Method and apparatus for processing a substrate in a cleaning module

Abstract

Embodiments described herein generally relate to equipment used in the manufacture of electronic devices, and more particularly, to cleaning systems, cleaning system hardware, and related methods that can be used to transport and clean substrate surfaces. According to one embodiment, a blade handling assembly for handling a substrate in a cleaning system includes a gripping assembly including a pair of gripping blades operable with a gripping actuator to hold the substrate at an edge of the substrate. The assembly includes a first blade actuator for moving the gripping assembly and the substrate between a horizontal orientation and a vertical orientation with a first shaft. The assembly includes a second blade actuator for moving the vertically oriented gripping assembly and the substrate 180 degrees with a second axis, causing the substrate to face in opposite directions. The first blade actuator and the second blade actuator are caused to rotate with movement of the first shaft, and only the second blade actuator is caused to rotate with movement of the second shaft.

Description

Technical Field

[0001] Embodiments described herein relate generally to equipment for manufacturing electronic devices, and more particularly, to substrate processing systems that can be used to clean substrate surfaces. Background Art

[0002] The substrate processing unit may perform chemical mechanical polishing (CMP), which is commonly used in the manufacture of high-density integrated circuits to planarize or polish a layer of material deposited on a substrate. In a typical CMP process, a substrate is held in a carrier head that presses the back side of the substrate against a rotating polishing pad in the presence of a polishing fluid. Material is removed across the surface of the substrate material layer in contact with the polishing pad by a combination of chemical and mechanical activity provided by the polishing fluid and the relative motion of the substrate and the polishing pad. Typically, after one or more CMP processes are completed, the polished substrate is further processed using one or more post-CMP substrate processing operations in a CMP processing system. For example, the polished substrate may be further processed using one or more cleaning operations in a cleaning unit. Various cleaning operations may be performed in a cleaning unit having multiple cleaning stations (i.e., cleaning chambers). Once the post-CMP operation is completed, the substrate may be removed from the CMP processing system and then transported to the next device manufacturing system, such as a lithography, etching, or deposition system.

[0003] In a cleaning unit with multiple cleaning chambers, there is limited space available for transferring substrates between the various cleaning chambers. The space limitation problem is exacerbated when the substrate needs to be manipulated between a vertical position and a horizontal position for insertion and removal from different types of chambers. For example, some first cleaning chambers require the substrate to be inserted in a horizontal orientation, while some second cleaning chambers (such as cleaning chambers that are typically encountered after cleaning in the first cleaning chamber) require the substrate to be inserted in a vertical orientation. Thereafter, transferring the substrate from the vertically oriented cleaning chamber to another horizontally oriented cleaning chamber requires adjusting the orientation of the substrate back to a horizontal position. In addition, each chamber that requires the substrate to be arranged horizontally requires the substrate to be oriented "device side up", which means that the side with the semiconductor device formed on it must face up. The ultimate challenge of the cleaning enclosure is to minimize the air exposure time to prevent the substrate from being exposed to oxidation and particulate matter between cleaning stations. For this reason, the chambers are arranged as closely together as possible, leaving little room for a robot-like device to grab the substrate, change its orientation and insert it into another chamber.

[0004] Typically, a substrate enters the cleaning unit of a CMP tool from a polisher and is inserted into and subjected to a first cleaning chamber. Thereafter, the substrate is moved to one or more secondary cleaning chambers and then to a final cleaning chamber. Since the substrate becomes increasingly "cleaner" as it moves through the process, the final transfer from the secondary cleaning chamber to the final cleaning chamber is the most critical, as time and handling create the most opportunities for oxidation and contamination.

[0005] What is needed is an apparatus that can manipulate a substrate between two rotation angles at a predetermined step in the cleaning process, thereby reducing the footprint of the cleaning enclosure and, subsequently, the time required to move the substrate between chambers toward the end of the process. In one example, particles may be deposited on the substrate as it is transported from the second cleaning chamber to the drying chamber. As a result, the post-CMP cleaning process may not provide optimal particle-free performance.

[0006] Therefore, there is also a need to improve the final drying process in the final cleaning chamber.Therefore, what is needed in the art is a device and method for solving the above-mentioned problems. Summary of the invention

[0007] Embodiments described herein relate generally to equipment used in electronic device manufacturing, and more particularly, to cleaning systems and related methods that may be used to clean substrate surfaces during semiconductor device manufacturing.

[0008] In one embodiment, a substrate cleaning unit includes a pre-cleaning module configured to perform a pre-cleaning process on the substrate when the substrate is in a horizontal orientation. The unit includes: a first cleaning chamber configured to perform a first cleaning process on the substrate when the substrate is in a vertical orientation. The unit includes: a second cleaning chamber configured to perform a second cleaning process on the substrate when the substrate is in the vertical orientation. The unit includes: an integrated cleaning and drying module configured to perform a cleaning and drying process on the substrate in the horizontal orientation. The unit includes: a substrate handler configured to transfer the substrate from the pre-cleaning module to the first cleaning chamber, from the first cleaning chamber to the second cleaning chamber, and from the second cleaning chamber to the integrated cleaning and drying module. The first cleaning chamber and the second cleaning chamber are positioned below the pre-cleaning module.

[0009] In another embodiment, a substrate cleaning system includes a first substrate cleaning unit, a second substrate cleaning unit, and a first substrate handler, the first substrate handler being configured to transfer a substrate from a polishing system to one of the first substrate cleaning unit and the second substrate cleaning unit. Each of the units includes a pre-cleaning module, the pre-cleaning module being configured to receive the substrate from the first substrate handler and perform a pre-cleaning process on the substrate when the substrate is in a horizontal orientation. Each of the units includes a first cleaning chamber, the first cleaning chamber being configured to perform a first cleaning process on the substrate when the substrate is in a vertical orientation. Each of the units includes a second cleaning chamber, the second cleaning chamber being configured to perform a second cleaning process on the substrate when the substrate is in the vertical orientation. Each of the units includes an integrated cleaning and drying module, the integrated cleaning and drying module being configured to perform a cleaning and drying process on the substrate in the horizontal orientation. Each of the units includes a second substrate handler configured to transfer the substrate from the pre-cleaning module to the first cleaning chamber, from the first cleaning chamber to the second cleaning chamber, and from the second cleaning chamber to the integrated cleaning and drying module. The first cleaning chamber and the second cleaning chamber are positioned below the pre-cleaning module.

[0010] In another embodiment, a method of cleaning a substrate includes transferring a substrate to a pre-cleaning module in a substrate cleaning system with a first substrate handler. The method includes performing a pre-cleaning process on the substrate in the pre-cleaning module with the substrate in a horizontal orientation. The method includes transferring the substrate from the pre-cleaning module to a first cleaning chamber in the substrate cleaning system with a second substrate handler. The method includes performing a first cleaning process on the substrate in the first cleaning chamber with the substrate in a vertical orientation. The method includes transferring the substrate from the first cleaning chamber to a second cleaning chamber in the substrate cleaning system with the substrate in the vertical orientation with the second substrate handler. The method includes performing a second cleaning process on the substrate in the second cleaning chamber with the substrate in the vertical orientation. The method includes transferring the substrate from the second cleaning chamber to an integrated cleaning and drying module in the substrate cleaning system with the second substrate handler. The method includes performing a cleaning and drying process on the substrate with the integrated cleaning and drying module with the substrate in the horizontal orientation. The first cleaning chamber and the second cleaning chamber are positioned below the pre-cleaning module.

[0011] In another embodiment, a method for handling a substrate in a substrate processing system includes: translating a substrate secured by a first blade assembly from a processing region of a first clean chamber, wherein the first blade assembly is coupled to a first vertical motion actuator and a first horizontal motion actuator, and the substrate secured by the first blade assembly is oriented in a horizontal orientation with a device side facing upward. The method includes: rotating the substrate and the first blade assembly 90 degrees from a horizontal orientation to a vertical orientation using a first blade actuator of the first blade assembly. The method includes: rotating the substrate and the first blade assembly 180 degrees while the substrate is positioned or being positioned in the vertical orientation using a second blade actuator of the first blade assembly, thereby causing the device side of the substrate to face in an opposite direction. The method includes: translating the vertically oriented substrate and the first blade assembly along a horizontal axis to a position above a second clean chamber using the first horizontal motion actuator. The method includes: inserting the substrate into the processing region of the second clean chamber using the first vertical motion actuator. The method includes: using the first horizontal motion actuator, translating the blade assembly along the horizontal axis to a third clean chamber. The method includes: transferring the substrate from the second clean chamber to the third clean chamber using a second blade assembly, the second blade assembly coupled to a second vertical motion actuator and a second horizontal motion actuator. The method includes: retrieving the substrate from a processing area of ​​the third clean chamber using the first blade assembly and the first vertical motion actuator. The method includes: using the first blade actuator of the first blade assembly to rotate the substrate and the first blade assembly 90 degrees from the vertical orientation to a horizontal orientation, wherein the horizontally oriented substrate is oriented so that the device side faces upward. The method includes: inserting the substrate and the first blade assembly into a processing area of ​​a fourth clean chamber using the first horizontal motion actuator.

[0012] In another embodiment, a blade handling assembly for handling substrates includes a gripper assembly including a pair of gripper blades operable with a gripper actuator to hold a substrate at an edge of the substrate. The assembly includes a first blade actuator for moving the gripper assembly and the substrate between a horizontal orientation and a vertical orientation using a first axis. The assembly includes a second blade actuator for moving the gripper assembly and the substrate 180 degrees using a second axis, thereby causing the substrate to face in an opposite direction. Movement using the first axis causes the gripper actuator and the second blade actuator to rotate, and movement using the second axis causes only the gripper actuator to rotate.

[0013] In another embodiment, a blade handling assembly for handling a substrate includes a gripping assembly, the gripping assembly including a pair of gripping blades, the blades being operable with a gripping actuator to hold the substrate at an edge of the substrate. The assembly includes a first blade actuator for moving the gripping assembly and the substrate between a horizontal orientation and a vertical orientation. The assembly includes a second blade actuator for moving the gripping assembly and the substrate 180 degrees, causing the substrate to face in an opposite direction. The assembly includes a first cleaning chamber disposed on a first side of the assembly. The assembly includes a second cleaning chamber disposed on a second side of the assembly. When the assembly and the substrate are oriented in a horizontal position, the horizontal distance between the chambers is between 115% and 150% of the length of the assembly and the substrate.

[0014] Embodiments of the present disclosure may also include a substrate handling device, comprising: a first blade assembly; a first vertical actuator assembly, comprising a first vertical rail and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical rail and is configured to be positioned along the first vertical rail by the first vertical actuator; and a horizontal actuator assembly, comprising a horizontal rail and a first rail actuator, wherein the first vertical actuator assembly is coupled to a first portion of the horizontal rail and is configured to be positioned along the horizontal rail by the first rail actuator. The first blade assembly includes: a gripping assembly including a pair of gripping blades and a gripping actuator, wherein the gripping actuator is configured to cause the substrate to be fixed between the pair of gripping blades during a first transfer process; a first blade actuator for rotating the gripping assembly around a first axis; and a second blade actuator configured to rotate the gripping assembly around a second axis, wherein the second axis is substantially parallel to the front surface of the substrate, wherein the rotation of the first blade actuator around the first axis causes the second blade actuator and the gripping assembly to rotate, and the rotation of the second blade actuator around the second axis causes the gripping assembly to rotate.

[0015] Embodiments of the present disclosure may also include a substrate handling device, the substrate handling device comprising: a gripping assembly including a pair of gripping blades, the blades being operable with a gripping actuator to secure the substrate at an edge of the substrate; a first blade actuator for rotating the gripping assembly and the substrate about a first axis, wherein the first axis is substantially parallel to a front side of the substrate, the substrate being secured at its edge; a second blade actuator for rotating the gripping assembly and the first blade actuator about a second axis; a first cleaning module having a first side; and a second cleaning module having a first side. The gripping assembly is disposed between the first side of the first cleaning module and the first side of the second cleaning module, and when the first axis is oriented perpendicularly to the first side of the first cleaning module and the first side of the second cleaning module, the distance between the first side of the first cleaning module and the first side of the second cleaning module is between 102% and 150% of the total length of the gripping assembly and the secured substrate.

[0016] Embodiments of the present disclosure may also include a substrate handling device, comprising: a first blade assembly; a first vertical actuator assembly, comprising a first vertical rail and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical rail and is configured to be positioned along the first vertical rail by the first vertical actuator; a second blade assembly; a second vertical actuator assembly, comprising a second vertical rail and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical rail and is configured to be positioned along the second vertical rail by the second vertical actuator; and a horizontal actuator assembly. The first blade assembly includes: a gripping assembly including a pair of gripping blades and a gripping actuator, wherein the gripping actuator is configured to cause the substrate to be fixed between the pair of gripping blades during a first transfer process; a first blade actuator for rotating the gripping assembly around a first axis, wherein rotating the gripping assembly around the first axis is configured to cause the substrate to rotate between a horizontal orientation and a vertical orientation during the first transfer process; and a second blade actuator configured to rotate the gripping assembly around a second axis, wherein the second axis is substantially parallel to a front surface of the substrate, and rotating the gripping assembly around the second axis is configured to cause the front surface of the substrate to face in an opposite direction during the first transfer process, wherein the rotation of the first blade actuator around the first axis causes the second blade actuator and the gripping assembly to rotate, and the rotation of the second blade actuator around the second axis causes the gripping assembly to rotate. The second blade assembly includes: a gripping assembly including a pair of gripping blades and a gripping actuator, wherein the gripping actuator is configured to cause the substrate to be fixed between the pair of gripping blades during a second transfer process. The horizontal actuator assembly includes: a horizontal track; a first horizontal track actuator; and a second horizontal track actuator, wherein the first vertical actuator assembly is coupled to a first portion of the horizontal track and is configured to be positioned along the horizontal track by the first horizontal track actuator, and the second vertical actuator assembly is coupled to a second portion of the horizontal track and is configured to be positioned along the horizontal track by the second horizontal track actuator.

[0017] Embodiments of the present disclosure may also include a substrate cleaning system, the substrate cleaning system comprising: a first substrate cleaning unit; and a first substrate carrier disposed between the first substrate cleaning units and configured to transfer a substrate from a polishing system to the first substrate cleaning unit. The first substrate cleaning unit comprises: a first cleaning chamber configured to receive the substrate from the first substrate carrier and perform a first cleaning process on the substrate when the substrate is in a horizontal orientation; a second cleaning chamber configured to perform a second cleaning process on the substrate when the substrate is in a vertical orientation; a third cleaning chamber configured to perform a third cleaning process on the substrate when the substrate is in the vertical orientation; a fourth cleaning chamber configured to perform a fourth cleaning process on the substrate in the horizontal orientation; and a second substrate carrier configured to transfer the substrate from the first cleaning chamber to the second cleaning chamber, from the second cleaning chamber to the third cleaning chamber, and from the third cleaning chamber to the fourth cleaning chamber.

[0018] Embodiments of the present disclosure may also include a substrate cleaning system, the substrate cleaning system comprising: a first substrate cleaning unit; a second substrate cleaning unit; and a first substrate carrier, disposed between the first substrate cleaning unit and the second substrate cleaning unit, and configured to transfer a substrate from a polishing system to one of the first substrate cleaning unit and the second substrate cleaning unit. The first substrate cleaning unit and the second substrate cleaning unit each include: a first cleaning module, configured to receive the substrate from the first substrate carrier, and perform a first cleaning process on the substrate when the substrate is in a horizontal orientation; a second cleaning module, configured to perform a second cleaning process on the substrate when the substrate is in a vertical orientation; a third cleaning module, configured to perform a third cleaning process on the substrate when the substrate is in the vertical orientation; a fourth cleaning module, configured to perform a fourth cleaning process on the substrate in the horizontal orientation; and a second substrate carrier, configured to transfer the substrate from the first cleaning module to the second cleaning module, from the second cleaning module to the third cleaning module, and from the third cleaning module to the fourth cleaning module. The first substrate cleaning unit and the second substrate cleaning unit may each further include: a fifth cleaning module configured to perform a fifth cleaning process on the substrate when the substrate is in the vertical orientation, wherein the fifth cleaning process is performed sequentially between performing the third cleaning process in the third cleaning module and performing the fourth cleaning process in the fourth cleaning module.

[0019] Embodiments of the present disclosure may also include a method of cleaning a substrate by using the following actions. Using a first substrate handler, transferring a substrate to a first cleaning module in a substrate cleaning system. In the first cleaning module, a first cleaning process is performed on the substrate with the substrate in a first orientation. Using a second substrate handler, transferring the substrate from the first cleaning module to a second cleaning module in the substrate cleaning system, wherein transferring the substrate includes: causing the orientation of the substrate to change from the first orientation to a second orientation; and in the second cleaning module, performing a second cleaning process on the substrate with the substrate in the second orientation. Using the second substrate handler, transferring the substrate from the second cleaning module to a third cleaning module in the substrate cleaning system. In the third cleaning module, a third cleaning process is performed on the substrate with the substrate in the second orientation. Using the second substrate handler, transferring the substrate from the third cleaning module to a fourth cleaning module in the substrate cleaning system, wherein transferring includes: causing the orientation of the substrate to change from the second orientation to the first orientation. Then, using the fourth cleaning module, performing a fourth cleaning process on the substrate with the substrate in the first orientation, wherein the second cleaning module or the third cleaning module is positioned vertically below the first cleaning module.

[0020] Embodiments of the present disclosure may also include a method of cleaning a substrate by using the following actions. Using a first substrate handler, transferring a substrate to a first cleaning module in a substrate cleaning system. In the first cleaning module, performing a first cleaning process on the substrate with the substrate in a first orientation. Using a second substrate handler, transferring the substrate from the first cleaning module to a second cleaning module in the substrate cleaning system, wherein the transfer includes: rotating the substrate about a first axis, thereby causing the orientation of the substrate to change from the first orientation to a second orientation; and translating the substrate in a first direction. In the second cleaning module, performing a second cleaning process on the substrate with the substrate in the second orientation. Using the second substrate handler, transferring the substrate from the second cleaning module to a third cleaning module in the substrate cleaning system with the substrate in the second orientation, wherein the transfer includes: translating the substrate in a second direction, wherein the second direction is opposite to the first direction. In the third cleaning module, performing a third cleaning process on the substrate with the substrate in the second orientation. Using the second substrate handler, transferring the substrate from the third cleaning module to a fourth cleaning module in the substrate cleaning system, wherein the transfer includes: rotating the substrate about a first axis, thereby causing the orientation of the substrate to change from the second orientation to a third orientation. Then, a fourth cleaning process is performed on the substrate with the substrate in the first orientation using the fourth cleaning module.

