Universal electromagnetic shielding test packaging box and assembling method

Abstract

The invention belongs to the field of low-loss transmission and packaging of low-temperature radio-frequency signals, particularly relates to a universal electromagnetic shielding test packaging box and an assembling method, and aims to solve the problems of long iteration period, high research and development cost, low integration density, poor universality and the like of chip packaging verification. The high-speed radio-frequency chip packaging structure comprises a shielding layer (1), an integrated SMA terminal (2), a high-speed substrate (3), a supporting seat (4), a shielding cover (5), a buckle (6), a telescopic clamping seat (7), a radio-frequency chip (8), a packaging substrate (9), a low-temperature interconnection bump (10) and a telescopic needle (11). According to the invention, different circuits can be tested by using the same packaging box, so that the compatibility of the packaging box can be effectively improved.

Description

Technical Field

[0001] The invention belongs to the field of low-loss transmission and packaging of low-temperature radio frequency signals, and in particular relates to a universal electromagnetic shielding test packaging box and an assembling method. Background Art

[0002] New radio frequency devices such as optoelectronics and quantum devices have become key technical components in the field of modern communications.

[0003] As the scale (number of leads) of new RF devices continues to increase, the requirements for packaging technology are also getting higher and higher. Packaging technology determines the signal integration and transmission quality of RF devices. In order to meet the high-density and general-purpose integrated testing needs of new RF devices, it is necessary to learn from the integrated circuit packaging system, consider the particularity of its device performance in the packaging process, and comprehensively optimize to achieve its high-density and high-reliability packaging.

[0004] At present, the packaging of new RF devices is still in the early stage of customization. Signal coupling, packaging boxes and signal transmission links need to be designed according to the specific layout of the actual chip. The interconnection process is immature, resulting in long packaging verification iteration cycles, high R&D costs, low integration density, and poor versatility.

[0005] The universal packaging box separates the device-level packaging structure and the board-level test assembly structure by using a reusable flexible interconnection method, which avoids the thermal process of the board-level packaging from damaging the chip functional devices. In addition, the flexible interconnection of the telescopic pin adopts an undefined interconnection network, which can realize chip packaging test verification of different scales and different networks without changing the overall structure of the packaging box, and realize flexible, efficient and stable packaging of new RF communication devices. Summary of the invention

[0006] In view of the defects and shortcomings in the prior art, a technical purpose of the present invention is to provide a universal electromagnetic shielding test packaging box and packaging method. The new radio frequency circuit realizes signal and mechanical interconnection through flexible interconnection of telescopic pins, and separates the test interconnection from the circuit packaging, which not only avoids the damage to the chip performance caused by the thermal process of the test packaging process, but also realizes high-density signal fan-out while having multiple multiplexing capabilities.

[0007] Another technical purpose of the present invention is to significantly improve the flexibility and integration of multiple chips on the packaging substrate, adapt to wire bonding and flip-chip packaging, and be compatible with high-density, low-temperature advanced packaging in the form of an adapter plate.

[0008] The technical solution of the present invention includes:

[0009] A universal electromagnetic shielding test packaging box, characterized in that it comprises a shielding layer (1), an integrated SMA terminal (2), a high-speed substrate (3), a support seat (4), a shielding cover (5), a buckle (6), a telescopic card seat (7), a radio frequency chip (8), a packaging substrate (9), a low-temperature interconnection bump (10), and a telescopic needle (11), wherein the telescopic card seat (7) and the integrated SMA terminal (2) are fixed to the high-speed substrate (3) by welding or mechanical connection; the high-speed substrate (3) is connected to the shielding layer (1) and the support seat (4) by fixing screws; the packaged circuit is placed in the groove of the telescopic card seat (7), so that the solder pad on the back of the circuit is connected to the telescopic needle (11) correspondingly. The shielding cover (5) is fixed to the circuit and the shielding cover (5) by means of a buckle (6), wherein the signal of the radio frequency chip (8) is fanned outwards via a signal transmission link composed of a packaging substrate (9), a telescopic pin (11), a telescopic card seat (7), a high-speed substrate (3), and an integrated SMA terminal (2), wherein all conductors on the signal transmission link are made of non-magnetic metal or superconducting metal, wherein the support seat (4), the shielding layer (1), and the shielding cover (5) provide mechanical support and electromagnetic shielding for the overall structure, and the packaging substrate (9) and the telescopic card seat (7) are connected by telescopic pins, so that universal packaging tests of various radio frequency chips are realized without changing the telescopic card seat (7).

