Fabric bus for power delivery in computing systems

Abstract

Aspects of the present disclosure relate to fabric busbars for power delivery in computing systems. The computing system may include a plurality of computing tiles and a busbar positioned with the plurality of computing tiles. The bus may provide structural support for the plurality of compute tiles and provide power for the plurality of compute tiles. In some embodiments, the fabric bus may also provide coolant to each of the computational tiles. In some embodiments, the fabric bus may provide power and electrical support to any suitable electronic module.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 377,998, filed on September 30, 2022, and entitled “INTEGRATED STRUCTURED COMPUTING PLANE WITH COOLANT, POWER AND SIGNAL DELIVERY,” the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates generally to busbars in computing systems, and more particularly, to integrated power delivery in structural busbars. Background Art

[0004] Certain computing systems may be used and / or specifically configured for high-performance computing and / or computationally intensive applications, such as neural network training, neural network inference, machine learning, artificial intelligence, complex simulations, and the like. In some applications, a computing system may be used to perform neural network training. For example, such neural network training may generate data for an autonomous driving system, other autonomous vehicle functions, or advanced driver assistance system (ADAS) functions of a vehicle (e.g., a car).

[0005] In high-performance computing systems, high-speed connectivity, ideal power performance, and dense integration are generally desirable. Summary of the Invention

[0006] The innovations described in the claims each have several aspects, no single one of which is solely responsible for its desirable attributes. Without limiting the scope of the claims, some of the prominent features of the disclosure will now be briefly described.

[0007] In one aspect, a computing system is disclosed. The computing system may include a plurality of computing tiles. Each of the plurality of computing tiles may include a plurality of die and a cooling solution integrated with the plurality of die. The computing system may include a busbar on which the plurality of computing tiles are positioned. The busbar may be configured to provide structural support to the plurality of computing tiles and to supply electrical power to the plurality of computing tiles.

[0008] In one embodiment, the busbar may include a power layer and a ground layer. The power layer and the ground layer may be electrically connected to each of the plurality of computing tiles. The busbar may include multiple insulating layers. The computing system may also include a first plurality of connectors electrically coupling the plurality of computing tiles to the power layer of the busbar. The busbar may include a second plurality of connectors electrically coupling the plurality of computing tiles to the ground layer of the busbar.

[0009] In one embodiment, the busbar may include an integrated inlet manifold configured to deliver coolant to each of the plurality of compute tiles; and an integrated outlet manifold configured to receive coolant from each of the plurality of compute tiles. The integrated inlet manifold and the integrated outlet manifold may each be positioned between layers of the busbar.

[0010] In one embodiment, the busbar may include a stepped edge sized to slide into the cabinet structure and engage the side rails of the cabinet structure.

[0011] In one embodiment, each of the plurality of compute tiles comprises a system on wafer (SoW) comprising a plurality of dies.

[0012] In one embodiment, a cooling solution includes a cold plate comprising an inlet port configured to receive a coolant and an outlet port configured to exhaust the coolant.

[0013] In one embodiment, the busbar may include an integrated inlet manifold configured to deliver coolant to an inlet port of each of the plurality of computing tiles; and an integrated outlet manifold configured to receive coolant from an outlet port of each of the plurality of computing tiles. The integrated inlet manifold and the integrated outlet manifold may each be positioned between layers of the busbar.

[0014] In one embodiment, a computing system may include an inlet manifold positioned above a busbar and configured to deliver coolant to an inlet port of each of a plurality of computing tiles; and an outlet manifold positioned above the busbar and configured to receive coolant from an outlet port of each of the plurality of computing tiles.

[0015] In one embodiment, a computing system may include a first host positioned vertically relative to a busbar. The first host may be configured to provide data support to a plurality of computing tiles. The computing system may include a second plurality of computing tiles and a second busbar, the second plurality of computing tiles being positioned on the second busbar. The second busbar may be configured to provide structural support to the second plurality of computing tiles and to provide electrical power to the second plurality of computing tiles. The first host may be positioned between the busbar and the second busbar. The computing system may include a second host positioned vertically relative to the second plurality of computing tiles. The computing system may include a cabinet structure, in which the busbar, the second busbar, the first host, and the second host may be positioned.

[0016] In one aspect, a busbar for supporting and electrically connecting electronic modules is disclosed. The busbar may include a power layer, a ground layer, and multiple insulation layers. The busbar may be configured to provide structural support for multiple electronic modules and to supply electrical power to each of the multiple electronic modules.

[0017] In one embodiment, the plurality of electronic modules comprises compute tiles. Each of the compute tiles may include a plurality of dies and a cooling solution integrated with the plurality of dies.

[0018] In one embodiment, the busbar includes an integrated inlet manifold configured to provide coolant to each of the electronic modules and an integrated outlet manifold configured to receive coolant from each of the electronic modules.

[0019] In one embodiment, the plurality of insulation layers includes two outer insulation layers, both the power layer and the ground layer are positioned between the two outer insulation layers, the integrated inlet manifold is positioned between the two outer insulation layers, and the integrated outlet manifold is positioned between the two outer insulation layers.

[0020] In one embodiment, the surface of the busbar includes connections to both the integrated inlet manifold and the integrated outlet manifold.

[0021] In one embodiment, the surface of the busbar also includes a connection to the power plane and a connection to the ground plane.

