Liquid crystal phased array signal transmission device and phased array antenna
By employing a sandwich structure of a non-glass dielectric layer, a glass panel layer, and a liquid crystal layer in a liquid crystal phased array signal transmission device, and utilizing slotting and coupling components in the metal layer, the problem of high electromagnetic wave transmission loss in the microwave band is solved, achieving broadband performance and low-loss electromagnetic wave transmission.
Patent Information
- Application Number
- CN202510135998.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-07
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2045-02-07
AI Technical Summary
In the microwave band, when phased array devices transmit signals across two substrates, the inability to fabricate metal sidewalls in the glass medium or the high cost of fabricating through-holes leads to significant lateral electromagnetic radiation and loss. This is especially true when using liquid crystal phase shifters made of glass, where existing technologies lack effective solutions to achieve good electromagnetic wave transmission and broadband performance.
A sandwich structure consisting of a non-glass dielectric layer, a glass panel layer, and a liquid crystal layer is adopted. By utilizing slots and coupling components in the metal layer, combined with microstrip lines and resonant cavities, the system achieves efficient transmission and mode conversion of electromagnetic waves, thereby reducing system losses.
It achieves good electromagnetic wave transmission between glass and non-glass media, reduces the system loss of liquid crystal phased array antennas, has broadband performance, and is suitable for satellite communication and other fields.
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Figure CN119944259B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of phased array equipment technology, and in particular to a liquid crystal phased array signal transmission device and a phased array antenna. Background Technology
[0002] In the microwave band, when phased array devices transmit signals across two substrates, it is difficult to fabricate complete metal sidewalls in non-glass media. Therefore, metal vias are typically used to form equivalent coaxial lines or waveguide structures. However, when one layer is glass and vias cannot be fabricated, or when fabricating vias is too costly, lateral electromagnetic radiation from the transmission structure can easily occur, leading to poor coupling and significant signal loss during transmission. Especially when phased array devices such as liquid crystal phase shifters made of glass are needed to implement the function of phased array antennas, existing technologies lack relevant implementation schemes. Summary of the Invention
[0003] In view of this, the purpose of the present invention is to provide a liquid crystal phased array signal transmission device and a phased array antenna, which can realize good electromagnetic wave transmission between glass and non-glass media, reduce the system loss of the liquid crystal phased array antenna, and have broadband performance.
[0004] In a first aspect, the present invention provides a liquid crystal phased array signal transmission device, which includes: a non-glass dielectric layer, a glass panel layer, a liquid crystal layer, and a metal layer; wherein a transmission structure is disposed between the glass panel layer, the liquid crystal layer, and the metal layer.
[0005] The non-glass dielectric layer includes an upper non-glass dielectric layer and a lower non-glass dielectric layer, and the glass panel layer includes an upper glass layer and a lower glass layer; the upper non-glass dielectric layer is located above the upper glass layer, and the lower non-glass dielectric layer is located below the lower glass layer; the liquid crystal layer is disposed between the upper glass layer and the lower glass layer.
[0006] Metal layers are set on the top of the upper glass and the bottom of the lower glass; the metal layers are all provided with slots, and the transmission structure corresponds to the slots;
[0007] The transmission structure has an upper electrode and a lower electrode in the liquid crystal layer; wherein, the upper electrode is located on the lower surface of the upper glass layer and corresponds to the slot; the lower electrode is located on the upper surface of the lower glass layer; a coupling component is provided between the upper electrode and the lower electrode, and the liquid crystal layer is sandwiched between them;
[0008] Microstrip lines and resonant cavities are disposed in the upper and lower non-glass dielectric layers; both the microstrip lines and resonant cavities correspond to the transmission structure.
[0009] Optionally, the coupling assembly includes a first hook arm and a second hook arm; wherein the first hook arm is located in the lower electrode and a first dipole is disposed in the first hook arm; the second hook arm is located in the upper electrode and a second dipole is disposed in the second hook arm.
