Temperature detection device for food materials

Abstract

A temperature detection device (1) for food materials, comprising: a housing (100) and a control circuit board (200); a mounting cavity is formed in the shell (100); the shell (100) comprises a metal section (110) and an insulating section (120), and the insulating section (120) is located behind the metal section (110); the control circuit board (200) is arranged in the mounting cavity; the control circuit board (200) is provided with a main body part (210) and an extension part (220) extending backwards from the main body part (210), the main body part (210) is arranged in a mounting cavity formed by the metal section (110), the main body part (210) is provided with a control circuit (211), and the control circuit (211) is provided with an antenna signal processing unit (2111); the extension part (220) is provided with at least one layer or a plurality of layers of laminated and fixed base material layers (221), the extension part (220) is provided with an antenna (222), and the antenna (222) is electrically connected with the antenna signal processing unit (2111) through a conductive wire (2221); the main body part (210) of the control circuit board (200) is further provided with a grounding feed point (600) close to the extension part (220), the grounding feed point (600) is electrically connected with the antenna signal processing unit (2111), and the grounding feed point (600) is connected with the metal section (110) in an abutting mode through a metal contact (601).

Description

A temperature detection device for food Technical Field

[0001] The present application relates to the field of food cooking, and in particular to a temperature detection device for detecting the temperature of food. Background Art

[0002] With the advancement of technology and the increasing demand for taste and nutrition of food, people expect to more accurately control the temperature elements in the cooking process, such as more precise control of the temperature of food.

[0003] Meat and other similar ingredients often experience a significant temperature difference between the surface and interior, with the center of the ingredient typically being the coldest. To detect the temperature near the center of the ingredient, a temperature probe is typically designed to be insertable, such as a needle-like structure, to measure the temperature of the interior (e.g., the center) of the ingredient.

[0004] Typically, in order to continuously obtain the temperature of food, during the cooking process, the temperature detection device remains inserted into the food and remains in the cooking space (such as an oven, steamer, fryer, etc.) together with the food.

[0005] After the temperature detection device obtains the temperature, it needs to transmit the temperature signal wirelessly to other devices. Considering the environment in which the temperature detection device is used and its own structure, how to design its antenna structure is a challenging problem. Technical issues

[0006] In order to solve the above problems, the present application mainly provides a temperature detection device for food, which is described in detail below. Technical Solutions

[0007] According to a first aspect, an embodiment provides a temperature detection device for food, comprising:

[0008] a housing having a front end capable of being inserted into food and a rear end opposite the front end, the housing forming a mounting cavity; the housing comprising a metal section and an insulating section, the insulating section being located behind the metal section;

[0009] A control circuit board is arranged in the installation cavity; the control circuit board has a main body and an extension part extending backward from the main body, the main body is arranged in the installation cavity formed by the metal segment, the main body has a control circuit, and the control circuit has an antenna signal processing unit; the extension part has at least one or more layers of stacked and fixed base material layers, the extension part is provided with an antenna, and the antenna is electrically connected to the antenna signal processing unit through a conductive wire; the main body of the control circuit board is also provided with a grounding feed point near the extension part, the grounding feed point is electrically connected to the antenna signal processing unit, and the grounding feed point is connected to the metal segment through a metal contact.

[0010] In one embodiment, the base material layer provided with the antenna is an antenna layer, and in the stacking direction of the base material layers, the antenna layer is located at the outermost side.

[0011] In one embodiment, the substrate layer is at least two layers. In the stacking direction of the substrate layers, the two outermost substrate layers are both the antenna layers, and the antennas on the two antenna layers are electrically connected to each other.

[0012] In one embodiment, one antenna layer is a first antenna layer, and the other antenna layer is a second antenna layer; on the first antenna layer, the antenna is electrically connected to the antenna signal processing unit through the conductive wire.

[0013] In one embodiment, the first antenna layer is provided with a first impedance matching structure, and the first impedance matching structure is provided on both sides of the conductive line;

[0014] The first impedance matching structure extends forward to the ground feeding point of the main body, so that the first impedance matching structure is electrically connected to the ground feeding point.

[0015] In one embodiment, the distance between the first impedance matching structure and the conductive line is 5 mil.

[0016] In one embodiment, the width of the conductive line is 17 mil.

[0017] In one embodiment, two grounding conductive vias are provided on the main body of the control circuit board near the extension portion to form the grounding feeding point.

[0018] In one embodiment, the metal contact comprises an elastic member, two ends of which are respectively connected to the two grounding conductive vias and form a bow shape to contact and connect with the metal segment.

[0019] In one embodiment, the elastic member is a spring.

[0020] In one embodiment, the metal contact comprises a spring, and two ends of the spring are respectively connected to two grounding conductive vias and in contact with the metal segment.

[0021] In one embodiment, the substrate layer has six layers.

[0022] In one embodiment, the first antenna layer is adjacent to two clearance layers.

[0023] In one embodiment, the first antenna layer is the first layer, and the fourth layer in the substrate layer is configured as a complete ground plane.

[0024] In one embodiment, the complete ground plane is electrically connected to the first impedance matching structure through a second conductive via.

[0025] In one embodiment, a second impedance matching structure is provided on the second antenna layer. The second impedance matching structure corresponds to the position of the first impedance matching structure and is electrically connected to the first impedance matching structure through a second conductive via.

[0026] In one embodiment, the temperature detection device further comprises an ambient temperature detection unit, which is provided on the housing and is used to detect the temperature of the cooking environment of the food;

[0027] The extension portion is further provided with an onboard conductive wire. The antenna and the onboard conductive wire are respectively fixed on different substrate layers. The onboard conductive wire is used to electrically connect the control circuit with the ambient temperature detection unit.

[0028] In one embodiment, the substrate layer comprises at least three layers, and in the stacking direction of the substrate layers, the two outermost substrate layers are both the antenna layers, and the antennas on the two antenna layers are electrically connected to each other;

[0029] The substrate layer provided with the on-board conductive lines is located between the two antenna layers.

[0030] In one embodiment, the control circuit board is provided with two conductive vias near the extension portion to form the ground feeding point.

[0031] In one embodiment, the on-board conductive wire has a detection unit positive wire and a detection unit negative wire, the first detection unit wire and the second detection unit wire electrically connect the ambient temperature detection unit with the control unit, the substrate layer where the first detection unit wire and the second detection unit wire are located is located on the inner side of the antenna layer, and the antenna layer has a first contact and a second contact for electrically connecting the ambient temperature detection unit, the first contact is electrically connected to the detection unit positive wire, and the second contact is electrically connected to the detection unit negative wire.

[0032] In one embodiment, the first detection unit wire and the second detection unit wire are fixed on the same substrate layer or respectively fixed on different substrate layers, the first detection unit wire is electrically connected to the first contact through a third conductive via, and the second detection unit wire is electrically connected to the second contact through a fourth conductive via.