[0021] Embodiments of the present disclosure may also include a method of cleaning a substrate by using the following actions. Using a first substrate handler, transferring a substrate to a first cleaning module in a substrate cleaning system. In the first cleaning module, performing a first cleaning process on the substrate when the substrate is in a horizontal orientation. Using a second substrate handler, transferring the substrate from the first cleaning module to a second cleaning module in the substrate cleaning system. In the second cleaning module, performing a second cleaning process on the substrate when the substrate is in a vertical orientation. Using the second substrate handler, transferring the substrate from the second cleaning module to a third cleaning module in the substrate cleaning system when the substrate is in the vertical orientation. In the third cleaning module, performing a third cleaning process on the substrate when the substrate is in the vertical orientation. Using the second substrate handler, transferring the substrate from the third cleaning module to a fourth cleaning module in the substrate cleaning system, and performing a fourth cleaning process on the substrate with the fourth cleaning module when the substrate is in the horizontal orientation, wherein the second cleaning module or the third cleaning module is positioned below the first cleaning module in a vertical direction.

[0022] Embodiments of the present disclosure may also include a method of cleaning a substrate by using the following actions. Using a first substrate handler, transferring a substrate to a first cleaning module in a substrate cleaning system. In the first cleaning module, performing a first cleaning process on the substrate with the substrate in a first orientation. Using a second substrate handler, transferring the substrate from the first cleaning module to a second cleaning module in the substrate cleaning system, wherein the transfer includes: rotating the substrate about a first axis, thereby causing the orientation of the substrate to change from the first orientation to a second orientation, and translating the substrate in a first direction. In the second cleaning module, performing a second cleaning process on the substrate with the substrate in the second orientation. Using the second substrate handler, transferring the substrate from the second cleaning module to a third cleaning module in the substrate cleaning system with the substrate in the second orientation, wherein the transfer includes: translating the substrate in a second direction, wherein the second direction is opposite to the first direction. In the third cleaning module, performing a third cleaning process on the substrate with the substrate in the second orientation. Using the second substrate handler, transferring the substrate from the third cleaning module to a fourth cleaning module in the substrate cleaning system, wherein the transferring includes: rotating the substrate about a first axis, thereby causing an orientation of the substrate to change from the second orientation to a third orientation, and performing a fourth cleaning process on the substrate with the substrate in the first orientation using the fourth cleaning module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to be able to understand the above-mentioned features of the present disclosure in detail, a more detailed description of the present disclosure briefly summarized above can be obtained by reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings only show typical embodiments of the present disclosure and should not be considered as limiting the scope of the present disclosure, as the present disclosure may accept other equally effective embodiments.

[0024] Figure 1A is a schematic top view of an exemplary chemical mechanical polishing (CMP) processing system according to one or more embodiments.

[0025] Figure 1B is a schematic side view of a CMP processing system according to one or more embodiments.

[0026] Figure 2A is a perspective view of an example of a first cleaning module utilized in a CMP processing system according to one or more embodiments.

[0027] Figure 2B According to one or more embodiments Figure 2A Cross-sectional view of a first cleaning module.

[0028] Figure 2C is a perspective view of an example of a second cleaning module utilized in a CMP processing system according to one or more embodiments.

[0029] Figure 2D According to one or more embodiments Figure 2C A cross-sectional view of a second cleaning module.

[0030] Figure 2E is a cross-sectional view of a third cleaning module utilized in a CMP processing system according to one or more embodiments.

[0031] Figure 2F is a cross-sectional view of a fourth cleaning module utilized in a CMP processing system according to one or more embodiments.

[0032] Figure 2G is a cross-sectional view of a fifth cleaning module utilized in a CMP processing system according to one or more embodiments.

[0033] Figure 2H is a cross-sectional view of a sixth cleaning module utilized in a CMP processing system according to one or more embodiments.

[0034] Figure 3 is a perspective view of a portion of an exemplary cleaning system in a CMP processing system, specifically a housing having multiple substrate cleaning chambers, according to one or more embodiments.

[0035] Figure 4 is another perspective view of a portion of a cleaning system according to one or more embodiments, and Figure 3 Similar, but omits the outer shell.

[0036] Figure 5 According to one or more embodiments, Figure 1A Schematic elevation view of an exemplary cleaning system viewed inside a factory interface.

[0037] Figure 6 is a perspective view of a portion of an enclosure including a plurality of substrate cleaning chambers.

[0038] Figure 7 is a perspective view of a horizontal actuator and a vertical actuator used to move a substrate between chambers.

[0039] Figure 8 is a top view of a first blade assembly according to one or more embodiments.

[0040] Fig.9A is a top view of a gripper assembly according to one or more embodiments.

[0041] Fig. 9B is another embodiment of a gripping assembly according to one or more embodiments.

[0042] Fig.10 is a side view of a second blade assembly according to one or more embodiments.

[0043] Fig.11 is another embodiment of a gripping assembly according to one or more embodiments.

[0044] Figure 12A-12J The progression of a substrate as it is moved by a first blade assembly and a second blade assembly through a cleaning process including multiple chambers is shown in accordance with one or more embodiments.

[0045] Fig.13A is a perspective view of a portion of an enclosure including a plurality of substrate cleaning chambers according to one or more embodiments.

[0046] Fig. 13B is a perspective view of a portion of an enclosure including a plurality of substrate cleaning chambers according to one or more embodiments.

[0047] Fig. 13C is a schematic top view of an alternative chemical mechanical polishing (CMP) processing system configuration according to one or more embodiments.

[0048] Figures 14A-14D FIG. 1 illustrates an example of a method for performing Figure 1A Different substrate processing sequences performed in a CMP processing system are shown.

[0049] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0050] Embodiments described herein relate generally to equipment used in electronic device manufacturing, and more particularly, to a cleaning system that can be used to clean a substrate surface after chemical mechanical polishing of the substrate during semiconductor device manufacturing.

[0051] Figure 1A is a schematic top view of an exemplary chemical mechanical polishing (CMP) processing system 100 described herein, according to one or more embodiments. Figure 1B is a schematic side view of a CMP processing system 100 according to one or more embodiments. Although the disclosure provided herein primarily discusses various embodiments that may be used in conjunction with a CMP apparatus, such as polishing station 105, such configuration is not intended to limit the scope of the disclosure provided herein.

[0052] Certain portions of the housing and certain other internal and external components are omitted from the drawings to more clearly illustrate various aspects of the CMP processing system 100. Here, the CMP processing system 100 is connected to a factory interface 102. The factory interface 102 may include one or more loading stations 102A. For example, the loading station 102A may be a FOUP or a cassette. Each loading station 102A may include one or more substrates 200 for CMP processing in the CMP processing system 100.

[0053] The CMP processing system 100 may include a polishing station 105, a first substrate handler 103 of a factory interface 102, and a cleaning system 106 including a second substrate handler 104. The first substrate handler 103 is positioned to transfer substrates 200 to and from one or more loading stations 102A. For example, the first substrate handler 103 transfers the substrate 200 from the loading station 102A to the cleaning system 106, for example, to the cleaner lane 102B, where the second substrate handler 104 may pick up the substrate 200. As another example, the first substrate handler 103 transfers the substrate 200 from the cleaning system 106 (e.g., from the cleaning module 110 or the cleaner lane 102B) to the loading station 102A.

[0054] Typically, the substrate 200 initially positioned in the loading station 102A has undergone one or more previous manufacturing processes, such as, for example, wafering, photolithography, etching, and / or deposition processes, on its processing surface 201. The first substrate handler 103 transfers the substrate to and from the loading station 102A with the processing surface 201 facing upward.

[0055] For example, the second substrate handler 104 may be a wet cleaner robot. The second substrate handler 104 is positioned to transfer the substrate 200 to and from the polishing station 105 with the processing surface 201 facing up or down. For example, the second substrate handler 104 receives the substrate 200 from the cleaner channel 102B or the first substrate handler 103, and then transfers the substrate 200 to the transfer station 105A within the polishing system 105. As another example, the second substrate handler 104 retrieves the substrate 200 from the transfer station 105A within the polishing station 105, and then transfers the substrate 200 to the first cleaning chamber, which includes the first cleaning module 107 in the cleaning system 106. In some embodiments, the horizontal input station 117 ( Figure 2G ) or vertical input station 119 ( Figure 2H) replaces the first cleaning module 107. In some embodiments, the second substrate handler 104 may include a substrate flipping function (e.g., a rotating blade wrist assembly) that allows the orientation of the substrate to be flipped from the polishing surface of the substrate facing up to the polishing surface of the substrate facing down, or vice versa. This ability to flip the substrate during a cleaning process sequence can be used to allow the cleaning processes performed in the cleaning system 106 to be performed on the front side of the substrate, the back side of the substrate, or on both sides of the substrate sequentially.

[0056] The polishing station 105 is a substrate polishing system that may include a plurality of polishing stations (not shown). The polishing station 105 includes one or more polishing assemblies that are used to polish the substrate 200 received from the second substrate carrier using one or more CMP processes. Typically, each of the one or more polishing assemblies will include the use of a polishing platform (not shown) and a polishing head (not shown), which is configured to push the substrate 200 against a polishing pad (not shown) disposed on the polishing platform. After undergoing the CMP process in the polishing station 105, residual abrasive particles and / or liquids (such as acidic or alkaline chemicals) may remain on the substrate 200. Therefore, the cleaning system 106 is positioned between the polishing station 105 and the factory interface 102 to clean the substrate 200 before returning the substrate 200 to the loading station 102A.

[0057] like Figure 1A As shown, the cleaning system 106 may include two cleaning units 106A, 106B, which are arranged parallel to each other on opposite sides of the second substrate carrier 104. The cleaning units 106A, 106B include a plurality of cleaning chambers. As described below, the cleaning chambers positioned within the cleaning system 106 may include one or more first cleaning modules, one or more second cleaning modules, one or more third cleaning modules, one or more fourth cleaning modules, one or more fifth cleaning modules, one or more sixth cleaning modules, and / or one or more seventh cleaning modules. Figure 3 is a top isometric view of the cleaning unit 106A, with the robot tunnel 104T omitted for clarity ( Figure 1A ) and a partition between the cleaning unit 106B (and other internal and external components). Figure 4 1 is another top isometric view of cleaning unit 106A, with the housing (and other internal and external components) omitted for clarity. Figure 3 , Figure 4 and Figure 12A-12J The cleaning system 106 configuration shown includes three different types of cleaning modules positioned at various cleaning chamber locations. As will be discussed further below, Fig.13AThe figure shows a configuration that can include six different types of cleaning modules that can be used in the cleaning process sequences described herein. Fig. 13B The figure shows a configuration that can include seven different types of cleaning modules that can be used in the cleaning process sequence described herein. Figure 1A It is understood and described above that cleaning unit 106B is substantially a replica of cleaning unit 106A. Therefore, the depiction of cleaning unit 106A in the description and drawings herein should also be inferred to be the description and depiction of cleaning unit 106B. However, while the disclosure provided herein primarily illustrates and discloses a configuration in which cleaning unit 106A and cleaning unit 106B are replicas, such a configuration is not intended to limit the scope of the disclosure provided herein, as the cleaning units may include different types and / or different numbers of cleaning modules without departing from the scope of the disclosure provided herein.

[0058] The cleaning units 106A, 106B may be separated by a robot tunnel 104T in which the second substrate handler 104 is positioned. In some embodiments, each cleaning unit 106A, 106B includes a first cleaning module 107, a third substrate handler 108, a second cleaning module 109, a third cleaning module 110, and an optional fourth cleaning module 115. In some embodiments, the first cleaning module is generally referred to herein as a horizontal pre-cleaning module 107, but is not intended to limit the scope of the disclosure provided herein. However, as described above, the first cleaning module 107 may be provided by a vertical input station 119 ( Figure 2H ) or horizontal input station 117 ( Figure 2G ), these input stations are each typically configured to support the substrate in a desired physical orientation while ensuring that the substrate surface remains wetted prior to performing a subsequent cleaning process on the substrate. In some embodiments, the second cleaning module 109 is generally referred to herein as a vertical cleaning module 109, but is not intended to limit the scope of the disclosure provided herein. In some embodiments, the third cleaning module 110 is generally referred to herein as an integrated clean and dry (ICD) module 110, but is not intended to limit the scope of the disclosure provided herein. In some embodiments, the vertical cleaning module 109 may be provided as a first vertical cleaning module 109A and a second vertical cleaning module 109B. In some embodiments, the integrated clean and dry module 110 may be provided as a first integrated clean and dry module 110A and a second integrated clean and dry module 110B. In some embodiments, as Figure 1AAs shown, the third substrate handler 108 in each of the cleaning units 106A, 106B is positioned at the outer edge of the cleaning units 106A, 106B of the CMP processing system 100. In this configuration, the substrate handler 108 is positioned outside the cleaning chamber (such as the first cleaning module, the second cleaning module, and the third cleaning module as shown), the outside being opposite to the inside of the first cleaning module, the second cleaning module, and the third cleaning module, the inside facing the robot tunnel 104T and the second substrate handler 104 of the CMP processing system 100.

[0059] The horizontal pre-cleaning module 107 is configured to process a substrate 200 disposed in a substantially horizontal orientation (i.e., in the XY plane) with the processing surface 201 facing upward. In some embodiments, each cleaning unit 106A, 106B includes two vertical cleaning modules 109A, 109B, which are configured to process a substrate 200 disposed in a substantially vertical orientation (i.e., in the ZY plane) with the processing surface 201 facing the factory interface 102.

[0060] As described above, in some embodiments of the cleaning system 106, the horizontal pre-cleaning module 107 receives the polished substrate 200 from the second substrate handler 104 through the first door 107A formed in the first side panel of the horizontal pre-cleaning module 107. For example, the first door 107A can be a slit valve configured to isolate the inner area of ​​the horizontal pre-cleaning module 107 from the outer area of ​​the horizontal pre-cleaning module 107. The horizontal pre-cleaning module 107 receives the substrate 200 in a horizontal orientation so as to position the substrate on the substrate support surface disposed horizontally in the pre-cleaning module. Then, the horizontal pre-cleaning module 107 performs a pre-cleaning process, such as a buffing process, on the substrate 200, and then transfers the substrate 200 out of the pre-cleaning module using the third substrate handler 108, which is sometimes also referred to herein as the third substrate handling device 108. In some embodiments, the buffing process will include sweeping the entire surface of the substrate positioned on the horizontally disposed substrate support surface with a buffing pad to remove residual slurry, scratches and other defects present on the substrate surface. The buffing pad may include materials such as polyurethane, acrylate, or other polymeric materials.

[0061] Figure 2A 1 is a top isometric view of a horizontal pre-cleaning module 107 that may be positioned within a cleaning chamber in a CMP processing system 100 as described herein. Figure 2AIn order to more clearly show the internal components of the horizontal pre-cleaning module 107, the maintenance access panel is omitted. Generally, the horizontal pre-cleaning module 107 includes a chamber 210, a basin 214 and a cover 216 formed by a plurality of side panels, which together define a processing area 212.

[0062] The first side panel 226 is formed on the first side 208 of the horizontal pre-cleaning module 107 facing the second substrate handler 104 and includes a first door 107A (eg, Figure 2A , 2B The first door is configured to selectively cover an opening for positioning the substrate 200 on the rotatable vacuum table 230 by using the second substrate carrier 104. The second side panel 222 is formed at the second end 204 of the horizontal pre-cleaning module 107, and the second end faces away from the polishing station 105. The second side panel 222 includes a second door 107B (e.g., Figure 2A , 2B The second door is configured to selectively cover the opening 209 for removing the substrate 200 from the rotatable vacuum table 230 by using the third substrate handler 108. The horizontal pre-cleaning module 107 can be configured and installed in both cleaning units 106A, 106B, and thus positioned on both sides of the CMP processing system 100 in opposite orientations, such as Figure 1A shown.

[0063] The horizontal pre-cleaning module 107 is disposed in the processing area 212 of the horizontal pre-cleaning module 107, and further includes: a rotatable vacuum table 230 for vacuum chucking the substrate 200; an annular substrate lifting mechanism 270, which is disposed radially outside the rotatable vacuum table 230; a pad conditioning station 280, which is disposed near the rotatable vacuum table 230; and a pad carrier positioning arm 282, which can move between a first position above the rotatable vacuum table 230 and a second position above the pad conditioning station 280. The rotatable vacuum table 230, the annular substrate lifting mechanism 270, the pad conditioning station 280, and the pad carrier positioning arm 282 are each independently mounted to the basin 214.

[0064] Figure 2B It can be used for Figure 2A A side cross-sectional view of the pad carrier positioning arm 282 of the horizontal pre-cleaning module 107. Figure 2BAs shown, the pad carrier positioning arm 282 is disposed adjacent to the rotatable vacuum table 230. The distal end 302 of the pad carrier positioning arm 282 includes a vertically movable pad carrier assembly 304 for supporting a polishing pad 306 at its lower end. The pad carrier assembly 304 is vertically movable relative to the rotatable vacuum table 230 by using an actuator assembly 317. The distal end 302 of the pad carrier positioning arm 282 can also be positioned at the pad conditioning station 280 ( Figure 2A ) above, the rotary actuator is configured to rotate the pad carrier positioning arm 282 around axis c1.

[0065] The pad carrier assembly 304 includes a head motor 308 for rotating the polishing pad 306 about an axis c2, which is substantially aligned in the direction of gravity. The pad carrier assembly 304 includes a coupling base 307, which is coupled to the head motor 308 via an axle 311. In some embodiments, the coupling base 307 is sized to support one or more polishing pads 306. In one example, as Figure 2A-2B As shown, a single buffing pad 306 is utilized having a diameter of approximately 40 mm to 150 mm, which is larger than conventional buffing pads used in similar cleaning modules.

[0066] In some embodiments, the polishing pad 306 is formed of a polyvinyl alcohol (PVA) material. The PVA material is hydrophilic and can absorb and retain water. When wet, the PVA material is elastic, flexible and soft, and has mechanical strength and wear resistance. Compared to traditional materials used as polishing pads (such as porous polymeric materials or filled or unfilled polymer materials), the PVA material provides high shear forces for chemical and mechanical cleaning of previously CMP polished surfaces of substrates. The diameter of the polishing pad 306 formed of the PVA material is smaller than the diameter of the substrate to be processed in the horizontal pre-cleaning module 107. During the chemical mechanical cleaning process, the larger polishing pad improves performance and shortens the polishing time. The coupling base 307 is configured to support a large and thick water-absorbent polishing pad 306, while including a fixing feature that is configured to prevent the polishing pad 306 from sagging by using a mechanical clamping mechanism.

