High-integration low-profile missile-borne phased-array antenna

Abstract

The invention relates to the technical field of active phased-array antennas, in particular to a high-integration low-profile missile-borne phased-array antenna, which comprises an integrated front-end module, an integrated composite cold plate, a power supply and wave control module and a radio frequency comprehensive processing module, the integrated front-end module, the integrated composite cold plate, the power supply and wave control module and the radio frequency comprehensive processing module are arranged in a stacked mode from top to bottom in a tile type framework, the integrated front-end module and the power supply and wave control module conduct heat to the integrated composite cold plate, and the radio frequency comprehensive processing module is installed on the power supply and wave control module. And the heat is indirectly conducted to the integrated composite cold plate. The design of isomorphic integration and heterogeneous layering is adopted, the system integration degree is improved, and the electromagnetic compatibility risk is reduced; a structural and thermal control multifunctional integrated design is adopted, so that low profile, high reliability and high stability are realized; meanwhile, an integrated composite cold plate capable of passing liquid and storing energy in a phase change mode is adopted, and the cold plate has the active heat dissipation capacity and the passive heat dissipation capacity at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of active phased array antennas, and in particular to a highly integrated low-profile missile-borne phased array antenna. Background Art

[0002] As an important component of the missile-borne seeker of the active phased array system, the phased array antenna has the characteristics of high transmission power, compact structure layout, high heat flux density, etc., and needs to be able to detect and track targets more reliably in a complex electromagnetic environment. In order to obtain better target resolution, high frequency bands such as Ku and millimeter waves are usually used, which makes the channel spacing very small, the entire antenna structure layout is compact, the density of each component is extremely high, and the heat flux density is also extremely large, but the resulting thermal design resources are very limited. Usually, the thermal design of the seeker needs to solve both the transient heat dissipation problem of short-term operation during flight, and the steady-state heat dissipation problem of long-term stable operation during long-term debugging, testing, and maintenance on the ground.

[0003] The current phased array antennas have the following main shortcomings:

[0004] 1) Due to the compact structure and extremely high density of components, traditional heat dissipation solutions are difficult to effectively handle the huge amount of heat generated. Especially during flight, the transient heat dissipation demand is in sharp contrast to the steady-state heat dissipation demand during long-term work on the ground, which increases the complexity of thermal design.

[0005] 2) Electromagnetic compatibility (EMC) issues: As the frequency increases, the risk of electromagnetic interference also increases. The compact structure layout further exacerbates this problem, resulting in a decrease in the overall reliability of the antenna. Summary of the invention

[0006] The present invention provides a highly integrated, low-profile missile-borne phased array antenna, which adopts a homogeneous integrated and heterogeneous layered design to improve system integration and reduce electromagnetic compatibility risks; adopts a structural and thermal control multifunctional integrated design to achieve low profile, high reliability and high stability; vertical blind plugging is adopted between the functional layers of the antenna to achieve the shortest distance signal interconnection, thereby improving installation convenience and maintenance security; at the same time, an integrated composite cold plate that can pass liquid and phase change energy storage is adopted, and the cold plate has the ability of active and passive heat dissipation.

[0007] In order to achieve the purpose of the present invention, the technical scheme adopted is: a highly integrated, low-profile missile-borne phased array antenna, including an integrated front-end module, an integrated composite cold plate, a power supply and wave control module and a radio frequency integrated processing module. The integrated front-end module, the integrated composite cold plate, the power supply and wave control module and the radio frequency integrated processing module are stacked from top to bottom in a tile-like architecture. The radio frequency integrated processing module receives the radio frequency signal from the external signal source to generate a radio frequency excitation signal and sends it to the integrated front-end module. The integrated front-end module generates a radio frequency radiation signal to realize the transmission of the radio frequency signal; the integrated front-end module receives the echo signal and sends it to the radio frequency integrated processing module after processing. The radio frequency integrated processing module processes the beam signal to realize the reception of the radio frequency signal; the integrated front-end module and the power supply and wave control module both transfer heat to the integrated composite cold plate. The radio frequency integrated processing module is installed on the power supply and wave control module to indirectly transfer heat to the integrated composite cold plate.

[0008] As an optimization scheme of the present invention, the integrated front-end module includes an antenna unit, an analog four TR, a fixed J63A connector 1, an SMP connector 1 and a multilayer board. The antenna unit is a microstrip patch antenna, which is integrated on the surface of the multilayer board. The analog four TR, the fixed J63A connector 1 and the SMP connector 1 are all connected to the other side of the antenna side of the multilayer board. The fixed J63A connector 1 and the SMP connector 1 are the external interfaces of the integrated front-end module.

