A high-frequency integrated device board-level flexible interconnection structure and a processing method thereof

Abstract

The application relates to the field of board-level interconnection technology of integrated devices, and particularly relates to a high-frequency integrated device board-level elastic interconnection structure and a processing method, the interconnection structure comprising a base and a cover plate, and a packaging array structure being arranged between the base and the cover plate; the packaging array structure comprises a substrate, an elastic pin array and a circuit board which are sequentially connected; the elastic pin array comprises a plurality of micro-spring pins, each micro-spring pin comprises two end rings which are connected with the substrate and the circuit board respectively, and a longitudinal elastic supporting structure is integrally formed between the two end rings. In the application, the micro-spring pin structure is integrally formed with the longitudinal elastic supporting structure and the end ring, the processing procedure is reduced, the overall reliability of the micro-spring pin is improved, mechanical vibration can be better coped with, the transmission of high-frequency signals is more stable, and the loss in the transmission process of the high-frequency signals can be reduced.

Description

TECHNICAL FIELD

[0001] The application relates to the field of board-level interconnection of integrated devices, and particularly relates to a high-frequency integrated device board-level elastic interconnection structure and a processing method. BACKGROUND

[0002] Electronic devices in the fields of aviation, aerospace and the like develop towards miniaturization, diversification and integration, and are required to serve for a long time in harsh environments such as extreme high / low temperature, long-time vibration and high impact. Ceramic column grid array (CCGA) is gradually widely applied to electronic devices in the fields of aviation and aerospace due to its high packaging density, excellent thermal fatigue resistance and heat dissipation performance.

[0003] At present, the CCGA packaging pin forms include three kinds of cast type soldering column, copper band winding type soldering column and micro spring type soldering column. The cast type soldering column material is selected from Sn10Pb90 or Sn20Pb80. Since the internal thermal stress of the soldering point can be released through the bending deformation of the slender soldering column, the thermal fatigue failure caused by the mismatch of the thermal expansion coefficients of the ceramic substrate and the printed circuit board can be effectively solved. On the other hand, compared with the ceramic ball grid array (CBGA) packaging, the CCGA interconnection distance is increased, and the heat dissipation performance of the packaging body can be significantly improved. The copper band winding type soldering column material is generally selected from Sn20Pb80. The copper band is wound on the soldering column at equal pitches, which can not only increase the mechanical properties of the soldering column, but also assist the soldering column in rapid heat dissipation, thereby improving the electrical interconnection reliability. However, the cast type soldering column and the copper band winding type soldering column still have the problem of poor Z-direction mechanical vibration resistance. Under the action of long-time vibration and high impact, the pins are easily deformed, thereby causing the electronic device to fail and be scrapped. The micro spring type CCGA uses a spiral type micro spring to replace the soldering column, has a flexible connection feature, and can effectively solve the problem of poor mechanical vibration resistance of the soldering column type CCGA. In this regard, a plurality of published patents have been applied for, such as a micro spring pin assembly tin paste coating simulation method (CN202410449475.2), a method and device for controlling the perpendicularity between micro spring boards (CN202210319645.6), a micro spring pin rapid assembly tool and method for integrated circuits (CN202211669097.6) and a high-precision CCGA micro spring array board-level assembly process (CN202410097835.7). However, the coaxiality and coplanarity of the spiral type micro spring pin and the substrate are difficult to guarantee, which easily causes problems such as micro spring pin soldering-off and high void rate. More importantly, the spiral type micro spring pin shows inductive effect in the signal transmission process, thereby affecting the high-frequency signal transmission characteristics, and thereby limiting its application in high-frequency integrated device packaging.

