TGV arrangement method for improving TGV punching efficiency

Abstract

The invention discloses a TGV arrangement method for improving TGV punching efficiency, and belongs to the field of glass-based LED direct display, and the method comprises the following steps: 1, carrying out the design of a glass-based LED direct display schematic diagram; step 2, setting a line width and a line distance, serially connecting column lines in the same column in the same data, and parallelly connecting common levels of the LEDs in the same row; step 3, Driver is arranged at the central position of the data set; step 4, performing line layout to complete electrical connection; step 5, carrying out cross flow channel line layout to complete electrical connection; step 6, taking the data set as a template, and performing analogy to other data sets in the single lamp panel to complete the layout of the whole panel; step 7, performing signal connection to complete electrical connection; 8, ending work is carried out; and step 9, DRC is carried out to complete image detection. According to the invention, the TGV arrangement array of the design drawing is orderly, the circuit layout is simple and orderly, the requirement of the circuit on the number of board layers is reduced, and the processing efficiency of the TGV is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of glass-based LED direct display, and in particular to a TGV arrangement method for improving TGV drilling efficiency. Background Art

[0002] Glass-based LED Direct Display is a new type of display technology that integrates traditional LED display screens on transparent or translucent glass substrates. This technology combines the unique characteristics of glass materials with the advantages of LED displays, providing users with a brand new visual experience and application scenarios.

[0003] In the existing glass-based LED direct display technology, the driver is on the glass base, which has high requirements for the board layer, disordered TGV arrangement, low punching efficiency; and the glass-based direct display cannot explore smaller pitches. Summary of the invention

[0004] The purpose of the present invention is to provide a TGV arrangement method for improving the TGV drilling efficiency, cooperate with a customized Driver chip, be compatible with a smaller Pitch, arrange the TGV array in an orderly manner in the design drawing, make the circuit layout simple and orderly, reduce the requirements of the circuit on the number of board layers, and improve the processing efficiency of TGV.

[0005] To achieve the above object, the present invention provides a TGV arrangement method for improving TGV drilling efficiency, comprising the following steps:

[0006] Step 1: Define the size of the preliminary data group and the array layout of the LED, design the schematic diagram of the glass-based LED direct display, and enter the Layout and design layout;

[0007] Step 2: Set appropriate line width and line spacing, string together the column lines in the same column of the same data, and connect the LED common level lines in the same row in parallel;

[0008] Step 3: Place the Driver at the center of a data set;

[0009] Step 4: Layout the lines and complete the electrical connection;

[0010] Step 5: Layout the cross-flow channel circuits to complete the electrical connection. According to different pitches, two TGV layouts are designed, namely double cross layout and double fengzi layout.

[0011] Step 6: Use the data group of the central layout Driver as a template and apply it to the remaining data groups in the single light board to complete the layout of the entire board;

[0012] Step 7, perform signal connection to complete the electrical connection;

[0013] Step 8: Process VDD and GND and finish the copper coating;

[0014] Step nine, DRC completes the drawing inspection and completes the design.

[0015] Preferably, in step three, the customized Driver size is square, the number of row I / O ports is 30*2, the number of cross-flow channel I / O ports is 27*3*2, and the number of LEDs carried by the Driver is: 54*3 (RGB)*60S; the pins are specifically defined and sorted, the upper part is the cross-flow channels R1.G1.B1 to R27.G27.B27, arranged from right to left, and the lower part is the cross-flow channels R28.G28.B28 to R54.G54.B54, arranged from right to left; the left part is the scan channels H1.H3.H5 to.H59, arranged from top to bottom in sequence, and the right part is the scan channels H2.H4.H6 to H60, arranged from top to bottom in sequence, to complete the definition of the Driver channel arrangement.

[0016] Preferably, in step 4, the scan channels on both sides are laid out from the I / O port, enter the inner layer circuit through the hole, are laid out to each scan channel, are connected to each scan through TGV, and the row line completes the electrical connection.

[0017] Preferably, the TGVs are arranged equidistantly in a straight line at a distance of 2*pitch.

[0018] Preferably, in step five, the cross-flow channels of the upper and lower parts are driven by the surface circuit layout to each column, and then connected to the circuit on the LED surface through the hole-TGV-hole to complete the electrical connection of the cross-flow channels.

[0019] Preferably, the double cross arrangement has a pitch ≥ 1.25, and the double Feng character arrangement has a pitch ≥ 2.5 ≥ 1.25.

[0020] Therefore, the present invention adopts the above-mentioned TGV arrangement method for improving TGV drilling efficiency, and is designed through method steps, with a customized Driver chip, compatible with a pitch as small as 0.5 mm; the circuit layout is simple and orderly, which greatly reduces the requirements of the circuit on the number of board layers; the design drawing and the TGV arrangement array are orderly, which greatly improves the processing efficiency of the TGV in the subsequent substrate processing stage.

[0021] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a diagram showing the LED connection relationship of an embodiment of the present invention;

[0023] Figure 2 A diagram showing the Driver configuration of an embodiment of the present invention;

[0024] Figure 3 This is a Driver signal arrangement diagram of an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of the Driver layout of an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of a row line layout according to an embodiment of the present invention;

[0027] Figure 6 A schematic diagram of a column line layout according to an embodiment of the present invention;

[0028] Figure 7 A schematic diagram of a double cross arrangement according to an embodiment of the present invention;

[0029] Figure 8 Schematic diagram of the arrangement of double Feng characters according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages disclosed in the embodiments of the present invention clearer, the embodiments of the present invention are further described in detail in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the embodiments of the present invention and are not intended to limit the embodiments of the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions.

[0031] It should be noted that the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or server that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or devices.

