Efficient shielding and efficient heat dissipation mobile phone circuit board

Abstract

The invention discloses an efficient shielding and efficient heat dissipation mobile phone circuit board which comprises a circuit board body, a plurality of card insertion seats installed on the circuit board body, a control chip installed on the circuit board body, a shielding cover covering the control chip, a first heat dissipation protection cover and a second heat dissipation protection cover. The first heat dissipation protection cover is provided with a heat conduction silica gel pad which can abut against the shielding cover. The mobile phone circuit board is provided with the heat dissipation protection cover, so that the mobile phone circuit board has a better heat dissipation effect and a better shielding effect, and has a mechanical reinforcement effect on the circuit board body. And the heat dissipation protection cover also has a certain protection effect on the plurality of card insertion seats, so that the service life is prolonged. When the battery is replaced, a certain prompting effect can be provided, so that a user is reminded to avoid bad use habits.

Description

Technical Field

[0001] The present invention relates to the technical field of mobile phone circuit boards, and more specifically to a mobile phone circuit board with high efficiency shielding and high efficiency heat dissipation. Background Art

[0002] Although smartphones are mainstream in some regions, in some economically backward regions, feature phones are more popular due to their low prices and low maintenance costs, as smartphones are more expensive and may incur relatively more costs during use. In addition, among some elderly people, feature phones usually have simpler operating interfaces and larger buttons, which are more friendly to the elderly with reduced eyesight and less flexible fingers. Therefore, feature phones still have a large market.

[0003] Feature phones are often more durable, cheaper, more drop-resistant, and have longer standby time. Many feature phones also retain the design of removable batteries. For this reason, feature phones are often not as carefully cared for and cared for as smartphones in daily use. Therefore, higher requirements are placed on the strength of mobile phone circuit boards. As the core component inside the mobile phone, the circuit board must be able to withstand various shocks and vibrations in daily use to ensure that it can still work normally in the case of frequent falls or accidental collisions. In addition, in order to cope with the aging problem that may be caused by long-term use, the circuit board of the feature phone must also have good heat dissipation performance to ensure that the phone can maintain stable operation in various environments. Summary of the invention

[0004] The present invention aims to overcome the defects of the prior art and provide a mobile phone circuit board with high efficiency shielding and high efficiency heat dissipation.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a mobile phone circuit board, comprising a circuit board body, a plurality of card sockets installed on the circuit board body, a control chip installed on the circuit board body, a shielding cover covering the control chip, a first heat dissipation protection cover and a second heat dissipation protection cover, the first heat dissipation protection cover having a thermally conductive silicone pad that can abut the shielding cover; the card socket having a metal limit cover, a fixing block being fixed to the metal limit cover, the fixing block having an installation groove, and the first heat dissipation protection cover and the second heat dissipation protection cover both having installation blocks that cooperate with the installation groove.

[0006] Further, the plurality of card sockets include two SIM card sockets and two memory card sockets, the first heat dissipation protection cover covers the two SIM card sockets, and the second heat dissipation protection cover covers the two memory card sockets.

[0007] This allows multiple SIM cards and multiple memory cards to be inserted, thus realizing dual-card and storage expansion functions.

[0008] Further, the first heat dissipation protection cover comprises a first cover plate, a first reinforcing side rod connected to the first cover plate, and a plurality of first heat dissipation ribs located at the first cover plate, the first reinforcing side rod having a first strip-shaped embedding groove capable of accommodating the side edge of the circuit board body, the first cover plate comprises a first rectangular plate, a second rectangular plate connected to the first rectangular plate, and a third rectangular plate connected to the second rectangular plate, the third rectangular plate having a plurality of semi-cylindrical limiting protrusions on both sides, and the end of the third rectangular plate facing the second heat dissipation protection cover having a limiting slot; the second heat dissipation protection cover comprises a second cover plate, a second reinforcing side rod connected to the second cover plate, and a plurality of second heat dissipation ribs located at the second cover plate, the second reinforcing side rod having a second strip-shaped embedding groove capable of accommodating the side edge of the circuit board body, the second cover plate comprises a fourth rectangular plate and two fifth rectangular plates fixedly connected to the fourth rectangular plate, the fifth rectangular plate having a row of semi-cylindrical limiting grooves matched with the limiting protrusions, and the fourth rectangular plate is also connected with a limiting plug plate matched with the limiting slot.

[0009] Furthermore, the end of the third rectangular plate facing the fourth rectangular plate has a limiting slot.

