A packaging structure for a chip circuit board

Abstract

The present invention discloses a packaging structure for a chip circuit board, which relates to the technical field of chip circuit board equipment and includes a packaging cover. It further includes: an installation base is installed at the bottom of the packaging cover. The beneficial effects of the present invention are as follows: The present invention is provided with a packaging cover, a top mounting plate and a chip circuit board, and is repositioned through a limit pin. The wiring terminals and wiring pins are used to assist the normal use of the chip circuit board. The top mounting plate and the second heat dissipation metal plate are used to assist the temperature conduction inside the packaging cover to achieve an auxiliary heat dissipation effect; The present invention is provided with a support bottom plate, and multiple heat dissipation treatments are carried out through the second heat dissipation metal plate, the first heat dissipation metal plate and the heat dissipation fan, which prolongs the service life of the internal components. At the same time, it is convenient to adjust the installation height. When it needs to be in a sealed state, the packaging treatment is carried out through the cooperation of the two support bottom plates and the second installation grooves reserved in the two installation bottom plates with the insertion plates, which improves the use flexibility of the overall equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of chip circuit board equipment, and specifically relates to a packaging structure for a chip circuit board. Background Art

[0002] With the development of technology, many intelligent electronic products have emerged around us, enriching our lives and improving the quality of life. These electronic products mostly work by controlling the internal chips. A chip is an electronic product with a relatively small volume and a complex structure. To be used for a long time, it needs to be packaged and protected. Chip packaging technology is a process technology that wraps the chip to prevent the chip from contacting the outside world and protect the chip body from damage by the outside world. Impurities and bad gases in the air, and even water vapor, will corrode the precise circuits on the chip, thereby causing a decline in electrical performance. Different packaging technologies vary greatly in manufacturing processes and techniques, and also play a crucial role in the performance of the memory chip itself after packaging.

[0003] Chinese Patent Publication No. CN 209963048 U discloses a packaging structure for a chip circuit board, including a sealing colloid. A substrate is arranged inside the sealing colloid. A chip body is arranged on the top of the substrate. Metal pin bodies are mounted on both sides of the sealing colloid corresponding to the position of the chip body. And an electrical connection is achieved between the metal pin body and the chip body through a lead wire. A heat dissipation groove is opened on the front surface of the sealing colloid corresponding to the position of the chip body. A cooling pipe is arranged in the heat dissipation groove. In this utility model, through the mutual cooperation among the heat dissipation groove, the cooling pipe, the elastic bag, the anti-collision strip and the silica gel block, under the combined action of the heat dissipation groove and the cooling pipe, the heat dissipation capacity of the sealing colloid can be further improved. The elastic bag has a shock absorption and isolation function, slowing down the impact of external force on the substrate through the sealing colloid, avoiding the loosening of the chip body due to external force impact, and extending the service life.

[0004] However, the following problems still exist in the above solution: Only a single method is used to assist the heat dissipation of the chip circuit board, resulting in a poor heat dissipation efficiency. At the same time, when this heat dissipation device fails, it will affect the normal heat dissipation of the chip circuit board, thereby reducing the service life of the device. The operation is relatively cumbersome when switching from the overall packaging state to the maintenance state, it is difficult to quickly disassemble and assemble the device, the normal maintenance cycle is lengthened, and the height of the device cannot be finely adjusted according to the installation and use scenarios required, and the overall use flexibility is low, unable to meet the normal use requirements. Therefore, the present invention needs to design a packaging structure for a chip circuit board to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a packaging structure for a chip circuit board to solve the problems raised in the above background art.

[0006] To achieve the above object, the present invention provides the following technical solution: A packaging structure for a chip circuit board, including a packaging cover, further including:

[0007] An installation base is installed at the bottom of the packaging cover;

[0008] A battery pack is arranged inside the packaging cover, and a chip circuit board extending into the interior of the installation base is installed below the battery pack;

[0009] A collection box is installed inside the installation base, a guide plate is installed on one side of the collection box, an installation sleeve is installed below the collection box, a connection sleeve is installed at one end of the installation sleeve, a valve is installed on the outer side of the connection sleeve, and a feed sleeve is installed at the other end of the installation sleeve. The installation sleeve is used to collect the leaked liquid inside the packaging cover and the installation base;

[0010] Symmetrically distributed support and packaging mechanisms are installed at the bottom of the installation base, and the support and packaging mechanisms are used to support the packaging cover and the installation base.