[0004] From the above, the three kinds of CCGA package pin forms currently have excellent thermal fatigue resistance, excellent heat dissipation performance, but the cast solder column, copper band winding type solder column has poor resistance to mechanical vibration, the micro spring type solder column has high quality welding difficulty, and the high frequency signal transmission performance is affected, thereby leading to the problem that the three kinds of package pins are limited in application scenarios. Therefore, developing a new array package structure with excellent anti-mechanical vibration, good solder mechanical properties, and excellent electrical properties and a process implementation method is of great significance to promote electronic equipment with high reliability and long service life in the fields of aviation, aerospace and the like. Therefore, a more reasonable technical solution is needed to solve the technical problems in the prior art. SUMMARY

[0005] To at least overcome one of the above-mentioned defects, the present application proposes a high-frequency integrated device board-level elastic interconnection structure and processing method, which can improve the anti-vibration ability, simplify the processing technology, and improve the overall mechanical properties and electrical properties by improving the elastic interconnection structure.

[0006] In order to achieve the above-mentioned purpose, the elastic interconnection structure disclosed by the present application can adopt the following technical solutions:

[0007] A high-frequency integrated device board-level elastic interconnection structure, comprising a base and a cover plate, a packaging array structure is arranged between the base and the cover plate; the packaging array structure comprises a substrate, an elastic pin array and a circuit board connected in sequence; the elastic pin array comprises a plurality of micro spring pins, each micro spring pin comprises two end rings connected with the substrate and the circuit board respectively, and a longitudinal elastic support structure is integrally formed between the two end rings.

[0008] The above-mentioned board-level elastic interconnection structure is improved by the micro spring pin, the longitudinal elastic support structure provides elastic force to filter mechanical vibration, realizes the flexible connection of the substrate and the circuit board, and the micro spring pin adopts an integral forming structure, which avoids complicated welding processing procedures, and also facilitates to improve the stability of high-frequency signal transmission and reduce the loss in high-frequency signal transmission.

[0009] Further, the elastic support structure supports the upper and lower end rings and elastically deforms when the upper and lower end rings are subjected to load pressure, thereby elastically supporting the upper and lower end rings. The elastic support structure can be constructed in various forms and is not uniquely limited in structure. Here, one of the feasible options is optimized and proposed: the elastic support structure comprises a plurality of spring leaves or spring columns, the spring leaves or spring columns are arranged at intervals along the end rings, and the spring leaves or spring columns are curved. When the above scheme is adopted, the spring leaves or spring columns are pre-set to be curved, which facilitates elastic deformation along the original curved direction under the pressure of the load, thereby providing elastic support.

[0010] Further, the spring leaf and the spring column can be bent in multiple directions, and the bent structure is not uniquely limited. Here, optimization is performed, and a feasible option is proposed as follows: the spring leaf and the spring column are bent towards the outside of the end ring; or the spring leaf and the spring column are bent towards the inside of the end ring, and a gap is kept between the spring leaves or between the spring columns. When the above scheme is adopted, the spring leaf and the spring column are both bent outwards, and the micro spring pin forms a waist drum structure. When the spring leaf and the spring column are both bent inwards, in order to ensure the reliability of the elastic support, a gap is kept between any two spring leaves or spring columns bent inwards, and the gap does not touch even when the deformation reaches the maximum.

[0011] Further, in order to control the overall size of the packaging array structure and avoid the overall thickness of the integrated device being too large, the size of the micro spring pin needs to be limited: when the micro spring pin is in a free state, the height of the elastic support structure is 1.5 mm to 2.5 mm, and when the micro spring pin bears a load, the transverse width of the micro spring pin is 0.5 mm to 0.7 mm. According to the gap between the elastic substrate and the circuit board, a suitable micro spring pin can be selected for connection and cooperation. Considering the transverse deformation size of the micro spring pin, the gap between adjacent micro spring pins needs to be considered when the array is performed, so that the gap is greater than the maximum transverse width of the micro spring pin.

[0012] Further, in order to provide better and more stable elastic support, the structure of the micro spring pin is improved, and the structure is not uniquely limited. Here, optimization is performed, and one of the feasible options is proposed as follows: a containing cavity is formed in the micro spring pin, and an elastic filler is arranged in the containing cavity. When the above scheme is adopted, the elastic filler can be elastic rubber or the like.

