High-frequency integrated device board-level elastic interconnection structure and processing method

Abstract

The invention relates to the technical field of board-level interconnection of integrated devices, in particular to a high-frequency integrated device board-level elastic interconnection structure and a processing method, the interconnection structure comprises a base and a cover plate, and a packaging array structure is arranged between the base and the cover plate; the packaging array structure comprises a substrate, an elastic pin array and a circuit board which are connected in sequence, the elastic pin array comprises a plurality of micro-spring pins, each micro-spring pin comprises two end rings connected with the substrate and the circuit board respectively, and a longitudinal elastic supporting structure is integrally formed between the two end rings. According to the micro-spring pin structure, the longitudinal elastic supporting structure and the end ring are integrally formed, so that the machining procedures are reduced, the overall reliability of the micro-spring pin is improved, mechanical vibration can be better dealt with, meanwhile, transmission of high-frequency signals is more stable, and loss in the high-frequency signal transmission process can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of board-level interconnection of integrated devices, and in particular to a board-level elastic interconnection structure of a high-frequency integrated device and a processing method thereof. Background Art

[0002] Electronic equipment in the fields of aviation and aerospace is developing towards miniaturization, diversification, and integration, and is required to be able to serve for a long time in harsh environments such as extreme high / low temperatures, long-term vibration, and high impact. Ceramic column grid array (CCGA) is gradually being widely used in electronic equipment in the fields of aviation and aerospace due to its high packaging density, excellent resistance to thermal fatigue, and heat dissipation performance.

[0003] At present, the pin forms of CCGA package include three types: cast solder column, copper tape wrapped solder column, and micro spring solder column. The cast solder column material is Sn10Pb90 or Sn20Pb80. Since the internal thermal stress of the solder joint can be released through the bending deformation of the slender solder column, it can effectively solve the thermal fatigue failure caused by the mismatch of the thermal expansion coefficients of the ceramic substrate and the printed circuit board; on the other hand, compared with the ceramic ball grid array (CBGA) package, the CCGA interconnection distance is increased, which can significantly improve the heat dissipation performance of the package. The copper tape wrapped solder column material is generally Sn20Pb80. The copper tape is wound on the solder column with equal pitch, which can not only increase the mechanical properties of the solder column, but also assist the solder column in rapid heat dissipation and cooling, thereby improving the reliability of electrical interconnection. However, the cast solder column and the copper tape wrapped solder column still have the problem of poor Z-axis mechanical vibration resistance. Under the action of long-term vibration and high impact, it is easy to cause pin deformation, which leads to failure and scrapping of electronic equipment. The micro-spring type CCGA uses a spiral micro-spring to replace the solder column, which has a flexible connection feature and can effectively solve the problem of poor mechanical vibration resistance of the solder column type CCGA. In this regard, a number of patents have been applied for: such as a micro-spring pin assembly solder paste coating simulation method (CN202410449475.2), a method and device for controlling the verticality between micro-spring plates (CN202210319645.6), a micro-spring pin rapid assembly tool and method for integrated circuits (CN202211669097.6) and a high-precision CCGA micro-spring array board-level assembly process (CN202410097835.7). However, the coaxiality and coplanarity of the spiral micro-spring pin and the substrate are difficult to guarantee, which can easily cause problems such as micro-spring pin desoldering and high void rate; the more critical problem is that the spiral micro-spring pin exhibits an inductance effect during signal transmission, which in turn affects the high-frequency signal transmission characteristics, thereby limiting its application in high-frequency integrated device packaging.

