Movable device

Abstract

The embodiment of the invention relates to a movable device. The movable device comprises a lifting unit which is located on a first plane and used for enabling an object to be moved which can be placed on the first plane to reciprocate in a first direction; and the sliding assembly is used for enabling the to-be-moved object to reciprocate through a sliding rail located on the second plane in the second direction. Other embodiments of the present application relate to a processing apparatus that may include the aforementioned movable device. The movable device provided by the embodiment of the invention can effectively solve the problems encountered in the traditional technology.

Description

Technical Field

[0001] The present application relates to the field of machinery, and more particularly, to a movable device. Background Art

[0002] With the rapid development of science and technology, the demand for processing-related equipment in the fields of materials science, electronic engineering, optical manufacturing, etc. is increasing. Some processing equipment or some of its components are difficult to replace or maintain due to their immobility, or are difficult to move due to their large size and heavy weight. However, some current movable devices cannot meet specific needs.

[0003] Therefore, the existing movable devices need to be further improved. Summary of the invention

[0004] One of the purposes of the present application is to provide a mobile device to solve at least one problem existing in the prior art.

[0005] According to the first aspect of the present application, a movable device includes: a lifting unit, which is located on a first plane and is used to make an object to be moved that can be placed on the first plane move back and forth in a first direction; a sliding assembly, which is used to make the object to be moved move back and forth in a second direction through a slide rail located on a second plane.

[0006] In some embodiments, the lifting unit includes a jack.

[0007] In some embodiments, the lifting unit includes a support member for fixing the position of the movable device in the first direction.

[0008] In some embodiments, the object to be transferred includes one or more vacuum pumps.

[0009] In some embodiments, the movable device further comprises a second pipe connected to one end of the object to be moved, wherein the second pipe comprises a shock absorbing portion.

[0010] In some embodiments, the lifting unit further comprises a first support member, the lower end of which is located on the first plane, and the upper end is provided with a plurality of pillars for supporting the associated components, the associated components are connected to the object to be moved. The pillars may comprise an axis core and a removable sleeve covering the outer periphery of the axis core.

[0011] According to a second aspect of the present application, a processing equipment may include the aforementioned movable device.

[0012] The movable device proposed in the present application is simple to operate, easy to assemble, and convenient for operating the object to be moved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Schematic diagram of a movable device according to some embodiments of the present application.

[0014] Figure 2 Schematic diagram of movable devices according to other embodiments of the present application.

[0015] Figure 3A Schematic diagram of the support 240 according to some embodiments of the present application.

[0016] Figure 3B It is a cross-sectional view of the second cover member 210 and the support column 240 after being installed.

[0017] Figures 4A-4C This is a schematic diagram of processing equipment according to some embodiments of the present application.

[0018] Figure 5 Schematic diagram of processing equipment according to some further embodiments of the present application. DETAILED DESCRIPTION

[0019] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0020] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0021] Embodiments of the present application will be described in detail below. Throughout the present application specification, as used herein, the terms "roughly", "substantially", "substantially" and "approximately" are used to describe and illustrate small changes. When used in conjunction with an event or situation, the term may refer to an example in which an event or situation occurs precisely and an example in which an event or situation occurs very approximately. For example, when used in conjunction with a numerical value, the term may refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, two values ​​may be considered “substantially” the same if the difference between them is less than or equal to ±10% of the average of the values ​​(e.g., less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%).

[0022] In this specification, unless otherwise specified or limited, relative terms such as "central", "longitudinal", "lateral", "front", "rear", "right", "left", "inner", "outer", "lower", "higher", "horizontal", "vertical", "above", "below", "above", "below", "top", "bottom" and their derivative terms (such as "horizontally", "downwardly", "upwardly", etc.) should be interpreted as referring to the directions described in the discussion or depicted in the drawings. These relative terms are only used for convenience of description and do not require that the present application be constructed or operated in a specific direction.

[0023] In addition, sometimes amounts, ratios and other numerical values ​​are presented in range format herein. It should be understood that such range format is for convenience and brevity, and should be flexibly understood to include not only the numerical values ​​explicitly specified as range limits, but also all individual numerical values ​​or sub-ranges encompassed within the range, as if each numerical value and sub-range were explicitly specified.

[0024] Furthermore, for ease of description, “first”, “second”, “third”, etc. may be used herein to distinguish different components in one figure or a series of figures. “First”, “second”, “third”, etc. are not intended to describe the corresponding components.

[0025] In the embodiments of the present application, unless otherwise specified or limited, the terms "set", "connected", "coupled", "fixed" and similar terms are used broadly, and those skilled in the art may understand that the above terms may be, for example, fixed connection, detachable connection or integrated connection according to the specific circumstances; it may also be a mechanical connection or an electrical connection; it may also be a direct connection or an indirect connection through an intermediate structure; it may also be internal communication between two components.

