Wafer processing scheduling method and device

Abstract

The application provides a wafer processing scheduling method and device. The method comprises the following steps: querying an offline scheduling scheme from an offline scheduling scheme library based on target machine information and target wafer processing information; if the target offline scheduling scheme is queried from the offline scheduling scheme library, outputting the target offline scheduling scheme as a processing scheduling scheme of the wafer to be processed; if the target offline scheduling scheme is not queried from the offline scheduling scheme library, generating an online scheduling scheme of the wafer to be processed based on the target machine information and the target wafer processing information, and outputting the online scheduling scheme as the processing scheduling scheme of the wafer to be processed; and executing the processing scheduling scheme of the wafer to be processed. The application can enrich the acquisition mode of the processing scheduling scheme, enhance the flexibility of acquiring the processing scheduling scheme, further improve the wafer processing scheduling processing capability, and has strong applicability.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a wafer processing scheduling method and device. BACKGROUND

[0002] With the rapid development of semiconductor manufacturing technology, the production capacity requirement of semiconductor manufacturing equipment is increasing. The semiconductor manufacturing equipment usually includes a plurality of processing chambers, including but not limited to processing chambers suitable for processing wafers using different processing technologies such as cleaning, etching, ion implantation, etc. The semiconductor manufacturing equipment transports the wafers to different processing chambers for processing based on the process requirements of the wafers to complete the required wafer production. In order to improve production efficiency, path planning based on the process requirements of the wafers is usually required to develop a wafer scheduling scheme to guide the semiconductor manufacturing equipment to deliver the wafers to different processing chambers for processing in sequence. However, in the wafer production process, due to the involvement of complex production environment, the process of developing a wafer scheduling scheme is time-consuming, resulting in low wafer production efficiency. Therefore, how to improve the wafer production efficiency has become one of the technical problems to be solved at present.

[0003] The present application relates to the technical field of semiconductor technology, and in particular to a wafer processing scheduling method and device. SUMMARY

[0004] The present application provides a wafer processing scheduling method and device, which can enrich the acquisition method of the processing scheduling scheme, enhance the flexibility of acquiring the processing scheduling scheme, and has strong applicability.

[0005] In a first aspect, a wafer processing scheduling method is provided. The method includes obtaining target machine information and target wafer processing information of a wafer to be processed, querying an offline scheduling scheme from an offline scheduling scheme library based on the target machine information and the target wafer processing information, wherein the offline scheduling scheme library includes a plurality of offline scheduling schemes, and a usage frequency of a corresponding wafer processing flow configuration in each of the offline scheduling schemes is greater than or equal to an upper limit usage frequency threshold, and the usage frequency of the corresponding wafer processing flow configuration in any of the offline scheduling schemes indicates an execution frequency of the any of the offline scheduling schemes; if a target offline scheduling scheme is queried from the offline scheduling scheme library, outputting the target offline scheduling scheme as a processing scheduling scheme of the wafer to be processed, wherein at least one of machine information and wafer processing information in the target offline scheduling scheme is consistent with at least one of the target machine information and the target wafer processing information; if the target offline scheduling scheme is not queried from the offline scheduling scheme library, generating an online scheduling scheme of the wafer to be processed based on the target machine information and the target wafer processing information, and outputting the online scheduling scheme as the processing scheduling scheme of the wafer to be processed; and executing the processing scheduling scheme of the wafer to be processed to complete processing scheduling of the wafer to be processed. In the present application, the offline scheduling scheme with an execution frequency greater than or equal to an upper limit usage frequency threshold can be queried from the offline scheduling scheme library or the online scheduling scheme of the wafer to be processed can be generated online according to the target machine information and the target wafer processing information of the wafer to be processed, so as to serve as the processing scheduling scheme of the wafer to be processed. This can enrich the acquisition method of the processing scheduling scheme, enhance the flexibility of acquiring the processing scheduling scheme, and effectively meet different wafer processing requirements by combining the machine information and the wafer processing information, improve the processing scheduling processing capability of the wafer, and have strong applicability.

[0006] In a possible implementation of the first aspect, the querying the offline scheduling scheme from the offline scheduling scheme library based on the target machine information and the target wafer processing information comprises: matching the target machine information with machine information included in each offline scheduling scheme included in the offline scheduling scheme library, the machine information comprising at least one of a machine hardware configuration, a movement parameter of a robot configuration, a cleaning time of a wafer processing chamber, or a preparation time of a wafer processing chamber; matching the target wafer processing information with wafer processing information included in each offline scheduling scheme included in the offline scheduling scheme library, the wafer processing information comprising at least one of a wafer processing process, a wafer processing sequence, or a wafer processing time; and determining that the target offline scheduling scheme is queried from the offline scheduling scheme library when any offline scheduling scheme in which the machine information is consistent with the target machine information is matched from the offline scheduling scheme library, or any offline scheduling scheme in which the wafer processing information is consistent with the target wafer processing information is matched from the offline scheduling scheme library, or any offline scheduling scheme in which the machine information is consistent with the target machine information and the wafer processing information is consistent with the target wafer processing information is matched from the offline scheduling scheme library. In this application, the flexibility of querying the offline scheduling scheme can be improved by querying the offline scheduling scheme from the offline scheduling scheme library based on the target machine information and the target wafer processing information.

[0007] In a possible implementation of the first aspect, before the target machine information and the target wafer processing information of the wafer to be processed are acquired, the method further comprises: acquiring a plurality of wafer processing flow configurations of a plurality of wafer types, and storing the plurality of wafer processing flow configurations as wafer processing use cases in a wafer processing use case library, wherein each wafer processing flow configuration in the plurality of wafer processing flow configurations is used more than or equal to the upper limit usage threshold number of times within a target time length; taking each wafer processing flow configuration included in the wafer processing use case library as input data, calling an optimization scheduling algorithm to generate a plurality of optimal scheduling schemes corresponding to the plurality of wafer processing flow configurations, and storing the plurality of optimal scheduling schemes as offline scheduling schemes for wafer processing in an offline scheduling scheme library. In this application, the wafer processing flow configuration used more than or equal to the upper limit usage threshold number of times is stored as a wafer processing use case in the wafer processing use case library, and the offline scheduling scheme is generated based on the wafer processing use case in the wafer processing use case library, which can improve the effective matching rate of the offline scheduling scheme, enhance the adaptability of the wafer processing scheduling scheme and the processing requirement of the wafer to be processed, and improve the wafer production efficiency.

[0008] In a possible implementation of the first aspect, after the above storing the plurality of wafer processing flow configurations as wafer processing use cases in the wafer processing use case library, the method further includes: determining the identification and the number of uses of each wafer processing flow configuration included in the wafer processing use case library, generating a wafer processing use case record table based on the identification and the number of uses of each wafer processing flow configuration, and feeding back the use status of each wafer processing flow configuration through the wafer processing use case record table. In this application, the wafer processing equipment can manage the number of uses of each wafer processing flow configuration stored in the wafer processing use case library through the wafer processing use case record table, which can improve the convenience of perception of the use status of each wafer processing flow configuration and improve the query efficiency of the use status of each wafer processing flow configuration.

[0009] In a possible implementation of the first aspect, after the above outputting the target offline scheduling scheme as the processing scheduling scheme of the wafer to be processed, the method further includes: updating the number of uses of the target wafer processing flow configuration corresponding to the target offline scheduling scheme to be one more, updating the number of uses of the wafer processing flow configuration corresponding to other offline scheduling schemes in the offline scheduling scheme library to be one less, and updating the wafer processing use case record table. In this application, the number of uses of each wafer processing flow configuration in the wafer processing use case record table is updated based on the processing scheduling scheme of the wafer to be processed, which can enhance the timeliness of the number of uses of each wafer processing flow configuration recorded in the wafer processing use case record table and improve the recording accuracy of the use status of each wafer processing flow configuration.

[0010] In a possible implementation of the first aspect, after the above updating the number of uses of the target wafer processing flow configuration corresponding to the target offline scheduling scheme to be one more and updating the number of uses of the wafer processing flow configuration corresponding to other offline scheduling schemes in the offline scheduling scheme library to be one less, the method further includes: when the number of uses of any wafer processing flow configuration corresponding to any offline scheduling scheme recorded in the wafer processing use case record table is less than a lower limit number of use threshold, removing the any wafer processing flow configuration from the wafer processing use case library and removing the any offline scheduling scheme from the offline scheduling scheme library. In this application, the offline scheduling schemes in the offline scheduling scheme library are updated based on the number of uses of each wafer processing flow configuration in the wafer processing use case record table, so that the offline scheduling schemes in the offline scheduling scheme library can better meet the production demand, improve the adaptability of the offline scheduling scheme library, and improve the wafer production efficiency.

[0011] In a possible implementation of the first aspect, after the processing scheduling scheme of the wafer to be processed is executed, the method further includes: obtaining a processing parameter generated in real time when the machine executes the processing scheduling scheme, the processing parameter including at least one of the machine information or the wafer processing information; and when the real-time generated processing parameter is inconsistent with the processing parameter included in the target offline scheduling scheme, updating the processing parameter in the target offline scheduling scheme to the real-time generated processing parameter to obtain an updated target offline scheduling scheme, and updating the target offline scheduling scheme in the offline scheduling scheme library to the updated target offline scheduling scheme. In this application, the target offline scheduling scheme can be dynamically updated according to the real-time generated processing parameter, and the target offline scheduling scheme in the offline scheduling scheme library is updated, so that a more reasonable offline scheduling scheme is formulated, the rationality and effectiveness of resource allocation are improved, and the wafer production efficiency is improved.