[0011] As a preferred embodiment of the present invention, an installation cavity for installing the collection box is provided inside the installation base. A plurality of equidistantly distributed filter holes are provided at the top of the collection box. A guide groove for cooperating with the guide plate is provided on one side of the collection box. The guide groove is used to collect the leaked liquid until it enters the interior of the collection box. The guide groove can be designed as an inclined structure to reduce the situation of residual liquid staying.

[0012] As a preferred embodiment of the present invention, the support and packaging mechanism includes a support bottom plate and an installation bottom plate. Symmetrically distributed installation bottom plates are installed at the bottom of the installation base. Support bottom plates are installed below both of the two installation bottom plates. Symmetrically distributed first positioning bolts that extend to the inner wall of the installation base are threadedly connected to the bottoms of both of the two installation bottom plates. The support and packaging mechanism and the installation base are fixedly installed through the first positioning bolts, which facilitates quick disassembly and assembly during maintenance and reduces the labor intensity of manual maintenance.

[0013] As a preferred embodiment of the present invention, symmetrically distributed support columns are fixedly connected to the tops of both of the two support bottom plates. A sliding support rod is slidably connected to the top of each support column. One end of the top of each sliding support rod is fixedly connected to the bottom of the corresponding support column.

[0014] As a preferred embodiment of the present invention, second positioning bolts are threadedly connected inside both of the support bottom plates. The second positioning bolts are located on one side of the support columns. Second installation grooves are provided on one side of the two support bottom plates that are close to each other and on one side of the two installation bottom plates that are close to each other. Insert plates are installed inside the two second installation grooves on the same side. The insert plates are used to encapsulate the bottom of the encapsulation cover and the installation base. The overall equipment is positioned and installed through the cooperation of the support bottom plates and the second positioning bolts, improving the stability during overall use. The height of the encapsulation cover can be adjusted according to the different required installation heights in the use scenario. Remove the limit pin, pull out the sliding support rod upward from inside the support column for height adjustment until the required height, and then reposition it through the limit pin to meet the requirements.

[0015] As a preferred embodiment of the present invention, a conveying inner pipe is installed inside the installation sleeve. One end of the conveying inner pipe is provided with a connecting channel extending into the feeding sleeve. A buzzer is fixedly connected to one side of the installation base; the liquid level sensor is used to monitor the leakage of liquid inside the connecting channel in real time and give an early warning in time through the external buzzer when the set value is reached.

[0016] As a preferred embodiment of the present invention, an external pipe is installed on one side of the feeding sleeve. An emergency discharge pipe extending into the installation sleeve is installed inside the feeding sleeve. A sealing sleeve is sleeved between the installation sleeve and the connecting sleeve. A connecting pipe is installed between the feeding sleeve and the collection box. The collection box and the feeding sleeve are connected through the connecting pipe, so that the leaked liquid collected by the collection box is conveyed into the installation sleeve for collection, while assisting in the early warning process, reducing potential safety hazards and facilitating timely cleaning by workers.

[0017] As a preferred embodiment of the present invention, an installation rack is installed inside the encapsulation cover and below the battery pack. A cooling fan is installed inside the installation rack. First installation grooves are provided at equal intervals on the inner wall of the encapsulation cover. A plurality of equally spaced first heat dissipation metal plates are fixedly connected to both sides of the encapsulation cover. The positions of the first heat dissipation metal plates match those of the first installation grooves. The first heat dissipation metal plates and the first installation grooves are used to assist in the heat dissipation treatment inside the encapsulation cover. The cooling fan is used for auxiliary internal heat dissipation treatment. The cooling fan is a two-way fan, and the blowing direction can be adjusted according to the requirements during use, improving the flexibility during use.

[0018] As a preferred embodiment of the present invention, a plurality of equally spaced metal patches are installed on the outer side of the battery pack. A plurality of equally spaced wiring terminals are installed on the top of the chip circuit board. A plurality of equally spaced wiring pins are installed on the bottom of the chip circuit board. The wiring terminals and the wiring pins are used to assist the normal use of the chip circuit board.

[0019] As a preferred embodiment of the present invention, a top mounting plate is fixedly connected to the top of the encapsulation cover. A plurality of equally spaced second heat dissipation metal plates are mounted on the top of the top mounting plate. One end of the bottom of each second heat dissipation metal plate extends into the top mounting plate and is close to the battery pack. The top mounting plate and the second heat dissipation metal plates are used to assist in temperature conduction inside the encapsulation cover to achieve an auxiliary heat dissipation effect.

