A mobile phone circuit board with high efficiency shielding and high heat dissipation

Abstract

The present application discloses a mobile phone circuit board with high efficiency shielding and high efficiency heat dissipation, comprising a circuit board body, a plurality of card slots mounted on the circuit board body, a control chip mounted on the circuit board body, a shielding cover covering the control chip, a first heat dissipation protective cover, and a second heat dissipation protective cover. The first heat dissipation protective cover is provided with a thermally conductive silicone pad that can abut against the shielding cover. The mobile phone circuit board of the present application is equipped with a heat dissipation protective cover, thereby having better heat dissipation and shielding effects, and having a mechanical reinforcement effect on the circuit board body. The heat dissipation protective cover also has a certain protective effect on the plurality of card slots, thereby extending the service life. When replacing the battery, it can provide a certain prompt effect, thereby reminding the user to avoid bad usage habits.

Description

Technical Field

[0001] The present invention relates to the technical field of mobile phone circuit boards, and more particularly to a mobile phone circuit board with high efficiency shielding and high efficiency heat dissipation. Background Art

[0002] While smartphones are mainstream in some regions, in economically less developed areas, feature phones are more popular due to their lower price and lower maintenance costs, as smartphones are more expensive and can incur significant operational costs. Furthermore, among some seniors, feature phones often feature simpler interfaces and larger buttons, making them more user-friendly for those with diminished eyesight and limited finger dexterity. Therefore, there remains a significant market for feature phones.

[0003] Feature phones are often more durable, less expensive, more drop-resistant, and have longer standby times. Many feature phones also retain removable batteries. For this reason, feature phones often receive less meticulous care and attention than smartphones in daily use. This places higher demands on the strength of the phone's circuit boards. As a core component within the phone, the circuit board must be able to withstand the various shocks and vibrations of daily use, ensuring continued operation despite frequent drops and accidental collisions. Furthermore, to address potential aging issues associated with prolonged use, feature phone circuit boards must also possess excellent heat dissipation performance to ensure stable operation in all environments. Summary of the Invention

[0004] The present invention aims to overcome the defects of the prior art and provide a mobile phone circuit board with high efficiency shielding and high efficiency heat dissipation.

[0005] In order to achieve the above-mentioned objectives, the present invention provides the following technical solutions: a mobile phone circuit board, comprising a circuit board body, a plurality of card sockets installed on the circuit board body, a control chip installed on the circuit board body, a shielding cover covering the control chip, a first heat dissipation protection cover and a second heat dissipation protection cover, wherein the first heat dissipation protection cover has a thermally conductive silicone pad that can abut the shielding cover; the card socket has a metal limit cover, a fixing block is fixed to the metal limit cover, and the fixing block has an installation groove, and the first heat dissipation protection cover and the second heat dissipation protection cover both have installation blocks that cooperate with the installation groove.

[0006] Furthermore, the plurality of card slots include two SIM card slots and two memory card slots, the first heat dissipation protection cover covers the two SIM card slots, and the second heat dissipation protection cover covers the two memory card slots.

[0007] This allows you to insert multiple SIM cards and multiple memory cards, thus realizing dual-card and storage expansion functions.

[0008] Further, the first heat dissipation protection cover includes a first cover plate, a first reinforcing side rod connected to the first cover plate, and a plurality of first heat dissipation ribs located on the first cover plate, the first reinforcing side rod has a first strip-shaped embedding groove capable of accommodating the side edge of the circuit board body, the first cover plate includes a first rectangular plate, a second rectangular plate connected to the first rectangular plate, and a third rectangular plate connected to the second rectangular plate, the two sides of the third rectangular plate have a plurality of semi-cylindrical limiting protrusions, and the end of the third rectangular plate facing the second heat dissipation protection cover has a limiting slot; the second heat dissipation protection cover includes a second cover plate, a second reinforcing side rod connected to the second cover plate, and a plurality of second heat dissipation ribs located on the second cover plate, the second reinforcing side rod has a second strip-shaped embedding groove capable of accommodating the side edge of the circuit board body, the second cover plate includes a fourth rectangular plate and two fifth rectangular plates fixedly connected to the fourth rectangular plate, the fifth rectangular plate has a row of semi-cylindrical limiting grooves that cooperate with the limiting protrusions, and the fourth rectangular plate is also connected to a limiting plug that cooperates with the limiting slot.

[0009] Furthermore, the end of the third rectangular plate facing the fourth rectangular plate has a limiting slot.