[0012] In a possible implementation of the first aspect, after the online scheduling scheme is output as the processing scheduling scheme of the wafer to be processed, the method further includes: determining an online wafer processing flow configuration included in the online scheduling scheme, and querying the online wafer processing flow configuration from the wafer processing use case record table; when the online wafer processing flow configuration is queried from the wafer processing use case record table, updating the usage frequency of the online wafer processing flow configuration to usage frequency plus one; and when the online wafer processing flow configuration cannot be queried from the wafer processing use case record table, adding the online wafer processing flow configuration to the wafer processing use case record table, and recording the usage frequency of the online wafer processing flow configuration as 1. In this application, the usage frequency of the online wafer processing flow configuration can be monitored through the processing use case record table, and the management effectiveness and convenience of the online wafer processing flow configuration can be improved.

[0013] In a possible implementation of the first aspect, after the usage frequency of the online wafer processing flow configuration is updated to usage frequency plus one, the method further includes: when the usage frequency of the online wafer processing flow configuration recorded in the wafer processing use case record table is equal to the upper limit usage frequency threshold, adding the online wafer processing flow configuration to the wafer processing use case library, calling an optimization scheduling algorithm to generate an online optimal scheduling scheme corresponding to the online wafer processing flow configuration by taking the online wafer processing flow configuration as input data, and storing the online optimal scheduling scheme as a newly added offline scheduling scheme in the offline scheduling scheme library. In this application, the offline scheduling scheme corresponding to the online wafer processing flow configuration meeting the requirements can be stored in the offline scheduling scheme library, so that the offline scheduling schemes in the offline scheduling scheme library can be more in line with production requirements, the adaptability of the offline scheduling scheme library is improved, and the wafer production efficiency is improved.

[0014] In a possible implementation of the first aspect, the above-mentioned online scheduling scheme for generating the above-mentioned wafers to be processed based on the above-mentioned target machine information and the above-mentioned target wafer processing information includes: based on the above-mentioned target machine information and the above-mentioned target wafer processing information, a target online scheduling algorithm and a corresponding target operator are determined from an online scheduling algorithm library through a self-learning selection strategy, the above-mentioned online scheduling algorithm library includes multiple online scheduling algorithms, and each online scheduling algorithm corresponds to at least one operator; using the above-mentioned target machine information and the above-mentioned target wafer processing information as input data, calling the above-mentioned target online scheduling algorithm and the above-mentioned target operator to generate the online scheduling scheme for the above-mentioned wafers to be processed. In the present application, an online scheduling algorithm can be selected to generate a processing scheduling scheme for the wafers to be processed that matches the current production demand, thereby enhancing the flexibility of obtaining the processing scheduling scheme and improving the accuracy of obtaining the processing scheduling scheme.

[0015] In a second aspect, the present application provides a wafer processing scheduling device, which includes a module or unit for executing a wafer processing scheduling method as described in the first aspect or any possible implementation method of the first aspect.

[0016] Exemplarily, the above-mentioned device includes:

[0017] An offline query module is configured to obtain target machine information and target wafer processing information of a wafer to be processed, and query an offline scheduling plan from an offline scheduling plan library based on the target machine information and the target wafer processing information, wherein the offline scheduling plan library includes multiple offline scheduling plans, and the usage count of the wafer processing flow configuration corresponding to each of the offline scheduling plans is greater than or equal to an upper usage count threshold, and the usage count of the wafer processing flow configuration corresponding to any of the offline scheduling plans is used to indicate the execution count of any of the offline scheduling plans;

[0018] an output module configured to output the target offline scheduling plan as the processing scheduling plan for the wafer to be processed if the offline query module obtains a target offline scheduling plan from the offline scheduling plan library, wherein at least one of the machine information and the wafer processing information in the target offline scheduling plan is consistent with at least one of the target machine information and the target wafer processing information;

[0019] an online query module configured to generate an online scheduling plan for the wafer to be processed based on the target machine information and the target wafer processing information if the offline query module fails to obtain the target offline scheduling plan from the offline scheduling plan library, and output the online scheduling plan as the processing scheduling plan for the wafer to be processed;

[0020] The scheduling execution module is used to execute the processing scheduling plan of the wafer to be processed output by the above-mentioned output module or the above-mentioned online query module to complete the processing scheduling of the above-mentioned wafer to be processed.

[0021] In a third aspect, the present application provides a wafer processing device, the wafer processing device comprising: a processor and a memory;

[0022] The above-mentioned processor is connected to the above-mentioned memory, wherein the above-mentioned memory is used to store program code, and the above-mentioned processor is used to call the above-mentioned program code to execute the wafer processing scheduling method provided by the above-mentioned first aspect and any possible implementation method of the first aspect.

[0023] In a fourth aspect, the present application provides a computer-readable storage medium, in which a computer program is stored. The computer program is suitable for being loaded by a processor and executing the wafer processing scheduling method. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of a single cluster type device provided by this application;

[0025] Figure 2 It is a flowchart of the wafer processing scheduling method provided by this application;

[0026] Figure 3 This is another flowchart of the wafer processing scheduling method provided by the present application;

[0027] Figure 4 It is a structural diagram of the wafer processing scheduling device provided by this application;

[0028] Figure 5 It is a structural schematic diagram of the wafer processing equipment provided in this application. DETAILED DESCRIPTION

[0029] To facilitate understanding of this application, before introducing the wafer scheduling method, we first introduce in detail the relevant knowledge involved in the implementation of this application:

[0030] Semiconductor manufacturing equipment can be an etching equipment for processing wafers, including single-beam type equipment or multi-beam type equipment, wherein the wafer refers to a silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. Figure 1 , Figure 1 This is a schematic diagram of the structure of the single cluster device provided by this application. Figure 1As shown, the single cluster type equipment includes a load port (LP), an atmosphere robot (ATM robot), a vacuum robot (VAC robot), a load lock (LL), and N process modules (PMs), etc. The load port is an interface for introducing a wafer into the equipment from the outside, and is in an atmospheric environment, isolated from the outside environment. After the wafer is introduced into the single cluster type equipment through the load port, it is further processed by the internal robot, which includes the atmosphere robot and the vacuum robot. The atmosphere robot is located in the atmospheric region inside the equipment and is responsible for the transmission of the wafer between the load port and the load lock, ensuring safe and stable transmission in the atmospheric environment. The load lock provides a vacuum environment and maintains the vacuum state inside the equipment, ensuring that the wafer is loaded while maintaining the vacuum environment inside the equipment. The vacuum robot is located in the vacuum region inside the equipment and is responsible for the transmission of the wafer between the load lock, different process modules, or inside the module, and precise positioning to the processing position. The process module is the main area for processing the wafer in the equipment, and the equipment usually includes multiple process modules, which can include process modules of the same processing procedure and process modules of different processing procedures. Each process module is equipped with a specific processing procedure for performing each step of wafer processing, such as cleaning, etching, deposition, etc., to meet the processing requirements of different types of wafers.

[0031] In this application, the process of processing a wafer by a cluster type equipment includes but is not limited to the following steps: 1. The atmosphere robot transfers the wafer to be processed from the load port to the load lock; 2. The vacuum robot transfers the wafer from the load lock to the process module; 3. The wafer is processed in the process module; 4. After the wafer processing is completed, the vacuum robot transfers the processed wafer from the process module to the load lock; 5. The atmosphere robot transfers the processed wafer from the load lock to the load port. Based on the above process, it can be known that the wafer will go through multiple links during processing, such as the atmosphere robot transferring the wafer to be processed from the load port to the load lock, the vacuum robot transferring the wafer from the load lock to the process module, and the transmission of the wafer between different processing modules, etc. Each link needs to consume a certain amount of time, so a processing scheduling scheme needs to be developed to move and schedule the wafer in each link to improve the wafer production efficiency.

[0032] The structures involved in the following embodiments, such as the load port, the atmospheric robot, the vacuum robot, the load lock chamber, and the processing chamber, can refer to the structures mentioned in the above related knowledge. The technical solutions in the present application will be described clearly and completely. Obviously, the described embodiments are part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0033] Embodiment one:

[0034] Referring to Figure 2 , Figure 2 is a flowchart of a wafer processing scheduling method provided by the present application. In the present application, the wafer processing scheduling method can be executed by a wafer processing device, which can be a semiconductor manufacturing device for processing wafers. The above-mentioned semiconductor manufacturing device includes but is not limited to a single cluster type device or a multi-cluster type device, etc. The specific device can be determined according to the actual application scenario, which is not limited here. As shown in Figure 2 , the wafer processing scheduling method provided by the present application (or simply referred to as the method provided by the present application) can include the following steps:

[0035] S100, obtaining target machine information and target wafer processing information of a wafer to be processed, and querying an offline scheduling scheme from an offline scheduling scheme library based on the target machine information and the target wafer processing information.

[0036] In some possible embodiments, the offline scheduling scheme library includes a plurality of offline scheduling schemes, and the use frequency of the wafer processing flow configuration in each of the offline scheduling schemes is greater than or equal to an upper limit use frequency threshold. The use frequency of the wafer processing flow configuration in any of the offline scheduling schemes indicates the execution frequency of the offline scheduling scheme. When the wafer to be processed needs to be processed, the wafer processing device can obtain a processing scheduling scheme of the wafer to be processed, and process the wafer to be processed based on the processing scheduling scheme. The execution frequency of any of the offline scheduling schemes can be understood as the number of times that the wafer processing device processes the wafer to be processed based on the offline scheduling scheme. The wafer processing device completes a processing scheduling of the wafer to be processed based on the offline scheduling scheme, which can be understood as that the offline scheduling scheme is executed once. It can be understood that the processing scheduling scheme includes the moving tasks to be executed by the vacuum robot and the moving tasks to be executed by the atmospheric robot. These moving tasks are used to indicate the specific moving actions of the atmospheric robot or the vacuum robot on the wafer to be processed. The wafer processing device can control the atmospheric robot and the vacuum robot to execute the corresponding moving actions according to the processing scheduling scheme, so as to move the wafer to be processed to an appropriate position for processing, thereby completing the processing scheduling of the wafer to be processed.

