Color conversion layer for display device and method of forming display device

Abstract

A color conversion array for a multi-color display is provided herein. The color conversion array includes: a plurality of features, each feature having a base and a distal end; and a plurality of wells. Each well is defined within one or more of the plurality of features. A first color conversion layer is disposed within a first well of the plurality of wells to convert the first illumination into light of a first color. A second color conversion layer is disposed within a second well of the plurality of wells to convert the second illumination into light of a second color. The first major surface or the second major surface of the array is configured to be coupled to a backplane.

Description

Technical Field

[0001] Embodiments of the present disclosure are generally directed to a color conversion layer for a display device and a method of forming a display device. Background Art

[0002] Light emitting diode (LED) panels use an array of LEDs, where individual LEDs provide individually controllable pixel elements. Such LED panels can be used in computers, touch panel devices, personal digital assistants (PDAs), mobile phones, TV monitors, AR / VR displays, etc. LED panels using micron-sized LEDs based on III-V semiconductor technology (also known as micro-LEDs) will have multiple advantages over OLEDs, such as higher energy efficiency, brightness and lifetime, as well as fewer material layers in the display stack, which can simplify manufacturing. However, the manufacturing of micro-LED panels also faces challenges. Micro-LEDs with different color emissions (for example, red, green, and blue pixels) need to be manufactured on different substrates through separate processes.

[0003] Bottom-up integration of color conversion layers based on color emitting materials, such as quantum dots for advanced micro-LED (e.g., light emitting diode) displays, presents challenges. First, it is difficult to achieve sub-pixel isolation to ensure little to essentially no color emission crosstalk. Minimizing crosstalk becomes more difficult as display pixels per inch (PPI) get higher, such as approaching single-digit micron length scales. Second, it is difficult to achieve high-yield selective deposition of color emitting materials. Third, fabricating sub-pixel isolation structures directly to the backplane includes multiple detail operations that can result in low yields.

[0004] Therefore, there is a need for processes for efficiently manufacturing high PPI devices with minimized color crosstalk. Summary of the invention

[0005] In some embodiments, a color conversion array for a multicolor display is provided. The color conversion array includes: a plurality of features, each feature having a base and a distal end; and a plurality of wells. Each well is defined within one or more of the plurality of features. A first color conversion layer is disposed within a first well of the plurality of wells to convert a first illumination into light of a first color. A second color conversion layer is disposed within a second well of the plurality of wells to convert a second illumination into light of a second color. A first major surface or a second major surface of the array is configured to be coupled to a backplane.

[0006] In some embodiments, a multicolor display is provided. The multicolor display includes a backplane having a backplane circuit and an LED die array electrically integrated with the backplane circuit. A color conversion array is coupled to the LED die array. The color conversion array includes a plurality of features and a plurality of wells. Each well is defined within one or more of the plurality of features. The plurality of wells include a first well having quantum dots of a first color and a second well having quantum dots of a second color. Each feature is aligned with a gap between adjacent die in the LED die array. A light refractive material is disposed above the color conversion array.

[0007] In some embodiments, a multicolor display is provided. The multicolor display includes a backplane having a backplane circuit and an LED die array electrically integrated with the backplane circuit. A color conversion array is coupled to the LED die array. The color conversion array includes a base portion extending from a first major surface of the color conversion array to a base of a recessed portion disposed within the color conversion array. The color conversion array further includes a plurality of features extending from the base of the recessed portion and a plurality of wells. Each well in the plurality of wells is defined by one or more of the plurality of features and the base of the recessed portion. The plurality of wells include a first well having quantum dots of a first color and a second well having quantum dots of a second color. Each feature is aligned with a gap between the die in the LED die array. A light refractive material is disposed over a sidewall of the feature.

[0008] In some embodiments, a multicolor display is provided. The multicolor display includes a backplane having a backplane circuit. An array of LED dies is electrically integrated with the backplane circuit. A metal grid is coupled to the array of LED dies. The metal grid includes a plurality of features and a plurality of wells. Each feature is defined within one or more of the plurality of features. The plurality of wells includes a first well having quantum dots of a first color and a second well having quantum dots of a second color. Each feature is aligned with a gap between dies in the array of LED dies.

[0009] In some embodiments, a method of forming a multicolor display device is provided. The method includes etching a substrate to form an array including a plurality of wells and a plurality of features. Each well is defined within one or more features of the plurality of features. The method includes coating the array with a refractive material and disposing a first color conversion layer within a first well of the plurality of wells. The method includes disposing a second color conversion layer within a second well of the plurality of wells to form a color conversion array. The color conversion array is integrated with a backplane. The backplane includes backplane circuitry.