[0013] Further, the end ring is used to cooperate with the substrate or the circuit board, and can adopt various geometric shapes, and the structure is not uniquely limited. Here, optimization is performed, and one of the feasible options is proposed as follows: the end ring is a circular ring, the diameter of the circular ring is 0.5 mm to 0.6 mm, and the cross-sectional diameter of the circular ring is 0.15 mm to 0.2 mm.

[0014] Further, in order to keep the overall structure of the micro spring pin reliable and meet the elastic deformation requirement, the structure of the spring leaf and the spring column can be set in multiple forms, and the structure is not uniquely limited. Here, optimization is performed, and one of the feasible options is proposed as follows: the thickness of the spring leaf and the spring column is less than the cross-sectional diameter of the end ring. When the above scheme is adopted, the process of machining is simplified, and the micro spring pin is obtained conveniently and quickly.

[0015] Further, the structure of the spring leaf and the spring column can be optimized and improved, and is not uniquely limited. Here, optimization is performed, and one of the feasible options is proposed as follows: the cross section of the spring leaf or the spring column at least includes a square face, a trapezoidal face or a circular face.

[0016] Further, when the array package structure is arranged to the base and the cover plate, the cooperation can be realized in various ways, and the structure is not uniquely limited, and one of the feasible options is optimized and proposed herein: the base and the cover plate are aligned through the positioning structure, and the cascade cavity for accommodating the array package structure is formed between the base and the cover plate, and the limiting pressing block is arranged on the cover plate, and the limiting pressing block is used to apply pressure to the array package structure and keep it stable. When the above scheme is adopted, the cascade cavity formed by the base and the cover plate is buckled, and the stress stability of the array package structure can be improved through the limiting pressing block.

[0017] The above discloses the board-level elastic interconnection structure, and the application also provides a processing method of the board-level elastic interconnection structure, which is specifically as follows:

[0018] A processing method of a board-level elastic interconnection structure of a high-frequency integrated device, which is used to process the board-level elastic interconnection structure described above, and includes the following steps:

[0019] An integral micro-spring pin is obtained through an additive process or a subtractive process;

[0020] The surface of the micro-spring pin is subjected to laser or plasma treatment to activate and modify the surface of the micro-spring pin;

[0021] A nickel layer with a thickness of 4.5-5.5 microns is electroplated on the surface of the micro-spring pin;

[0022] A tin layer with a thickness of 27-33 microns is continuously electroplated on the nickel layer;

[0023] One end ring of the micro-spring pin is spot-welded to a pad of a substrate, and the other end ring of the micro-spring pin is welded to a pad of a circuit board, thereby realizing the connection and conduction of the substrate and the circuit board and forming a packaged array structure;

[0024] The packaged array structure is arranged between the base and the cover plate and is connected and fastened.

[0025] Compared with the prior art, some beneficial effects of the technical solution of the application include:

[0026] The micro-spring pin structure adopted in the application is integrally formed with the longitudinal elastic support structure and the end ring, which reduces the processing procedures and improves the overall reliability of the micro-spring pin, can better cope with mechanical vibration, and is more stable in transmission of high-frequency signals, thereby reducing the loss in the process of high-frequency signal transmission. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only represent some of the embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0028] Figure 1 The overall structure of the micro spring pin.

[0029] Figure 2 The schematic diagram of the micro spring array packaging structure.

[0030] Figure 3 The schematic diagram of the micro spring array structure and the base and the cover plate.

[0031] Figure 4 The electromagnetic transmission characteristics of the micro spring pin, the spiral micro spring pin and the traditional CCGA pin.