[0033] In one embodiment, the on-board conductive wire has a charging wire, the control circuit has a charging circuit, and the charging wire is electrically connected to the charging circuit; the base material layer provided with the charging wire is a charging wire layer, the charging wire layer is located on the inner side of the antenna layer, the antenna layer has charging contacts, and the charging contacts are electrically connected to the charging wire.

[0034] In one embodiment, the insulating segment is provided with a metal conductive member, the metal conductive member is electrically connected to the charging point contact, the metal segment is electrically connected to the charging circuit, and the metal conductive member and the metal segment respectively serve as one of the positive and negative electrodes of the charging circuit to achieve charging.

[0035] In one embodiment, the charging line layer is located between the antenna layer and the first detection unit wire layer, or between the antenna layer and the second detection unit wire layer, and the charging contact is electrically connected to the charging line through a fifth conductive hole.

[0036] In one embodiment, the substrate layer adjacent to the antenna layer is a clearance layer.

[0037] In one embodiment, the clearance layer has two layers.

[0038] In one embodiment, a transverse dimension of the extension portion is smaller than a transverse dimension of the main body portion. Beneficial effects

[0039] According to the temperature detection device of some of the above embodiments, a dipole-structured antenna is constructed, and a ground plane is constructed near the antenna signal feed point to provide a loop, thereby making the signal attenuation very small. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG1 is a schematic diagram of the appearance structure of a temperature detection device according to an embodiment of the present application;

[0041] FIG2 is an exploded schematic diagram of a temperature detection device according to an embodiment of the present application;

[0042] FIG3 is an exploded schematic diagram of a control circuit board, an ambient temperature detection unit, and a metal conductive member in one embodiment of the present application;

[0043] FIG4 is a schematic structural diagram of a control circuit board in one embodiment of the present application;

[0044] FIG5 is a schematic cross-sectional view of a housing, a control circuit board, an ambient temperature detection unit, and a metal conductive member in one embodiment of the present application;

[0045] FIG6 is a schematic diagram of a stacked structure of substrate layers of an extension portion of a control circuit board in one embodiment of the present application;

[0046] FIG7 is a schematic diagram of the circuits on each substrate layer on the extension portion of one embodiment of the present application. This figure omits each substrate layer and shows the circuits of each substrate layer on the same plane to facilitate the overall electrical connection between the temporary antenna and the onboard conductive wires;

[0047] FIG8 is a schematic diagram of a circuit on the first antenna layer in one embodiment of the present application;

[0048] FIG9 is a schematic diagram of a circuit on a clearance layer in one embodiment of the present application;

[0049] FIG10 is a schematic diagram of a circuit on a conductive line layer of a first detection unit in one embodiment of the present application;

[0050] FIG11 is a schematic diagram of a circuit on a conductor layer of a second detection unit in one embodiment of the present application;

[0051] FIG12 is a schematic diagram of a circuit on a charging line layer in one embodiment of the present application;

[0052] FIG13 is a schematic diagram of a circuit on a second antenna layer in one embodiment of the present application;

[0053] FIG14 is a schematic diagram of electrical connections between an antenna signal processing unit and a charging circuit and other structures in a control circuit in one embodiment of the present application;

[0054] FIG15 is a schematic structural diagram of a metal contact in an embodiment of the present application. Modes for Carrying Out the Invention

[0055] The present application is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0056] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various embodiments. Furthermore, the steps or actions in the method description may be reordered or adjusted in a manner readily apparent to those skilled in the art. Therefore, the various sequences in the specification and drawings are provided solely for the purpose of clearly describing a particular embodiment and are not intended to be mandatory, unless otherwise specified.

[0057] Component numbers used herein, such as "first" and "second," are used solely to distinguish the components being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0058] This application provides a temperature detection device for food ingredients. The device can be inserted into the food ingredients during cooking to detect the internal temperature, particularly to accurately determine the lowest internal temperature. The food ingredients can be in any cooking state, including but not limited to steaming, boiling, baking, roasting, frying, deep-frying, or any other heat-treated method. Of course, the temperature detection device can be placed directly in the measured environment for temperature measurement. The measured environment includes but is not limited to a cooking environment.

[0059] 1-5 , the temperature detection device 1 includes a housing 100 and a control circuit board 200. Of course, in some embodiments, the temperature detection device 1 may further include other related components according to other functional requirements, such as an ambient temperature detection unit 300, a food temperature detection unit 400 for detecting the temperature of food, or a battery for power supply, etc.

[0060] The housing 100 is used to protect and install components that realize the functions of the temperature detection device 1 (such as the food temperature detection unit 400, the control circuit board 200, the battery and / or the ambient temperature detection unit 300, etc.). The housing 100 forms an installation cavity for accommodating and installing other components. In some embodiments, the housing 100 can be a structure with a cavity inside, and the functional components of the temperature detection device 1 can be arranged in the cavity inside the housing 100. In some embodiments, there can be one cavity inside the housing 100, and the functional components of the temperature detection device 1 can be arranged in the cavity; there can also be multiple cavities inside the housing 100, and one or more functional components of the temperature detection device 1 can be arranged in each cavity. The one or more cavities can be of any shape as long as they do not affect the installation of the functional components of the temperature detection device 1.

[0061] 1-5 , in some embodiments, the housing 100 may be assembled from multiple parts. In other embodiments, the housing 100 may also be formed from a single part.

[0062] In some embodiments, the housing 100 may enclose the functional components of the temperature detection device 1. That is, the housing 100 may be located at the outermost layer of the temperature detection device 1, blocking the outside world from contacting the components inside the housing 100. In some embodiments, the housing 100 may not completely enclose the functional components of the temperature detection device 1. For example, part of the ambient temperature detection unit 300 may be located outside the housing 100 to facilitate temperature measurement.

[0063] Referring to Figures 1-5 , in some embodiments, the housing 100 has a front end capable of being inserted into food and a rear end opposite the front end. For example, the housing 100 may have a pointed protrusion at one end as the front end. This pointed protrusion facilitates insertion of the temperature detection device 1 into the object to be measured for temperature measurement. In some embodiments, the housing 100 may be formed into an elongated structure, such as a tubular structure. In some embodiments, the diameter of the front end of the elongated structure of the housing 100 gradually decreases until it approaches zero, forming a closed, sharp front end. In some embodiments, the housing 100 may be a hollow tubular structure with one end closed, and the functional components of the temperature detection device 1 may be mounted within the hollow tubular structure. In some embodiments, the cross-section of the housing 100 may be circular, oval, triangular, rectangular, polygonal, or a special shape. In some embodiments, to facilitate hand-held temperature measurement using the temperature detection device 1, a handle may be provided at one end (e.g., the rear end) of the housing 100 for easy gripping. In some embodiments, the handle may be located away from the front end. In some embodiments, the material of the housing 100 may have a certain degree of hardness to maintain the shape of the housing 100 and to provide some protection for the internal functional components.