[0020] As a preferred embodiment of the present invention, a wireless signal transceiver is mounted on the outside of the mounting base. The buzzer is located on one side of the wireless signal transceiver. The buzzer is connected to the mounting base through a positioning bolt. A main control board is fixedly connected inside the wireless signal transceiver. A control chip is fixedly connected to the outside of the main control board. The heat dissipation fan, battery pack, wireless signal transceiver, buzzer, liquid level sensor, valve, and chip circuit board are all electrically connected to the control chip.

[0021] As a preferred embodiment of the present invention, the control chip is used to control the operation of the heat dissipation fan, battery pack, wireless signal transceiver, buzzer, liquid level sensor, valve, and chip circuit board, realizing the unified management of power equipment.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] 1. The present invention is provided with an encapsulation cover, a mounting base, a top mounting plate, and a chip circuit board. When in use, a guiding groove for cooperating with the guiding plate is provided on one side of the collection box. The guiding groove is used to collect the leaked liquid until it enters the collection box. The guiding groove can be designed as an inclined structure to reduce the situation of residual liquid staying. The liquid level sensor is used to monitor the leakage liquid situation inside the connection channel in real time. When the set value is reached, an early warning is timely processed through an external buzzer. A sealing sleeve is installed between the feeding sleeve and the collection box to seal and connect the collection box and the feeding sleeve. The overall equipment is positioned and installed through the cooperation of the support bottom plate and the second positioning bolt, improving the stability during overall use. The height of the encapsulation cover can be adjusted according to the different required installation heights in the use scenario. Remove the limit pin, pull out the sliding support rod upward from the support column for height adjustment until the required height, and then reposition it through the limit pin to meet the requirements. The wiring terminal and the wiring pin are used to assist the normal use of the chip circuit board. The top mounting plate and the second heat dissipation metal plates are used to assist in temperature conduction inside the encapsulation cover to achieve an auxiliary heat dissipation effect;

[0024] 2. The present invention is provided with a support base plate. During actual installation, the overall structure is installed in the order of the top mounting plate, the encapsulation cover, the mounting base, and the two support base plates. The battery pack, the mounting rack, and the chip circuit board are sequentially placed inside the encapsulation cover for overall installation. When in use, the guide plate inside the mounting base guides the leaked liquid to flow into the collection box, and is transported to the inside of the mounting sleeve through the collection box. The connection channel monitors the leakage flow rate in real time. When it exceeds the set value, an early warning is processed through the external buzzer; multiple heat dissipation treatments are carried out through the second heat dissipation metal plate, the first heat dissipation metal plate, and the heat dissipation fan, extending the service life of the internal components and meeting the requirements during use. The overall is assisted in positioning and installation through the cooperation of the support and encapsulation mechanism, and at the same time, it is convenient to adjust the installation height. When it needs to be in a sealed state, the two support base plates and the second installation grooves reserved inside the two mounting base plates cooperate with the insertion plates for encapsulation treatment, improving the flexibility of use of the overall device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 FIG.

[0026] Figure 2 is a three-dimensional structural diagram of the encapsulation structure of the chip circuit board provided by an embodiment of the present invention in one direction;

[0027] Figure 3 FIG.

[0028] Figure 4 is a three-dimensional structural diagram of the encapsulation structure of the chip circuit board provided by an embodiment of the present invention in another direction;

[0029] Figure 5 FIG.

[0030] Figure 6 is an enlarged three-dimensional structural diagram of the mounting base provided by an embodiment of the present invention in one direction;

[0031] Figure 7 FIG.

[0032] Figure 8 is an enlarged internal structural diagram of the mounting sleeve provided by an embodiment of the present invention;

[0033] Figure 9 is Figure 3 an enlarged structural diagram of the position A in

[0034] Figure 10 is Figure 3Schematic diagram of the enlarged structure at B in the [Chinese context];

[0035] Figure 11 This is the enlarged three - dimensional structure schematic diagram of the installation base provided by the embodiment of the present invention from another direction.