[0010] The first heat dissipation protection cover and the second heat dissipation protection cover can achieve stable connection and can reinforce and protect the circuit board body.

[0011] Furthermore, the first heat dissipation protection cover and the second heat dissipation protection cover are both made of metal material.

[0012] Therefore, the first heat dissipation protective cover and the second heat dissipation protective cover can achieve better heat dissipation for the circuit board body.

[0013] Furthermore, the fixed block at the metal limit cover at each SIM card holder has two of the above-mentioned mounting slots; the fixed block at the metal limit cover at each memory card holder has two of the above-mentioned mounting slots; the first heat dissipation protection cover has four mounting blocks, and the second heat dissipation protection cover has four mounting blocks; the mounting slot includes a groove portion and a slot portion connected to the groove portion, the mounting block includes a connecting block and a plug-in plate portion connected to the connecting block, and the connecting block has a notch portion.

[0014] Thus, an insertion connection can be achieved between the mounting block and the mounting slot. The mounting block itself has a certain longitudinal elasticity, and the metal limit cover also has a certain elasticity, so that the first heat dissipation protection cover and the second heat dissipation protection cover can better protect the circuit board body.

[0015] Furthermore, the side of the circuit board body facing the first reinforcing side rod and the side facing the second reinforcing side rod each have two first semicircular grooves and a second semicircular groove located between the two first semicircular grooves, the first semicircular groove is fixed with a first arc portion, the first arc portion is connected to the insertion rod; the second semicircular groove is installed with a second arc portion, the second arc portion is connected to the insertion protrusion, and the second semicircular groove has an insertion hole; the first strip-shaped embedded groove and the second strip-shaped embedded groove each have two semi-cylindrical portions and a protrusion located between the two A fixed axis between the semi-cylindrical parts, the semi-cylindrical part abuts against the first arc-shaped part, the semi-cylindrical part has a limiting through hole cooperating with the insertion rod, the limiting through hole at the first heat dissipation protection cover passes through the semi-cylindrical part and the first reinforcing side rod, the limiting through hole at the second heat dissipation protection cover passes through the semi-cylindrical part and the second reinforcing side rod, a shift rod is installed at the fixed axis through an elastic hinge component, one end of the shift rod abuts against one end of the second arc-shaped part, and the first heat dissipation protection cover and the second heat dissipation protection cover both have observation holes for observing the second arc-shaped part.

[0016] Therefore, it is possible to identify whether the second arc-shaped portion is in the initial position through the observation hole, thereby judging the usage status of the mobile phone.

[0017] Furthermore, the first arc-shaped portion and the insertion rod are integrally formed and made of rubber material, the second arc-shaped portion and the insertion protrusion are integrally formed and made of rubber material, the first arc-shaped portion and the first semicircular groove are fixedly connected by adhesive, and the second arc-shaped portion and the second semicircular groove are connected by the insertion protrusion and the insertion hole.

[0018] Thus, the first reinforcing side bar and the second reinforcing side bar can form better protection with the circuit board body.

[0019] Furthermore, the limiting through hole is cylindrical, and the end of the limiting through hole has a trumpet-shaped chamfer.

[0020] This allows for better alignment of the insertion rod and the limiting through hole. After installation, the insertion rod can be extended out of the limiting through hole to indicate that the installation is in place.

[0021] Furthermore, an earphone jack and a charging base are also installed on the circuit board body.

[0022] Furthermore, a battery connection unit is installed on the circuit board body.

[0023] Furthermore, the second arc-shaped portion has a red or green coating.

[0024] This allows for better identification and judgment of whether the second arc-shaped portion is in the initial position.

[0025] Beneficial effects:

[0026] 1. The mobile phone circuit board of the present application is equipped with a heat dissipation protection cover, thereby having better heat dissipation and shielding effects, and having a mechanical reinforcement effect on the circuit board body.

[0027] 2. The heat dissipation protection cover of the mobile phone circuit board of the present application also has a certain protective effect on multiple card slots, thereby extending the service life.

[0028] 3. The mobile phone circuit board of the present application can give certain prompts when replacing the battery, thereby reminding the user to avoid bad usage habits. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of the separated components, without the second arc-shaped portion installed;

[0030] Figure 2 This is an enlarged view of area A;

[0031] Figure 3 for Figure 1 Schematic diagram from another perspective;

[0032] Figure 4 A schematic diagram of the second arc portion is shown;

[0033] Figure 5 This is a schematic diagram of the first and second heat dissipation protection covers after installation;

[0034] Figure 6 This is an enlarged view of area B.