[0010] In some embodiments, a method of forming a multicolor display device is provided. The method includes depositing a plurality of metal features on a substrate to form a metal grid. The multicolor display includes a plurality of wells / each well is defined within or between one or more features of the plurality of features. The method includes disposing a first color conversion layer within a first well of the plurality of wells. The method includes disposing a second color conversion layer within a second well of the plurality of wells to form a color conversion array. The color conversion array is integrated with a backplane having backplane circuitry. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order that the above-recited features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above may be made with reference to embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope, as the present disclosure may admit to other equally effective embodiments.

[0012] Figure 1 is a schematic top view of a micro-LED array integrated with a backplane according to some embodiments.

[0013] Figure 2 is a schematic cross-sectional side view of a substrate suitable for processing into a color conversion array according to some embodiments.

[0014] Figure 3A is a schematic cross-sectional side view of an etched substrate 300 according to some embodiments.

[0015] Figure 3B is a schematic cross-sectional side view of a coated etched substrate 300 according to some embodiments.

[0016] Figure 4 is a schematic cross-sectional side view of a color conversion array at a stage of fabrication according to some embodiments.

[0017] Figure 5 is a schematic cross-sectional side view of a color conversion array at a stage of fabrication according to some embodiments.

[0018] Figure 6 is a schematic cross-sectional side view of a color conversion array at a stage of fabrication according to some embodiments.

[0019] Figure 7 is a schematic cross-sectional side view of a color conversion array at a stage of fabrication according to some embodiments.

[0020] Figure 8 is a schematic cross-sectional side view of a color conversion array at a stage of fabrication according to some embodiments.

[0021] Fig. 9 is a schematic cross-sectional side view of a color conversion array prior to integration with a backplane according to some embodiments.

[0022] Fig.10 is a schematic cross-sectional side view of a multicolor display according to some embodiments.

[0023] Fig.11 is a schematic cross-sectional side view of a multicolor display according to some embodiments.

[0024] Fig.12 is a schematic cross-sectional side view of an etched substrate 300 according to some embodiments.

[0025] Fig.13 is a schematic cross-sectional top view of an etched substrate 300 according to some embodiments.

[0026] Fig.14 is a schematic cross-sectional side view of an etched substrate 300 according to some embodiments.

[0027] Fig.15 is a schematic cross-sectional side view of a substrate having a grid structure according to some embodiments.

[0028] Fig.16 is a schematic top view of a backplate according to some embodiments.

[0029] Fig.17 is a schematic top view of a color conversion array according to some embodiments.

[0030] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0031] Methods for manufacturing display devices and color conversion layers suitable for integration with backplanes that address conventional challenges are provided herein. In particular, it has been found that manufacturing closed or open well arrays made of structures that can selectively place quantum dot materials and then integrate with a backplane can efficiently produce display stacks that are substantially free of color emission crosstalk. Several methods of selectively placing quantum dot materials within the wells are contemplated, including coating a photocurable fluid layer containing a color conversion agent (CCA) of a first color without simulation, turning on a light source (such as a laser beam) over a selected well to trigger polymerization and fix the CCA near a selected sub-pixel. Uncured fluid over non-selected sub-pixels can be removed, and the same process can be repeated for CCAs of different colors until all sub-pixels on the substrate are covered with CCAs of a predetermined color.

[0032] Figure 1 1 is a schematic top view of a micro LED display 10 including an array 12 of individual micro LEDs 14 integrated with a backplane 16. The micro LED die 14 are integrated with a backplane circuit 18 so that each micro LED 14 is individually addressable. For example, the backplane circuit 18 may include a thin film transistor (TFT) active matrix array having a thin film transistor and storage capacitor (not shown) for each micro LED, column address and row address lines 18a, column and row drivers 18b, etc. to drive the micro LEDs 14. Alternatively, the micro LEDs 14 may be driven by a passive matrix in the backplane circuit 18. The backplane 16 may be manufactured using a conventional CMOS process.

[0033] Figures 2 to 9 Schematic cross-sectional side views showing a color conversion array at various stages of fabrication. Figure 2 2 is a schematic cross-sectional side view of a substrate 202 suitable for processing into a color conversion array according to some embodiments. The substrate 202 can be a transparent substrate, such as glass or a polymer. The substrate 202 can be any solid material, such as PET, silicon dioxide (SiO2), fused quartz, amorphous quartz, ceramic, or a combination of the above. The thickness 201 of the substrate 202 is about 25 μm to about 100 μm, such as about 50 μm to about 75 μm.

[0034] Figure 3A is a schematic cross-sectional side view of an etched substrate 202 according to certain embodiments of the present disclosure. The substrate 202 can be etched to form an etched substrate 300. The etched substrate 300 has a first major surface 308A and a second major surface 308B. The etched substrate 300 includes a plurality of features 306 and a plurality of wells 302 defined within one or more of the features 306. In some embodiments, the plurality of features 306 are in the form of a grid structure (such as an interconnected grid with square wells).