[0067] During processing in the horizontal pre-cleaning module 107, the substrate 200 is positioned on the rotatable vacuum table 230 by transferring the substrate 200 through the opening formed in the first side panel 226 using the second substrate handler 104 and positioning the substrate 200 on a plurality of lift pins within the lift pin assembly 303. The lift pin assembly 303 includes the plurality of lift pins that can be raised and lowered using lift pin actuators (not shown) to allow the substrate 200 to be positioned on or removed from the surface of the rotatable vacuum table 230. A vacuum is then created between the substrate 200 and the opening formed in the surface of the rotatable vacuum table 230 using a pump 319. The rotary polishing pad 306 is then brought into contact with the surface of the substrate using the head motor 308 and the actuator assembly 317. In some embodiments, the rotatable vacuum table 230 and the substrate 200 may also be rotated during processing using the rotary actuator 327. The rotary polishing pad 306 may then be translated in an oscillating arc motion across the surface of the substrate 200 using the rotary actuator 313. In some embodiments, the rotary actuator 313 can rotate the polishing pad 306 in an oscillating rotational motion that covers an angle less than a full 360 degree rotation. While the rotating polishing pad 306 is translated across the surface of the substrate 200, a first treatment fluid (such as deionized (DI) water) and / or one or more first cleaning fluids (e.g., TMAH, ). The cleaning process is effective in removing residual scratches and abrasive particles from the surface of the substrate. After processing for a desired period of time, the processing is stopped and the substrate is removed from the horizontal pre-cleaning module 107 by performing the above steps in reverse order. However, as will be explained below, by using a portion of the third substrate carrier 108, the substrate will be advantageously removed from the horizontal pre-cleaning module 107 through the opening 209.

[0068] In some alternative embodiments of the cleaning system 106, the horizontal input module 117 ( Figure 2G) is positioned at the location of the horizontal pre-cleaning module 107 so that the horizontal input module 117 can receive the polished substrate 200 from the second substrate carrier 104. The housing of the horizontal input module 117 is configured similarly to the horizontal pre-cleaning module 107 and thus includes a first door 107A formed in a first side panel of the housing and a second door 107B formed in a second side panel. The horizontal input module 117 generally includes a substrate support assembly 288 (the substrate support assembly may include a plurality of support rods 289) and one or more rinse nozzles 286A, 286B, which are positioned to deliver a flow of rinse fluid (e.g., deionized water) received from a fluid source 287 to an exposed surface (e.g., an upper surface and a lower surface) of the substrate during processing. The horizontal input module 117 is configured to keep the substrate wet and remove any residual slurry or other residual material left on the surface of the substrate after polishing in the polishing station 105.

[0069] In another alternative embodiment of the cleaning system 106, the vertical input module 119 ( Figure 2H ) is positioned at the location of the horizontal pre-cleaning module 107 so that the vertical input module 119 can receive the polished substrate 200 from the second substrate handler 104. The housing of the vertical input module 119 includes a first door 107A formed in a first side panel of the housing and a second door 107B formed in a second side panel. The vertical input module 119 generally includes a substrate support assembly 297 (the substrate support assembly may include a plurality of support features 294) and one or more rinse nozzles 286A, 286B, which are positioned to deliver a flow of rinse fluid (e.g., deionized water) received from a fluid source 287 to an exposed surface (e.g., a front side surface and a back side surface) of the substrate during processing. The vertical input module 119 is configured to keep the substrate wet and remove any residual slurry or other residual material left on the substrate surface after polishing in the polishing station 105. The vertical input module 119 will also include an actuator configured to rotate the substrate 200 positioned on the substrate support assembly 297 about a vertical axis (i.e., the Z axis) to rotationally orient the substrate 200 so that the central robot 104 and the blade assembly 300 ( Figure 7 ) can access the substrate 200 from the corresponding side of the vertical input module 119 at different times. Figure 2HAs shown, in some embodiments, during the transfer process, the robot blade 298 is inserted through a door (e.g., the second door 107B) and positioned behind the substrate, which has been positioned on a portion of the substrate support assembly 297. The robot blade 298 includes a clamping assembly 298A and a fixing element 298B, which are configured to grab a vertically oriented substrate during the substrate transfer process. The process of grabbing the substrate may include using an actuator (not shown) within the clamping assembly 298A, the actuator being configured to apply a force to the edge of the substrate so that the edge of the substrate can be supported and fixed between the clamping assembly 298A component and the fixing element 298B.

[0070] As will be combined below Figure 6-12K As further discussed, the third substrate handler 108 includes two separate blade assemblies 300 and 400 for separately handling substrates 200 during different cleaning stages in the cleaning system 106. Therefore, it will be appreciated that descriptions of the third substrate handler 108 handling substrates 200 may refer to movement of one or more of the blade assemblies 300, 400 of the substrate handler 108 handling substrates 200, as further discussed below.

[0071] refer to Figure 1A and Figure 1B , the third substrate handler 108 transfers the substrate 200 out of the horizontal pre-cleaning module 107 via the second door 107B, which covers the opening 209 formed in the second side panel 222 of the horizontal pre-cleaning module 107. For example, the second side panel 222 can be orthogonal to the first side panel 226. The substrate 200 is still in a horizontal orientation, i.e., oriented in the XY plane, when the substrate is removed from the horizontal pre-cleaning module 107. After the substrate 200 is transferred out of the horizontal pre-cleaning module 107, the third substrate handler 108 manipulates the substrate 200 to a vertical orientation, i.e., oriented in the YZ plane, with the processing surface 201 facing the factory interface 102, for further processing in the vertical cleaning modules 109A, 109B of the cleaning system 106. For example, after the substrate 200 is transferred out of the horizontal pre-cleaning module 107, the third substrate handler 108 may rotate the substrate 200 90 degrees around the Y axis to change the orientation to a vertical position, and may also rotate the substrate 200 180 degrees around the Z axis so that the processing surface 201 faces the factory interface 102. The Y-axis rotation and the Z-axis rotation may be performed continuously or with overlapping time intervals.

[0072] After manipulating the substrate so that the processing surface 201 faces the factory interface 102, the third substrate handler 108 transfers the substrate 200 to the vertical cleaning module 109A ( Figure 1B). The transfer process may include the third substrate carrier 108 moving in at least one direction (such as the X direction). For example, the door 109C may be a slit valve. Each cleaning unit 106A, 106B may include two vertical cleaning modules 109A, 109B. The two vertical cleaning modules 109A, 109B may be arranged linearly in each corresponding cleaning unit 106A, 106B, i.e., arranged in the X direction. The two vertical cleaning modules 109A, 109B may also be substantially arranged below the horizontal pre-cleaning module 107 in each corresponding cleaning unit 106A, 106B, i.e., in the Z direction. Arranging the vertical cleaning modules 109A, 109B below the horizontal pre-cleaning module 107 in this way can reduce the footprint of the overall cleaning system 106, and also help to reduce the transfer time between these modules to improve throughput. Importantly, the drying capacity of the wet substrate can be reduced and the air exposure time of the substrate between cleaning steps can be reduced.

[0073] In some embodiments, the vertical cleaning modules 109A, 109B may be any one or a combination of contact and non-contact cleaning systems for removing polishing byproducts from a substrate surface, such as spray boxes and / or scrubber boxes.

[0074] Figure 2C 1 is an isometric view of an example vertical cleaning module 109, which shows vertical cleaning modules 109A and 109B and can be used in the above-mentioned cleaning units. Figure 2C and 2D The cover portion of the vertical cleaning module 109 including the door 109C is removed. Figure 2C The vertical cleaning module 109 shown may be a scrubber box type vertical cleaner. The example vertical cleaning module 109 includes a tank 505 supported by a first support 525 and a second support 530. The vertical cleaning module 109 includes an actuator 535, each coupled to a cylindrical roller 515, 520 (e.g., a cylindrical roller 515, 520) located inside the tank 505. Figure 2D ). The actuators 535 may each include a drive motor, such as a direct drive servo motor, adapted to rotate the respective cylindrical rollers 515 and 520 about axes A′ and A″. Each of the actuators 535 is coupled to a controller adapted to control the rotational speed of the cylindrical rollers 515 and 520.

[0075] The connecting rod 510 and the actuator 545 are configured to allow the cylindrical rollers 515 and 520 located inside the reservoir 505 to move relative to the major surface of the substrate 200 (eg, Figure 2D). The actuator 545 is coupled to the controller to control the movement of the link 510 relative to the base plate disposed between the cylindrical rollers 515, 520. In operation, the first support 525 and the second support 530 can move simultaneously relative to the base 540. Figure 2C As shown, such movement may bring the first cylindrical roller 515 and the second cylindrical roller 520 into close proximity with the substrate 200 , or space the first cylindrical roller 515 and the second cylindrical roller 520 apart to allow insertion and / or removal of the substrate 200 from the vertical cleaning module 109 .

[0076] Figure 2D yes Figure 2C 1 is a top view of the vertical cleaning module 109, showing the cylindrical rollers 515, 520 in a processing position, in which the cylindrical rollers 515, 520 are close to or pressed against the major surface of the substrate 200. The vertical cleaning module 109 also includes one or more drive motors 544 and a rotating device 547. Each of the drive motors 544 and the rotating device 547 includes a roller 549, which is disposed at the end of the output shaft of each drive motor 544 and the rotating device 547 and is configured to support and / or engage the substrate 200 and promote the rotation of the substrate 200 around an axis parallel to the horizontal plane (i.e., the XY plane).

[0077] Each of the cylindrical rollers 515 and 520 includes a tubular cover 528 disposed thereon. The tubular cover 528 may be a removable sleeve made of a pad material for polishing the substrate 200 or may be a brush body adapted to clean the substrate 200. During processing in the vertical cleaning module 109, the tubular covers 528 of the cylindrical rollers 515 and 520 are in contact with the substrate while the tubular covers are rotated by the actuator 535 and while the substrate 200 is rotated by using a support roller 549 coupled to the output shaft of the drive motor 544 and the rotating device 547. As the substrate 200 and the cylindrical rollers 515, 520 are rotated by the various actuators and motors, a second treatment fluid, such as deionized water and / or one or more second cleaning fluids (e.g., an aqueous solution containing an acid or base) is applied from a second fluid source to the surface of the substrate 200. In some embodiments, the composition of the second treatment fluid provided to the substrate surface is different from the composition of the first treatment fluid provided to the substrate surface in the horizontal pre-cleaning module 107. During the cleaning process of each vertical cleaning module 109A, 109B, the substrate 200 can be positioned so that the processing surface 201 faces the factory interface 102. In another embodiment, the vertical cleaning modules 109A and 109B are oriented within the cleaning units 106A and 106B so that the processing surface 201 faces an orientation substantially perpendicular to the factory interface 102 (e.g., parallel to the XZ plane) during the cleaning process. In another embodiment, the vertical cleaning modules 109A and 109B are oriented in the cleaning units 106A and 106B so that the processing surface 201 of the substrate 200 faces an orientation that is angled between parallel to the XZ plane and parallel to the YZ plane during the cleaning process.

[0078] According to one embodiment, a dedicated adjustment device 560 may be provided for each of the cylindrical rollers 515 and 520. The adjustment device 560 is mounted near the side wall of the tank 505 by one or more support members 570. The position of the adjustment device 560 is away from the center of the tank 505 so as not to interfere with the substrate transfer and / or substrate polishing or cleaning process. However, when the first support 525 and the second support 530 are driven downward and outward away from each other, the adjustment device 560 is positioned to contact each of the cylindrical rollers 515 and 520. In one embodiment, the movement of the first support 525 and the second support 530 causes the cylindrical rollers 515 and 520 to contact the corresponding adjustment device 560. In this position, the processing surface of the tubular cover 528 on each of the cylindrical rollers 515 and 520 can be adjusted during the relative movement between the cylindrical rollers 515 and 520 and the adjustment device 560.

[0079] According to one embodiment, the cleaning units 106A, 106B can each be configured to sequentially process each substrate 200 through two vertical cleaning modules 109A, 109B as a two-step cleaning process. That is, after the substrate 200 undergoes cleaning processing in the vertical cleaning module 109A closest to the polishing station 105, the third substrate handler 108 transfers the substrate 200 to the vertical cleaning module 109B closest to the factory interface 102 for further cleaning processing. In the cleaning process sequence, after processing in the first vertical cleaning module 109A for a first time period, the substrate is then transferred to the second vertical cleaning module 109B and then processed for a second time period, which is generally substantially similar to the first time period. The processes performed in the first vertical cleaning module 109A and the second vertical cleaning module 109B can include using similar fluid chemistry and mechanical processing parameters (e.g., the rotation speed and force of the cylindrical roller). In some embodiments, the first vertical cleaning module 109A is adapted to perform a rough cleaning step to remove most of the remaining contaminants (e.g., particles, abrasive particles, chemical residues, etc.) remaining on the surface of the substrate after the first cleaning process is performed in the first cleaning module, while the second vertical cleaning module 109B is configured to perform a cleaning process that is adapted to remove any remaining contaminants remaining from the process performed in the first vertical cleaning module 109A.

[0080] Then, the third substrate handler 108 passes through a first door 110C ( Figure 1A and Figure 2E ), the substrate 200 is transferred to the available one of the integrated cleaning and drying modules 110A, 110B. For example, the door 110C may be a slit valve. Figure 1A-1BAs shown, each cleaning unit 106A, 106B may include two integrated cleaning and drying modules 110A, 110B arranged vertically (i.e., arranged in the Z direction). Each of the integrated cleaning and drying modules 110A, 110B performs cleaning and drying processes on the substrate 200. In one example, the integrated cleaning and drying modules 110A, 110B may rinse and dry the substrate 200. For example, the integrated cleaning and drying modules 110A, 110B may apply chemicals while rinsing the substrate 200 with deionized water to clean and / or adjust the surface tension of the liquid, thereby reducing the adhesion of the liquid to the substrate 200 during the rinsing and drying processes. In another example, at least one of the integrated cleaning and drying modules 110A, 110B is configured to perform only the rinsing and drying processes on the substrate 200. For example, the integrated cleaning and drying modules 110A, 110B may rinse the substrate 200 with deionized water while simultaneously drying the substrate by applying a surface tension adjusting fluid (eg, IPA vapor) using a Marangoni type process.

[0081] The horizontal arrangement of the integrated cleaning and drying modules 110A, 110B can increase the throughput of substrates 200 for cleaning and drying processes while keeping the footprint of the overall cleaning system 106 low. This arrangement of the integrated cleaning and drying modules 110A, 110B in the CMP system 100 will help reduce the transfer time between the vertical cleaning module 109B and the integrated cleaning and drying modules 110A, 110B to increase throughput, importantly reduce the drying capacity of wet substrates, and reduce the air exposure time of substrates between cleaning steps.

[0082] In some configurations, each cleaning unit 106A, 106B may include only a single integrated cleaning and drying module 110. For example, one integrated cleaning and drying module 110 may require maintenance. In this case, the integrated cleaning and drying module 110 requiring maintenance may be removed and / or removed from the cleaning unit 106A or 106B, and the remaining integrated cleaning and drying module 110 may be retained in the cleaning unit 106A or 106B, so that the CMP process of the substrate 200 may continue in the polishing station 105 and the substrate 200 may be subsequently cleaned in the cleaning unit 106A or 106B (as the case may be).

[0083] from Figure 5As can be seen, for example, in the case where only one integrated cleaning and drying module 110A is used in the cleaning unit 106B, the door blank 110E can be placed on the wall of the cleaning unit 106B facing the factory interface 102. Even if only one integrated cleaning and drying module 110A is used, and another integrated cleaning and drying module 110B is not installed in the cleaning unit 106B, the door blank 110E can also maintain the isolation between the interior of the cleaning unit 106B and the factory interface 102. It will be understood that the cleaning unit 106A can also be configured in the same manner. That is, the cleaning system 106 can be operated with two, three or four integrated cleaning and drying modules 110. However, it can be expected that in most applications, the cleaning system 106 will be operated with two or four integrated cleaning and drying modules 110. That is, both cleaning units 106A, 106B can be operated with the same number (one or two) of integrated cleaning and drying modules 110. In some embodiments, each of the cleaning units 106A, 106B includes two integrated cleaning and drying modules 110 stacked in a vertical direction.

[0084] Figure 2E 1 is a cross-sectional schematic diagram of an integrated cleaning and drying module 110, which represents an integrated cleaning and drying module 110A, 110B and can be used for the cleaning units 106A, 106B described above. After the substrate 200 is cleaned in one or more of the horizontal pre-cleaning module 107 and the vertical cleaning modules 109A, 109B, and the final cleaning module 115, and before the first substrate carrier 103 in the factory interface 102 receives the substrate 200, the integrated cleaning and drying module 110 can receive the substrate 200 to be cleaned. The integrated cleaning and drying module 110 can be used to remove contaminants from the substrate 200, which, if not removed, may cause the corresponding substrate 200 to not meet the cleanliness requirements of subsequent processing steps and be discarded. In one example, the integrated cleaning and drying module 110 is configured to perform a cleaning and drying process that prevents water droplet marks from being formed on the surface of the substrate 200. Typically, the process performed in each integrated cleaning and drying module 110 is the last cleaning process performed in the cleaning sequence performed on the substrate in the CMP system 100. The process performed in each integrated cleaning and drying module 110 may include one or more cleaning steps in which a cleaning fluid or a rinsing fluid (e.g., deionized water) is supplied to the top side and / or the bottom side of the substrate, and then a drying process is performed on the substrate. The drying process may include separately and sequentially delivering a deionized water flow and an IPA vapor flow containing an inert gas mixture, the vapor flow being swept across the processing side (i.e., the substrate 200) using a rotatable arm. Figure 2E top surface) and / or back surface.

[0085] The integrated cleaning and drying module 110 includes a substrate gripping device 603, a first sweep arm 639, a second sweep arm 630, a first nozzle mechanism 640, a second nozzle mechanism 641, a gas chamber 680, an exhaust device 660, an exhaust device 684, and a gas source 670. The integrated cleaning and drying module 110 may also include a sensing device 694, such as a camera for detecting the status of the cleaning process, or a reflective position sensing device for sensing the position of the substrate within the internal volume 695.

[0086] The substrate grabbing device 603 is configured to support, hold and / or fix the substrate 200 in a horizontal orientation. For example, the substrate grabbing device 603 is configured to support the substrate 200 in a horizontal orientation perpendicular to the rotation axis 616 oriented vertically. The substrate grabbing device 603 includes a catch cup 610 and a catch assembly 620. The catch cup 610 may include a first catch cup 611 and a second catch cup 612. The first catch cup 611 may be coupled to the second catch cup 612. For example, the first catch cup 611 may be coupled to the second catch cup 612 via one or more bolts. One or more of the first catch cup 611 and the second catch cup 612 may include one or more threaded portions configured to receive threaded bolts.

[0087] The cup 610 may include drain holes 662 positioned in an array along the edge of the cup 610 so that when the substrate 200, the gripping assembly 620, and the cup 610 are rotated by the drive motor 622, moisture flows into the drain device 684. Further, a labyrinth 664 may be formed between the cup 610 and the housing of the integrated cleaning and drying module 110. The labyrinth 664 may be configured to at least partially restrict moisture from flowing back through the labyrinth 664 and into the interior volume 695.

[0088] The cup 610 includes a wall 613 having an annular inner surface 614. The annular inner surface 614 defines a processing volume 697 within the substrate gripper device 603. The annular inner surface 614 has angled portions that are symmetrical about a central axis, such as an axis of rotation 616 of the substrate gripper device 603. For example, the substrate 200 may be cleaned within the processing volume 697.