[0009] As an optimization solution of the present invention, the integrated composite cold plate includes a heat dissipation boss layer close to the integrated front-end module, an energy storage layer in the middle, a liquid cooling layer on the back and a water joint, and the liquid cooling layer conducts heat through the water joint.

[0010] As an optimization solution of the present invention, the integrated composite cold plate also includes a round hole 1 and a square hole, the SMP connector 1 passes through the round hole 1 to interconnect with the power supply and the wave control module, and the fixed J63A connector 1 passes through the square hole to interconnect with the power supply and the wave control module.

[0011] As an optimization solution of the present invention, the power supply and wave control module includes a floating J63A connector, a floating J30J connector, a fixed J30J connector 1 and a shell 1. The floating J63A connector, the floating J30J connector and the fixed J30J connector 1 are all installed on the shell 1. The floating J63A connector is interconnected with the fixed J63A connector 1 through a square hole. The fixed J30J connector 1 is used to receive external signals. The floating J30J connector is interconnected with the radio frequency integrated processing module.

[0012] As an optimization solution of the present invention, the power supply and wave control module further includes a circular hole 2.

[0013] As an optimization solution of the present invention, the radio frequency integrated processing module includes a shell 2, an SMP connector 2, a fixed J30J connector 2 and an SMP connector 3 all installed on the shell 2, the SMP connector 2 is used to receive external signals, the fixed J30J connector 2 is interconnected with the floating J30J connector, and the SMP connector 3 is interconnected with the SMP connector 1 through the circular hole 2 and the circular hole 1 via the KK connector.

[0014] As an optimization scheme of the present invention, the external wave control instructions and the external power supply are input to the power supply and wave control module through the fixed J30J connector 1. The wave control instructions are converted into phase data through the FPGA calculation, and enter the integrated front-end module through the floating J63A connector to provide the wave control instructions to the analog four TRs. At the same time, it enters the RF integrated processing module through the floating J30J connector to provide it with control signals. After the external power supply is transformed and stabilized by the power supply and wave control module, it enters the integrated front-end module through the floating J63A connector to power it, and at the same time, it enters the RF integrated processing module through the floating J30J connector to power it.

[0015] The present invention has positive effects: 1) The present invention adopts a homogeneous synthesis and heterogeneous layered design to improve system integration and reduce electromagnetic compatibility risks;

[0016] 2) The present invention adopts a multifunctional integrated design of structure and thermal control to achieve low profile, high reliability and high stability;

[0017] 3) Vertical blind plugging is adopted between each functional layer of the antenna of the present invention to realize the shortest distance signal interconnection, thereby improving installation convenience and maintenance security;

[0018] 4) The present invention adopts an integrated composite cold plate that can pass liquid and store phase change energy, and the cold plate has the ability of active and passive heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0020] Figure 1 It is a schematic diagram of the system architecture of the present invention;

[0021] Figure 2 It is a schematic diagram of the integrated front-end module architecture of the present invention;

[0022] Figure 3 It is a schematic diagram of the multilayer circuit stacking of the present invention;

[0023] Figure 4 It is a structural cross-sectional view of the present invention;

[0024] Figure 5 It is a structural explosion diagram of the present invention;

[0025] Figure 6 The 17GHz receiving azimuth -45 degree scanning pattern of the present invention;

[0026] Figure 7 The 17GHz transmission azimuth +45 degree scanning pattern of the present invention;

[0027] Among them: 1. Integrated front-end module; 11. Antenna unit; 12. Analog four TRs; 13. Fixed J63A connector 1; 14. SMP connector 1; 15. Multilayer board; 2. Integrated composite cold plate; 21. Water joint; 22. Round hole 1; 23. Square hole; 24. Heat dissipation boss layer; 25. Energy storage layer; 26. Liquid cooling layer; 3. Power supply and wave control module; 31. Floating J63A connector; 32. Round hole 2; 33. Floating J30J connector; 34. Fixed J30J connector 1; 35. Shell 1; 4. RF integrated processing module; 41. Shell 2; 42. SMP connector 2; 43. Fixed J30J connector 2; 44. SMP connector 3; 5. KK connector. DETAILED DESCRIPTION

[0028] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] like Figure 1 As shown, the present invention discloses a highly integrated, low-profile missile-borne phased array antenna, comprising: an integrated front-end module 1, an integrated composite cold plate 2, a power supply and wave control module 3, a radio frequency integrated processing module 4, etc., which are stacked in a tile-like architecture.

