Multifunctional wafer extraction device for dry etching machine
By designing a multifunctional extraction device in a dry etching machine, and adjusting the extraction environment using nitrogen cylinders and electric heaters, the problems of wafer surface oxidation and inappropriate environment are solved, and the wafer yield and convenience of use are improved.
Patent Information
- Application Number
- CN202510073811.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-05-06
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing dry etching machine uses wafer extraction method to cause the wafer surface oxidation during the extraction process, and the temperature and humidity of the extraction space cannot be adjusted, which affects the subsequent dry etching effect and leads to a low wafer yield.
A multi-functional wafer extraction device for dry etching machines is designed. An environmental adjustment mechanism is used to supply air through a nitrogen cylinder to discharge air in the protective cover to avoid oxidation, and the temperature and humidity in the protective cover are detected through a temperature and humidity sensor, and an electric heater is used to adjust the ambient temperature and humidity to make it more suitable.
It effectively avoids the oxidation of the wafer surface, and adjusts the temperature and humidity, improves the environmental suitability of the extraction process, improves the wafer yield and convenience of use.
Smart Images
Figure CN119943743A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of wafer technology, and in particular to a multifunctional wafer extraction device for a dry etching machine. Background Art
[0002] Wafer extraction refers to the process of safely and accurately moving a wafer from one location, such as a wafer box, a wafer stage of a processing equipment, etc., to another location, such as inside different processing equipment, or in the wafer forming area of a testing equipment, during the semiconductor manufacturing process. It is a key link connecting various semiconductor manufacturing processes to ensure that wafers can flow smoothly according to the process flow. In semiconductor manufacturing, wafers need to be transferred between different processing equipment, such as lithography, etching, and coating equipment. Accurate and safe wafer extraction is an important factor in ensuring the smooth progress of the entire production process and improving product quality and production efficiency. If the wafer is damaged during the extraction process, such as scratches, cracks, or contamination, it may cause chip performance to decline, yield to decrease, or even the entire wafer to be scrapped, resulting in huge economic losses. Therefore, a dry etching machine wafer extraction device is required to extract the wafer.
[0003] The existing method for extracting wafers from dry etchers is to place the wafer on a carrier and then slide the carrier along a slide rail to extract the wafer. In this extraction method, the wafer is exposed to the outside air during the extraction process, which will cause oxidation on the wafer surface. At the same time, the temperature and humidity of the space where the wafer is located cannot be adjusted during the extraction process, which can easily affect the subsequent dry etching effect, resulting in a low wafer yield and certain inconveniences in use. Summary of the invention
[0004] The present invention provides a multifunctional wafer extraction device for a dry etching machine to solve the problems raised in the above background technology.
[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:
[0006] A multifunctional wafer extraction device for a dry etching machine comprises an extraction mechanism, a taking mechanism is arranged on the top of the extraction mechanism, a dust removal mechanism is arranged in the middle of the top of the extraction mechanism, an environment adjustment mechanism is fixedly connected to the top of the extraction mechanism, a humidity adjustment mechanism is arranged inside the environment adjustment mechanism, the environment adjustment mechanism comprises a nitrogen bottle, the nitrogen bottle is installed on the top of a protective cover, a light-transmitting observation window is arranged on the surface of the protective cover, a control panel is fixedly connected to the surface of the protective cover, a temperature and humidity sensor is arranged inside the protective cover, an air outlet of the nitrogen bottle is connected to a processing chamber through a connecting pipe, a solenoid valve is arranged inside the connecting pipe, a first electric heater is fixedly connected to the inner wall of the processing chamber, and the interior of the processing chamber is connected to the top of the inner cavity of the protective cover through a pipeline.
[0007] A further improvement of the technical solution of the present invention is that the extraction mechanism includes a support table, a first motor is fixedly connected to the surface of the support table, a first screw is fixedly connected to one end of the first motor shaft, a mounting plate is threadedly connected to the surface of the first screw, and the top of the support table is fixedly connected to the bottom of the protective cover.
[0008] A further improvement of the technical solution of the present invention is that: the interior of the mounting plate is slidably connected to a first slide rail, the bottom of the first slide rail is fixedly connected to the top of the support platform, and the top of the mounting plate is fixedly connected to a second slide rail.
