Plastic packaging processing device for chip packaging and use method

Abstract

The invention relates to the field of chip packaging. The invention discloses a plastic packaging processing device for chip packaging and a use method, and aims to solve the problem that the subsequent chip plastic packaging quality of the device is influenced by manually placing a chip needing plastic packaging in a mold. The chip plastic packaging device is composed of a chip positioning and clamping mechanism, a chip angle exchange mechanism and a chip plastic packaging mechanism. According to the plastic packaging processing device for chip packaging and the use method, a vertical driving air cylinder drives four extrusion plates to extrude a chip needing plastic packaging to the right lower side of an octagonal plate, so that the upper end of an L-shaped sliding rod slides to the upper right side of a guide groove, and then along with continuous upward movement of the octagonal plate, the chip needs to be subjected to plastic packaging; according to the chip clamping device, the upper side V-shaped groove is matched with the lower side V-shaped groove, one end of the L-shaped sliding rod slides to the included angle from the end of the upper side V-shaped groove, the supporting sliding plate which moves upwards is locked, then the four extrusion plates are locked, dust is prevented from being attached to the chip through clamping of the four sides of the chip, and then the quality of subsequent plastic packaging of the chip is guaranteed.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to a plastic packaging processing device for chip packaging and a use method thereof. Background Art

[0002] The shapes of chips are square, rectangular and round. After the bare semiconductor chip is wire bonded, it must be under strict environmental control to avoid failure. However, the daily environment does not have the environmental control conditions it needs. It is usually necessary to use packaging to protect the chip and encapsulate the semiconductor integrated circuit chip into a plastic shell. There are two main types of semiconductor chip plastic packaging molding, namely plastic transfer molding and compression molding. Transfer molding is the process of heating the epoxy resin mixture into a flowing melt and filling the mold cavity under pressure to encapsulate and protect the chip.

[0003] The existing patent (Announcement No.: CN116403942A) discloses a packaging device for chip processing, including a base frame, etc. The downward movement of the guide block will drive the push plate to move in the direction close to the rubber block, so that the pressure rod and the push plate clamp the rubber plate, and the pressure plate limits the upper mold, thereby reducing the gap between the rubber block and the chip pins, thereby reducing the impact on the chip pins during packaging. In the process of realizing the present invention, the inventor found that there are at least the following problems in the prior art that have not been solved: 1. The device manually places the chip to be encapsulated in the mold, which easily causes dust to adhere to the chip, affecting the quality of the subsequent chip encapsulation of the device; 2. If the user places the rectangular chip, it is also necessary to adjust the placement direction of the chip to ensure that the chip matches the mold, which increases the labor intensity of the user and easily affects the efficiency of the device in encapsulating the chip. Summary of the invention

[0004] The purpose of the present invention is to provide a plastic encapsulation processing device for chip packaging and a method of use, so as to solve the problem raised in the above background technology that manually placing the chip to be plastic encapsulated in the mold affects the quality of the subsequent plastic encapsulation of the chip by the device. To achieve the above purpose, the present invention provides the following technical solutions: a plastic encapsulation processing device for chip packaging, comprising a chip conveying table, a plastic encapsulation table is installed on the right side of the chip conveying table, a positioning conveying table is longitudinally arranged on the plastic encapsulation table, two inverted U-shaped brackets are installed on the top surface of the plastic encapsulation table and the chip conveying table, a horizontal driving cylinder is fixedly installed between the two inverted U-shaped brackets, a vertical driving cylinder is fixedly connected to the left end of the horizontal driving cylinder, a chip positioning clamping mechanism is fixedly connected to the lower end of the vertical driving cylinder, and a chip angle changing mechanism is arranged on the chip positioning clamping mechanism; A chip plastic sealing mechanism is installed on the top of the right side of the plastic sealing platform, and the chip on the positioning and conveying platform is positioned and clamped by the chip positioning and clamping mechanism, and then the chip clamped at the bottom of the chip positioning and clamping mechanism is conveyed to the positioning and conveying platform by the vertical driving cylinder, and the chip in the positioning and conveying platform is plastic sealed in cooperation with the chip plastic sealing mechanism; The chip positioning and clamping mechanism comprises an outer sleeve fixedly connected to the lower end of the vertical driving cylinder, an inner tube slidably arranged inside the outer sleeve, and a compression spring connected between the inner wall of the inner tube and the top surface of the inner wall of the outer sleeve; An octagonal plate is fixedly connected to the bottom surface of the inner tube, and four rectangular plates are fixedly connected to the bottom of the octagonal plate in an equidistant manner in a ring shape. Two parallel first spring telescopic plates are hingedly connected to the side of the rectangular plate facing the bottom of the inner tube, and an extrusion plate is hingedly connected to one end of the two first spring telescopic plates away from the rectangular plate, and the extrusion plate and the rectangular plate are parallel to each other; A supporting sliding plate is slidably arranged on the upper limit sliding surfaces of the four extrusion plates, and the supporting sliding plate is slidably arranged on the four rectangular plates, the supporting sliding plate is directly below the octagonal plate, and a locking piece is arranged between the supporting sliding plate and the octagonal plate, and a vacuum cleaner is arranged in the middle of the bottom surface of the supporting sliding plate.