[0030] like Figure 2 As shown, the integrated front-end module is composed of a multilayer board 15, an antenna unit 11, an analog quad TR 12, a fixed J63A connector 1, and an SMP connector 1. Figure 3 As shown, the multilayer board 15 adopts high-density multilayer board mixed pressure integration technology, and based on the multilayer mixed pressure buried resistor technology and high-density vertical interconnection technology PCB process, a high-integration integrated design is achieved, and the low profile and light weight of the phased array antenna are achieved. The antenna unit 11 selects the microstrip patch form with the advantages of low profile, low cost, and light weight. At the same time, the microstrip patch antenna adopts a planar printing process, which is easy to integrate on the surface of the multilayer board. Simulate four TRs representing four-way transmit-receive switches (Transmit-Receive Switch)), fix J63A connector 1 and SMP connector 1 to the other side surface of the antenna side of the multilayer board 15, and fix J63A connector 1 and SMP connector 1 as the external interface of the integrated front-end module.

[0031] like Figure 4As shown, the integrated composite cold plate 2 is composed of three functional layers, namely, the heat dissipation boss layer 24 close to the integrated front-end module, the energy storage layer 25 in the middle and the liquid cooling layer 26 on the back, to achieve a thermal control compatible design - a combination of precise passive heat dissipation and high-efficiency indirect liquid cooling type active heat dissipation. The liquid cooling layer 26 is interconnected with the outside world through a water joint 21. In the working state, the heat sink transient heat storage technology is adopted, and the latent heat of the energy storage layer 25 is used to passively store heat dissipation to solve the problem of excessive temperature rise in a short time; in the test state, the liquid cooling active heat dissipation technology with high heat dissipation efficiency and good reliability is adopted, and the liquid cooling layer 26 is used to export a large amount of heat from the system through the water joint to meet the continuous long-term testing requirements. The integrated composite cold plate is provided with a round hole 1 and a square hole 23, which facilitates the KK connector 5 and the floating J63A connector 31 to pass through and interconnect with the SMP connector 1 and the fixed J63A connector 1 on the integrated front-end module 1.

[0032] like Figure 5 As shown, the power supply and wave control module consists of a housing 1, and a floating J63A connector 31, a floating J30J connector 33, and a fixed J30J connector 1 installed on the housing 1. A round hole 2 is opened on the housing 1 to facilitate the KK connector 5 to pass through and interconnect with the SMP connector 1 on the integrated front-end module. The floating J63A connector 31 passes through the square hole 23 to interconnect with the fixed J63A connector 1 on the integrated front-end module. The fixed J30J connector 1 is used for interconnection with external signals.

[0033] The RF integrated processing module consists of a housing 2, and an SMP connector 2, a fixed J30J connector 2, and an SMP connector 3 installed on the housing 2. The SMP connector 2 is used for interconnection with external signals, the fixed J30J connector 2 is blindly plugged with the floating J30J connector, and the SMP connector 3 is interconnected with the SMP connector 1 on the integrated front-end module through the round holes 1 and 2 via the KK connector 5.

[0034] The external wave control command and the external power supply are input to the power supply and wave control module 3 through the fixed J30J connector 1. The wave control command is converted into phase data by FPGA calculation, and enters the integrated front-end module 1 through the floating J63A connector to provide the wave control command to the analog four TR on the integrated front-end module 1, and enters the RF integrated processing module 4 through the floating J30J connector to provide it with a control signal; after the external power supply is transformed and stabilized by the power module, it enters the integrated front-end module 1 through the floating J63A connector to supply power to it, and enters the RF integrated processing module 4 through the floating J30J connector to supply power to it.

[0035] The RF signal from the external signal source enters the RF integrated processing module 4 from the SMP connector 2, generates four RF excitation signals, and the SMP connector 3 enters the integrated front-end module 1 through the KK connector 5. The analog four TRs on the integrated front-end module 1 generate corresponding RF radiation signals for the antenna unit, thereby realizing the transmission of RF signals.

[0036] The integrated front-end module receives the echo signal through the antenna unit 11, and after analog four-TR amplification and synthesis, it enters the RF integrated processing module 4 through the SMP connector 1 and the KK connector 5, and forms the final required combined beam signal, azimuth difference beam signal and elevation difference beam signal inside the RF integrated processing module 4, thereby realizing the reception of RF signals.

[0037] The integrated composite cold plate 2 serves as the internal heat sink of the missile-borne phased array antenna and is the terminal for the heat flow of each component. The analog four TR12 on the integrated front-end module 1 conducts heat to the integrated composite cold plate 2 by directly contacting the heat dissipation boss layer 24; the power supply and wave control module 3 conducts heat to the integrated composite cold plate 2 by being directly installed on the liquid cooling layer 26; the RF integrated processing module 4 is installed on the power supply and wave control module 3, and indirectly conducts heat to the integrated composite cold plate 2 through the shell 1.

[0038] like Figure 6 , Figure 7 As shown, it can be seen that there is no obvious deterioration in the transmission and reception patterns, and a large-angle scanning of plus or minus 45 degrees can be achieved.