[0010] The first heat dissipation protection cover and the second heat dissipation protection cover can achieve stable connection, and can reinforce and protect the circuit board body.

[0011] Furthermore, the first heat dissipation protection cover and the second heat dissipation protection cover are both made of metal material.

[0012] Therefore, the first heat dissipation protective cover and the second heat dissipation protective cover can achieve better heat dissipation for the circuit board body.

[0013] Furthermore, each SIM card holder has two mounting grooves at the fixed block of the metal limit cover; each memory card holder has two mounting grooves at the fixed block of the metal limit cover; the first heat dissipation protection cover has four mounting blocks, and the second heat dissipation protection cover has four mounting blocks; the mounting groove includes a groove portion and a slot portion connected to the groove portion, the mounting block includes a connecting block and a plug-in plate portion connected to the connecting block, and the connecting block has a notch portion.

[0014] Thus, an insertion connection can be achieved between the mounting block and the mounting groove, the mounting block itself has a certain longitudinal elasticity, and the metal limit cover also has a certain elasticity, so that the first heat dissipation protection cover and the second heat dissipation protection cover can better protect the circuit board body.

[0015] Furthermore, the side of the circuit board body facing the first reinforcing side rod and the side facing the second reinforcing side rod each have two first semicircular grooves and a second semicircular groove located between the two first semicircular grooves, a first arc portion is fixed at the first semicircular groove, and the first arc portion is connected to the insertion rod; a second arc portion is installed at the second semicircular groove, and the second arc portion is connected to the insertion protrusion, and the second semicircular groove has an insertion hole; the first strip-shaped embedding groove and the second strip-shaped embedding groove each have two semi-cylindrical portions and a second semi-cylindrical portion located between the two first semicircular grooves. A fixed axis between the semi-cylindrical parts, the semi-cylindrical part abuts against the first arc-shaped part, the semi-cylindrical part has a limiting through hole cooperating with the insertion rod, the limiting through hole at the first heat dissipation protection cover passes through the semi-cylindrical part and the first reinforcing side rod, the limiting through hole at the second heat dissipation protection cover passes through the semi-cylindrical part and the second reinforcing side rod, a lever is installed at the fixed axis through an elastic hinge part, one end of the lever abuts against one end of the second arc-shaped part, and the first heat dissipation protection cover and the second heat dissipation protection cover both have observation holes for observing the second arc-shaped part.

[0016] Therefore, it is possible to identify whether the second arc-shaped portion is in the initial position through the observation hole, thereby judging the usage status of the mobile phone.

[0017] Furthermore, the first arc portion and the insertion rod are integrally formed and made of rubber material, the second arc portion and the insertion protrusion are integrally formed and made of rubber material, the first arc portion and the first semicircular groove are fixedly connected by adhesive, and the second arc portion and the second semicircular groove are connected by the insertion protrusion and the insertion hole.

[0018] Thereby, the first reinforcing side bar and the second reinforcing side bar can form better protection with the circuit board body.

[0019] Furthermore, the limiting through hole is cylindrical, and the end of the limiting through hole has a trumpet-shaped chamfer.

[0020] Therefore, the insertion rod and the limiting through hole can be better aligned and matched. And after installation, it can be judged that the installation is in place by the insertion rod extending out of the limiting through hole.

[0021] Furthermore, an earphone jack and a charging seat are also installed on the circuit board body.

[0022] Furthermore, a battery connection unit is installed on the circuit board body.

[0023] Furthermore, the second arc-shaped portion has a red or green coating.

[0024] This allows for better identification and judgment of whether the second arc-shaped portion is in the initial position.

[0025] Beneficial effects: 1. The mobile phone circuit board of the present application is equipped with a heat dissipation protection cover, so as to have better heat dissipation and shielding effects, and has a mechanical reinforcement effect on the circuit board body.

[0026] 2. The heat dissipation protection cover of the mobile phone circuit board of the present application also has a certain protective effect on multiple card slots, thereby extending the service life.

[0027] 3. The mobile phone circuit board of the present application can give certain prompts when replacing the battery, thereby reminding the user to avoid bad usage habits. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the components being separated, without the second arc-shaped portion being installed; Figure 2 This is an enlarged view of area A; Figure 3 for Figure 1 Schematic diagram from another perspective; Figure 4 A schematic diagram of the second arc portion is shown in FIG. Figure 5 This is a schematic diagram of the first and second heat dissipation protection covers after installation; Figure 6 This is an enlarged view of area B.