[0010] As an optional technical solution, the support seat (4), the shielding layer (1), and the shielding cover (5) are fixed as a whole by means of positioning screws.

[0011] As an optional technical solution, the non-magnetic metal or superconducting metal is one of Cu, Ag, Au, Al, Ti, Ta, and Nb.

[0012] As an optional technical solution, the shielding layer (1) adopts a semi-enclosed cavity structure, that is, the inner diameter of the shielding cavity is 1.0 to 1.2 mm larger than the outer contour of the telescopic card seat (7). This cavity structure avoids the coupling leakage capacitance between the packaging circuit and the shielding layer, while reducing the incidence probability of environmental electromagnetic radiation and reducing the signal noise in the packaging box.

[0013] As an optional technical solution, the integrated SMA terminal (2) adopts a raised ejector pin structure, which is 0.1 mm higher than the lower plane of the SMA terminal to achieve a mechanically stable connection, or is welded to the high-speed substrate (3) through reflow soldering; the SMA terminal adopts a slotted structure on the side of the ejector pin, with a slot height of 0.50 mm to 1.00 mm and a slot width of 2 mm to 2.5 mm. The slotted structure can prevent the surface wiring of the high-speed substrate (3) from generating coupling capacitance with the SMA terminal to leak the signal of the high-speed substrate (3), and can also achieve impedance matching of the planar signal transmitted to the vertical coaxial cable by adjusting the size.

[0014] As an optional technical solution, the support seat (4) has a groove of 0.5 mm to 1 mm on the back of the SMA terminal. This structure provides a feeding channel for the back of the high-speed substrate wiring, thereby avoiding signal leakage caused by the coupling capacitor.

[0015] As an optional technical solution, the telescopic card seat (7) and the high-speed substrate (3) are interconnected on one side by welding with a metal pad or mechanically connected with a telescopic needle (11); the telescopic card seat (7) and the packaging substrate (9) have a groove structure on one side to achieve horizontal fixation of the packaging circuit with a fixing error of less than 0.1 mm. This side is also provided with a surface array of telescopic needles (11), which can achieve high-performance electrical interconnection and have the function of repeated disassembly and reuse.

[0016] As an optional technical solution, the telescopic needle (11) comprises a needle tube, a spring and a needle head. The telescopic needle is made of non-magnetic metal material to reduce high-frequency transmission noise in radio frequency circuit transmission. The needle heads on both sides are fixed by compressing the spring into the needle tube, and the needle head and the needle tube are fixed by a buckle at the front end of the needle head. The telescopic needle (11) is fixed in the packaging substrate (9) in a semi-embedded mode. After packaging is completed, the telescopic needle (11) is firmly connected to the circuit lead-out terminal and the PCB board pad.

[0017] As an optional technical solution, the outer diameter of the telescopic needle is Ф0.1mm~Ф1.0mm, the inner diameter is Ф0.05mm~Ф0.8mm, the stretched length of the telescopic needle is 6.5mm, the contracted length is 5.0mm, and the maximum elongation is 1.5mm.

[0018] As an optional technical solution, the telescopic needle material is a non-magnetic material such as Al, Cu, Au, etc.

[0019] As an optional technical solution, buckles (6) are provided on both sides of the shielding cover (5) to achieve vertical fixation of the shielding cover (5) and the telescopic holder (7). A circular support protrusion is provided in the inner cavity of the shielding cover (5), and the protrusion is 0.2 to 0.5 mm higher than the outer edge of the shielding cover (5). After being fixed in the vertical direction, the protrusion is in an annular contact with the packaging substrate (9) and presses the packaging substrate (9) into the telescopic holder (7).

[0020] As an optional technical solution, the wiring of the packaging substrate (9) is made of non-magnetic low-loss material, and a metal wiring pattern is provided on the surface of the packaging substrate (9). The metal wiring pattern is used for capacitive coupling between the radio frequency chip (8) and the packaging substrate (9) to achieve cross-chip signal transmission of the radio frequency chip (8).