[0064] The control circuit board 200 is disposed within the mounting cavity of the housing 100 and can be directly or indirectly fixed to the housing 100. The control circuit board 200 includes a control circuit 211, which is used to control some or all of the functions of the temperature detection device 1, such as, but not limited to, controlling each sensor, receiving, processing, and transmitting temperature signals, controlling communication with other devices, and / or charging the device. The control circuit 211 can utilize various circuits and / or structures capable of information processing and logical judgment, such as a processor, memory, and other devices.

[0065] The ambient temperature detection unit 300 is electrically connected to the control circuit 211 and is used to detect the temperature of the measured environment (e.g., the cooking environment). The food temperature detection unit 400 is electrically connected to the control circuit 211 and is used to detect the temperature of the food. The measured ambient temperature can be used to, but is not limited to, help the control circuit 211 better determine the actual temperature of the food. This can be achieved using existing technologies and will not be elaborated upon here. The ambient temperature detection unit 300 is disposed within the housing 100 and can be completely embedded within the housing 100 or partially exposed from the housing 100 to detect the temperature of the cooking environment. The food temperature detection unit 400 and the ambient temperature detection unit 300 have structures capable of directly or indirectly detecting temperature, and any feasible method can be used to achieve temperature detection. For example, in some embodiments, the food temperature detection unit 400 and the ambient temperature detection unit 300 include components for sensing heat and obtaining temperature information. In some embodiments, the food temperature detection unit 400 and the ambient temperature detection unit 300 can be sensors that detect temperature or temperature-related signals and convert them into usable output signals.

[0066] In some embodiments, the sensor can be a thermocouple (TC), a resistance temperature detector (RTD), a thermistor, or any combination thereof. In some embodiments, to facilitate rapid temperature measurement, the sensor can be a thermocouple. A thermocouple consists of two conductors of different compositions connected at both ends to form a circuit, with one end directly used for temperature measurement serving as the temperature measurement terminal and the other end serving as the compensation terminal. In some embodiments, the sensor can be a negative temperature coefficient (NTC) thermistor. A thermistor consists of a thermal probe (temperature measurement terminal), a conductive connection terminal, and a housing 100.

[0067] Referring to FIG. 4 , in some embodiments, the control circuit board 200 includes a main body 210 and an extension 220 extending rearward from the main body 210. The main body 210 and the extension 220 form an integrated structure, which may include a fixed connection between the main body 210 and the extension 220 (e.g., welding, bonding, clamping, screwing, etc.), or an integral structure where the main body 210 and the extension 220 are different regions of the same circuit board.

[0068] The control circuit 211 is provided on the main body 210 and serves as the primary control portion of the entire control circuit board 200. For example, in some embodiments, as shown in FIG14 , the control circuit 211 may include an antenna signal processing unit 2111 to process data and send commands. The antenna signal processing unit 2111 may be used to control the antenna's signal transmission and reception and process antenna signals.

[0069] In some embodiments, the extension portion 220 comprises a single substrate layer 221; in some embodiments, the extension portion 220 comprises at least two laminated and fixed substrate layers 221. Referring to Figures 4 and 6, in some embodiments, the extension portion 220 comprises at least two laminated and fixed substrate layers 221. Each substrate layer 221 is used to provide a corresponding circuit. The substrate layer 221 is made of an insulating material. For example, in some embodiments, various materials suitable for circuit board substrates can be selected. Of course, the main body 210 can also be made of the same material as the extension portion 220 to form the final main body 210. In some embodiments, the main body 210 can utilize the same laminated structure of substrate layers 221 as the extension portion 220. The corresponding substrate layers 221 on the main body 210 and the extension portion 220 can be a single, complete substrate. That is, at least two laminated substrate layers 221 form the entire control circuit board 200. The control circuit board 200 is divided into the main body 210 and the extension portion 220 based on the different circuit structures. Of course, in other embodiments, the main body 210 and the extension 220 may be two separate components, manufactured separately. The main body 210 may not have the same laminated structure as the extension 220. In some embodiments, the control circuit 211 of the main body 210 may be disposed on the same substrate layer 221. As long as the control circuit 211 on the main body 210 can perform the relevant functions, such as transmitting and receiving antenna signals, detecting ambient temperature, and charging the device, the structure of the main body 210 may adopt any feasible solution.

[0070] In some embodiments, the extension portion 220 is provided with an antenna 222. The antenna 222 is electrically connected to the antenna signal processing unit 2111. The antenna 222 is fixedly provided on the extension portion 220, ensuring that the position of the antenna 222 is stable.

[0071] In some embodiments, the extension portion 220 is further provided with an onboard conductive wire 223 . The onboard conductive wire 223 is a conductive circuit fixedly mounted on the extension portion 220 of the onboard structure. The conductive circuit is used to electrically connect the control circuit 211 to other components, such as, but not limited to, the ambient temperature detection unit 300 and / or the charging electrode. The onboard conductive wire 223 is fixedly mounted on the extension portion 220 , ensuring a stable position of the onboard conductive wire 223 .

[0072] In the example where the extension portion 220 is provided with an antenna 222 and an onboard conductive wire 223, the antenna 222 and the onboard conductive wire 223 are fixedly arranged on the extension portion 220, which ensures the stability of the position of the antenna 222 and the position of the onboard conductive wire 223, and keeps the antenna 222 and the onboard conductive wire 223 in fixed relative positions, thereby improving the consistency of the positions of the antenna 222 and the onboard conductive wire 223, avoiding the shaking of the antenna 222 and the onboard conductive wire 223, and thereby reducing the interference with the communication signal of the antenna 222 caused by the shaking of the antenna 222 and the onboard conductive wire 223, thereby improving the communication effect of the antenna 222.

[0073] At the same time, compared to placing the antenna 222 and the onboard conductive wire 223 on the same substrate layer 221, in some embodiments, the antenna 222 and the onboard conductive wire 223 are further fixedly arranged on different substrate layers 221, fully utilizing the space in the stacking direction of the substrate layers 221 (as shown by a2 in FIG. 6 ). This not only increases the distance between the antenna 222 and the onboard conductive wire 223, thereby improving the communication effect of the antenna 222, but also reduces the width of the substrate layer 221 (as shown by a1 in FIG. 4 and 6 ). The width of the entire extension portion 220 can also be further reduced, reserving more space for other components within the temperature detection device 1, thereby facilitating a reduction in the width of the entire temperature detection device 1.

[0074] Of course, in other embodiments, the antenna 222 and the onboard conductive line 223 may also be provided on the same substrate layer 221, thereby reducing the thickness of the extension portion 220 and the difficulty of manufacturing. For example, in some embodiments, the extension portion 220 has a single substrate layer 221, and the antenna 222 and the onboard conductive line 223 are fixedly provided on one or both surfaces of the substrate layer 221.

