Multilayer ceramic capacitor

Abstract

Provided is a multilayer ceramic capacitor (1) in which the stability when mounted on a substrate is improved and the contact between a housing and the multilayer ceramic capacitor (1) is suppressed. In a multilayer ceramic capacitor (1), 0.26 < = length in the width direction (W) of a WT surface main surface horizontal portion (MH1) / length in the width direction (W) of an external electrode (20) < = 0.56, 0.26 < = length in the lamination direction (T) of a WT surface side surface horizontal portion (SH1) / length in the lamination direction (T) of the external electrode (20) < = 0.56, the WT surface main surface horizontal portion (MH1) is located closer to the main surface (M) side than a WT surface shoulder portion (C1), the WT surface side surface horizontal portion (SH1) is located closer to the side surface (S) side than a WT surface shoulder portion (C3), and the WT surface shoulder portion (C3) is located closer to the side surface (S) side than a WT surface shoulder portion (C3). 0.26 < = the length of the LT surface main surface horizontal section (MH2) in the longitudinal direction (L) / the length of the external electrode (20) in the longitudinal direction (L) < = 0.56, the LT surface main surface horizontal section (MH2) is positioned closer to the main surface (S) side than the LT surface shoulder section (C2) and the LT surface non-horizontal section (MH2), 0.26 < = the length of the WL surface side surface horizontal section (SH3) / the length of the external electrode (20) in the longitudinal direction (L) < = 0.56, and the WL surface side surface horizontal section (SH3) is positioned closer to the side surface (S) side than the WL surface shoulder section (C3) and the WL surface non-horizontal section (N2).

Description

Technical Field

[0001] The present invention relates to a laminated ceramic capacitor. Background Art

[0002] Patent Document 1 and the like disclose a display module having a flexible housing, a plurality of inflexible substrates built into the housing, and a flexible substrate connecting the plurality of substrates. The display module is flexible as a whole and can be used even in a bent state. In addition, a non-flexible substrate is connected to the display module, and electronic components are mounted on the substrate. The electronic components include a laminated ceramic capacitor.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2008-306244 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In recent years, thinning has been promoted in flexible modules represented by display modules. In a thinned flexible module, when a flexible housing is bent, the housing may contact a laminated ceramic component mounted on a substrate. When a laminated ceramic capacitor contacts the housing, the laminated ceramic capacitor may be damaged.

[0008] Therefore, an object of the present invention is to provide a multilayer ceramic capacitor which can improve stability when mounted on a substrate and suppress contact between a case and the multilayer ceramic capacitor.

[0009] Technical solutions to solve problems

[0010] Multilayer ceramic capacitors have:

[0011] A laminated body comprising a plurality of laminated dielectric layers and a plurality of internal electrode layers, having a first main surface and a second main surface opposite to each other in a lamination direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the lamination direction, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the lamination direction and the width direction; and

[0012] an external electrode, disposed on the first end surface and the second end surface, and connected to the internal electrode layer;

[0013] The external electrodes extend to at least a portion of the first main surface, the second main surface, the first side surface, and the second side surface, respectively.

[0014] A cross section parallel to the width direction and the stacking direction is defined as a WT cross section, a cross section parallel to the length direction and the stacking direction is defined as an LT cross section, and a cross section parallel to the width direction and the length direction is defined as a WL cross section.

[0015] When observed in the WT cross section, the external electrode has a WT surface main surface horizontal portion, a WT surface side surface horizontal portion, and a WT surface shoulder portion connecting the WT surface main surface horizontal portion and the WT surface side surface horizontal portion.

[0016] 0.26≤the length of the horizontal portion of the main surface of the WT plane in the width direction / the length of the external electrode in the width direction≤0.56,

[0017] 0.26≤the length of the horizontal portion of the WT surface side in the stacking direction / the length of the external electrode in the stacking direction≤0.56,

[0018] The WT surface main surface horizontal portion is located closer to the main surface side than the WT surface shoulder portion,

[0019] The horizontal portion of the WT surface side is located closer to the side surface than the WT surface shoulder portion,

[0020] When viewed in the LT cross section, the external electrode has an LT surface main surface horizontal portion, an LT surface end surface horizontal portion, an LT surface shoulder portion connecting the LT surface main surface horizontal portion and the LT surface end surface horizontal portion, and an LT surface non-horizontal portion connecting the LT surface main surface horizontal portion and the stacked body.

[0021] 0.26≤the length of the horizontal portion of the LT plane main surface in the longitudinal direction / the length of the external electrode in the longitudinal direction≤0.56,

[0022] The LT surface main surface horizontal portion is located closer to the main surface side than the LT surface shoulder portion and the LT surface non-horizontal portion.

[0023] When observed on the WL cross section, the external electrode has a WL surface side horizontal portion, a WL surface end surface horizontal portion, a WL surface shoulder portion connecting the WL surface side horizontal portion and the WL surface end surface horizontal portion, and a WL surface non-horizontal portion connecting the WL surface side horizontal portion and the stacked body,

[0024] 0.26≤the length of the horizontal portion of the WL surface side / the length of the external electrode in the longitudinal direction≤0.56,

[0025] The WL-surface side horizontal portion is located closer to the side surface than the WL-surface shoulder portion and the WL-surface non-horizontal portion.

[0026] Effects of the Invention

[0027] According to the present invention, it is possible to provide a multilayer ceramic capacitor which can improve stability when mounted on a substrate and in which contact between a case and the multilayer ceramic capacitor is suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A perspective view of a multilayer ceramic capacitor according to the present invention.

[0029] Figure 2 yes Figure 1 Line II cross-sectional view.

[0030] Figure 3 yes Figure 1 Sectional view along line II-II.

[0031] Figure 4 It is a diagram schematically showing a WT cross section of an external electrode.

[0032] Figure 5 It is a diagram for explaining the horizontal part.

[0033] Figure 6 FIG. 1 is a diagram schematically showing a LT cross section of a multilayer ceramic capacitor.

[0034] Figure 7 FIG. 1 is a diagram schematically showing a LW cross section of a multilayer ceramic capacitor. DETAILED DESCRIPTION

[0035] Hereinafter, an example of an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the same reference numerals are attached to the same or corresponding parts in each drawing.

[0036] <Outline of Multilayer Ceramic Capacitors>

[0037] based on Figure 1 , an outline of the appearance of the multilayer ceramic capacitor 1 will be described. Figure 1 1 is a perspective view showing a multilayer ceramic capacitor 1 according to the present embodiment.

[0038] The multilayer ceramic capacitor 1 includes a multilayer body 2 and external electrodes 20. The external electrodes 20 include a first external electrode 20a and a second external electrode 20b.

[0039] <Definition of direction>

[0040] exist Figures 1 to 7 , an L direction, a W direction, and a T direction are shown. The L direction is a length direction L of the multilayer ceramic capacitor 1. The W direction is a width direction W of the multilayer ceramic capacitor 1. The T direction is a stacking direction T of the multilayer ceramic capacitor 1.

[0041] thus, Figure 2 The section shown is called the LT section. Figure 3The section shown is called the WT section.

[0042] The length direction L, the width direction W, and the stacking direction T do not necessarily need to be orthogonal to each other. The length direction L, the width direction W, and the stacking direction T may also be intersecting to each other.

[0043] <Outer Shape of Laminated Body>

[0044] like Figure 1 As shown, the stacked body 2 has a substantially rectangular parallelepiped shape.

[0045] The laminate has two main surfaces M, two end surfaces E, and two side surfaces S. The main surfaces M are surfaces facing each other in the lamination direction T. The end surfaces E are surfaces facing each other in the longitudinal direction L. The side surfaces S are surfaces facing each other in the width direction W.

[0046] The two main surfaces M are referred to as a first main surface M1 and a second main surface M2. The two end surfaces E are referred to as a first end surface E1 and a second end surface E2. The two side surfaces S are referred to as a first side surface S1 and a second side surface S2.

[0047] It is preferable that the ridges and corners of the laminate 2 are rounded. The ridges are the portions where two surfaces of the laminate 2 intersect. The corners are the portions where three surfaces of the laminate 2 intersect.