[0089] The gripping assembly 620 holds the substrate 200 while deionized water and / or a third cleaning fluid are applied to the substrate 200 for cleaning. The gripping assembly 620 may also include a gripping bar 617 coupled to the plate 619. In one or more embodiments, each gripping bar 617 may be coupled to an element 680 configured to contact the housing of the first cup 611 when the plate 619 is positioned relative to the cup 610 using the actuator 629. The contact between the element 680 and the surface of the first cup 611 imparts translational motion to the gripping bar 617. For example, in response to the element 680 contacting the annular inner surface 614 of the first cup 611, when the plate 619 and the gripping assembly 620 are moved in the +Z direction by the actuator 629, the element 680 contacts the annular inner surface 614 of the first cup 611 and pivots. In response, the pivoting and / or translational motion is transmitted to the gripping bar 617 coupled to the element 680. In one embodiment, the element 680 continues to pivot until the movement of the grab assembly 620 in the +Z direction stops. In one embodiment, after the movement of the plate 619 in the +Z direction stops, the element 680 and the grab bar 617 are positioned in the open position.

[0090] A spring element (such as a leaf spring or other suitable spring design (not shown)) can further return the element 680 to the starting position in response to the element 680 no longer contacting the annular inner surface 614 of the first cup 611 (such as when the substrate 200 is positioned as shown in FIG. Figure 2B The gripping rod 617 is moved to the gripping position when the gripping rod 617 is in the processing position shown in FIG. The biasing force from the spring element can load the element 680 so that when the element 680 is no longer in contact with the housing of the first cup 611, the element 680 returns to the starting position and the gripping rod 617 returns to the gripping position.

[0091] One or more fluids may be applied to the processing side 201 of the substrate 200 by the first nozzle mechanism 640 and the second nozzle mechanism 641. For example, the first fluid supply 643 may supply deionized water, an inert gas, and / or IPA vapor to the second nozzle mechanism 641, which is positioned to deliver the fluid to the processing side (i.e., Figure 2E The first nozzle mechanism 640 may also apply deionized water and / or cleaning chemicals to the processing side of the substrate 200.

[0092] For example, the first nozzle mechanism 640 may include a component configured to perform a non-contact cleaning process (such as a cleaning process using a megasonic nozzle or a jet nozzle). In one example, the first nozzle mechanism 640 includes one or more elements, such as a megasonic actuator, which is configured to apply megasonic energy in the form of waves in a cleaning fluid in an alternating manner according to a sine wave or other pattern to produce a megasonic actuated fluid. The cleaning fluid can be delivered from a first fluid source 643, which is adapted to deliver deionized water and / or a cleaning solution (i.e., an acid or alkaline solution). For example, the first nozzle mechanism 640 can be configured to alternately apply megasonic energy in a sinusoidal pattern at a rate between about 430kHz and 5MHz (such as 950kHz) to produce megasonic actuated deionized water provided to the surface of the substrate 200. The first nozzle mechanism 640 can be configured to provide megasonic energy at multiple frequencies, such as delivering at least two different frequencies.

[0093] While the gripper assembly 620 and the cup 610 are rotating, a fluid may be applied to the back side of the substrate 200 via an opening 625 formed in a shaft 624 coupled to a fluid source 623. The shaft 624 may include one or more tubes (not shown) configured to deliver deionized water, a cleaning fluid, and / or a gas to the back side of the substrate 200.

[0094] The drive motor 622 may be coupled to the gripping assembly 620 via a shaft 624. The drive motor 622 rotates the gripping assembly 620 and the cup 610 around the rotation axis 616. Further, the drive motor may be one of a hydraulic, pneumatic, electromechanical, and magnetic motor. The gripping assembly 620, the substrate 200, and the cup 610 are configured to rotate together (e.g., rotate simultaneously) so that the relative speed between the substrate 200 and the cup 610 is substantially the same to reduce the chance that droplets thrown off the surface of the rotating substrate due to the delivery of fluid to the front or back side of the substrate bounce off the inner surface of the cup 610 and land on the surface of the substrate.

[0095] The cover 602 can cover an opening formed in a wall (e.g., a housing wall) 683 and provide access to an interior volume 695 of the integrated cleaning and drying module 110 so that the substrate 200 can be inserted and removed from the integrated cleaning and drying module 110. When the cover 602 is in a closed position, the interior volume 695 of the integrated cleaning and drying module 110 can be referred to as an isolated environment. For example, when the cover 602 is closed, the interior volume 695 of the integrated cleaning and drying module 110 is isolated from the external environment so that fumes (e.g., IPA vapor) and liquids generated and / or used during cleaning of the substrate 200 do not escape from the integrated cleaning and drying module 110 during the cleaning process. Any fumes and cleaning liquids used and / or generated during the cleaning process are removed from the integrated cleaning and drying module 110 in a controlled manner via the exhaust device 660 and / or the exhaust device 684. Air can be provided to the air chamber 680 by the gas source 670 and exhausted from the integrated cleaning and drying module 110 by the exhaust device 660. Further, the plenum 680 and the exhaust device 660 can be configured to control the airflow within the integrated cleaning and drying module 110 to prevent particles from reattaching to the surface of the substrate 200. The airflow provided to the integrated cleaning and drying module 110 can be provided at a desired pressure and flow rate to ensure the removal of vapors (e.g., IPA vapors) and / or airborne particles, etc., formed in the processing area of ​​the integrated cleaning and drying module 110 during processing. In some embodiments in which nitrogen is delivered to the integrated cleaning and drying module 110, it may be necessary to eliminate the use of HEPA filters from the system to reduce system and maintenance costs and reduce system complexity. In some embodiments, the gas source 670 is configured to provide filtered air or other gas so that a desired pressure (e.g., greater than atmospheric pressure) is maintained in the processing area of ​​the integrated cleaning and drying module 110A.

[0096] The drain 684 may be used to remove excess moisture from the integrated cleaning and drying module 110. In one embodiment, the drain 684 may remove excess cleaning fluid from the integrated cleaning and drying module 110 during the cleaning process.

[0097] The interior volume 695 of the integrated cleaning and drying module 110 can be defined between the cup 610 and the wall (e.g., housing wall) 683. A substrate (e.g., substrate 200) can be inserted into the interior volume 695 when loaded into the integrated cleaning and drying module 110 and removed from the interior volume 695 when removed from the integrated cleaning and drying module 110.

[0098] The sensing device 694 can detect the substrate 200 within the integrated cleaning and drying module 110. For example, the sensing device 694 can detect the substrate 200 within the internal volume 695. Further, the sensing device 694 can detect the substrate 200 while the substrate 200 is held by the gripping assembly 620. The sensing device 694 can detect when the substrate 200 is correctly or incorrectly loaded into the gripping assembly 620. Further, the sensing device 694 can detect when the substrate 200 falls off or falls out of the gripping assembly 620. The sensing device 694 can further determine when the substrate 200 is inserted into and removed from the integrated cleaning and drying module 110.

[0099] The first sweep arm 639 is coupled to the sweep arm shaft 637 and the sweep arm drive motor 638. The sweep arm shaft 637 and the sweep arm drive motor 638 form a first sweep arm drive assembly 633. The sweep arm drive motor 638 can be coupled to the sweep arm shaft 637 and is configured to move the first nozzle mechanism 640 on the distal end of the first sweep arm 639 in an arc path parallel to the surface of the substrate 200. The first sweep arm 639 may include one or more tubes for delivering fluid to the first nozzle mechanism 640. The first sweep arm drive assembly 633 is configured to move the first nozzle mechanism 640 over the surface of the substrate 200 during the cleaning process so that the cleaning fluid output by the first nozzle mechanism 640 is evenly distributed on the surface of the substrate 200. The first sweep arm drive assembly 633 can also be configured to vertically move the first sweep arm 639 to set the distance between the cover of the integrated cleaning and drying module 110 and the surface of the substrate 200.

[0100] The second sweep arm 630 is coupled to a sweep arm shaft 632 and a sweep arm drive motor 634. The sweep arm shaft 632 and the sweep arm drive motor 634 form a second sweep arm drive assembly 636. The sweep arm drive motor 634 can be coupled to the second sweep arm shaft 636 and configured to move the second nozzle mechanism 641 on the distal end of the second sweep arm 630 in an arc path parallel to the surface of the substrate 200. The second sweep arm 630 may include one or more tubes for delivering fluid to the second nozzle mechanism 641. The second sweep arm drive assembly 636 is configured to move the second nozzle mechanism 641 over the surface of the substrate 200 during the cleaning process so that the cleaning fluid output by the second nozzle mechanism 641 is evenly distributed on the surface of the substrate 200. The second sweep arm drive assembly 636 can also be configured to vertically move the second sweep arm 630 to set the distance between the cover of the integrated cleaning and drying module 110 and the surface of the substrate 200.

[0101] In some embodiments, the second nozzle mechanism 641 is adapted to provide IPA vapor to the surface of the substrate 200 while the first nozzle mechanism 640 provides deionized water to the surface of the substrate 200 to produce a "Marangoni" effect to dry the surface of the substrate 200. The IPA vapor is provided from an IPA vapor delivery assembly, which may include an IPA vapor generation source 644 and a carrier gas delivery source 645. The IPA vapor generation source 644 may include an IPA liquid vaporization device (not shown) configured to receive liquid IPA and convert it into vapor, which is then mixed with a carrier gas (e.g., N2) provided from the carrier gas delivery source 645 and then provided to the surface of the substrate during the Marangoni drying process. During the horizontally oriented Marangoni drying process, the sweep arm 639 moves the first nozzle mechanism 640 along an arc path from the center region of the substrate to the edge region to create a moving boundary of deionized water that moves outward from the center of the substrate to the edge. In this case, the first nozzle mechanism 640 (which provides deionized water to the surface of the substrate) will lead the second nozzle mechanism 641 (which provides the IPA vapor carrier gas mixture to the surface of the substrate) as the sweep arm 630 moves the second nozzle mechanism 641 along an arcuate path from the center area to the edge area.

[0102] The positions of the sweep arms 630 and 639 and their corresponding nozzle mechanisms 640 and 641 can be adjusted to ensure that the nozzle mechanisms 640 and 641 each pass through the center of the rotating substrate 200 during processing. Further, at least one of the positions of the sweep arms 630 and 639 and the positions of their corresponding nozzle mechanisms 640 and 641 can be adjusted so that the nozzle mechanisms 640 and 641 each pass through a portion of the substrate 200 other than the center of the substrate 200. For example, the nozzle mechanism 640 or 641 can be moved relative to the sweep arm 630 or 639, and / or the sweep arm 630 or 639 can be moved relative to the sweep arm shaft 632 to change the position of the nozzle mechanism 640, 641 relative to the surface of the substrate 200. Further, the axial distance between the nozzle mechanism 640, 641 and the surface of the substrate 200 can be changed to assist in the cleaning process.

[0103] According to one embodiment, Figure 5As shown, a shared gas feed module 113 can be provided in the robot tunnel 104T (FIG. 1). For example, a shared gas feed module 113 can be provided above the cleaner channel 102B. The shared gas feed module 113 can be repaired and / or re-supplied via an access panel (not shown) in the robot tunnel 104T. The shared gas feed module 113 is configured to provide gas (e.g., IPA vapor) to one of the integrated cleaning and drying modules 110 in the cleaning unit 106A and one of the integrated cleaning and drying modules 110 in the cleaning unit 106B. In one example, the shared gas feed module 113 is configured to supply gas (e.g., IPA vapor) to the lower integrated cleaning and drying module 110A in the cleaning unit 106A and the lower integrated cleaning and drying module 110A in the cleaning unit 106B.

[0104] The cleaning system 106 may also include a fluid and pipe section 111. For example, Figure 1B and Figure 5 As shown, the fluid and pipeline section 111 can be located at the bottom of the cleaning unit 106A, 106B and below the robot tunnel 104T. The fluid and pipeline section 111 of each cleaning unit 106A, 106B can include liquid delivery modules 111A, 111B and 111C (as well as conduits, valves, etc., not shown), which are used to supply the process liquid required for each individual module 107, 109, 110 in each cleaning unit 106A, 106B. For example, the horizontal pre-cleaning liquid delivery module 111A can supply process liquid to the horizontal pre-cleaning module 107. Similarly, two different vertical brush box liquid delivery modules 111B can each supply process liquid to a corresponding one of the vertical cleaning modules 109A, 109B, and two different integrated cleaning and drying liquid delivery modules 111C can each supply process liquid to a corresponding one of the integrated cleaning and drying modules 110.

[0105] In some embodiments, each liquid delivery module 111A-111C may be a dedicated liquid delivery module for supplying process liquid to a single specific module of the modules 107, 109, 110. Thus, when one of the cleaning units 106A, 106B is configured with only a single integrated cleaning and drying module 110 (as described above), a single integrated cleaning and drying liquid delivery module 111C may be provided in the corresponding fluid and conduit section 111 to supply process liquid to the single integrated cleaning and drying module 110.

[0106] The fluid and piping section 111 of each cleaning unit 106A, 106B may also include a module for delivering gas to, for example, the integrated cleaning and drying module 110 or exhausting gas from, for example, the integrated cleaning and drying module 110. According to one embodiment, the fluid and piping system 111 of each cleaning unit 106A, 106B includes an integrated cleaning and drying direct gas feed module 111D for delivering process gas to one of the integrated cleaning and drying modules 110. For example, the integrated cleaning and drying direct gas feed module 111D of each cleaning unit 106A, 106B supplies process gas to the corresponding upper integrated cleaning and drying module 110B. In some embodiments, since the shared gas feed module 113 supplies the necessary process gas to a single integrated cleaning and drying module 110, the integrated cleaning and drying direct gas feed module may be omitted from the corresponding fluid and piping section 111.

[0107] According to one embodiment, the fluid and pipeline section 111 of each cleaning unit 106A, 106B includes two integrated clean and dry inert gas feed modules 111F, which are used to deliver inert gas (such as N2) to each of the integrated clean and dry modules 110. For example, the integrated clean and dry inert gas feed module 111F can be an N2 pallet. Each integrated clean and dry inert gas feed module 111F can be a dedicated gas feed module for supplying inert gas to a single specific integrated clean and dry module 110. Therefore, when one of the cleaning units 106A, 106B is configured with only a single integrated clean and dry module 110 (as described above), a single integrated clean and dry inert gas feed module 111F can be provided in the corresponding fluid and pipeline section 111 to supply inert gas to the single integrated clean and dry module 110.

[0108] The environment of the CMP system 100 is strictly controlled in terms of, for example, temperature, humidity, airflow, lighting, etc. In accordance with such strictly controlled environmental conditions, the cleaning system 106 may also include an air supply and exhaust section 112. For example, Figure 1B and Figure 5As shown, the air supply and exhaust section can be located at the top of the cleaning unit 106A, 106B and above the robot tunnel 104T. The air supply and exhaust section 112 of each cleaning unit 106A, 106B may include an air filtration system 112A. The air filtration system 112A of each cleaning unit 106A, 106B supplies air through the corresponding cleaning unit 106A, 106B, for example, according to the conditions required by the specific application. For example, each air filtration system 112A may include a filter, such as a high-efficiency particulate air (HEPA) filter, which is configured to provide filtered air to the area of ​​the CMP system 100. Each air filtration system 112A can be configured to control the temperature of the air delivered to the corresponding cleaning unit 106A, 106B. Each air filtration system 112A can also be configured to control the humidity of the air delivered to the corresponding cleaning unit 106A, 106B. Each air filtration system 112A can deliver air to the corresponding cleaning unit 106A, 106B through, for example, a duct. Each cleaning unit 106A, 106B may include an opening (not shown) at the base of the cleaning unit so that the air supplied by the air filtration system 112A flows out of the cleaning unit 106A, 106B through the base of the cleaning unit. Such a configuration can ensure that the positive flow of environmentally controlled air is maintained from top to bottom through the cleaning units 106A, 106B, which can, for example, minimize the stray particles that may contaminate the substrate 200 and the processing surface 201 during the handling of the substrate 200 in the cleaning unit 106A, 106B. In some embodiments, the gas source 670 forms a part of the air filtration system 112A. In one embodiment, the air filtration system 112A is configured to provide a separate controlled airflow to each integrated cleaning and drying module 110 disposed in each cleaning unit 106A and 106B. Separate controlled airflows can be provided by using separate fan units in the air filtration system 112A, which are connected to each air chamber 680 in each integrated cleaning and drying module 110 through a fluid conduit (not shown). In some embodiments of the air filtration system 112A, a HEPA filter is disposed at the outlet of a fan filter unit positioned above various cleaning modules (e.g., first cleaning module 107, second cleaning module 109, third cleaning module 110, etc.) in each cleaning unit 106A, 106B, so that the fan can pass a laminar airflow through an open area of ​​the cleaning unit 106A, 106B during processing. Alternatively, in some embodiments, a HEPA filter is disposed in one or more cleaning modules (e.g., third cleaning module 110) in each cleaning unit 106A, 106B, so that a fan unit coupled to a cleaning module by a fluid conduit in the air filtration system 112A can pass a laminar airflow through an interior area of ​​the cleaning module during processing.

[0109] The air supply and exhaust section 112 of each cleaning unit 106A, 106B may also include an exhaust section 112B. The exhaust section 112B includes various exhaust ducts to discharge exhaust gas from the following: horizontal pre-cleaning module 107, vertical cleaning modules 109A, 109B, integrated cleaning and drying modules 110A, 110B, integrated cleaning and drying direct gas feed module 111D, and shared gas feed module 113.

[0110] According to an embodiment, the exhaust section 112B may include a plurality of separate exhaust ducts to exhaust the horizontal pre-cleaning module 107 and each of the vertical cleaning modules 109A, 109B of each of the cleaning units 106A and 106B, respectively. The exhaust section 112B may also include two separate exhaust ducts, which are used to discharge the exhaust gas from the main chamber area of ​​each of the cleaning units 106A, 106B (i.e., the return air from the air filtration system 112A). The exhaust section 112B may further include a separate shared exhaust duct, which is used to discharge the exhaust gas from the integrated cleaning and drying modules 110A, 110B and the shared gas feeding module 113. In some embodiments, the exhaust section 112B may further include separate shared exhaust ducts for ventilating the shared gas feed module 113 and each auxiliary gas feed module 513, wherein the shared gas feed module is adapted to provide fluid to at least one of the integrated cleaning and drying modules 110A, 110B within the cleaning units 106A, 106B, and each auxiliary gas feed module is adapted to provide fluid to at least one of the integrated cleaning and drying modules 110A, 110B within the cleaning units 106A, 106B. The exhaust section 112B may further include a separate exhaust duct for exhausting exhaust gases from the fluid and duct section 111. The exhaust section 112B may further include a separate shared exhaust duct for exhausting exhaust gases from the horizontal pre-cleaning liquid delivery module 111A, the vertical brush box liquid delivery module 111B, and the integrated cleaning and drying liquid delivery module 111C. In some embodiments, a shared gas feed module 113 is used to deliver gas, such as an inert gas (e.g., nitrogen (N2), argon (Ar)) and / or a process gas (e.g., IPA) to the cleaning and drying modules 110A (e.g., the fourth cleaning chamber) in each cleaning unit 106A, 106B. In addition, in some embodiments of the system, a direct gas inlet box is used to supply gas to each module, for example, each cleaning and drying module 110B (e.g., the fifth cleaning chamber) in each cleaning unit 106A, 106B receives gas from a separate gas inlet box.