[0039] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A highly integrated, low-profile missile-borne phased array antenna, characterized in that: The invention comprises an integrated front-end module (1), an integrated composite cold plate (2), a power supply and wave control module (3) and a radio frequency integrated processing module (4), wherein the integrated front-end module (1), the integrated composite cold plate (2), the power supply and wave control module (3) and the radio frequency integrated processing module (4) are stacked from top to bottom in a tile-type architecture, wherein the radio frequency integrated processing module (4) receives a radio frequency signal from an external signal source to generate a radio frequency excitation signal and sends it to the integrated front-end module (1), and the integrated front-end module (1) generates a radio frequency radiation signal to transmit the radio frequency signal; the integrated front-end module (1) receives an echo signal and processes it and sends it to the radio frequency integrated processing module (4), and the radio frequency integrated processing module (4) processes it to obtain a beam signal to receive the radio frequency signal; the integrated front-end module (1) and the power supply and wave control module (3) both transfer heat to the integrated composite cold plate (2), and the radio frequency integrated processing module (4) is installed on the power supply and wave control module (3) to indirectly transfer heat to the integrated composite cold plate (2).

2. The highly integrated, low-profile missile-borne phased array antenna according to claim 1, characterized in that: The integrated front-end module (1) comprises an antenna unit (11), an analog four TR (12), a fixed J63A connector 1 (13), an SMP connector 1 (14) and a multilayer board (15); the antenna unit (11) is a microstrip patch antenna, which is integrated on the surface of the multilayer board (15); the analog four TR (12), the fixed J63A connector 1 (13) and the SMP connector 1 (14) are all connected to the other side of the antenna side of the multilayer board (15); the fixed J63A connector 1 (13) and the SMP connector 1 (14) are external interfaces of the integrated front-end module (1).

3. The highly integrated, low-profile missile-borne phased array antenna according to claim 2, characterized in that: The integrated composite cold plate (2) comprises a heat dissipation boss layer (24) close to the integrated front-end module (1), an energy storage layer (25) in the middle, a liquid cooling layer (26) on the back side, and a water joint (21), wherein the liquid cooling layer (26) conducts heat away through the water joint (21).

4. The highly integrated, low-profile missile-borne phased array antenna according to claim 3, characterized in that: The integrated composite cold plate (2) further comprises a round hole 1 (22) and a square hole (23); the SMP connector 1 (14) passes through the round hole 1 (22) to be interconnected with the power supply and the wave control module (3); and the fixed J63A connector 1 (13) passes through the square hole (23) to be interconnected with the power supply and the wave control module (3).

5. The highly integrated, low-profile missile-borne phased array antenna according to claim 4, characterized in that: The power supply and wave control module (3) comprises a floating J63A connector (31), a floating J30J connector (33), a fixed J30J connector 1 (34) and a housing 1 (35). The floating J63A connector (31), the floating J30J connector (33) and the fixed J30J connector 1 (34) are all mounted on the housing 1 (35). The floating J63A connector (31) passes through the square hole (23) to be interconnected with the fixed J63A connector 1 (13). The fixed J30J connector 1 (34) is used to receive external signals. The floating J30J connector (33) is interconnected with the radio frequency integrated processing module (4).

6. The highly integrated, low-profile missile-borne phased array antenna according to claim 5, characterized in that: The power supply and wave control module (3) also includes a circular hole 2 (32).

7. The highly integrated, low-profile missile-borne phased array antenna according to claim 6, characterized in that: The radio frequency integrated processing module (4) includes a housing 2 (41), an SMP connector 2 (42), a fixed J30J connector 2 (43) and an SMP connector 3 (44) all mounted on the housing 2 (41), the SMP connector 2 (42) being used to receive external signals, the fixed J30J connector 2 (43) being interconnected with the floating J30J connector (33), and the SMP connector 3 (44) being interconnected with the SMP connector 1 (14) through the circular hole 2 (32) and the circular hole 1 (22) via the KK connector (5).

8. The highly integrated, low-profile missile-borne phased array antenna according to claim 7, characterized in that: The external wave control instructions and external power supply are input to the power supply and wave control module (3) through the fixed J30J connector 1 (34); the wave control instructions are converted into phase data by FPGA calculation, and enter the integrated front-end module (1) through the floating J63A connector (31), providing the wave control instructions to the analog four TR (12); at the same time, they enter the radio frequency integrated processing module (4) through the floating J30J connector (33) to provide it with a control signal; after the external power supply is transformed and stabilized by the power supply and wave control module (3), it enters the integrated front-end module (1) through the floating J63A connector (31) to supply power to it, and at the same time, it enters the radio frequency integrated processing module (4) through the floating J30J connector (33) to supply power to it.

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