[0035] The etched substrate 300 may have a border region 304 surrounding a plurality of wells 302 and a plurality of features 306. In some embodiments, a laser induced direct etching process is used to form the plurality of wells 302 and the plurality of features 306. Each of the plurality of wells may have a width 301 that may be smaller at the base of the well between proximal ends 306A of adjacent feature portions relative to a width 303 disposed between distal ends 306B of adjacent features. In one embodiment, the width 301, 303 of each well is between about 1 μm and about 100 μm. One or more of the plurality of features 306 may have a height 305. In one embodiment, the height 305 is between about 1 μm and substantially the same height as the border region 304.

[0036] Figure 3B The etched substrate 300 is depicted after being coated with a material 312, such as a refractive material, a light blocking material, or other opaque material. Without being bound by theory, it is believed that coating the etched substrate 300 with a refractive material can isolate intrusive light passing through the plurality of features 306 and isolate each of the plurality of wells 310 defined within one or more of the coated features 306. The material 312 can be a metal-containing coating, such as metallic aluminum, metallic silver, dielectric carbon, or a combination of the above. The material 312 is conformally introduced at a thickness of about 50 nm or greater, such as about 500 nm to 800 nm. The etched substrate 300 can be coated with the material 312 by a deposition process to achieve a conformal result, including but not limited to a chemical vapor deposition (CVD) process, an atomic layer deposition (ALD) process, a physical vapor deposition (PVD) process, and a plasma enhanced vapor deposition process. The material 312 prevents color cross contamination when the RGB quantum dots are illuminated during display operation.

[0037] The coated etched substrate 300 may be coupled to a second substrate 402, such as Figure 4 As shown. The second substrate 402 is coupled to the coated substrate 300 via an adhesive polymer layer 404. In one embodiment, the adhesive polymer layer 404 is formed of a pressure-sensitive polymer, a UV-curable polymer, a thermally-curable polymer, etc. In some aspects, the adhesive polymer layer 404 is transparent and allows light to pass through. In another aspect, the adhesive polymer layer 404 has a thickness of about 10 nm to about 50 μm.

[0038] like Figure 5As depicted, base matrix 502 is applied within each of the plurality of wells and over the plurality of features. In one embodiment, base matrix 502 is formed of materials including, but not limited to, acrylates, polyurethanes, epoxies, and other optically transparent polymers. In one embodiment, base matrix 502 is conformally coated over base matrix 502. In one embodiment that may be combined with other embodiments herein, base matrix 502 may be spin coated to provide leak-proof wells.

[0039] Figure 6 A first color conversion layer 602 is depicted deposited within a first well 604 of a plurality of wells. The first color conversion layer 602 includes a color conversion agent that can convert received light having a first wavelength into a wavelength of colored light (e.g., red, green, or blue light for a red, green, or blue subpixel). The first color conversion layer 602 can be quantum dots of a first color and can be deposited using any suitable process, such as selective or non-selective inkjet, selective or non-selective spin coating, selective or non-selective spray coating. The first color conversion layer 602 can be cured using any suitable process, such as selective UV curing, such as by using a laser, such as by using a flood light source, such as from the bottom of each well, or such as from the top of each well. In one aspect, the curing process for the first color conversion layer 602 is performed in an inert environment, such as in a processing chamber filled with an inert gas, such as argon, nitrogen, or a combination of the above. In some embodiments, the first color conversion layer 602, such as red, is filled into each well and then selectively cured. In some embodiments, selectively curing includes scanning a laser along a raster path and selectively turning on the laser spot at the well array location to be cured or fixed. An unfixed or uncured color conversion layer can be cleaned or removed using a solvent such as isopropyl alcohol.

[0040] This process can be repeated for other additional color conversion layers of other colors. Once the selective deposition of quantum dots (QDs) is completed, integration with the backplane can be performed. In one embodiment, the thickness of the cured QDs ranges from about 1 μm to about 50 μm. In some embodiments, an external laser source is used and aligned with the base of the well.

[0041] Figure 7 Depicted is a second color converting layer 702 deposited within a second well 704 of the plurality of wells. Second color converting layer 702 may be deposited and cured using any of the processes described with respect to first color converting layer 602. Additional color converting layers of additional colors may be further deposited and cured as described with respect to the first color converting layer and the second color converting layer.

[0042] Once all colors are deposited and cured, additional barrier layers 802, such as protective layers, passivation layers, and other layers, may be deposited over the cured color conversion layers. Figure 8 In one embodiment, which may be combined with other embodiments herein, barrier layer 802 is formed of materials such as SiO2, Si3N4, optically transparent organic and inorganic thin films, etc. Although not depicted, other processes such as planarization or flattening of layers or fillers are also contemplated.