[0010] Optionally, the first hook-shaped arm includes: a first protrusion and a first metal arm; wherein the first protrusion is tower-shaped, the first metal arm is L-shaped, and the first protrusion is connected to the first metal arm through the top of the tower shape.
[0011] Optionally, the second hook-shaped arm includes: a second protrusion and a second metal arm; wherein the second protrusion is rectangular, the second metal arm is L-shaped, and the second protrusion is connected to the second metal arm through one end of the rectangle.
[0012] Optionally, the first hook-shaped arm also includes a surrounding metal layer, which has a rectangular hole structure. The first protrusion is connected to the surrounding metal layer through the bottom of the tower shape. Both the first protrusion and the first metal arm are disposed within the surrounding metal layer.
[0013] Optionally, the metal layer includes: a top metal layer, a middle and upper metal layer, a middle and lower metal layer, and a bottom metal layer;
[0014] The top metal layer is set on top of the upper non-glass dielectric layer;
[0015] The upper and middle metallic layers are positioned between the upper glass layer and the upper non-glass dielectric layer;
[0016] The middle and lower metallic strata are set between the lower glass layer and the lower non-glass dielectric layer;
[0017] The underlying metallic layer is located at the bottom of the lower non-glass dielectric layer.
[0018] Optionally, the resonant cavity consists of several metal vias connected to the metal layer, and the resonant region enclosed by the metal vias corresponds to the transmission structure.
[0019] Secondly, the present invention provides a phased array antenna, wherein the liquid crystal phased array antenna is provided with the liquid crystal phased array signal transmission device mentioned in the first aspect.
[0020] This invention provides a liquid crystal phased array signal transmission device and a liquid crystal phased array antenna. The liquid crystal phased array signal transmission device includes: a non-glass dielectric layer, a glass panel layer, a liquid crystal layer, and a metal layer; wherein a transmission structure is disposed between the glass panel layer, the liquid crystal layer, and the metal layer; wherein the non-glass dielectric layer includes an upper non-glass dielectric layer and a lower non-glass dielectric layer, and the glass panel layer includes an upper glass layer and a lower glass layer; the upper non-glass dielectric layer is located above the upper glass layer, and the lower non-glass dielectric layer is located below the lower glass layer; the liquid crystal layer is disposed on the upper layer. Between the upper and lower glass layers, a metal layer is disposed at the top of the upper glass layer and the bottom of the lower glass layer. Each metal layer has slots, and the transmission structure corresponds to these slots. The transmission structure has an upper electrode and a lower electrode within the liquid crystal layer. The upper electrode is located on the lower surface of the upper glass layer and corresponds to the slots; the lower electrode is located on the upper surface of the lower glass layer. A coupling component is disposed between the upper and lower electrodes, sandwiching the liquid crystal layer. Microstrip lines and resonant cavities are disposed in both the upper and lower non-glass dielectric layers, and both the microstrip lines and resonant cavities correspond to the transmission structure. This liquid crystal phased array signal transmission device and liquid crystal phased array antenna can achieve good electromagnetic wave transmission between glass and non-glass dielectrics, reduce system losses of the liquid crystal phased array antenna, and has broadband performance.
[0021] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained in accordance with the structures particularly pointed out in the description, claims and drawings.
[0022] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0023] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of the structure of a liquid crystal phased array signal transmission device provided in an embodiment of the present invention;
[0025] Figure 2 This is a schematic diagram of the coupling device in a liquid crystal phased array signal transmission device provided in an embodiment of the present invention;
[0026] Figure 3This is a schematic diagram of the structure of a coupling device with a metal outer ring in a liquid crystal phased array signal transmission device according to an embodiment of the present invention;
[0027] Figure 4 This is a three-dimensional structural diagram of a coupled input with a resonant cavity composed of a non-glass dielectric layer in a liquid crystal phased array signal transmission device provided in an embodiment of the present invention.