[0032] In the above drawings, the meanings of the respective marks are as follows:

[0033] 1, end ring; 2, elastic support structure; 3, substrate; 4, micro spring pin; 5, circuit board; 6, base; 7, cover plate; 8, limiting block; 9, positioning column; 10, positioning hole; 11, tapered guide column; 12, cascading cavity; 13, packaging array structure; 14, groove; 15, abutting hole; 16, guide column; 17, guide hole. DETAILED DESCRIPTION

[0034] The present embodiment will be further explained in combination with the drawings and specific embodiments.

[0035] In view of the fact that the board-level elastic interconnection structure of the integrated device in the prior art has the problems of complex process, poor mechanical vibration resistance and affecting stable transmission of high-frequency signals, the following embodiments are optimized and overcome the defects in the prior art.

[0036] Embodiment 1

[0037] As shown in Figure 1 , Figure 2 , the present embodiment provides a board-level elastic interconnection structure of a high-frequency integrated device, which comprises a base 6 and a cover plate 7, and a packaging array structure 13 is arranged between the base 6 and the cover plate 7; the packaging array structure 13 comprises a substrate 3, an elastic pin array and a circuit board 5 connected in sequence; the elastic pin array comprises a plurality of micro spring pins 4, each micro spring pin 4 comprises two end rings 1 connected with the substrate 3 and the circuit board 5 respectively, and an elastic support structure 2 is integrally formed between the two end rings 1.

[0038] Preferably, in the embodiment, the substrate 3 is a ceramic substrate 3, and the circuit board 5 is a printed circuit board 5.

[0039] The board-level elastic interconnection structure disclosed in the embodiment provides elastic force by improving the micro spring pin 4 and using the longitudinal elastic support structure 2 to filter mechanical vibration, realizes flexible connection of the substrate 3 and the circuit board 5, and the micro spring pin 4 adopts an integrated structure, thereby avoiding complicated welding processing procedures and facilitating improvement of stability of high-frequency signal transmission and reduction of loss in high-frequency signal transmission.

[0040] The elastic support structure 2 supports the upper and lower end rings 1 and elastically deforms when the upper and lower end rings 1 are subjected to load pressure, thereby elastically supporting the upper and lower end rings 1. The elastic support structure 2 can be constructed in various forms and is not uniquely limited in structure. The embodiment is optimized and adopts one of the feasible options: the elastic support structure includes a plurality of spring leaves or spring columns, the spring leaves or spring columns are arranged at intervals along the end ring 1, and the spring leaves or spring columns are curved. When the above scheme is adopted, the spring leaves or spring columns are pre-set to be curved, which facilitates elastic deformation in the original curved direction under the pressure of the load, thereby performing elastic support.

[0041] Preferably, when the spring leaves are adopted, the spring leaves are elastic leaves with a certain thickness; and when the spring columns are adopted, the spring columns are elastic columns with a certain deflection.

[0042] In the embodiment, the spring leaves or spring columns are integrally formed with the end ring 1 by a 3D printing additive process or a laser subtractive process.

[0043] The spring leaves and spring columns can be curved in multiple directions, and the curved structure is not uniquely limited. The embodiment is optimized and adopts the following feasible option: the spring leaves and spring columns are curved toward the outside of the end ring 1; or the spring leaves and spring columns are curved toward the inside of the end ring 1, and gaps are maintained between the spring leaves or between the spring columns. When the above scheme is adopted, the spring leaves and spring columns are curved outward, and the micro spring pin 4 forms a waist drum-shaped structure. When the spring leaves and spring columns are curved inward, gaps are maintained between any two spring leaves or spring columns curved inward to ensure the reliability of the elastic support member, and the gaps do not touch even when deformed to the maximum extent.