[0036] The markings in the figure are as follows:

[0037] 1. Encapsulation cover; 11. Installation rack; 12. Cooling fan; 13. First installation groove; 14. Battery pack; 15. Metal patch; 16. First heat dissipation metal plate; 17. Wireless signal transceiver; 18. Buzzer;

[0038] 2. Installation base; 21. Installation inner cavity; 22. Collection box; 221. Guide groove; 23. Installation sleeve; 231. Conveying inner pipe; 232. Connection channel; 233. Liquid level sensor; 234. Connection pipe; 235. Delivery port; 24. Sealing sleeve; 25. Feeding sleeve; 26. External connection pipe; 27. Connection sleeve; 28. Valve; 29. Emergency discharge pipe;

[0039] 3. Support bottom plate; 31. Installation bottom plate; 32. Support column; 33. Sliding support rod; 34. Limit pin; 35. First positioning bolt; 36. Second positioning bolt; 37. Second installation groove;

[0040] 4. Top installation plate; 41. Second heat dissipation metal plate;

[0041] 5. Chip circuit board; 51. Wiring terminal; 52. Wiring pin;

[0042] 6. Guide plate. Detailed implementation manners

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and illustrated herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0044] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0045] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] The present invention will be further described below with reference to the drawings and specific embodiments.

[0047] Please refer to Figures 1 to 11 As shown, the present invention provides a technical solution: a packaging structure for a chip circuit board, including a packaging cover 1, and further including: an installation base 2 is installed at the bottom of the packaging cover 1; a battery pack 14 is arranged inside the packaging cover 1, and a chip circuit board 5 extending into the interior of the installation base 2 is installed below the battery pack 14; a collection box 22 is installed inside the installation base 2, a guide plate 6 is installed on one side of the collection box 22, an installation sleeve 23 is installed below the collection box 22, a connection sleeve 27 is installed at one end of the installation sleeve 23, a valve 28 is installed on the outer side of the connection sleeve 27, and a feed sleeve 25 is installed at the other end of the installation sleeve 23. The installation sleeve 23 is used to collect the leaked liquid inside the packaging cover 1 and the installation base 2; symmetrically distributed support and packaging mechanisms are installed at the bottom of the installation base 2, and the support and packaging mechanisms are used to support the packaging cover 1 and the installation base 2. The top of the packaging cover 1 is fixedly connected to a top mounting plate 4, and a plurality of second heat dissipation metal plates 41 are installed at equal intervals on the top of the top mounting plate 4. One end of the bottom of each second heat dissipation metal plate 41 extends into the top mounting plate 4 and is close to the battery pack 14.

[0048] A packaging structure for a chip circuit board provided by an embodiment of the present invention, when in use, the whole is installed in the order of the top mounting plate 4, the packaging cover 1, the mounting base 2 and the two support bottom plates 3. The battery pack 14, the mounting frame 11 and the chip circuit board 5 are sequentially placed inside the packaging cover 1 for overall installation. When in use, the guide plate 6 inside the mounting base 2 guides the leaked liquid to flow into the collection box 22, and is transported to the inside of the mounting sleeve 23 through the collection box 22. The connection channel 232 monitors the leakage flow rate in real time. When it exceeds the set value, early warning processing is carried out through the external buzzer 18. Multiple heat dissipation treatments are carried out through the second heat dissipation metal plate 41, the first heat dissipation metal plate 16 and the heat dissipation fan 12, which extends the service life of internal components and meets the requirements during use. The overall is assisted in positioning and installation through the cooperation of the support and packaging mechanism, and at the same time, it is convenient to adjust the installation height. When it needs to be in a sealed state, the second installation groove 37 reserved inside the two support bottom plates 3 and the two mounting bottom plates 31 cooperates with the plug board for packaging treatment, which improves the use flexibility of the overall device.

[0049] A packaging structure for a chip circuit board provided by an embodiment of the present invention, please refer to Figures 1 to 8 , an installation cavity 21 for installing and using the collection box 22 is opened inside the mounting base 2. A plurality of equally spaced filter holes are opened at the top of the collection box 22. A guide groove 221 for cooperating with the guide plate 6 is opened on one side of the collection box 22. The guide groove 221 is used to collect the leaked liquid until it enters the collection box 22. The guide groove 221 can be designed as an inclined structure to reduce the situation of residual liquid staying. A conveying inner pipe 231 is installed inside the mounting sleeve 23. One end of the conveying inner pipe 231 is installed with a connection channel 232 extending into the feeding sleeve 25. A buzzer 18 is fixedly connected to one side of the mounting base 2. The liquid level sensor 233 is used to monitor the leakage of liquid inside the connection channel 232 in real time. When it reaches the set value, early warning processing is carried out in time through the external buzzer 18. An external pipe 26 is installed on one side of the feeding sleeve 25. An emergency discharge pipe 29 extending into the mounting sleeve 23 is installed inside the feeding sleeve 25. The emergency discharge pipe 29 is used for auxiliary liquid discharge during maintenance; when not in use usually, a sealing plug is provided at the end of the emergency discharge pipe 29 to seal the emergency discharge pipe 29. A sealing sleeve 24 is sleeved between the mounting sleeve 23 and the connection sleeve 27. The sealing sleeve 24 is used for sealing connection between the connection sleeve 27 and the mounting sleeve 23 to achieve a sealing effect.