[0009] A further improvement of the technical solution of the present invention is that: a sliding rod is slidably connected to the surface of the second slide rail, a clamping member is fixedly connected to one side of the sliding rod, a second screw is connected to the internal thread of the sliding rod, a second motor is provided at one end of the second screw, and the surface of the second motor is fixedly connected to the surface of the mounting plate.
[0010] A further improvement of the technical solution of the present invention is that the taking mechanism includes a mounting plate, the bottom of the mounting plate is fixedly connected to the top of the support platform, a mechanical arm is arranged on the top of the mounting plate, and one end of the mechanical arm is fixedly connected to a spring.
[0011] A further improvement of the technical solution of the present invention is that the lower end of the spring is fixedly connected to a suction plate with a suction cup at the bottom, the surface of the robotic arm is fixedly connected to a vacuum pump, and the air suction port of the vacuum pump is connected to the inner cavity of the suction cup at the bottom of the suction plate through a pipe.
[0012] A further improvement of the technical solution of the present invention is that the dust removal mechanism includes a support member, the bottom of the support member is fixedly connected to the top of the support platform, the top of the support member is fixedly connected to a blower, the air outlet of the blower is connected to an air outlet through a pipe, and the top of the air outlet is fixedly connected to the bottom of one end of the support member.
[0013] A further improvement of the technical solution of the present invention is that the humidity regulating mechanism includes a regulating chamber for containing pure water, the bottom of the regulating chamber is fixedly connected to the bottom of the inner cavity of the processing chamber, a second electric heater is arranged inside the regulating chamber, a third motor is fixedly connected to the surface of the regulating chamber, a third screw is fixedly connected to one end of the rotating shaft of the third motor, and a baffle is threadedly connected to the surface of the third screw.
[0014] Due to the adoption of the above technical solution, the present invention has the following technical advances compared with the prior art:
[0015] The invention provides a multifunctional wafer extraction device for a dry etching machine. Through the setting of an environmental adjustment mechanism, during the process of wafer extraction, nitrogen can be supplied through a nitrogen bottle to continuously introduce nitrogen into a protective cover, thereby discharging the air in the protective cover, thereby avoiding contact with oxygen in the air during wafer extraction to cause oxidation of the wafer surface. At the same time, during the process of introducing nitrogen, the temperature and humidity in the protective cover are detected by a temperature and humidity sensor. When the temperature is low, a first electric heater can be started to heat the introduced nitrogen, thereby increasing the environmental temperature in the protective cover. When the humidity is low, a second electric heater can be started to heat pure water in an adjustment chamber, and the generated water vapor enters the nitrogen, thereby humidifying the environment in the protective cover, making the temperature and humidity more suitable and more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the main structure of the present invention;
[0017] Figure 2 It is a side structural schematic diagram of the present invention;
[0018] Figure 3 It is a schematic diagram of the structure of the extraction mechanism of the present invention;
[0019] Figure 4 It is a schematic diagram of the dust removal mechanism structure of the present invention;
[0020] Figure 5 It is a schematic diagram of the structure of the environment adjustment mechanism of the present invention;
[0021] Figure 6 It is a schematic diagram of the internal structure of the environment adjustment mechanism of the present invention;
[0022] Figure 7 It is a schematic diagram of the internal structure of the humidity regulating mechanism of the present invention;
[0023] Figure 8 For the present invention Figure 3 A is an enlarged schematic diagram of the structure.