[0075] To secure the antenna 222 and the onboard conductive wire 223 to the substrate layer 221, in some embodiments, the antenna 222 and the onboard conductive wire 223 are attached to the surface of the substrate layer 221. In some embodiments, the antenna 222 and the onboard conductive wire 223 can be secured to the surface of the substrate layer 221 through a printing or spraying process, thereby securing the antenna 222 and the onboard conductive wire 223 to the surface of the substrate layer 221. Of course, in other embodiments, other feasible methods can also be used to secure the antenna 222 and the onboard conductive wire 223 to the surface of the substrate layer 221.

[0076] Furthermore, when the antenna 222 and the onboard conductive wire 223 are arranged on different substrate layers 221, when they are specifically stacked, the antenna 222 and the onboard conductive wire 223 can be arranged on any different substrate layer 221. The antenna 222 can be arranged on the outermost substrate layer 221 or the middle substrate layer 221. Similarly, the onboard conductive wire 223 can be arranged on the outermost substrate layer 221 or the middle substrate layer 221. The onboard conductive wire 223 can be of one or more types depending on the connection object, for example, it can be one or both of the charging cable and the conductor of the ambient temperature detection unit. When there are more than two types of onboard conductive wires 223, these different types of onboard conductive wires 223 can be partially or entirely arranged on the same substrate layer 221, or different types of onboard conductive wires 223 can be independently dispersed on different substrate layers 221.

[0077] Referring to Figures 6, 8, and 13, in some embodiments, the substrate layer 221 provided with the antenna 222 is an antenna layer (e.g., 2211, 2216). The antenna layer is located on the outermost side of the substrate layer 221 in the stacking direction. As shown in Figure 6, this outermost side can be either the uppermost side (e.g., 2211) or the lowermost side (e.g., 2216) in the illustrated direction. Placing the antenna layer on the outermost side can better ensure that the antenna 222 can more efficiently transmit and receive signals.

[0078] In some embodiments, when the antenna layer is located at the outermost layer, the onboard conductive traces 223 may be disposed on one or more substrate layers 221 inside the antenna layer. When the antenna layer is one of the outermost substrate layers (the uppermost substrate layer 221 as shown in FIG6 ), the onboard conductive traces 223 may be disposed on the other outermost substrate layer (the lowermost substrate layer 221 as shown in FIG6 ).

[0079] Of course, in some embodiments, the onboard conductive line 223 may also be disposed on the antenna layer.

[0080] Further, referring to Figures 6, 8, and 13, in some embodiments, the substrate layer 221 comprises at least three layers. In the stacking direction of the substrate layers 221, the two outermost substrate layers 221 serve as antenna layers (e.g., 2211 and 2216). The antennas 222 on the two antenna layers (e.g., 2211 and 2216) are electrically connected to each other. The advantage of having two antenna layers is that, without changing the width of the substrate layers 221 and the extension 220 (as indicated by a1 in Figures 4 and 6), the area of ​​the antenna 222 can be increased by utilizing the space in the stacking direction (as indicated by a2 in Figure 6), thereby improving the antenna 222's signal transmission and reception capabilities and communication performance. In other embodiments, more substrate layers 221 may be provided as antenna layers, such as by using one or more intermediate substrate layers 221 as antenna layers.

[0081] Further, referring to Figures 8 and 13 , in some embodiments, to further increase the area of ​​antenna 222 and thereby improve communication performance, antenna 222 may be configured as a planar antenna with one end having a circular arc surface to facilitate signal conduction and radiation. Of course, in other embodiments, antenna 222 may also be configured as a planar structure other than that shown in Figures 8 and 13 , or may be configured as other shapes and structures capable of transmitting and receiving wireless signals.

[0082] Further, referring to Figures 6 and 8-13, to achieve conductive connection between two or more antenna layers in the stacking direction, in some embodiments, the antenna layers (e.g., 2211, 2216) and the substrate layer 221 located between the two antenna layers (e.g., 2211, 2216) are provided with first conductive vias 2251. The first conductive vias 2251 are conductively connected to each other, electrically connecting the antennas 222 on the two antenna layers (e.g., 2211, 2216). Specifically, the first conductive vias 2251 on each substrate layer 221 are provided through the substrate layer 221, and the walls of the first conductive vias 2251 are provided with conductive material. After the substrate layers 221 are stacked, the first conductive vias 2251 in adjacent substrate layers 221 can be conductively connected together in sequence.

[0083] Of course, in other embodiments, the antenna layer may also be electrically connected in other ways, such as through a cable.

[0084] Further, referring to Figures 6, 8, 13, and 14, in some embodiments, one antenna layer is a first antenna layer 2211, and the other antenna layer is a second antenna layer 2216. The first antenna layer 2211 can be either the topmost layer or the bottommost layer as shown in Figure 6. On the first antenna layer 2211, the antenna 222 is electrically connected to the antenna signal processing unit 2111 via a conductive wire 2221. The conductive wire 2221 and the first antenna layer 2211 also electrically connect the antenna 222 on the second antenna layer 2216 to the antenna signal processing unit 2111.

[0085] Referring to FIG8 , in some embodiments, to facilitate better transmission of antenna 222 signals in a predetermined direction, the first antenna layer 2211 is provided with a first impedance matching structure 2241, which is disposed on both sides of the conductive line. The first impedance matching structure 2241 can help antenna 222 signals transmit in a predetermined direction, such as toward the rear end of the housing 100.

[0086] Referring to FIG. 13 , in some embodiments, to better constrain signal transmission from the antenna 222, when a second antenna layer 2216 is provided, a second impedance matching structure 2242 is provided on the second antenna layer 2216. The second impedance matching structure 2242 corresponds to the first impedance matching structure 2241 in position. For example, on a plane perpendicular to the stacking direction of the substrate layer 221 (as shown by a2 in FIG. 6 ), the projections of the second impedance matching structure 2242 and the first impedance matching structure 2241 partially or completely overlap. The second impedance matching structure 2242 and the first impedance matching structure 2241 can be electrically connected to each other via a second conductive via 2252.

[0087] Further, referring to Figures 6 and 8-13, in some embodiments, the substrate layer 221, which includes onboard conductive traces 223, is located between two antenna layers (e.g., 2211 and 2216), allowing the outermost substrate layer 221 to function as the antenna layer. First conductive vias 2251 can be provided on the substrate layer 221, where these onboard conductive traces 223 are located, to facilitate conductive connection between the antenna layers.

[0088] Referring to Figures 6 and 8-13, in some embodiments, the onboard conductive wire 223 includes a first detection unit conductor 2231 and a second detection unit conductor 2232 (i.e., the conductors of the ambient temperature detection unit). The first detection unit conductor 2231 and the second detection unit conductor 2232 electrically connect the ambient temperature detection unit 300 to the control circuit 211. The substrate layer 221, where the first detection unit conductor 2231 and the second detection unit conductor 2232 are located, is located inside the antenna layer. The antenna layer has first and second contacts 2261 and 2262 for electrically connecting to the ambient temperature detection unit 300. As shown in Figure 8, in one embodiment, the first and second contacts 2261 and 2262 are located on the first antenna layer 2211. In other embodiments, the first and second contacts 2261 and 2262 may also be located on the second antenna layer 2216. The first contact 2261 is electrically connected to the first detection unit conductor 2231, and the second contact 2262 is electrically connected to the second detection unit conductor 2232.