[0050] A packaging structure for a chip circuit board provided by an embodiment of the present invention. There is a connecting pipe 234 installed between the feeding sleeve 25 and the collecting box 22. Specifically, a conveying port 235 is provided on the feeding sleeve 234, and the conveying port 235 is connected to the inner conveying pipe 231. One end of the connecting pipe 234 is communicated with the conveying port. The collecting box 22 and the feeding sleeve 25 are connected through the connecting pipe 234, so that the leaked liquid collected by the collecting box 22 is conveyed into the installation sleeve 23 for collection, while assisting in early warning processing, reducing potential safety hazards, and facilitating timely cleaning by workers.

[0051] A packaging structure for a chip circuit board provided by an embodiment of the present invention. Please refer to Figures 1 to 4 , Figure 9 , the support packaging mechanism includes a support bottom plate 3 and an installation bottom plate 31. The bottom of the installation base 2 is installed with symmetrically distributed installation bottom plates 31. Below the two installation bottom plates 31 are installed support bottom plates 3. The bottoms of the two installation bottom plates 31 are both threadedly connected with symmetrically distributed first positioning bolts 35 that extend into the inner wall of the installation base 2. The support packaging mechanism and the installation base 2 are fixedly installed through the first positioning bolts 35, which facilitates quick disassembly and assembly during maintenance, reduces the labor intensity of manual maintenance. The tops of the two support bottom plates 3 are both fixedly connected with symmetrically distributed support columns 32. The tops of the support columns 32 are both slidably connected with sliding support rods 33. One side of each support column 32 is installed with a limit pin 34 for cooperating with the sliding support rod 33. One end of the top of the sliding support rod 33 is fixedly connected to the bottom of the corresponding support column 32. The interiors of the two support bottom plates 3 are both threadedly connected with second positioning bolts 36, and the second positioning bolts 36 are located on one side of the support columns 32.

[0052] A packaging structure for a chip circuit board provided by an embodiment of the present invention. Second installation grooves 37 are provided on the closer sides of the two support bottom plates 3 and the closer sides of the two installation bottom plates 31. Plugs are installed inside the two second installation grooves 37 on the same side. The plugs are used for packaging the bottom of the packaging cover 1 and the installation base 2. The overall device is positioned and installed through the cooperation of the support bottom plate 3 and the second positioning bolts 36, improving the stability during overall use. The height of the packaging cover 1 can be adjusted according to different requirements for the installation height in the use scenario. Remove the limit pin 34, pull the sliding support rod 33 upward from inside the support column 32 for height adjustment until the required height, and then reposition it through the limit pin 34 to meet the requirements.

[0053] A packaging structure for a chip circuit board provided by an embodiment of the present invention. Please refer to Figures 1 to 4 , Figure 10As shown, an installation frame 11 is installed inside the encapsulation cover 1 and below the battery pack 14. A heat dissipation fan 12 is installed inside the installation frame 11. A plurality of equally spaced first installation grooves 13 are formed in the inner wall of the encapsulation cover 1. A plurality of equally spaced first heat dissipation metal plates 16 are fixedly connected to both sides of the encapsulation cover 1.

[0054] For a chip circuit board encapsulation structure provided by an embodiment of the present invention, the positions of the first heat dissipation metal plates 16 and the first installation grooves 13 match. The first heat dissipation metal plates 16 and the first installation grooves 13 are used for auxiliary heat dissipation treatment inside the encapsulation cover 1. The heat dissipation fan 12 is used for auxiliary internal heat dissipation treatment. The heat dissipation fan 12 is a two-way fan, and the blowing direction can be adjusted according to requirements during use, improving the flexibility during use.