[0048] <Size of laminated body>

[0049] The size of the laminate 2 is not particularly limited. As an example, the length of the longitudinal direction L of the laminate 2 can be set to be greater than 0.05 mm and less than 1.00 mm. The length of the stacking direction T of the laminate 2 can be set to be greater than 0.10 mm and less than 0.50 mm. The length of the width direction W of the laminate 2 can be set to be greater than 0.10 mm and less than 0.50 mm.

[0050] The length of each part of the laminate 2 can be measured by a micrometer or an optical microscope. In addition, the length in the longitudinal direction L does not necessarily need to be longer than the length in the width direction W.

[0051] <Horizontal Part of External Electrode>

[0052] In the multilayer ceramic capacitor 1 of the present embodiment, the external electrode 20 is provided with a horizontal portion H having a predetermined shape.

[0053] Specifically, the external electrode 20 is provided with a main surface horizontal portion MH, a side surface horizontal portion SH, and an end surface horizontal portion EH. These horizontal portions H will be described later.

[0054] <Internal structure of laminate>

[0055] based on Figure 2, the internal structure of the stacked body 2 is described. Figure 2 yes Figure 1 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor taken along line II shown in FIG.

[0056] The laminate 2 includes a plurality of dielectric layers 4 and a plurality of internal electrode layers 10. The plurality of dielectric layers 4 and the plurality of internal electrode layers 10 are laminated in a lamination direction T with respect to each other.

[0057] <Inner layer and outer layer>

[0058] The laminate 2 has an inner layer portion IL and an outer layer portion OL in the lamination direction T. The outer layer portion OL includes a first outer layer portion OL1 and a second outer layer portion OL2. The first outer layer portion OL1 and the second outer layer portion OL2 are arranged in the lamination direction T so as to sandwich the inner layer portion IL.

[0059] The inner layer portion IL includes a part of the plurality of dielectric layers 4 and the plurality of internal electrode layers 10. In the inner layer portion IL, the plurality of internal electrode layers 10 are arranged to face each other with the dielectric layer 4 interposed therebetween.

[0060] The inner layer portion IL is a portion that forms electrostatic capacitance and substantially functions as a capacitor. Therefore, the inner layer portion IL is also referred to as an effective portion.

[0061] The first outer layer portion OL1 is arranged on the first main surface M1 side of the laminate 2. The second outer layer portion OL2 is arranged on the second main surface M2 side of the laminate 2.

[0062] Specifically, the first outer layer portion OL1 is disposed between the internal electrode layer 10 closest to the first main surface M1 and the second outer layer portion OL2 is disposed between the internal electrode layer 10 closest to the second main surface M2 and the second main surface M2.

[0063] The first outer layer portion OL1 and the second outer layer portion OL2 do not include the internal electrode layer 10. The first outer layer portion OL1 and the second outer layer portion OL2 include the remaining dielectric layers 4 except the dielectric layers 4 used for the inner layer portion IL among the plurality of dielectric layers 4.

[0064] The first outer layer portion OL1 and the second outer layer portion OL2 function as protective layers for the inner layer portion IL.

[0065] <Dielectric Layer>

[0066] The dielectric layer 4 includes an outer dielectric layer 5 and an inner dielectric layer 6 .

[0067] <Outer Dielectric Layer>

[0068] The outer dielectric layer 5 is a dielectric layer 4 constituting the first outer layer portion OL1 and the second outer layer portion OL2 among the dielectric layers 4. The outer dielectric layer 5 is arranged between the first main surface M1 and the internal electrode layer 10 closest to the first main surface M1, and between the second main surface M2 and the internal electrode layer 10 closest to the second main surface M2.

[0069] <Inner Dielectric Layer>

[0070] The inner dielectric layer 6 is a dielectric layer 4 that is located between the internal electrode layers 10 and constitutes the inner layer portion IL together with the internal electrode layers 10 .

[0071] The inner dielectric layer 6 is arranged between a first internal electrode layer 10 a and a second internal electrode layer 10 b described below.

[0072] <Number of Dielectric Layers>

[0073] The number of dielectric layers 4 stacked in the stacked body 2 can be, for example, 10 or more and 2000 or less. The number of dielectric layers 4 includes the number of outer dielectric layers 5 and the number of inner dielectric layers 6.

[0074] <Thickness of Dielectric Layer>

[0075] The thickness of the outer dielectric layer 5 among the dielectric layers 4 can be set to, for example, 10 μm or more and 100 μm or less. The thickness of the inner dielectric layer 6 can be set to, for example, 0.8 μm or more and 3.0 μm or less.

[0076] <Material for Dielectric Layer>

[0077] The material of the dielectric layer 4 can be a dielectric ceramic including, for example, BaTiO 3 , CaTiO 3 , SrTiO 3 , CaZrO 3 , or TiO 2 .

[0078] The material of the dielectric layer 4 may be obtained by adding a Mn compound, an Fe compound, a Cr compound, a Co compound, a Ni compound, etc., whose content is smaller than that of the main component, to the above-mentioned dielectric ceramic.

[0079] <Internal Electrode Layer>

[0080] The internal electrode layer 10 includes a first internal electrode layer 10a and a second internal electrode layer 10b. The first internal electrode layer 10a is an internal electrode layer 10 connected to the first external electrode 20a. The second internal electrode layer 10b is an internal electrode layer 10 connected to the second external electrode 20b.

[0081] The first internal electrode layer 10a extends from the first end surface E1 toward the second end surface E2. The second internal electrode layer 10b extends from the second end surface E2 toward the first end surface E1.

[0082] <Opposing portion and lead portion>

[0083] The first internal electrode layer 10 a and the second internal electrode layer 10 b each have a counter electrode portion 11 and a lead electrode portion 12 .

[0084] The counter electrode portion 11 is a portion of the internal electrode layer 10 where the first internal electrode layer 10a and the second internal electrode layer 10b face each other in the stacking direction T. The lead electrode portion 12 is a portion of the internal electrode layer 10 that is led out from the counter electrode portion 11 to the end surface E1 or the end surface E2 of the stacked body 2 .

[0085] The counter electrode portion 11 of the first internal electrode layer 10a is referred to as a first counter electrode portion 11a, and the lead electrode portion 12 of the first internal electrode layer 10a is referred to as a first lead electrode portion 12a. The first lead electrode portion 12a is a portion extending from the first counter electrode portion 11a to the first end surface E1 of the laminate 2.

[0086] Similarly, the counter electrode portion 11 of the second internal electrode layer 10b is referred to as the second counter electrode portion 11b, and the lead electrode portion 12 of the second internal electrode layer 10b is referred to as the second lead electrode portion 12b. The second lead electrode portion 12b is a portion extending from the second counter electrode portion 11b to the second end surface E2 of the laminate 2.

[0087] <Number of Internal Electrode Layers>

[0088] The number of internal electrode layers 10 can be, for example, not less than 10 and not more than 1000. The number of internal electrode layers 10 includes the number of first internal electrode layers 10a and the number of second internal electrode layers 10b.

[0089] <Thickness of Internal Electrode Layer>

[0090] The thickness of the internal electrode layer 10 can be set to, for example, 0.3 μm or more and 0.4 μm or less.

[0091] <Material of Internal Electrode Layer>

[0092] The material of the internal electrode layer 10 can be, for example, a metal such as Ni, Cu, Ag, Pd, or Au, an alloy of Ni and Cu, an alloy of Ag and Pd, etc. In addition, the material of the internal electrode layer 10 may also include dielectric particles having the same composition as the ceramic contained in the dielectric layer 4.

[0093] <Electrode Opposing Section>

[0094] The divisions in the longitudinal direction L of the laminate 2 will be described.

[0095] The laminated body 2 has an electrode facing portion LF and an end gap portion EG in the longitudinal direction L. The end gap portion EG includes a first end gap portion EG1 and a second end gap portion EG2.

[0096] The electrode facing portion LF is a portion where the first internal electrode layer 10 a and the second internal electrode layer 10 b face each other in the stacking direction T. That is, the electrode facing portion LF is a portion where the first counter electrode portion 11 a and the second counter electrode portion 11 b face each other in the stacking direction T.

[0097] The electrode facing portion LF is located at the center portion in the longitudinal direction L of the stacked body 2 .