[0005] Preferably, the locking member comprises a limiting slide rail fixed on the top surface of the supporting sliding plate, a rectangular slider is slidably connected inside the limiting slide rail, a guide groove is provided inside the rectangular slider, an L-shaped slide rod is slidably connected inside the guide groove, and the lower end of the L-shaped slide rod is hinged on the top surface of the supporting sliding plate; The bottom of the rectangular sliding block is fixedly connected with a compression spring, and the lower end of the compression spring is fixedly connected to the top surface of the supporting sliding plate.

[0006] Preferably, the guide groove consists of two V-shaped grooves and two vertical grooves, and the two V-shaped grooves are connected through two vertical grooves.

[0007] Preferably, the chip angle switching mechanism comprises four limiting guide grooves provided on the outer wall of the inner tube, and the limiting guide grooves are composed of vertical grooves and oblique arc grooves, and the four limiting guide grooves are interconnected, wherein two of the limiting guide grooves are slidably connected with hinge plates in the vertical grooves, the upper ends of the hinge plates are hinged to the bottom end of the outer sleeve, the lower ends of the hinge plates are fixedly connected with a spring telescopic rod, and one end of the spring telescopic rod abuts against the vertical grooves of the limiting guide grooves; The chip angle exchange mechanism also includes four telescopic plates fixed on the top of the four extrusion plates, and the four telescopic plates are respectively slidably set in four limit grooves opened on the supporting sliding plate. The top of the telescopic plate passes through the limit groove and is fixedly connected with a second spring telescopic plate. The bottom of the second spring telescopic plate is slidably set on the top surface of the octagonal plate, and the top of the second spring telescopic plate is an inclined surface.

[0008] Preferably, the chip plastic sealing mechanism comprises a guide rail fixed on the top of the right side of the plastic sealing platform, a rectangular slide is slidably connected in the guide rail, a wave guide groove is provided on the rectangular slide, two sliders are slidably connected in the wave guide groove, and a push plate is rotatably connected to the top of the two sliders, and the push plate slides on the top surface of the rectangular slide; The middle part of the top surface of the pushing plate is rotatably connected with a first return spring telescopic rod, and the right end of the first return spring telescopic rod is fixed to the top surface of the right side of the guide slide rail, and the first return spring telescopic rod inner rod is provided with a card slot on both sides of the front and rear, and the outer sleeve of the first return spring telescopic rod is provided with a socket, and the second return spring telescopic rod is movably inserted in the socket, one end of the second return spring telescopic rod passes through the socket and abuts against the inner rod of the first return spring telescopic rod, and the other end of the second return spring telescopic rod is fixed to the top surface of the rectangular slide, and the inner rod of the second return spring telescopic rod is provided with a right-angled triangular groove, a right-angled triangular block is squeezed in the right-angled triangular groove, and the right-angled triangular block is fixed on the right side of the top surface of the rectangular slide; Rectangular grooves are provided on both sides of the guide rail, and a third return spring telescopic rod is fixedly connected to the right end of the inner wall of the rectangular groove. The left ends of the two third return spring telescopic rods are respectively fixed on the front and rear sides of the rectangular slide.

[0009] Preferably, a conveyor is fixedly installed between the inverted U-shaped brackets, and one end of the conveyor pipe of the conveyor passes through the left slider and extends to the lower side of the rectangular slide.

[0010] Preferably, both sides of the vertical driving cylinder are fixedly connected with limiting slides, and the vertical driving cylinder is slidably arranged on the inverted U-shaped bracket through two limiting slides.