[0022] In one embodiment, the bus bar includes openings in an area over which the plurality of electronic modules are positioned when the plurality of electronic modules are connected to the power layer and the ground layer.

[0023] In one aspect, a method of assembling a computing system is disclosed. The method may include providing a busbar including a power layer, a ground layer, and a plurality of insulating layers. The method may include connecting a plurality of compute tiles to the power layer and the ground layer of the busbar, such that each of the plurality of compute tiles is arranged to receive structural support and electrical power from the busbar. Each of the plurality of compute tiles may include a plurality of die and a cooling solution integrated with the plurality of die.

[0024] In one embodiment, each of the plurality of compute tiles comprises a system on wafer (SoW) comprising a plurality of dies.

[0025] In one embodiment, the cooling solution is a cold plate, and the cold plate is integrated with the SoW.

[0026] In one embodiment, connecting each compute tile may also connect each compute tile to an integrated inlet manifold and an integrated outlet manifold of a busbar in the same operation.

[0027] To summarize this disclosure, certain aspects, advantages, and novel features of the innovations are described herein. It should be understood that not all of these advantages may be achieved according to any particular embodiment. Thus, an innovation may be embodied or implemented in a manner that achieves or optimizes one advantage or group of advantages taught herein without necessarily achieving other advantages taught or suggested herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Specific embodiments will now be described with reference to the following figures, which are provided by way of example and not limitation.

[0029] Figure 1A Illustrated is a system tray according to one embodiment.

[0030] Figure 1B A computer cabinet according to one embodiment is illustrated.

[0031] Figure 2A is a schematic diagram of a cross-section of an example system tray according to one embodiment.

[0032] Figure 2B is a schematic diagram of a cross-section of an example system tray according to one embodiment.

[0033] Figure 2C Illustrated is a top view of an example system tray according to one embodiment.

[0034] Figure 2D Illustrated is a perspective view of an example system tray according to one embodiment.

[0035] Figure 2E Illustrated is a perspective view of an example system tray according to one embodiment with compute tiles omitted.

[0036] Figure 3A is a schematic diagram of a cross-section of a system tray according to one embodiment, wherein the coolant manifold is integrated into the structural busbar.

[0037] Figure 3B is a schematic diagram of a cross-section of a system tray according to one embodiment, wherein the coolant manifold is integrated into the structural busbar.

[0038] Figure 4 is a top view of an illustrative structural busbar according to one embodiment.

[0039] Figure 5A and Figure 5B is a schematic diagram of a tile-type power connector according to one embodiment.

[0040] Figure 5C is a schematic diagram of a top view of a tile-type power connector according to one embodiment.

[0041] Figure 6A A processing system according to aspects of the present disclosure is illustrated.

[0042] Figure 6B A wafer system according to aspects of the present disclosure is illustrated.

[0043] Figure 6C is a diagram illustrating various aspects of the present disclosure Figure 6A A perspective view of a portion of a processing system.

[0044] Figure 7 Illustrated are connection pins and sockets for connecting a compute tile to a structural bus, according to one embodiment. DETAILED DESCRIPTION

[0045] The following detailed description of certain embodiments presents various descriptions of specific embodiments. However, the innovations described herein may be embodied in a variety of different ways, for example, as defined and covered by the claims. In this specification, reference is made to the accompanying drawings in which the same reference numerals and / or terms may indicate identical or functionally similar elements. It should be understood that the elements shown in the drawings are not necessarily drawn to scale. Furthermore, it should be understood that certain embodiments may include more elements than shown in the drawings and / or a subset of the elements shown in the drawings. Furthermore, some embodiments may incorporate any suitable combination of features from two or more of the drawings.

[0046] As described above, certain computing systems may be used and / or specifically configured for high-performance computing and / or computationally intensive applications, such as neural network training, neural network inference, machine learning, artificial intelligence, complex simulations, and the like. In some applications, a computing system may be used to perform neural network training. For example, such neural network training may generate data for an autonomous driving system, other autonomous vehicle functions, or advanced driver assistance system (ADAS) functions of a vehicle (e.g., a car).

[0047] Certain computing systems may include various layers to perform computing tasks. For example, a computing system may include electronic modules, chips or dies, computing tiles (each including multiple chips or dies packaged together and integrated with one or more cooling solutions), system trays (including an array of connected computing tiles on a structural bus), and computer cabinets (each including one or more system tray(s)).

[0048] The present disclosure relates to a new system tray for a computing system. The system tray disclosed herein can be configured for high-performance computing applications. The system tray disclosed herein can provide high-speed connectivity, ideal power and mechanical and thermal performance, and dense integration.

[0049] Figure 1A A system tray 100 according to one embodiment is illustrated. As shown, the system tray 100 includes an array of computing tiles 102 interconnected and supported by a structural bus 104. Figure 1A , but any suitable electronic modules may be included in the system tray 100 and supported by the structural bus 104. The structural bus 104 may provide structural support and deliver power to the compute tiles 102 positioned thereon. In certain embodiments, each compute tile 102 comprises a system on a chip that includes a die array integrated with a cooling solution (e.g., a cold plate). In neural network training applications, the compute tiles 102 may be referred to as training tiles. The compute tiles 102 may be referred to as compute tiles. Any suitable number of compute tiles 102 may be interconnected on the system tray 100. For example, Figure 1A Six computing tiles 102 are shown interconnected. The system tray 100 can include an intra-tray signal delivery cable 108 to facilitate communication between each computing tile 102 and an external connection hub (not shown). The computing tiles 102 are positioned close to each other so that connections between the tiles (such as connections established by the intra-tray signal delivery cables 108) are relatively short to promote high-speed connectivity. The system tray 100 can operate at relatively high power and maintain mechanical integrity and dissipate enough heat to operate at a suitable temperature. The illustrated system tray 100 supports dense integration. For example, the system tray 100 can support a considerable mass and maintain a relatively small height.