[0021] As an optional technical solution, the RF chip (8) and the packaging substrate (9) are interconnected by flip-chip soldering bumps, the flip-chip bumps are made of low-temperature and low-loss materials, the low-temperature and low-loss materials include one of Al, Ta, Nb, and Au, and low-temperature interconnection is achieved by ultrasonic hot pressing or reflow soldering, the low temperature is less than 150° C., or the RF chip (8) is flip-chip soldered on a silicon-based / sapphire-based adapter board, and the adapter board is then flip-chip soldered on the packaging substrate (9).

[0022] A method for assembling a universal electromagnetic shielding test package box, characterized by comprising the following steps:

[0023] Step 1, substrate assembly: the solder paste can be printed on the upper surface of the high-speed substrate (3) by screen printing or solder paste spraying, and the integrated SMA terminal (3) and the telescopic card seat (7) are welded to the surface of the high-speed substrate (3) by reflow soldering to achieve mechanical and electrical connection, or the integrated SMA terminal (3) and the telescopic pin card seat (7) are fixed to the surface of the high-speed substrate (3) by screw connection, and the electrical connection is achieved through the telescopic pin (11);

[0024] Step 2: Assemble the housing: Place the high-speed substrate (3) assembled in step 1 into the corresponding slot in the packaging box support seat (4) to achieve horizontal fixation. Then, install the shielding layer (1), compact the high-speed substrate (3) around the shielding layer (1) to achieve vertical fixation, and fix the support seat (4), shielding layer (1) and high-speed substrate (3) to each other through vertical fixing pins;

[0025] Step 3, circuit packaging: M×N (M, N are both positive integers) radio frequency chips (8) are integrated on a packaging substrate (9) by low temperature interconnection, wherein the low temperature interconnection process temperature is ≤150°C, and signal coupling between radio frequency chips (8) is achieved by capacitance inside or on the surface of the packaging substrate (9), and the packaged radio frequency circuit is placed in a designated groove in a telescopic pin holder (7), so that the back pad of the packaging substrate (9) and the telescopic pin (11) are mechanically and electrically interconnected;

[0026] Step 4: Fixing with bayonet: Place the shielding cover (5) on the telescopic pin holder (7), the back support structure of the shielding cover (5) is in contact with the packaging substrate (9) on all sides, and the mechanical interconnection between the shielding cover (5) and the telescopic pin holder (7), and between the shielding cover (5) and the shielding layer (1) is achieved through the metal buckle (6).

[0027] As an optional technical solution, the circuit packaging in step three uses wire bonding to achieve signal coupling interconnection between RF chips (8) and interconnection between RF chips (8) and packaging substrate (9). The bonding wire is made of non-magnetic low-loss metal material, and the non-magnetic low-loss metal includes one of Al, Au, and Cu. The bonding method uses 100μm to 500μm single thick wire bonding or 20μm to 75μm thin wire bonding. A high-arc bonding method is used during bonding. The shortest distance between the bonding wire and the chip edge is ≥0.5mm, and there must be ground bonding wires on both sides of the signal bonding wire to achieve signal impedance matching and avoid bonding wire signal leakage.

[0028] As an optional technical solution, the circuit packaging in step three uses flip-chip welding to achieve interconnection between the radio frequency chip (8) and the packaging substrate (9), and the flip-chip bumps use low-temperature and low-loss materials, and the low-temperature and low-loss materials include one of Al, Ta, Nb, and Au. Low-temperature interconnection is achieved by ultrasonic hot pressing or reflow welding, and the low temperature is less than 150°C. The radio frequency chip (8) can also be flip-chip welded on a silicon-based / sapphire-based adapter board, and the adapter board is flip-chip welded on the packaging substrate (9).

[0029] Beneficial effects of the present invention:

[0030] (1) The present invention uses a telescopic pin array to flexibly connect the circuit pad with the telescopic card holder, which can achieve multiplexing fan-out of up to 1024 signals. By changing the wiring in the packaging substrate, the same packaging box can be used to test different circuits, which can effectively improve the compatibility of the packaging box.

[0031] (2) The present invention provides a packaging assembly method with separated inside and outside, which separates the chip-level packaging and the packaging test box through a flexible connection, thereby avoiding the influence of the process heat process during the packaging box assembly process on the chip function.

[0032] (3) The present invention compacts the substrate and the telescopic needles around the package through the raised structure in the shielding layer cavity. The maximum telescopic length of the telescopic needle is 1.5 mm, which can effectively ensure that the substrate surface array pads are in full contact with the telescopic needles.