[0011] Preferably, the method for using the plastic encapsulation processing device for chip packaging comprises the following steps: S1: After the chip conveying platform conveys the chip to the lower side of the octagonal plate, the vertical driving cylinder drives four extrusion plates to squeeze the chip to be plastic-sealed to the lower side of the octagonal plate, and during the relative movement of the four extrusion plates, the upper end of the L-shaped slide bar slides to the upper right side of the guide groove; Then, as the vertical driving cylinder continues to extend, the hinged plate at the lower end of the outer sleeve is driven to slide in the vertical groove of the limit guide groove. When the spring telescopic rod at the lower end of the hinged plate squeezes the second spring telescopic plate, the spring telescopic rod swings clockwise along the inclined surface on the upper end of the second spring telescopic plate, and then enters the oblique arc groove of the first limit guide groove in the clockwise direction. Then, the outer sleeve is driven upward by contracting the vertical driving cylinder, driving the inner tube and the octagonal plate to rotate 90 degrees clockwise at the same time, so that the chip between the four extrusion plates rotates 90 degrees. Then, as the octagonal plate continues to move upward, one end of the L-shaped slide bar slides from the end of the upper V-shaped groove to its angle, locking the upward-moving support slide plate, and then locking the four extrusion plates. S2: The clamped chip is then pulled to the right by contracting the lateral driving cylinder, and the rectangular slide is pushed to slide rightward in the guide rail. When the first return spring telescopic rod is contracted to the shortest value, one end of the second return spring telescopic rod is inserted into the socket to lock the contracted first return spring telescopic rod. When the octagonal plate moves to the upper side of the positioning conveyor, the vertical drive cylinder extends and moves downward again, releasing the restriction of the octagonal plate on the supporting sliding plate. As the octagonal plate continues to move upward, the four extrusion plates move away from the center of the octagonal plate, releasing the clamping of the four extrusion plates on the chip, causing the chip to fall into the plastic sealing groove on the positioning conveyor; S3: Then the horizontal driving cylinder is extended to push the vertical driving cylinder to move left and reset. At this time, the rectangular slide moves left under the action of the third reset spring telescopic rod, and drives the right-angled triangle block to move left to squeeze the right-angled triangle groove, and then pulls the second reset spring telescopic rod out of the socket. At this time, the push plate moves left under the reset force of the first reset spring telescopic rod, and pushes one end of the conveyor pipe to move left and slide in the wave guide groove at the same time. When the conveyor pipe moves to the top of the positioning conveying platform, the plastic sealing glue is transported to the positioning groove through the conveyor pipe on the conveyor to plastic seal the chip in the positioning groove.

[0012] Compared with the prior art, the present invention has the following beneficial effects: In the present invention, the four extrusion plates are driven by a vertical driving cylinder to squeeze the chip to be plastic-sealed to the lower side of the octagonal plate, and during the relative movement of the four extrusion plates, the upper end of the L-shaped slide bar slides to the upper right side of the guide groove, and then as the octagonal plate continues to move upward, one end of the L-shaped slide bar slides from the end of the upper V-shaped groove to its angle, and the supporting sliding plate after moving upward is locked, and then the four extrusion plates are locked, completing the positioning and fixing of the chip by the device, and the four extrusion plates clamp the four sides of the chip to prevent dust from adhering to the chip, thereby ensuring the quality of subsequent plastic sealing of the chip.

[0013] In the present invention, when the spring telescopic rod at the lower end of the hinged plate squeezes the second spring telescopic plate, the spring telescopic rod swings clockwise along the inclined surface on the upper end of the second spring telescopic plate, and then enters the inclined arc groove of the first limiting guide groove in the clockwise direction, and can indicate that the rectangular chip is placed horizontally and needs to be adjusted to adapt to the opening direction of the plastic sealing groove on the positioning and conveying platform, and then the outer sleeve is driven to move upward by contracting the vertical driving cylinder, driving the inner tube and the octagonal plate to rotate clockwise by 90 degrees at the same time, so that the chip between the four extrusion plates rotates 90 degrees, and the chip is rotated to ensure that the chip corresponds to the plastic sealing groove on the positioning and conveying platform.

[0014] In the present invention, the vertical driving cylinder is pushed to move left and reset by extending the horizontal driving cylinder. At this time, the rectangular slide moves left under the action of the third reset spring telescopic rod, and drives the right-angled triangle block to move left and squeeze the right-angled triangle groove, thereby pulling the second reset spring telescopic rod out of the socket. At this time, the push plate moves left under the action of the reset force of the first reset spring telescopic rod, and pushes one end of the conveyor tube to move left and slide in the wave guide groove at the same time. When the conveyor tube moves to the top of the positioning conveying platform, the plastic sealing glue is transported into the positioning groove through the conveyor tube on the conveyor to complete the plastic sealing of the chip surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a three-dimensional structural cross-sectional view of the outer sleeve of the present invention; Figure 3 It is a three-dimensional structural schematic diagram of the hinged plate and the spring telescopic rod of the present invention; Figure 4 is a top view of an octagonal plate of the present invention; Figure 5 It is a schematic diagram of the three-dimensional structure of the supporting sliding plate and the vacuum cleaner of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the first spring telescopic plate and the extrusion plate of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the limiting slide rail and the rectangular slide block of the present invention; Figure 8 It is a schematic diagram of the three-dimensional structure of the rectangular slider of the present invention; Fig. 9 It is a schematic diagram of the three-dimensional structure of the first return spring telescopic rod and the third return spring telescopic rod of the present invention in an extended state; Fig.10 It is a schematic diagram of the three-dimensional structure of the first return spring telescopic rod and the third return spring telescopic rod of the present invention in a contracted state; Fig.11 It is a schematic diagram of the three-dimensional structure of the first return spring telescopic rod and the rectangular slide plate of the present invention.