[0037] In some possible embodiments, in order to improve the wafer production efficiency, the wafer processing equipment can first construct an offline scheduling scheme library, so as to directly obtain the required processing scheduling scheme from the offline scheduling scheme library when processing the wafer to be processed, which can improve the processing scheduling efficiency of the wafer to be processed. Optionally, the offline scheduling scheme library includes a plurality of offline scheduling schemes, and the offline scheduling scheme is an offline generated processing scheduling scheme and is saved to the offline scheduling scheme library. It can be understood that the offline scheduling scheme includes the movement tasks required to be executed by the vacuum robot and the movement tasks required to be executed by the atmospheric robot, and the movement tasks involve the scheduling sequence of the machine information and the wafer processing information. Optionally, the machine information includes at least one of the information reflecting the specific configuration of the wafer processing equipment, such as the machine hardware configuration, the movement parameters of the robot configuration, the cleaning time of the wafer processing chamber and the preparation time of the wafer processing chamber. It can be understood that the machine hardware configuration includes relevant information capable of reflecting the performance parameters (such as temperature, pressure, etc.) of the wafer processing equipment; the movement parameters of the robot configuration include the movement time and movement sequence required by the atmospheric robot and the vacuum robot in the wafer processing equipment, so as to ensure the correct movement of the wafer in the equipment; and the cleaning time of the wafer processing chamber indicates the time length required for the wafer processing chamber to complete the cleaning step. Optionally, the wafer processing information includes at least one of the information reflecting the required processing information of the wafer, such as the wafer processing process, the wafer processing sequence, the wafer processing time, etc. It can be understood that the wafer processing process indicates the wafer processing chamber to be experienced by the wafer; the wafer processing sequence determines the execution sequence of the processing steps, so as to ensure that the wafer moves to each processing chamber for processing in the correct sequence; and the wafer processing time refers to the time length required for the wafer to complete the entire processing process flow in the vacuum environment of the wafer processing equipment, including the wafer movement time, the chamber processing time and the wafer waiting time. It can be seen that the scheduling sequence of the information involved in the offline scheduling scheme can indicate the wafer processing equipment to process the wafer, so as to improve the wafer production efficiency and the equipment resource utilization rate. In the present application, in order to make the offline scheduling schemes in the offline scheduling scheme library meet the production requirements and improve the effective utilization rate of the offline scheduling scheme library, the wafer processing equipment can set the offline scheduling schemes stored in the offline scheduling scheme library to be the scheduling schemes whose usage times corresponding to the wafer processing flow are greater than or equal to a preset upper limit usage time threshold, so as to ensure that the offline scheduling schemes included in the offline scheduling scheme library are commonly used offline scheduling schemes, wherein the usage times corresponding to the wafer processing flow reflect the execution times of the offline scheduling schemes executed by the wafer processing equipment.

[0038] In some possible embodiments, when a wafer to be processed needs to be processed, the wafer to be processed is stored in a loading port of a wafer processing device, the wafer processing device can identify the wafer to be processed in the loading port by using wafer identification technology, and the loading port can accommodate one or more wafers to be processed, wherein the wafer processing device can identify the identification of each wafer to be processed in the loading port by image recognition, so as to accurately identify the wafer to be processed. When the wafer processing device identifies the wafer to be processed, the target machine information and the target wafer processing information of the wafer to be processed are obtained, and an offline scheduling scheme is queried from the offline scheduling scheme library based on the obtained target machine information and the target wafer processing information. Optionally, the target wafer processing information includes one or more of the wafer processing process, the wafer processing sequence, or the wafer processing time of the wafer to be processed. The target machine information includes at least one of the machine hardware configuration of the current wafer processing device, the movement parameter of the robot configuration, the cleaning time of the wafer processing chamber, or the preparation time of the wafer processing chamber. For specific descriptions of the target machine information and the target wafer processing information, please refer to the machine information and the wafer processing information described above, which will not be described here. It can be understood that each offline scheduling scheme included in the offline scheduling scheme library includes a scheduling sequence of machine information and wafer processing information, and the wafer processing device can query whether there is an offline scheduling scheme matching the target machine information or the target wafer processing information from the offline scheduling scheme library based on the obtained target machine information and the target wafer processing information of the wafer to be processed. Optionally, the wafer processing device can match the target machine information with the machine information included in each offline scheduling scheme included in the offline scheduling scheme library to query whether there is an offline scheduling scheme matching the target machine information in the offline scheduling scheme library. Optionally, the wafer processing device can also match the target wafer processing information with the wafer processing information included in each offline scheduling scheme included in the offline scheduling scheme library to query whether there is an offline scheduling scheme matching the target wafer processing information in the offline scheduling scheme library. Optionally, the wafer processing device can also match the target machine information and the target processing information with the machine information and the wafer processing information included in each offline scheduling scheme included in the offline scheduling scheme library, respectively, to query whether there is an offline scheduling scheme matching both the target machine information and the target wafer processing information in the offline scheduling scheme library, and to query whether the processing scheduling requirement stored in the wafer to be processed matches the offline scheduling scheme. In this application, when the scheme is queried from the offline scheduling scheme library according to the target machine and the target wafer processing information, different matching conditions can be set to improve the query flexibility of the offline scheduling scheme, to meet the different requirements of the query accuracy of the processing scheduling scheme for processing and scheduling the wafer to be processed with different processing scheduling requirements, to be flexible in operation, and to have strong applicability.

[0039] S101, if the target offline scheduling scheme is obtained from the offline scheduling scheme library, output the target offline scheduling scheme as the processing scheduling scheme of the wafer to be processed.

[0040] In some possible embodiments, obtaining the target offline scheduling scheme from the offline scheduling scheme library can be: obtaining, from the offline scheduling scheme library, an offline scheduling scheme including machine information consistent with the target machine information as the target offline scheduling scheme. It can be understood that the machine information consistent with the target machine information can mean that the content in the machine information is completely consistent with the content in the target machine information, or can mean that at least one of the machine hardware configuration, the movement parameter of the robot configuration, the cleaning time of the wafer processing chamber, and the preparation time of the wafer processing chamber, etc. reflecting the specific configuration of the wafer processing equipment included in the machine information is completely consistent with at least one of the machine hardware configuration, the movement parameter of the robot configuration, the cleaning time of the wafer processing chamber, and the preparation time of the wafer processing chamber, etc. reflecting the specific configuration of the wafer processing equipment included in the target machine information. That is, the content in the machine information can be completely consistent with the content in the target machine information, or can be partially consistent.

[0041] In some possible embodiments, obtaining the target offline scheduling scheme from the offline scheduling scheme library can be: obtaining, from the offline scheduling scheme library, an offline scheduling scheme including wafer processing information consistent with the target wafer processing information as the target offline scheduling scheme. It can be understood that the wafer processing information consistent with the target wafer processing information means that the content in the wafer processing information is completely consistent with the content in the target wafer processing information, or can mean that at least one of the wafer processing process, the wafer processing sequence, the wafer processing time, etc. reflecting the required processing information of the wafer included in the wafer processing information is completely consistent with at least one of the wafer processing process, the wafer processing sequence, the wafer processing time, etc. reflecting the required processing information of the wafer included in the target machine information. That is, the content in the wafer processing information can be completely consistent with the content in the target wafer processing information, or can be partially consistent.

[0042] In some possible implementation manners, the target offline scheduling scheme can be obtained by querying the offline scheduling scheme library according to the following method: obtaining, from the offline scheduling scheme library, an offline scheduling scheme that includes machine information consistent with the target machine information and wafer processing information consistent with the target wafer processing information as the target offline scheduling scheme. That is, the content of the wafer processing information can be completely consistent with or partially consistent with the content of the target wafer processing information, and the content of the wafer processing information can be completely consistent with or partially consistent with the content of the target wafer processing information. It can be seen that, in the present application, the target offline scheduling scheme can be obtained by different matching conditions, so as to meet different requirements of the query accuracy of the processing scheduling scheme for processing and scheduling the wafer to be processed.

[0043] In some possible implementation manners, when the target offline scheduling scheme is obtained, the target offline scheduling scheme is output as the processing scheduling scheme of the wafer to be processed, so as to use the processing scheduling scheme to process and schedule the wafer to be processed.

[0044] S102, if the target offline scheduling scheme is not obtained from the offline scheduling scheme library, an online scheduling scheme of the wafer to be processed is generated based on the target machine information and the target wafer processing information, and the online scheduling scheme is output as the processing scheduling scheme of the wafer to be processed.