[0004] From the above, we can see that the three types of CCGA package pins currently have excellent resistance to thermal fatigue and excellent heat dissipation performance, but the cast solder column and copper tape wrapped solder column have poor resistance to mechanical vibration, and the micro-spring solder column is difficult to weld with high quality, which affects the high-frequency signal transmission performance, which leads to the problem of limited application scenarios for these three types of package pins. Therefore, the development of new array packaging structures and process implementation methods with excellent resistance to mechanical vibration, good solder joint mechanical properties, and excellent electrical properties is of great significance to promote high reliability and long service life of electronic equipment in the fields of aviation and aerospace. Therefore, it is necessary to propose a more reasonable technical solution to solve the technical problems existing in the prior art. Summary of the invention

[0005] In order to overcome at least one of the defects mentioned above, the present invention proposes a board-level elastic interconnection structure and processing method for a high-frequency integrated device. By improving the elastic interconnection structure, the vibration resistance can be improved, the processing technology can be simplified, and the overall mechanical and electrical properties can be improved.

[0006] In order to achieve the above-mentioned purpose, the elastic interconnection structure disclosed in the present invention can adopt the following technical solutions:

[0007] A high-frequency integrated device board-level elastic interconnection structure comprises a base and a cover plate, wherein a package array structure is arranged between the base and the cover plate; the package array structure comprises a substrate, an elastic pin array and a circuit board connected in sequence; the elastic pin array comprises a plurality of micro-spring pins, the micro-spring pins comprise two end rings respectively connected to the substrate and the circuit board, and a longitudinal elastic support structure is integrally formed between the two end rings.

[0008] The above-disclosed board-level elastic interconnection structure improves the micro-spring pins, utilizes the longitudinal elastic support structure to provide elastic force, filters the mechanical vibration, and realizes the flexible connection between the substrate and the circuit board. At the same time, the micro-spring pins adopt an integrated molding structure, which avoids the cumbersome welding processing steps, and is also convenient for improving the stability of high-frequency signal transmission and reducing the loss in high-frequency signal transmission.

[0009] Furthermore, the elastic support structure supports the upper and lower end rings, and elastically deforms when the upper and lower end rings are subjected to load pressure, thereby elastically supporting the upper and lower end rings. The elastic support structure can be constructed in a variety of forms, and its structure is not limited to a single one. Here, it is optimized and one of the feasible options is proposed: the elastic support structure includes a plurality of spring leaves or spring columns, which are arranged at intervals along the end rings, and the spring leaves or spring columns are curved. When the above scheme is adopted, the spring leaves or spring columns are pre-set to a curved shape, so that they can be elastically deformed along their original bending direction under the pressure of the load, thereby providing elastic support.

[0010] Furthermore, the leaf spring and the spring column can be bent in multiple directions, and their bending structures are not limited to a single one. Here, the optimization is carried out and the following feasible options are proposed: the leaf spring and the spring column are bent toward the outside of the end ring; or, the leaf spring and the spring column are bent toward the inside of the end ring, and a gap is maintained between the leaf springs or the spring columns. When the above scheme is adopted, the leaf spring and the spring column are bent outward, and the micro-spring pin forms a waist drum-shaped structure. The leaf spring and the spring column are bent inward, and in order to ensure the reliability of the elastic support, any two leaf springs or spring columns that are bent inward maintain a gap, and do not touch each other when the deformation reaches the maximum extent.

[0011] Furthermore, in order to control the overall size of the package array structure and avoid the overall thickness of the integrated device being too large, the size of the microspring pin needs to be limited: when the microspring pin is in a free state, the height of the elastic support structure is 1.5mm to 2.5mm, and when the microspring pin is under load, the lateral width of the microspring pin is 0.5mm to 0.7mm. According to the gap between the elastic substrate and the circuit board, a suitable microspring pin can be selected for connection and matching. Considering the lateral deformation size of the microspring pin, the gap between adjacent microspring pins needs to be considered when making an array, so that the gap is greater than the maximum lateral width of the microspring pin.

[0012] Furthermore, in order to provide better and more stable elastic support, the micro-spring pin structure is improved, and its structure is not limited to the only one. Here, it is optimized and one feasible option is proposed: a receiving cavity is formed in the micro-spring pin, and an elastic filling piece is arranged in the receiving cavity. When the above solution is adopted, the elastic filling piece can be made of elastic rubber or the like.