[0033] (4) The present invention is compatible with wire bonding and flip-chip packaging chip circuits. The surface and interior of the packaging substrate are wired with non-magnetic low-loss wiring to achieve signal transmission between RF chips and signal coupling between chips. In addition, the structure further supports the packaging integration of chip plus adapter board, which can effectively be compatible with RF chip circuits in various packaging forms and realize the universalization of packaging boxes.

[0034] (5) The chip packaging of the present invention adopts a low-temperature interconnection process, and the welding materials include but are not limited to interconnection materials such as Al, Ta, and In. The overall process temperature is less than 150°C. After the chip packaging is completed, there is no high-temperature interconnection process, which can effectively reduce the impact of high-temperature annealing on the performance of the RF chip.

[0035] (6) The integrated non-magnetic SMA terminal of the present invention adopts an array integration method surrounded by all sides, which can support 1 to 1024 signals to fan out at the same time. The bottom of the SMA terminal signal pin is raised by 0.1 to 0.3 mm and can be connected to the high-speed substrate by screws or welding, which can effectively ensure that the RF chip signal at the lead-out end is led out.

[0036] (7) The support base of the present invention adopts a slotted structure on the back of the integrated SMA terminal, with a slot depth of 0.3 to 0.5 mm. The slotted structure can effectively reduce the coupling capacitance between the SMA terminal and the signal link to the ground, effectively reduce electromagnetic signal leakage, and ensure high-speed signal high-quality transmission.

[0037] (8) The shielding layer of the present invention adopts an envelope open cavity structure, and the overall cavity structure is 1.0 to 1.2 mm larger than the outer contour of the high-speed substrate, the telescopic card seat, and the shielding cover. The envelope open cavity structure can effectively reduce the leakage of the RF chip through the capacitive coupling to the ground while providing mechanical protection and peripheral electromagnetic shielding.

[0038] (9) The universal electromagnetic shielding packaging box of the present invention adopts telescopic pin interconnection to realize multiple reuse of the radio frequency packaging box; the inner cavity of the telescopic card holder can simultaneously meet the use of wire bonding and flip-chip integrated radio frequency devices; the telescopic pin has an undefined network and can adapt to different circuit network structures; the non-magnetic metal packaging box can provide an electromagnetic shielding efficiency greater than 60dB. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0040] Figure 1 It is a schematic diagram of the structure of a universal electromagnetic shielding test packaging box of the present invention;

[0041] Figure 2 It is a schematic diagram of the structure of the radio frequency chip, the shielding cover and the telescopic card holder;

[0042] FIG3( a ) is a schematic diagram of the overall outline of the telescopic needle;

[0043] Figure 3(b) is a schematic diagram of the assembly structure of the telescopic needle before compression;

[0044] Figure 3(c) is a schematic diagram of the assembly structure of the telescopic needle after compression;

[0045] FIG4( a ) is a schematic diagram of an integrated SMA terminal structure;

[0046] FIG4( b ) is an enlarged schematic diagram of the signal pin protrusion;

[0047] FIG. 4( c ) is a schematic diagram of the side groove structure of the signal pin.

[0048] Reference numerals:

[0049] 1-shielding layer, 2-integrated SMA terminal, 3-high-speed substrate, 4-support base, 5-shielding cover, 6-clip, 7-telescopic card seat, 8-RF chip, 9-packaging substrate, 10-low-temperature interconnect bump, 11-telescopic needle, 111-needle tube, 112-needle head. DETAILED DESCRIPTION

[0050] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the relevant invention are shown in the accompanying drawings.

[0051] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0052] like Figure 1 The figure shows a schematic diagram of the structure of a universal electromagnetic shielding test packaging box of the present invention, comprising: a shielding layer 1, an integrated SMA terminal 2, a high-speed substrate 3, a support seat 4, a shielding cover 5, a buckle 6, a telescopic socket 7, a radio frequency chip 8, a packaging substrate 9, a low-temperature interconnection bump 10, and a telescopic needle 11.