[0045] In some possible implementation manners, if the target offline scheduling scheme is not obtained from the offline scheduling scheme library, the target online scheduling algorithm and the corresponding target operator can be determined from the online scheduling algorithm library based on the target machine information and the target wafer processing information by using a self-learning selection strategy, the target machine information and the target wafer processing information are used as input data, the target online scheduling algorithm and the target operator are called to generate the online scheduling scheme of the wafer to be processed, and the online scheduling algorithm library includes a plurality of online scheduling algorithms, and each online scheduling algorithm corresponds to at least one operator. It can be understood that the online processing scheduling scheme is also a processing scheduling scheme, that is, the online processing scheduling scheme includes the moving tasks to be performed by the vacuum robot and the moving tasks to be performed by the atmospheric robot, and the moving tasks involve the scheduling sequence of the machine information and the wafer processing information.

[0046] In some possible embodiments, the online scheduling algorithm includes a heuristic algorithm such as a Pull and Swap strategy, a (dynamic) priority algorithm, a bottleneck-based push-pull strategy, a longest-waiting strategy, and the like. The online scheduling algorithm can also use a meta-heuristic algorithm such as a Tabu Search (TS), a Simulated Annealing (SA), a Genetic Algorithm (GA), a Beam Search algorithm, and the like. The online scheduling algorithm can also be a learning optimization algorithm such as a Deep Learning (DL) algorithm, a Deep Reinforcement Learning (DRL) algorithm, and the like. The operator corresponding to the online scheduling algorithm can refer to various operations performed in the process of scheduling the online processing scheduling scheme, such as movement operations of the robot, allocation operations of the tasks, and scheduling operations of the resources, and the like. The self-learning selection strategy can automatically identify, from the online scheduling algorithm library, a target online scheduling algorithm and a corresponding target operator that are most suitable for the current environment (target machine information and target wafer processing information) by learning historical data, so that the wafer processing equipment can generate an online processing scheduling scheme using the target online scheduling algorithm and the target operator, which can better adapt to the current environment to improve the wafer production efficiency. Optionally, the self-learning selection strategy includes but is not limited to supervised learning, reinforcement learning, deep reinforcement learning, and the like, and the specific implementation can be determined according to the actual application scenario, which is not limited herein.

[0047] In some possible embodiments, the wafer processing equipment can call the target online scheduling algorithm and the target operator to generate a wafer processing scheduling scheme by taking the target machine information and the target wafer processing information as input data, and the target operator is responsible for processing specific operations including robot movement, task allocation, and resource scheduling, and the like. The wafer processing equipment can further input the processing result processed by the target operator into the target online scheduling algorithm, and the target online scheduling algorithm can optimize the processing result to generate a processing scheduling scheme of the wafer to be processed that matches the current production demand. It can be seen that, in the embodiments of the present application, the acquisition method of the processing scheduling scheme can be enriched, and the flexibility and accuracy of the processing scheduling scheme can be enhanced.

[0048] S103, the processing scheduling scheme of the wafer to be processed is executed to complete the processing scheduling of the wafer to be processed.

[0049] In some possible embodiments, the wafer processing equipment can control the atmospheric robot and the vacuum robot to perform corresponding movement actions according to the wafer processing scheduling task in the processing scheduling scheme of the wafer to be processed, so as to move the wafer to be processed to a proper position for processing, thereby completing the processing scheduling of the wafer to be processed.

[0050] In an embodiment of the present application, the wafer processing equipment can query the offline scheduling plan whose execution times are greater than or equal to the upper limit usage times threshold from the offline scheduling plan library according to the target machine information and the target wafer processing information of the wafer to be processed, or generate the online scheduling plan for the wafer to be processed online as the processing scheduling plan for the above-mentioned wafer to be processed, and execute the processing scheduling plan for the wafer to be processed to complete the processing scheduling of the above-mentioned wafer to be processed. This can enrich the method of obtaining the processing scheduling plan, enhance the flexibility of obtaining the processing scheduling plan, and the processing scheduling plan combining the machine information and wafer processing information can effectively meet different wafer processing needs, improve the processing scheduling processing capability of the wafer, and has strong applicability.

[0051] Example 2:

[0052] See also Figure 3 , Figure 3 This is another flow chart of the wafer processing scheduling method provided by this application. Figure 3 As shown, the wafer processing scheduling method provided in this application may include the following steps:

[0053] S200, obtain multiple wafer processing flow configurations for multiple wafer types, and store the above multiple wafer processing flow configurations as wafer processing use cases in a wafer processing use case library, wherein the number of times each wafer processing flow configuration in the above multiple wafer processing flow configurations is used within the target time length is greater than or equal to the above upper limit usage number threshold.

[0054] In some feasible implementations, the wafer processing equipment can build a wafer processing use case library, optionally, collect multiple wafer processing flow configurations of multiple wafer types offline, and store these multiple wafer processing flow configurations as wafer processing use cases in the wafer processing use case library, where multiple wafer types can refer to wafer types of multiple different processing technologies. In order to ensure that the wafer processing use cases in the wafer processing use case library are commonly used wafer processing use cases, the wafer processing flow configurations whose usage times are greater than or equal to the upper limit usage times threshold are stored as wafer processing use cases in the wafer processing use case library. In an embodiment of the present application, the number of times a wafer processing flow configuration is used reflects the number of times the corresponding processing scheduling scheme is executed. Then, an offline scheduling scheme is generated based on the wafer processing use cases in the wafer processing use case library, which means that the processing scheduling scheme generated by the multiple wafer processing flow configurations in the wafer processing use case library is a processing scheduling scheme commonly used by wafer processing equipment, thereby providing a suitable offline scheduling scheme so that the wafer processing equipment can quickly obtain a wafer processing scheduling scheme suitable for the current production situation, thereby improving wafer production efficiency.

[0055] In some possible embodiments, the wafer processing flow configuration includes a single sequence / multiple sequence configuration, a single job / multiple job configuration, and a different RunMode configuration. The single sequence / multiple sequence configuration indicates whether the wafer is processed in one sequence or multiple sequences during the processing, which allows selecting a suitable processing sequence for wafer processing. The single job / multiple job configuration indicates whether the wafer involves one job or multiple jobs during the processing, which allows flexible and parallel processing of multiple wafers. The different RunMode configuration indicates different running modes that the wafer can adopt during the processing, so that a scheduling algorithm can be called based on the wafer processing flow configuration to generate a corresponding wafer processing scheme as an offline scheduling scheme.

[0056] In some possible embodiments, the wafer processing equipment can generate corresponding offline scheduling schemes using multiple wafer processing flow configurations in the wafer processing case library to form an offline scheduling library. To ensure that the offline scheduling library can provide commonly used processing scheduling schemes, the number of times each wafer processing flow configuration included in the wafer processing case library is used within a target time period is greater than or equal to a preset upper limit usage threshold. The target time period can be the current last week, the current last month, or other specified time period, which is not limited herein. That is, the wafer processing equipment can add or delete the wafer processing case library based on the number of times each wafer processing flow configuration is used, so that the number of times each wafer processing flow configuration included in the wafer processing case library is used within the target time period is greater than or equal to the preset upper limit usage threshold, to ensure that the offline scheduling schemes included in the offline scheduling library are commonly used scheduling schemes. It can be understood that the wafer processing equipment evaluates the commonality of the offline scheduling scheme corresponding to each wafer processing flow configuration based on the number of times each wafer processing flow configuration is used within the target time period, which means checking whether the number of times the offline scheduling scheme is executed is greater than or equal to the preset upper limit usage threshold. The upper limit usage threshold is considered as the lower limit value of the offline scheduling scheme that is considered to be commonly used, and can be set according to production needs, which is not limited herein. When the number of times each wafer processing flow configuration is used within the target time period is greater than or equal to the upper limit usage threshold, the corresponding offline scheduling scheme is considered to be commonly used, and the wafer processing flow configuration is added to the wafer processing case library. It can be seen that this management method can ensure that the offline scheduling schemes in the offline scheduling library are verified by execution, so that the offline scheduling schemes that have been verified by use can be quickly called and applied in actual production, improving wafer production efficiency and effectively saving resources.

[0057] S201, determine the identification and usage times of each wafer processing flow configuration included in the wafer processing case library, generate a wafer processing case record table based on the identification and usage times of each wafer processing flow configuration, and feed back the usage status of each wafer processing flow configuration through the wafer processing case record table.

[0058] In some possible embodiments, the wafer processing equipment can manage various wafer processing flow configurations and their corresponding usage times in the wafer processing case library through the wafer processing case record table, and each wafer processing flow configuration can be identified by the name or label of the wafer, that is, the wafer processing case record table can be composed of two fields, the identification of the wafer processing flow configuration and the usage times of the wafer processing flow configuration. It can be understood that the wafer processing equipment can record the usage of each wafer processing flow configuration in detail by using the wafer processing case record table, so that the wafer processing equipment can track and manage the usage times of each wafer processing flow configuration stored in the wafer processing case library through the wafer processing case record table, accurately record the usage times of each wafer processing flow configuration in the wafer processing case record table, and quickly understand the usage status of each wafer processing flow configuration, so as to effectively manage the wafer processing case library and the offline scheduling scheme library. For example, the wafer processing equipment can monitor whether the usage times of the wafer processing flow configuration is greater than or equal to the upper limit usage times threshold based on the preset upper limit usage times threshold, and when it is less than the upper limit usage times threshold, the wafer processing flow configuration can be removed from the wafer processing case library and the corresponding offline scheduling scheme can be removed from the offline scheduling scheme library.

[0059] S202, taking each wafer processing flow configuration included in the wafer processing case library as input data, calling the optimization scheduling algorithm to generate a plurality of optimal scheduling schemes corresponding to the plurality of wafer processing flow configurations, and storing the plurality of optimal scheduling schemes as offline scheduling schemes of wafer processing to the offline scheduling scheme library.