[0013] Furthermore, the end ring is used to cooperate with the substrate or circuit board, and it can adopt a variety of geometric shapes. Its structure is not limited to a single one. Here, it is optimized and one feasible option is proposed: the end ring is a circular ring with a diameter of 0.5mm to 0.6mm and a cross-sectional diameter of 0.15mm to 0.2mm.

[0014] Furthermore, in order to keep the overall structure of the micro spring pin reliable and meet the elastic deformation requirements, the structure of the spring leaf and the spring column can be set to a variety of forms, and the structure is not limited to a single one. Here, an optimization is made and one of the feasible options is proposed: the thickness of the spring leaf and the spring column is less than the cross-sectional diameter of the end ring. When the above scheme is adopted, it is easy to simplify the processing process and obtain the micro spring pin conveniently and quickly.

[0015] Furthermore, the structure of the reed and the spring column can be optimized and improved, which is not limited to a single one. Here, optimization is performed and one feasible option is proposed: the cross-section of the reed or the spring column includes at least a square surface, a trapezoidal surface or a circular surface.

[0016] Furthermore, when the array packaging structure is set to the base and the cover plate, the matching can be achieved in a variety of ways, and its structure is not limited to a single one. Here, an optimization is made and one of the feasible options is proposed: the base and the cover plate are aligned through a positioning structure, and a cascade cavity for accommodating the array packaging structure is formed between the base and the cover plate, and a limiting pressure block is provided on the cover plate, which is used to apply pressure to the array packaging structure and keep it stable. When the above scheme is adopted, the cascade cavity that can be formed by the base and the cover plate is buckled, and the force stability of the array packaging structure can be improved by the limiting pressure block.

[0017] The above content discloses a board-level elastic interconnection structure. The present invention also provides a processing method for the board-level elastic interconnection structure, which is specifically as follows:

[0018] A method for processing a high-frequency integrated device board-level elastic interconnection structure, used to process the above-mentioned board-level elastic interconnection structure, comprising:

[0019] An integrally formed micro spring pin is obtained by an additive process or a subtractive process;

[0020] Performing laser or plasma treatment on the surface of the micro-spring pin to activate and modify the surface of the micro-spring pin;

[0021] Electroplating a nickel layer with a thickness of 4.5 μm to 5.5 μm on the surface of the microspring pin;

[0022] Continue electroplating a 27μm to 33μ thick tin layer on the nickel layer;

[0023] The end ring at one end of the micro-spring pin is welded to the pad of the substrate, and the end ring at the other end of the micro-spring pin is welded to the pad of the circuit board, so as to complete the connection and conduction between the substrate and the circuit board to form a package array structure;

[0024] The package array structure is arranged between the base and the cover plate, and they are connected and fastened.

[0025] Compared with the prior art, some beneficial effects of the technical solution disclosed in the present invention include:

[0026] The micro-spring pin structure adopted in the present invention reduces the processing steps by integrally forming the longitudinal elastic support structure with the end ring, improves the overall reliability of the micro-spring pin, can better cope with mechanical vibration, and at the same time, is more stable in the transmission of high-frequency signals, which can reduce the loss in the high-frequency signal transmission process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only represent some embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0028] Figure 1 Schematic diagram of the overall structure of the microspring pin.

[0029] Figure 2 Schematic diagram of the microspring array packaging structure.

[0030] Figure 3 Schematic diagram of the assembly of the microspring array structure with the base and cover.

[0031] Figure 4 The electromagnetic transmission characteristics of the shaped microspring pins, spiral microspring pins and traditional CCGA pins are compared.