[0024] In the figure: 11, support table; 12, first motor; 13, first screw; 14, mounting plate; 15, first slide rail; 16, second slide rail; 17, slide rod; 18, clamping member; 19, second screw; 110, second motor; 21, mounting plate; 22, robotic arm; 23, spring; 24, suction plate; 25, vacuum pump; 31, support member; 32, blower; 33, air outlet; 41, protective cover; 42, control panel; 43, temperature and humidity sensor; 44, nitrogen bottle; 45, connecting pipe; 46, processing chamber; 47, first electric heater; 51, adjustment chamber; 52, second electric heater; 53, third motor; 54, third screw; 55, shielding plate. DETAILED DESCRIPTION
[0025] The present invention is further described in detail below in conjunction with embodiments:
[0026] Example 1
[0027] like Figure 1-8 As shown, the present invention provides a multifunctional wafer extraction device for a dry etcher, comprising an extraction mechanism, a taking mechanism is arranged on the top of the extraction mechanism, a dust removal mechanism is arranged in the middle of the top of the extraction mechanism, an environment adjustment mechanism is fixedly connected to the top of the extraction mechanism, a humidity adjustment mechanism is arranged inside the environment adjustment mechanism, the environment adjustment mechanism comprises a nitrogen bottle 44, the nitrogen bottle 44 is installed on the top of a protective cover 41, a light-transmitting observation window is arranged on the surface of the protective cover 41, a control panel 42 is fixedly connected to the surface of the protective cover 41, a temperature and humidity sensor 43 is arranged inside the protective cover 41, an air outlet of the nitrogen bottle 44 is connected with a processing chamber 46 through a connecting pipe 45, an electromagnetic valve is arranged inside the connecting pipe 45, a first electric heater 47 is fixedly connected to the inner wall of the processing chamber 46, and the inside of the processing chamber 46 is connected with the top of the inner cavity of the protective cover 41 through a pipeline.
[0028] In this embodiment, during the extraction process, nitrogen is continuously introduced into the processing chamber 46 through the nitrogen bottle 44, and the nitrogen enters the protective cover 41 along the pipeline, so that the air in the protective cover 41 can be discharged to avoid oxidation of the wafer surface. At the same time, the ambient temperature and humidity in the protective cover 41 are detected by the temperature and humidity sensor 43. When the temperature is low, the first electric heater 47 is started to heat the introduced nitrogen, thereby increasing the ambient temperature in the protective cover 41.
[0029] Example 2
[0030] like Figure 1-8As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the extraction mechanism includes a support table 11, a first motor 12 is fixedly connected to the surface of the support table 11, a first screw 13 is fixedly connected to one end of the rotating shaft of the first motor 12, a mounting plate 14 is threadedly connected to the surface of the first screw 13, the top of the support table 11 is fixedly connected to the bottom of the protective cover 41, a first slide rail 15 is slidably connected inside the mounting plate 14, the bottom of the first slide rail 15 is fixedly connected to the top of the support table 11, a second slide rail 16 is fixedly connected to the top of the mounting plate 14, a slide rod 17 is slidably connected to the surface of the second slide rail 16, a clamping member 18 is fixedly connected to one side of the slide rod 17, a second screw 19 is threadedly connected to the inside of the slide rod 17, and a second motor 110 is arranged at one end of the second screw 19, The surface of the second motor 110 is fixedly connected to the surface of the mounting plate 14, the picking mechanism includes a mounting plate 21, the bottom of the mounting plate 21 is fixedly connected to the top of the support platform 11, a mechanical arm 22 is arranged on the top of the mounting plate 21, one end of the mechanical arm 22 is fixedly connected to a spring 23, the lower end of the spring 23 is fixedly connected to a suction plate 24 with a suction cup arranged at the bottom, a vacuum pump 25 is fixedly connected to the surface of the mechanical arm 22, the air suction port of the vacuum pump 25 is connected to the inner cavity of the suction cup at the bottom of the suction plate 24 through a pipeline, the dust removal mechanism includes a support member 31, the bottom of the support member 31 is fixedly connected to the top of the support platform 11, the top of the support member 31 is fixedly connected to a blower 32, the air outlet of the blower 32 is connected to a blowing port 33 through a pipeline, and the top of the blowing port 33 is fixedly connected to the bottom of one end of the support member 31.