[0016] In the figure: 1. chip conveying platform; 2. plastic sealing platform; 3. positioning conveying platform; 4. inverted U-shaped bracket; 5. horizontal driving cylinder; 6. vertical driving cylinder; 7. chip positioning clamping mechanism; 71. outer sleeve; 72. inner tube; 73. compression spring; 74. octagonal plate; 75. rectangular plate; 76. first spring telescopic plate; 77. extrusion plate; 78. locking member; 781. limit slide rail; 782. rectangular slider; 783. guide groove; 7831. V-shaped groove; 7832. vertical groove; 784. L-shaped slide bar; 785. compression spring; 79. support slide plate; 710. vacuum cleaner; 8 , chip angle changing mechanism; 81, limiting guide groove; 82, hinged plate; 83, spring telescopic rod; 84, telescopic plate; 85, limiting groove; 86, second spring telescopic plate; 9, chip plastic sealing mechanism; 91, guide rail; 92, rectangular slide; 93, wave guide groove; 94, slider; 95, push plate; 96, first reset spring telescopic rod; 97, slot; 98, socket; 99, second reset spring telescopic rod; 910, right-angle triangular groove; 911, right-angle triangular block; 912, rectangular groove; 913, third reset spring telescopic rod; 10, conveyor; 11, limiting slide. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figures 1 to 11 The present invention provides a technical solution: a plastic sealing platform 2 is installed on the right side of a chip conveying platform 1, a positioning conveying platform 3 is longitudinally arranged on the plastic sealing platform 2, two inverted U-shaped brackets 4 are installed on the top surface of the plastic sealing platform 2 and the chip conveying platform 1, a horizontal driving cylinder 5 is fixedly installed between the two inverted U-shaped brackets 4, a vertical driving cylinder 6 is fixedly connected to the left end of the horizontal driving cylinder 5, a chip positioning clamping mechanism 7 is fixedly connected to the lower end of the vertical driving cylinder 6, and a chip angle changing mechanism 8 is arranged on the chip positioning clamping mechanism 7; a plastic sealing groove is arranged on the positioning conveying platform 3, and then the chip in the plastic sealing groove is plastic sealed by a conveyor 10.

[0019] A chip plastic sealing mechanism 9 is installed on the top of the right side of the plastic sealing platform 2, and the chip on the positioning and conveying platform 3 is positioned and clamped by the chip positioning and clamping mechanism 7, and then the chip clamped at the bottom of the chip positioning and clamping mechanism 7 is conveyed to the positioning and conveying platform 3 by the vertical driving cylinder 6, and the chip in the positioning and conveying platform 3 is plastic sealed in cooperation with the chip plastic sealing mechanism 9; The chip positioning and clamping mechanism 7 includes an outer sleeve 71 fixedly connected to the lower end of the vertical driving cylinder 6, an inner tube 72 is longitudinally and vertically slidably arranged inside the outer sleeve 71, and a compression spring 73 is connected between the inner wall of the inner tube 72 and the top surface of the inner wall of the outer sleeve 71; An octagonal plate 74 is fixedly connected to the bottom surface of the inner tube 72, and four rectangular plates 75 are fixedly connected to the bottom of the octagonal plate 74 in an equidistant manner in a ring shape. The rectangular plate 75 is hinged to one side facing the bottom of the inner tube 72 with two parallel first spring telescopic plates 76, and one end of the two first spring telescopic plates 76 away from the rectangular plate 75 is hinged to an extrusion plate 77, and the extrusion plate 77 is parallel to the rectangular plate 75. The upper limit sliding support plate 79 is slidably provided on the top surface of the four extrusion plates 77, and the support sliding plate 79 is slidably provided on the four rectangular plates 75, the support sliding plate 79 is directly below the octagonal plate 74, and a locking member 78 is provided between the support sliding plate 79 and the octagonal plate 74, and a dust collector 710 is provided on the middle part of the bottom surface of the support sliding plate 79. The dust collector 710 is used to vacuum the chip located on the lower side of the octagonal plate 74, so as to further ensure the cleanliness of the chip surface.

[0020] In this embodiment, Figure 2 , Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, the locking member 78 includes a limiting slide rail 781 fixed on the top surface of the supporting sliding plate 79, a rectangular slider 782 is slidably connected inside the limiting slide rail 781, a guide groove 783 is provided inside the rectangular slider 782, an L-shaped slide bar 784 is slidably connected inside the guide groove 783, and the lower end of the L-shaped slide bar 784 is hinged on the top surface of the supporting sliding plate 79; A compression spring 785 is fixedly connected to the bottom of the rectangular sliding block 782 , and the lower end of the compression spring 785 is fixedly connected to the top surface of the supporting sliding plate 79 .