[0111] The integrated cleaning and drying modules 110A, 110B in each of the cleaning units 106A, 106B may require separate ducts to separately discharge solvent waste gas, acid waste gas and cabinet waste gas. That is, according to one embodiment, the exhaust section 112B may further include: a separate exhaust duct for discharging solvent waste gas from the two integrated cleaning and drying modules 110A, 110B of the cleaning unit 106A; a separate exhaust duct for discharging acid waste gas from the two integrated cleaning and drying modules 110A, 110B of the cleaning unit 106A; and a separate exhaust duct for discharging waste gas from the cabinets of the two integrated cleaning and drying modules 110A, 110B of the cleaning unit 106A. Likewise, the exhaust section 112B may further include: a separate exhaust duct for exhausting solvent exhaust from the integrated cleaning and drying modules 110A, 110B of the cleaning unit 106B; a separate exhaust duct for exhausting acid exhaust from the integrated cleaning and drying modules 110A, 110B of the cleaning unit 106B; and a separate exhaust duct for exhausting exhaust from the cabinets of the integrated cleaning and drying modules 110A, 110B of the cleaning unit 106B. In some embodiments, the one or more exhaust ducts of the exhaust section 112B are configured to evacuate the processing volumes of the integrated cleaning and drying modules 110A and 110B to one of the two or more exhaust paths at different times during the execution of a process sequence in each of the integrated cleaning and drying modules 110A, 110B. In one example, at a first time, a valve integrated into exhaust section 112B is configured to divert flammable or toxic gases or vapors to a first type of exhaust path (e.g., scrubbed exhaust), and at a second time, the valve is configured to divert other types of gases or vapors to a second type of exhaust path (e.g., non-scrubbed exhaust).

[0112] As described above, the integrated cleaning and drying modules 110A, 110B in each of the cleaning units 106A, 106B may require separate ducts to discharge solvent waste gas and acid waste gas separately. Therefore, each integrated cleaning and drying module 110A, 110B may include a three-way valve that operates to selectively discharge solvent waste gas or acid waste gas separately.

[0113] To prevent air from flowing back into the cabinets of the integrated cleaning and drying modules 110A, 110B, each integrated cleaning and drying module 110A, 110B may include a P-type trap (not shown) leading to an appropriate duct to discharge exhaust air from the corresponding cabinet. Each P-type trap may include a discharge port.

[0114] Various ducts of the exhaust section 112B may be positioned on the top side of the cleaning system 106 according to the arrangement of the corresponding modules being ventilated and the needs of the manufacturing facility. According to one embodiment, various ducts for exhausting exhaust gases from the horizontal pre-cleaning module 107, the vertical cleaning modules 109A, 109B, and the main chamber areas of the cleaning units 106A, 106B may be arranged on the side of the exhaust section 112B closest to the polishing station 105. In addition, various ducts for exhausting exhaust gases from the integrated cleaning and drying modules 110A, 110B, the integrated cleaning and drying direct gas feed module 111D and the shared gas feed module 113, and the fluid and duct section 111 may be arranged on the side of the exhaust section 112B closest to the factory interface 102.

[0115] Figure 2F 1 is a side cross-sectional view of a fourth cleaning module 115 that can be used in a CMP processing system according to one or more embodiments. The fourth cleaning module 115 (also referred to herein as a final cleaning module) includes an improved cleaning system and method for removing particles from a processed substrate. In various cases, the substrate cleaning process performed in the fourth cleaning module 115 is performed after a polishing and / or brush scrubbing, a polishing or a cleaning process (e.g., a first cleaning module type process and a second cleaning module type process), wherein particle reattachment may occur after the polishing and / or brush scrubbing process. Therefore, the yield of the processed wafer will be negatively affected. The following description of the fourth cleaning module 115 illustrates a non-contact cleaning method that is configured to remove any remaining particles on the substrate before drying the substrate.

[0116] The fourth cleaning module 115 includes a substrate grabbing device 703 , a first scanning arm 739 , a first nozzle mechanism 740 , a second nozzle mechanism 741 , a gas chamber 780 , an exhaust device 760 , an exhaust device 784 , and a gas source 770 . The fourth cleaning module 115 may further include a sensing device 794 .

[0117] The substrate gripping device 703 is configured to support, hold and / or fix the substrate 200 in a vertical orientation. For example, the substrate gripping device 703 is configured to support the substrate 200 in a vertical orientation perpendicular to the horizontally oriented rotation axis 716. The substrate gripping device 703 includes a cup 710 and a gripping assembly 720. The cup 710 may include a first cup 711 and a second cup 712. The first cup 711 may be coupled to the second cup 712.

[0118] The cup 710 may include drain holes 762 positioned in an array along the edge of the cup 710, such that when the substrate 200, the gripping assembly 720, and the cup 710 are rotated by the drive motor 722, moisture flows into the drain device 784. Further, a labyrinth 764 may be formed between the cup 710 and the housing of the fourth cleaning module 115. The labyrinth 764 may be configured to at least partially restrict moisture from flowing back through the labyrinth 764 and into the internal volume 795.

[0119] The cup 710 includes a wall 713 having an annular inner surface 714. The annular inner surface 714 defines a processing volume 797 within the substrate gripper device 703. The annular inner surface 714 has angled portions that are symmetrical about a central axis, such as an axis of rotation 716 of the substrate gripper device 703. For example, the substrate 200 may be cleaned within the processing volume 797.

[0120] The gripping assembly 720 holds the substrate 200 while deionized water and / or a third cleaning fluid are applied to the substrate 200 for cleaning. The gripping assembly 720 may also include a gripping bar 717 coupled to the plate 719. In one or more embodiments, each gripping bar 717 may be coupled to an element 780 configured to contact the housing of the first cup 711 when the plate 719 is positioned relative to the cup 710 using the actuator 729. The contact between the element 780 and the surface of the first cup 711 transfers the translational motion to the gripping bar 717. For example, in response to the element 780 contacting the annular inner surface 714 of the first cup 711, when the plate 719 and the gripping assembly 720 are moved in the +Y direction by the actuator 729, the element 780 contacts the annular inner surface 714 of the first cup 711 and pivots. In response, the pivoting and / or translational motion is transferred to the gripping bar 717 coupled to the element 780. In one embodiment, the element 780 continues to pivot until the movement of the grab assembly 720 in the +Y direction stops. In one embodiment, after the movement of the plate 719 in the +Y direction stops, the element 780 and the grab bar 717 are positioned in the open position.

[0121] A spring element (e.g., a leaf spring or other suitable spring design (not shown)) can further return the element 780 to the starting position in response to the element 780 no longer contacting the annular inner surface 714 of the first cup 711, for example, when the substrate 200 is positioned as shown in FIG. Figure 2F When the element 780 is no longer in contact with the housing of the first cup 711, the biasing force from the spring element can cause the element 780 to be loaded, so that the element 780 returns to the starting position and the grabbing rod 717 returns to the grabbing position.

[0122] One or more fluids may be applied to the processing side 201 of the substrate 200 by the first nozzle mechanism 740 and the second nozzle mechanism 741. For example, the first fluid supplier 743 may supply deionized water to the second nozzle mechanism 741, which is positioned to deliver the fluid to the processing side of the substrate 200. The first nozzle mechanism 740 may also apply deionized water and / or a cleaning chemical to the processing side of the substrate 200.

[0123] For example, the first nozzle mechanism 740 may include a component configured to perform a non-contact cleaning process (such as a cleaning process using a megasonic nozzle or a jet nozzle). In one example, the first nozzle mechanism 740 includes one or more elements, such as a megasonic actuator, which is configured to apply megasonic energy in the form of waves in a cleaning fluid in an alternating manner according to a sine wave or other pattern to produce a megasonic actuated fluid. The cleaning fluid can be delivered from a first fluid source 743, which is adapted to deliver deionized water and / or a cleaning solution (i.e., an acid or alkaline solution). For example, the first nozzle mechanism 740 can be configured to alternately apply megasonic energy in a sinusoidal mode at a rate between about 430kHz and 5MHz (such as 950kHz) to produce megasonic actuated deionized water provided to the surface of the substrate 200. The first nozzle mechanism 740 can be configured to provide megasonic energy at multiple frequencies, such as delivering at least two different frequencies.

[0124] While the gripper assembly 720 and the cup 710 are rotating, a fluid may be applied to the back side of the substrate 200 via an opening 725 formed in a shaft 724 coupled to a fluid source 723. The shaft 724 may include one or more tubes (not shown) configured to deliver deionized water, cleaning fluids, and / or gases to the back side of the substrate 200.

[0125] The drive motor 722 may be coupled to the gripping assembly 720 via a shaft 724. The drive motor 722 rotates the gripping assembly 720 and the cup 710 about the rotation axis 716. Further, the drive motor may be one of a hydraulic, pneumatic, electromechanical, and magnetic motor. The gripping assembly 720, the substrate 200, and the cup 710 are configured to rotate together (e.g., rotate simultaneously) so that the relative speed between the substrate 200 and the cup 710 is substantially the same to reduce the chance that droplets thrown off the surface of the rotating substrate due to the delivery of fluid to the front or back side of the substrate bounce off the inner surface of the cup 710 and land on the surface of the substrate.

[0126] The cover 702 can cover an opening formed in a wall (e.g., a housing wall) 783 and provide access to the interior volume 795 of the fourth cleaning module 115 so that a vertically oriented substrate 200 can be inserted and removed from the fourth cleaning module 115. When the cover 702 is in a closed position, the interior volume 795 of the fourth cleaning module 115 can be referred to as an isolated environment. For example, when the cover 702 is closed, the interior volume 795 of the fourth cleaning module 115 is isolated from the external environment so that fumes (e.g., acid or base vapors) and liquids generated and / or used during cleaning the substrate 200 do not escape from the fourth cleaning module 115 during the cleaning process. Any fumes and cleaning liquids used and / or generated during the cleaning process are removed from the fourth cleaning module 115 in a controlled manner via an exhaust device 760 and / or an exhaust device 784, which are positioned at opposite ends of the module. Air can be provided to the air chamber 780 by a gas source 770 and exhausted from the fourth cleaning module 115 by the exhaust device 760. Further, the plenum 780 and the upper exhaust 760 can be configured to control the gas flow within the fourth cleaning module 115 to prevent particles from reattaching to the surface of the substrate 200. The gas flow provided to the fourth cleaning module 115 can be provided at a desired pressure and flow rate to ensure the removal of vapors and / or airborne particles, etc. formed during processing within the processing area of ​​the fourth cleaning module 115. In some embodiments, the gas source 770 is configured to provide filtered air or other gas so that a desired pressure (e.g., greater than atmospheric pressure) is maintained in the processing area of ​​the fourth cleaning module 115A.

[0127] The interior volume 795 of the fourth cleaning module 115 may be defined between the cup 710 and the wall 783. The substrate 200 may be inserted into the interior volume 795 when loaded into the fourth cleaning module 115 and removed from the interior volume 795 when removed from the fourth cleaning module 115.

[0128] The sensing device 794 can detect the substrate 200 within the fourth cleaning module 115. For example, the sensing device 794 can detect the substrate 200 within the internal volume 795. Further, the sensing device 794 can detect the substrate 200 while the substrate 200 is held by the gripping assembly 720. The sensing device 794 can detect when the substrate 200 is correctly or incorrectly loaded into the gripping assembly 720. Further, the sensing device 794 can detect when the substrate 200 falls off or falls out of the gripping assembly 720. The sensing device 794 can further determine when the substrate 200 is inserted into the fourth cleaning module 115 and removed from the fourth cleaning module 115.

[0129] The sweep arm 730 is coupled to a sweep arm shaft 732 and a sweep arm drive motor 734. The sweep arm shaft 732 and the sweep arm drive motor 734 form a first sweep arm drive assembly 736. A sweep arm drive motor 738 can be coupled to the sweep arm shaft 732 and configured to move a first nozzle mechanism 740 on the distal end of the first sweep arm 730 in an arc path parallel to the surface of the substrate 200. The first sweep arm 730 can include one or more tubes for delivering fluid to the first nozzle mechanism 740. The first sweep arm drive assembly 736 is configured to move the first nozzle mechanism 740 over the surface of the substrate 200 during the cleaning process so that the cleaning fluid output by the nozzle mechanism 740 is evenly distributed on the surface of the substrate 200. The first sweep arm drive assembly 736 can also be configured to vertically move the sweep arm 730 to set the distance between the cover of the fourth cleaning module 115 and the surface of the substrate 200.

[0130] The substrate cleaning process includes rotating the cup 710, the gripping assembly 720, and the substrate 200 simultaneously while applying a cleaning fluid to a first side (front surface) and a second side (back surface) of the substrate 200. Rotating the cup 710, the gripping assembly 720, and the substrate 200 simultaneously while applying the cleaning fluid helps to minimize and / or eliminate the reattachment of particles to either surface of the substrate 200. For example, the drive motor 722 can be configured to rotate the cup 710, the gripping assembly 720, and the substrate 200. The substrate 200 is rotated at a speed ranging from about 500 RPM to about 1000 RPM so that the fluid is removed from the surface of the substrate 200. Further, the rotation speed of the substrate 200 can be varied during the cleaning process. In addition, once the wafer gripper 710 is placed in the cleaning position, the cleaning cycle can be initiated. The first cleaning fluid can be applied to the back surface of the substrate 200 via the fluid source 723, the shaft 724, and the hole 725. Further, the second fluid can be applied to the front surface of the substrate 200 via the nozzle mechanism 740. The sweep arm drive motor 734 moves the sweep arm 730 so that the nozzle mechanism 740 moves in an arc path over the front surface of the substrate 200. The nozzle mechanism 740 can be configured to apply a cleaning fluid to the front surface of the substrate 200 during the cleaning process. The fluid can include cleaning chemicals and / or rinse agents. In one embodiment, the cleaning fluid can be applied to the front surface and back surface of the substrate 200 at substantially the same time or during one or more overlapping and non-overlapping time periods. When in the cleaning position, the situation that the cleaning fluid splashes back on the substrate 200 is at least reduced, and is eliminated in various embodiments. During at least one of the cleaning process, the loading process, and the unloading process, the airflow in the fourth cleaning module 115 reduces the occurrence of recirculation, thereby preventing particles from reattaching to the surface of the substrate 200. Clean system configuration

[0131] The various cleaning chambers within the cleaning system 106 (which may include one or more cleaning modules 107, 109, 110, 115, 117, and 119) are modular. Therefore, the modules 107, 109, 110, 115, 117, and 119 can be changed according to the needs of, for example, service and / or routine maintenance or the needs of a specific application.

[0132] Return to reference Figure 1A-1B and Figure 5 According to an embodiment in which any of the cleaning units 106A, 106B is configured with two integrated cleaning and drying modules 110A, 110B, the third substrate carrier 108 may transfer the substrate 200 from the vertical cleaning module 109B to an available one of the integrated cleaning and drying modules 110A, 110B. That is, when one substrate 200 is subjected to a cleaning and drying process in one of the integrated cleaning and drying modules 110A, 110B, the third substrate carrier 108 may transfer the substrate 200 to another module of the integrated cleaning and drying modules 110A, 110B (generally referred to as the integrated cleaning and drying module 110) that is not currently performing a cleaning and drying process on the substrate 200. During transfer of the substrate 200 from the vertical cleaning module 109B to an available integrated cleaning and drying module 110 , the third substrate handler 108 may rotate the substrate 200 90 degrees about the Y axis so that the processing side 201 of the substrate 200 faces upward (i.e., in the Z direction) when positioned in the integrated cleaning and drying module 110 .

[0133] The first substrate carrier 103 can transfer the substrate 200 from the integrated cleaning and drying module 110 via a second door 110D formed in a second side panel of the integrated cleaning and drying module 110. The first side panel of the integrated cleaning and drying module 110 and the second side panel of the integrated cleaning and drying module 110 can be parallel to each other and located on opposite sides of the integrated cleaning and drying module. For example, the door 110D can be a slit valve. The first substrate carrier 103 can transfer the substrate 200 from the integrated cleaning and drying module 110 to one of the loading stations 102A.

[0134] In one example of a cleaning process sequence, the substrate 200 is moved between the horizontal pre-cleaning module 107 and the vertical cleaning module 109A, between each of the cleaning modules 109A, 109B, and between the cleaning module 109B and the integrated cleaning and drying modules 110A, 110B using the third substrate handler 108. The arrangement of the various modules 107, 109, 110, 115, 117, and 119 and the substantial range of the substrate handler 108 in the Z direction can improve the cleaning operation, for example, because the time and distance that the third substrate handler 108 has to handle the substrate 200 is reduced.

[0135] As mentioned above, and will now be described, the third substrate handler 108 may have two separate blade assemblies for separately handling substrates 200 during different cleaning stages in the cleaning system 106 .

[0136] Figure 6 yes Figure 3 , and identifies and describes other components of the substrate handler 106A. Specifically, the handler includes a first blade assembly 300 and a second blade assembly 400, each blade assembly having a gripping actuator 310, 410 to allow a pair of blades 370 on each assembly to open and close around the edge of the substrate 200. Figure 7 As can be best seen, each blade assembly is provided with a vertical actuator 320, 420 disposed within a vertical actuator assembly 330, 430, and a horizontal actuator assembly 435 to move the blade assembly 300, 400 to various horizontal and vertical positions within the substrate handler housing. Figure 7-Figure 8 and Fig.10 As shown, each blade assembly 300, 400 is coupled to a translatable portion of a vertical track 321, 421 (e.g., a linear guide, a linear ball slide, etc.) aligned in the vertical direction (i.e., the Z direction). Each of the tracks 321, 421 is disposed within a vertical actuator assembly 330, 430, respectively, which can each be moved along a horizontal track 436 (e.g., a linear guide, a linear ball slide, etc.) within a horizontal actuator assembly 435 by using horizontal actuators 437A, 437B, which are adapted to position the corresponding blade assembly 300, 400 in the horizontal direction (i.e., the X direction). In some embodiments, the horizontal actuators 437A, 437B and the vertical actuators 320, 420 may each include a linear actuator or an electric ball screw actuator assembly configured to drive and position the corresponding components using commands from the system controller 160.