[0089] Please refer to Figures 3 and 8. In some embodiments, the ambient temperature detection unit 300 can be electrically connected to the first contact 2261 and the second contact 2262 on the first antenna layer 2211. For example, the conductive connection end of the ambient temperature detection unit 300 can be electrically connected to the first contact 2261 and the second contact 2262 by welding or other fixing methods.

[0090] Referring to Figures 2-5, in some embodiments, the conductive connection end 310 of the ambient temperature detection unit 300 is welded and electrically connected to the first and second contacts 2261 and 2262 (collectively, the conductive contacts). Considering that during use of the device, the solder joints between the conductive connection end 310 of the ambient temperature detection unit 300 and the first and second contacts 2261 and 2262 are located in a cooking environment and must withstand the high temperatures encountered therein. Materials commonly used for circuit soldering can easily melt at high temperatures, leading to electrical connection failure. For example, when the cooking environment temperature exceeds 300°C, the electrical connection between the conductive connection end 310 of the ambient temperature detection unit 300 and the first and second contacts 2261 and 2262 can easily become disconnected and fail. Therefore, in some embodiments, the solder joints between the conductive connection end 310 and the first contact 2261 and the second contact 2262 are wrapped by an adhesive layer 500, and the failure temperature of the adhesive layer 500 is higher than the failure temperature of the solder joints between the conductive connection end 310 and the first contact 2261 and the second contact 2262, thereby preventing the solder joints from being damaged in a high-temperature environment and ensuring the reliability of the electrical connection.

[0091] In some embodiments, the material of the adhesive layer 500 is high-temperature inorganic adhesive or high-temperature organic adhesive.

[0092] In some embodiments, the failure temperature threshold of the high-temperature organic adhesive is greater than or equal to 300°C.

[0093] In some embodiments, the failure temperature threshold of the high-temperature inorganic adhesive is greater than or equal to 400°C.

[0094] Further, referring to Figures 8-13, in some embodiments, the first detection unit conductor 2231 and the second detection unit conductor 2232 are respectively fixed on different substrate layers 221. The first detection unit conductor 2231 is electrically connected to the first contact 2261 through the third conductive via 2253, and the second detection unit conductor 2232 is electrically connected to the second contact 2262 through the fourth conductive via 2254. Of course, in other embodiments, the first detection unit conductor 2231 and the second detection unit conductor 2232 can also be fixed on the same substrate layer 221.

[0095] FIG11 shows the routing of the first detection unit conductor 2231 on the substrate layer 221. FIG12 shows the routing of the second detection unit conductor 2232 on the substrate layer 221. In other embodiments, the onboard conductive wire 223 shown in FIG11 may be configured as the second detection unit conductor 2232, and the onboard conductive wire 223 shown in FIG12 may be configured as the first detection unit conductor 2231.

[0096] In some embodiments, the substrate layer 221 provided with the first detection unit conductor 2231 is referred to as the first detection unit conductor layer 2214, and the substrate layer 221 provided with the second detection unit conductor 2232 is referred to as the second detection unit conductor layer 2215. As shown in FIG6 , in some embodiments, the first detection unit conductor layer 2214 and the second detection unit conductor layer 2215 are different substrate layers 221 and are stacked one on top of the other.

[0097] To better constrain the transmission of antenna 222 signals, in some embodiments, referring to FIG. 11 , the first detection unit conductor layer 2214 includes a third impedance matching structure 2243 disposed on either side of the first detection unit conductor 2231. And / or, referring to FIG. 12 , the second detection unit conductor layer 2215 includes a fourth impedance matching structure 2244 disposed on either side of the second detection unit conductor 2232. The third impedance matching structure 2243 and the fourth impedance matching structure 2244 are electrically connected to the second impedance matching structure 2242 and the first impedance matching structure 2241 via second conductive vias 2252, thereby forming a unified impedance matching structure on the multi-layer substrate layer 221, thereby better constraining the transmission direction of antenna 222 signals.

[0098] Furthermore, the onboard conductive wire 223 can also be used for other purposes. For example, when the device requires charging, the onboard conductive wire 223 can also serve as a charging wire. Referring to Figure 14 , the control circuit 211 includes a charging circuit 2112. There can be one or two charging wires 2233, each intended to electrically connect at least one of the positive and negative charging electrodes to the charging circuit 2112 for charging.

[0099] Referring to Figures 6 and 10 , in some embodiments, the substrate layer 221 with the charging cable 2233 is referred to as the charging cable layer 2213. This charging cable layer 2213 is located inside the antenna layer. The antenna layer has at least one charging connector 2263. As shown in Figure 8 , in one embodiment, this charging connector 2263 is located on the first antenna layer 2211. In other embodiments, this charging connector 2263 may also be located on the second antenna layer 2216. The charging connector 2263 is electrically connected to the charging cable 2233 and can be used to establish an electrical connection with at least one of the positive and negative charging electrodes, such as the metal conductive member 130 described below. The charging connector 2263 has a conductive structure, such as a conductive contact or other structure.

[0100] Referring to Figures 2-5, in some embodiments, to form a positive charging electrode and a negative charging electrode for easy charging, the housing 100 includes a metal segment 110 and an insulating segment 120. Both the metal segment 110 and the insulating segment 120 are cylindrical structures. The insulating segment 120 can be docked at the rear end of the metal segment 110. Together, the metal segment 110 and the insulating segment 120 can be used to enclose at least a portion of the housing cavity of the housing 100. The metal segment 110 can be made of a metal material such as copper or nickel, or an alloy material such as stainless steel. The insulating segment 120 can be made of ceramic or other insulating materials. The insulating segment 120 is provided with a metal conductive member 130, which is electrically connected to the charging connection terminal 2263. The metal segment 110 is electrically connected to the charging circuit 2112. In which, the metal conductive member 130 and the metal segment 110 respectively serve as one of the charging positive electrode and the charging negative electrode of the charging circuit 2112, for example, the metal conductive member 130 serves as the charging positive electrode and the metal segment 110 serves as the charging negative electrode, or the metal conductive member 130 serves as the charging negative electrode and the metal segment 110 serves as the charging positive electrode to achieve charging.

[0101] Referring to Figures 2-5, in some embodiments, the control circuit board 200 is provided with an elastic pin 212. This elastic pin 212 is made of a conductive material. One end of this pin is electrically connected to the charging circuit 2112, and the other end is electrically connected to the inner wall of the metal segment 110, thereby electrically connecting the metal segment 110 of the housing 100 to the charging circuit 2112. Of course, this elastic pin 212 can also be replaced with other materials, such as a conductive spring. The elastic pin 212 not only serves as a charging electrode, but also serves to position and limit the control circuit board 200 within the accommodating cavity, thereby reducing the shaking of the control circuit board 200 within the accommodating cavity.