[0050] like Figure 1A As shown, the system tray 100 may include stepped edges 106 positioned along the length of opposite sides of the system tray 100. The stepped edges 106 may facilitate sliding the system tray 100 into and out of a cabinet, such as with reference to FIG. Figure 1B 1. The computer cabinet 150 is depicted. The system tray 100 can be moved into and out of the cabinet to facilitate blind connections of power, data, and / or coolant. The system tray 100 can include a handle 110 to facilitate moving the system tray 100 into and out of the cabinet.

[0051] The structural bus 104 may include multiple layers that provide structural and electrical support for the compute tiles 102. These layers may include an insulating layer, one or more power layers, and one or more ground layers. In one embodiment, the structural bus 104 may include five layers, such as a power layer, an inner insulating layer, and a ground layer, each positioned between two outer insulating layers. The power layer and the ground layer may provide power to the compute tiles 102. For example, the power layer and the ground layer may be made of a conductive material. The insulating layer may be made of an electrically insulating material such that the compute tiles 102, the power layer, and the ground layer are generally electrically isolated except where they are electrically connected for power delivery. For example, a reference Figure 5A and Figure 5B The tile power connectors discussed may connect each compute tile 102 to the power and ground planes.

[0052] In some embodiments, the structural bus 104 may include an integrated manifold (in Figure 1A (not shown) Such integrated manifolds can be used to cool the structural bus 104. In one embodiment, the manifolds for distributing the coolant are integrated into a layer of the structural bus 104. For example, the inlet manifold can be integrated into the power layer, and the outlet manifold can be integrated into the ground layer. The manifolds for distributing the coolant can be integrated into the structural bus in any other suitable manner, for example, in another layer of the structural bus 104 or as an additional layer.

[0053] Figure 1B A computer cabinet 150 according to one embodiment is illustrated. The computer cabinet can include a system tray 100, a host computer 152, a power supply 156, and a cabinet structure 154. The host computer 152 can provide data support to the compute tiles 102 and the computer cabinet 150. For example, the host computer 152 can perform ingestion processing. The power supply 156 can facilitate the distribution of power to the computer cabinet 150. For example, based on the power specifications of the computer cabinet 150, the power supply 156 can include a power converter, a voltage and / or current source, etc. The cabinet structure 154 can include side rails 158 that provide structural support for the system tray 100, the host computer 152, and the power supply 156. For example, the stepped edge 106 of the system tray 100 can engage the side rails 158 to facilitate sliding the system tray 100 into and out of the cabinet structure 154.

[0054] like Figure 1BAs shown, the computer cabinet 150 includes a first system tray 100 positioned vertically above a first host 152 and a second system tray 100 positioned vertically above a second host 152. As shown, the first host 152 can be positioned between the first system tray 100 and the second system tray 200. Power supplies 156 can be included at the top and bottom of the computer cabinet 150 and positioned vertically relative to the system tray 100 and the hosts 152.

[0055] The cabinet of configuration 154 may include power connectors, data connectors, and coolant connectors that interface with a fully inserted system tray 100, a host computer 152, and a power supply 156. For example, a fully inserted system tray 100 may be blindly connected to the power connectors, data connectors, and coolant connectors. The connectors may facilitate electrical and power connections between the inserted system tray 100, the host computer 152, and the power supply 156.

[0056] Figures 2A to 2E is a schematic diagram of an example system tray, such as system tray 100 , according to one embodiment. Figure 2A is a schematic diagram of a cross-section of an example system tray 200. Features of system tray 200 are not necessarily shown to scale. System tray 200 includes compute tiles 102, power plane 202, ground plane 204, power connector 206, ground connector 208, coolant inlet manifold 210, coolant outlet manifold 212, coolant delivery hose 214, and insulation layer 216. In system tray 200, a structural bus includes power plane 202, ground plane 204, and insulation layer 216.

[0057] The power layer 202 and the ground layer 204 may include conductive materials. The power layer 202 and the ground layer 204 may form an electrical power circuit. For example, when the system tray 200 is fully inserted into the computer cabinet, a circuit may be formed by the power layer 202 and the ground layer 204. The insulating layer 216 may be made of an electrically insulating material. The insulating layer 216 may electrically insulate the computing tile 102 from the power layer 202 and the ground layer 204, except where the computing tile 102 is connected to the power layer 202 or the ground layer 204.

[0058] The power layer 202, the ground layer 204, the insulation layer 216, the power connector 206, and the ground connector 208 may form a structural bus, such as Figure 1AThe structural bus 104 of the computing tile 102 can be connected to the computing tile 102. The structural bus can provide structural support and electrical power to the computing tile 102. For example, the power layer 202, the ground layer 204, and the insulation layer 216 can be combined to form a rigid body. The power connector 206 can electrically couple the computing tile 102 to the power layer 202. The ground connector 208 can electrically couple the computing tile 102 to the ground layer 204. The power connector 206 and the ground connector 208 can also provide physical couplings to physically connect the computing tile 102 to the structural bus. In this way, the computing tile 102 can be physically and electrically coupled to the structural bus in a single connection action.