[0031] In this embodiment, during use, the device is installed between two devices that need to extract wafers, and the position of the suction plate 24 is adjusted by the mechanical arm 22, so that the mechanical arm 22 drives the suction plate 24 to extend into the device, so that the suction plate 24 contacts the top of the wafer, and under the action of the vacuum pump 25, the air in the suction cup at the bottom of the suction plate 24 is extracted to suck the wafer, and then the wafer is placed on the surface of the mounting plate 14 under the action of the mechanical arm, and under the action of the second motor 110, the second screw 19 rotates to make the slide bar 17 slide along the second slide rail 16 , so that the clamping member 18 contacts the side of the wafer to clamp and fix the wafer. After the fixation is completed, under the action of the first motor 12, the first screw 13 rotates to drive the mounting plate 14 to slide along the first slide rail 15 to transfer the wafer. When it moves to the bottom of the air blowing port 33, the gas in the protective cover 41 is extracted by the blower 32, and the gas is passed into the air blowing port 33 along the pipeline and blown downward to blow and clean the surface of the wafer. After moving to the other end of the device, the wafer is picked up by another group of taking mechanisms and placed in another device to complete the extraction of the wafer.
[0032] Example 3
[0033] like Figure 1-8As shown, on the basis of Example 1, the present invention provides a technical solution: preferably, the humidity adjustment mechanism includes an adjustment chamber 51 for containing pure water, the bottom of the adjustment chamber 51 is fixedly connected to the bottom of the inner cavity of the processing chamber 46, a second electric heater 52 is arranged inside the adjustment chamber 51, a third motor 53 is fixedly connected to the surface of the adjustment chamber 51, a third screw 54 is fixedly connected to one end of the rotating shaft of the third motor 53, and a baffle 55 is threadedly connected to the surface of the third screw 54.
[0034] In this embodiment, when the humidity in the protective cover 41 is low, the third motor 53 is started, so that the third screw 54 drives the baffle plate 55 to move, and the size of the opening at the top of the water storage chamber is adjusted, thereby changing the evaporation rate of pure water and adjusting the nitrogen humidity. When the humidity is too low, the second electric heater 52 is started to heat the pure water in the adjustment chamber 51, so that it quickly generates water vapor and enters the nitrogen, thereby quickly humidifying the environment in the protective cover 41, making the environment in the protective cover 41 more suitable and easier to use.
[0035] The following is a detailed description of the working principle of the multifunctional wafer extraction device for the dry etcher.
[0036] like Figure 1-8As shown, during use, the device is installed between two devices that need to extract wafers, and the position of the suction plate 24 is adjusted by the mechanical arm 22, so that the mechanical arm 22 drives the suction plate 24 to extend into the device, so that the suction plate 24 contacts the top of the wafer, and under the action of the vacuum pump 25, the air in the suction cup at the bottom of the suction plate 24 is extracted to suck the wafer, and then under the action of the mechanical arm, the wafer is placed on the surface of the mounting plate 14, and under the action of the second motor 110, the second screw 19 rotates to make the slide bar 17 slide along the second slide rail 16, so that the clamping member 18 contacts the side of the wafer to clamp and fix the wafer, and after the fixation is completed, under the action of the first motor 12, the first screw 13 rotates to drive the mounting plate 14 to slide along the first slide rail 15 to transfer the wafer, and when it moves to the bottom of the blowing port 33, the gas in the protective cover 41 is extracted by the blower 32, and the gas is passed into the blowing port 33 along the pipeline and blown downward to blow and clean the surface of the wafer, and then moved to the other end of the device , after the wafer is picked up by another group of taking mechanisms, it is placed in another device to complete the extraction of the wafer. During the extraction process, nitrogen is continuously introduced into the processing chamber 46 through the nitrogen bottle 44, and the nitrogen enters the protective cover 41 along the pipeline, so that the air in the protective cover 41 can be discharged to avoid oxidation of the wafer surface. At the same time, the temperature and humidity of the environment in the protective cover 41 are detected by the temperature and humidity sensor 43. When the temperature is low, the first electric heater 47 is started to heat the nitrogen introduced, thereby increasing the environmental temperature in the protective cover 41. When the humidity in the protective cover 41 is low, the third motor 53 is started to make the third screw 54 drive the baffle plate 55 to move, adjust the size of the opening at the top of the water storage chamber, and then change the evaporation rate of pure water and adjust the nitrogen humidity. When the humidity is too low, the second electric heater 52 is started to heat the pure water in the adjustment chamber 51, so that it quickly generates water vapor and enters the nitrogen, thereby quickly humidifying the environment in the protective cover 41, making the environment in the protective cover 41 more suitable and easier to use.