[0021] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8As shown, the guide groove 783 is composed of two V-shaped grooves 7831 and two vertical grooves 7832, and the two V-shaped grooves 7831 are connected through the two vertical grooves 7832. When the rectangular plate 75 slides downward at the end of the supporting sliding plate 79, the upper end of the L-shaped slide bar 784 is driven to move upward from the angle of the lower V-shaped groove 7831, and slide along the right vertical groove 7832 to the upper right side of the upper V-shaped groove 7831. When the rectangular plate 75 moves upward relative to the supporting sliding plate 79, the upper end of the L-shaped slide bar 784 slides from the right side of the upper V-shaped groove 7831 to the angle of the upper V-shaped groove 7831 through the compression spring 785, the distance between the rectangular plate 75 and the supporting sliding plate 79 is locked, and then the state of the four extrusion plates 77 is locked.

[0022] In this embodiment, Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, the chip angle switching mechanism 8 includes four limiting guide grooves 81 formed on the outer wall of the inner tube 72, and the limiting guide grooves 81 are composed of vertical grooves and oblique arc grooves. The four limiting guide grooves 81 are interconnected, wherein two of the limiting guide grooves 81 are slidably connected with hinge plates 82 in the vertical grooves, the upper ends of the hinge plates 82 are hinged to the bottom end of the outer sleeve 71, and the lower ends of the hinge plates 82 are fixedly connected with a spring telescopic rod 83, and one end of the spring telescopic rod 83 abuts against the vertical grooves of the limiting guide grooves 81; The chip angle exchange mechanism 8 also includes four telescopic plates 84 fixed on the top of the four extrusion plates 77. The four telescopic plates 84 are respectively slidably set in four limit grooves 85 opened on the supporting sliding plate 79. The top of the telescopic plate 84 passes through the limit groove 85 and is fixedly connected with a second spring telescopic plate 86. The bottom of the second spring telescopic plate 86 is slidably set on the top surface of the octagonal plate 74, and the top of the second spring telescopic plate 86 is an inclined surface.

[0023] In this embodiment, Figure 1 , Fig. 9 , Fig.10 , Fig.11 As shown, the chip plastic sealing mechanism 9 includes a guide rail 91 fixed on the top of the right side of the plastic sealing platform 2, a rectangular slide 92 is slidably connected in the guide rail 91, a wave guide groove 93 is provided on the rectangular slide 92, two sliders 94 are slidably connected in the wave guide groove 93, and a push plate 95 is rotatably connected to the top of the two sliders 94, and the push plate 95 slides on the top surface of the rectangular slide 92; The middle part of the top surface of the push plate 95 is rotatably connected with a first return spring telescopic rod 96, and the right end of the first return spring telescopic rod 96 is fixed on the top surface of the right side of the guide rail 91, and slots 97 are provided on both sides of the front and rear of the inner rod of the first return spring telescopic rod 96, and a socket 98 is provided on the outer sleeve of the first return spring telescopic rod 96, and a second return spring telescopic rod 99 is movably inserted in the socket 98, one end of the second return spring telescopic rod 99 passes through the socket 98 and abuts against the inner rod of the first return spring telescopic rod 96, and the other end of the second return spring telescopic rod 99 is fixed on the top surface of the rectangular slide 92, and a right-angled triangular groove 910 is provided on the inner rod of the second return spring telescopic rod 99, and a right-angled triangular block 911 is squeezed in the right-angled triangular groove 910, and the right-angled triangular block 911 is fixed on the right side of the top surface of the rectangular slide 92; Rectangular grooves 912 are provided on both sides of the guide rail 91, and a third return spring telescopic rod 913 is fixedly connected to the right end of the inner wall of the rectangular groove 912. The left ends of the two third return spring telescopic rods 913 are respectively fixed on the front and rear sides of the rectangular slide 92.

[0024] In this embodiment, Figure 1 , Fig. 9 , Fig.10 , Fig.11 As shown, a conveyor 10 is fixedly installed between the inverted U-shaped brackets 4 , and one end of a conveying pipe of the conveyor 10 passes through the left slider 94 and extends to the lower side of the rectangular slide 92 .

[0025] In this embodiment, Figure 1 As shown, the vertical driving cylinder 6 is fixedly connected to the limiting slides 11 on both sides of the front and rear, and the vertical driving cylinder 6 is slidably arranged on the inverted U-shaped bracket 4 through the two limiting slides 11.