[0059] The coolant inlet manifold 210 can deliver coolant into the system tray 200, and the coolant outlet manifold 212 can take coolant out of the system tray 200. Figure 6C In more detail, the compute tile 102 can include a cold plate that includes various components for receiving coolant into the cold plate, distributing the coolant throughout the cold plate to cool the compute tile 102, and exhausting the coolant from the cold plate. Coolant delivery hoses 214 can deliver coolant from the coolant inlet manifold 210 to the compute tile 102 and from the compute tile 102 to the coolant outlet manifold 212.

[0060] Figure 2B is a schematic diagram of a cross-section of an example system tray 230. Features of the system tray 230 are not necessarily shown to scale. Figure 2A In addition to the components of the system tray 200, the system tray 230 may also include a local power reservoir 232. The local power reservoir 232 may be an energy storage device, such as a battery, a capacitor, or any suitable combination thereof that can provide a power source to the system tray 230. For example, the local power reservoir 232 may provide an additional or alternative power source to the compute tile 102. The local power reservoir 232 may be directly connected to the compute tile 102 using the power connector 206 and the ground connector 208, and / or may be connected to the power plane 202 and the ground plane 204.

[0061] Figures 2C to 2E Various views of a system tray 250 are illustrated, according to one embodiment, wherein the coolant manifold is positioned above the structural busbars. Figure 2C A top view of the system tray 250 is shown. Figure 2D A perspective view of the system tray 250 is illustrated. Figure 2E A perspective view of the system tray 250 is illustrated with the compute tile 102 omitted.

[0062] The system tray 250 may include a computing tile 102, a structural bus 104, a stepped edge 106, an intra-tray signal delivery cable 108, and a handle 110, as shown in FIG. Figure 1A The system tray 250 may further include a coolant inlet manifold 210, a coolant outlet manifold 212, a coolant delivery hose 214, a system tray data connector 252, a system tray power connector 254, an inter-tray data port 282, a tile power connector 292, and a tile data connector 294.

[0063] As reference Figure 2A As described, the coolant inlet manifold 210, the coolant outlet manifold 212, and the coolant delivery hose 214 can deliver coolant to or from the computing tile 102. The coolant inlet manifold 210 can be connected to an external coolant source, such as through a connector on a computer cabinet, to receive the coolant. The coolant outlet manifold 212 can discharge the coolant from the system tray 250.

[0064] The system tray data connector 252 is configured to transfer data to and from the system tray 250. The system tray data connector 252 is connected to each computing tile 102 via the intra-tray signal delivery cable 108. The system tray power connector 254 is configured to deliver power to the system tray. The system tray power connector 254 is connected to each computing tile 102 via the structural bus 104. The system tray data connector 252 and the system tray power connector 254 can be connected to external devices, such as reference Figure 1B The host 152 and power supply 156 are configured to receive power and receive and send data signals.

[0065] Each of the system tray data connector 252, the system tray power connector 254, the coolant inlet manifold 210, and the coolant outlet manifold 212 can be positioned at the rear end of the system tray 250 so that when the system tray 250 is inserted into the computer cabinet, each connects to a corresponding connector on the computer cabinet. For example, when the system tray 250 is fully inserted into the computer cabinet, as shown in FIG. Figure 1B In the depicted computer cabinet 150 , the system tray data connector 252 may be connected to a data connection on the cabinet structure 154 , the system tray power connector 254 may be connected to a power connection on the cabinet structure 154 , and the inlet manifold 210 and the coolant outlet manifold 212 may be connected to a coolant connection on the cabinet structure 154 .

[0066] The inter-tray data port 282 is positioned on the system tray 250 opposite the system tray data connector 252 and the system tray power connector 254. Thus, the inter-tray data port 282 is accessible when the system tray 250 is inserted into a computer cabinet. The inter-tray data port 282 can be connected to the compute tile 102 via the intra-tray signal delivery cable 108. The inter-tray data port 282 can facilitate connections between multiple system trays, connections to other computer cabinets, and / or connections to other external sources.

[0067] The tile data connector 294 can connect the compute tile 102 to the in-tray signal delivery cable 108 to facilitate data communication with the compute tile 102. The tile power connector 292 can connect the compute tile 102 to the structural bus 104 to facilitate power delivery to the compute tile 102. The tile data connector 294 and the tile power connector 292 are positioned so that when the compute tile 102 is added to the system tray 250, the compute tile 102 is simultaneously connected to the tile data connector 294 and the tile power connector 292 (e.g., in a single mechanical action).

[0068] Figure 3A 3 is a schematic diagram of a cross-section of a system tray 300 in which the coolant manifold is integrated into the structural busbars. The various features of the system tray 300 are not necessarily shown to scale. The system tray 300 includes the compute tiles 102, a power layer 302, a ground layer 304, power connectors 306, a ground connector 308, an integrated coolant inlet manifold 310, an integrated coolant outlet manifold 312, coolant passages 314, and an insulation layer 316.