[0102] 2-5 , in some embodiments, the metal conductive member 130 is exposed outside the insulating section 120 , wherein the metal conductive member 130 extends to the charging connection end 2263 of the antenna layer and is electrically connected to the charging connection end 2263, and further electrically connected to the charging circuit 2112 via the charging cable 2233. The metal conductive member 130 can be fixed to the charging connection end 2263 by welding, clamping, bonding, or the like to maintain the electrical connection.

[0103] During use, when the device is inserted into food, the area where the insulating section 120 is located is typically outside the food and must withstand the high temperatures of the cooking environment. In some cooking environments, the temperature within this area can reach over 300°C. For example, the cooking environment temperature in an oven can reach over 200°C, and the cooking environment temperature in a BBQ grill can reach over 500°C. To ensure a reliable electrical connection between the metal conductive member 130 and the charging connector 2263, in some embodiments, referring to Figures 2-5, 7, and 8, the charging connector 2263 has a fifth conductive via 2255, and the metal conductive member 130 has a mounting hole 131. The charging connector 2263 and the metal conductive member 130 are secured and electrically connected by a conductive screw 133 that passes through the fifth conductive via 2255 and the mounting hole 131. The conductive screw 133 not only secures the charging connector 2263 and the metal conductive member 130, but also provides electrical conductivity. The conductive screw 133 itself is resistant to high temperatures, so this connection structure is not only firm and reliable, but its electrical connection effect can also withstand the test of high temperatures. For example, at 300°C, the conductive screw 133 can still ensure good electrical connection between the charging connection terminal 2263 and the metal conductive part 130.

[0104] Referring to Figures 2-5 , in some embodiments, the metal conductive member 130 extends from the rear end to the rear end of the insulating section 120. Because the metal conductive member 130 is made of a conductive metal and has excellent thermal conductivity, in these embodiments, the ambient temperature detection unit 300 is at least partially disposed within the metal conductive member 130, utilizing the metal conductive member 130 for heat transfer to achieve temperature detection. The metal conductive member 130 can be directly exposed to the cooking environment to better sense and transmit temperature information within the cooking environment. Alternatively, the metal conductive member 130 can indirectly contact the hot air in the cooking environment, forming a heat conduction structure.

[0105] Please refer to Figures 2-5. In some embodiments, the metal conductive member 130 has an inner cavity, and the rear end of the extension portion 220 extends into the inner cavity, which not only facilitates the docking of the ambient temperature detection unit 300 and the extension portion 220, but also utilizes the good strength of the metal to protect the ambient temperature detection unit 300 placed in the metal conductive member 130.

[0106] 2-5 , in some embodiments, the metal conductive member 130 is also part of the housing 100, and its outer wall, together with the metal segment 110 and the insulating segment 120, forms the outer wall of the housing 100. In some embodiments, the metal conductive member 130 has a shape that matches the insulating segment 120, such as a cylindrical or other shape, to form a smooth transition with the insulating segment 120 in the axial direction of the housing 100. The inner cavity of the metal conductive member 130, together with the cavities of the metal segment 110 and the insulating segment 120, forms a mounting cavity.

[0107] 2-5 , in some embodiments, the metal conductive member 130 can be threadedly inserted into the cavity of the insulating segment 120 and fixed by threading the external threads of the metal conductive member 130 with the internal threads of the cavity of the insulating segment 120. Of course, in other embodiments, the metal conductive member 130 and the extension portion 220 can also be fixed by other means, such as welding, clamping, etc.

[0108] 2-5 , in some embodiments, a rear cover 140 may be provided at the rear end of the metal conductive member 130. The rear cover 140 is fixed to the metal conductive member 130, for example, by screwing the threaded hole of the rear cover 140 to the raised threaded portion 132 on the metal conductive member 130. Of course, in other embodiments, the metal conductive member 130 and the rear cover 140 may be fixed by other means, such as welding, clamping, etc.

[0109] Further, referring to Figure 6 , in some embodiments, the charging cable layer 2213 is located between the antenna layer (e.g., the first antenna layer 2211) and the first detection unit wire layer 2214. Alternatively, in other embodiments, the charging cable layer 2213 may be located between the antenna layer (e.g., the second antenna layer 2216) and the second detection unit wire layer 2215. The charging connection terminal 2263 is electrically connected to the charging cable 2233 via the fifth conductive via 2255.

[0110] Further, referring to Figure 6 , in some embodiments, the substrate layer 221 adjacent to the antenna layer is a clearance layer 2212. Neither the antenna 222 nor the onboard conductive wire 223 are provided in the clearance layer 2212 to ensure sufficient spacing between the substrate layer 221 where the onboard conductive wire 223 resides and the first antenna layer 2211 in the stacking direction. Of course, the number of clearance layers 2212 can be more than one; in other embodiments, the number of clearance layers 2212 can be two or more.

[0111] Of course, in other embodiments, the first antenna layer 2211, the clearance layer 2212, the charging line layer 2213, the first detection unit wire layer 2214, the second detection unit wire layer 2215 and the second antenna layer 2216 may also be arranged in other stacking manners and are not limited to the stacking order shown in Figure 6.

[0112] Further, referring to Figures 2-5, in some embodiments, the housing 100 includes a safety zone marking 101. The area from the front end of the housing 100 to the safety zone marking 101 constitutes the safety zone, and the food temperature detection unit 40030 is located within the safety zone. In some embodiments, the safety zone marking 101 can be a line or a three-dimensional, concave or convex line with a color that is distinctly different from the rest of the housing 100. This serves to indicate to the user the proper insertion depth of the temperature detection device 1 into the object being measured (e.g., food). Because the safety zone is designed to allow full insertion into the food during use, and the temperature inside the food is lower than that of the cooking environment, damage to the electronic components of the temperature detection device 1 caused by high temperatures in the cooking environment (e.g., ovens over 200°C, BBQ grills over 500°C, etc.) can be avoided. Furthermore, the safety zone marking 101 can prevent damage to the housing 100 caused by the temperature detection device 1 being inserted too deeply into the object being measured, as well as prevent burns to the operator. In some embodiments, the safety zone marking 101 can be located on the outer wall of the housing 100. In some embodiments, the safety zone marking 101 may be disposed around the outer wall of the housing 100 .

[0113] In some embodiments, the battery can be a rechargeable battery or a disposable battery. The battery is disposed within the housing 100 and is located within the safety zone. The battery is used to power various electrical components within the temperature detection device 1.

[0114] 1-5 , in some embodiments, the control circuit board 200 is located within the safety zone, in the longitudinal direction of the housing 100 . The battery is located at the front end of the control circuit board 200 .