[0037] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.
Claims
1. A multifunctional wafer extraction device for a dry etching machine, comprising an extraction mechanism, characterized in that: A taking mechanism is arranged on the top of the extraction mechanism, a dust removal mechanism is arranged in the middle of the top of the extraction mechanism, an environment adjustment mechanism is fixedly connected to the top of the extraction mechanism, a humidity adjustment mechanism is arranged inside the environment adjustment mechanism, the environment adjustment mechanism comprises a nitrogen bottle (44), the nitrogen bottle (44) is installed on the top of the protective cover (41), a light-transmitting observation window is arranged on the surface of the protective cover (41), a control panel (42) is fixedly connected to the surface of the protective cover (41), a temperature and humidity sensor (43) is arranged inside the protective cover (41), an air outlet of the nitrogen bottle (44) is connected to the processing chamber (46) through a connecting pipe (45), a solenoid valve is arranged inside the connecting pipe (45), a first electric heater (47) is fixedly connected to the inner wall of the processing chamber (46), and the interior of the processing chamber (46) is connected to the top of the inner cavity of the protective cover (41) through a pipeline.
2. The multifunctional wafer extraction device for a dry etching machine according to claim 1, characterized in that: The extraction mechanism comprises a support platform (11), a first motor (12) is fixedly connected to the surface of the support platform (11), a first screw (13) is fixedly connected to one end of the rotating shaft of the first motor (12), a mounting plate (14) is threadedly connected to the surface of the first screw (13), and the top of the support platform (11) is fixedly connected to the bottom of the protective cover (41).
3. The multifunctional wafer extraction device for a dry etching machine according to claim 2, characterized in that: The interior of the mounting plate (14) is slidably connected to a first slide rail (15), the bottom of the first slide rail (15) is fixedly connected to the top of the support platform (11), and the top of the mounting plate (14) is fixedly connected to a second slide rail (16).
4. The multifunctional wafer extraction device for a dry etching machine according to claim 3, characterized in that: The surface of the second slide rail (16) is slidably connected to a slide rod (17), one side of the slide rod (17) is fixedly connected to a clamping member (18), the internal thread of the slide rod (17) is connected to a second screw rod (19), one end of the second screw rod (19) is provided with a second motor (110), and the surface of the second motor (110) is fixedly connected to the surface of the mounting plate (14).
5. The multifunctional wafer extraction device for a dry etching machine according to claim 1, characterized in that: The taking mechanism comprises a mounting plate (21), the bottom of the mounting plate (21) is fixedly connected to the top of the support platform (11), a mechanical arm (22) is arranged on the top of the mounting plate (21), and one end of the mechanical arm (22) is fixedly connected to a spring (23).
6. The multifunctional wafer extraction device for a dry etching machine according to claim 5, characterized in that: The lower end of the spring (23) is fixedly connected to a suction plate (24) with a suction cup at the bottom, and the surface of the mechanical arm (22) is fixedly connected to a vacuum pump (25), and the air suction port of the vacuum pump (25) is connected to the inner cavity of the suction cup at the bottom of the suction plate (24) through a pipeline.
7. The multifunctional wafer extraction device for a dry etching machine according to claim 1, characterized in that: The dust removal mechanism comprises a support member (31), the bottom of the support member (31) is fixedly connected to the top of the support platform (11), the top of the support member (31) is fixedly connected to a blower (32), the air outlet of the blower (32) is connected to an air outlet (33) via a pipeline, and the top of the air outlet (33) is fixedly connected to the bottom of one end of the support member (31).
8. The multifunctional wafer extraction device for a dry etching machine according to claim 1, characterized in that: The humidity regulating mechanism comprises a regulating chamber (51) containing pure water therein, the bottom of the regulating chamber (51) being fixedly connected to the bottom of an inner cavity of a processing chamber (46), a second electric heater (52) being arranged inside the regulating chamber (51), a third motor (53) being fixedly connected to the surface of the regulating chamber (51), a third screw (54) being fixedly connected to one end of a rotating shaft of the third motor (53), and a shielding plate (55) being threadedly connected to the surface of the third screw (54).