[0029] Explanation of reference numerals: circuit board body 1; first arc-shaped portion 1.1; insertion rod 1.2; second semicircular groove 1.3; second arc-shaped portion 1.4; insertion protrusion 1.5; insertion hole 1.6; headphone jack seat 1.7; charging seat 1.8; battery connection unit 1.9; card seat 2; SIM card seat 2.1; memory card seat 2.2; shielding cover 3; first heat dissipation protection cover 4; first rectangular plate 4.1; second rectangular plate 4.2; third rectangular plate 4.3; limiting protrusion 4.3.1; limiting slot 4.3.2; first reinforcing side rod 4.4; first strip embedding groove 4.4.1; first Heat dissipation rib 4.5; thermal conductive silicone pad 4.6; second heat dissipation protection cover 5; fourth rectangular plate 5.1; limiting plug plate 5.1.1; fifth rectangular plate 5.2; limiting groove 5.2.1; second reinforcing side rod 5.3; second strip embedded groove 5.3.1; second heat dissipation rib 5.4; metal limiting cover 6; fixing block 6.1; mounting groove 6.2; groove part 6.2.1; slot part 6.2.2; mounting block 7; connecting block 7.1; plug plate part 7.2; notch part 7.3; semi-cylindrical part 8.1; fixing shaft 8.2; limiting through hole 8.3; lever 8.4; observation hole 9. DETAILED DESCRIPTION

[0030] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0031] As shown in the figure, a mobile phone circuit board with high efficiency shielding and high efficiency heat dissipation comprises a circuit board body 1, a plurality of card slots 2 mounted on the circuit board body 1, a control chip mounted on the circuit board body 1, a shielding cover 3 covering the control chip, a first heat dissipation protection cover 4 and a second heat dissipation protection cover 5, wherein the first heat dissipation protection cover 4 has a thermal conductive silicone pad 4.6 capable of abutting the shielding cover 3; the card slot 2 has a metal limit cover 6, a fixing block 6.1 is fixed to the metal limit cover 6, and the fixing block 6.1 has an installation groove 6.2, and the first heat dissipation protection cover 4 and the second heat dissipation protection cover 5 both have an installation block 7 matched with the installation groove 6.2. The plurality of card slots 2 include two SIM card slots 2.1 and two memory card slots 2.2, the first heat dissipation protection cover 4 covers the two SIM card slots 2.1, and the second heat dissipation protection cover 5 covers the two memory card slots 2.2.

[0032] The first heat dissipation protection cover 4 comprises a first cover plate, a first reinforcing side bar 4.4 connected to the first cover plate, and a plurality of first heat dissipation ribs 4.5 located at the first cover plate, the first reinforcing side bar 4.4 has a first strip-shaped embedding groove 4.4.1 capable of accommodating the side edge of the circuit board body 1, the first cover plate comprises a first rectangular plate 4.1, a second rectangular plate 4.2 connected to the first rectangular plate 4.1, and a third rectangular plate 4.3 connected to the second rectangular plate 4.2, the third rectangular plate 4.3 has a plurality of semi-cylindrical limiting protrusions 4.3.1 on both sides, and the end of the third rectangular plate 4.3 facing the second heat dissipation protection cover has a limiting slot 4.3.2; The second heat dissipation protection cover 5 includes a second cover plate, a second reinforcing side rod 5.3 connected to the second cover plate, and a plurality of second heat dissipation ribs 5.4 located at the second cover plate, the second reinforcing side rod 5.3 has a second strip-shaped embedding groove 5.3.1 capable of accommodating the side edge of the circuit board body 1, the second cover plate includes a fourth rectangular plate 5.1 and two fifth rectangular plates 5.2 fixedly connected to the fourth rectangular plate 5.1, the fifth rectangular plate 5.2 has a row of semi-cylindrical limiting grooves 5.2.1 cooperating with the limiting protrusions 4.3.1, and the fourth rectangular plate 5.1 is also connected to a limiting plug plate 5.1.1 cooperating with the limiting slot 4.3.2. The fixing block 6.1 at the metal limit cover 6 at each SIM card holder 2.1 has two mounting grooves 6.2; the fixing block 6.1 at the metal limit cover 6 at each storage card holder 2.2 has two mounting grooves 6.2; the first heat dissipation protection cover 4 has four mounting blocks 7, and the second heat dissipation protection cover 5 has four mounting blocks 7; the mounting groove 6.2 includes a groove portion 6.2.1 and a slot portion 6.2.2 connected to the groove portion 6.2.1, the mounting block 7 includes a connecting block 7.1 and a plug board portion 7.2 connected to the connecting block 7.1, and the connecting block 7.1 has a notch portion 7.3.