[0115] Further, please refer to Figures 1-5. In some embodiments, in order to better obtain the signal of the antenna 222, the antenna 222 is arranged on the rear side of the safety zone mark 101, that is, when the temperature detection device 1 is in use, the antenna 222 is outside the food to prevent the food from affecting the signal reception and transmission of the antenna 222. In some embodiments, the ambient temperature detection unit 300 is arranged on the rear side of the safety zone mark 101, that is, when the temperature detection device 1 is in use, the ambient temperature detection unit 300 is outside the food to better detect the temperature of the cooking environment. In some embodiments, the metal conductive part 130 is arranged behind the safety zone mark 101 to prevent repeated insertion of food from damaging the metal conductive part 130. The charging connection terminal 2263 is also arranged on the rear side of the safety line to facilitate docking with the metal conductive part 130.

[0116] Further, referring to Figures 1-5, in some embodiments, the safety zone marker 101 is located on the metal segment 110. That is, in this embodiment, a portion of the metal segment 110, the insulating segment 120, and the metal conductive member 130 are all located behind the safety zone marker 101. The antenna 222 is located within the insulating segment 120 to ensure communication effectiveness of the antenna 222.

[0117] During use of the temperature detection device 1, the area behind the safety zone marking 101 is typically exposed to higher temperatures. The extension portion 220 is also located behind the safety zone marking 101. Because the antenna 222, onboard conductive wires 223, and conductive vias on the extension portion 220 are merely conductive surfaces disposed on the substrate layer 221, they are less susceptible to deformation under the high temperatures of the cooking environment, thereby ensuring a stable electrical connection.

[0118] On the other hand, in addition to being used in the above-mentioned temperature detection device 1, in other embodiments, the control circuit board 200 can also be applied to other temperature detection devices 1 that need to realize wireless communication, especially temperature detection devices 1 that need to be used at high temperatures.

[0119] During the operation of the temperature detection device 1 , in order to make the signal of the antenna 222 stronger, a ground plane close to the loop may be constructed on the temperature detection device 1 to increase the active power of the antenna signal.

[0120] In some embodiments, the lateral dimension of the extension portion 220 is smaller than the lateral dimension of the main body portion 210. The insulating segment 120 can be sleeved on the rear end of the metal segment 110, which makes the space at the rear end of the metal segment 110 relatively narrow. Therefore, when designing, the lateral dimension of the extension portion 220 is made smaller than the lateral dimension of the main body portion 210, so that the extension portion 220 can be extended into the accommodating cavity formed by the insulating segment 120. At the same time, glue can be applied to the sleeve joints of the insulating segment 120 and the metal segment 110 to further make the connection between the two stable and waterproof. In some embodiments, since the structure of the temperature detection device 1 itself limits the construction of the nearest loop ground plane, how to design an antenna ground feed point to greatly improve the performance of the entire antenna is a problem.

[0121] In some embodiments, the main body 210 is disposed within the mounting cavity formed by the metal segment 110. A ground feed point 600 is further disposed on the main body 210 of the control circuit board 200 near the extension 220. The ground feed point 600 is electrically connected to the antenna signal processing unit 2111 and is in contact with the metal segment 110 via a metal contact 601. By disposing the ground feed point 600 near the extension 220 of the main body 210, while the ground feed point 600 is electrically connected to the antenna signal processing unit 2111 and in contact with the metal segment 110 via the metal contact 601, a ground signal is constructed that is relatively close to the antenna 222.

[0122] In some embodiments, the first impedance matching structure 2241 extends forward to the ground feeding point 600 of the main body 210 , so that the first impedance matching structure 2241 is electrically connected to the ground feeding point 600 .

[0123] In some embodiments, two grounding conductive vias 602 are provided on the main body 210 of the control circuit board 200 near the extension portion 220 to form a grounding feeding point 600 .

[0124] In some embodiments, referring to FIG. 15 , the metal contact 601 includes an elastic member 6011. The ends of the elastic member 6011 are respectively connected to the two grounded conductive vias 602. The elastic member 6011 is formed into a bow shape to contact the metal segment 110. It will be appreciated that the elastic member 6011 is made of a conductive metal material. In some embodiments, the elastic member 6011 is a spring. FIG. 15 is a schematic diagram of a radial cross-section of the temperature detection device.

[0125] In some embodiments, the metal contact 601 comprises a spring, with its two ends connected to two grounded conductive vias 602 and in contact with the metal segment 110. Adding the metal contact 601 near the antenna 222 can increase antenna signal strength. In some embodiments, the metal contact 601 can also be used for charging.

[0126] When the control circuit board 200 is specifically designed, it can be designed to have one or more layers according to requirements, for example, six layers, that is, the base material layer has six layers.

[0127] In some embodiments, the first layer may be the first antenna layer 2211. In some embodiments, the substrate layer adjacent to the antenna layer is a clearance layer. In some embodiments, the clearance layer comprises two layers. For example, if the first layer is the first antenna layer 2211, the second and third layers are both clearance layers, where the clearance layer is a substrate layer without an antenna or onboard conductive wires.

[0128] In some embodiments, a single layer can be configured as a complete ground plane, for example, the fourth layer of the substrate can be configured as a complete ground plane. It is understood that in such an example, the ground feed point 600 is electrically connected to the fourth layer of the complete ground plane, for example, through the ground conductive via 602.

[0129] In some embodiments, the complete ground plane is electrically connected to the first impedance matching structure 2241 through the second conductive via 2242 .

[0130] In some of the above embodiments, a dipole-structured antenna is constructed, and a ground plane is constructed near the antenna signal feed point to provide a loop, thereby minimizing signal attenuation.

[0131] In some embodiments, the distance between the first impedance matching structure 2241 and the conductive line 2221 is 5 mil.

[0132] In some embodiments, the width of the conductive line 2221 is 17 mil.

[0133] In some of the above embodiments, through experimental tests, it can improve the active power of a Bluetooth antenna signal by about 1.3 dB.

[0134] In some of the above embodiments, experimental tests have shown that the signal transmission attenuation is extremely small, and at a transmission power of 8dB, the output can be close to full power.

[0135] This document is described with reference to various exemplary embodiments. However, those skilled in the art will recognize that changes and modifications may be made to the exemplary embodiments without departing from the scope of this document. For example, the various operational steps and components used to perform the operational steps may be implemented in different ways (e.g., one or more steps may be deleted, modified, or incorporated into other steps) depending on the specific application or any number of cost functions associated with the operation of the system.

[0136] Although the principles of this invention have been shown in various embodiments, many modifications of structure, arrangement, proportion, elements, materials and components that are particularly suitable for specific environments and operational requirements can be used without departing from the principles and scope of this invention. The above modifications and other changes or amendments are intended to be included within the scope of this invention.

[0137] The foregoing detailed description has been described with reference to various embodiments. However, those skilled in the art will recognize that various modifications and changes can be made without departing from the scope of this disclosure. Therefore, the consideration of this disclosure will be illustrative rather than restrictive, and all such modifications will be included within its scope. Similarly, the advantages, other advantages and solutions to the problems of the various embodiments have been described above. However, the benefits, advantages, solutions to the problems and any elements that can produce these, or make them more specific, should not be interpreted as critical, necessary or essential. The term "comprising" and any other variants used in this article are all non-exclusive inclusions, so that a process, method, article or device that includes a list of elements includes not only these elements, but also other elements that are not explicitly listed or do not belong to the process, method, system, article or device. In addition, the term "coupling" and any other variants used in this article refer to physical connections, electrical connections, magnetic connections, optical connections, communication connections, functional connections and / or any other connections.