[0032] Like reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0034] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting", "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] Example

[0036] A TGV arrangement method for improving TGV drilling efficiency according to the present invention comprises the following steps:

[0037] Step 1: Define the size of the preliminary data group and the array layout of the LED, design the glass-based LED direct display schematic, and enter the Layout and design layout.

[0038] Step 2: Set appropriate line width and line spacing, connect the column lines of the same column in the same data in series, and connect the LED common level lines of the same row in parallel. Figure 1 As shown, all the same rows and columns in the same data are connected in parallel, and all the same columns are connected in series.

[0039] Step 3: Place the Driver (circuit driver) at the center of a data group, such as Figure 4 The custom driver size is square as shown. Figure 2As shown, the number of row I / O ports is 30*2 (on both sides), and the number of cross-flow channel I / O ports is 27*3*2 (on both sides), so the maximum number of LEDs that the Driver can carry is 54*3 (RGB)*60S. The pins are specifically defined and sorted. The upper part is the cross-flow channel R1.G1.B1......R27.G27.B27, arranged from right to left, and the lower part is the cross-flow channel R28.G28.B28......R54.G54.B54, arranged from right to left; the left part is the scan channel H1.H3.H5......H59, arranged from top to bottom, and the right part is the scan channel H2.H4.H6......H60, arranged from top to bottom; thus, the Driver channel arrangement definition can be completed, as shown in the Driver arrangement schematic diagram below. Figure 3 shown.

[0040] Step 4: Layout the scan channels on both sides from the I / O port immediately through the hole into the inner layer circuit, and then layout them near each scan, such as Figure 5 Then connect to each scan through TGV, and the row line completes the electrical connection (LED common level completes the electrical connection). At this time, TGV is arranged in a straight line at an equal distance of 2*pitch.

[0041] Step 5: Layout the upper and lower cross-flow channels directly through the surface circuit to the vicinity of each column driver, and then connect directly to the circuit on the LED surface through: hole-TGV-hole to complete the electrical connection of the cross-flow channel, such as Figure 6 As shown. Because the I / O layout is arranged in the design order, you only need to connect the lines, and there will be no line conflict or crossing. According to different pitches, two TGV layout methods are designed; one is a double cross layout for pitch ≥ 1.25, such as Figure 7 As shown; the other is the double Feng character arrangement, the double Feng character arrangement 2.5≥pitch≥1.25. Figure 8 As shown, it is compatible with smaller pitches, up to 0.625mm.

[0042] Step 6: Use the data group of the central layout Driver as a template and apply it to other data groups in the single light board to complete the layout of the entire board.

[0043] Step seven, complete the electrical connection of the signal.

[0044] Step 8: Processing of VDD and GND, copper coating and other finishing work.

[0045] Step nine, finally DRC completes the drawing inspection and completes the design.

[0046] By following the above steps and combining with the customized Driver chip, the design can be compatible with a pitch as small as 0.5mm; the circuit layout is simple and orderly, which greatly reduces the requirement for the number of board layers; more importantly, the TGV array in the designed drawing is orderly, which greatly improves the processing efficiency of TGV in the subsequent substrate processing stage.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. A TGV arrangement method for improving TGV drilling efficiency, characterized in that: The following steps are involved: Step 1: Define the size of the preliminary data group and the array layout of the LED, design the schematic diagram of the glass-based LED direct display, and enter the Layout and design layout; Step 2: Set appropriate line width and line spacing, string together the column lines in the same column of the same data, and connect the LED common level lines in the same row in parallel; Step 3: Place the Driver at the center of a data set; Step 4: Layout the lines and complete the electrical connection; Step 5: Layout the cross-flow channel circuits to complete the electrical connection. According to different pitches, two TGV layouts are designed, namely double cross layout and double fengzi layout. Step 6: Use the data group of the central layout Driver as a template and apply it to the remaining data groups in the single light board to complete the layout of the entire board; Step 7, perform signal connection to complete the electrical connection; Step 8: Process VDD and GND and finish the copper coating; Step nine, DRC completes the drawing inspection and completes the design.

2. The TGV arrangement method for improving TGV drilling efficiency according to claim 1, characterized in that: In step three, the Driver size is customized to be square, the number of row I / O ports is 30*2, the number of cross-flow channel I / O ports is 27*3*2, and the number of LEDs carried by the Driver is: 54*3(RGB)*60S; the pins are specifically defined and sorted, the upper part is the cross-flow channels R1.G1.B1 to R27.G27.B27, arranged from right to left, and the lower part is the cross-flow channels R28.G28.B28 to R54.G54.B54, arranged from right to left; the left part is the scan channels H1.H3.H5 to.H59, arranged from top to bottom, and the right part is the scan channels H2.H4.H6 to H60, arranged from top to bottom, completing the definition of the Driver channel arrangement.

3. The TGV arrangement method for improving TGV drilling efficiency according to claim 2, characterized in that: In step 4, the scan channels on both sides are laid out from the I / O port, enter the inner layer line through the hole, laid out to each scan channel, connected to each scan through TGV, and the row line completes the electrical connection.

4. The TGV arrangement method for improving TGV drilling efficiency according to claim 3, characterized in that: The TGVs are arranged in a straight line at an equal distance of 2*pitch.

5. The TGV arrangement method for improving TGV drilling efficiency according to claim 4, characterized in that: In step five, the cross-flow channels of the upper and lower parts are laid out to each column driver through the surface circuit, and then connected to the circuit on the LED surface through the hole-TGV-hole to complete the electrical connection of the cross-flow channel.

6. The TGV arrangement method for improving TGV drilling efficiency according to claim 5, characterized in that: The double cross arrangement pitch is ≥1.25, and the double Feng character arrangement is 2.5≥pitch≥1.25.

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