[0055] For a chip circuit board encapsulation structure provided by an embodiment of the present invention, please refer to Figures 1 to 11 As shown, a plurality of equally spaced metal patches 15 are installed on the outer side of the battery pack 14. A plurality of equally spaced wiring terminals 51 are installed on the top of the chip circuit board 5. A plurality of equally spaced wiring pins 52 are installed on the bottom of the chip circuit board 5. The wiring terminals 51 and the wiring pins 52 are used to assist the normal use of the chip circuit board 5. A top mounting plate 4 is fixedly connected to the top of the encapsulation cover 1. A plurality of equally spaced second heat dissipation metal plates 41 are installed on the top of the top mounting plate 4. One end of the bottom of each second heat dissipation metal plate 41 extends into the top mounting plate 4 and is close to the battery pack 14. The top mounting plate 4 and the second heat dissipation metal plates 41 are used for auxiliary temperature conduction inside the encapsulation cover 1 to achieve an auxiliary heat dissipation effect. A wireless signal transceiver 17 is installed on the outer side of the mounting base 2. The buzzer 18 is located on one side of the wireless signal transceiver 17. The buzzer 18 is connected to the mounting base 2 through a positioning bolt. A main control board is fixedly connected inside the wireless signal transceiver 17. A control chip is fixedly connected to the outer side of the main control board. The heat dissipation fan 12, the battery pack 14, the wireless signal transceiver 17, the buzzer 18, the liquid level sensor 233, the valve 28, and the chip circuit board 5 are all electrically connected to the control chip.

[0056] For a chip circuit board encapsulation structure provided by an embodiment of the present invention, the control chip is used to control the operation of the heat dissipation fan 12, the battery pack 14, the wireless signal transceiver 17, the buzzer 18, the liquid level sensor 233, the valve 28, and the chip circuit board 5, realizing the unified management of electrical equipment. The liquid level sensor 233 measures whether there is excessive liquid leakage inside the installation sleeve 23, converts it into a signal and sends it to the control chip. The control chip receives the signal and processes it, generating corresponding control signals according to the preset control algorithm.

[0057] A packaging structure for a chip circuit board provided by an embodiment of the present invention, when in use, a guide groove for cooperating with a guide plate is provided on one side of the collection box, and the guide groove is used to collect leaked liquid until it enters the interior of the collection box. The guide groove can be designed as an inclined structure to reduce the situation of residual liquid staying. The liquid level sensor is used to monitor the leakage of liquid inside the connection channel in real time, and when it reaches the set value, an early warning process is carried out in time through an external buzzer. A sealing sleeve is installed between the feeding sleeve and the collection box, and the collection box and the feeding sleeve are hermetically connected through the sealing sleeve. The overall device is positioned and installed through the cooperation of the support bottom plate and the second positioning bolt, improving the stability during overall use. The height of the packaging cover can be adjusted according to different requirements for the installation height in the use scenario. Remove the limit pin, pull out the sliding support rod upward from inside the support column for height adjustment until the required height, and then reposition it through the limit pin to meet the requirements. The wiring terminal and the wiring pin are used to assist the normal use of the chip circuit board, and the top mounting plate and the second heat dissipation metal plate are used to assist in heat conduction inside the packaging cover to achieve the effect of auxiliary heat dissipation.

[0058] A packaging structure for a chip circuit board provided by an embodiment of the present invention, during actual installation, the whole is installed in the order of the top mounting plate, the packaging cover, the mounting base and the two support bottom plates. The battery pack, the mounting rack and the chip circuit board are sequentially placed into the packaging cover and the interior for overall installation. When in use, the guide plate inside the mounting base guides the leaked liquid to flow into the collection box, and is transported to the inside of the mounting sleeve through the collection box. The connection channel monitors the leakage flow rate of the liquid in real time, and when it exceeds the set value, an early warning process is carried out through an external buzzer; multiple heat dissipation treatments are carried out through the second heat dissipation metal plate, the first heat dissipation metal plate and the heat dissipation fan, extending the service life of the internal components and meeting the requirements during use. The overall is assisted in positioning and installation through the cooperation of the support and packaging mechanism, and at the same time, it is convenient to adjust the installation height. When it needs to be in a sealed state, the packaging process is carried out through the cooperation of the two support bottom plates and the second installation grooves reserved inside the two installation bottom plates and the insertion plate, improving the use flexibility of the overall device.