[0069] The power layer 302 and the ground layer 304 may include conductive materials. The power layer 302 and the ground layer 304 may form an electrical power circuit. For example, when the system tray 300 is fully inserted into the computer cabinet, a circuit may be formed by the power layer 302 and the ground layer 304. The insulating layer 316 may be made of an electrically insulating material. The insulating layer 316 may electrically insulate the computing tile 102 from the power layer 302 and the ground layer 304, wherein the computing tile 102 is not connected to the power layer 302 or the ground layer 304.

[0070] The integrated coolant inlet manifold 310 can deliver coolant into the system tray 300. The integrated coolant outlet manifold 312 can take coolant out of the system tray 300. Figure 6CIn more detail, the compute tile 102 can include a cold plate that includes various components for receiving coolant into the cold plate, distributing the coolant throughout the cold plate to cool the compute tile 102, and exhausting the coolant from the cold plate. Coolant passages 314 can deliver coolant from the coolant inlet manifold 210 to the compute tile 102. Other coolant passages 34 can deliver coolant from the compute tile to the coolant outlet manifold 212.

[0071] The power layer 302, the ground layer 304, the insulation layer 316, the power connector 306 and the ground connector 308 may form a structural busbar, as shown in FIG. Figure 1A The structural bus 104 is described. The structural bus can provide structural and power support for the compute tile 102. For example, the power layer 302, the ground layer 304, and the insulation layer 316 can be combined to form a rigid body. The power connector 306 can electrically couple the compute tile 102 to the power layer 302, and the ground connector can electrically couple the compute tile 102 to the ground layer. The power connector 306 and the ground connector 308 can also provide physical couplings to physically connect the compute tile 102 to the structural bus. In this way, the compute tile 102 can be physically and electrically coupled to the structural bus in a single connection action.

[0072] The integrated coolant inlet manifold 310, the integrated coolant outlet manifold 312, and the coolant passages 314 can be incorporated into the structural busbar. The integrated coolant inlet manifold 310 can be positioned between the layers of the structural busbar. The integrated coolant outlet manifold 312 can be positioned between the layers of the structural busbar. Thus, Figure 3A The structural busbar can provide structural support for the computing tiles, provide power delivery to the computing tiles, and provide coolant delivery and exhaust for the computing tiles. The integrated coolant inlet manifold 310 and the integrated coolant outlet manifold 312 can provide cooling to the structural busbar. In some embodiments, the structural busbar can include a temperature monitoring grid for monitoring the temperature distribution on the structural busbar. For example, the structural busbar can include one or more thermocouples, resistance temperature detectors (RTDs), thermistors, semiconductor-based integrated circuits, etc., or any suitable combination thereof, which monitor the temperature distribution on the structural busbar.

[0073] Figure 3AThe integrated coolant inlet manifold 310 is shown housed in the power layer 302 and the integrated coolant outlet manifold 312 is shown housed in the ground layer 304. In some embodiments, the integrated coolant inlet manifold 310 and / or the integrated coolant outlet manifold 312 are incorporated into other portions of the structural busbar. For example, the integrated coolant inlet manifold 310 and the integrated coolant outlet manifold 312 can be housed in a single layer, such as the power layer 302, in one or more insulating layers 316, or as additional layers to the structural busbar.

[0074] In some embodiments, the compute tile 102 includes an integrated coolant connection, such as reference Figure 6C The inlet port 612 and outlet port 614 are shown. The compute tile 102 can be physically coupled to the structural bus through the power connector 306, the ground connector 308, and the coolant passage 314, and electrically coupled to the structural bus through the power connector 306 and the ground connector 308. In this way, the compute tile 102 can be physically and electrically coupled to the structural bus and physically coupled to the integrated coolant inlet manifold 310 and the integrated coolant outlet manifold 312 in a single connection action.

[0075] Figure 3B is a schematic diagram of a cross-section of an example system tray 330. Features of the system tray 330 are not necessarily shown to scale. Figure 3A In addition to the components of the system tray 300, the system tray 330 may also include a local power reservoir 332. The local power reservoir 332 may be an energy storage device, such as a battery, a capacitor, or any suitable combination thereof that can provide a power source to the system tray 330. For example, the local power reservoir 332 may provide an additional or alternative power source to the compute tile 102. The local power reservoir 332 may be directly connected to the compute tile 102 using the power connector 306 and the ground connector 308, and / or may be connected to the power plane 302 and the ground plane 304.

[0076] Figure 4 is a top view of an illustrative structural busbar 104 according to one embodiment. The structural busbar 104 may include a stepped edge 106 and a handle 110, as shown in FIG. Figure 1A The structural bus 104 may also include Figures 2C to 2E The tile-type power connector 292.

[0077] As described above, the structural bus 104 may include multiple layers that provide structural support and power to the compute tiles 102. These layers may include, for example, reference Figure 2A and Figure 3AThe various layers discussed. Tile power connectors 292 can connect each compute tile 102 to the power and ground layers of the structural bus 104. In some embodiments, the structural bus 104 can include an integrated manifold for distributing coolant to the compute tiles, such as described in reference to FIG. Figure 3A An integrated coolant inlet manifold 310 and an integrated coolant outlet manifold 312 are discussed.