[0026] Figure 1 Schematic diagram of a movable device according to some embodiments of the present application.

[0027] like Figure 1 As shown, a movable device 100 provided in some embodiments of the present application includes: a lifting unit 110, which is located on a first plane P1 and is used to enable an object to be moved 101 that can be placed on the first plane P1 to reciprocate in a first direction d1; a sliding component, which is used to enable the object to be moved 101 to reciprocate in a second direction d2 through a slide rail located on the second plane P2.

[0028] The movable device proposed in the present application is convenient for moving the object to be moved, and in particular, the object to be moved can be positioned quickly, repeatedly and accurately through the slide rail.

[0029] According to some embodiments of the present application, the lifting unit 110 may include a jack. Figure 1 The two jacks 111.

[0030] According to some embodiments of the present application, the lifting unit 110 may include a first support member 112 for further positioning the object 101 to be moved in the first direction d1, and may also prevent the lifting unit 110 from descending. The first support member may be a stopper (angle brace, foot cup), or the angle brace may be placed on a base with a larger surface area to increase the force area between the first support member and the supporting surface.

[0031] According to other embodiments of the present application, the object to be moved may include one or more vacuum pumps (or vacuum pump groups), which can be used to construct processing equipment. The processing equipment may include vacuum coating equipment. As the cornerstone of high-end manufacturing, the vacuum coating equipment industry has ushered in rapid development with the rise of industries such as semiconductors, new energy, and electronic components. However, the vacuum pump group in traditional processing equipment is heavy and large in size, and cannot be moved, which is not convenient for the operation or maintenance of the processing equipment.

[0032] The movable device provided in the present application can place the vacuum pump group on a base (the base can be located on the first plane P1), and a slidable component is arranged on the base to couple with a slide rail arranged on the ground. The direction and shape of the slide rail can be set as required to facilitate the reciprocating sliding of the movable device in the required direction, thereby realizing rapid, repeated and accurate positioning of the object to be moved, for example Figure 1The second direction d2 shown may be a horizontal direction.

[0033] In order to prevent the object to be moved from vibrating during operation or to prevent the working unit connected to the object to be moved from being damaged, a shock absorbing part 102 may be provided. The shock absorbing part may be a flexible object, such as a spring-shaped pipe, and may be provided between the object to be moved and the working unit.

[0034] Figure 2 Schematic diagram of movable devices according to other embodiments of the present application.

[0035] like Figure 2 As shown, the lifting unit may further include a second support member 113, the lower end of which is located on the first substrate (such as the aforementioned base), the first substrate may be arranged on the first plane P1, and a plurality of pillars 240 for supporting associated components (such as the working unit 301) are arranged on the upper end of the second support member 113. The associated components may be positioned in the first direction through the second support member, and the first direction d1 may be a vertical direction.

[0036] According to some embodiments of the present application, the support 240 may include a shaft core 241 and a removable sleeve 242 covering the outer periphery of the shaft core 241. After the working unit is connected to the second support member, the working unit 301 can be separated from the shaft core 241 by moving or removing the sleeve 242, thereby preventing the working unit from being affected by the vibration of the second support member.

[0037] Figure 3A Schematic diagram of the support 240 according to some embodiments of the present application.

[0038] Figure 3B It is a cross-sectional view of the second cover member 210 and the support column 240 after being installed.

[0039] Figure 3B The dotted line portion in FIG. 2 illustrates that the sleeve 242 is movable or removable, so that the shaft core 241 is separated from the second cover member 210 .

[0040] It should be understood that in addition to the effects of shock isolation and damping, the support 240 can also achieve the technical effects of heat insulation or insulation. Of course, other buffer materials can also be filled in the gap between the shaft core and the working unit after the sleeve is removed to achieve the effects of shock isolation, heat insulation and insulation.

[0041] Some other embodiments of the present application further provide a processing equipment, which includes the aforementioned movable device.

[0042] Figures 4A-4C This is a schematic diagram of processing equipment according to some embodiments of the present application.

[0043] like Figures 4A-4CAs shown, the processing equipment provided in some embodiments of the present application includes a working unit 301, which includes a first end 310 and a second end 320; a first operating unit 101, which includes a first cover part 110 for connecting to the first end 310 of the working unit 301; a second operating unit 201, which includes a second cover part 210 for connecting to the second end 320 of the working unit 301, wherein the second operating unit 201 can be moved in multiple directions by the aforementioned movable device to couple or separate with the first operating unit 101.

[0044] The term “coupled” in the present application may be understood as one element / component / unit being directly or indirectly connected to another element / component / unit, or the two being directly or indirectly connected.