[0044] In order to control the overall size of the package array structure 13 and avoid the overall thickness of the integrated device being too large, the size of the micro spring pin 4 needs to be limited: when the micro spring pin 4 is in a free state, the height of the elastic support structure 2 is 1.5mm-2.5mm, and when the micro spring pin 4 bears a load, the lateral width of the micro spring pin 4 is 0.5mm-0.7mm. According to the gap between the elastic substrate 3 and the circuit board 5, a suitable micro spring pin 4 can be selected for connection and cooperation. Considering the lateral deformation size of the micro spring pin 4, the gap between adjacent micro spring pins 4 needs to be considered when the array is performed, so that the gap is greater than the maximum lateral width of the micro spring pin 4.

[0045] Preferably, in the present embodiment, the lateral width of the micro spring pin 4 is 0.5mm-0.7mm at most.

[0046] In order to provide better and more stable elasticity support, the structure of the micro spring pin 4 is improved, which is not uniquely limited. In the present embodiment, one of the feasible options is optimized and adopted: a containing cavity is formed in the micro spring pin 4, and an elastic filler is arranged in the containing cavity. When the above scheme is adopted, the elastic filler can be made of elastic rubber or the like.

[0047] The end ring 1 is used to cooperate with the substrate 3 or the circuit board 5, which can adopt various geometric shapes, and its structure is not uniquely limited. In the present embodiment, one of the feasible options is optimized and adopted: the end ring 1 is a circular ring, the diameter of the circular ring is 0.5mm-0.6mm, and the cross-sectional diameter of the circular ring is 0.15mm-0.2mm.

[0048] In order to keep the overall structure of the micro spring pin 4 reliable and meet the elastic deformation requirement, the structures of the spring sheet and the spring column can be set in various forms, which are not uniquely limited. In the present embodiment, one of the feasible options is optimized and adopted: the thickness of the spring sheet and the spring column is less than the cross-sectional diameter of the end ring 1. When the above scheme is adopted, the process of machining is simplified, and the micro spring pin 4 is obtained conveniently and quickly.

[0049] The structures of the spring sheet and the spring column can be optimized and improved, which are not uniquely limited. In the present embodiment, one of the feasible options is optimized and adopted: the cross section of the spring sheet or the spring column at least includes a square face, a trapezoidal face or a circular face.

[0050] As Figure 3As shown, when the array package structure is arranged to the base 6 and the cover plate 7, the cooperation can be realized in various ways, and the structure is not uniquely limited, and one of the feasible choices is optimized and adopted in the embodiment: the base 6 and the cover plate 7 are aligned through the positioning structure, and the cascade cavity 12 for accommodating the array package structure is formed between the base 6 and the cover plate 7, and the limiting pressing block 8 is arranged on the cover plate 7, which is used to apply pressure to the array package structure and keep it stable. When the above scheme is adopted, the cascade cavity 12 formed by the base 6 and the cover plate 7 is buckled, and the stress stability of the array package structure can be improved through the limiting pressing block 8.

[0051] Preferably, the positioning structure includes the positioning column 9 and the positioning hole 10, the positioning column 9 is arranged on the base 6, and the positioning hole 10 is arranged on the cover plate 7, and the cooperation of the base 6 and the cover plate 7 is realized through the alignment of the positioning column 9 and the positioning hole 10.

[0052] Preferably, the cover plate 7 is provided with the groove 14, a plurality of abutting holes 15 are arranged in the groove 14, the limiting pressing block 8 is arranged at the groove 14, and a plurality of abutting columns are arranged on the limiting pressing block 8, the abutting columns are abutted with the package array structure 13 after passing through the abutting holes 15. In the embodiment, the abutting column is a column with gradually changing diameter, and the diameter of the abutting column gradually decreases from the bottom to the end.

[0053] Preferably, the cover plate 7 is provided with the guide column 16, and the limiting pressing block 8 is provided with the guide hole 17 corresponding to the guide column 16, and when the limiting pressing block 8 cooperates with the cover plate 7, the guide column 16 passes through the guide hole 17.

[0054] When the board-level elastic interconnection structure disclosed in the embodiment is specifically adopted, better effects can be achieved than the traditional interconnection structure.