[0078] Each tile power connector 292 includes a power connector 406 and a ground connector 408. Figure 2A and Figure 3A As discussed, the power connector 406 may correspond to the power connector 206 and / or the power connector 306. Similarly, the ground connector 408 may correspond to the ground connector 208 and / or the ground connector 308, as described with reference to FIG. Figure 2A and Figure 3A Although Figure 4 Each tile power connector 292 is shown to include four power connectors 406 and four ground connectors 408, but more or fewer power connectors 406 and / or ground connectors 408 may be used. Figures 5A to 5B The tile-style power connector 292 is described in more detail.

[0079] Figures 5A to 5B is a schematic diagram of a tile-style power connector, such as tile-style power connector 292 , according to one embodiment. Figure 5A is a schematic diagram of a top view of the tile-type power connector 500 . Figure 5B FIG is a schematic diagram of a cross section of a tile-type power connector 500. Figure 5A and / or Figure 5B , various features of tile power connector 500 are not necessarily shown to scale. A structural busbar with tile connector 500 may implement integrated fusion. Power connector 500 includes a device ground connector 502, a device power connector 504, a busbar ground plane 510, and a busbar power plane 512. For example, device ground connector 502 and / or device ground connector 504 may be pins. For illustrative purposes, tile footprint 506 provides an example footprint of a compute tile 102 compared to tile power connector 500.

[0080] Device ground connector 502 may be a pin of a compute tile 102 that extends into bus ground plane 510. Device power connector 504 may be a pin of a compute tile 102 that extends into bus power plane 512. When device ground connector 502 is plugged into bus ground plane 510 and device power connector 504 is plugged into bus power plane 512, a power circuit is established and power is delivered to the compute tile 102.

[0081] The busbar power layer 512 and the busbar ground layer 510 each include built-in sections of thinner conductor cross-sections. The thinner conductor cross-sections can limit the current that can be delivered to the computing tile 102 to protect the computing tile 102 from surge currents. The tile power connector 500 can be implemented without electrical fuses integrated into the busbar.

[0082] Figure 5C is a schematic diagram of a top view of a tile power connector 550 (such as tile power connector 292) according to one embodiment. Figure 5B In addition to the components of the power connector 500, the power connector 550 may also include an electrical fuse 552. In some embodiments, the electrical fuse 552 may be integrated into the busbar, such as part of the busbar power layer 512. In some embodiments, one or more other electrical fuses may be external to the busbar. In some embodiments, the electrical fuse 552 may include a current sensing component and output one or more signals associated with a current passing a threshold.

[0083] Figure 6A A processing system 10 according to aspects of the present disclosure is illustrated. Figure 6B A system on wafer (SoW) 14 of a processing system 10 is illustrated in accordance with aspects of the present disclosure. In some embodiments, the processing system 10 corresponds to Figure 1A The processing system 10 may be configured to have a high computational density and / or any other suitable computational tile disclosed herein. The processing system 10 may have a high computational density, and the dissipation of heat generated by the processing system 10 may significantly affect the performance of the processing system 10. The processing system 10 may be used and / or specifically configured for high-performance computing and / or computationally intensive applications, such as neural network training and / or processing, machine learning, artificial intelligence, and the like. The processing system 10 may implement redundancy. In some applications, the processing system 10 may be used for neural network training, to generate data for use by an autonomous driving system of a vehicle (e.g., a car), to implement other autonomous vehicle functions, to implement advanced driver assistance system (ADAS) functions, and the like.

[0084] The processing system 10 may include a heat dissipation structure 12, a SoW 14, an input / output (I / O) frame 15, a voltage regulator module (VRM), a cooling system 18, a control board, etc. In the processing system 10, the thermal system includes the heat dissipation structure 12 and the cooling system 18. Each of the illustrated elements of the processing system 10 is a SoW assembly structure. Figure 6A The diagram shows the Figure 1A The system tray 100 is shown with the processing system 10 in an inverted position.

[0085] The heat dissipation structure 12 can dissipate heat from the SoW 14. The heat dissipation structure 12 can include a heat sink. Such a heat sink can include a metal plate. Alternatively or additionally, the heat dissipation structure 12 can include a heat sink. The heat dissipation structure 12 can include any suitable material having desired heat dissipation properties. A thermal interface material can be included between the heat dissipation structure 12 and the SoW 14 to reduce and / or minimize heat transfer resistance.

[0086] exist Figure 6A In FIG, the processing system 10 includes a SoW 14 positioned between a heat dissipation structure 12 and a cooling system 18. Figure 6B As shown, SoW 14 may include an array of integrated circuit (IC) dies 22. IC dies 22 may be embedded in a molding material. SoW 14 may have a high computational density. IC dies 22 may be semiconductor dies, such as silicon dies. The array of IC dies 22 may include any suitable number of IC dies 22. For example, the array of IC dies 22 may include 16 IC dies 22, 25 IC dies 22, 36 IC dies 22, or 49 IC dies 22. For example, SoW 14 may be an integrated fan-out (InFO) wafer. A fan-out wafer may include multiple wiring layers on the array of IC dies 22. For example, in some applications, a fan-out wafer may include 4, 5, 6, 8, or 10 wiring layers. The wiring layers of the fan-out wafer may provide signal connectivity between IC dies 22 and / or to external components. SoW 14 may have a relatively large diameter, such as a diameter in the range of 10 inches to 15 inches. As an example, the SoW 14 may have a diameter of 12 inches.

[0087] The I / O frame 15 contributes to the structural integrity of the processing system 10. The I / O frame 15 may provide support for the VRM and hold the VRM in place.