[0045] The processing equipment may include semiconductor processing equipment, such as semiconductor processing equipment used for processes such as coating, etching, etc. The working unit may be a reaction chamber, in which an object to be processed (not shown in the figure) may be placed.

[0046] Figure 5 Schematic diagram of processing equipment according to other embodiments of the present application.

[0047] like Figure 5 As shown, the first operating unit 101 may include a first pipe 120 for conveying a first workpiece to the working unit 301 through the first cover member 110. The first workpiece may include an excited gas, a carrier gas, such as plasma. The second operating unit 201 also includes a second pipe 220 for outputting a second workpiece from the working unit 301 through the second cover member 210. The second workpiece can be discharged from the working unit through the second pipe.

[0048] The second operating unit 201 can move in multiple directions to couple or separate from the first operating unit 101 to facilitate processing of the working unit 310, such as replacing or maintaining the working unit, or processing of the object to be processed in the working unit, such as replacing or maintaining the object to be processed, making the replacement or maintenance work more convenient.

[0049] According to some embodiments of the present application, the reaction chamber may include a quartz tube in which wafers to be processed may be placed. Multiple wafers may be placed in the reaction chamber via a carrier (such as a wafer boat) to facilitate placing the wafers in or taking them out of the reaction chamber.

[0050] like Figure 4B As shown, the second operating unit 201 can reciprocate in the first direction d1 to couple or separate with the first operating unit 101, and can also reciprocate in the second direction d2 to move away from the first operating unit 101, so that the object to be processed inside the working unit can be operated through the first end 310 of the working unit 301, such as replacement or maintenance.

[0051] like Figure 4C As shown, the second operating unit 201 can reciprocate in the first direction d1 to couple or separate with the first operating unit 101, and can also reciprocate in the second direction d2 to move away from the working unit 301, so as to operate the object to be processed inside the working unit through the second end 320 of the working unit 301, such as replacement or maintenance.

[0052] Both ends of the reaction chamber (such as Figure 4B and Figure 4C The first end 310 and the second end 320 in the wafer can be connected to the operating unit to input or discharge the workpiece acting on the wafer. According to the processing requirements, the working unit can be sealed to the operating unit, for example, the two ends of the working unit can be sealed to the operating unit through the cover component.

[0053] like Figure 4B and Figure 4C As shown, when the second operating unit 201 is separated from the first operating unit 101 , the first cover member 110 of the first operating unit 101 is separated from the working unit 301 , and the second cover member 210 of the second operating unit 201 is sealed and connected to the second end 320 of the working unit 301 .

[0054] When the second operating unit 201 is separated from the first operating unit 101 , the second cover member 210 of the second operating unit 201 is separated from the second end 320 of the working unit 301 , and the first cover member 110 of the first operating unit 101 is sealed and connected to the first end 310 of the working unit 301 .

[0055] According to some embodiments of the present application, the reaction chamber can be used to generate chemical or physical reactions, and gas can be introduced into the reaction chamber to generate the desired chemical reaction, thereby acting on the object to be processed in the reaction chamber to achieve the processing purpose. When the object to be processed is a wafer, the reaction chamber can be configured as a cylindrical quartz tube to evenly distribute the gas in the reaction chamber.

[0056] The technical content and technical features of this application have been disclosed as above, but those skilled in the art may still make various substitutions and modifications based on the teachings and disclosures of this application without departing from the spirit of this application. Therefore, the protection scope of this application should not be limited to the contents disclosed in the embodiments, but should include various substitutions and modifications without departing from this application, and be covered by the claims of this application.

Claims

1. A mobile device, comprising: A lifting unit, which is located on the first plane and is used to reciprocate the object to be moved which can be placed on the first plane in a first direction; The sliding assembly is used to enable the object to be moved to reciprocate in a second direction through a sliding rail located on a second plane. The movable device according to claim 1 , wherein the lifting unit comprises a jack.

3. The movable device according to claim 1, wherein the lifting unit comprises a first support member for positioning the object to be moved in the first direction. The movable device according to claim 1 , wherein the object to be moved comprises one or more vacuum pumps. The movable device according to claim 1 , wherein the object to be moved is provided with a shock absorbing portion.

6. The movable device according to claim 1, wherein the lifting unit further comprises a first support member, the lower end of which is located on the first plane, and the upper end is provided with a plurality of pillars for supporting associated components, wherein the associated components are connected to the object to be moved. 7 . The movable air extraction device according to claim 6 , wherein the support column comprises an axis core and a removable sleeve covering the outer periphery of the axis core.

8. A processing plant comprising a movable device according to any one of the preceding claims 1-7.

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