[0035] Explanation of reference numerals: circuit board body 1; first arc-shaped portion 1.1; insertion rod 1.2; second semicircular groove 1.3; second arc-shaped portion 1.4; insertion protrusion 1.5; insertion hole 1.6; headphone jack seat 1.7; charging seat 1.8; battery connection unit 1.9; card insertion seat 2; SIM card seat 2.1; memory card seat 2.2; shielding cover 3; first heat dissipation protection cover 4; first rectangular plate 4.1; second rectangular plate 4.2; third rectangular plate 4.3; limiting protrusion 4.3.1; limiting slot 4.3.2; first reinforcing side bar 4.4; first strip-shaped embedding groove 4.4.1; first Heat dissipation rib 4.5; thermally conductive silicone pad 4.6; second heat dissipation protective cover 5; fourth rectangular plate 5.1; limiting plug plate 5.1.1; fifth rectangular plate 5.2; limiting groove 5.2.1; second reinforcing side rod 5.3; second strip-shaped embedded groove 5.3.1; second heat dissipation rib 5.4; metal limiting cover 6; fixing block 6.1; mounting groove 6.2; groove portion 6.2.1; slot portion 6.2.2; mounting block 7; connecting block 7.1; plug plate portion 7.2; notch portion 7.3; semi-cylindrical portion 8.1; fixing shaft 8.2; limiting through hole 8.3; shift lever 8.4; observation hole 9. DETAILED DESCRIPTION

[0036] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0037] As shown in the figure, a mobile phone circuit board with high efficiency shielding and high heat dissipation comprises a circuit board body 1, multiple card slots 2 mounted on the circuit board body 1, a control chip mounted on the circuit board body 1, a shielding cover 3 covering the control chip, a first heat dissipation protective cover 4, and a second heat dissipation protective cover 5. The first heat dissipation protective cover 4 has a thermally conductive silicone pad 4.6 that can abut the shielding cover 3. The card slots 2 have a metal limit cover 6, fixed with a fixing block 6.1, and the fixing block 6.1 has a mounting groove 6.2. Both the first heat dissipation protective cover 4 and the second heat dissipation protective cover 5 have mounting blocks 7 that mate with the mounting groove 6.2. The multiple card slots 2 include two SIM card slots 2.1 and two memory card slots 2.2. The first heat dissipation protective cover 4 covers the two SIM card slots 2.1, and the second heat dissipation protective cover 5 covers the two memory card slots 2.2.

[0038] The first heat dissipation protection cover 4 includes a first cover plate, a first reinforcing side bar 4.4 connected to the first cover plate, and a plurality of first heat dissipation ribs 4.5 located on the first cover plate. The first reinforcing side bar 4.4 has a first strip-shaped embedding groove 4.4.1 capable of accommodating the side edge of the circuit board body 1. The first cover plate includes a first rectangular plate 4.1, a second rectangular plate 4.2 connected to the first rectangular plate 4.1, and a third rectangular plate 4.3 connected to the second rectangular plate 4.2. The third rectangular plate 4.3 has a plurality of semi-cylindrical limiting protrusions 4.3.1 on both sides. The end of the third rectangular plate 4.3 facing the second heat dissipation protection cover has a limiting slot 4.3.2. The second heat dissipation protection cover 5 includes a second cover plate, a second reinforcing side rod 5.3 connected to the second cover plate, and a plurality of second heat dissipation ribs 5.4 located on the second cover plate. The second reinforcing side rod 5.3 has a second strip-shaped embedding groove 5.3.1 capable of accommodating the side edge of the circuit board body 1. The second cover plate includes a fourth rectangular plate 5.1 and two fifth rectangular plates 5.2 fixedly connected to the fourth rectangular plate 5.1. The fifth rectangular plate 5.2 has a row of semi-cylindrical limiting grooves 5.2.1 that cooperate with the limiting protrusions 4.3.1. The fourth rectangular plate 5.1 is also connected to a limiting plug plate 5.1.1 that cooperates with the limiting slot 4.3.2. The fixing block 6.1 at the metal limit cover 6 at each SIM card holder 2.1 has two said mounting slots 6.2; the fixing block 6.1 at the metal limit cover 6 at each memory card holder 2.2 has two said mounting slots 6.2; the first heat dissipation protection cover 4 has four mounting blocks 7, and the second heat dissipation protection cover 5 has four mounting blocks 7; the mounting slot 6.2 includes a groove portion 6.2.1 and a slot portion 6.2.2 connected to the groove portion 6.2.1, the mounting block 7 includes a connecting block 7.1 and a plug-in board portion 7.2 connected to the connecting block 7.1, and the connecting block 7.1 has a notch portion 7.3.