[0055] Specifically as Figure 4 As shown, the electromagnetic transmission characteristics of the waist-drum-shaped micro spring pin 4, the spiral micro spring pin 4 and the traditional CCGA pin are compared by using the HFSS software simulation, the frequency adaptation range of the spiral micro spring pin is highest at 2GHz, and the return loss of the signal sharply increases when the frequency exceeds the range, and the decline of the electrical performance is unacceptable (S11>-20dB). In contrast, the S11 of the waist-drum-shaped micro spring pin and the traditional CCGA pin is less than-20dB in the frequency range of 0.1-40GHz, which proves that the waist-drum-shaped micro spring pin meets the signal transmission function requirement of 40GHz.

[0056] It can be known that the board-level interconnection structure in the embodiment has the following beneficial effects:

[0057] Excellent high-frequency signal transmission characteristics. The spiral micro-spring pin 4 exhibits inductive effects in the process of circuit transmission, and has large high-frequency loss, which seriously restricts its application scenarios. The new type of drum-shaped micro-spring pin 4 proposed in the embodiment is composed of a plurality of elastic spring sheets arranged in a ring shape and a circular ring body at both ends, which has flexible interconnection characteristics and can effectively avoid the inductive effects exhibited in the process of high-frequency circuit signal transmission, so that the array interconnection form has good high-frequency signal transmission characteristics.

[0058] Excellent thermal fatigue resistance. The drum-shaped micro-spring array packaging structure proposed in the embodiment is composed of a plurality of elastic spring sheets arranged in a ring shape and a circular ring body at both ends. The structure can release the thermal stress of the solder joint through the bending deformation of the elastic spring sheet, thereby effectively solving the problem of thermal fatigue failure caused by the mismatch of the thermal expansion coefficients of the ceramic substrate 3 and the printed circuit board 5.

[0059] Excellent mechanical vibration resistance. The new type of drum-shaped micro-spring pin 4 structure proposed in the embodiment has flexible interconnection characteristics, and can absorb vibration energy through the elastic deformation of the spring sheet under the action of mechanical vibration, thereby significantly improving the ability of the package to resist long-time vibration and high impact.

[0060] Excellent heat dissipation performance. The new type of drum-shaped micro-spring pin 4 structure proposed in the embodiment ensures that the ceramic substrate 3 and the printed circuit board 5 have a large interconnection distance, and the hollow structure feature is more conducive to air circulation, thereby the array packaging form has excellent heat dissipation performance.

[0061] Good mechanical properties of the solder joint. The spiral micro-spring pin 4 is manufactured by winding, and the coplanarity degree is difficult to guarantee, which can easily cause incomplete wrapping of the solder paste on the micro-spring pin, pin detachment, and large void rate. The drum-shaped micro-spring pin 4 proposed in the embodiment is manufactured by integrated molding process, and the coplanarity degree of the end face of the circular ring body can be effectively guaranteed. At the same time, the solder tin can climb along the side wall of the circular ring body during the soldering process, so that the solder tin has a larger wrapping area on the pin, which can effectively disperse the stress of the solder joint, and thus has better mechanical properties.

[0062] Effective drum-shaped micro-spring pin 4 processing technology implementation. The embodiment is precisely manufactured by 3D printing additive or ultrafast laser subtractive method, and the material needs to be selected to have elastic and conductive properties, such as beryllium copper, spring steel, etc. Subsequently, the printed pin structure is sequentially treated by laser or plasma activation, electroplating nickel and electroplating tin, so as to have weldability.

