect the wafer disassembly property and wafer disassembly status of the updated wafer; If the wafer debonding property of the updated wafer is that debonding is required and the wafer debonding state is that debonding is not yet completed, the corresponding updated wafer is sent to the debonding station on the production line.
6. The wafer dissolution control method according to claim 1, characterized in that: After the step of storing the wafer disassembly properties and wafer disassembly states of the remaining wafers according to the wafer numbers, the method further includes: When a new batch of the production line is executed, according to the material number and wafer number contained in the new batch, the corresponding remaining wafers are obtained as the wafers to be put on line; Send the wafers to be put online to the wafer queue of the new batch.
7. The wafer dissolution control method according to claim 1, characterized in that: After the step of storing the wafer disassembly properties and wafer disassembly states of the remaining wafers according to the wafer numbers, the method further includes: When a wafer information query instruction is received, parsing the wafer information query instruction to obtain wafer query parameters; According to the wafer query parameters, the current wafer debonding properties and wafer debonding status of the queried wafer are returned, as well as the entry time, debonding time, and exit time of the queried wafer at the debonding station.
8. A wafer dissolution control device, characterized in that: include: The wafer information acquisition module is used to obtain the wafer number, wafer disassembly attribute and wafer disassembly status of the wafers in the wafer queue of the current batch on the production line; A debonding station inspection module is used to send the corresponding wafer to the debonding station on the production line if the debonding attribute of the wafer is that debonding is required and the debonding state of the wafer is that debonding is not yet completed; A first information updating module is used to update the wafer debonding state of the wafer after being processed by the debonding station to debonded; A core loading station inspection module is used to send the corresponding wafer to the core loading station on the production line if, after the update, the wafer debonding attribute is that debonding is not required, or the wafer debonding attribute is that debonding is required and the wafer debonding state is that debonding has been performed; The second information updating module is used to recycle the wafers remaining after being processed by the core loading station, and store the wafer debonding properties and wafer debonding status of the remaining wafers according to the wafer numbers.
9. An electronic device, characterized in that: include: at least one processor; as well as, a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the wafer debonding control method described in any one of claims 1-7.
10. A non-volatile computer-readable storage medium, characterized in that: The non-volatile computer-readable storage medium stores computer-executable instructions. When the computer-executable instructions are executed by an electronic device, the electronic device executes the wafer debonding control method according to any one of claims 1 to 7.