[0059] The working principle of a packaging structure for a chip circuit board provided by an embodiment of the present invention is as follows:

[0060] When in use, a guide groove for cooperating with the guide plate 6 is provided on one side of the collection box 22, and the guide groove is used to collect leaked liquid until it enters the interior of the collection box 22. The guide groove can be designed as an inclined structure to reduce the situation of residual liquid staying;

[0061] The liquid level sensor 233 is used to monitor the leakage of liquid inside the connection channel 232 in real time, and when it reaches the set value, an early warning process is carried out in time through the external buzzer 18;

[0062] A connecting pipe 234 is installed between the feeding sleeve 25 and the collection box 22. The collection box 22 and the feeding sleeve 25 are connected through the connecting pipe 234, so that the leaked liquid collected by the collection box 22 is conveyed into the installation sleeve 23 for collection, while assisting in the early warning process, reducing potential safety hazards and facilitating timely manual cleaning.

[0063] The support and encapsulation mechanism and the installation base 2 are firmly installed through the first positioning bolt 35, which facilitates quick disassembly and assembly during maintenance and reduces the labor intensity of manual maintenance.

[0064] Second installation grooves 37 are formed on the sides of the two support bottom plates 3 and the installation bottom plate 31 close to each other. Plug plates are installed inside the two second installation grooves 37 on the same side, and the plug plates are used to encapsulate the bottom of the encapsulation cover 1 and the installation base 2.

[0065] The overall device is positioned and installed through the cooperation of the support bottom plate 3 and the second positioning bolt 36, which improves the stability during overall use. The height of the encapsulation cover 1 can be adjusted according to the different requirements for the installation height in the use scenario. Remove the limit pin 34, pull the sliding support rod 33 upward from inside the support column 32 for height adjustment until the required height, and then reposition it through the limit pin 34 to meet the requirements.

[0066] The terminal block 51 and the connection pins 52 are used to assist the normal operation of the chip circuit board 5. The top mounting plate 4 and the second heat dissipation metal plate 41 are used to assist in heat conduction inside the encapsulation cover 1 to achieve an auxiliary heat dissipation effect.

[0067] The position of the first heat dissipation metal plate 16 matches that of the first installation groove 13. The first heat dissipation metal plate 16 and the first installation groove 13 are used to assist in heat discharge inside the encapsulation cover 1. The heat dissipation fan 12 is used for auxiliary internal heat dissipation. The heat dissipation fan 12 is a two-way fan, and the blowing direction can be adjusted according to the requirements during use, which improves the flexibility during use.

[0068] The control chip is used to control the operation of the heat dissipation fan 12, the battery pack 14, the wireless signal transceiver 17, the buzzer 18, the liquid level sensor 233, the valve 28 and the chip circuit board 5, realizing the unified management of the power equipment.

[0069] The liquid level sensor 233 measures whether there is excessive leaked liquid inside the installation sleeve 23, converts it into a signal and sends it to the control chip. The control chip receives the signal and processes it, and generates corresponding control signals according to the preset control algorithm.

[0070] During actual installation, the whole is installed in the order of the top mounting plate 4, the encapsulation cover 1, the mounting base 2 and the two support bottom plates 3. The battery pack 14, the mounting bracket 11 and the chip circuit board 5 are sequentially placed inside the encapsulation cover 1 for overall installation. When in use, the guide plate 6 inside the mounting base 2 guides the leaked liquid to flow into the collection box 22, and is conveyed to the inside of the mounting sleeve 23 through the collection box 22. The connection channel 232 monitors the leakage flow rate in real time. When it exceeds the set value, an early warning is processed through the external buzzer 18. Multiple heat dissipation treatments are carried out through the second heat dissipation metal plate 41, the first heat dissipation metal plate 16 and the heat dissipation fan 12, which extends the service life of the internal components and meets the requirements during use. The overall is assisted in positioning and installation through the cooperation of the support and encapsulation mechanism, and at the same time, it is convenient to adjust the installation height. When it needs to be in a sealed state, the two support bottom plates 3 and the second installation grooves 37 reserved inside the two mounting bottom plates 31 cooperate with the insertion plates for encapsulation treatment, which improves the use flexibility of the overall device.