[0033] The side of the circuit board body 1 facing the first reinforcing side rod 4.4 and the side facing the second reinforcing side rod 5.3 both have two first semicircular grooves and a second semicircular groove 1.3 located between the two first semicircular grooves, a first arc portion 1.1 is fixed at the first semicircular groove, and the first arc portion 1.1 is connected to an insertion rod 1.2; a second arc portion 1.4 is installed at the second semicircular groove 1.3, the second arc portion 1.4 is connected to an insertion protrusion 1.5, and the second semicircular groove 1.3 has an insertion hole 1.6; the first strip embedded groove 4.4.1 and the second strip embedded groove 5.3.1 both have two semi-cylindrical portions 8.1 and a fixed shaft 8.2 located between the two semi-cylindrical portions 8.1, the semi-cylindrical portion 8.1 abuts against the first arc portion 1.1, and the semi-cylindrical portion 8.1 has a limiting through hole 8.3 that cooperates with the insertion rod 1.2 The limiting through hole 8.3 at the first heat dissipation protection cover 4 penetrates the semi-cylindrical portion 8.1 and the first reinforcing side rod 4.4, the limiting through hole 8.3 at the second heat dissipation protection cover 5 penetrates the semi-cylindrical portion 8.1 and the second reinforcing side rod 5.3, a lever 8.4 is installed at the fixed shaft 8.2 through an elastic hinge component, one end of the lever 8.4 abuts against one end of the second arc-shaped portion 1.4, and the first heat dissipation protection cover 4 and the second heat dissipation protection cover 5 both have an observation hole 9 for observing the second arc-shaped portion 1.4; the first arc-shaped portion 1.1 and the insertion rod 1.2 are integrally formed and made of rubber material, the second arc-shaped portion 1.4 and the insertion protrusion 1.5 are integrally formed and made of rubber material, the first arc-shaped portion 1.1 and the first semicircular groove are fixedly connected by an adhesive, and the second arc-shaped portion 1.4 and the second semicircular groove 1.3 are connected by an insertion protrusion 1.5 and an insertion hole 1.6. The limiting through hole 8.3 is cylindrical, and the end of the limiting through hole 8.3 has a trumpet-shaped chamfer. The circuit board body 1 is also equipped with an earphone jack seat 1.7, a charging seat 1.8 and a battery connection unit 1.9. The second arc portion 1.4 has a red or green coating.

[0034] The mobile phone circuit board of the present application has multiple card slots, multiple SIM cards and multiple memory cards can be inserted, and the battery can be removed, so it is more suitable for the use scenario of the feature phone. And when the mobile phone circuit board of the present application is in use, due to the provision of the first heat dissipation protection cover and the second heat dissipation protection cover, the first heat dissipation protection cover and the second heat dissipation protection cover are made of metal material, so that it has a better heat conduction effect, a larger heat dissipation area, and a better shielding effect. And because the metal limit cover at the SIM card seat and the memory card seat itself has a certain elasticity, the thermal conductive silicone pad has a certain elasticity, and the structure of the mounting block with a notch has a certain elasticity, so that the circuit board body can be protected, the first and second heat dissipation protection covers form a better protection effect, and the first and second reinforcement side rods form reinforcement protection for the side of the circuit board body. During installation, the first heat dissipation protection cover and the second heat dissipation protection cover are inserted and connected from both sides, and can be matched by the insertion rod and the limiting through hole, and the connection is realized by a plurality of limiting protrusions and limiting grooves, and precise positioning is formed by the limiting plug plate and the limiting slot. And after installation, the second arc-shaped portion is limited by the insertion protrusion and the insertion hole, and the first strip embedded groove and the second strip embedded groove also have a certain limiting effect on the second arc-shaped portion, and the insertion protrusion is made of rubber material with a certain elasticity, the second arc-shaped portion can abut the second semicircular groove, and at this time the lever will not cause the second arc-shaped portion to be displaced, but when it is impacted by external force, for example, when the mobile phone is dropped, due to vibration, the insertion protrusion and the insertion hole will fall off, so that under the action of the lever, the second arc-shaped portion will be offset from the original position, and it can be clearly seen through the observation hole, so that the user can easily see it when replacing the mobile phone battery. Thereby, the user can be reminded to change the use habits and pay attention to protecting the mobile phone. And at this time, the first heat dissipation protection cover and the second heat dissipation protection cover can be easily opened and disassembled through the two observation holes, the second arc-shaped portion is returned to its position, and then the first heat dissipation protection cover and the second heat dissipation protection cover are installed.