[0098] The electrode facing portion LF is a portion that forms electrostatic capacitance and substantially functions as a capacitor. Therefore, the electrode facing portion LF is also referred to as an effective portion.

[0099] <End Gap>

[0100] The end gap portion EG is a portion where the first internal electrode layer 10 a and the second internal electrode layer 10 b do not face each other in the stacking direction T.

[0101] Specifically, a portion where the first internal electrode layer 10a is arranged but the second internal electrode layer 10b is not arranged is a first end gap EG1 in the stacking direction T. Similarly, a portion where the second internal electrode layer 10b is arranged but the first internal electrode layer 10a is not arranged is a second end gap EG2.

[0102] The first end gap EG1 corresponds to a portion where the first extraction electrode portion 12 a is arranged, and the second end gap EG2 corresponds to a portion where the second extraction electrode portion 12 b is arranged.

[0103] The first end gap EG1 functions as an extraction electrode of the first internal electrode layer 10a to the first end surface E1, and the second end gap EG2 functions as an extraction electrode of the second internal electrode layer 10b to the second end surface E2.

[0104] The end gap portion EG is a partition in the length direction L, and therefore is also called an L gap.

[0105] The length of the end gap portion EG in the longitudinal direction L can be set to, for example, 5 μm or more and 30 μm or less.

[0106] <External Electrode>

[0107] The external electrodes include a first external electrode 20 a and a second external electrode 20 b .

[0108] <First External Electrode>

[0109] The first external electrode 20a is an external electrode disposed on the first end surface E1 of the stacked body 2. The first external electrode 20a is electrically connected to the first internal electrode layer 10a.

[0110] <Second External Electrode>

[0111] The second external electrode 20b is an external electrode disposed on the second end surface E2 of the stacked body 2. The second external electrode 20b is electrically connected to the second internal electrode layer 10b.

[0112] <External electrodes on each surface>

[0113] The external electrode 20 extends from the end surface E to a portion of the two main surfaces M and a portion of the two side surfaces S.

[0114] The portion of the external electrode 20 disposed on the end surface E is referred to as the end surface external electrode 25 . The portion of the external electrode 20 disposed on a part of the main surface M is referred to as the main surface external electrode 26 . The portion of the external electrode 20 disposed on a part of the side surface S is referred to as the side surface external electrode 27 .

[0115] Specifically, the portion of the first external electrode 20a disposed on the first end surface E1 is set as the first end surface external electrode 25a. The portion of the first external electrode 20a disposed on a portion of the first main surface M1 or a portion of the second main surface M2 is set as the first main surface external electrode 26a. The portion of the first external electrode 20a disposed on a portion of the first side surface S1 or a portion of the second side surface S2 is set as the first side surface external electrode 27a.

[0116] In addition, regarding the second external electrode 20b, similarly to the first external electrode 20a, the portion of the second external electrode 20b disposed on the second end surface E2 is set as the second end surface external electrode 25b. The portion of the second external electrode 20b disposed on a portion of the first main surface M1 or a portion of the second main surface M2 is set as the second main surface external electrode 26b. The portion of the second external electrode 20b disposed on a portion of the first side surface S1 or a portion of the second side surface S2 is set as the second side surface external electrode 27b.

[0117] <Horizontal Part of External Electrode>

[0118] The aforementioned main surface horizontal portion MH is provided on the first main surface external electrode 26a and the second main surface external electrode 26b. In addition, the end surface horizontal portion EH is provided on the first end surface external electrode 25a and the second end surface external electrode 25b.

[0119] <Layer Structure of External Electrode>

[0120] based on Figure 2 The layer structure of the external electrode 20 will be described.

[0121] The external electrode 20 includes three layers: a base electrode layer 21 , an inner plating layer 23 , and a surface plating layer 24 . These layers are arranged in this order from the end surface E of the laminate 2 .

[0122] Specifically, the first external electrode 20a includes a first base electrode layer 21a, a first inner plating layer 23a, and a first surface plating layer 24a. Similarly, the second external electrode 20b includes a second base electrode layer 21b, a second inner plating layer 23b, and a second surface plating layer 24b.

[0123] In the description of the external electrode 20 , the direction away from the end surface E of the laminate 2 may be referred to as upward. For example, in the above-mentioned foundation electrode layer 21 and resin electrode layer 22 , the resin electrode layer 22 may be described as being disposed on the foundation electrode layer 21 .

[0124] <Base Electrode Layer>

[0125] The first foundation electrode layer 21a is disposed on and covers the first end face E1 of the laminate 2. The first foundation electrode layer 21a may extend from the first end face E1 to a portion of the first principal face M1, a portion of the second principal face M2, a portion of the first side face S1, and a portion of the second side face S2.

[0126] Similarly, the second foundation electrode layer 21b is arranged on the second end face E2 of the stacked body 2 to cover the second end face E2. The second foundation electrode layer 21b may extend from the second end face E2 to a portion of the second main face M1, a portion of the second main face M2, a portion of the first side face S1, and a portion of the second side face S2.

[0127] <Fired layer>

[0128] The base electrode layer 21 can be a fired layer containing metal and glass.

[0129] The fired layer is a layer obtained by applying a conductive paste containing metal and glass to the laminate by dipping and firing. The firing for forming the fired layer can be performed after the firing of the internal electrode layer, or can be performed simultaneously with the firing of the internal electrode layer. In addition, the fired layer can also be a multilayer.

[0130] The metal contained in the sintered layer includes Cu as a main component. In addition, as the metal, for example, at least one selected from metals such as Ni, Ag, Pd or Au, or alloys such as Ag-Pd alloys may be included as a main component, or a component other than the main component may be included.

[0131] Examples of the glass contained in the fired layer include glass components containing at least one selected from B, Si, Ba, Mg, Al, Li, etc. As a specific example, borosilicate glass can be used.

[0132] Furthermore, the base electrode layer 21 may be a resin layer containing conductive particles and a thermosetting resin. The resin layer may be formed on the above-mentioned fired layer, or may be formed directly on the laminate without forming a fired layer.

[0133] The resin layer is a layer obtained by applying a conductive paste containing conductive particles and a thermosetting resin to the laminate by a coating method and firing. In addition, the resin layer may be fired after the internal electrode layer is fired, or may be fired simultaneously with the internal electrode layer. In addition, the resin layer may also be multilayered.

[0134] The thickness of each base electrode layer 21 as a fired layer or a resin layer is not particularly limited, and may be 1 μm or more and 10 μm or less.

[0135] Alternatively, the base electrode layer 21 may be a thin film layer of 1 μm or less in thickness formed by a thin film forming method such as sputtering or vapor deposition and in which metal particles are deposited.

[0136] <Inner plating layer>

[0137] The inner plating layer 23 is disposed on the base electrode layer 21 and covers at least a portion of the base electrode layer 21. The inner plating layer 23 includes at least one selected from metals such as Cu, Ni, Ag, Pd, and Au, and alloys such as Ag-Pd alloy.

[0138] <Surface plating layer>

[0139] The surface plating layer 24 is disposed on the inner plating layer 23, and covers at least a portion of the inner plating layer 23. The surface plating layer 24 includes a metal such as Sn, for example.

[0140] The inner plating layer 23 is preferably a Ni plating layer, and the surface plating layer 24 is preferably a Sn plating layer.

[0141] The Ni plating layer can prevent the base electrode layer from being corroded by the solder when the ceramic electronic component is mounted. The Sn plating layer can improve the wettability of the solder when the ceramic electronic component is mounted, making the mounting easier. By setting the surface plating layer 24 as the Sn plating layer, the wettability of the solder to the external electrode 20 can be improved.

[0142] <Internal structure of laminate (WT cross section)>

[0143] based on Figure 3 , describing the internal structure of the stacked body 2, particularly the internal structure as viewed from the second end face E2. Figure 3 yes Figure 1 FIG. 1 is a cross-sectional view of the multilayer ceramic capacitor taken along line II-II shown in FIG.

[0144] The laminate 2 has an electrode facing portion WF where the internal electrode layers 10 face each other, and side gap portions SG in the width direction W. The side gap portions SG include first side gap portions SG1 and second side gap portions SG2. The first side gap portions SG1 and the second side gap portions SG2 are arranged to sandwich the electrode facing portion WF.