[0053] The telescopic holder 7 and the integrated SMA terminal 2 are fixed on the high-speed substrate 3 by welding or mechanical connection; the high-speed substrate 3 is connected with the shielding layer 1 and the support seat 4 by fixing screws; the packaged circuit is placed in the groove of the telescopic holder 7 so that the pads on the back of the circuit are in contact with the telescopic pins 11, and the shielding cover 5 thereon is fixed to the circuit and the shielding cover 5 by the buckle 6.

[0054] like Figure 2 The figure shows the overall structure of the cavity assembled in the telescopic seat.

[0055] The RF chip 8 is connected to the package substrate 9 by low-temperature interconnect bumps 10, which use low-temperature (<150°C) flip-chip soldering or wire bonding to achieve signal interconnection and coupling. The package substrate 9 is placed in the corresponding groove of the telescopic card seat 7 to achieve horizontal fixation of the substrate. The back pad of the package substrate 9 is in one-to-one contact with the telescopic card seat 7 by a telescopic needle array. At this time, the length of the telescopic needle 11 is 6.5 mm, as shown in Figure 3(b).

[0056] The structure of the telescopic needle 11 is shown in Figure 3(a), which includes a needle tube 111, a spring and a needle 112. The telescopic needle 11 is made of non-magnetic metal material to reduce high-frequency transmission noise in radio frequency circuit transmission. The needles 112 on both sides are fixed by compressing the spring into the needle tube 111, and the needle 112 and the needle tube 111 are fixed by the front end buckle of the needle 112. The telescopic needle 11 is fixed in the packaging substrate 9 in a semi-embedded mode. After packaging is completed, the telescopic needle 11 is firmly connected to the circuit lead-out terminal and the PCB board pad.

[0057] The outer diameter of the telescopic needle 11 is Ф0.1mm-Ф1.0mm, the inner diameter is Ф0.05mm-Ф0.8mm, the stretched length of the telescopic needle is 6.5mm, the contracted length is 5.0mm, and the maximum elongation is 1.5mm.

[0058] The telescopic needle material is non-magnetic material such as Al, Cu, Au, etc.

[0059] The shielding cover 5 is buckled onto the telescopic holder 7 to fix the packaging substrate 9 in the vertical direction. The shielding cover 5 is compacted with the buckle 6 to make the solder pads on the back of the packaging substrate 9 stably contact with the array telescopic needles. After compression, the length of the telescopic needles 11 becomes 5 mm, as shown in FIG. 3( c ).

[0060] The shielding layer 1 adopts a semi-enclosed cavity structure, that is, the inner diameter of the shielding cavity is 1.0-1.2 mm larger than the outer contour of the telescopic card seat 7. This cavity structure avoids the coupling leakage capacitance between the packaging circuit and the shielding layer, while reducing the incidence probability of environmental electromagnetic radiation and reducing signal noise in the packaging box.

[0061] The integrated SMA terminal 2 is made of non-magnetic material. The integrated SMA terminal 2 and the telescopic holder 7 are aligned and integrated on the high-speed substrate 3 by welding or screw connection, as shown in FIG. 4( a ).

[0062] The integrated SMA terminal 2 adopts a raised ejector pin structure, which is 0.1mm higher than the lower plane of the SMA terminal to achieve a mechanically stable connection, or to be welded to the high-speed substrate 3 through reflow soldering; the SMA terminal adopts a slotted structure on the side of the ejector pin, as shown in Figure 4(c), with a slot height of 0.50mm~1.00mm and a slot width of 2mm~2.5mm. The slotted structure can not only avoid the coupling capacitance between the surface wiring of the high-speed substrate 3 and the SMA terminal to leak the signal of the high-speed substrate 3, but also achieve impedance matching of the planar signal to the vertical coaxial cable transmission by adjusting the size.

[0063] The support base 4 has a groove of 0.5mm to 1mm on the back of the SMA terminal. This structure provides a feeding channel for the back of the high-speed substrate wiring to avoid signal leakage caused by the coupling capacitor.

[0064] The signal contact point of the SMA port is 0.1 mm higher than the horizontal plane of the terminal to ensure stable signal contact, as shown in Figure 4(b).

[0065] The high-speed substrate 3 is placed in the groove of the support seat 4. The outer contour of the groove is 0.1 mm larger than the outer contour of the high-speed substrate 3, so that the high-speed substrate is fixed horizontally.

[0066] Through the positioning through holes at the four corners of the shielding layer 1 and the support base 4, through screws are used to achieve vertical alignment and fixation of the support base 4, the shielding layer 1 and the high-speed substrate 3.