[0026] The use method and advantages of the present invention: The use method of the plastic packaging processing device for chip packaging, the working process is as follows: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Fig. 9 , Fig.10 , Fig.11 As shown: S1: When the device is packaging rectangular chips, the chip conveying platform 1 intermittently conveys the chips to be packaged. When the chips move to the lower side of the octagonal plate 74, the vertical driving cylinder 6 is extended to drive the octagonal plate 74 to move downward, so that the bottoms of the four squeezing plates 77 are in contact with the top surface of the chip conveying platform 1, and under the action of the first spring expansion plate 76, the four squeezing plates 77 are simultaneously moved to the middle of the lower side of the supporting sliding plate 79, squeezing the chips to be plastic-encapsulated to the lower side of the octagonal plate 74; In the process that the octagonal plate 74 moves downward and pushes the four extrusion plates 77 to move relatively, the rectangular plate 75 slides downward at the end of the supporting sliding plate 79, thereby causing the upper end of the L-shaped sliding rod 784 to slide to the upper right side of the guide groove 783; When the second spring expansion plate 86 is pressed against the second spring expansion plate 86, the spring expansion plate 83 swings clockwise along the inclined surface of the upper end of the second spring expansion plate 86, and then enters the oblique arc groove of the first limiting guide groove 81 in the clockwise direction; that is, it can be shown that the rectangular chip is placed horizontally and needs to be adjusted to adapt to the opening direction of the plastic sealing groove on the positioning conveying platform 3; on the contrary, if the spring expansion plate 83 at the lower end of the hinge plate 82 does not squeeze the second spring expansion plate 86, that is, the rectangular chip is placed vertically, the spring expansion plate 83 will not contact the upper end of the second spring expansion plate 86, that is, it is prevented from entering the oblique arc groove of the limiting guide groove 81 and driving the chip between the four extrusion plates 77 to rotate; Then, the outer sleeve 71 is moved upward by contracting the vertical driving cylinder 6. At this time, the compression spring 73 is reset, so that one end of the spring telescopic rod 83 slides in the oblique arc groove of the limiting guide groove 81, thereby driving the inner tube 72 and the octagonal plate 74 to rotate clockwise by 90 degrees at the same time, so that the chip between the four extrusion plates 77 rotates by 90 degrees. Then, as the octagonal plate 74 moves upward, one end of the L-shaped sliding rod 784 slides from the end of the upper V-shaped groove 7831 to its included angle, locking the upwardly moved supporting sliding plate 79, and then locking the four extrusion plates 77. S2: The clamped chip is then pulled to move rightward by contracting the transverse driving cylinder 5. When the rectangular plate 75 moves rightward and squeezes the rectangular slide 92, the rectangular slide 92 is pushed to slide rightward in the guide rail 91. When the first return spring telescopic rod 96 is contracted to the shortest value, one end of the second return spring telescopic rod 99 is inserted into the socket 98 to lock the contracted first return spring telescopic rod 96. When the octagonal plate 74 moves to the upper side of the plastic sealing groove on the positioning and conveying platform 3, the vertical driving cylinder 6 extends and moves downward again, thereby driving the rectangular plate 75 to move downward relative to the extrusion plate 77, prompting the octagonal plate 74 to move downward and push the rectangular slide block 782 to move downward. At this time, the upper end of the L-shaped slide bar 784 moves to the upper left side of the guide groove 783, and then the vertical driving cylinder 6 is contracted and pushed under the action of the restoring force of the compression spring 785, so that the rectangular slide block 782 slides upward in the limiting slide rail 781, thereby releasing the restriction of the octagonal plate 74 on the supporting sliding plate 79. As the octagonal plate 74 continues to move upward, the four extrusion plates 77 all move away from the center of the octagonal plate 74, releasing the clamping of the chip by the four extrusion plates 77, prompting the chip to fall into the plastic sealing groove on the positioning and conveying platform 3, and then the horizontal driving cylinder 5 is extended to push the vertical driving cylinder 6 to move left and reset; S3: When the vertical driving cylinder 6 moves to the left and resets, the rectangular slide 92 moves to the left and resets under the action of the reset force of the third reset spring telescopic rod 913. Then, when the right-angled triangle block 911 on the rectangular slide 92 moves to the left and squeezes the right-angled triangle groove 910 on the second reset spring telescopic rod 99, the second reset spring telescopic rod 99 is pulled out of the socket 98. At this time, the push plate 95 moves to the left under the action of the reset force of the first reset spring telescopic rod 96, and pushes one end of the conveying tube of the conveyor 10 to move to the left and slide in the wave guide groove 93 at the same time. When the conveying tube of the conveyor 10 moves to the top of the positioning conveying platform 3, the plastic sealing glue is transported to the positioning groove through the conveying tube on the conveyor 10 to plastic seal the chip in the positioning groove. The device repeatedly positions the chip in this way and plastic seals it.