[0145] The first side gap SG1 is located between the electrode opposing portion WF and the first side surface S1 , and the second side gap SG2 is located between the electrode opposing portion WF and the second side surface S2 .

[0146] Specifically, the first side gap SG1 is located between the end of the internal electrode layer 10 on the first side face S1 and the first side face S1 , and the second side gap SG2 is located between the end of the internal electrode layer 10 on the second side face S2 and the second side face S2 .

[0147] The first side gap portion SG1 and the second side gap portion SG2 do not include the internal electrode layer 10 , and include only the dielectric layer 4 .

[0148] The first side gap portion SG1 and the second side gap portion SG2 function as a protective layer for the internal electrode layer 10 .

[0149] The side gap portion SG is a partition in the width direction W, and therefore is also called a W gap.

[0150] The length of the side gap portion SG in the width direction W can be set to, for example, 1 / 10 of the length of the stacked body 2 in the width direction W or to 5 μm or more and 30 μm or less.

[0151] <Horizontal Part of External Electrode>

[0152] Based on the above Figure 2 Similarly to the description of , the aforementioned main surface horizontal portion MH is provided on the first main surface external electrode 26a and the second main surface external electrode 26b. In addition, the side surface horizontal portion SH is provided on the first side surface external electrode 27a and the second side surface external electrode 27b.

[0153] <Size of Multilayer Ceramic Capacitors>

[0154] The length L of the entire multilayer ceramic capacitor 1 including the laminated body 2 and the external electrode 20 can be set to, for example, 0.2 mm or more and 2.0 mm or less. The length T of the entire multilayer ceramic capacitor 1 in the stacking direction can be set to, for example, 0.1 mm or more and 1.2 mm or less. The length W of the entire multilayer ceramic capacitor 1 in the width direction can be set to, for example, 0.1 mm or more and 1.2 mm or less.

[0155] In addition, in the present embodiment, the multilayer ceramic capacitor 1 is a two-terminal capacitor. The multilayer ceramic capacitor 1 is not limited to a two-terminal capacitor, and can be a multi-terminal capacitor of three or more terminals.

[0156] <Shape of External Electrodes>

[0157] In the multilayer ceramic capacitor 1 of the present embodiment, the horizontal portion H exists in the external electrode 20. The length of the horizontal portion H satisfies a predetermined ratio.

[0158] In addition, the portion other than the horizontal portion H of the external electrode 20 exists at a position lower than the horizontal portion H, that is, at a position closer to the inside of the stacked body 2 .

[0159] Thus, in the multilayer ceramic capacitor 1 of the present embodiment, the stability when mounted on the substrate can be improved. In addition, in the multilayer ceramic capacitor 1 of the present embodiment, the case and the multilayer ceramic capacitor 1 can be prevented from coming into contact with each other.

[0160] <Explanation of Terms>

[0161] In the following description, in addition to the horizontal portion H, terms such as shoulder portion C, non-horizontal portion N, and laminate shoulder portion K are used.

[0162] The horizontal portion H includes a main surface horizontal portion MH, a side surface horizontal portion SH, and an end surface horizontal portion EH.

[0163] The main surface horizontal portion MH includes a WT-plane main surface horizontal portion MH1 and a LT-plane main surface horizontal portion MH2. The side surface horizontal portion SH includes a WT-plane side surface horizontal portion SH1 and a WL-plane side surface horizontal portion SH3. The end surface horizontal portion EH includes an LT-plane end surface horizontal portion EH2 and a WL-plane end surface horizontal portion EH3.

[0164] The shoulder C includes a WT face shoulder C1 , an LT face shoulder C2 , and a WL face shoulder C3 .

[0165] The non-horizontal portion N includes an LT-plane non-horizontal portion N1 and a WL-plane non-horizontal portion N2 .

[0166] The laminate corner portion K includes a WT-side laminate shoulder portion K1 , a LT-side laminate shoulder portion K2 , and a WL-side laminate shoulder portion K3 .

[0167] First, the outline of the horizontal portion H and the like will be described based on the drawings. Figure 4 It is a diagram schematically showing a WT cross section of the external electrode 20 . Figure 6 1 is a diagram schematically showing a cross section of the multilayer ceramic capacitor 1 taken along the line LT. Figure 7 1 is a diagram schematically showing a LW cross section of the multilayer ceramic capacitor 1 .

[0168] <WT cross-section>

[0169] Based on Figure 4 explain the WT cross-section.

[0170] <Horizontal part>

[0171] The external electrode 20 has a WT surface main surface horizontal part MH1 in the main surface external electrode 26. The WT surface main surface horizontal part MH1 is provided on the first main surface M1 and the second main surface M2 of the laminate 2 respectively ( Figure 1 as shown). Therefore, two WT surface main surface horizontal parts MH1 are included in the WT cross-section.

[0172] The WT surface main surface horizontal part MH1 includes a part that is substantially horizontal with respect to the main surface M of the laminate 2.

[0173] In addition, the external electrode 20 has a WT surface side horizontal part SH1 in the side external electrode 27. The WT surface side horizontal part SH1 is provided on the first side surface S1 and the second side surface S2 of the laminate 2 respectively ( Figure 1 as shown). Therefore, two WT surface side horizontal parts SH1 are included in the WT cross-section.

[0174] The WT side horizontal part SH1 includes a part that is substantially horizontal with respect to the side surface S of the laminate 2.

[0175] Regarding the detailed definition of the horizontal part H, based on Figure 5 it will be described later.

[0176] <Shoulder>

[0177] The external electrode 20 has a WT surface shoulder C1.

[0178] The WT surface shoulder C1 is the part that connects the WT surface main surface horizontal part MH1 and the WT surface end face horizontal part SH1.

[0179] Specifically, the WT surface shoulder C1 is the external electrode 20 existing in Figure 4 the corner region R1 shown. The corner region R1 is the region defined by the line L1 and the line L2.

[0180] The line L1 is a line that extends parallel to the stacking direction T from the end in the width direction W of the WT surface main surface horizontal part MH1. The line L2 is a line that extends parallel to the width direction W from the end in the stacking direction T of the WT surface side horizontal part SH1.

[0181] The WT surface shoulders C1 exist on the four ridge lines of the laminate 2 respectively. Therefore, four WT surface shoulders C1 are included in the WT cross-section.

[0182] <Details of the horizontal part>

[0183] based on Figure 5 , the horizontal portion H is described. Figure 5 This is an enlarged view of the WT cross section for explaining the horizontal portion H.

[0184] Figure 5 Yes Figure 4 The area R4 of FIG is enlarged. That is, Figure 5 The WT plane main surface horizontal portion MH1 is shown in an enlarged manner.

[0185] Figure 5 The point P1 shown is a point showing the position of the external electrode 20 closest to the first main surface M1 in the WT cross section. In other words, the point P1 is a point showing the position of the external electrode 20 closest to the first main surface M1 in the WT cross section.

[0186] also, Figure 5 The illustrated point P2 is a point that indicates a position that is located in a direction parallel to the stacking direction T from the point P1 toward the inside of the stacked body 2 by a length D1.

[0187] The WT plane main surface horizontal portion MH1 is an external electrode 20 located between point P1 and point P2. More specifically, the WT plane main surface horizontal portion MH1 is an external electrode 20 located between a line passing through point P1 and parallel to the first main surface M1 and a line passing through point P2 and parallel to the first main surface M1 in the WT cross section. The aforementioned length D1 can be set to be greater than or equal to 0.5 μm and less than or equal to 3 μm.

[0188] In the above description, the horizontal portion H is described by taking the horizontal portion MH1 of the main surface of the WT plane as an example. This description is also appropriate for other horizontal portions H. That is, the horizontal portion H is the external electrode 20 in the range of the point closest to the side of each surface as the reference to the position of the point in the direction of the inside of the stack 2 by a given distance.

[0189] The above-mentioned given distances among the six horizontal portions H shown above are described below.

[0190] The WT-plane main-surface horizontal portion MH1 is a portion extending from 0.5 μm to 3.0 μm inward with respect to a point located closest to the main-surface M side in the WT plane.