[0067] The signal of the radio frequency chip (8) is fanned out through a signal transmission link composed of a packaging substrate (9), a telescopic needle (11), a telescopic card seat (7), a high-speed substrate (3), and an integrated SMA terminal (2). All conductors on the signal transmission link are made of non-magnetic metal or superconducting metal. The support seat (4), the shielding layer (1), and the shielding cover (5) provide mechanical support and electromagnetic shielding for the overall structure. The packaging substrate (9) and the telescopic card seat (7) are connected by the telescopic needle. Without changing the telescopic card seat (7), universal packaging tests of various radio frequency chips are achieved.

[0068] In the present invention, the non-magnetic metal or superconducting metal is one of Cu, Ag, Au, Al, Ti, Ta, and Nb.

[0069] The universal electromagnetic shielding test package box assembly method of the present invention has the following steps:

[0070] Step 1: Substrate assembly: Print solder paste on the upper surface of the high-speed substrate, and solder the integrated SMA terminal and the telescopic card holder to the surface of the high-speed substrate by reflow soldering to achieve connection. Alternatively, fix the integrated SMA terminal and the telescopic card holder to the surface of the high-speed substrate by screw connection, and realize signal transmission through the raised signal contacts at the bottom.

[0071] Step 2: Assemble the shell: Put the assembled substrate in step 1 into the corresponding slot in the support seat of the packaging box to achieve horizontal fixation. Then install the shielding layer, compact the substrate around the shielding layer, and fix it vertically with the four corner positioning screws.

[0072] Step 3: Circuit packaging: Integrate M×N (M and N are both positive integers) RF chips on the packaging substrate through low-temperature interconnection (process temperature ≤ 150°C), and realize signal coupling between chips through the internal or surface capacitance of the packaging substrate. Place the packaged circuit in the designated groove in the telescopic card holder to achieve mechanical and electrical interconnection between the pads on the back of the substrate and the telescopic needles.

[0073] Step 4: Fixing with bayonet: Place the shielding cover on the telescopic card holder, and the support structure on the back of the shielding cover is in contact with the package substrate. Through the metal bayonet, the mechanical interconnection between the shielding cover and the telescopic card holder, and between the shielding cover and the shielding layer is achieved.

[0074] Example:

[0075] The universal electromagnetic shielding test package box proposed by the present invention was used to package and test two 64-bit superconducting quantum daisy chain circuits, and the following results were achieved:

[0076] The high-speed substrate is a 4-layer Rogers substrate with a GSG stacking structure, and the substrate size is 120×120×1mm. The 128-port non-magnetic integrated terminal is fixed to the substrate by screws at the four corners and the center of the edge. The telescopic socket of the 128 telescopic pin array is fixed to the Rogersky board by screws at the four corners. The assembled substrate is placed in a support seat of 130×130×6mm. The size of the cavity structure in the support seat is 0.1mm smaller than the outer contour of the substrate, and the groove depth is 1mm. The support seat is annularly grooved on the back of the 128-port non-magnetic integrated terminal, with a groove depth of 2mm to avoid signal coupling leakage. Then a shielding layer is added, and the size of the shielding layer is 130×130×6mm. The groove in the shielding layer is 1mm larger than the outer contour of the telescopic card seat. The mechanical connection between the shielding layer, the support seat, and the high-speed substrate is achieved by fixing with four screws. The package substrate after the In bump is flipped is installed in the telescopic card seat to ensure that the telescopic pin contacts the pad on the back of the package substrate. Finally, the shielding cover is installed on the telescopic card holder, and the overall structure is compacted and fixed with buckles. Finally, the vector network test instrument is tested. Under 6GHz conditions, the insertion loss is ≥-2dB and the reflection loss is ≤-15dB, which meets the requirements of superconducting quantum bit signal transmission.

[0077] The structure and method of the present invention adopts the method of interconnecting the circuit and the telescopic card holder with telescopic pins, which effectively realizes the multiplexing of the universal superconducting quantum chip packaging box, and the universal functional test can be realized for superconducting quantum bits with different bits and interconnections only by changing the wiring of the packaging substrate. The whole process temperature ≤150℃ effectively controls the impact of the packaging process on the performance of the device and improves the packaging yield. Tested by the vector network test instrument, the insertion loss is ≥-2dB and the reflection loss is ≤-15dB under 6GHz conditions, which meets the signal transmission requirements of superconducting quantum bits.