[0032] In the above drawings, the meanings of the symbols are as follows:

[0033] 1. End ring; 2. Elastic support structure; 3. Base plate; 4. Micro spring pin; 5. Circuit board; 6. Base; 7. Cover plate; 8. Limiting block; 9. Positioning column; 10. Positioning hole; 11. Gradient guide column; 12. Cascade cavity; 13. Package array structure; 14. Groove; 15. Tightening hole; 16. Guide column; 17. Guide hole. DETAILED DESCRIPTION

[0034] The present embodiment is further explained below in conjunction with the accompanying drawings and specific embodiments.

[0035] In view of the fact that the board-level elastic interconnect structure of the integrated device in the prior art has complex processing difficulties, poor mechanical vibration resistance, and affects the stable transmission of high-frequency signals, the following embodiments are optimized and overcome the defects in the prior art.

[0036] Example 1

[0037] like Figure 1 , Figure 2 As shown, this embodiment provides a high-frequency integrated device board-level elastic interconnection structure, including a base 6 and a cover plate 7, a package array structure 13 is arranged between the base 6 and the cover plate 7; the package array structure 13 includes a substrate 3, an elastic pin array and a circuit board 5 connected in sequence; the elastic pin array includes a plurality of micro-spring pins 4, the micro-spring pins 4 include two end rings 1 respectively connected to the substrate 3 and the circuit board 5, and a longitudinal elastic support structure 2 is integrally formed between the two end rings 1.

[0038] Preferably, in this embodiment, the substrate 3 is a ceramic substrate 3 , and the circuit board 5 is a printed circuit board 5 .

[0039] The board-level elastic interconnection structure disclosed in this embodiment improves the micro-spring pin 4, utilizes the longitudinal elastic support structure 2 to provide elastic force, filters the mechanical vibration, and realizes the flexible connection between the substrate 3 and the circuit board 5. At the same time, the micro-spring pin 4 adopts an integrated molding structure, which avoids cumbersome welding processing procedures, and is also convenient for improving the stability of high-frequency signal transmission and reducing the loss in high-frequency signal transmission.

[0040] The elastic support structure 2 supports the upper and lower end rings 1, and undergoes elastic deformation when the upper and lower end rings 1 are subjected to load pressure, thereby elastically supporting the upper and lower end rings 1. The elastic support structure 2 can be constructed in a variety of forms, and its structure is not limited to a single one. This embodiment is optimized and adopts one of the feasible options: the elastic support structure includes a plurality of spring leaves or spring columns, which are arranged at intervals along the end ring 1, and the spring leaves or spring columns are curved. When the above scheme is adopted, the spring leaves or spring columns are pre-set to a curved shape, so that they can be elastically deformed along their original bending direction under the pressure of the load, thereby providing elastic support.

[0041] Preferably, when a leaf spring is used, the leaf spring is an elastic thin sheet with a certain thickness; when a spring column is used, the spring column is an elastic column with a certain deflection.

[0042] In this embodiment, the spring leaf or spring column is integrally formed with the end ring 1 by using a 3D printing additive process, or is integrally formed with the end ring 1 by using a laser subtractive processing process.

[0043] The spring leaf and spring column can be bent in multiple directions, and their bending structure is not limited to a single one. This embodiment is optimized and adopts the following feasible options: the spring leaf and spring column are bent toward the outside of the end ring 1; or, the spring leaf and spring column are bent toward the inside of the end ring 1, and a gap is maintained between the spring leaves or spring columns. When the above scheme is adopted, the spring leaf and spring column are bent outward, and the micro-spring pin 4 forms a waist drum-shaped structure. The spring leaf and spring column are bent inward. In order to ensure the reliability of the elastic support, any two spring leaves or spring columns that are bent inward maintain a gap, and do not touch each other when the deformation reaches the maximum extent.