[0191] The WT-plane side surface horizontal portion SH1 is a portion extending from a point located closest to the side surface S in the WT plane to an inner side by 0.5 μm or more and 3.0 μm or less.

[0192] The LT-plane main-surface horizontal portion MH2 is a portion extending from a point located closest to the main-surface M side in the LT plane to an inner side by 0.5 μm or more and 2.5 μm or less.

[0193] The LT-plane end-face horizontal portion EH2 is, in the LT-plane, the portion from the point closest to the end face E side to the inner side by 0.5 μm or more and 4.0 μm or less, based on the point existing on the LT-plane.

[0194] The WL-plane side-face horizontal portion SH3 is, in the WT-plane, the portion from the point closest to the side face S side to the inner side by 0.5 μm or more and 2.5 μm or less, based on the point existing on the WT-plane.

[0195] The WL-plane end-face horizontal portion EH3 is, in the WT-plane, the portion from the point closest to the end face E side to the inner side by 0.5 μm or more and 4.0 μm or less, based on the point existing on the WT-plane.

[0196] As described above, the horizontal portion H does not only refer to the strictly horizontal portion in the external electrode 20. The horizontal portion H refers to the external electrode 20 that includes the strictly horizontal portion and is within the aforementioned range.

[0197] <LT-plane>

[0198] Hereinafter, surfaces other than the WT-plane will be described.

[0199] First, the LT-plane will be described. Figure 6 is a diagram schematically showing the LT cross-section of the multilayer ceramic capacitor 1. In Figure 6 regard to the external electrode 20, details are only described for the external electrode 20 disposed on the first end face E1. However, the external electrode 20 disposed on the second end face E2 is the same as the external electrode 20 disposed on the first end face E1.

[0200] In the LT-plane, the external electrode 20 has the LT-plane main-face horizontal portion MH2 and the LT-plane end-face horizontal portion EH2 as the horizontal portion H.

[0201] The LT-plane main-face horizontal portion MH2 exists in the main-face external electrode 26 disposed on the first main face M1 and the main-face external electrode 26 disposed on the second main face M2.

[0202] In addition, the LT-plane end-face horizontal portion EH2 exists in the end-face external electrode 25 disposed on the first end face E1.

[0203] The ranges of the LT-plane main-face horizontal portion MH2 and the LT-plane end-face horizontal portion EH2 are as described above.

[0204] That is, the LT-plane main-face horizontal portion MH2 is the portion of the external electrode 20 from the point closest to the main face M side to the inner side by a given length. In addition, the LT-plane end-face horizontal portion EH2 is the portion of the external electrode 20 from the point closest to the end face E side to the inner side by a given length.

[0205] <Shoulder portion>

[0206] In addition, in the LT plane, the external electrode 20 has an LT-plane shoulder portion C2.

[0207] The LT-plane shoulder portion C2 is a portion that connects the LT-plane main-surface horizontal portion MH2 and the LT-plane end-surface horizontal portion EH2.

[0208] Similar to the WT-plane shoulder portion C1 described previously, the LT-plane shoulder portion C2 is the external electrode 20 that exists within Figure 6 the range defined by the line L3 and the line L4 as shown.

[0209] Here, the line L3 is a line that extends parallel to the stacking direction T from the end portion on the first end surface E1 side of the LT-plane main-surface horizontal portion MH2. The line L4 is a line that extends parallel to the length direction L from the end portion of the LT-plane end-surface horizontal portion EH2.

[0210] The LT-plane shoulder portion C2 exists at each of the four ridge lines of the laminate 2. Therefore, four LT-plane shoulder portions C2 are included in the LT cross-section.

[0211] <Non-horizontal portion>

[0212] In addition, in the LT plane, the external electrode 20 has an LT-plane non-horizontal portion N1.

[0213] The LT-plane non-horizontal portion N1 is the external electrode 20 that exists within the range from the end portion on the second end surface E2 side of the LT-plane main-surface horizontal portion MH2 to the end portion P3 on the second end surface E2 side of the external electrode 20 in the LT plane.

[0214] The LT-plane non-horizontal portion N1 is provided on the first main surface M1 side and the second main surface M2 side in the LT plane.

[0215] <LT-laminate shoulder portion>

[0216] Next, the LT-laminate corner portion K2 will be described.

[0217] The LT-laminate corner portion K2 is the corner portion of the laminate 2 that is in contact with the external electrode 20 that connects the LT-plane main-surface horizontal portion MH2 and the LT-plane end-surface horizontal portion EH2. In other words, the LT-laminate corner portion K2 is the corner portion of the laminate 2 that is in contact with the LT-plane shoulder portion C2.

[0218] Specifically, the LT-laminate corner portion K2 is the laminate 2 that exists within Figure 6 the corner region R2 as shown. This corner region R2 is the region defined by the aforementioned line L3 and line L4.

[0219] The LT-layer laminate corners K2 are respectively present at the four ridges of the laminate 2. Therefore, four LT-layer laminate corners K2 are included in the LT cross-section.

[0220] <WL plane>

[0221] Next, the WL plane will be described. Figure 7 It is a diagram schematically showing the WL cross-section of the multilayer ceramic capacitor 1. In Figure 7 regard to the external electrode 20, details are described only for the external electrode 20 disposed on the first end face E1. However, the external electrode 20 disposed on the second end face E2 is the same as the external electrode 20 disposed on the first end face E1.

[0222] The arrangement of the external electrode 20 in the WL plane is the same as the arrangement of the external electrode 20 in the aforementioned LT plane.

[0223] In the WL plane, the external electrode 20 has a WL-plane side horizontal portion SH3 and a WL-plane end-face horizontal portion EH3 as the horizontal portion H.

[0224] The WL-plane side horizontal portion SH3 exists in the side external electrode 27 disposed on the first side S1 and the side external electrode 27 disposed on the second side S2.

[0225] In addition, the WL-plane end-face horizontal portion EH3 exists in the end-face external electrode 25 disposed on the first end face E1.

[0226] The ranges of the WL-plane side horizontal portion SH3 and the WL-plane end-face horizontal portion EH3 are as described above.

[0227] That is, the WL-plane side horizontal portion SH3 is the portion of the external electrode 20 from the point existing closest to the side S to a given length inward. In addition, the WL-plane end-face horizontal portion EH3 is the portion of the external electrode 20 from the point existing closest to the end face E to a given length inward.

[0228] <Shoulder>

[0229] In addition, in the WL plane, the external electrode 20 has a WL-plane shoulder C3.

[0230] The WL-plane shoulder C3 is the portion connecting the WL-plane side horizontal portion SH3 and the WL-plane end-face horizontal portion EH3.

[0231] The WL-plane shoulder C3 is the same as the WT-plane shoulder C1 and the LT-plane shoulder C2 described previously, and is the external electrode 20 existing in the Figure 7 range defined by the line L5 and the line L6 as shown.

[0232] Here, the line L5 extends parallel to the width direction W from the end on the first end face E1 side of the side horizontal portion SH3 of the WL plane. The line L6 extends parallel to the length direction L from the end of the end face horizontal portion EH3 of the WL plane.

[0233] The WL plane shoulders C3 are respectively present at the four ridge lines of the laminate 2. Therefore, four WL plane shoulders C3 are included in the WL cross-section.

[0234] <Non-horizontal portion>

[0235] In addition, in the WL plane, the external electrode 20 has a WL plane non-horizontal portion N2.

[0236] The WL plane non-horizontal portion N2 is the external electrode 20 in the WL plane that exists in the range from the end on the second end face E2 side of the side horizontal portion SH3 of the WL plane to the end P4 on the second end face E2 side of the external electrode 20.

[0237] The WL plane non-horizontal portion N2 is provided on the first side S1 side and the second side S2 side in the WL plane.

[0238] <WL plane laminate shoulder>

[0239] Next, the WL plane laminate shoulder K3 will be described.

[0240] The WL plane laminate shoulder K3 is the corner portion of the laminate 2 that is in contact with the external electrode 20 connecting the side horizontal portion SH3 and the end face horizontal portion EH3 of the WL plane. In other words, the WL plane laminate shoulder K3 is the corner portion of the laminate 2 that is in contact with the WL plane shoulder C3.