[0078] Parts of the present invention that are not described in detail belong to common knowledge among those skilled in the art.

[0079] In the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0080] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0081] The term "comprise" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus / device.

[0082] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A universal electromagnetic shielding test package box, characterized in that: The invention comprises a shielding layer (1), an integrated SMA terminal (2), a high-speed substrate (3), a support seat (4), a shielding cover (5), a buckle (6), a telescopic card seat (7), a radio frequency chip (8), a packaging substrate (9), a low-temperature interconnection bump (10), and a telescopic needle (11), wherein the telescopic card seat (7) and the integrated SMA terminal (2) are fixed to the high-speed substrate (3) by welding or mechanical connection; the high-speed substrate (3) is connected to the shielding layer (1) and the support seat (4) by fixing screws; the packaged circuit is placed in the groove of the telescopic card seat (7) so that the pads on the back of the circuit are in contact with the telescopic needle (11) correspondingly. The shielding cover (5) is fixed to the circuit and the shielding cover (5) by means of a buckle (6), wherein the signal of the radio frequency chip (8) is fanned outwards via a signal transmission link composed of a packaging substrate (9), a telescopic pin (11), a telescopic card seat (7), a high-speed substrate (3), and an integrated SMA terminal (2), wherein all conductors on the signal transmission link are made of non-magnetic metal or superconducting metal, wherein the support seat (4), the shielding layer (1), and the shielding cover (5) provide mechanical support and electromagnetic shielding for the overall structure, and the packaging substrate (9) and the telescopic card seat (7) are connected by telescopic pins, thereby realizing universal packaging testing of various radio frequency chips.

2. A universal electromagnetic shielding test package box as claimed in claim 1, characterized in that: The shielding layer (1) adopts a semi-enclosed cavity structure, that is, the inner diameter of the shielding cavity is 1.0 to 1.2 mm larger than the outer contour of the telescopic card seat (7). The cavity structure avoids the coupling leakage capacitance between the packaging circuit and the shielding layer, while reducing the incidence probability of environmental electromagnetic radiation and reducing the signal noise in the packaging box.

3. The universal electromagnetic shielding test package box according to claim 1, characterized in that: The integrated SMA terminal (2) adopts a raised ejector pin structure, which is 0.1 mm higher than the lower plane of the SMA terminal to achieve a mechanically stable connection, or to be welded to the high-speed substrate (3) through reflow soldering; the SMA terminal adopts a slotted structure on the side of the ejector pin, with a slot height of 0.50 mm to 1.00 mm and a slot width of 2 mm to 2.5 mm. The slotted structure can prevent the surface wiring of the high-speed substrate (3) from generating coupling capacitance with the SMA terminal to leak the signal of the high-speed substrate (3), and can also achieve impedance matching of the transmission of the planar signal to the vertical coaxial cable through the adjustment of the size.

4. The universal electromagnetic shielding test package box according to claim 1, characterized in that: The support seat (4) has a groove of 0.5 mm to 1 mm on the back of the SMA terminal. This structure provides a feeding channel for the back of the high-speed substrate wiring, thereby avoiding signal leakage caused by the coupling capacitor.

5. The universal electromagnetic shielding test package box according to claim 1, characterized in that: The telescopic card seat (7) and the high-speed substrate (3) are interconnected on one side by welding with a metal pad or mechanically connected with a telescopic pin (11); the telescopic card seat (7) and the packaging substrate (9) have a groove structure on one side to achieve horizontal fixation of the packaging circuit with a fixing error of less than 0.1 mm. This side is also provided with a surface array of telescopic pins (11), which can achieve high-performance electrical interconnection and have the functions of repeated disassembly and reuse.

6. The universal electromagnetic shielding test package box according to claim 1, characterized in that: The telescopic needle (11) comprises a needle tube, a spring and a needle head. The telescopic needle is made of non-magnetic metal material to reduce high-frequency transmission noise in radio frequency circuit transmission. The needle heads on both sides are fixed by compressing the spring into the needle tube, and the needle head and the needle tube are fixed by a needle head front end buckle. The telescopic needle (11) is fixed in the packaging substrate (9) in a semi-embedded mode. After packaging is completed, the telescopic needle (11) is firmly connected to the circuit lead-out terminal and the PCB board pad.