[0027] The above shows and describes the basic principles, main features and advantages of the present invention. Technical personnel in this industry should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A plastic encapsulation processing device for chip packaging, comprising a chip conveying platform (1), characterized in that: A plastic sealing platform (2) is installed on the right side of the chip conveying platform (1), a positioning conveying platform (3) is longitudinally arranged on the plastic sealing platform (2), two inverted U-shaped brackets (4) are installed on the top surfaces of the plastic sealing platform (2) and the chip conveying platform (1), a horizontal driving cylinder (5) is fixedly installed between the two inverted U-shaped brackets (4), a vertical driving cylinder (6) is fixedly connected to the left end of the horizontal driving cylinder (5), a chip positioning clamping mechanism (7) is fixedly connected to the lower end of the vertical driving cylinder (6), and a chip angle changing mechanism (8) is arranged on the chip positioning clamping mechanism (7); A chip plastic sealing mechanism (9) is installed on the top of the right side of the plastic sealing platform (2), and the chip on the positioning and conveying platform (3) is positioned and clamped by the chip positioning and clamping mechanism (7), and then the chip clamped at the bottom of the chip positioning and clamping mechanism (7) is conveyed to the positioning and conveying platform (3) by the vertical driving cylinder (6), and the chip in the positioning and conveying platform (3) is plastic sealed in cooperation with the chip plastic sealing mechanism (9); The chip positioning and clamping mechanism (7) comprises an outer sleeve (71) fixedly connected to the lower end of the vertical driving cylinder (6), an inner tube (72) being slidably arranged inside the outer sleeve (71), and a compression spring (73) being connected between the inner wall of the inner tube (72) and the top surface of the inner wall of the outer sleeve (71); An octagonal plate (74) is fixedly connected to the bottom surface of the inner tube (72); four rectangular plates (75) are fixedly connected to the bottom of the octagonal plate (74) in an equidistant manner in a ring shape; two parallel first spring telescopic plates (76) are hingedly connected to one side of the rectangular plate (75) facing the bottom of the inner tube (72); an extrusion plate (77) is hingedly connected to one end of the two first spring telescopic plates (76) away from the rectangular plate (75); and the extrusion plate (77) and the rectangular plate (75) are parallel to each other; A support sliding plate (79) is provided on the upper surfaces of the four extrusion plates (77) for sliding movement, and the support sliding plate (79) is slidably arranged on the four rectangular plates (75). The support sliding plate (79) is located directly below the octagonal plate (74), and a locking member (78) is provided between the support sliding plate (79) and the octagonal plate (74). A dust collector (710) is provided on the middle of the bottom surface of the support sliding plate (79).

2. The plastic encapsulation processing device for chip packaging according to claim 1, characterized in that: The locking member (78) comprises a limiting slide rail (781) fixed on the top surface of the supporting sliding plate (79), a rectangular sliding block (782) is slidably connected inside the limiting slide rail (781), a guide groove (783) is provided inside the rectangular sliding block (782), an L-shaped sliding rod (784) is slidably connected inside the guide groove (783), and the lower end of the L-shaped sliding rod (784) is hinged on the top surface of the supporting sliding plate (79); A compression spring (785) is fixedly connected to the bottom of the rectangular sliding block (782), and the lower end of the compression spring (785) is fixedly connected to the top surface of the supporting sliding plate (79).

3. A plastic encapsulation processing device for chip packaging according to claim 2, characterized in that: The guide groove (783) is composed of two V-shaped grooves (7831) and two vertical grooves (7832), and the two V-shaped grooves (7831) are connected through the two vertical grooves (7832).

4. The plastic encapsulation processing device for chip packaging according to claim 3, characterized in that: The chip angle exchange mechanism (8) comprises four limiting guide grooves (81) formed on the outer wall of the inner tube (72), and the limiting guide grooves (81) are composed of vertical grooves and oblique arc grooves, and the four limiting guide grooves (81) are interconnected, wherein two of the limiting guide grooves (81) are slidably connected with hinged plates (82) in the vertical grooves, the upper ends of the hinged plates (82) are hinged to the bottom end of the outer sleeve (71), and the lower ends of the hinged plates (82) are fixedly connected with a spring telescopic rod (83), and one end of the spring telescopic rod (83) abuts against the vertical groove of the limiting guide groove (81); The chip angle exchange mechanism (8) further comprises four telescopic plates (84) fixed on the top of the four extrusion plates (77), the four telescopic plates (84) being respectively slidably arranged in four limiting grooves (85) provided on the supporting sliding plate (79), the top of the telescopic plate (84) passing through the limiting groove (85) and being fixedly connected with a second spring telescopic plate (86), the bottom of the second spring telescopic plate (86) being slidably arranged on the top surface of the octagonal plate (74), and the top of the second spring telescopic plate (86) being an inclined surface.