[0044] In order to control the overall size of the package array structure 13 and avoid the overall thickness of the integrated device being too large, the size of the microspring pin 4 needs to be limited: when the microspring pin 4 is in a free state, the height of the elastic support structure 2 is 1.5mm to 2.5mm, and when the microspring pin 4 is under load, the lateral width of the microspring pin 4 is 0.5mm to 0.7mm. According to the gap between the elastic substrate 3 and the circuit board 5, a suitable microspring pin 4 can be selected for connection and matching. Considering the lateral deformation size of the microspring pin 4, the gap between adjacent microspring pins 4 needs to be considered when making an array, so that the gap is greater than the maximum lateral width of the microspring pin 4.

[0045] Preferably, in this embodiment, the maximum lateral width of the micro-spring pin 4 is 0.5 mm to 0.7 mm.

[0046] In order to provide better and more stable elastic support, the structure of the micro spring pin 4 is improved, and its structure is not limited to the only one. This embodiment optimizes and adopts one of the feasible options: a receiving cavity is formed in the micro spring pin 4, and an elastic filling piece is arranged in the receiving cavity. When adopting the above solution, the elastic filling piece can be made of elastic rubber or the like.

[0047] The end ring 1 is used to cooperate with the substrate 3 or the circuit board 5. It can adopt a variety of geometric shapes, and its structure is not limited to a single one. This embodiment is optimized and adopts one of the feasible options: the end ring 1 is a circular ring with a diameter of 0.5mm to 0.6mm and a cross-sectional diameter of 0.15mm to 0.2mm.

[0048] In order to keep the overall structure of the micro spring pin 4 reliable and meet the elastic deformation requirements, the structure of the spring leaf and the spring column can be set to a variety of forms, and the structure is not limited to a single one. This embodiment optimizes and adopts one of the feasible options: the thickness of the spring leaf and the spring column is smaller than the cross-sectional diameter of the end ring 1. When the above solution is adopted, it is convenient to simplify the processing process and obtain the micro spring pin 4 conveniently and quickly.

[0049] The structure of the reed leaf and the reed column can be optimized and improved, and is not limited to a single one. This embodiment is optimized and adopts one of the feasible options: the cross section of the reed leaf or the reed column includes at least a square surface, a trapezoidal surface or a circular surface.

[0050] like Figure 3As shown, when the array packaging structure is set to the base 6 and the cover plate 7, the matching can be achieved in a variety of ways, and its structure is not limited to a single one. This embodiment is optimized and adopts one of the feasible options: the base 6 and the cover plate 7 are aligned through the positioning structure, and a cascade cavity 12 for accommodating the array packaging structure is formed between the base 6 and the cover plate 7. A limiting pressure block 8 is provided on the cover plate 7. The limiting pressure block 8 is used to apply pressure to the array packaging structure and keep it stable. When the above scheme is adopted, the cascade cavity 12 that can be formed by the base 6 and the cover plate 7 is buckled, and the force stability of the array packaging structure can be improved by the limiting pressure block 8.

[0051] Preferably, the positioning structure comprises a positioning column 9 and a positioning hole 10 . The positioning column 9 is provided on the base 6 , and the positioning hole 10 is provided on the cover plate 7 . The base 6 and the cover plate 7 are matched by aligning the positioning column 9 with the positioning hole 10 .

[0052] Preferably, the cover plate 7 is provided with a groove 14, a plurality of abutting holes 15 are provided in the groove 14, the limiting pressure block 8 is arranged at the groove 14, and a plurality of abutting columns are provided on the limiting pressure block 8, and the abutting columns pass through the abutting holes 15 and abut against the package array structure 13. In this embodiment, the abutting columns are cylinders with gradually changing diameters, and the diameter of the abutting columns gradually decreases from the bottom to the end.

[0053] Preferably, the cover plate 7 is provided with a guide column 16 , and the limiting pressure block 8 is correspondingly provided with a guide hole 17 . When the limiting pressure block 8 is matched with the cover plate 7 , the guide column 16 passes through the guide hole 17 .

[0054] When the board-level elastic interconnection structure disclosed in this embodiment is specifically adopted, it can achieve better effects than the traditional interconnection structure.