[0039] The side of the circuit board body 1 facing the first reinforcing side rod 4.4 and the side facing the second reinforcing side rod 5.3 both have two first semicircular grooves and a second semicircular groove 1.3 located between the two first semicircular grooves, the first semicircular groove is fixed with a first arc portion 1.1, and the first arc portion 1.1 is connected to an insertion rod 1.2; the second semicircular groove 1.3 is installed with a second arc portion 1.4, the second arc portion 1.4 is connected to an insertion protrusion 1.5, and the second semicircular groove 1.3 has an insertion hole 1.6; the first strip-shaped embedded groove 4.4.1 and the second strip-shaped embedded groove 5.3.1 both have two semi-cylindrical portions 8.1 and a fixed shaft 8.2 located between the two semi-cylindrical portions 8.1, the semi-cylindrical portion 8.1 abuts the first arc portion 1.1, and the semi-cylindrical portion 8.1 has a limiting through hole 8.3 that cooperates with the insertion rod 1.2 The limiting through hole 8.3 at the first heat dissipation protective cover 4 passes through the semi-cylindrical portion 8.1 and the first reinforcing side rod 4.4, the limiting through hole 8.3 at the second heat dissipation protective cover 5 passes through the semi-cylindrical portion 8.1 and the second reinforcing side rod 5.3, and a shift rod 8.4 is installed at the fixed shaft 8.2 through an elastic hinge component, one end of the shift rod 8.4 abuts one end of the second arc-shaped portion 1.4, and the first heat dissipation protective cover 4 and the second heat dissipation protective cover 5 both have an observation hole 9 for observing the second arc-shaped portion 1.4; the first arc-shaped portion 1.1 and the insertion rod 1.2 are integrally formed and made of rubber material, the second arc-shaped portion 1.4 and the insertion protrusion 1.5 are integrally formed and made of rubber material, the first arc-shaped portion 1.1 and the first semicircular groove are fixedly connected by adhesive, and the second arc-shaped portion 1.4 and the second semicircular groove 1.3 are connected by the insertion protrusion 1.5 and the insertion hole 1.6. The limiting through hole 8.3 is cylindrical, and the end of the limiting through hole 8.3 has a trumpet-shaped chamfer. The circuit board body 1 is also equipped with an earphone jack 1.7, a charging cradle 1.8, and a battery connection unit 1.9. The second curved portion 1.4 has a red or green coating.

[0040] The mobile phone circuit board of the present application has multiple card slots that can insert multiple SIM cards and multiple memory cards, and the battery is removable, making it more suitable for use in feature phone scenarios. Furthermore, when in use, the mobile phone circuit board of the present application is provided with a first heat dissipation protective cover and a second heat dissipation protective cover made of metal material, thereby having better heat conduction effect, a larger heat dissipation area, and better shielding effect. Furthermore, since the metal limit covers at the SIM card slot and the memory card slot themselves have a certain elasticity, the thermal conductive silicone pad has a certain elasticity, and the mounting block has a certain elasticity of the notched structure, it can protect the circuit board body. The first and second heat dissipation protective covers provide better protection, and the first and second reinforcing side rods provide reinforced protection for the sides of the circuit board body. During installation, the first and second heat dissipation protective covers are inserted and connected from both sides, and can be matched between the insertion rods and the limiting through-holes, and are connected by multiple limiting protrusions and limiting grooves, and are precisely positioned by the limiting plug plate and limiting slot. After installation, the second curved portion is restrained by the insertion protrusion and the insertion hole, and the first and second strip-shaped insertion grooves also have a certain restraining effect on the second curved portion. The insertion protrusion is made of rubber and has a certain degree of elasticity, so the second curved portion can abut the second semicircular groove. At this time, the lever will not cause the second curved portion to move. However, when subjected to external impact, such as when the phone is dropped, the insertion protrusion and the insertion hole may fall apart due to vibration. As a result, the second curved portion will be displaced from its original position under the action of the lever. This can be clearly seen through the observation hole, making it easy for the user to see when changing the phone battery. This can remind the user to change their usage habits and pay attention to protecting the phone. At this time, the two observation holes can also be used to easily open and remove the first and second heat dissipation protective covers, return the second curved portion to its original position, and then install the first and second heat dissipation protective covers.