[0241] Specifically, the WL plane laminate shoulder K3 is present in Figure 7 the laminate 2 in the corner region R3 shown. This corner region R3 is the region defined by the aforementioned line L5 and line L6.

[0242] The WL plane laminate shoulders K3 are respectively present at the four ridge lines of the laminate 2. Therefore, four WL plane laminate shoulders K3 are included in the WL cross-section.

[0243] The characteristics of the ceramic capacitor 1 of the present embodiment will be described.

[0244] <Characteristic 1>

[0245] The ceramic capacitor 1 of the present embodiment has the following (1-1) to (1-11) as Characteristic 1.

[0246] (1-1): When viewed on the WT plane, the external electrode 20 has a WT plane main surface horizontal portion MH1 , a WT plane side surface horizontal portion SH1 , and a WT plane shoulder portion C1 connecting the WT plane main surface horizontal portion MH1 and the WT plane side surface horizontal portion SH1 .

[0247] (1-2): 0.26≤length D2 of the WT-plane main surface horizontal portion MH1 in the width direction W / length D3 of the external electrode 20 in the width direction W≤0.56.

[0248] (1-3): 0.26≤length D4 of the WT-plane main surface horizontal portion SH1 in the stacking direction T / length D5 of the external electrode 20 in the stacking direction T≤0.56.

[0249] (1-4): The WT-plane main-surface horizontal portion MH1 is located closer to the main-surface M side than the WT-plane shoulder portion C1.

[0250] (1-5): The WT surface side surface horizontal portion SH1 is located closer to the side surface S than the WT surface shoulder portion C1.

[0251] (1-6): When observed in the LT cross section, the external electrode 20 has an LT surface main surface horizontal portion MH2, an LT surface end surface horizontal portion EH2, an LT surface shoulder portion C2 connecting the LT surface main surface horizontal portion MH2 and the LT surface end surface horizontal portion EH2, and an LT surface non-horizontal portion N1 connecting the LT surface main surface horizontal portion MH2 and the stack 2.

[0252] (1-7): 0.26≤length D6 of the LT-plane main surface horizontal portion MH2 in the longitudinal direction L / length D7 of the external electrode 20 in the longitudinal direction L≤0.56.

[0253] (1-8): The LT-plane main surface horizontal portion MH2 is located closer to the main surface M side than the LT-plane shoulder portion C2 and the LT-plane non-horizontal portion N1.

[0254] (1-9): When observed in the WL cross section, the external electrode 20 has a WL surface side horizontal portion SH3, a WL surface end surface horizontal portion EH3, a WL surface shoulder portion C3 connecting the WL surface side horizontal portion SH3 and the WL surface end surface horizontal portion EH3, and a WL surface non-horizontal portion N2 connecting the WL surface side horizontal portion SH3 and the stack 2.

[0255] (1-10): 0.26≤length D8 of WL cross-section main surface horizontal portion SH3 in the longitudinal direction L / length D7 of the external electrode 20 in the longitudinal direction L≤0.56.

[0256] (1-11): The WL-plane side surface horizontal portion SH3 is located closer to the side surface S than the WL-plane shoulder portion C3 and the WL-plane non-horizontal portion N2.

[0257] <Length Relationship>

[0258] The relationship of the lengths included in Feature 1 will be described based on the drawings.

[0259] First, based on Figure 4 (1-2) and (1-3) are explained.

[0260] exist Figure 4 In FIG. 1 , D2 denotes the length of the WT-plane main surface horizontal portion MH1 in the width direction W. Furthermore, D3 denotes the length of the external electrode 20 in the width direction W. The WT-plane main surface horizontal portion MH1 of the present embodiment satisfies 0.26≤D2 / D3≤0.56.

[0261] Similarly, in Figure 4 In FIG. 1 , the length of the WT-plane main surface horizontal portion SH1 in the stacking direction T is represented by D4. Furthermore, the length of the external electrode 20 in the stacking direction T is represented by D5. The WT-plane main surface horizontal portion SH1 of the present embodiment satisfies 0.26≤D4 / D5≤0.56.

[0262] based on Figure 6 Explain (1-7).

[0263] exist Figure 6 In FIG. 1 , D6 denotes the length of the LT-plane main surface horizontal portion MH2 in the longitudinal direction L. Furthermore, D7 denotes the length of the external electrode 20 in the longitudinal direction L. The LT-plane main surface horizontal portion MH2 of the present embodiment satisfies 0.26≤D6 / D7≤0.56.

[0264] based on Figure 7 Explain (1-10).

[0265] exist Figure 7 In FIG. 1 , the length of the WL cross-section principal surface horizontal portion SH3 in the longitudinal direction L is represented by D8. Furthermore, the length of the external electrode 20 in the longitudinal direction L is represented by D7. The WL cross-section principal surface horizontal portion SH3 of the present embodiment satisfies 0.26≤D8 / D7≤0.56.

[0266] <Position Relationship>

[0267] The relationship of positions included in Feature 1 will be described based on the drawings.

[0268] First, based on Figure 4 (1-4) and (1-5) are explained.

[0269] like Figure 4 As shown in FIG. 1 , the WT-plane main-surface horizontal portion MH1 is located closer to the main-surface M side than the WT-plane shoulder portion C1. Here, “located closer to the main-surface M side” means that it is located further outward in the stacking direction T.

[0270] In addition, if Figure 4 As shown in FIG. 1 , the WT-plane side surface horizontal portion SH1 is located closer to the side surface S than the WT-plane shoulder portion C1. Here, “located closer to the side surface S” means that it is located further outward in the width direction W.

[0271] Next, based on Figure 6 Explain (1-8).

[0272] like Figure 6 As shown, the LT-plane main surface horizontal portion MH2 is located closer to the main surface M than the LT-plane shoulder portion C2 and the LT-plane non-horizontal portion N1. Here, “located closer to the main surface M” means located further outward in the stacking direction.

[0273] Next, based on Figure 7 Explain (1-11).

[0274] like Figure 7 As shown, the WL-plane side surface horizontal portion SH3 is located closer to the side surface S than the WL-plane shoulder portion C3 and the WL-plane non-horizontal portion N2. Here, the term "located closer to the side surface S" means that it is located further outward in the width direction W.

[0275] <Effects based on feature 1>

[0276] The multilayer ceramic capacitor 1 of the present embodiment can achieve the following two effects by combining (1-1) to (1-11).

[0277] That is, the multilayer ceramic capacitor 1 of the present embodiment can increase stability when mounted on a substrate because it has the horizontal portion H of a predetermined length.

[0278] Furthermore, the multilayer ceramic capacitor 1 of the present embodiment can suppress the case from coming into contact with the multilayer ceramic capacitor 1 with respect to deformation of the case in all directions.

[0279] For example, consider a case where a substrate is provided in the case and the laminated ceramic capacitor 1 is mounted on the substrate. If the case has flexibility, the bent case may come into contact with the laminated ceramic capacitor 1 mounted on the substrate.

[0280] The multilayer ceramic capacitor 1 of the present embodiment has a WT plane shoulder C1 , an LT plane shoulder C2 , a WL plane shoulder C3 , an LT plane non-horizontal portion N1 , and a WL plane non-horizontal portion N2 .

[0281] Therefore, in the multilayer ceramic capacitor 1 of the present embodiment, it is possible to suppress the case from coming into contact with the multilayer ceramic capacitor 1 due to deformation of the case.

[0282] <Feature 2>

[0283] Next, feature 2 will be described.

[0284] The ceramic capacitor 1 of the present embodiment has the following (2-1) to (2-3) as Feature 2.

[0285] First, as a premise of (2-1) to (2-3), the WT face laminate shoulder K1, the WT face shoulder C1, the LT face laminate shoulder K2, the LT face shoulder C2, the WL face laminate shoulder K3, and the WL face shoulder C3 are each a curved line.

[0286] (2-1): The curvature radius of the WT-surface stack shoulder K1 is larger than the curvature radius of the WT-surface shoulder C1.

[0287] (2-2): The radius of curvature of the LT surface laminate shoulder K2 is larger than the radius of curvature of the LT surface shoulder C2.