[0060] In some possible implementation manners, the wafer processing device can generate corresponding optimal scheduling schemes by offline calculation based on various wafer processing flow configurations in the wafer processing case library. In offline calculation, since the execution time limit of the algorithm is relatively loose, an accurate optimal scheduling algorithm can be selected to calculate an optimal solution. The optimal scheduling algorithm can be based on a mixed integer programming algorithm (MIP), a branch and bound algorithm, or a Petri net algorithm, and the like. It can be understood that these optimal scheduling algorithms are a method for solving job shop scheduling problems by using intelligent optimization algorithms, and are aimed at finding an optimal scheduling scheme by using the global search and local search capabilities of the optimization algorithm, so as to minimize the maximum completion time or other performance indicators. Then, when the optimal scheduling algorithm is applied to wafer production scheduling, the optimal scheduling algorithm can also consider the scheduling sequence of the machine information and the wafer processing information, and generate multiple optimal scheduling schemes to maximize resource utilization and wafer production efficiency in the production process.

[0061] In some possible implementation manners, the wafer processing device uses each wafer processing flow configuration included in the wafer processing case library as input data, calls an optimal scheduling algorithm to generate multiple optimal scheduling schemes corresponding to the multiple wafer processing flow configurations, and stores the multiple optimal scheduling schemes as offline scheduling schemes of wafer processing in an offline scheduling scheme library. The optimal scheduling scheme is also a processing scheduling scheme, and the use frequency of the wafer processing flow configuration corresponding to the optimal scheduling scheme is greater than or equal to the upper limit use frequency threshold. It can be seen that the wafer processing device stores these optimal scheduling schemes in the commonly used offline scheduling scheme library, which can facilitate the scheduling of future wafer processing schemes, and improve production flexibility and wafer production efficiency.

[0062] S203, target machine information and target wafer processing information of a wafer to be processed are obtained, and an offline scheduling scheme is queried from the offline scheduling scheme library based on the target machine information and the target wafer processing information.

[0063] S204, if a target offline scheduling scheme is queried from the offline scheduling scheme library, the target offline scheduling scheme is output as a processing scheduling scheme of the wafer to be processed.

[0064] In some possible implementation manners, the specific implementation manners of steps S203 to S204 can refer to the specific implementation manners of steps S100 to S101 provided in the above-mentioned embodiments, and details are not described herein. Figure 2 The specific implementation manners of steps S100 to S101 provided in the above-mentioned embodiments, and details are not described herein.

[0065] S205, updating the usage times of the target wafer processing flow configuration corresponding to the target offline scheduling scheme to be usage times plus one, and updating the usage times of the wafer processing flow configurations corresponding to other offline scheduling schemes in the offline scheduling scheme library to be usage times minus one, to update the wafer processing case record table.

[0066] In some possible embodiments, the usage times of all wafer processing flow configurations in the wafer processing case record table are updated correspondingly each time the processing scheduling scheme of the wafer to be processed is executed. Optionally, the usage times of the target wafer processing flow configuration corresponding to the target offline scheduling scheme in the wafer processing case record table are usage times plus one, such as usage times K+1 of the target wafer processing flow configuration; and the usage times of the wafer processing flow configurations corresponding to other offline scheduling schemes in the wafer processing case record table are usage times minus one, such as usage times K-1 of the wafer processing flow configuration corresponding to other offline scheduling schemes. Wherein K is an integer greater than or equal to 1. That is, the usage times of all wafer processing flow configurations corresponding to the wafer processing case record table are adjusted each time the processing scheduling scheme of the wafer to be processed is executed, so as to ensure that the usage times of each wafer processing flow configuration in the wafer processing case record table are accurately recorded, to accurately manage the wafer processing cases in the wafer processing case library and the offline scheduling schemes in the offline scheduling scheme library, and to provide the wafer processing equipment with commonly used offline scheduling schemes.

[0067] In some possible embodiments, when the use frequency of any wafer processing flow configuration corresponding to any offline scheduling scheme recorded in the wafer processing case record table is less than a lower use frequency threshold, the any wafer processing flow configuration is removed from the wafer processing case library, and the any offline scheduling scheme is removed from the offline scheduling scheme library, wherein the lower use frequency threshold can be regarded as an upper limit value of the wafer processing case or the offline scheduling scheme that is considered to be not commonly used, and the lower use frequency threshold can be set according to production requirements, which is not limited herein. Thus, the wafer processing cases that do not meet the conditions in the wafer processing case library and the offline scheduling schemes that do not meet the conditions in the offline scheduling scheme library can be deleted based on the use frequency of the wafer processing case and the lower use frequency threshold, so that the wafer processing cases stored in the wafer processing case library are commonly used wafer processing cases, and meanwhile, the consistency between the offline scheduling scheme library and the wafer processing case library is ensured, and the storage resource waste and the inaccurate scheduling caused by the offline scheduling schemes that are out of date or irrelevant in the offline scheduling scheme library are avoided. It can be seen that, in the embodiments of the present application, the offline scheduling schemes in the offline scheduling scheme library are updated based on the use frequency of each wafer processing flow configuration in the wafer processing case record table, and the update allows the wafer processing case library and the offline scheduling scheme library to be adjusted in real time, so that the offline scheduling schemes better match the production requirements, and thus the adaptability of the offline scheduling scheme library and the wafer production efficiency are improved.

[0068] In some possible embodiments, the machine table information includes at least one of a movement parameter of a robot configuration, a cleaning time of a wafer processing chamber, or a preparation time of the wafer processing chamber, and the wafer processing information includes at least one of a wafer processing process, a wafer processing sequence, or a wafer processing time.

[0069] In some possible embodiments, the movement parameter of the robot configuration, the cleaning time of the wafer processing chamber, or the preparation time of the wafer processing chamber involved in the machine table information, and the wafer processing process, the wafer processing sequence, or the wafer processing time involved in the wafer processing information can be changed in actual execution process, and the mechanical components such as the processing chamber and the robot can also be faulty. In order to adapt to the changes and unexpected situations in the production process, the wafer processing equipment can monitor the processing parameters generated in real time when the processing scheduling scheme is executed, and the processing parameters can include at least one of the machine table information or the wafer processing information.

[0070] In some possible embodiments, the machine table information includes at least one of a movement parameter of a robot configuration, a cleaning time of a wafer processing chamber, or a preparation time of the wafer processing chamber, and the wafer processing information includes at least one of a wafer processing process, a wafer processing sequence, or a wafer processing time.

[0071] In some possible implementation manners, the wafer processing equipment matches the processing parameters generated in real time with the processing parameters included in the target offline scheduling scheme, and when the processing parameters generated in real time are inconsistent, the processing scheduling scheme currently executed is corrected by using the processing parameters generated in real time. It can be seen that the wafer processing equipment can correct and update the wafer processing scheduling scheme executed in the subsequent real-time iteration process through the processing parameters generated in real time, so that the wafer processing scheduling scheme can be flexibly adjusted during the execution of the processing scheduling scheme, and the wafer production efficiency of the equipment is improved.

[0072] In some possible implementation manners, in order to improve the accuracy of the offline scheduling scheme library, the offline scheduling scheme library can be updated by comparing the differences between the target offline scheduling scheme and the iteration obtained wafer processing scheduling scheme. Therefore, when the processing scheduling scheme actually executed for the wafer to be processed is significantly different from the target offline scheduling scheme obtained initially, the actually executed scheme can be directly replaced by the original scheme to ensure that the scheme in the offline library is the latest. Further, the wafer processing equipment can also update the processing parameters in the target offline scheduling scheme to the processing parameters generated in real time to obtain an updated target offline scheduling scheme, and update the target offline scheduling scheme in the offline scheduling scheme library to the updated target offline scheduling scheme. That is, the real-time generated processing parameters that cause the difference are used to generate an updated target offline scheduling scheme based on the scheduling algorithm to update the target offline scheduling scheme. It can be seen that the embodiments of the present application can provide an offline scheduling scheme that meets the actual production requirements, so that the resource allocation is more reasonable and effective, and the wafer production efficiency is improved.

[0073] S208, if the target offline scheduling scheme is not queried from the offline scheduling scheme library, an online scheduling scheme of the wafer to be processed is generated based on the target machine information and the target wafer processing information, and the online scheduling scheme is output as the processing scheduling scheme of the wafer to be processed.

[0074] In some possible implementation manners, the specific implementation manner of the step S208 can refer to the specific implementation manner of the step S102 provided in the embodiments described above, and details are not described herein. Figure 1 The specific implementation manner of the step S102 provided in the embodiments described above, and details are not described herein.

[0075] S209, determining an online wafer processing flow configuration included in the online scheduling scheme, and querying the online wafer processing flow configuration from the wafer processing case record table.

[0076] S210, when the online wafer processing flow configuration is queried from the wafer processing case record table, updating the usage frequency of the online wafer processing flow configuration to the usage frequency plus one.

[0077] S211, when the online wafer processing flow configuration cannot be queried from the wafer processing case record table, the online wafer processing flow configuration is added to the wafer processing case record table, and the use frequency of the online wafer processing flow configuration is recorded as 1.