[0041] Although the present invention has been illustrated and described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A mobile phone circuit board with high efficiency shielding and high efficiency heat dissipation, characterized in that: The invention comprises a circuit board body, a plurality of card insertion sockets mounted on the circuit board body, a control chip mounted on the circuit board body, a shielding cover covering the control chip, a first heat dissipation protection cover, and a second heat dissipation protection cover, wherein the first heat dissipation protection cover has a thermally conductive silicone pad capable of abutting the shielding cover; the card insertion socket has a metal limit cover, a fixing block is fixed to the metal limit cover, and the fixing block has a mounting slot, and the first heat dissipation protection cover and the second heat dissipation protection cover both have mounting blocks that match the mounting slot; The first heat dissipation protection cover includes a first cover plate, a first reinforcing side rod connected to the first cover plate, and a plurality of first heat dissipation ribs located on the first cover plate, the first reinforcing side rod having a first strip-shaped embedded groove capable of accommodating the side edge of the circuit board body, the first cover plate includes a first rectangular plate, a second rectangular plate connected to the first rectangular plate, and a third rectangular plate connected to the second rectangular plate, the two sides of the third rectangular plate have a plurality of semi-cylindrical limiting protrusions, and the end of the third rectangular plate facing the second heat dissipation protection cover has a limiting slot; the second heat dissipation protection cover includes a second cover plate, a second reinforcing side rod connected to the second cover plate, and a plurality of second heat dissipation ribs located on the second cover plate, the second reinforcing side rod having a second strip-shaped embedded groove capable of accommodating the side edge of the circuit board body, the second cover plate includes a fourth rectangular plate and two fifth rectangular plates fixedly connected to the fourth rectangular plate, the fifth rectangular plate has a row of semi-cylindrical limiting grooves that cooperate with the limiting protrusions, and the fourth rectangular plate is also connected to a limiting plug that cooperates with the limiting slot.

2. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 1, characterized in that: The multiple card sockets include two SIM card sockets and two memory card sockets. The first heat dissipation protection cover covers the two SIM card sockets, and the second heat dissipation protection cover covers the two memory card sockets.

3. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 2, characterized in that: The fixed block of the metal limit cover at each SIM card holder has two of the above-mentioned mounting slots; the fixed block of the metal limit cover at each memory card holder has two of the above-mentioned mounting slots; the first heat dissipation protection cover has four mounting blocks, and the second heat dissipation protection cover has four mounting blocks; the mounting slot includes a groove portion and a slot portion connected to the groove portion, the mounting block includes a connecting block and a plug-in plate portion connected to the connecting block, and the connecting block has a notch portion.

4. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 1, characterized in that: The side of the circuit board body facing the first reinforcing side rod and the side facing the second reinforcing side rod both have two first semicircular grooves and a second semicircular groove located between the two first semicircular grooves, the first semicircular groove is fixed with a first arc portion, the first arc portion is connected to the insertion rod; the second semicircular groove is installed with a second arc portion, the second arc portion is connected to the insertion protrusion, and the second semicircular groove has an insertion hole; the first strip-shaped embedding groove and the second strip-shaped embedding groove both have two semi-cylindrical portions and a fixed axis located between the two semi-cylindrical portions, the semi-cylindrical portion abuts the first arc portion, and the semi-cylindrical portion has a limiting through-hole that cooperates with the insertion rod, the first The limiting through hole at the heat dissipation protection cover passes through the semi-cylindrical portion and the first reinforcing side rod, and the limiting through hole at the second heat dissipation protection cover passes through the semi-cylindrical portion and the second reinforcing side rod. A shift rod is installed at the fixed axis through an elastic hinge component, and one end of the shift rod abuts one end of the second arc-shaped portion. Both the first heat dissipation protection cover and the second heat dissipation protection cover have observation holes for observing the second arc-shaped portion; the first arc-shaped portion and the insertion rod are integrally formed and made of rubber material, and the second arc-shaped portion and the insertion protrusion are integrally formed and made of rubber material. The first arc-shaped portion and the first semicircular groove are fixedly connected by adhesive, and the second arc-shaped portion and the second semicircular groove are connected by the insertion protrusion and the insertion hole.

5. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 4, characterized in that: The limiting through hole is cylindrical, and the end of the limiting through hole has a trumpet-shaped chamfer.

6. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 1, characterized in that: The circuit board body is also equipped with an earphone jack, a charging base and a battery connection unit.

7. The high-efficiency shielding and high-efficiency heat dissipation mobile phone circuit board according to claim 4, characterized in that: The second arc portion has a red or green coating.

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