[0055] Specific as Figure 4 As shown, the electromagnetic transmission characteristics of the waist drum-shaped micro spring pin 4 of this embodiment, the spiral micro spring pin 4 and the traditional CCGA pin are simulated and compared by HFSS software. The frequency adaptation range of the spiral micro spring pin is up to 2GHz. Beyond this frequency band, the return loss of the signal increases sharply, and the degradation of electrical performance is unacceptable (S11>-20dB). In contrast, the S11 of the waist drum-shaped micro spring pin and the traditional CCGA pin in the frequency range of 0.1~40GHz is less than -20dB, which proves that the waist drum-shaped micro spring pin meets the 40GHz signal transmission function requirements.

[0056] It can be seen that the board-level interconnection structure in this embodiment has the following beneficial effects:

[0057] Excellent high-frequency signal transmission characteristics. The spiral micro-spring pin 4 exhibits an inductive effect during circuit transmission, and the high-frequency loss is large, which seriously restricts its application scenarios. The new waist drum-shaped micro-spring pin 4 proposed in this embodiment is composed of a number of elastic springs arranged in a ring and circular rings at both ends. While having flexible interconnection characteristics, it can effectively avoid the inductive effect exhibited during high-frequency circuit signal transmission. Therefore, this array interconnection form has good high-frequency signal transmission characteristics.

[0058] Excellent anti-thermal fatigue properties. The waist drum-shaped microspring array packaging structure proposed in this embodiment is composed of a number of elastic springs arranged in a ring and two-end circular ring bodies. This structure can release the thermal stress of the solder joints through the bending deformation of the elastic springs, thereby effectively solving the thermal fatigue failure problem caused by the mismatch of the thermal expansion coefficients of the ceramic substrate 3 and the printed circuit board 5.

[0059] Excellent anti-mechanical vibration characteristics. The novel waist drum-shaped micro-spring pin 4 structure proposed in this embodiment has a flexible interconnection feature, and can absorb vibration energy through elastic deformation of the spring under mechanical vibration, significantly improving the ability of the package to resist long-term vibration and high impact.

[0060] Excellent heat dissipation performance. The novel waist drum-shaped micro spring pin 4 structure proposed in this embodiment ensures that the ceramic substrate 3 and the printed circuit board 5 have a large interconnection distance, and the hollow structure feature is more conducive to air circulation, so that the array packaging form has excellent heat dissipation performance.

[0061] Good mechanical properties of solder joints. The spiral micro-spring pin 4 is manufactured by winding, and the coplanarity is difficult to guarantee, which can easily cause problems such as incomplete solder paste wrapping of the micro-spring pin, pin desoldering, and high void rate. The waist drum-shaped micro-spring pin 4 proposed in this embodiment is manufactured using an integrated molding process, and the coplanarity of the end face of the annulus can be effectively guaranteed; at the same time, during the welding process, the solder can climb along the side wall of the annulus, so the solder wraps a larger area around the pin, which can effectively disperse the stress of the solder joint, and thus has better mechanical properties.

[0062] The effective processing technology of the waist drum-shaped micro spring pin 4 is feasible. In this embodiment, the precision metal 3D printing additive or ultrafast laser subtractive method is used for integrated molding. The material needs to be selected with elastic and conductive properties, such as beryllium copper, spring steel, etc., and then the printed pin structure is sequentially laser or plasma activated, electroplated with nickel and electroplated with tin to make it weldable.