[0088] The VRMs can be positioned so that each VRM is stacked with the IC die 22 of the SoW 14. In the processing system 10, there is a high density of packaging of the VRMs. Therefore, the VRMs can consume a large amount of power and generate heat. The VRMs are configured to receive a direct current (DC) supply voltage and supply a lower output voltage to the corresponding IC die 22 of the SoW 14. The VRMs can be connected to a fabric bus, such as fabric bus 104, to provide the supply voltage to the VRMs.

[0089] The cooling system 18 can provide active cooling for the VRMs and the SoWs 22. The cooling system 18 can receive coolant from a coolant inlet manifold. The cooling system 18 can discharge the coolant to a coolant outlet manifold. The cooling system 18 can provide active cooling for the control board. The cooling system 18 can include metal having a flow path for a heat transfer fluid (such as a coolant) to flow through. In the assembled processing system 10, the cooling system 18 can be bolted to the heat dissipation structure 12. This can provide structural support for the SoWs 14 and / or can reduce the chance of SoWs 14 cracking. A thermal interface material can be included between the cooling system 18 and the control board to reduce and / or minimize resistance to heat transfer.

[0090] The control board may include electronic components. The electronic components of the control board may provide control signals to the VRM. The control board may include electronic components to control the operation of the SoW 14.

[0091] Figure 6C 6 is a perspective view illustrating a portion 600 of a processing system 10 according to aspects of the present disclosure. The portion 600 of the processing system 10 illustrates a cold plate 610, power connector pins 606, and ground connector pins 604. For example, the cold plate 610 may implement Figure 6A Cooling system 18.

[0092] The cold plate 610 can include various inlets, such as an inlet port 612, an inlet manifold, mechanical supports, flow channels, fins, an outlet manifold, and outlets, such as an outlet port 614. The cold plate 610 can also include openings (also referred to as sockets or slots) for passing connectors, such as power connector pins 606 and ground connector pins 604, which provide thermal connectivity, power connectivity, and / or communication connectivity through the cold plate 610. In some embodiments, the cold plate can be formed from machined copper sections that have been brazed. The cold plate body can be formed from any other suitable material. The cold plate body can include an array of cooling elements, such as heat sink fins.

[0093] The cold plate 610 can facilitate active cooling of the processing system 10 via a coolant. The cold plate 610 can receive coolant from a coolant inlet manifold of the system tray to the cold plate 610 at an inlet port 612, distribute the coolant through flow channels of the cold plate 610 to cool the processing system 10, and discharge the coolant to a coolant outlet manifold of the system tray through an outlet port 614.

[0094] In some embodiments, power connector pin 606 and ground connector pin 604 correspond to reference Figures 5A to 5B The device power connector 504 and the device ground connector 502 are described. Figure 6CAs shown, the power connector pins 606, the ground connector pins 604, the inlet port 612, and the outlet port 614 are positioned on the same side of the processing system 10. In this way, structural connections, electrical connections, and coolant connections can be established in the same connection action. For example, the processing system 10 can be physically and electrically coupled to the structural busbar and physically coupled to the integrated coolant inlet manifold and the integrated coolant outlet manifold in the structural busbar in a single connection action. The structural busbar can include surfaces with power connections, ground connections, and coolant path connections to facilitate such connections.

[0095] Figure 7 The diagram shows a connection pin 702 and a connection socket 704 according to one embodiment. The connection pin 702 can be inserted into the connection socket 704 to establish an electrical coupling and a physical coupling between the connection pin 702 and the connection socket 704. In some embodiments, the connection pin 702 corresponds to a reference Figures 5A to 5B The device ground connector 502 and the device power connector 504 are discussed. However, any other suitable components may be used in place of the connection pins 702. In some embodiments, the connection sockets 704 are incorporated into the structural busbars, such as Figure 4 The power connector 406 and the ground connector 408 of the structural bus 104. However, any other suitable component may be used instead of the connection socket 704.

[0096] In some embodiments, the connection pins 702 and / or the connection socket 704 can include built-in electrical fuses. The built-in electrical fuses can help regulate the amount of current that can flow through the connection pins 702 and / or the connection socket 704.

[0097] Unless the context clearly requires otherwise, throughout the specification and claims, the words "comprise," "comprising," "include," "including," and the like should be construed in an inclusive sense, as opposed to an exclusive or exhaustive sense; that is, in the sense of "including, but not limited to." The word "coupled," as generally used herein, refers to two or more elements that can be directly connected or connected through one or more intermediate elements. Similarly, the word "connected," as generally used herein, refers to two or more elements that can be directly connected or connected through one or more intermediate elements. Furthermore, when used in this application, the words "herein," "above," "below," and words of similar meaning shall refer to this application as a whole and not to any particular parts of this application. Where the context permits, words in the above detailed description that use the singular or plural number may also include the plural or singular number, respectively. The word "or," when referring to a list of two or more items, encompasses all of the following interpretations of the word: any item in the list, all items in the list, and any combination of items in the list.

[0098] Furthermore, conditional language used herein, such as “can,” “could,” “might,” “may,” “eg,” “for example,” “such as,” etc., unless specifically stated otherwise or understood otherwise in the context of use, is generally intended to convey that some embodiments include, while other embodiments do not include, certain features, elements, and / or states. Thus, such conditional language is generally not intended to imply that one or more embodiments require a feature, element, and / or state in any way.