[0078] In some possible embodiments, when the online scheduling scheme is selected as the processing scheduling scheme of the wafer to be processed, the wafer processing device can further determine the online wafer processing flow configuration included in the online scheduling scheme, and query the online wafer processing flow configuration from the wafer processing case record table. When the online wafer processing flow configuration is queried from the wafer processing case record table, the use frequency of the online wafer processing flow configuration is updated as the use frequency plus one. When the online wafer processing flow configuration cannot be queried from the wafer processing case record table, the online wafer processing flow configuration is added to the wafer processing case record table, and the use frequency of the online wafer processing flow configuration is recorded as 1. Optionally, the wafer processing device can obtain the wafer processing flow configuration of the wafer to be processed online as the online wafer processing flow configuration, that is, the online wafer processing flow configuration includes single sequence / multiple sequence configuration, single Job / multiple Job configuration, and different RunMode configurations. The specific description of the online wafer processing flow configuration can be referred to the wafer processing flow configuration described above, which will not be described here. The wafer processing device can query the wafer processing case record table based on the identifier of the online wafer processing flow configuration, and record the use frequency of the online wafer processing flow configuration. In the embodiments of the present application, the wafer processing case record table records not only the use frequency of the wafer processing flow configuration corresponding to the offline scheduling scheme, but also the use frequency of the online wafer processing flow configuration corresponding to the online scheduling scheme, so as to improve the application range of the wafer processing case record, and effectively manage the processing scheduling scheme used by the wafer processing device.

[0079] S212, when the use frequency of the online wafer processing flow configuration recorded in the wafer processing case record table is equal to the upper limit use frequency threshold, the online wafer processing flow configuration is added to the wafer processing case library, and the online wafer processing flow configuration is taken as input data to call the optimization scheduling algorithm to generate an online optimal scheduling scheme corresponding to the online wafer processing flow configuration. The online optimal scheduling scheme is stored in the offline scheduling scheme library as a newly added offline scheduling scheme.

[0080] In some possible implementation manners, the online wafer processing flow configuration with the usage frequency equal to the upper limit usage frequency threshold value can be added to the wafer processing case library as a wafer processing case, and it can be understood that even if the online wafer processing flow configuration is not an offline acquired wafer processing flow configuration, when the execution frequency of the processing scheduling scheme corresponding to the online wafer processing flow configuration reaches the upper limit usage frequency threshold value, the online wafer processing flow configuration is stored in the wafer processing case library as a commonly used wafer processing case, to ensure that the wafer processing case library can adapt to the demand changes in actual production, and at the same time, the wafer processing case updated to the wafer processing case library can call the optimization scheduling algorithm to generate a corresponding online optimal scheduling scheme and store the online optimal scheduling scheme in the offline scheduling scheme library as a newly added offline scheduling scheme, which also ensures that the offline scheduling scheme library and the wafer processing case library are consistent, avoids that the offline scheduling scheme library includes outdated or irrelevant offline scheduling schemes, and causes storage resource waste and inaccurate scheduling. It can be seen that in the embodiment of the present application, the offline scheduling scheme corresponding to the online wafer processing flow configuration meeting the requirements can be stored in the above-mentioned offline scheduling scheme library, so that the offline scheduling scheme library can cover commonly used offline scheduling schemes. Since the commonly used processing cases are verified through multiple actual applications, the commonly used processing cases have high stability and reliability, so that the offline scheduling scheme library is more in line with production requirements, improves the adaptability of the offline scheduling scheme library, and improves the wafer production efficiency.

[0081] S213, executing the processing scheduling scheme of the wafer to be processed to complete the processing scheduling of the wafer to be processed.

[0082] In some possible implementation manners, the specific implementation manner of the step S213 can refer to the specific implementation manner of the step S103 provided in the above-mentioned Figure 1 The specific implementation manner of the step S103 provided in the above-mentioned

[0083] In the embodiment of the present application, the wafer processing flow configuration with the use frequency greater than or equal to the upper limit use frequency threshold is stored in the wafer processing case library as a wafer processing case, and an offline scheduling scheme is generated based on the wafer processing cases in the wafer processing case library, which can improve the effective matching rate of the offline scheduling scheme, enhance the adaptability of the wafer processing scheduling scheme and the processing requirements of the to-be-processed wafers, improve the wafer production efficiency, further, the target machine information and the target wafer processing information of the to-be-processed wafer are used to query the offline scheduling scheme from the offline scheduling scheme library or generate an online scheduling scheme for the to-be-processed wafer as the processing scheduling scheme of the to-be-processed wafer, and the use frequency of each wafer processing flow configuration stored in the wafer processing case library and the use frequency of the online wafer processing flow configuration are managed and stored through the wafer processing case record table, which improves the management effectiveness and convenience of the online wafer processing flow configuration and each wafer processing flow configuration in the wafer processing case library, finally, the machine is controlled to execute the processing scheduling scheme of the to-be-processed wafer, and the target offline scheduling scheme is dynamically updated according to the real-time generated processing parameters, so as to make a more reasonable offline scheduling scheme, which can improve the rationality and effectiveness of resource allocation and improve the wafer production efficiency.

[0084] Referring to Figure 4 , Figure 4 is a structural schematic diagram of a wafer processing scheduling device provided by the present application. As shown in Figure 4 , the wafer processing scheduling device provided by the present application comprises:

[0085] An offline query module 101 is configured to acquire target machine information and target wafer processing information of a to-be-processed wafer, and query an offline scheduling scheme from an offline scheduling scheme library based on the target machine information and the target wafer processing information, wherein the offline scheduling scheme library comprises a plurality of offline scheduling schemes, and the use frequency of the corresponding wafer processing flow configuration in each offline scheduling scheme is greater than or equal to an upper limit use frequency threshold, and the use frequency of the corresponding wafer processing flow configuration in any offline scheduling scheme is used to indicate the execution frequency of the any offline scheduling scheme;

[0086] An output module 102 is configured to output a target offline scheduling scheme as a processing scheduling scheme of the to-be-processed wafer if the target offline scheduling scheme is queried from the offline scheduling scheme library by the offline query module 101, wherein at least one of the machine information and the wafer processing information in the target offline scheduling scheme is consistent with at least one of the target machine information and the target wafer processing information;

[0087] The online query module 103 is configured to generate an online scheduling scheme of the target wafer based on the target machine information and the target wafer processing information if the target offline scheduling scheme is not obtained from the offline scheduling scheme library by the offline query module 101, and output the online scheduling scheme as the processing scheduling scheme of the target wafer.

[0088] The scheduling execution module 104 is configured to execute the processing scheduling scheme of the target wafer output by the output module 102 or the online query module 103 to complete the processing scheduling of the target wafer.

[0089] In some possible embodiments, the offline query module includes:

[0090] The machine information matching unit 10 is configured to match the target machine information with machine information included in each offline scheduling scheme included in the offline scheduling scheme library, the machine information including at least one of machine hardware configuration, movement parameters of a robot, cleaning time of a wafer processing chamber, or preparation time of a wafer processing chamber.

[0091] The wafer processing information matching unit 20 is configured to match the target wafer processing information with wafer processing information included in each offline scheduling scheme included in the offline scheduling scheme library, the wafer processing information including at least one of wafer processing technology, wafer processing sequence, or wafer processing time.

[0092] The determination unit 30 is configured to determine that the target offline scheduling scheme is obtained from the offline scheduling scheme library when any offline scheduling scheme in which the machine information is consistent with the target machine information is matched from the offline scheduling scheme library by the wafer processing information matching unit 20, or any offline scheduling scheme in which the wafer processing information is consistent with the target wafer processing information is matched from the offline scheduling scheme library by the wafer processing information matching unit 20, or any offline scheduling scheme in which the machine information is consistent with the target machine information and the wafer processing information is consistent with the target wafer processing information is matched from the offline scheduling scheme library by the wafer processing information matching unit 20.

[0093] In some possible embodiments, the device further includes:

[0094] The first acquisition module 105 is configured to acquire a plurality of wafer processing flow configurations of a plurality of wafer types, and store the plurality of wafer processing flow configurations as wafer processing use cases in a wafer processing use case library, wherein the use frequency of each wafer processing flow configuration in the plurality of wafer processing flow configurations within a target time length is greater than or equal to the upper limit use frequency threshold.

[0095] The scheduling scheme generation module 106 is configured to take each wafer processing flow configuration included in the wafer processing case library as input data, call an optimization scheduling algorithm to generate a plurality of optimal scheduling schemes corresponding to the plurality of wafer processing flow configurations, and store the plurality of optimal scheduling schemes as offline scheduling schemes of wafer processing in an offline scheduling scheme library.

[0096] In some possible implementation manners, the device further includes:

[0097] The record table generation module 107 is configured to determine the identification and usage frequency of each wafer processing flow configuration included in the wafer processing case library, and generate a wafer processing case record table based on the identification and usage frequency of each wafer processing flow configuration, so as to feed back the usage state of each wafer processing flow configuration through the wafer processing case record table.

[0098] In some possible implementation manners, the device further includes:

[0099] The first updating module 108 is configured to update the usage frequency of the target wafer processing flow configuration corresponding to the target offline scheduling scheme to the usage frequency plus one, and simultaneously update the usage frequency of the wafer processing flow configuration corresponding to other offline scheduling schemes in the offline scheduling scheme library to the usage frequency minus one, so as to update the wafer processing case record table.

[0100] In some possible implementation manners, the device further includes:

[0101] The removal module 109 is configured to remove, from the wafer processing case library, any wafer processing flow configuration corresponding to any offline scheduling scheme recorded in the wafer processing case record table when the usage frequency of the wafer processing flow configuration is less than a lower limit usage frequency threshold, and simultaneously remove the offline scheduling scheme from the offline scheduling scheme library.

[0102] In some possible implementation manners, the device further includes:

[0103] The second acquisition module 110 is configured to acquire a processing parameter generated in real time when the machine executes the processing scheduling scheme, the processing parameter including at least one of the machine information or the wafer processing information.