[0028] icon:
[0029] 10 - Glass panel layer; 20 - Liquid crystal layer; 30 - Metal layer; 40 - Transmission structure; 50 - Non-glass dielectric layer;
[0030] 11-Upper glass; 12-Lower glass;
[0031] 21 - Upper electrode; 22 - Lower electrode;
[0032] 41-First hook-shaped arm; 41a-First protrusion; 41b-First metal arm; 41c-Surrounding metal layer;
[0033] 42-Second hook-shaped arm; 42a-Second protrusion; 42b-Second metal arm;
[0034] 31 - Top metallic stratum; 32 - Middle to upper metallic stratum; 33 - Middle to lower metallic stratum; 34 - Bottom metallic stratum;
[0035] 51-Upper non-glass dielectric layer; 52-Lower non-glass dielectric layer; 53-Upper microstrip line; 54-First metal via; 55-Lower microstrip line; 56-Second metal via. Detailed Implementation
[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0037] In the microwave band, when phased array signal transmission devices transmit signals across two substrates, it is difficult to fabricate complete metal sidewalls in a non-glass medium. Therefore, metal vias are typically used to form equivalent coaxial or waveguide structures. However, when one layer is glass and vias cannot be fabricated or are too costly, lateral electromagnetic radiation from the transmission structure can easily occur, leading to poor coupling and significant losses during electromagnetic wave transmission. If a phased array system with glass layers also requires broadband operation, this design becomes even more difficult to implement. For example, in satellite communications, both receiving and transmitting signals need to cover the entire Ka or Ku band, which are broadband. Existing liquid crystal phased array antennas, due to the use of glass layers, typically struggle to cover the required Ka or Ku operating frequency bands without incurring significant losses and impedance mismatch.
[0038] In summary, existing technologies lack feasible implementation schemes for phased array antennas that require the use of glass-based liquid crystal phase shifters or similar devices. Therefore, this invention provides a liquid crystal phased array signal transmission device and a liquid crystal phased array antenna, which can achieve good electromagnetic wave transmission between glass and non-glass media, reduce system losses in the liquid crystal phased array antenna, and possess broadband performance.
[0039] To facilitate understanding of this embodiment, a detailed description of a liquid crystal phased array signal transmission device disclosed in this embodiment of the invention will be provided first, such as... Figure 1 As shown in the schematic diagram, the liquid crystal phased array signal transmission device includes: a non-glass dielectric layer 50, a glass panel layer 10, a liquid crystal layer 20, and a metal layer 30; wherein a transmission structure 40 is provided between the glass panel layer 10, the liquid crystal layer 20, and the metal layer 30.
[0040] Specifically, the non-glass dielectric layer 50 includes an upper non-glass dielectric layer 51 and a lower non-glass dielectric layer 52, and the glass panel layer 10 includes an upper glass layer 11 and a lower glass layer 12; the upper non-glass dielectric layer 51 is located above the upper glass layer 11, and the lower non-glass dielectric layer 52 is located below the lower glass layer 12; the liquid crystal layer 20 is disposed between the upper glass layer 11 and the lower glass layer 12.
[0041] Metal layers 30 are disposed on the top of the upper glass layer 11 and the bottom of the lower glass layer 12; both metal layers 30 are provided with slots, and the transmission structure 40 corresponds to the slots. The transmission structure 40 is provided with an upper electrode 21 and a lower electrode 22 in the liquid crystal layer 20; wherein, the upper electrode 21 is located on the lower surface of the upper glass layer 11 and corresponds to the slot; the lower electrode 22 is located on the upper surface of the lower glass layer; a coupling component is provided between the upper electrode 21 and the lower electrode 22, and the liquid crystal layer 20 is sandwiched between them.
[0042] Microstrip lines and resonant cavities are provided in the upper non-glass dielectric layer 51 and the lower non-glass dielectric layer 52; the microstrip lines and resonant cavities correspond to the transmission structure.
[0043] The liquid crystal phased array signal transmission device is an overall stacked sandwich structure cavity. By utilizing the slotted cavity, electromagnetic waves of different modes can be coupled into the dipole structure in the glass panel.