[0137] like Figure 8 As shown, the first blade assembly 300 is also provided with a first blade actuator motor 350 and a second blade actuator motor 355, wherein the first blade actuator motor is used to allow the blade assembly and the substrate to move between a horizontal position (as shown) and a vertical position, and the second blade actuator motor is used to rotate the first blade assembly and the substrate 180 degrees so that the vertically positioned substrate 200 faces the opposite direction. As shown, the actuator motors 350, 355 allow the blade assembly to rotate around two axes A1, A2. In operation, as will be shown herein, the first blade actuator 350 first moves the substrate from a horizontal position to a vertical position using axis A1. Thereafter, the second actuator motor 355 rotates the substrate 180 degrees using axis A2. As shown in FIG. Figure 8As shown, axis A2 is aligned such that axis A2 is substantially parallel to the front side (e.g., device side) of substrate 200, and axis A1 is aligned such that axis A1 is substantially perpendicular to axis A2. In the illustrated embodiment, the first movement causes the second actuator motor 355 to rotate with the substrate and blade assembly 300, while in the second movement (180 degree movement), only the substrate and blade assembly 300 rotate.

[0138] In some embodiments, the entire blade assembly 300 can be optionally set to a predetermined distance "W" from the vertical actuator 320 of the blade assembly using a sliding mechanism 376 between the first blade actuator and the vertical actuator 320 of the blade assembly. The sliding mechanism ensures that the grab blade 370 is properly aligned with the access door of each cleaning chamber. In fact, the substrate is manipulated and repositioned between cleaning chambers using the blade assemblies 300 and 400. Figure 8 Also visible in the figure are gripping blades 370 for holding and / or fixing the substrate 200. In the embodiment of the present invention, the gripping blades are part of the gripping assembly 360 and are opened and closed by the gripping actuator 310. The substrate 200 is shown as being held between the blades 370 by the edges of the substrate. The substrate 200 is depicted with its "device side facing up", which means that the side shown (i.e., the front side) is the side on which the semiconductor device has been formed. In the present disclosure, the device side is illustrated as a schematic representation of a semiconductor die formed on the front surface of the substrate, which is also referred to herein as the front side or device side of the substrate. Unlike the first blade assembly 300, the second assembly 400 is only used to transfer the substrate from the first vertical cleaning module 109A to the second vertical cleaning module 109B, and therefore only utilizes its vertical and horizontal actuators 420, 430 and the gripping actuator (not shown) to grip and release the substrate 200.

[0139] Fig.9A 384 is a top isometric view of a specific embodiment of the gripper assembly 360. The cover has been removed for clarity. Shown are two gripper blades 370 that can move toward or away from each other due to operation of the gripper actuator 310. In this embodiment, each blade 370 is mounted on a block 382, ​​and each block is mounted on a track 384. When the gripper actuator 310 causes the blocks 382 to move by using the bracket 385 to move the gripper assembly 360 between the open or closed position, the blocks 382 attached to the track 384 move in opposite directions. Fig. 9B 386 ( FIG. 387 is a side view of a vertically oriented gripper assembly 360 providing a visual indication of the position of the gripper blades 370 relative to the substrate 200 to be gripped. Each blade 370 is supplied with a "target" 386 ( Fig. 9BWhen the gripping actuator 310 is operated to close or separate the blades, the target moves with the blades 370. An optical sensor 388 ( Fig. 9B ), each optical sensor is arranged to provide a signal when a corresponding target 386 is aligned with the optical sensor. The basics of optical sensors are well known in the art. Fig. 9B , the upper sensor is aligned with the target of the upper sensor, while the lower sensor is not aligned with the target. This arrangement indicates a situation where the gripping assembly 360 successfully grips the substrate. If the blades 370 separate to the extent that the inner diameter of the blades exceeds the outer diameter of the substrate 200, the lower sensor 388 and the target 386 are aligned, while the upper target and the sensor are not aligned, an "open" condition is indicated. If the blades 370 close to exceed the outer diameter of the substrate 200, and both sensors are not aligned with their targets, a "miss" condition is indicated.

[0140] Fig.10 4 is a side view of the second blade assembly 400. The second blade assembly 400 will generally include a gripper assembly 360 that is attached to the vertical track 421 of the vertical actuator 420 using a sliding mechanism 476. In operation, the second blade assembly 400 is coupled to the translatable portion of the vertical track 412 and is adapted to be moved vertically using a vertical actuation device (not shown) disposed within the vertical actuator 420 (such as a linear motor or an electric ball screw). The second blade assembly 400 is also adapted to be moved horizontally using a horizontal actuator 437B within the horizontal actuator assembly 435 ( Figure 7 ). In some embodiments, the entire blade assembly 400 can be set to a predetermined distance "W" from the vertical actuator 420 of the blade assembly using a sliding mechanism 476. The sliding mechanism 476 ensures that the grab blade 370 is properly aligned with the access door of each of the second cleaning modules 109A, 109B. In effect, the substrate is manipulated and repositioned between the second cleaning modules using both blade assemblies 300, 400. Fig.10 Also visible in the figure are gripper blades 370 for holding and / or securing the substrate 200. In one example, the blade assembly 400 includes gripper blades 370 configured to hold and secure the substrate 200 in a vertical orientation, such as Fig.10 As shown, the front side of the substrate 200 is parallel to the YZ plane. Figure 8Similar to the discussion, the gripping blades 370 are part of the gripping assembly 360 and are opened and closed by the gripping actuator 310. The substrate 200 is shown as being held between the blades 370 by the edges of the substrate and is depicted with the device side of the substrate facing away from the polishing station 105. Unlike the first blade assembly 300, the second assembly 400 is used only to transfer the substrate from the first vertical cleaning module 109A to the second vertical cleaning module 109B, and thus in some embodiments, only its vertical actuator 420 and the gripping assembly 360 are utilized to position and grip and release the substrate 200. In some embodiments, the second blade assembly 400 has an overall height "H", which is defined as the distance from the farthest point on the edge of the substrate 200 to the farthest point on the opposite side of the second blade assembly 400. In some embodiments, the overall height H is configured to be equal to or less than the first blade assembly 300 ( Figure 8 )'s total length "L", which will be discussed further below.

[0141] Although it is often desirable to form the second blade assembly 400 without adding the ability to rotate the grab blade 370 about one or more rotational axes for the sake of reducing system complexity and cost, in some cases it may be desirable to provide this additional capability. Therefore, in some embodiments of the third substrate handler 108, the second blade assembly 400 will additionally include one or more actuators configured to rotate the grab blade 370 about one or more axes (e.g., axes similar to the axis A1 and / or axis A2 discussed herein with respect to the first blade assembly 300). In one example, when the second blade assembly 400 transfers substrates between cleaning chambers, it is desirable that the second blade assembly changes the orientation of the device side of the substrate, in which case the second blade assembly 400 includes a second actuator motor 355 adapted to rotate the substrate about the axis A2. In another example, the second blade assembly 400 is configured similarly to the first blade assembly 300 and is therefore configured to perform similar movements as the first blade assembly 300 described herein.

[0142] Fig.11is an alternative embodiment of the first blade assembly 300 that includes a first housing 390 and a second housing 392 to ensure that the cable elements 394 associated with each actuator 310, 312, 314 are enclosed and thereby protected from contaminants during processing of the substrate. In this configuration, the first housing 390 is coupled to the sliding mechanism 376. In some embodiments, the cable elements 394 can each include cables and / or pneumatic tubing used by one or more components in the first blade assembly 330. The cable elements 394 enter through a plurality of holes 396 in the first housing. From here, each cable element is threaded to its designated actuator 310, 312, 314 using protected paths that include the centerline A11 of hole 310C and the centerline A21 of hole 312C that provide rotational movement of the gripping assembly 360 and the substrate 200. As shown in FIG. Fig.11 As shown, axis A21 is aligned so that axis A21 is substantially parallel to the front face (e.g., device side) of substrate 200, while axis A11 is aligned so that axis A11 is substantially perpendicular to axis A21. Actuator motors 312 and 314 each have an output shaft body, which are respectively coupled to concentric / coaxial gears 312A and 314A, which interact with offset gears 312B and 314B to rotate components coupled to offset gears 312B and 314B. Fig.11 As shown, the actuator 314 is configured to rotate the gear 314A (drive gear), thereby rotating the gear 314B (offset gear) about the axis A11, and rotating the second housing 392, the actuator 312, and the blade assembly 393 about the axis A11. The actuator 312 is configured to rotate the gear 312A (drive gear), thereby rotating the gear 312B (offset gear) about the axis A21, and rotating the blade assembly 393 about the axis A21. In some embodiments, the blade assembly 393 may include the same components as the blade assembly 360 discussed herein. The offset gears 312B and 314B include openings, such as concentric / coaxial holes 312C and 314C on the rotational axes of the gears represented by the center lines A11 and A21, respectively, which provide a path for electrical cables (such as sensor wires and AC or DC power cables) and / or pneumatic tube elements to be routed through the gear 314B while allowing the second housing 392 and the gripper assembly 360 to rotate and move. Example of a cleaning process sequence

[0143] Figures 12A-12KThe figure shows an example of a movement sequence of blade assemblies 300, 400 and multiple substrates 200 within multiple cleaning chambers that include different types of cleaning modules used during the cleaning process sequence. During the processing sequence performed within the CMP processing system 100, the transfer sequence utilizes the various devices and methods disclosed herein to perform the most time and space efficient manipulations. The above describes the cleaning process performed in each cleaning module within the cleaning process sequence. It should be understood that the cleaning process sequence described herein is a continuous process such that during steady state operation, substrates are typically set in all cleaning modules at any one time. Therefore, Figures 12A-12K The base plate in the illustrated module is shown in dashed lines. Fig. 12A 109A, a substrate 200 is shown in each module except the first vertical cleaning module 109A. As will be shown in the figure, the bin is waiting to receive the substrate currently shown in the horizontal pre-cleaning module 107. In order to better explain the operation of the blade assembly, the substrate in the vertical cleaning module 109B will be referred to as the first substrate 200A, and the substrate shown in the horizontal pre-cleaning module 107 will be referred to as the second substrate 200B. The second substrate 200B in the horizontal pre-cleaning module 107 is placed there by the central robot (e.g., the second substrate handler 104) using the first door 107A at the front of the module after the polishing operation is performed on the substrate. Figures 12A-12K The central robot is not shown in the figure. It can be seen that the grab blade 370 of the first blade assembly 300 is opened to extract the substrate 200B through the door 107B on the side of the first cleaning module. As shown in the figure, the blade assembly 300 is vertically aligned with the door 107B, and only the horizontal actuator 435A in the horizontal actuator assembly 435 needs to provide horizontal movement to reach the substrate.

[0144] It is worth noting that the specific reference Figures 12B-12F For example, the horizontal space between module 107 and module 110B is minimized to reduce the footprint of the cleaning system and the need for large horizontal movement of the first vertical actuator assembly 330, thereby reducing the need for large horizontal movement of the first blade assembly 300. Figure 12B-12F The motion shown is to reduce the system footprint. Figures 12A-12F The spacing shown is adapted to clearly illustrate the motion of the robot. However, the actual distance between module 107 and module 110B is approximately equal to or almost equal to the total length L ( L ) of the blade assembly 300 holding the substrate. Figure 8 ), as more clearly described in this article.

[0145] exist Fig. 12B4, substrate 200B has been removed from module 107 using horizontal actuator 435A, with the direction of travel of the gripper assembly being indicated by arrow 202. Substrate 200B is oriented with the device side facing upward. Fig. 12C As shown in the figure, due to the action of the first blade actuator 350, the first blade assembly 300 rotates 45 degrees clockwise around the Y axis relative to the horizontal plane. Fig.12D In FIG. 1 , due to the continued operation of the first blade actuator 350, the first blade assembly 300 has oriented the substrate 200B in a vertical position, and through the operation of the vertical actuator 320, the first blade assembly has been lowered in the housing to a height slightly higher than the vertical cleaning modules 109A, 109B. Note that in FIG. Fig.12D , substrate 200B is oriented with the device side facing the right side of the housing.

[0146] Fig.12E The first blade assembly 300 is shown oriented in such a manner that the base plate 200B is rotated 90 degrees due to the operation of the second blade actuator 355 and faces one side of the housing. Fig.12F In the embodiment, the substrate 200B is ready to be lowered into the first vertical cleaning module 109A. Not only does the blade assembly 300 move horizontally due to the operation of the horizontal actuator 435A, but the first blade assembly 300 also uses the second blade actuator 355 to move the substrate from Fig.12D The configuration is rotated 180 degrees so that the device side of the substrate 200B faces the left side of the housing, which will minimize the movement required to place the substrate in one of the integrated cleaning and drying modules 110A, 110B at a later stage in the process sequence.

[0147] Figure 12G The first blade assembly 300 is shown to have repositioned itself above the second vertical cleaning module 109B after placing the substrate 200 in the first vertical cleaning module 109A, where the first substrate 200A has undergone a cleaning operation. The movement and position of the blade assembly 300 is the result of the movement of the horizontal actuator 435A and the vertical actuator 320. In addition to the movement of the first blade assembly 300, the second blade assembly 400 also simultaneously uses its own horizontal actuator 435B and vertical actuator 420 to position itself above the first vertical cleaning module 109A in preparation for retrieving the second substrate 200B previously placed there by the first blade assembly 300. Fig.12H, each blade assembly 300, 400 removes the substrate 200A, 200B corresponding to the blade assembly from the vertical cleaning modules 109A, 109B using the corresponding vertical actuator of the blade assembly. At this point, the first substrate 200A is ready to be transported to one of the integrated cleaning and drying modules 110A, 110B on the left side of the housing. The substrate that was in the integrated cleaning and drying module 110A has been processed and has been extracted from the integrated cleaning and drying module using the first substrate carrier 103 in a moving manner shown by arrow 205. It will be understood that in some cleaning operations, some steps require longer time than other steps. Therefore, two integrated cleaning and drying modules are provided in the cleaning unit 106A to compensate for the additional time required to complete the cleaning and drying steps in the integrated cleaning and drying module.

[0148] In some configurations, two integrated cleaning and drying modules are provided in the cleaning unit 106A to allow a cleaning process to be performed on a substrate in one of the integrated cleaning and drying modules (such as the integrated cleaning and drying module 110A) and then a separate rinsing and drying process to be performed in a second integrated cleaning and drying module 110 (such as the integrated cleaning and drying module 110B). In one example, during a processing sequence, after being processed in the integrated cleaning and drying module 110A, the substrate is transferred to the integrated cleaning and drying module 110B by the first blade assembly 300 for further processing and then removed from the integrated cleaning and drying module 110B by the first substrate handler 103.

[0149] Fig.12I 200B have been moved horizontally to the left of the housing. In the case of substrate 200B, the second blade assembly 400 has been moved by its horizontal actuator 435B to a position slightly above the second vertical cleaning module 109B for insertion therein. In the case of substrate 200A, the first blade assembly 300 has been moved by its horizontal actuator 435A toward the integrated cleaning and drying modules 110A, 110B. In addition, the first blade actuator 350 has rotated the gripper assembly 360 and its substrate 200A to a horizontal position. Note that in Fig.12I In the embodiment, the device side of both substrates are arranged to face the left side of the housing. Fig.12J In the figure, the first substrate 200A has been completely in a horizontal position, device side facing up, and inserted into the integrated cleaning and drying module 110A by using the horizontal actuator 435A, and the movement of the module is shown by arrow 204. At the same time, the second substrate 200B has been inserted into the second vertical cleaning module 109B by using the vertical actuator 420 to move the second blade assembly 400 vertically. Fig.12JAlso shown in dashed lines is the first blade assembly 300 placing subsequent substrates in the second integrated cleaning and drying module 110B, which does so in each cycle, so each substrate is in the integrated cleaning and drying module twice as long as in other types of modules.

[0150] It is important to understand that because the first blade assembly is capable of manipulating the substrate in two different axes early in the process (i.e., manipulating the substrate between the horizontal pre-cleaning module 107 and the first vertical cleaning module 109A), the most critical transfer between the second vertical cleaning module 109B and the integrated cleaning and drying module 110 can be performed quickly with little manipulation in a small space, and the device side of the substrate is already oriented in the correct direction for insertion into the integrated cleaning and drying module 110A. Thus, exposing the substrate to damage from water spots caused by premature air drying and unwanted corrosion of materials (e.g., metals) on the substrate surface is greatly reduced. Figure 1A-1B and Figure 8 , where it can be appreciated that the distance "D" between the first cleaning module and the second cleaning module (such as the horizontal pre-cleaning module 107 and the integrated cleaning and drying module 110B) is only slightly greater than the total length "L" of the first blade assembly 300. In one embodiment, with the substrate 200 positioned between the blades 370, the distance between the first cleaning module and the second cleaning module is between 102% and 125% of the total length L of the first blade assembly 300, such as between about 102% and 110%, or even between about 104% and 106%. Figure 8 As shown, the total length L is defined as the distance from the farthest point on the edge of the substrate 200 to the farthest point on the opposite side of the first blade assembly 300, which is disposed between adjacent cleaning modules (such as the horizontal pre-cleaning module 107 and the integrated cleaning and drying module 110B). In one example, for the first blade assembly 300 configured to transfer a 300 mm substrate, the total length L is between about 500 mm and 550 mm. In a narrow space or area within the cleaning unit 106A, 106B, the cleaning unit 106A, 106B is required to perform a cleaning operation around the axis A1 ( Figure 8 ), the first blade assembly 300 can be configured to have a swept envelope length that is a fraction (e.g., between 0% and 5% larger, or between 0.5% and 3% larger) greater than the total length L. The swept envelope length is generally defined by the length of the outer extent of the swept volume of the rotating portion of the blade assembly 300 projected onto a plane that is parallel to the major surface of the substrate 200 (i.e., Figure 8 Since the thickness of the first blade assembly 300 is in a direction perpendicular to the plane measuring the swept envelope length (such as the XY plane in the figure) and includes the rotation axis (i.e., axis A1). Figure 8In the Z direction (in the Z direction), minimizing the swept envelope length helps ensure that when the first blade assembly 300 is rotated (such as a 90 degree rotation) during the transfer process, the various parts of the first blade assembly 300 will not collide with the various parts within the cleaning units 106A, 106B. In a configuration where the swept envelope length is greater than 0%, the distance between the first cleaning module and the second cleaning module can be configured as a percentage of the swept envelope length plus an additional percentage to reduce the chance of collision with the parts within the cleaning units 106A, 106B due to robotic or calibration errors. In one example, if it is advantageous to rotate the substrate at a position between the cleaning modules, the swept envelope length is 3% greater than the total length L, and the minimum spacing required to avoid collisions related to robotic or calibration errors is 102%, then the spacing between the modules can be set to 105% of the total length L. However, in order to minimize the footprint of the cleaning units 106A, 106B, it may be necessary to prevent the blade assembly from rotating in certain areas of the cleaning units 106A, 106B (e.g., between the first cleaning module and the second cleaning module), so that the spacing between the modules can be set to a value less than the sweep envelope length.