[0138] Those skilled in the art will recognize that many changes can be made to the details of the above embodiments without departing from the basic principles of the present application. Therefore, the scope of the present application should be determined based on the following claims.

Claims

1. A temperature detection device for food, characterized in that: include: A shell, the shell having a front end capable of being inserted into food and a rear end opposite to the front end, the shell forming a mounting cavity; the shell comprising a metal section and an insulating section, the insulating section being located behind the metal section; A control circuit board, wherein the control circuit board is arranged in the installation cavity; the control circuit board comprises a main body and an extension portion extending backward from the main body, the main body being arranged in the installation cavity formed by the metal segment, the main body having a control circuit, and the control circuit having an antenna signal processing unit; the extension portion comprises at least one or more layers of laminated and fixed substrate layers, the extension portion is provided with an antenna, and the antenna is electrically connected to the antenna signal processing unit through a conductive line; a grounding feed point is also provided on the main body of the control circuit board near the extension portion, the grounding feed point is electrically connected to the antenna signal processing unit, and the grounding feed point is contact-connected to the metal segment through a metal contact.

2. The temperature detection device according to claim 1, characterized in that: The base layer provided with the antenna is an antenna layer, and in the stacking direction of the base layer, the antenna layer is located on the outermost side.

3. The temperature detection device according to claim 2, characterized in that: The substrate layer has at least two layers. In the stacking direction of the substrate layers, the two outermost substrate layers are both the antenna layers, and the antennas on the two antenna layers are electrically connected to each other.

4. The temperature detection device according to claim 3, characterized in that: One antenna layer is a first antenna layer, and the other antenna layer is a second antenna layer; on the first antenna layer, the antenna is electrically connected to the antenna signal processing unit through the conductive wire.

5. The temperature detection device according to claim 4, characterized in that: The first antenna layer is provided with a first impedance matching structure, and the first impedance matching structure is provided on both sides of the conductive line; The first impedance matching structure extends forward to the ground feeding point of the main body, so that the first impedance matching structure is electrically connected to the ground feeding point.

6. The temperature detection device according to claim 5, characterized in that: The distance between the first impedance matching structure and the conductive line is 5 mil.

7. The temperature detection device according to claim 1 or 6, characterized in that: The width of the conductive line is 17 mil.

8. The temperature detection device according to claim 1 or 5, characterized in that: The main body of the control circuit board is provided with two grounding conductive vias near the extension portion to form the grounding feeding point.

9. The temperature detection device according to claim 8, characterized in that: The metal contact comprises an elastic member, two ends of which are respectively connected to the two grounding conductive vias and form an arch shape to be in contact with the metal segment.

10. The temperature detection device according to claim 9, characterized in that: The elastic member is a spring.

11. The temperature detection device according to claim 8, wherein the metal contact comprises a spring, and two ends of the spring are respectively connected to two grounding conductive vias and in contact with the metal segment.

12. The temperature detection device according to any one of claims 1 to 4, characterized in that: The substrate layer has six layers.

13. The temperature detection device according to claim 12, characterized in that: The first antenna layer is adjacent to two clearance layers.

14. The temperature detection device according to claim 12 or 13, characterized in that: The first antenna layer is the first layer, and the fourth layer in the substrate layer is configured as a complete ground plane.

15. The temperature detection device as claimed in claim 14, wherein the complete ground plane is electrically connected to the first impedance matching structure through a second conductive via.

16. The temperature detection device according to claim 4, characterized in that: A second impedance matching structure is disposed on the second antenna layer. The second impedance matching structure corresponds to the position of the first impedance matching structure and is electrically connected to the first impedance matching structure through a second conductive via.

17. The temperature detection device according to claim 1 or 4, characterized in that: It also includes an environment temperature detection unit, which is arranged on the housing and is used to detect the temperature of the cooking environment of the food; The extension portion is further provided with an onboard conductive wire, the antenna and the onboard conductive wire are respectively fixed on different substrate layers, and the onboard conductive wire is used to electrically connect the control circuit with the ambient temperature detection unit.

18. The temperature detection device according to claim 17, characterized in that: The substrate layer has at least three layers, and in the stacking direction of the substrate layers, the two outermost substrate layers are both the antenna layers, and the antennas on the two antenna layers are electrically connected to each other; The substrate layer provided with the on-board conductive wires is located between the two antenna layers.

19. The temperature detection device according to claim 17, characterized in that: The control circuit board is provided with two conductive vias near the extension portion to form the ground feeding point.

20. The temperature detection device according to claim 19, characterized in that: The on-board conductive wire has a positive wire of a detection unit and a negative wire of a detection unit. The first detection unit wire and the second detection unit wire electrically connect the ambient temperature detection unit with the control unit. The substrate layer where the first detection unit wire and the second detection unit wire are located is located on the inner side of the antenna layer. The antenna layer has a first contact and a second contact for electrically connecting the ambient temperature detection unit. The first contact is electrically connected to the positive wire of the detection unit, and the second contact is electrically connected to the negative wire of the detection unit.

21. The temperature detection device according to claim 20, characterized in that: The first detection unit wire and the second detection unit wire are fixed on the same substrate layer or respectively fixed on different substrate layers, the first detection unit wire is electrically connected to the first contact through a third conductive via, and the second detection unit wire is electrically connected to the second contact through a fourth conductive via.

22. The temperature detection device according to claim 17, characterized in that: The on-board conductive wire has a charging wire, the control circuit has a charging circuit, and the charging wire is electrically connected to the charging circuit; the base layer provided with the charging wire is a charging wire layer, the charging wire layer is located on the inner side of the antenna layer, the antenna layer has a charging contact, and the charging contact is electrically connected to the charging wire.

23. The temperature detection device according to claim 22, characterized in that: The insulating segment is provided with a metal conductive member, the metal conductive member is electrically connected to the charging point contact, the metal segment is electrically connected to the charging circuit, and the metal conductive member and the metal segment respectively serve as one of the positive and negative electrodes of the charging circuit to achieve charging.

24. The temperature detection device according to claim 22, characterized in that: The charging line layer is located between the antenna layer and the first detection unit wire layer, or between the antenna layer and the second detection unit wire layer, and the charging contact is electrically connected to the charging line through a fifth conductive hole.

25. The temperature detection device according to claim 1, characterized in that: The substrate layer adjacent to the antenna layer is a clearance layer.

26. The temperature detection device according to claim 25, characterized in that: The clearance layer has two layers.

27. The temperature detection device according to claim 1, characterized in that: The lateral dimension of the extension portion is smaller than the lateral dimension of the main body portion.

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