[0288] (2-3): The curvature radius of the WL-surface laminate shoulder K3 is larger than the curvature radius of the WL-surface shoulder C3.

[0289] exist Figure 4 The WT surface stack shoulder K1 and the WT surface shoulder C1 are shown in FIG. Figure 6 The LT face stack shoulder K2 and the LT face shoulder C2 are shown in FIG. Figure 7 The WL-surface laminate shoulder K3 and the WL-surface shoulder C3 are shown in FIG.

[0290] As shown in the respective figures, the curvature radius of the corner portion K of the laminated body is larger than the curvature radius of the shoulder portion C corresponding thereto.

[0291] <Effects based on Feature 2>

[0292] The multilayer ceramic capacitor 1 of the present embodiment can achieve the following effects by combining (2-1) to (2-3).

[0293] In the ceramic capacitor 1 of this embodiment, the corners of the outer shape are reduced in sharpness. This is because the radius of curvature of the shoulder C of the external electrode 20 is increased. In addition, the overall volume of the ceramic capacitor 1 is reduced. This is because the corners of the outer shape are reduced in sharpness.

[0294] As described above, it is possible to further suppress the case from coming into contact with the multilayer ceramic capacitor 1 due to deformation of the case.

[0295] <Feature 3>

[0296] Next, feature 3 will be described.

[0297] The ceramic capacitor 1 of the present embodiment has the following (3-1) to (3-3) as Feature 3.

[0298] <Effects based on Feature 3>

[0299] (3-1): The radius of curvature of the shoulder portion C1 of the WT surface is greater than or equal to 10 μm and less than or equal to 20 μm.

[0300] (3-2): The radius of curvature of the LT surface shoulder portion C2 is greater than or equal to 10 μm and less than or equal to 20 μm.

[0301] (3-3): The curvature radius of the WL surface shoulder portion C3 is greater than or equal to 10 μm and less than or equal to 20 μm.

[0302] <Effects based on Feature 3>

[0303] The multilayer ceramic capacitor 1 of the present embodiment can achieve the following effects by combining (3-1) to (3-3).

[0304] In the ceramic capacitor 1 of the present embodiment, the curvature radius of the shoulder C is set to a value within a given range, so that the thickness of the external electrode 20 does not become extremely thin at the shoulder C, and the corners of the external electrode 20 can be suppressed. As a result, the conductivity of the external electrode 20 can be ensured, and the case can be further suppressed from contacting the multilayer ceramic capacitor 1 due to deformation of the case.

[0305] <Feature 4>

[0306] Next, feature 4 will be described.

[0307] The ceramic capacitor 1 of the present embodiment has the following (4-1) to (4-3) as Feature 4.

[0308] (4-1): The radius of curvature of the shoulder portion K1 of the WT-surface laminate is 8 μm or more and 16 μm or less.

[0309] (4-2): The radius of curvature of the shoulder portion K2 of the LT-surface laminate is 8 μm or more and 16 μm or less.

[0310] (4-3): The curvature radius of the shoulder portion K3 of the WL-surface laminate is 8 μm or more and 16 μm or less.

[0311] <Effects based on Feature 4>

[0312] The multilayer ceramic capacitor 1 of the present embodiment can achieve the following effects by combining (4-1) to (4-3).

[0313] In the ceramic capacitor 1 of this embodiment, by setting the curvature radius of the laminate shoulder K to a value within a given range, it is easy to set the curvature radius of the shoulder C located outside it to a desired range. This can further prevent the case from contacting the laminated ceramic capacitor 1 due to deformation of the case.

[0314] <Method for Manufacturing Multilayer Ceramic Capacitor>

[0315] The manufacturing method will be described.

[0316] As a general flow of the manufacturing process, the multilayer ceramic capacitor 1 of the present embodiment can be manufactured by the same method as the conventional multilayer ceramic capacitor 1 .

[0317] Furthermore, in order to form the desired horizontal portion H, shoulder portion C, and non-horizontal portion N, for example, a method of polishing the external electrode layer 20 after forming the external electrode layer 20 can be exemplified.

[0318] Furthermore, in order to form a desired laminate corner portion K, a method of grinding the laminate 2 after forming the laminate 2 can be exemplified.

[0319] As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, Various changes and deformation|transformation are possible.

[0320] <1>

[0321] A multilayer ceramic capacitor comprising:

[0322] A laminated body comprising a plurality of laminated dielectric layers and a plurality of internal electrode layers, having a first main surface and a second main surface opposite to each other in a lamination direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the lamination direction, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the lamination direction and the width direction; and

[0323] an external electrode, disposed on the first end surface and the second end surface, and connected to the internal electrode layer;

[0324] The external electrodes extend to at least a portion of the first main surface, the second main surface, the first side surface, and the second side surface, respectively.

[0325] A cross section parallel to the width direction and the stacking direction is defined as a WT cross section, a cross section parallel to the length direction and the stacking direction is defined as an LT cross section, and a cross section parallel to the width direction and the length direction is defined as a WL cross section.

[0326] When observed in the WT cross section, the external electrode has a WT surface main surface horizontal portion, a WT surface side surface horizontal portion, and a WT surface shoulder portion connecting the WT surface main surface horizontal portion and the WT surface side surface horizontal portion.

[0327] 0.26≤the length of the horizontal portion of the main surface of the WT plane in the width direction / the length of the external electrode in the width direction≤0.56,

[0328] 0.26≤the length of the horizontal portion of the WT surface side in the stacking direction / the length of the external electrode in the stacking direction≤0.56,

[0329] The WT surface main surface horizontal portion is located closer to the main surface side than the WT surface shoulder portion,

[0330] The horizontal portion of the WT surface side is located closer to the side surface than the WT surface shoulder portion,

[0331] When viewed in the LT cross section, the external electrode has an LT surface main surface horizontal portion, an LT surface end surface horizontal portion, an LT surface shoulder portion connecting the LT surface main surface horizontal portion and the LT surface end surface horizontal portion, and an LT surface non-horizontal portion connecting the LT surface main surface horizontal portion and the stacked body.

[0332] 0.26≤the length of the horizontal portion of the LT plane main surface in the longitudinal direction / the length of the external electrode in the longitudinal direction≤0.56,

[0333] The LT surface main surface horizontal portion is located closer to the main surface side than the LT surface shoulder portion and the LT surface non-horizontal portion.

[0334] When observed on the WL cross section, the external electrode has a WL surface side horizontal portion, a WL surface end surface horizontal portion, a WL surface shoulder portion connecting the WL surface side horizontal portion and the WL surface end surface horizontal portion, and a WL surface non-horizontal portion connecting the WL surface side horizontal portion and the stacked body,

[0335] 0.26≤the length of the horizontal portion of the WL surface side / the length of the external electrode in the longitudinal direction≤0.56,

[0336] The WL-surface side horizontal portion is located closer to the side surface than the WL-surface shoulder portion and the WL-surface non-horizontal portion.

[0337] <2>

[0338] exist <1> In the multilayer ceramic capacitor,

[0339] When observing the WT cross section, the portion where the main surface and the side surface of the stack intersect is defined as the WT surface stack shoulder.

[0340] When observed on the LT cross section, the portion where the main surface and the end surface of the stacked body intersect is defined as the LT surface stacked body shoulder.

[0341] When observing on the WL cross section, the portion where the side surface and the end surface of the stacked body intersect is defined as a WL-surface stacked body shoulder.

[0342] The radius of curvature of the shoulder of the WT face stack is greater than the radius of curvature of the shoulder of the WT face,

[0343] The radius of curvature of the shoulder of the LT face laminate is greater than the radius of curvature of the shoulder of the LT face,

[0344] The radius of curvature of the shoulder of the WL-face laminate is greater than the radius of curvature of the shoulder of the WL-face.

[0345] <3>

[0346] exist <2> In the multilayer ceramic capacitor,

[0347] The curvature radius of the shoulder of the WT surface laminate is greater than the curvature radius of the shoulder of the WT surface by 1.25% or more and 2% or less,

[0348] The curvature radius of the shoulder of the LT surface laminate is greater than the curvature radius of the shoulder of the LT surface by 1.25% or more and 2% or less,

[0349] The curvature radius of the shoulder of the WL-surface laminate is greater than the curvature radius of the WL-surface shoulder by 1.25% or more and 2% or less.