[0063] Embodiment 2

[0064] The content of the above embodiment 1 discloses a board-level elastic interconnection structure, and the embodiment further provides a processing method of the above board-level elastic interconnection structure, which is as follows:

[0065] A processing method of a high-frequency integrated device board-level flexible interconnection structure is used to process the board-level flexible interconnection structure described above, and comprises the following steps:

[0066] The micro spring pin 4 is integrally formed by an additive process or a subtractive process;

[0067] The surface of the micro spring pin 4 is subjected to laser or plasma treatment to activate and modify the surface of the micro spring pin 4;

[0068] The surface of the micro spring pin 4 is electroplated with a nickel layer with a thickness of 4.5μ-5.5μ;

[0069] The nickel layer is further electroplated with a tin layer with a thickness of 27μm-33μ;

[0070] One end ring 1 of the micro spring pin 4 is spot-welded to a pad of the substrate 3, and the other end ring 1 of the micro spring pin 4 is welded to a pad of the circuit board 5, thereby connecting and conducting the substrate 3 and the circuit board 5, and forming a package array structure 13;

[0071] The package array structure 13 is arranged between the base 6 and the cover plate 7, and is connected and fastened.

[0072] Preferably, in the embodiment, the thickness of the nickel layer is 5μ.

[0073] Preferably, in the embodiment, the thickness of the tin layer is 30μ.

[0074] A specific case is listed here, taking the processing of a waist-drum-shaped micro spring pin 4 by a precise metal 3D printing additive method as an example, and the process implementation flow of the array package structure is as follows:

[0075] Step 1: according to the structure characteristics and size of the designed waist-drum-shaped micro spring pin 4, a three-dimensional model is constructed in software such as Solidworks, and then the model is sliced and imported into a precise metal 3D printing equipment to realize layer-by-layer printing of the waist-drum-shaped micro spring pin 4 structure;

[0076] Step 2: the prepared waist-drum-shaped micro spring pin 4 structure is subjected to electroplating treatment. This process needs to be subjected to laser or plasma treatment to activate and modify the surface of the formed pin, then tin is electroplated (thickness about 30μ), and nickel (thickness about 5μ) needs to be electroplated before tin plating to increase the adhesion between the pin material and the tin layer;

[0077] Step 3: the ceramic substrate 3 is installed in the positioning cavity of the base 6, and Sn63Pb37 solder paste is printed on the surface pads of the ceramic substrate 3 using a steel mesh designed based on the pad layout and size, and the printing thickness is about 0.12mm;

[0078] Step 4: install the cover plate 7 and limit through the positioning column 9 on the base 6 and the positioning hole 10 on the cover plate 7, then the drum-shaped micro spring pin 4 is aligned and placed through the through hole on the spring cover plate 7, and the limiting block 8 is installed on the drum-shaped micro spring pin 4; the limiting block 8 is designed with a gradually changing guide column 11 and is installed in cooperation with the ring body on the pin, which can further ensure that the micro spring pin does not tilt during welding, thereby improving the welding quality and reliability;

[0079] Step 5: place the base 6 with the ceramic substrate 3, the ceramic substrate 3, the spring cover plate 7, the limiting block 8, and the drum-shaped micro spring pin 4 array into a reflow furnace, the welding temperature is 200-210℃, and after cooling and solidification, the spring cover plate 7 and the limiting block 8 are removed to realize the interconnection of the drum-shaped micro spring pin 4 array and the surface pad of the ceramic substrate 3;

[0080] Step 6: install the printed circuit board 5 into the positioning cavity of the base 6, print Sn63Pb37 solder paste on the surface pad of the circuit board 5 using a steel mesh, the printing thickness is about 0.12mm, then align and place the drum-shaped micro spring pin 4 on the ceramic substrate 3 with the surface pad of the printed circuit board 5;

[0081] Step 7: place the printed circuit board 5 to the base 6 and the ceramic circuit board 5 with the drum-shaped micro spring pin 4 array into a reflow furnace, the welding temperature is 200-210℃; after cooling and solidification, the vertical interconnection of the ceramic substrate 3 and the printed circuit board 5 using the drum-shaped micro spring pin 4 array is realized.