[0099] The foregoing has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the invention to the precise forms described. Many modifications and variations are possible in light of the above teachings. Therefore, others skilled in the art will be able to best utilize these techniques and various embodiments with various modifications to suit a variety of applications.

[0100] Although the present disclosure and examples have been described with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art. Such changes and modifications should be understood to be included within the scope of the present disclosure.

Claims

1. A computing system, comprising: a plurality of compute tiles, wherein each of the plurality of compute tiles comprises a plurality of die and a cooling solution integrated with the plurality of die; as well as A bus bar on which the plurality of computing tiles are positioned, the bus bar being configured to provide structural support to the plurality of computing tiles and to provide electrical power to the plurality of computing tiles.

2. The computing system of claim 1, wherein The busbar comprises: Power layer; Ground plane; wherein the power plane and the ground plane are electrically connected to each of the plurality of computing tiles; as well as Multiple insulation layers; and The computing system further includes: a first plurality of connectors electrically coupling the plurality of compute tiles to the power plane of the bus; as well as A second plurality of connectors electrically couples the plurality of compute tiles to the ground layer of the busbar.

3. The computing system of claim 2, wherein the bus further comprises: an integrated inlet manifold configured to deliver coolant to each of the plurality of compute tiles; as well as An integrated outlet manifold is configured to receive the coolant from each of the plurality of compute tiles, the integrated inlet manifold and the integrated outlet manifold each being positioned between layers of the busbar. 4 . The computing system of claim 1 , wherein the bus bar includes a stepped edge sized to slide into a cabinet structure and engage a side rail of the cabinet structure.

5. The computing system of claim 1, wherein each of the plurality of computing tiles comprises a system on a wafer (SoW), the system on a wafer comprising the plurality of dies. 6 . The computing system of claim 1 , wherein the cooling solution comprises a cold plate including an inlet port configured to receive a coolant and an outlet port configured to exhaust the coolant.

7. The computing system of claim 6, wherein the bus further comprises: an integrated inlet manifold configured to deliver the coolant to the inlet port of each of the plurality of compute tiles; as well as An integrated outlet manifold configured to receive the coolant from the outlet port of each of the plurality of compute tiles, the integrated inlet manifold and the integrated outlet manifold each being positioned between layers of the busbar.

8. The computing system of claim 6, further comprising: an inlet manifold positioned above the busbar and configured to deliver the coolant to the inlet port of each of the plurality of compute tiles; as well as An outlet manifold is positioned above the busbar and is configured to receive the coolant from the outlet port of each of the plurality of compute tiles.

9. The computing system of claim 1, further comprising: a first host, the first host being vertically positioned relative to the bus, the first host being configured to provide data support to the plurality of computing tiles; a second plurality of computing tiles; a second bus bar, on which the second plurality of computing tiles are positioned, the second bus bar being configured to provide structural support to the second plurality of computing tiles and to provide electrical power to the second plurality of computing tiles, the first host being positioned between the bus bar and the second bus bar; a second host vertically positioned relative to the second plurality of compute tiles; as well as A cabinet structure, in which the busbar, the second busbar, the first host and the second host are positioned.

10. A busbar for supporting and electrically connecting electronic modules, the busbar comprising: Power layer; Ground plane; as well as Multiple insulation layers; The busbar is configured to provide structural support to a plurality of electronic modules, and the busbar is configured to provide electrical power to each of the plurality of electronic modules.

11. The busbar of claim 10, wherein the plurality of electronic modules comprises compute tiles, wherein each of the compute tiles comprises a plurality of dies and a cooling solution integrated with the plurality of dies.

12. The busbar according to claim 10, further comprising: an integrated inlet manifold configured to provide coolant to each of the electronic modules; as well as An integrated outlet manifold is configured to receive the coolant from each of the electronic modules.

13. The busbar according to claim 12, wherein: The plurality of insulating layers include two outer insulating layers; Both the power layer and the ground layer are positioned between the two outer insulating layers; The integrated inlet manifold is positioned between the two outer insulation layers; and The integrated outlet manifold is positioned between the two outer insulation layers.

14. The busbar of claim 12, wherein a surface of the busbar includes connections to both the integrated inlet manifold and the integrated outlet manifold.

15. The busbar of claim 14, wherein the surface of the busbar further comprises a connection to the power plane and a connection to the ground plane. 16 . The bus bar of claim 10 , wherein the bus bar includes openings in a region where the plurality of electronic modules are positioned when the plurality of electronic modules are connected to the power layer and the ground layer.

17. A method of assembling a computing system, the method comprising: Providing a busbar including a power layer, a ground layer and multiple insulation layers; as well as connecting a plurality of computing tiles to the power layer and the ground layer of a busbar such that each computing tile of the plurality of computing tiles is arranged to receive structural support and electrical power from the busbar, Each of the plurality of computing tiles includes a plurality of dies and a cooling solution integrated with the plurality of dies.

18. The method of claim 17, wherein each of the plurality of compute tiles comprises a system on wafer (SoW), the system on wafer comprising the plurality of dies.

19. The method of claim 18, wherein the cooling solution is a cold plate, and the cold plate is integrated with the SoW.

20. The method of claim 17, wherein said connecting each compute tile further connects each compute tile to an integrated inlet manifold and an integrated outlet manifold of the busbar in the same operation.

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