[0063] Example 2

[0064] The content of the above embodiment 1 discloses a board-level elastic interconnection structure. This embodiment also provides a processing method of the above board-level elastic interconnection structure, which is as follows:

[0065] A method for processing a high-frequency integrated device board-level elastic interconnection structure, used to process the above-mentioned board-level elastic interconnection structure, comprising:

[0066] An integrally formed micro spring pin 4 is obtained by an additive process or a subtractive process;

[0067] The surface of the micro-spring pin 4 is treated by laser or plasma to activate and modify the surface of the micro-spring pin 4;

[0068] Electroplating a nickel layer with a thickness of 4.5μ to 5.5μ on the surface of the micro spring pin 4;

[0069] Continue electroplating a 27μm to 33μ thick tin layer on the nickel layer;

[0070] The end ring 1 at one end of the micro-spring pin 4 is welded to the pad of the substrate 3, and the end ring 1 at the other end of the micro-spring pin 4 is welded to the pad of the circuit board 5, so as to complete the connection between the substrate 3 and the circuit board 5, and form a package array structure 13;

[0071] The package array structure 13 is disposed between the base 6 and the cover plate 7, and they are connected and fastened.

[0072] Preferably, in this embodiment, the thickness of the nickel layer is 5μ.

[0073] Preferably, in this embodiment, the thickness of the tin layer is 30μ.

[0074] Here is a specific case, taking the precision metal 3D printing additive method to process the waist drum-shaped micro spring pin 4 as an example, the process implementation process of the array packaging structure is as follows:

[0075] Step 1: Construct a three-dimensional model in software such as Solidworks according to the structural features and dimensions of the designed waist drum-shaped micro-spring pin 4, then slice the model using dedicated software and import it into a precision metal 3D printing device to print the waist drum-shaped micro-spring pin 4 structure layer by layer;

[0076] Step 2: Electroplating the prepared waist drum-shaped micro spring pin 4 structure. This process requires laser or plasma treatment to activate and modify the surface of the formed pin, and then electroplating tin (thickness of about 30μ), and nickel electroplating (thickness of about 5μ) is required before tin plating to increase the adhesion between the pin material and the tin layer;

[0077] Step 3: Install the ceramic substrate 3 in the positioning cavity of the base 6, and use a steel mesh designed based on the pad layout and size to print Sn63Pb37 solder paste on the surface pad of the ceramic substrate 3, with a printing thickness of about 0.12 mm;

[0078] Step 4: Install the cover plate 7, and limit the position through the positioning column 9 on the base 6 and the positioning hole 10 on the cover plate 7, then align and place the waist drum-shaped micro spring pin 4 through the through hole on the planting spring cover plate 7, and install the limiting pressure block 8 on the waist drum-shaped micro spring pin 4; the limiting pressure block 8 is designed with a gradual guide column 11, and is installed in conjunction with the annular body on the pin, which can further ensure that the micro spring pin does not fall over during the welding process, thereby improving the welding quality and reliability;

[0079] Step 5: Place the base 6 on which the ceramic substrate 3 is placed, the ceramic substrate 3, the spring cover 7, the limiting pressure block 8, and the waist drum-shaped micro spring pin 4 array into a reflow furnace at a welding temperature of 200-210°C. After cooling and solidification, remove the spring cover 7 and the limiting pressure block 8 to achieve interconnection between the waist drum-shaped micro spring pin 4 array and the surface pad of the ceramic substrate 3;

[0080] Step 6: Install the printed circuit board 5 into the positioning cavity of the base 6, use the steel mesh to print Sn63Pb37 solder paste on the surface pad of the circuit board 5, the printing thickness is about 0.12mm, and then align the waist drum-shaped micro spring pin 4 on the ceramic substrate 3 with the surface pad of the printed circuit board 5;

[0081] Step 7: Place the base 6 of the printed circuit board 5 and the ceramic circuit board 5 with the waist drum-shaped micro-spring pin array 4 into a reflow oven with a welding temperature of 200-210°C; after cooling and curing, the ceramic substrate 3 and the printed circuit board 5 can be vertically interconnected using the waist drum-shaped micro-spring pin array 4.

[0082] The above are the implementation methods listed in this embodiment, but this embodiment is not limited to the above optional implementation methods. Those skilled in the art can arbitrarily combine the above methods to obtain other various implementation methods. Anyone can derive other various implementation methods under the inspiration of this embodiment. The above specific implementation methods should not be understood as limiting the protection scope of this embodiment. The protection scope of this embodiment should be based on the definition in the claims.