[0044] The structural diagram of the coupled component is as follows Figure 2 As shown, it includes a first hook arm 41 and a second hook arm 42; wherein, the first hook arm 41 is located in the lower electrode 22 and a first dipole is disposed in the first hook arm 41; the second hook arm 42 is located in the upper electrode 21 and a second dipole is disposed in the second hook arm 42.
[0045] Optionally, the first hook-shaped arm 41 includes a first protrusion 41a and a first metal arm 41b; wherein the cross-section of the first protrusion 41a is tower-shaped, the cross-section of the first metal arm 41b is L-shaped, and the first protrusion 41a is connected to the first metal arm 41b through the top of the tower shape.
[0046] Optionally, the second hook-shaped arm 42 includes: a second protrusion 42a and a second metal arm 42b; wherein the cross-section of the second protrusion 42a is rectangular, the cross-section of the second metal arm 42b is L-shaped, and the second protrusion 42a is connected to the second metal arm 42b through one end of the rectangle.
[0047] Specifically, the coupling component includes two dipole hook-arm structures located on two different layers. The first hook-arm 41 is located in the metal ground, i.e., in the lower electrode 22; the second hook-arm 42 is located symmetrically on the upper electrode 21. Vertically, a liquid crystal material filling layer exists between the first hook-arm 41 and the second hook-arm 42, and an overlapping region exists in the center of the structure. Within this overlapping region, the dipole mode can be converted to a microstrip line mode using the gradient structure on the lower electrode 22.
[0048] Optionally, the first hook-shaped arm also includes a surrounding metal layer 41c, which has a rectangular hole structure. The first protrusion 41a is connected to the surrounding metal layer 41c through the bottom of the tower shape. Both the first protrusion 41a and the first metal arm 41b are disposed within the surrounding metal layer 41c.
[0049] It is worth mentioning that the surrounding metal layer 41c can be selectively increased, which can be achieved by creating an approximately rectangular slot in the metal ground of the lower electrode 22, specifically as follows: Figure 3 As shown. The surrounding metal layer 41c, as the outer ring metal, is beneficial for controlling the lateral radiation of the dipole and can be selectively optimized, removed, or retained according to actual needs.
[0050] Combination Figure 1 It can be seen that the resonant cavity enclosed by the first metal via 54 is inside the upper non-glass dielectric layer 51; the upper microstrip line 53 is located in a certain layer inside the upper non-glass dielectric layer 51, and its specific position can be adjusted according to the design. Similarly, the resonant cavity enclosed by the second metal via 56 is inside the lower non-glass dielectric layer 52; the lower microstrip line 55 is located in a certain layer inside the lower non-glass dielectric layer 52, and its specific position can also be adjusted according to the design.
[0051] Optionally, the metal layer 30 includes: a top metal ground layer 31, a middle upper metal ground layer 32, a middle lower metal ground layer 33, and a bottom metal ground layer 34; wherein, the top metal ground layer 31 is disposed on top of the upper non-glass dielectric layer 51; the middle upper metal ground layer 32 is disposed between the upper non-glass dielectric layer 51 and the upper glass 11; the middle lower metal ground layer 33 is disposed between the lower glass 12 and the lower non-glass dielectric layer 52; and the bottom metal ground layer 34 is disposed at the bottom of the lower non-glass dielectric layer 52.
[0052] At this point, the entire structure of the metal layer 30 is a multi-layered metal layer, located on the top layer of the upper non-glass dielectric layer 51, between the upper non-glass dielectric layer 51 and the upper glass layer 11, between the lower glass layer 12 and the lower non-glass dielectric layer 52, and at the bottom layer of the lower non-glass dielectric layer 52. The metal ground layer between the non-glass dielectric layer 50 and the glass panel layer 10 has an H-shaped slotted structure.