[0151] exist Figure 12K , the position of the components at the end of the cycle is shown. Each of the two integrated cleaning and drying modules 110A, 110B acts on a substrate 200 at the same time, while the second vertical cleaning module 109B acts on another substrate. At the same time, the first blade assembly 300 is ready to remove another substrate 200 from the horizontal pre-cleaning module 107 so that the substrate can be placed in the first vertical cleaning module 109A.

[0152] Fig.13A 1 shows a portion of the cleaning unit 106A, 106B, which includes four different types of cleaning chambers, which are configured to include a first cleaning module 107, two second cleaning modules 109, two third cleaning modules 110 and a fourth cleaning module 115. In some embodiments, as Fig.13A As shown, the fourth cleaning module 115 includes components configured to process substrates in a vertical orientation. During a cleaning process sequence performed in the cleaning system 106 (including the use of the fourth cleaning module 115), the process performed in the fourth cleaning module 115 (e.g., a non-contact cleaning process) is performed after the polishing and / or brush scrubbing process is performed in the second cleaning module 109 and before the rinsing and drying process is performed in the third cleaning module 110. Fig.13A As shown, the fourth cleaning module 115 may also be physically positioned between the second cleaning module 109 and the third cleaning module 110 , and the first cleaning module 107 may be positioned above the fourth cleaning module 115 .

[0153] Fig. 13B1 shows a portion of the cleaning units 106A, 106B, which includes five different types of cleaning chambers, which are configured to include a first cleaning module 107, two second cleaning modules 109, two third cleaning modules 110, a fourth cleaning module 115, and a fifth cleaning module 121. In some embodiments, as Fig. 13B As shown, the fifth cleaning module 121 includes components configured to process substrates in a vertical orientation. During a cleaning process sequence performed in the cleaning system 106 (including the use of the fifth cleaning module 121), the process performed in the fifth cleaning module 121 (e.g., a vertical vapor drying process) is performed after the polishing and / or brush scrubbing process is performed in the second cleaning module 109, after the cleaning process is performed in the fourth cleaning module 115, and / or before the drying process is performed in the third cleaning module 110. Fig. 13B As shown, the fifth cleaning module 121 may be physically positioned between the fourth cleaning module 115 and the third cleaning module 110 , and the first cleaning module 107 may be positioned above the fourth cleaning module 115 .

[0154] The fifth cleaning module 121 may include a first horizontally oriented spray bar (not shown) positioned above and to one side of the vertically oriented substrate and positioned on a support within the fifth cleaning chamber 121. The first horizontally oriented spray bar is adapted to spray a rinsing fluid (such as deionized water (with or without a cleaning agent such as a surfactant)) on a major surface of the vertically oriented substrate when a robotic element (not shown) coupled to the fifth cleaning module lifts the substrate from the housing. In one configuration, delivery of the rinsing fluid is provided such that a meniscus is formed on the surface of the substrate when the substrate is lifted from the housing by the robotic element. In another configuration, the fifth cleaning module 121 includes a deionized water bath in which the substrate is immersed such that a meniscus is formed on the surface of the substrate when the robotic element lifts the substrate from the housing. A second horizontally oriented spray bar (not shown) that may be positioned vertically above the first horizontally oriented spray bar is adapted to also direct drying vapor (e.g., isopropyl alcohol (IPA) vapor) toward the major surface of the substrate and the meniscus of the rinse fluid to utilize the Marangoni effect to dry the substrate while the robotic element is lifting the substrate from the chamber. The blade assembly 300 or the first substrate handler 103 may then retrieve the dried substrate from the robotic element and then transfer the substrate to a desired location within the FOUP.

[0155] Fig. 13C According to one or more embodiments Figure 1A A schematic top view of an alternative version of CMP processing system 100 is shown. Fig. 13C1 and 106B are shown in FIG. 1 , and the configurations of the cleaning units are different, such that each cleaning unit includes a different type and a different number of cleaning chambers. In one embodiment, the cleaning unit 106A includes a cleaning unit configuration that is similar to that described with respect to FIG. Figure 4 and Figures 12A-12K Similar to the configuration illustrated and discussed above, the configuration is generally configured to include one first cleaning module 107, two second cleaning modules 109, and two third cleaning modules 110. However, in other embodiments, the cleaning unit 106A may include the same Fig.13A The cleaning unit configuration is similar to that described and discussed, and is configured to include one or more first cleaning modules 107 , two or more second cleaning modules 109 , two or more third cleaning modules 110 , and one or more fourth cleaning modules 115 .

[0156] like Fig. 13C As shown, in one embodiment, the configuration of the cleaning unit 106B is different from that of the cleaning unit 106A and includes one or more first cleaning modules 107, two or more second cleaning modules 109 and one or more fifth cleaning modules 121, while the configuration of the cleaning unit 106A is as shown in FIG. Figure 4 , Figures 12A-12K or Fig.13A However, in other embodiments, the cleaning unit 106B may include Fig. 13B 106B may include a cleaning unit configuration similar to the configuration shown in FIG. 106A and may be configured to include one or more first cleaning modules 107, two or more second cleaning modules 109, one or more third cleaning modules 110, one or more fourth cleaning modules 115, and one or more fifth cleaning modules 121. In other embodiments, the cleaning unit 106B may include a cleaning unit configuration including one or more first cleaning modules 107, two or more second cleaning modules 109, one or more fourth cleaning modules 115, and one or more fifth cleaning modules 121. In other embodiments, the cleaning unit 106B may include a cleaning unit configuration including one or more first cleaning modules 107, two or more second cleaning modules 109, and one or more fifth cleaning modules 121.

[0157] As described in the foregoing description and corresponding figures, the present embodiments provide a space-saving apparatus and method for moving substrates through the housing of a cleaning chamber, wherein each substrate is moved through two degrees of rotation, with a reduced amount of space and airtime, particularly in the critical late steps of the cleaning process.

[0158] In the embodiment herein, the operation of the CMP processing system 100 (including the third substrate handler 108) is controlled by the system controller 160 ( Figure 1B ) boot. According to one embodiment, the system controller 160 can be located in the gas supply and exhaust section 112. The system controller 160 includes a programmable central processing unit (CPU) 161, which can operate with a memory 162 (e.g., non-volatile memory) and support circuits 163. The support circuits 163 are conventionally coupled to the CPU 161 and include caches, clock circuits, input / output subsystems, power supplies, etc. and combinations thereof, which are coupled to various components of the CMP processing system 100 to facilitate control of these components. The CPU 161 is one of any form of general-purpose computer processor (e.g., a programmable logic controller (PLC)) used in an industrial environment to control various components and sub-processors of a processing system. The memory 162 coupled to the CPU 161 is non-transitory and is typically one or more of readily available memories, such as random access memory (RAM), read-only memory (ROM), a floppy disk drive, a hard disk, or any other form of local or remote digital storage.

[0159] Typically, the memory 162 is in the form of a non-transitory computer-readable storage medium (e.g., non-volatile memory) containing instructions that, when executed by the CPU 161, facilitate the operation of the CMP processing system 100. The instructions in the memory 162 are in the form of a program product, such as a program that implements the methods of the present disclosure. The program code may conform to any of a variety of different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program of the program product defines the functions of the embodiments (including the methods described herein).

[0160] Illustrative non-transitory computer-readable storage media include, but are not limited to: (i) non-writable storage media that can permanently store information (e.g., a read-only memory device within a computer, such as a CD-ROM disk readable by a CD-ROM drive, a flash memory, a ROM chip, or any type of solid-state non-volatile semiconductor memory device, such as a solid-state hard drive (SSD)); and (ii) a writable storage medium that stores modifiable information (e.g., a floppy disk within a floppy disk drive, a hard drive, or any type of solid-state random access semiconductor memory). Computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are embodiments of the present disclosure. In some embodiments, the methods described herein, or portions thereof, are performed by one or more application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other types of hardware implementations. In some other embodiments, the substrate processing and / or handling methods described herein are performed by a combination of software routines, ASICs, FPGAs, and / or other types of hardware implementations. One or more system controllers 160 can be used with one or any combination of the various modular polishing systems described herein and / or with their individual polishing chambers.

[0161] The system controller 160 controls the activities and operating parameters of the automated components in the CMP processing system 100. Typically, most of the movement of the substrate through the processing system is performed using commands issued by the system controller 160 using various automated devices disclosed herein. In some embodiments, the system controller 160 is a general purpose computer for controlling one or more components in the CMP processing system 100. The system controller 160 is generally designed to facilitate the control and automation of one or more processing sequences disclosed herein using a CPU 161, a memory 162, and supporting circuits (or I / O). Software instructions and data may be encoded and stored in a memory (e.g., a non-transitory computer readable medium) for instructing the CPU 161. A program (or computer instructions) that can be read by a processing unit within the system controller determines which tasks can be performed in the processing system. For example, the non-transitory computer readable medium includes a program that, when executed by the processing unit, is configured to perform one or more methods described herein. Preferably, the program includes code for performing tasks associated with monitoring, performing and controlling the movement, support and / or positioning of the substrate, as well as the various process recipe tasks and various cleaning module process recipe steps being performed. Process sequence example

[0162] Figures 14A-14DThe diagram illustrates examples of four different substrate processing sequences that may be performed in the CMP processing system 100 using the system controller 160 and other supporting components within the CMP processing system 100 . Figures 14A-14D The diagram shows that Figure 1A Different substrate processing sequences are shown as being performed in a CMP processing system, but this example CMP processing system configuration is not intended to limit the scope of the disclosure provided herein.

[0163] Fig.14A The figure shows two substrate processing sequences 1400A and 1400B that can be performed in parallel in each of the cleaning units 106A, 106B using the first substrate handler 103, the second substrate handler 104, and the third substrate handler 108. In one embodiment, the substrate processing sequences 1400A and 1400B include the same processing sequence steps that are performed in parallel on opposite sides of the cleaning system 106. Thus, in one example, Fig.14A The process sequence 1400A shown in FIG. 14 begins with the first substrate handler 103 removing the substrate 200 from the loading station 102A and positioning the substrate on the cleaner channel 102B, as shown in path 1401. Then, the second substrate handler 104 transfers the substrate 200 from the cleaner channel 102B to the transfer station 105A of the polishing station 105, as shown in path 1402. After the substrate is processed in one or more polishing modules (not shown) in the polishing station 105, the substrate is placed again in the transfer station 105A. The processes performed in the polishing station 105 may include one or more CMP polishing processes that are configured to remove and planarize at least a portion of the material on the surface of the substrate. Then, the second substrate handler 104 transfers the substrate 200 from the transfer station 105A to the first cleaning module 107, as shown in path 1403. However, in the case where the first cleaning module 107 has been replaced by the horizontal input module 117 or the vertical input module 119, the second substrate handler 104 will transfer the substrate 200 from the transfer station 105A to the horizontal input module 117 or the vertical input module 119. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules within the cleaning units 106A, 106B, as shown by the path 1404. For example, the substrate cleaning process sequence performed along the path 1404 may include one or more of the process path steps 14041, 14042, 14043, and 14044, which require the use of the blade assemblies 300 and 400 to transfer the substrate between one or more second cleaning modules 109, one or more third cleaning modules 110, and / or one or more fourth cleaning modules 115. In one example, as described above with respect to Figure 12A-12JAs described, the substrate cleaning process sequence performed along the path 1404 includes a process sequence, and the process sequence includes three process path steps 14041, 14042, and 14044, which include performing cleaning processes in a first cleaning module 107, two second cleaning modules, and a third cleaning module 110. In this example, the first process path step 14041 includes the first blade assembly 300 transferring the substrate from the first cleaning module 107 to the first second cleaning module 109, the second process path step 14042 includes the second blade assembly 400 transferring the substrate from the first second cleaning module 109 to the second second cleaning module 109, and the fourth process path step 14044 includes the first blade assembly 300 transferring the substrate from the second second cleaning module 109 to the third cleaning module 110. In this example, the third process path step 14043 is not included in the substrate processing sequence because the substrate processing sequence does not include the use of the fourth cleaning module 115, which generally performs a cleaning process between the cleaning processes performed by the second cleaning modules 109 and the third cleaning modules 110. As shown in path 1405, after the process is performed in path 1404, the first substrate handler 103 then removes the substrate 200 from the third cleaning module 110 and positions the substrate in the loading station 102A. As described above, while the process sequence 1400A is being sequentially performed on multiple substrates, the process sequence 1400B can also be sequentially performed on different multiple substrates at the same time.

[0164] Fig. 14B 106A, 106B using the first substrate handler 103, the second substrate handler 104, and the third substrate handler 108. In one embodiment, the substrate processing sequence 1410 is performed in parallel on opposite sides of the cleaning system 106. In one example, Fig. 14BThe process sequence 1410 shown begins with the first substrate handler 103 removing the substrate 200 from the loading station 102A and positioning the substrate in the third cleaning module 110 so that a cleaning process can be performed on the input substrate, as shown in path 1411. After performing the cleaning process on the substrate, the first substrate handler 103 removes the substrate from the third cleaning module 110 and positions the substrate on the cleaner lane 102B, as shown in path 1412. Then, the second substrate handler 104 transfers the substrate 200 from the cleaner lane 102B to the transfer station 105A of the polishing station 105, as shown in path 1413. After the substrate is processed in one or more polishing modules (not shown) within the polishing station 105, the substrate is placed again in the transfer station 105A. Then, the second substrate handler 104 transfers the substrate 200 from the transfer station 105A to the first cleaning module 107, as shown in path 1414. However, in the case where the first cleaning module 107 has been replaced by the horizontal input module 117 or the vertical input module 119, the second substrate handler 104 will transfer the substrate 200 from the transfer station 105A to the horizontal input module 117 or the vertical input module 119. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117 or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules within the cleaning units 106A, 106B, as shown by the path 1415. For example, as described above, the substrate cleaning process sequence performed along the path 1415 may include one or more of the process path steps 14151, 14152, 14153 and 14154, which require the use of the blade assemblies 300 and 400 to transfer the substrate between the one or more second cleaning modules 109, the one or more third cleaning modules 110 and / or the one or more fourth cleaning modules 115. As shown in path 1416, after performing one or more processes in path 1415, the first substrate handler 103 then removes the substrate 200 from the third cleaning module 110 and positions the substrate in the loading station 102A. As described above, while the process sequence 1410 is being sequentially performed on multiple substrates in the cleaning unit 106A, the process sequence 1410 can also be sequentially performed on different multiple substrates in the cleaning unit 106B at the same time.

[0165] Fig. 14C The figure shows a substrate processing sequence 1420 that can be performed in either cleaning unit 106A, 106B using the first substrate handler 103, the second substrate handler 104, and the third substrate handler 108. Fig. 14C In one embodiment, substrate processing sequence 1420 is performed in parallel on opposite sides of cleaning system 106. However, in some cases, such as Fig. 14CAs shown, the processing sequence can utilize both cleaning units 106A, 106B to perform different portions of the substrate processing sequence 1420. In one example, Fig. 14CThe process sequence 1420 shown begins with the first substrate handler 103 removing the substrate 200 from the loading station 102A and positioning the substrate on the cleaner lane 102B, as shown by path 1421. Then, as shown by path 1422, the second substrate handler 104 transfers the substrate from the cleaner lane 102B to the first cleaning module 107 in the cleaning unit 106A. However, in the case where the first cleaning module 107 has been replaced by the horizontal input module 117 or the vertical input module 119, the second substrate handler 104 will transfer the substrate 200 from the cleaner lane 102B to the horizontal input module 117 or the vertical input module 119. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules within the cleaning units 106A, 106B, as shown by path 1423. For example, as described above, the substrate cleaning process sequence performed along the path 1423 may include one or more of the process path steps 14231, 14232, 14233, and 14234, which require the use of blade assemblies 300 and 400 to transfer substrates between one or more second cleaning modules 109, one or more third cleaning modules 110, and / or one or more fourth cleaning modules 115. As shown in path 1424, after performing one or more processes within the path 1423, the first substrate handler 103 then removes the substrate 200 from the third cleaning module 110 and positions the substrate in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119. Then, the second substrate handler 104 transfers the substrate 200 from the first cleaning module 107, the horizontal input module 117, or the vertical input module 119 to the transfer station 105A of the polishing station 105, as shown in path 1425. After the substrate is processed in one or more polishing modules (not shown) within the polishing station 105, the substrate is placed again in the transfer station 105A. Then, as shown by path 1426, the second substrate handler 104 transfers the substrate from the transfer station 105A to the first cleaning module 107 in the cleaning unit 106B. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules within the cleaning units 106A, 106B, as shown by path 1427. For example, as similarly discussed above, the substrate cleaning process sequence performed along the path 1427 may include one or more of the process path steps 14271, 14272, 14273, and 14274, which require the use of the blade assemblies 300 and 400 to transfer the substrate between the one or more second cleaning modules 109, the one or more third cleaning modules 110, and / or the one or more fourth cleaning modules 115.As shown in path 1428, after the process is performed in path 1427, the first substrate handler 103 then removes the substrate 200 from the third cleaning module 110 and positions the substrate in the loading station 102A. As described above, while the process sequence 1410 is being sequentially performed on a plurality of substrates in the cleaning unit 106A, the process sequence 1410 may also be sequentially performed on a plurality of different substrates in the cleaning unit 106B at the same time.

[0166] Fig.14D The figure shows a substrate processing sequence 1430 that can be performed in either cleaning unit 106A, 106B using the first substrate handler 103, the second substrate handler 104, and the third substrate handler 108. Fig.14D In one embodiment, substrate processing sequence 1430 is performed in parallel on opposite sides of cleaning system 106. However, in some cases, such as Fig.14D As shown, the processing sequence can utilize both cleaning units 106A, 106B to perform different portions of the substrate processing sequence 1430. In one example, Fig.14DThe process sequence 1430 shown begins with the first substrate handler 103 removing a substrate from the loading station 102A and positioning the substrate in the third cleaning module 110, as shown by path 1431. Then, as shown by path 1432, the third substrate handler 108 transfers the substrate through the cleaning modules in the cleaning cells 106A, 106B to the first cleaning module 107 in the cleaning cell 106A. However, in the case where the first cleaning module 107 has been replaced by the horizontal input module 117 or the vertical input module 119, the third substrate handler 108 then transfers the substrate from the third cleaning module 110 through the cleaning modules to the horizontal input module 117 or the vertical input module 119. Then, the second substrate handler 104 transfers the substrate from the first cleaning module 107, the horizontal input module 117 or the vertical input module 119 to the transfer station 105A of the polishing station 105, as shown by path 1433. After the substrate is processed in one or more polishing modules (not shown) in the polishing station 105, the substrate is placed again in the transfer station 105A. Then, as shown by path 1434, the second substrate handler 104 transfers the substrate from the transfer station 105A to the first cleaning module 107 in the cleaning unit 106B. After the cleaning process is performed in the first cleaning module 107, the horizontal input module 117, or the vertical input module 119, the third substrate handler 108 then transfers the substrate through the cleaning modules in the cleaning units 106A, 106B, as shown by path 1435. For example, as similarly discussed above, the substrate cleaning process sequence performed along the path 1435 may include one or more of the process path steps 14351, 14352, 14353, and 14354, which require the use of the blade assemblies 300 and 400 to transfer the substrate between the one or more second cleaning modules 109, the one or more third cleaning modules 110, and / or the one or more fourth cleaning modules 115. As shown by path 1436 , after performing the process in path 1435 , the first substrate handler 103 then removes the substrate from the third cleaning module 110 and positions the substrate in the loading station 102A.