[0104] The second updating module 111 is configured to update the processing parameter in the target offline scheduling scheme to the real-time generated processing parameter to obtain an updated target offline scheduling scheme when the real-time generated processing parameter is inconsistent with the processing parameter included in the target offline scheduling scheme, and update the target offline scheduling scheme in the offline scheduling scheme library to the updated target offline scheduling scheme.

[0105] In some possible implementation manners, the apparatus further includes:

[0106] a process configuration query module 112, configured to determine an online wafer processing process configuration included in the online scheduling scheme, and query the online wafer processing process configuration from the wafer processing case record table;

[0107] a third update module 113, configured to, when the process configuration query module 112 queries the online wafer processing process configuration from the wafer processing case record table, update a usage frequency of the online wafer processing process configuration to be one more than the usage frequency;

[0108] a process configuration adding module 114, configured to, when the process configuration query module 112 fails to query the online wafer processing process configuration from the wafer processing case record table, add the online wafer processing process configuration to the wafer processing case record table, and record a usage frequency of the online wafer processing process configuration to be one.

[0109] In some possible implementation manners, the apparatus further includes:

[0110] an offline data update module 115, configured to, when the usage frequency of the online wafer processing process configuration recorded in the wafer processing case record table is equal to the upper limit usage frequency threshold, add the online wafer processing process configuration to the wafer processing case library, and call an optimization scheduling algorithm to generate an online optimal scheduling scheme corresponding to the online wafer processing process configuration by taking the online wafer processing process configuration as input data, and store the online optimal scheduling scheme as a newly added offline scheduling scheme in the offline scheduling scheme library.

[0111] In some possible implementation manners, the online query module 103 includes:

[0112] a decision unit 40, configured to determine a target online scheduling algorithm and a corresponding target operator from an online scheduling algorithm library by self-learning selection strategy based on the target machine information and the target wafer processing information, the online scheduling algorithm library including a plurality of online scheduling algorithms, and each online scheduling algorithm corresponding to at least one operator;

[0113] an online scheduling scheme generation unit 50, configured to call the target online scheduling algorithm and the target operator to generate an online scheduling scheme of the wafer to be processed by taking the target machine information and the target wafer processing information as input data.

[0114] In some possible implementation manners, the implementation manners of each module or unit in the wafer processing scheduling apparatus can refer to the implementation manners of the wafer processing scheduling apparatus Figures 1 to 3The implementation methods provided in each step of the wafer processing scheduling method shown will not be repeated here.

[0115] The wafer processing scheduling device provided in this application can be applied to the wafer processing scheduling process, enrich the methods of obtaining processing scheduling plans, enhance the flexibility of obtaining processing scheduling plans, and further improve the processing scheduling processing capabilities of wafers, and has strong applicability.

[0116] See also Figure 5 , Figure 5 This is a schematic diagram of the structure of the wafer processing equipment provided by this application. Figure 5 As shown, the wafer processing equipment 1000 may include: a processor 1001, a network interface 1004, and a memory 1005. Furthermore, the wafer processing equipment 1000 may also include: a user interface 1003 and at least one communication bus 1002. The communication bus 1002 is used to enable communication between components such as the processor 1001, the network interface 1004, and the memory 1005. The user interface 1003 may include a display screen and a keyboard. Optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface). The memory 1005 includes random access memory (RAM) and non-volatile memory (NVM), such as erasable programmable read-only memory (EPROM). The memory 1005 may optionally be at least one storage device located away from the aforementioned processor 1001. Figure 5 As shown, the memory 1005 as a computer-readable storage medium may include an operating system, a network communication module, a user interface module, and a device control application.

[0117] In such Figure 5 In the wafer processing equipment 1000 shown, the network interface 1004 can provide network communication functions; the user interface 1003 is mainly used to provide an input interface for the user; and the processor 1001 can be used to call the equipment control application stored in the memory 1005 to implement the wafer processing scheduling method provided in this application.

[0118] It should be understood that the wafer processing equipment 1000 described in this application can perform the above Figures 1 to 3 The wafer processing scheduling method in any corresponding embodiment will not be described in detail here. In addition, the description of the beneficial effects of adopting the same method will not be repeated here either.

[0119] The application also provides a computer readable storage medium, and the computer readable storage medium stores the computer program of the wafer processing scheduling method mentioned above, and the computer program includes program instructions, which can execute the wafer processing scheduling method mentioned above when the processor executes the program instructions. Figures 1 to 3 The description of the wafer processing scheduling method in any corresponding embodiment is not repeated here. In addition, the description of the beneficial effects of using the same method is also not repeated here. For technical details not disclosed in the computer readable storage medium embodiments involved in the application, please refer to the description of the method embodiments of the application.

[0120] The computer readable storage medium can be an internal storage unit of the wafer processing scheduling method or the terminal device, such as a hard disk or a memory of the terminal device. The computer readable storage medium can also be an external storage device of the terminal device, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. Further, the computer readable storage medium can include both the internal storage unit and the external storage device of the terminal device. The computer readable storage medium is used to store the computer program and other programs and data required by the terminal device. The computer readable storage medium can also be used to temporarily store data that has been output or will be output.

[0121] In addition, it should be pointed out here that the application also provides a computer program product or a computer program, which includes computer instructions stored in a computer readable storage medium. The processor of the terminal device loads and executes the computer instructions, so that the terminal device executes the wafer processing scheduling method mentioned above. Figures 1 to 4 The method provided by any corresponding embodiment.

[0122] Those skilled in the art can realize that the system and algorithm steps of the examples described in combination with the embodiments disclosed herein can be realized by electronic hardware, computer software or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been described in the above description. The professional can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the application. The above only discloses the preferred embodiments of the application, and of course cannot limit the scope of the application, so the equivalent changes made by the claims of the application are still within the scope of the application.

Claims

1. A wafer processing scheduling method, characterized in that: The method comprises: Obtain target machine information and target wafer processing information of a wafer to be processed, and query an offline scheduling plan from an offline scheduling plan library based on the target machine information and the target wafer processing information, wherein the offline scheduling plan library includes multiple offline scheduling plans, and the usage count of the wafer processing flow configuration corresponding to each of the offline scheduling plans is greater than or equal to an upper usage count threshold, and the usage count of the wafer processing flow configuration corresponding to any of the offline scheduling plans is used to indicate the execution count of any of the offline scheduling plans; If a target offline scheduling plan is obtained by querying the offline scheduling plan library, the target offline scheduling plan is output as the processing scheduling plan for the wafer to be processed, wherein at least one of the machine information and the wafer processing information in the target offline scheduling plan is consistent with at least one of the target machine information and the target wafer processing information; If the target offline scheduling solution is not obtained from the offline scheduling solution library, an online scheduling solution for the wafer to be processed is generated based on the target machine information and the target wafer processing information, and the online scheduling solution is output as the processing scheduling solution for the wafer to be processed; Execute the processing scheduling plan of the wafer to be processed to complete the processing scheduling of the wafer to be processed.

2. The method according to claim 1, characterized in that The querying of an offline scheduling solution from an offline scheduling solution library based on the target machine information and the target wafer processing information includes: Matching the target tool information with tool information included in each offline scheduling plan included in the offline scheduling plan library, wherein the tool information includes at least one of tool hardware configuration, movement parameters of robot configuration, cleaning time of wafer processing chamber, or preparation time of wafer processing chamber; Matching the target wafer processing information with wafer processing information included in each offline scheduling plan included in the offline scheduling plan library, wherein the wafer processing information includes at least one of a wafer processing process, a wafer processing sequence, or a wafer processing time; When any offline scheduling plan whose machine information is consistent with the target machine information is matched from the offline scheduling plan library, or any offline scheduling plan whose wafer processing information is consistent with the target wafer processing information is matched from the offline scheduling plan library, or any offline scheduling plan whose machine information is consistent with the target machine information and the wafer processing information is consistent with the target wafer processing information is matched from the offline scheduling plan library, it is determined that the target offline scheduling plan is queried from the offline scheduling plan library.

3. The method according to claim 1, characterized in that Before acquiring target machine information and target wafer processing information of the wafer to be processed, the method further includes: Acquire multiple wafer processing flow configurations for multiple wafer types, and store the multiple wafer processing flow configurations as wafer processing use cases in a wafer processing use case library, wherein the number of times each of the multiple wafer processing flow configurations is used within a target duration is greater than or equal to an upper limit usage count threshold; The wafer processing flow configurations included in the wafer processing use case library are used as input data, and the optimization scheduling algorithm is called to generate multiple optimal scheduling schemes corresponding to the multiple wafer processing flow configurations, and the multiple optimal scheduling schemes are stored as offline scheduling schemes for wafer processing in the offline scheduling scheme library.

4. The method according to claim 3, characterized in that After storing the multiple wafer processing flow configurations as wafer processing use cases in a wafer processing use case library, the method further includes: Determine the identification and usage count of each wafer processing flow configuration included in the wafer processing use case library, and generate a wafer processing use case record table based on the identification and usage count of each wafer processing flow configuration, so as to feedback the usage status of each wafer processing flow configuration through the wafer processing use case record table.

5. The method according to claim 4, characterized in that After outputting the target offline scheduling plan as the processing scheduling plan for the wafer to be processed, the method further includes: Update the usage count of the target wafer processing flow configuration corresponding to the target offline scheduling scheme to the usage count plus one, and at the same time update the usage count of the wafer processing flow configuration corresponding to other offline scheduling schemes in the offline scheduling scheme library to the usage count minus one, so as to update the wafer processing use case record table.