[0035] Although the present invention has been illustrated and described with respect to the preferred embodiments, it will be appreciated by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A mobile phone circuit board with high efficiency shielding and high efficiency heat dissipation, characterized in that: It includes a circuit board body, multiple card sockets installed on the circuit board body, a control chip installed on the circuit board body, a shielding cover covering the control chip, a first heat dissipation protection cover and a second heat dissipation protection cover, the first heat dissipation protection cover is provided with a thermal conductive silicone pad that can abut the shielding cover; the card socket is provided with a metal limiting cover, a fixing block is fixed to the metal limiting cover, the fixing block is provided with an installation groove, and the first heat dissipation protection cover and the second heat dissipation protection cover are both provided with installation blocks that cooperate with the installation groove.

2. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 1, characterized in that: The multiple card sockets include two SIM card sockets and two memory card sockets, the first heat dissipation protection cover covers the two SIM card sockets, and the second heat dissipation protection cover covers the two memory card sockets.

3. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 2, characterized in that: The first heat dissipation protection cover comprises a first cover plate, a first reinforcing side rod connected to the first cover plate, and a plurality of first heat dissipation ribs located at the first cover plate, the first reinforcing side rod having a first strip-shaped embedding groove capable of accommodating the side edge of the circuit board body, the first cover plate comprises a first rectangular plate, a second rectangular plate connected to the first rectangular plate, and a third rectangular plate connected to the second rectangular plate, the two sides of the third rectangular plate having a plurality of semi-cylindrical limiting protrusions, and the end of the third rectangular plate facing the second heat dissipation protection cover having a limiting slot; the second heat dissipation protection cover comprises a second cover plate, a second reinforcing side rod connected to the second cover plate, and a plurality of second heat dissipation ribs located at the second cover plate, the second reinforcing side rod having a second strip-shaped embedding groove capable of accommodating the side edge of the circuit board body, the second cover plate comprises a fourth rectangular plate and two fifth rectangular plates fixedly connected to the fourth rectangular plate, the fifth rectangular plate having a row of semi-cylindrical limiting grooves matched with the limiting protrusions, and the fourth rectangular plate is also connected with a limiting plug plate matched with the limiting slot.

4. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 2, characterized in that: The fixed block at the metal limit cover at each SIM card holder has two mounting grooves; the fixed block at the metal limit cover at each memory card holder has two mounting grooves; the first heat dissipation protection cover has four mounting blocks, and the second heat dissipation protection cover has four mounting blocks; the mounting groove includes a groove portion and a slot portion connected to the groove portion, the mounting block includes a connecting block and a plug-in plate portion connected to the connecting block, and the connecting block has a notch portion.

5. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 3, characterized in that: The side of the circuit board body facing the first reinforcing side rod and the side facing the second reinforcing side rod both have two first semicircular grooves and a second semicircular groove located between the two first semicircular grooves, a first arc portion is fixed at the first semicircular groove, and the first arc portion is connected to an insertion rod; a second arc portion is installed at the second semicircular groove, and the second arc portion is connected to an insertion protrusion, and the second semicircular groove has an insertion hole; the first strip embedding groove and the second strip embedding groove both have two semi-cylindrical portions and a fixed axis located between the two semi-cylindrical portions, the semi-cylindrical portion abuts the first arc portion, and the semi-cylindrical portion has a limiting through hole that cooperates with the insertion rod, the first The limiting through hole at the heat dissipation protection cover passes through the semi-cylindrical portion and the first reinforcing side rod, and the limiting through hole at the second heat dissipation protection cover passes through the semi-cylindrical portion and the second reinforcing side rod. A lever is installed at the fixed axis through an elastic hinge component, and one end of the lever abuts against one end of the second arc-shaped portion. Both the first heat dissipation protection cover and the second heat dissipation protection cover have observation holes for observing the second arc-shaped portion; the first arc-shaped portion and the insertion rod are integrally formed and made of rubber material, and the second arc-shaped portion and the insertion protrusion are integrally formed and made of rubber material. The first arc-shaped portion and the first semicircular groove are fixedly connected by an adhesive, and the second arc-shaped portion and the second semicircular groove are connected by an insertion protrusion and an insertion hole.

6. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 5, characterized in that: The limiting through hole is cylindrical, and the end of the limiting through hole has a trumpet-shaped chamfer.

7. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 1, characterized in that: The circuit board body is also equipped with an earphone jack, a charging seat and a battery connection unit.

8. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 5, characterized in that: The second arc portion has a red or green coating.

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