[0053] The liquid crystal phase shifter is excited by coupling the resonant cavity with a slotted bottom in the upper non-glass dielectric layer 51 with the dipole structure in the liquid crystal layer 20. This structure achieves broadband performance and has good coupling performance. The dipole and hook-arm structure in the liquid crystal layer 20 can couple and transmit different modes of the original signal, and finally convert the output signal into the microstrip transmission mode (TEM) through the gradient structure.
[0054] refer to Figure 1 The first metal via 54, together with the top metal ground layer 31 and the upper middle metal ground layer 32 in the metal layer 30, forms the resonant cavity of the upper non-glass dielectric layer 51; the second metal via 56, together with the lower middle metal ground layer 33 and the bottom metal ground layer 34 in the metal layer 30, forms the resonant cavity of the lower non-glass dielectric layer 52, and the resonant region enclosed by the aforementioned metal vias and metal ground layers corresponds to the transmission structure. Figure 4The diagram shows a three-dimensional structure with a coupled input to a resonant cavity composed of a non-glass dielectric layer. Two dipole hook-like arm structures are coupled via a slotted structure on the upper metal ground plane. Within the non-glass dielectric layer 50, an equivalent resonant cavity structure is formed by metal vias and a metal ground plane. A microstrip probe structure is designed within the metal layer 30 and the non-glass dielectric layer 50. This microstrip probe structure excites the slot within the cavity, which then couples with the dipole structure in the glass panel layer to complete the electromagnetic wave transmission from the resonant cavity to the glass panel layer.
[0055] As can be seen from the liquid crystal phased array signal transmission device in the above embodiments, the liquid crystal phased array signal transmission device has a cavity with a slotted structure, which can couple electromagnetic waves of different modes into the dipole structure in the glass panel; the cavity structure is implemented on a substrate with a non-glass dielectric, the sidewalls of the cavity are formed by metal through holes, and it is sealed by the metal ground structure of the upper and lower layers; by using a microstrip line probe inserted into the cavity to excite the slot, the electromagnetic waves are effectively transmitted to the dipole structure.
[0056] Furthermore, this liquid crystal phased array signal transmission device employs a dipole structure design, comprising two hook-shaped arms, one part of which is buried in a metal ground layer; the other part is realized through the upper and lower electrodes of the liquid crystal glass panel. The two arms of the dipole are separated by a small gap, but overlap at the center. This overlapping portion serves as a transmission region. Through this overlapping region with gradually varying width, the original electromagnetic waves of different modes are converted into microstrip line modes before being output. Optionally, the microstrip line and resonant cavity structures in the two non-glass dielectric layers can not be exactly the same, depending on maximizing the transmission efficiency of the electromagnetic wave signal.
[0057] The resonant cavity and microstrip line coupling output structure composed of a lower non-glass dielectric layer are similar in principle and structure to the resonant cavity and microstrip line input structure composed of an upper non-glass dielectric layer, and will not be described in detail here.
[0058] The glass panel layer and liquid crystal layer in this liquid crystal phased array signal transmission device adopt a sandwich structure, with the upper and lower layers being glass substrates and the liquid crystal sandwiched in the middle; the metal layer is located on the inner surface of the glass substrate, and the transmission of electromagnetic waves is accomplished through the structure of these metal layers and the liquid crystal contained therein, which can effectively optimize for broadband performance and low-loss transmission.
[0059] The metal ground plane in this liquid crystal phased array signal transmission device can be selectively partially removed. To enhance control over lateral radiation, the ground plane around the dipoles can be partially or completely removed as needed. This selective removal allows for finer control over the radiation mode and coupling efficiency.
[0060] This invention also provides a liquid crystal phased array antenna, which includes the liquid crystal phased array signal transmission device mentioned in the above embodiments.
[0061] This liquid crystal phased array antenna can achieve good electromagnetic wave transmission between glass and non-glass media through its liquid crystal phased array signal transmission device, reduce the system loss of the liquid crystal phased array antenna, and has high bandwidth performance.