6. The method according to claim 5, characterized in that After the method further includes updating the usage count of the target wafer processing flow configuration corresponding to the target offline scheduling solution to the usage count plus one, and simultaneously updating the usage count of the wafer processing flow configurations corresponding to other offline scheduling solutions in the offline scheduling solution library to the usage count minus one, the method further includes: When the number of times any wafer processing flow configuration corresponding to any offline scheduling scheme recorded in the wafer processing use case record table is used is less than the lower limit usage number threshold, any wafer processing flow configuration will be removed from the wafer processing use case library, and any offline scheduling scheme will be removed from the offline scheduling scheme library at the same time.

7. The method according to claim 5, characterized in that After executing the processing scheduling plan for the wafer to be processed, the method further includes: Acquire processing parameters generated in real time when the machine executes the processing scheduling plan, wherein the processing parameters include at least one of the machine information or the wafer processing information; When the processing parameters generated in real time are inconsistent with the processing parameters included in the target offline scheduling plan, the processing parameters in the target offline scheduling plan are updated to the processing parameters generated in real time to obtain an updated target offline scheduling plan, and the target offline scheduling plan in the offline scheduling plan library is updated to the updated target offline scheduling plan.

8. The method according to claim 4, characterized in that After outputting the online scheduling plan as the processing scheduling plan for the wafer to be processed, the method further includes: Determining an online wafer processing flow configuration included in the online scheduling plan, and querying the online wafer processing flow configuration from the wafer processing use case record table; When the online wafer processing flow configuration is obtained by querying from the wafer processing use case record table, updating the usage count of the online wafer processing flow configuration to the usage count plus one; When the online wafer processing flow configuration cannot be found in the wafer processing use case record table, the online wafer processing flow configuration is added to the wafer processing use case record table, and the number of times the online wafer processing flow configuration is used is recorded as 1.

9. The method according to claim 8, characterized in that After the updating of the number of times the online wafer processing flow configuration is used is equal to the number of times used plus one, the method further comprises: When the number of times the online wafer processing process configuration recorded in the wafer processing use case record table is used is equal to the upper limit of the number of uses, the online wafer processing process configuration is added to the wafer processing use case library, and the online wafer processing process configuration is used as input data, and the optimization scheduling algorithm is called to generate an online optimal scheduling plan corresponding to the online wafer processing process configuration, and the online optimal scheduling plan is stored as a new offline scheduling plan in the offline scheduling plan library.

10. The method according to any one of claims 1 to 9, characterized in that The generating of the online scheduling scheme for the wafer to be processed based on the target machine information and the target wafer processing information includes: Based on the target machine information and the target wafer processing information, a target online scheduling algorithm and a target operator are determined from an online scheduling algorithm library through a self-learning selection strategy, wherein the online scheduling algorithm library includes a plurality of online scheduling algorithms, and each of the online scheduling algorithms corresponds to at least one operator; The target machine information and the target wafer processing information are used as input data, and the target online scheduling algorithm and the target operator are called to generate an online scheduling plan for the wafer to be processed.

11. A wafer processing scheduling device, characterized in that: The device comprises: An offline query module is configured to obtain target machine information and target wafer processing information of a wafer to be processed, and query an offline scheduling solution from an offline scheduling solution library based on the target machine information and the target wafer processing information, wherein the offline scheduling solution library includes a plurality of offline scheduling solutions, and the usage count of a corresponding wafer processing flow configuration in each of the offline scheduling solutions is greater than or equal to an upper usage count threshold, and the usage count of a corresponding wafer processing flow configuration in any of the offline scheduling solutions is used to indicate the execution count of any of the offline scheduling solutions; an output module, configured to output the target offline scheduling plan as the processing scheduling plan for the wafer to be processed when the offline query module obtains a target offline scheduling plan from the offline scheduling plan library, wherein at least one of the machine information and the wafer processing information in the target offline scheduling plan is consistent with at least one of the target machine information and the target wafer processing information; an online query module, configured to generate an online scheduling plan for the wafer to be processed based on the target machine information and the target wafer processing information when the offline query module fails to obtain the target offline scheduling plan from the offline scheduling plan library, and output the online scheduling plan as the processing scheduling plan for the wafer to be processed; The scheduling execution module is used to execute the processing scheduling plan of the wafer to be processed output by the output module or the online query module to complete the processing scheduling of the wafer to be processed.

12. The device according to claim 11, characterized in that The offline query module includes: a machine information matching unit, configured to match the target machine information with machine information included in each offline scheduling plan included in the offline scheduling plan library, wherein the machine information includes at least one of machine hardware configuration, movement parameters of a robot configuration, cleaning time of a wafer processing chamber, or preparation time of a wafer processing chamber; a wafer processing information matching unit, configured to match the target wafer processing information with wafer processing information included in each offline scheduling scheme included in the offline scheduling scheme library, wherein the wafer processing information includes at least one of a wafer processing technology, a wafer processing sequence, or a wafer processing time; A determination unit is used to determine the target offline scheduling plan obtained by querying from the offline scheduling plan library when the machine information matching unit matches any offline scheduling plan in which the machine information is consistent with the target machine information, or when the wafer processing information matching unit matches any offline scheduling plan in which the wafer processing information is consistent with the target wafer processing information, or when the machine information matching unit matches any offline scheduling plan in which the machine information is consistent with the target machine information and the wafer processing information matching unit matches any offline scheduling plan in which the wafer processing information is consistent with the target wafer processing information.

13. The device according to claim 11, characterized in that The device further comprises: A first acquisition module is configured to acquire multiple wafer processing flow configurations for multiple wafer types, and store the multiple wafer processing flow configurations as wafer processing use cases in a wafer processing use case library, wherein the number of times each of the multiple wafer processing flow configurations is used within a target duration is greater than or equal to an upper limit usage count threshold; A scheduling scheme generation module is used to take the various wafer processing flow configurations included in the wafer processing use case library as input data, call the optimization scheduling algorithm to generate multiple optimal scheduling schemes corresponding to the multiple wafer processing flow configurations, and store the multiple optimal scheduling schemes as offline scheduling schemes for wafer processing in the offline scheduling scheme library.

14. The device according to claim 13, characterized in that The device further comprises: A record table generation module is used to determine the identification and usage count of each wafer processing flow configuration included in the wafer processing use case library, and generate a wafer processing use case record table based on the identification and usage count of each wafer processing flow configuration, so as to feedback the usage status of each wafer processing flow configuration through the wafer processing use case record table.

15. The device according to claim 14, characterized in that The device further comprises: The first update module is used to update the number of uses of the target wafer processing flow configuration corresponding to the target offline scheduling scheme to the number of uses plus one, and at the same time update the number of uses of the wafer processing flow configurations corresponding to other offline scheduling schemes in the offline scheduling scheme library to the number of uses minus one, so as to update the wafer processing use case record table.

16. The device according to claim 15, characterized in that The device further comprises: A removal module is used to remove any wafer processing process configuration from the wafer processing use case library and remove any offline scheduling plan from the offline scheduling plan library when the number of times any wafer processing process configuration corresponding to any offline scheduling plan recorded in the wafer processing use case record table is used is less than the lower limit usage number threshold.

17. The device according to claim 16, characterized in that The device further comprises: A second acquisition module is configured to acquire processing parameters generated in real time when the machine executes the processing scheduling plan, wherein the processing parameters include at least one of the machine information or the wafer processing information; The second updating module is used to update the processing parameters in the target offline scheduling plan to the real-time generated processing parameters to obtain an updated target offline scheduling plan when the real-time generated processing parameters are inconsistent with the processing parameters included in the target offline scheduling plan, and update the target offline scheduling plan in the offline scheduling plan library to the updated target offline scheduling plan.

18. The device according to claim 14, characterized in that The device further comprises: A process configuration query module, configured to determine the online wafer processing process configuration included in the online scheduling plan, and query the online wafer processing process configuration from the wafer processing use case record table; A third updating module is configured to update the usage count of the online wafer processing process configuration to the usage count plus one when the process configuration query module obtains the online wafer processing process configuration from the wafer processing use case record table; A process configuration adding module is used to add the online wafer processing process configuration to the wafer processing use case record table when the process configuration query module cannot find the online wafer processing process configuration from the wafer processing use case record table, and record the number of times the online wafer processing process configuration is used as 1.

19. The device according to claim 18, characterized in that The device further comprises: An offline data update module is used to add the online wafer processing process configuration to the wafer processing use case library when the number of times the online wafer processing process configuration recorded in the wafer processing use case record table is used is equal to the upper limit of the number of uses threshold, and at the same time use the online wafer processing process configuration as input data, call the optimization scheduling algorithm to generate an online optimal scheduling plan corresponding to the online wafer processing process configuration, and store the online optimal scheduling plan as a newly added offline scheduling plan in the offline scheduling plan library.

20. The device according to any one of claims 11 to 19, characterized in that The online query module includes: a decision unit, configured to determine a target online scheduling algorithm and a target operator from an online scheduling algorithm library based on the target machine information and the target wafer processing information through a self-learning selection strategy, wherein the online scheduling algorithm library includes a plurality of online scheduling algorithms, each of which corresponds to at least one operator; The online scheduling solution generating unit takes the target machine information and the target wafer processing information as input data, calls the target online scheduling algorithm and the target operator to generate an online scheduling solution for the wafer to be processed.

21. A wafer processing equipment, characterized in that: include: processor and memory; The processor is connected to the memory, wherein the memory is used to store program code, and the processor is used to call the program code to execute the method according to any one of claims 1 to 10.

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