[0071] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging structure for a chip circuit board, comprising a packaging cover (1), characterized in that, Further included are: An installation base (2) is installed at the bottom of the encapsulation cover (1); A battery pack (14) is arranged inside the encapsulation cover (1), and a chip circuit board (5) is installed below the battery pack (14); A collection box (22) is installed inside the installation base (2), a guide plate (6) is installed on one side of the collection box (22), an installation sleeve (23) is installed below the collection box (22), a connection sleeve (27) is installed at one end of the installation sleeve (23), a valve (28) is installed on the outer side of the connection sleeve (27), and a feed sleeve (25) is installed at the other end of the installation sleeve (23). The installation sleeve (23) is used to collect the leaked liquid inside the encapsulation cover (1) and the installation base (2); Symmetrically distributed support and encapsulation mechanisms are installed at the bottom of the installation base (2), and the support and encapsulation mechanisms are used to support the encapsulation cover (1) and the installation base (2); An installation frame (11) is installed inside the encapsulation cover (1) and below the battery pack (14), a heat dissipation fan (12) is installed inside the installation frame (11), a plurality of equally spaced first installation grooves (13) are formed in the inner wall of the encapsulation cover (1), and a plurality of equally spaced first heat dissipation metal plates (16) are fixedly connected to both outer sides of the encapsulation cover (1); A top mounting plate (4) is fixedly connected to the top of the encapsulation cover (1), a plurality of equally spaced second heat dissipation metal plates (41) are installed on the top of the top mounting plate (4), and one end of the bottom of each second heat dissipation metal plate (41) extends into the top mounting plate (4) and is close to the battery pack (14).

2. The encapsulation structure of a chip circuit board according to claim 1, wherein: An installation cavity (21) for installing and using the collection box (22) is formed inside the installation base (2), a plurality of equally spaced filter holes are formed in the top of the collection box (22), and a guide groove (221) for cooperating with the guide plate (6) is formed on one side of the collection box (22).

3. The encapsulation structure of a chip circuit board according to claim 2, wherein: The support and encapsulation mechanism includes a support bottom plate (3) and an installation bottom plate (31). Symmetrically distributed installation bottom plates (31) are installed at the bottom of the installation base (2), support bottom plates (3) are installed below both of the installation bottom plates (31), and symmetrically distributed first positioning bolts (35) that extend into the inner wall of the installation base (2) are threadedly connected to the bottoms of both of the installation bottom plates (31).

4. The encapsulation structure of a chip circuit board according to claim 3, characterized in that: Two symmetrically distributed support columns (32) are fixedly connected to the top of both of the support bottom plates (3). A sliding support rod (33) is slidably connected to the top of each support column (32), and one end of the top of each sliding support rod (33) is fixedly connected to the bottom of the corresponding support column (32).

5. The encapsulation structure of a chip circuit board according to claim 4, wherein: Second positioning bolts (36) are threadedly connected to the interiors of both of the support bottom plates (3). The second positioning bolts (36) are located on one side of the support columns (32). Second installation grooves (37) are formed on the sides of both of the support bottom plates (3) close to each other and on the sides of both of the installation bottom plates (31) close to each other.

6. The encapsulation structure of a chip circuit board according to claim 2, characterized in that: Inside the installation sleeve (23), a conveying inner pipe (231) is installed. One end of the conveying inner pipe (231) is installed with a connecting channel (232) extending into the inside of the feeding sleeve (25). On one side of the installation base (2), a buzzer (18) is fixedly connected.

7. The encapsulation structure of a chip circuit board according to claim 6, characterized in that: On one side of the feeding sleeve (25), an external pipe (26) is installed. Inside the feeding sleeve (25), an emergency discharge pipe (29) extending into the inside of the installation sleeve (23) is installed.

8. The encapsulation structure of a chip circuit board according to claim 7, characterized in that: A sealing sleeve (24) is sleeved between the installation sleeve (23) and the connecting sleeve (27). A connecting pipe (234) is installed between the feeding sleeve (25) and the collection box (22).

9. The encapsulation structure of a chip circuit board according to claim 1, characterized in that: On the outer side of the battery pack (14), a plurality of metal patches (15) are equidistantly distributed. On the top of the chip circuit board (5), a plurality of wiring terminals (51) are equidistantly distributed. On the bottom of the chip circuit board (5), a plurality of wiring pins (52) are equidistantly distributed.

10. The encapsulation structure of a chip circuit board according to claim 7, wherein: On the outer side of the installation base (2), a wireless signal transceiver (17) is installed. Inside the wireless signal transceiver (17), a main control board is fixedly connected. On the outer side of the main control board, a control chip is fixedly connected. The cooling fan (12), the battery pack (14), the wireless signal transceiver (17), the buzzer (18), the liquid level sensor (233), the valve (28), and the chip circuit board (5) are all electrically connected to the control chip.

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