5. The plastic encapsulation processing device for chip packaging according to claim 1, characterized in that: The chip plastic sealing mechanism (9) comprises a guide rail (91) fixed on the top of the right side of the plastic sealing platform (2), a rectangular slide plate (92) is slidably connected in the guide rail (91), a wave guide groove (93) is provided on the rectangular slide plate (92), two sliders (94) are slidably connected in the wave guide groove (93), and a push plate (95) is rotatably connected to the top of the two sliders (94), and the push plate (95) slides on the top surface of the rectangular slide plate (92); A first return spring telescopic rod (96) is rotatably connected to the middle of the top surface of the push plate (95), and the right end of the first return spring telescopic rod (96) is fixed to the top surface of the right side of the guide rail (91). A clamping groove (97) is provided on both sides of the front and rear of the inner rod of the first return spring telescopic rod (96). A socket (98) is provided on the outer sleeve of the first return spring telescopic rod (96). A second return spring telescopic rod (99) is movably inserted into the socket (98). One end of the second return spring telescopic rod (99) passes through the socket (98) and abuts against the inner rod of the first return spring telescopic rod (96), and the other end of the second return spring telescopic rod (99) is fixed to the top surface of the rectangular slide plate (92). A right-angled triangular groove (910) is provided on the inner rod of the second return spring telescopic rod (99), a right-angled triangular block (911) is squeezed in the right-angled triangular groove (910), and the right-angled triangular block (911) is fixed to the right side of the top surface of the rectangular slide plate (92); Rectangular grooves (912) are provided on both sides of the front and rear of the guide slide rail (91); a third return spring telescopic rod (913) is fixedly connected to the right end of the inner wall of the rectangular groove (912); and the left ends of the two third return spring telescopic rods (913) are respectively fixed on both sides of the front and rear of the rectangular slide plate (92).

6. The plastic encapsulation processing device for chip packaging according to claim 5, characterized in that: A conveyor (10) is fixedly installed between the inverted U-shaped brackets (4), and one end of a conveying pipe of the conveyor (10) passes through the left sliding block (94) and extends to the lower side of the rectangular sliding block (92).

7. The plastic encapsulation processing device for chip packaging according to claim 1, characterized in that: The vertical drive cylinder (6) is fixedly connected to limit slides (11) on both sides of the front and rear, and the vertical drive cylinder (6) is slidably arranged on the inverted U-shaped bracket (4) via two limit slides (11).

8. A method for using a plastic encapsulation processing device for chip encapsulation, using the plastic encapsulation processing device for chip encapsulation as claimed in any one of claims 1 to 7, characterized in that: The steps include: S1: After the chip conveying platform (1) conveys the chip to the lower side of the octagonal plate (74), the vertical driving cylinder (6) drives four extrusion plates (77) to squeeze the chip to be plastic-sealed to the lower side of the octagonal plate (74), and during the relative movement of the four extrusion plates (77), the upper end of the L-shaped slide bar (784) slides to the upper right side of the guide groove (783); Then, as the vertical driving cylinder (6) continues to extend, the hinge plate (82) at the lower end of the outer sleeve (71) is driven to slide in the vertical groove of the limiting guide groove (81). When the spring telescopic rod (83) at the lower end of the hinge plate (82) is pressed against the second spring telescopic plate (86), the spring telescopic rod (83) swings clockwise along the inclined surface at the upper end of the second spring telescopic plate (86), and then enters the oblique arc groove of the first limiting guide groove (81) in the clockwise direction. Then, the outer sleeve (71) is driven upward by contracting the vertical driving cylinder (6), driving the inner tube (72) and the octagonal plate (74) to rotate clockwise 90 degrees at the same time, so that the chip between the four extrusion plates (77) rotates 90 degrees, and then as the octagonal plate (74) continues to move upward, one end of the L-shaped slide bar (784) slides from the end of the upper V-shaped groove (7831) to its included angle, locking the upwardly moved support slide plate (79), and then locking the four extrusion plates (77); S2: The clamped chip is then pulled to move to the right by contracting the lateral driving cylinder (5), and the rectangular slide plate (92) is pushed to slide to the right in the guide rail (91). When the first return spring telescopic rod (96) is contracted to the shortest value, one end of the second return spring telescopic rod (99) is inserted into the socket (98) to lock the contracted first return spring telescopic rod (96); When the octagonal plate (74) moves to the upper side of the positioning and conveying platform (3), the vertical driving cylinder (6) extends and moves downward again, releasing the restriction of the octagonal plate (74) on the supporting sliding plate (79). As the octagonal plate (74) continues to move upward, the four squeezing plates (77) move away from the center of the octagonal plate (74), releasing the clamping of the chip by the four squeezing plates (77), and causing the chip to fall into the plastic sealing groove on the positioning and conveying platform (3); S3: Then, the horizontal driving cylinder (5) is extended to push the vertical driving cylinder (6) to move leftward and reset. At this time, the rectangular slide plate (92) moves leftward under the action of the third reset spring telescopic rod (913), and drives the right-angled triangle block (911) to move leftward to squeeze the right-angled triangle groove (910), thereby pulling the second reset spring telescopic rod (99) out of the socket (98). At this time, the push plate (95) moves leftward under the action of the reset force of the first reset spring telescopic rod (96), and pushes one end of the conveying tube of the conveyor (10) to move leftward and slide in the wave guide groove (93) at the same time. When the conveying tube of the conveyor (10) moves to the top of the positioning conveying platform (3), the plastic sealing glue is transported into the positioning groove through the conveying tube on the conveyor (10) to plastic seal the chip in the positioning groove.

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