[0082] The above is the implementation mode listed in the embodiment, but the embodiment is not limited to the above optional implementation mode, and those skilled in the art can obtain other various implementation modes by arbitrarily combining the above modes with each other, and anyone can obtain other various forms of implementation modes under the inspiration of the embodiment. The above specific implementation mode should not be understood as a limitation on the protection scope of the embodiment, and the protection scope of the embodiment should be defined by the claims.

Claims

1. A high frequency integrated device board level elastic interconnection structure, characterized by: It includes a base (6) and a cover plate (7), and a packaging array structure (13) is arranged between the base (6) and the cover plate (7); the packaging array structure (13) comprises a substrate (3), an elastic pin array and a circuit board (5) connected in sequence; the elastic pin array comprises a plurality of micro spring pins (4), and each micro spring pin (4) comprises two end rings (1) connected with the substrate (3) and the circuit board (5) respectively, and an elastic support structure (2) is integrally formed between the two end rings (1) in a longitudinal direction. The elastic support structure (2) comprises a plurality of spring leaves or spring columns, the spring leaves or spring columns are arranged at intervals along the end rings (1), and the spring leaves or spring columns are curved.

2. The high frequency integrated device board level elastic interconnection structure of claim 1, wherein: The spring leaves or spring columns are curved towards the outside of the end rings (1). Alternatively, the spring leaves or spring columns are curved towards the inside of the end rings (1), and gaps are kept between the spring leaves or spring columns.

3. The high frequency integrated device board level elastic interconnection structure according to any one of claims 1-2, wherein: When the micro spring pins (4) are in a free state, the height of the elastic support structure (2) is 1.5mm-2.5mm, and when the micro spring pins (4) bear a load, the transverse width of the micro spring pins (4) is 0.5mm-0.7mm.

4. The board-level flexible interconnect structure for high-frequency integrated devices according to any one of claims 1 to 2, characterized in that: An accommodation cavity is formed on the inside of the elastic support structure (2), and an elastic filler is arranged in the accommodation cavity.

5. The board-level flexible interconnect structure for high-frequency integrated devices according to any one of claims 1 to 2, characterized in that: The end ring (1) is a circular ring, the diameter of the circular ring is 0.5mm-0.6mm, and the cross-sectional diameter of the circular ring is 0.15mm-0.2mm.

6. The board-level flexible interconnection structure for high-frequency integrated devices according to claim 1 or 2, characterized by: The thickness of the spring leaves and spring columns is less than the cross-sectional diameter of the end ring (1).

7. The board-level flexible interconnection structure for high-frequency integrated devices according to claim 1 or 2, wherein: The cross section of the spring leaves or spring columns at least comprises a square face, a trapezoidal face or a circular face.

8. The high frequency integrated device board level elastic interconnection structure of claim 1, wherein: The base (6) and the cover plate (7) are aligned by a positioning structure, and a cascade cavity (12) for accommodating the array packaging structure is formed between the base (6) and the cover plate (7), and a limiting block (8) is arranged on the cover plate (7), which is used to apply pressure to the array packaging structure and keep it stable.

9. A method for processing a board-level flexible interconnection structure of a high-frequency integrated device, for processing the board-level flexible interconnection structure according to any one of claims 1 to 8, characterized in that, It comprises: An integrally formed micro spring pin (4) is obtained by an additive process or a subtractive process; The surface of the micro spring pin (4) is treated by laser or plasma to activate and modify the surface of the micro spring pin (4); Electroplating of the surface of the micro spring pin (4) 4.5 5.5 thick nickel layer; The electroplating of the nickel layer is continued 27 33 a thick tin layer; One end ring (1) of the micro spring pin (4) is separately welded to a pad of the substrate (3), and the other end ring (1) of the micro spring pin (4) is welded to a pad of the circuit board (5), thereby connecting and conducting the substrate (3) and the circuit board (5), and forming a packaging array structure (13); The packaging array structure (13) is arranged between the base (6) and the cover plate (7), and is connected and fastened.

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