[0062] The liquid crystal phased array antenna provided in this embodiment of the invention has the same implementation principle and technical effect as the liquid crystal phased array signal transmission device in the aforementioned liquid crystal phased array signal transmission device embodiment. For the sake of brevity, any parts not mentioned in this embodiment can be referred to the corresponding content in the aforementioned liquid crystal phased array signal transmission device embodiment.
[0063] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the coupling or direct coupling or communication connection shown or discussed may be through some communication interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.
[0064] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0065] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.
[0066] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this invention, essentially, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, electronic device, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0067] Finally, it should be noted that the above-described embodiments are merely specific implementations of the present invention, used to illustrate the technical solutions of the present invention, and not to limit it. The scope of protection of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments within the technical scope disclosed in the present invention, or make equivalent substitutions for some of the technical features; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A liquid crystal phased array signal transmission device, characterized in that, The liquid crystal phased array signal transmission device includes: a non-glass dielectric layer, a glass panel layer, a liquid crystal layer, and a metal layer; wherein a transmission structure is provided between the glass panel layer, the liquid crystal layer, and the metal layer; The non-glass dielectric layer includes an upper non-glass dielectric layer and a lower non-glass dielectric layer, and the glass panel layer includes an upper glass layer and a lower glass layer; the upper non-glass dielectric layer is located above the upper glass layer, and the lower non-glass dielectric layer is located below the lower glass layer; the liquid crystal layer is disposed between the upper glass layer and the lower glass layer. The metal layer is disposed on the top of the upper glass and the bottom of the lower glass; each metal layer is provided with a slot, and the transmission structure corresponds to the slot; The transmission structure has an upper electrode and a lower electrode in the liquid crystal layer; wherein, the upper electrode is located on the lower surface of the upper glass layer and corresponds to the slot; the lower electrode is located on the upper surface of the lower glass layer; a coupling component is provided between the upper electrode and the lower electrode, and the liquid crystal layer is sandwiched between them; Microstrip lines and resonant cavities are disposed in the upper non-glass dielectric layer and the lower non-glass dielectric layer; the microstrip lines and resonant cavities correspond to the transmission structure. The coupling assembly includes a first hook arm and a second hook arm; wherein the first hook arm is located in the lower electrode and a first dipole is disposed therein; the second hook arm is located in the upper electrode and a second dipole is disposed therein.
2. The liquid crystal phased array signal transmission device according to claim 1, characterized in that, The first hook-shaped arm includes a first protrusion and a first metal arm; wherein the first metal arm is L-shaped, and the top end of the first protrusion is connected to the first metal arm.
3. The liquid crystal phased array signal transmission device according to claim 1, characterized in that, The second hook-shaped arm includes a second protrusion and a second metal arm; wherein the second protrusion is rectangular, the second metal arm is L-shaped, and the second protrusion is connected to the second metal arm through one end of the rectangle.
4. The liquid crystal phased array signal transmission device according to claim 2, characterized in that, The first hook-shaped arm also includes a surrounding metal layer, which has a rectangular hole structure. The bottom of the first protrusion is connected to the surrounding metal layer, and both the first protrusion and the first metal arm are disposed within the surrounding metal layer.
5. The liquid crystal phased array signal transmission device according to claim 1, characterized in that, The metal layer comprises: a top metal layer, a middle and upper metal layer, a middle and lower metal layer, and a bottom metal layer; The top metal ground layer is disposed on top of the upper non-glass dielectric layer; The upper metal layer is disposed between the upper glass layer and the upper non-glass dielectric layer; The middle and lower metal layer is disposed between the lower glass layer and the lower non-glass dielectric layer; The underlying metallic layer is located at the bottom of the lower non-glass dielectric layer.
6. The liquid crystal phased array signal transmission device according to claim 1, characterized in that, The resonant cavity is composed of a plurality of metal vias connected to the metal layer, and the resonant region enclosed by the metal vias corresponds to the transmission structure.
7. A phased array antenna, characterized in that, The phased array antenna is provided with a liquid crystal phased array signal transmission device as described in any one of claims 1 to 6.
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