7. The universal electromagnetic shielding test package box according to claim 1, characterized in that: Buckles (6) are provided on both sides of the shielding cover (5) to achieve vertical fixation of the shielding cover (5) and the telescopic holder (7). A circular support protrusion is provided in the inner cavity of the shielding cover (5). The protrusion is 0.2 to 0.5 mm higher than the outer edge of the shielding cover (5). After being fixed in the vertical direction, the protrusion is in an annular contact with the packaging substrate (9) around the periphery and presses the packaging substrate (9) tightly into the telescopic holder (7).

8. The universal electromagnetic shielding test package box according to claim 1, characterized in that: The packaging substrate (9) wiring is made of non-magnetic low-loss material, and a metal wiring pattern is provided on the surface of the packaging substrate (9). The metal wiring pattern is used for capacitive coupling between the radio frequency chip (8) and the packaging substrate (9) to achieve cross-chip signal transmission of the radio frequency chip (8).

9. The universal electromagnetic shielding test package box according to claim 1, characterized in that: The radio frequency chip (8) and the packaging substrate (9) are interconnected by means of flip-chip soldering bumps, wherein the flip-chip bumps are made of low-temperature, low-loss materials, and the low-temperature, low-loss materials include one of Al, Ta, Nb, and Au. Low-temperature interconnection is achieved by means of ultrasonic hot pressing or reflow soldering, wherein the low-temperature temperature is less than 150° C., or the radio frequency chip (8) is flip-chip soldered on a silicon-based / sapphire-based adapter board, and then the adapter board is flip-chip soldered on the packaging substrate (9).

10. A method for assembling a universal electromagnetic shielding test package box, characterized in that The following steps are involved: Step 1, substrate assembly: solder paste is printed on the upper surface of the high-speed substrate (3) by screen printing or solder paste spraying, and the integrated SMA terminal (3) and the telescopic card seat (7) are welded to the surface of the high-speed substrate (3) by reflow soldering to achieve mechanical and electrical connection, or the integrated SMA terminal (3) and the telescopic pin card seat (7) are fixed to the surface of the high-speed substrate (3) by screw connection, and electrical connection is achieved through the telescopic pin (11); Step 2: Assemble the housing: Place the high-speed substrate (3) assembled in step 1 into the corresponding slot in the packaging box support seat (4) to achieve horizontal fixation. Then, install the shielding layer (1), compact the high-speed substrate (3) around the shielding layer (1) to achieve vertical fixation, and fix the support seat (4), shielding layer (1) and high-speed substrate (3) to each other through vertical fixing pins; Step 3, circuit packaging: M×N (M, N are both positive integers) radio frequency chips (8) are integrated on a packaging substrate (9) by means of low temperature interconnection, wherein the temperature of the low temperature interconnection process is ≤150° C., and signal coupling between radio frequency chips (8) is achieved by capacitance inside or on the surface of the packaging substrate (9), and the packaged radio frequency circuit is placed in a designated groove in a telescopic pin holder (7), so that the back pad of the packaging substrate (9) and the telescopic pin (11) are mechanically and electrically interconnected; Step 4: Fixing with bayonet: Place the shielding cover (5) on the telescopic pin holder (7), the back support structure of the shielding cover (5) is in contact with the packaging substrate (9) on all sides, and the mechanical interconnection between the shielding cover (5) and the telescopic pin holder (7), and between the shielding cover (5) and the shielding layer (1) is achieved through the metal buckle (6).

11. A method for assembling a universal electromagnetic shielding test package box according to claim 10, characterized in that: The circuit packaging in step 3 uses wire bonding to achieve signal coupling interconnection between RF chips (8) and interconnection between RF chips (8) and packaging substrate (9). The bonding wire is made of non-magnetic low-loss metal material. The non-magnetic low-loss metal includes one of Al, Au, and Cu. The bonding method uses 100μm to 500μm single thick wire bonding or 20μm to 75μm thin wire bonding. A high-arc bonding method is used during bonding. The shortest distance between the bonding wire and the chip edge is ≥0.5mm, and ground bonding wires must exist on both sides of the signal bonding wire to achieve signal impedance matching and avoid bonding wire signal leakage.

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