[0167] In some embodiments of any process sequence disclosed herein, the substrate process sequence may include performing a cleaning process (e.g., a vertical vapor drying process) in the fifth cleaning module 121 before performing a cleaning process in the third cleaning module 110, but after performing a cleaning process in one or more second cleaning modules 109, or after one or more fourth cleaning modules 115 (if present). In some other embodiments, the substrate process sequence may include performing a cleaning process (e.g., a vertical vapor drying process) in the fifth cleaning module 121 as the last step of the process sequence, and thus after performing a cleaning process in one or more second cleaning modules 109, or after one or more fourth cleaning modules 115 (if present).

[0168] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope of the disclosure is determined by the claims that follow.

Claims

1. A substrate cleaning system, comprising: a first substrate cleaning unit; as well as a first substrate carrier disposed between the first substrate cleaning units and configured to transfer a substrate from the polishing system to the first substrate cleaning unit, The first substrate cleaning unit comprises: a first cleaning chamber configured to receive the substrate from the first substrate handler and perform a first cleaning process on the substrate with the substrate in a horizontal orientation; a second cleaning chamber configured to perform a second cleaning process on the substrate with the substrate in a vertical orientation; a third cleaning chamber configured to perform a third cleaning process on the substrate with the substrate in the vertical orientation; a fourth cleaning chamber configured to perform a fourth cleaning process on the substrate in the horizontal orientation; and The second substrate handler is configured to transfer the substrate from the first cleaning chamber to the second cleaning chamber, from the second cleaning chamber to the third cleaning chamber, and from the third cleaning chamber to the fourth cleaning chamber.

2. The substrate cleaning system of claim 1, further comprising: a second substrate cleaning unit, The first substrate cleaning unit and the second substrate cleaning unit each further include: A fifth cleaning chamber is configured to perform a fifth cleaning process on the substrate in the horizontal orientation, wherein the fourth cleaning chamber and the fifth cleaning chamber each include an integrated cleaning and drying module.

3. The substrate cleaning system of claim 2, further comprising: a first gas inlet box configured to deliver process gas to the fourth cleaning chamber; The second gas inlet box is configured to deliver the process gas to the fifth cleaning chamber.

4. The substrate cleaning system of claim 2, wherein for each of the first substrate cleaning unit and the second substrate cleaning unit, a corresponding second substrate handler is configured to transfer the substrate from a corresponding third cleaning chamber to a selected one of a corresponding fourth cleaning chamber and a fifth cleaning chamber.

5. The substrate cleaning system of claim 2, wherein for each of the first substrate cleaning unit and the second substrate cleaning unit, the corresponding integrated cleaning and drying module of the fourth cleaning chamber is vertically positioned below the corresponding integrated cleaning and drying module of the fifth cleaning chamber. 6 . The substrate cleaning system of claim 2 , wherein the second cleaning chamber or the third cleaning chamber is positioned below the first cleaning chamber in a vertical direction.

7. The substrate cleaning system of claim 1 , wherein the second substrate handler further comprises: Substrate handling equipment, including: The first blade assembly comprises: a gripping assembly including a pair of gripping blades, wherein the gripping blades are configured to secure a substrate at an edge of the substrate using a gripping actuator; a first blade actuator for rotating the gripper assembly and the secured substrate about a first axis, wherein the first axis is substantially parallel to a front side of the substrate at which the substrate is held; and A second blade actuator is used to rotate the gripper assembly and the first blade actuator about a second axis.

8. The substrate cleaning system of claim 7, wherein: When the first axis is oriented perpendicular to the first side of the first cleaning chamber and the first side of the fourth cleaning chamber, the distance between the first side of the first cleaning chamber and the first side of the fourth cleaning chamber is between 102% and 150% of the total length of the gripping assembly and the secured substrate.

9. The substrate cleaning system of claim 7, wherein the second substrate handler further comprises: a first vertical actuator assembly comprising a first vertical track and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical track and is configured to be positioned along the first vertical track by the first vertical actuator; as well as a horizontal actuator assembly comprising a horizontal track and a first track actuator, wherein the first vertical actuator assembly is coupled to a first portion of the horizontal track and is configured to be positioned along the horizontal track by the first track actuator, Wherein the horizontal actuator assembly of the second substrate handler, the first vertical actuator, and the second vertical actuator are positioned at an outer edge of the substrate cleaning system.

10. The substrate cleaning system of claim 9, wherein the second substrate handler further comprises: The second blade assembly comprises: a gripping assembly comprising a pair of gripping blades and a gripping actuator, wherein the gripping blades are configured to secure a substrate at an edge of the substrate by using the gripping actuator; and a second vertical actuator assembly comprising a second vertical track and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical track and is configured to be positioned along the second vertical track by the second vertical actuator, Wherein the second vertical actuator assembly is coupled to a second portion of the horizontal track and is configured to be positioned along the horizontal track by a second track actuator.

11. A substrate cleaning system, comprising: a first cleaning chamber configured to perform a first cleaning process on a substrate with the substrate in a horizontal orientation; a second cleaning chamber configured to perform a second cleaning process on the substrate with the substrate in a vertical orientation; a third cleaning chamber configured to perform a third cleaning process on the substrate with the substrate in the vertical orientation; a fourth cleaning chamber configured to perform a fourth cleaning process on the substrate in the horizontal orientation; as well as a substrate handler configured to transfer the substrate from the first clean chamber to the second clean chamber, from the second clean chamber to the third clean chamber, and from the third clean chamber to the fourth clean chamber; The second cleaning chamber or the third cleaning chamber is located below the first cleaning chamber in a vertical direction.

12. The substrate cleaning system of claim 11, further comprising: A fifth cleaning chamber is configured to perform the fourth cleaning process on the substrate in the horizontal orientation, wherein the fourth cleaning chamber and the fifth cleaning chamber each include an integrated cleaning and drying module. 13 . The substrate cleaning system of claim 12 , wherein the substrate handler is configured to transfer the substrate from the third cleaning chamber to a selected one of the fourth cleaning chamber or the fifth cleaning chamber. 14 . The substrate cleaning system of claim 12 , wherein the fourth cleaning chamber is positioned vertically above the fifth cleaning chamber.

15. The substrate cleaning system of claim 11, wherein the substrate handler further comprises: Substrate handling equipment, including: The first blade assembly comprises: a gripping assembly including a pair of gripping blades, wherein the gripping blades are configured to secure a substrate at an edge of the substrate using a gripping actuator; a first blade actuator for rotating the gripper assembly and the secured substrate about a first axis, wherein the first axis is substantially parallel to a front side of the substrate at which the substrate is held; and A second blade actuator is used to rotate the gripper assembly and the first blade actuator about a second axis.

16. The substrate cleaning system of claim 11, wherein: When the first axis is oriented perpendicular to the first side of the first cleaning chamber and the first side of the fourth cleaning chamber, the distance between the first side of the first cleaning chamber and the first side of the fourth cleaning chamber is between 102% and 150% of the total length of the gripping assembly and the secured substrate.

17. The substrate cleaning system of claim 11, wherein the substrate handler further comprises: a first vertical actuator assembly comprising a first vertical track and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical track and is configured to be positioned along the first vertical track by the first vertical actuator; as well as a horizontal actuator assembly comprising a horizontal track and a first track actuator, wherein the first vertical actuator assembly is coupled to a first portion of the horizontal track and is configured to be positioned along the horizontal track by the first track actuator, Wherein the horizontal actuator assembly and the first vertical actuator are positioned at an outer edge of the substrate cleaning system.

18. The substrate cleaning system of claim 17, wherein the substrate handler further comprises: The second blade assembly comprises: a gripping assembly comprising a pair of gripping blades and a gripping actuator, wherein the gripping blades are configured to secure a substrate at an edge of the substrate by using the gripping actuator; and a second vertical actuator assembly comprising a second vertical track and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical track and is configured to be positioned along the second vertical track by the second vertical actuator, Wherein the second vertical actuator assembly is coupled to a second portion of the horizontal track and is configured to be positioned along the horizontal track by a second track actuator.

19. The substrate cleaning system of claim 17, further comprising: a fifth cleaning chamber configured to perform the fourth cleaning process on the substrate in the horizontal orientation, wherein the fourth cleaning chamber and the fifth cleaning chamber each include an integrated cleaning and drying module; a first gas inlet box configured to deliver process gas to the fourth cleaning chamber; as well as a second gas inlet box configured to deliver process gas to the fifth cleaning chamber, The fourth cleaning chamber is located above the fifth cleaning chamber in a vertical direction.

20. The substrate cleaning system of claim 19, wherein the substrate handler further comprises: The second blade assembly comprises: a gripping assembly comprising a pair of gripping blades and a gripping actuator, wherein the gripping blades are configured to secure a substrate at an edge of the substrate by using the gripping actuator; and a second vertical actuator assembly comprising a second vertical track and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical track and is configured to be positioned along the second vertical track by the second vertical actuator, Wherein the second vertical actuator assembly is coupled to a second portion of the horizontal track and is configured to be positioned along the horizontal track by a second track actuator.

21. A substrate handling device, comprising: The first blade assembly comprises: a gripper assembly including a pair of gripper blades and a gripper actuator, wherein the gripper actuator is configured to cause a substrate to be secured between the pair of gripper blades during a first transfer process; a first blade actuator for rotating the gripper assembly about a first axis; and a second blade actuator configured to rotate the gripper assembly about a second axis, wherein the second axis is substantially parallel to the front surface of the substrate, wherein rotation of the second blade actuator and the gripper assembly is caused by rotation of the first blade actuator about the first axis, and rotation of the gripper assembly is caused by rotation of the second blade actuator about the second axis; a first vertical actuator assembly comprising a first vertical track and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical track and is configured to be positioned along the first vertical track by the first vertical actuator; and A horizontal actuator assembly includes a horizontal track and a first track actuator, wherein the first vertical actuator assembly is coupled to a first portion of the horizontal track and is configured to be positioned along the horizontal track by the first track actuator.

22. The substrate handling apparatus of claim 21, further comprising: The second blade assembly comprises: a gripper assembly comprising a pair of gripper blades and a gripper actuator, wherein the gripper actuator is configured to cause the substrate to be secured between the pair of gripper blades during a second transfer process; and a second vertical actuator assembly comprising a second vertical track and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical track and is configured to be positioned along the second vertical track by the second vertical actuator, Wherein the second vertical actuator assembly is coupled to a second portion of the horizontal track and is configured to be positioned along the horizontal track by a second track actuator.

23. The substrate handling apparatus of claim 22, wherein the gripping assembly of the second blade assembly is configured to secure the substrate between the pair of gripping blades in a vertical orientation.

24. The substrate handling apparatus of claim 22, wherein both the first blade assembly and the second blade assembly are independently movable along the horizontal track using the first track actuator and the second track actuator, respectively.

25. The substrate handling apparatus of claim 22, wherein the first blade assembly further comprises an optical device for determining a position of the pair of gripper blades relative to the substrate.

26. The substrate handling apparatus of claim 22, further comprising: A processor and a non-transitory computer readable medium having instructions for performing a method comprising: translating a substrate held by the first blade assembly from a processing region of a first cleaning module, wherein the substrate held by the first blade assembly is oriented in a horizontal orientation with a device side of the substrate facing upward; rotating the base plate and the first blade assembly from the horizontal orientation to a vertical orientation using the first blade actuator of the first blade assembly; rotating the substrate and the first blade assembly using the second blade actuator of the first blade assembly while the substrate is positioned in the vertical orientation, thereby causing the device side of the substrate to face in an opposite direction; translating the vertically oriented substrate and the first blade assembly along the horizontal track to a position above a second cleaning module using a first track actuator; inserting the substrate into a processing region of the second cleaning module using the first vertical actuator; using the first track actuator to translate the first blade assembly along the horizontal track to a third cleaning module; transferring the substrate from the second cleaning module to the third cleaning module using the second blade assembly and the second track actuator; retrieving the substrate from a processing area of ​​the third cleaning module using the first blade assembly and the first vertical actuator; rotating the substrate and the first blade assembly from the vertical orientation to a horizontal orientation using the first blade actuator of the first blade assembly, wherein the horizontally oriented substrate is oriented with the device side facing upward; and The substrate and the first blade assembly are inserted into a processing area of ​​a fourth cleaning module using the first track actuator.

27. The substrate handling apparatus of claim 21, wherein: the first blade actuator of the first blade assembly comprising a first actuator motor coupled to a first drive gear and a first offset gear, wherein the first actuator motor is configured to rotate the first drive gear, which causes the first offset gear to rotate about the first axis and causes the rotation of the second blade actuator and the first gripper assembly, and The second blade actuator of the second blade assembly includes a second actuator motor coupled to a second drive gear and a second offset gear, wherein the second actuator motor is configured to rotate the second drive gear, which causes the second offset gear to rotate about the second axis and causes the rotation of the first gripper assembly.

28. The substrate handling apparatus of claim 27, further comprising a plurality of electrical cables and / or pneumatic conduits associated with at least one of the second blade actuator and the gripper actuator to pass through an opening formed in the second offset gear.

29. The substrate handling apparatus of claim 21, wherein the horizontal actuator assembly, the first vertical actuator, and the second vertical actuator of the substrate handling apparatus are positioned at an outer edge of a cleaning system disposed within a chemical mechanical polishing system.

30. A substrate handling device comprising: a gripper assembly including a pair of gripper blades operable by a gripper actuator to secure a substrate at its edges; a first blade actuator for rotating the gripper assembly and the substrate about a first axis, wherein the first axis is substantially parallel to a front side of the substrate at which the substrate is held; a second blade actuator for rotating the gripper assembly and the first blade actuator about a second axis; A first cleaning module having a first side; as well as A second cleaning module having a first side, in: The gripping assembly is disposed between the first side of the first cleaning module and the first side of the second cleaning module, and When the first axis is oriented perpendicular to the first side of the first cleaning module and the first side of the second cleaning module, the distance between the first side of the first cleaning module and the first side of the second cleaning module is between 102% and 150% of the total length of the gripping assembly and the secured substrate.

31. The substrate handling apparatus of claim 30, further comprising: Horizontal track; a first blade assembly, wherein the first blade assembly includes the gripper assembly; a first vertical actuator assembly comprising a first vertical track and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical track and is configured to be positioned along the first vertical track by the first vertical actuator; The second blade assembly comprises: a gripper assembly comprising a pair of gripper blades and a gripper actuator, wherein the gripper actuator is configured to cause the substrate to be secured between the pair of gripper blades during a second transfer process; and a second vertical actuator assembly comprising a second vertical track and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical track and is configured to be positioned along the second vertical track by the second vertical actuator, in: The first vertical actuator assembly is coupled to a first portion of the horizontal track and is configured to be positioned along the horizontal track by a first track actuator, and The second vertical actuator assembly is coupled to a second portion of the horizontal track and is configured to be positioned along the horizontal track by a second track actuator.

32. The substrate handling apparatus of claim 31 , wherein the gripping assembly of the second blade assembly is configured to secure the substrate between the pair of gripping blades in a vertical orientation.

33. The substrate handling apparatus of claim 32, wherein the first blade assembly further comprises an optical device for determining a position of the pair of gripper blades relative to the substrate.

34. The substrate handling apparatus of claim 31, wherein both the first blade assembly and the second blade assembly are independently movable along the horizontal track using the first track actuator and the second track actuator, respectively.

35. The substrate handling apparatus of claim 30, wherein: The first blade assembly further includes a first actuator motor coupled to a first drive gear and a first offset gear, wherein the first actuator motor is configured to rotate the first drive gear, thereby causing the first offset gear to rotate about the first axis and causing the rotation of the second blade actuator and the gripper assembly, and The second blade actuator includes a second actuator motor coupled to a second drive gear and a second offset gear, wherein the second actuator motor is configured to rotate the second drive gear, thereby causing the second offset gear to rotate about the second axis and causing the rotation of the gripper assembly.

36. The substrate handling apparatus of claim 35, further comprising a plurality of electrical cables and / or pneumatic conduits associated with at least one of the second blade actuator and the gripper actuator to pass through an opening formed in the second offset gear.

37. A substrate handling device comprising: The first blade assembly comprises: a gripper assembly including a pair of gripper blades and a gripper actuator, wherein the gripper actuator is configured to cause a substrate to be secured between the pair of gripper blades during a first transfer process; a first blade actuator for rotating the gripper assembly about a first axis, wherein rotating the gripper assembly about the first axis is configured to cause the substrate to rotate between a horizontal orientation and a vertical orientation during the first transfer process; and a second blade actuator configured to rotate the gripper assembly about a second axis, wherein the second axis is substantially parallel to the front surface of the substrate, and rotating the gripper assembly about the second axis is configured to cause the front surface of the substrate to face in an opposite direction during the first transfer process, wherein rotation of the second blade actuator and the gripper assembly is caused by rotation of the first blade actuator about the first axis, and rotation of the gripper assembly is caused by rotation of the second blade actuator about the second axis; a first vertical actuator assembly comprising a first vertical track and a first vertical actuator, wherein the first blade assembly is coupled to a portion of the first vertical track and is configured to be positioned along the first vertical track by the first vertical actuator; The second blade assembly comprises: a gripper assembly comprising a pair of gripper blades and a gripper actuator, wherein the gripper actuator is configured to cause the substrate to be secured between the pair of gripper blades during a second transfer process; and a second vertical actuator assembly comprising a second vertical track and a second vertical actuator, wherein the second blade assembly is coupled to a portion of the second vertical track and is configured to be positioned along the second vertical track by the second vertical actuator, A horizontal actuator assembly comprising: Horizontal track; a first horizontal track actuator; and The second horizontal track actuator, in: The first vertical actuator assembly is coupled to a first portion of the horizontal track and is configured to be positioned along the horizontal track by the first horizontal track actuator, and The second vertical actuator assembly is coupled to a second portion of the horizontal track and is configured to be positioned along the horizontal track by the second horizontal track actuator.

38. The substrate handling apparatus of claim 36, wherein the first blade assembly further comprises an optical device for determining a position of the pair of gripper blades relative to the substrate.

39. The substrate handling apparatus of claim 36, wherein both the first blade assembly and the second blade assembly are independently movable along the horizontal track using the first horizontal track actuator and the second horizontal track actuator, respectively.

40. The substrate handling apparatus of claim 36, wherein the horizontal actuator assembly, the first vertical actuator, and the second vertical actuator of the substrate handling apparatus are positioned at an outer edge of a cleaning system disposed within a chemical mechanical polishing system.

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