[0350] <4>

[0351] exist <1> to <3> In any one of the multilayer ceramic capacitors,

[0352] The radius of curvature of the shoulder of the WT surface is not less than 10 μm and not more than 20 μm,

[0353] The curvature radius of the LT surface shoulder is not less than 10 μm and not more than 20 μm,

[0354] The WL surface shoulder portion has a curvature radius of not less than 10 μm and not more than 20 μm.

[0355] <5>

[0356] exist <2> or <3> In the multilayer ceramic capacitor,

[0357] The radius of curvature of the shoulder of the WT surface laminate is 8 μm or more and 16 μm or less,

[0358] The curvature radius of the shoulder of the LT surface laminate is 8 μm or more and 16 μm or less,

[0359] The curvature radius of the shoulder portion of the WL-surface laminate is 8 μm or more and 16 μm or less.

[0360] <6>

[0361] exist <1> to <5> In any one of the multilayer ceramic capacitors,

[0362] The external electrode includes a base electrode layer, an inner plating layer covering the base electrode layer, and a surface plating layer covering the inner plating layer.

[0363] The inner plating layer comprises a Ni plating layer,

[0364] The surface plating layer includes a Sn plating layer.

[0365] Description of Reference Numerals

[0366] 1 Multilayer Ceramic Capacitors

[0367] 2 Laminated body

[0368] 4 Dielectric layer

[0369] 5 Outer dielectric layer

[0370] 6 Inner dielectric layer

[0371] 10 Internal electrode layer

[0372] 11 Counter electrode part

[0373] 12 Lead-out electrode

[0374] 20 External electrodes

[0375] 21. Base electrode layer

[0376] 22 Resin electrode layer

[0377] 23 Inner coating

[0378] 24 Surface coating

[0379] 25 End surface external electrode

[0380] 26 Main surface external electrode

[0381] 27 Side external electrode

[0382] IL Inner layer

[0383] OL Outer layer

[0384] LF Electrode Opposition

[0385] EG End gap

[0386] WF Electrode facing part

[0387] SG Side clearance

[0388] M Main surface

[0389] E end face

[0390] S side

[0391] T stacking direction

[0392] L Length direction

[0393] W Width direction

[0394] H Horizontal

[0395] MH Main surface horizontal part

[0396] SH Side Horizontal

[0397] EH End Horizontal

[0398] C Shoulder

[0399] N Non-horizontal part

[0400] K Laminated corner

[0401] MH1 WT main surface horizontal part

[0402] SH1 WT side horizontal part

[0403] C1 WT Face Shoulder

[0404] MH2 LT surface main surface horizontal part

[0405] EH2 LT side horizontal part

[0406] C2 LT Face Shoulder

[0407] N1 LT surface non-horizontal part

[0408] SH3 WL side horizontal part

[0409] EH3 WL surface end horizontal part

[0410] C3 WL Face Shoulder

[0411] N2 Non-horizontal part of WL surface

[0412] K1 WT face laminate shoulder

[0413] K2 LT face laminate shoulders

[0414] K3 WL face laminate shoulder.

Claims

1. A multilayer ceramic capacitor comprising: A laminated body comprising a plurality of laminated dielectric layers and a plurality of internal electrode layers, having a first main surface and a second main surface opposite to each other in a lamination direction, a first side surface and a second side surface opposite to each other in a width direction perpendicular to the lamination direction, and a first end surface and a second end surface opposite to each other in a length direction perpendicular to the lamination direction and the width direction; and an external electrode, disposed on the first end surface and the second end surface, and connected to the internal electrode layer; The external electrodes extend to at least a portion of the first main surface, the second main surface, the first side surface, and the second side surface, respectively. A cross section parallel to the width direction and the stacking direction is defined as a WT cross section, a cross section parallel to the length direction and the stacking direction is defined as an LT cross section, and a cross section parallel to the width direction and the length direction is defined as a WL cross section. When observed in the WT cross section, the external electrode has a WT surface main surface horizontal portion, a WT surface side surface horizontal portion, and a WT surface shoulder portion connecting the WT surface main surface horizontal portion and the WT surface side surface horizontal portion. 0.26≤the length of the horizontal portion of the main surface of the WT plane in the width direction / the length of the external electrode in the width direction≤0.56, 0.26≤the length of the horizontal portion of the WT surface side in the stacking direction / the length of the external electrode in the stacking direction≤0.56, The WT surface main surface horizontal portion is located closer to the main surface side than the WT surface shoulder portion, The horizontal portion of the WT surface side is located closer to the side surface than the WT surface shoulder portion, When viewed in the LT cross section, the external electrode has an LT surface main surface horizontal portion, an LT surface end surface horizontal portion, an LT surface shoulder portion connecting the LT surface main surface horizontal portion and the LT surface end surface horizontal portion, and an LT surface non-horizontal portion connecting the LT surface main surface horizontal portion and the stacked body. 0.26≤the length of the horizontal portion of the LT plane main surface in the longitudinal direction / the length of the external electrode in the longitudinal direction≤0.56, The LT surface main surface horizontal portion is located closer to the main surface side than the LT surface shoulder portion and the LT surface non-horizontal portion. When observed on the WL cross section, the external electrode has a WL surface side horizontal portion, a WL surface end surface horizontal portion, a WL surface shoulder portion connecting the WL surface side horizontal portion and the WL surface end surface horizontal portion, and a WL surface non-horizontal portion connecting the WL surface side horizontal portion and the stacked body, 0.26≤the length of the horizontal portion of the WL surface side / the length of the external electrode in the longitudinal direction≤0.56, The WL-surface side horizontal portion is located closer to the side surface than the WL-surface shoulder portion and the WL-surface non-horizontal portion.

2. The multilayer ceramic capacitor according to claim 1, wherein When observing the WT cross section, the portion where the main surface and the side surface of the stack intersect is defined as the WT surface stack shoulder. When observed on the LT cross section, the portion where the main surface and the end surface of the stacked body intersect is defined as the LT surface stacked body shoulder. When observing on the WL cross section, the portion where the side surface and the end surface of the stacked body intersect is defined as a WL-surface stacked body shoulder. The radius of curvature of the shoulder of the WT face stack is greater than the radius of curvature of the shoulder of the WT face, The radius of curvature of the shoulder of the LT face laminate is greater than the radius of curvature of the shoulder of the LT face, The radius of curvature of the shoulder of the WL-face laminate is greater than the radius of curvature of the shoulder of the WL-face.

3. The multilayer ceramic capacitor according to claim 2, wherein: The curvature radius of the shoulder of the WT surface laminate is greater than the curvature radius of the shoulder of the WT surface by 1.25% or more and 2% or less, The curvature radius of the shoulder of the LT surface laminate is greater than the curvature radius of the shoulder of the LT surface by 1.25% or more and 2% or less, The curvature radius of the shoulder of the WL-surface laminate is greater than the curvature radius of the WL-surface shoulder by 1.25% or more and 2% or less.

4. The multilayer ceramic capacitor according to any one of claims 1 to 3, wherein The radius of curvature of the shoulder of the WT surface is not less than 10 μm and not more than 20 μm, The curvature radius of the LT surface shoulder is not less than 10 μm and not more than 20 μm, The WL surface shoulder portion has a curvature radius of not less than 10 μm and not more than 20 μm.

5. The multilayer ceramic capacitor according to claim 2 or 3, wherein: The radius of curvature of the shoulder of the WT surface laminate is 8 μm or more and 16 μm or less, The curvature radius of the shoulder of the LT surface laminate is 8 μm or more and 16 μm or less, The curvature radius of the shoulder portion of the WL-surface laminate is 8 μm or more and 16 μm or less.

6. The multilayer ceramic capacitor according to any one of claims 1 to 5, wherein The external electrode includes a base electrode layer, an inner plating layer covering the base electrode layer, and a surface plating layer covering the inner plating layer. The inner plating layer comprises a Ni plating layer, The surface plating layer includes a Sn plating layer.

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