Claims

1. A high-frequency integrated device board-level elastic interconnection structure, characterized in that: The invention comprises a base (6) and a cover plate (7), wherein a package array structure (13) is arranged between the base (6) and the cover plate (7); the package array structure (13) comprises a substrate (3), an elastic pin array and a circuit board (5) which are connected in sequence; the elastic pin array comprises a plurality of micro spring pins (4), the micro spring pins (4) comprise two end rings (1) respectively connected to the substrate (3) and the circuit board (5), and a longitudinal elastic support structure (2) is integrally formed between the two end rings (1).

2. The high-frequency integrated device board-level elastic interconnection structure according to claim 1, characterized in that: The elastic support structure comprises a plurality of spring leaves or spring columns, which are arranged at intervals along the end ring (1) and are in a curved shape.

3. The high-frequency integrated device board-level elastic interconnect structure according to claim 2, characterized in that: The spring leaf and the spring column are bent toward the outside of the end ring (1); Alternatively, the reed leaves and the reed pillars are bent toward the inner side of the end ring (1), and gaps are maintained between the reed leaves or the reed pillars.

4. The high-frequency integrated device board-level elastic interconnection structure according to any one of claims 1 to 3, characterized in that: When the micro-spring pin (4) is in a free state, the height of the elastic support structure (2) is 1.5 mm to 2.5 mm, and when the micro-spring pin (4) bears a load, the lateral width of the micro-spring pin (4) is 0.5 mm to 0.7 mm.

5. The high-frequency integrated device board-level elastic interconnection structure according to any one of claims 1 to 3, characterized in that: A receiving cavity is formed inside the elastic supporting structure (2), and an elastic filling piece is arranged in the receiving cavity.

6. The high-frequency integrated device board-level elastic interconnection structure according to any one of claims 1 to 3, characterized in that: The end ring (1) is a circular ring with a diameter of 0.5 mm to 0.6 mm and a cross-sectional diameter of 0.15 mm to 0.2 mm.

7. The high-frequency integrated device board-level elastic interconnection structure according to any one of claims 2 or 3, characterized in that: The thickness of the spring leaf and the spring column is smaller than the cross-sectional diameter of the end ring (1).

8. The high-frequency integrated device board-level elastic interconnection structure according to any one of claims 2 or 3, characterized in that: The cross section of the spring leaf or spring column at least includes a square surface, a trapezoidal surface or a circular surface.

9. The high-frequency integrated device board-level elastic interconnect structure according to claim 1, characterized in that: The base (6) and the cover plate (7) are aligned via a positioning structure, and a cascade cavity (12) for accommodating the array packaging structure is formed between the base (6) and the cover plate (7). A limiting pressure block (8) is provided on the cover plate (7), and the limiting pressure block (8) is used to apply pressure to the array packaging structure and keep it stable.

10. A method for processing a board-level elastic interconnection structure of a high-frequency integrated device, used for processing the board-level elastic interconnection structure according to any one of claims 1 to 9, characterized in that: include: An integrally formed micro spring pin (4) is obtained by an additive process or a subtractive process; Performing laser or plasma treatment on the surface of the micro-spring pin (4) to activate and modify the surface of the micro-spring pin (4); Electroplating a nickel layer with a thickness of 4.5 μm to 5.5 μm on the surface of the micro-spring pin (4); Continue electroplating a 27μm to 33μm thick tin layer on the nickel layer; The end ring (1) at one end of the micro-spring pin (4) is welded to the welding pad of the substrate (3), and the end ring (1) at the other end of the micro-spring pin (4) is welded to the welding pad of the circuit board (5), so as to complete the connection and conduction between the substrate (3) and the circuit board (5), thereby forming a package array structure (13); The packaging array structure (13) is arranged between the base (6) and the cover plate (7), and they are connected and fastened.

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