[0043] Fig. 9 The color conversion array of the multicolor display is depicted after removing (such as by a solvent, such as isopropyl alcohol) the adhesive polymer layer 404 and the second substrate 402. The color conversion array can then be coupled to the backplane 1002 along the first major surface 308A, such as Fig.10 As shown. The color conversion array may be coupled to the backplane 1002 via an adhesive layer (not shown). In one embodiment, the border region 304 may be trimmed to substantially the size of the well array prior to integration with the backplane 1002. In one embodiment that may be combined with other embodiments herein, the backplane 1002 is formed of a material including, but not limited to, glass, a flexible polymer film, and the like. The adhesive layer may be spin coated or drop cast onto the first major surface 308A. The color conversion array may be aligned with the backplane 1002 and coupled by bonding using any known bonding process, including, but not limited to, thermal bonding, UV bonding, and the like. The temperature for bonding may be less than about 100° C. to mitigate damage to the circuitry. The backplane 1002 may include a plurality of micro LED dies 1004 separated by a plurality of gaps 1006. The proximal end 306A of each of the features 306 may be aligned with a corresponding gap 1006 between each of the plurality of micro LED dies 1004 of the backplane 1002. In some embodiments, base portions of features 306 can at least partially penetrate gap 1006 to inhibit or eliminate color crosstalk and / or photon leakage from micro LED die 1004 to adjacent wells.

[0044] Alternatively, the second major surface 308B may be coupled to the back plate 1002, such as Fig.11 Backplane 1002 can be coupled via an adhesive layer (not shown) such that distal ends 306B of features 306 are aligned with gaps 106 between micro LED dies 1004. In some embodiments, distal ends 306B can at least partially penetrate gaps 106 to enhance color crosstalk isolation. In some embodiments, distal ends 306B extend to second major surface 308B of the color conversion array.

[0045] Alternatively, if Fig.12As shown, the color conversion array may include a first recessed portion 1200 and a second recessed portion 1201, the first recessed portion including features 306 and wells 302, the second recessed portion being disposed radially outside the first recessed portion 1200 and having a planar surface between the first major surface 308A and the second major surface 308B of the color conversion array. The second recessed portion 1201 may have a radial distance 1202, which may be about 1 mm or less. In some embodiments, the features 306 disposed between two wells 302 in the plurality of wells 302 taper from a base at a proximal end 306A of each feature 306 to a distal end 30BA at a taper angle θ between about -0 degrees and about 10 degrees. The distance 1204 between the first major surface and the second major surface may be about 100 μm or less, such as about 50 μm or less. The well width 1206 at the base of each well 302 may be about 1 μm to about 50 μm, such as about 20 μm to about 30 μm. Each of plurality of features 306 may have a height 1208 between about 5 μm and about 30 μm, such as about 15 μm to about 20 μm.

[0046] Fig.13 A top view of an example color conversion array 1300 (such as any color conversion array described herein) according to certain embodiments is depicted. In some embodiments, color conversion array 1300 can be sized such that the total width 1302 of the array portion is between about 5 millimeters and about 300 millimeters, and the total height 1304 of the array portion is between about 5 millimeters and about 300 millimeters. In some embodiments, a first side of a first well can have a distance 1306 to a first side of an adjacent well. In some embodiments, distance 1306 can be about 3 μm to about 50 μm. In some embodiments, a characteristic width 1308 between wells can be about 1 μm to about 20 μm, such as about 10 μm.

[0047] Fig.14A cross-sectional side view of a color conversion array 1400 is depicted in accordance with certain embodiments. The color conversion array 1400 may be etched to a depth between a first major surface 1406A and a second major surface 1406B of the color conversion array. The color conversion array 1400 includes a base portion 1401 and a plurality of wells 1410 defined by a plurality of features 1416. Each of the plurality of features 1416 may have a height 1408 extending from the base portion 1401 to the second major surface 1406B. The color conversion array 1400 also includes a thickness 1402 between the first major surface 1406A and the second major surface 1406B. In some embodiments, the thickness 1402 is about 100 μm or less, such as about 50 μm or less. Each of the plurality of features 1416 may taper at an angle θ between about 0 degrees and about 10 degrees, such as about 6 degrees to about 8 degrees. Each of the plurality of wells 1410 may include a well width 1404 at a base 1414 of each well 1410. In some embodiments, well width 1404 is about 1 μm to about 50 μm, such as about 20 μm to about 30 μm. A refractive material may be coated along the sidewalls of feature 1416 to visibly isolate each of wells 1410 from each other. The base 1414 of each well 1410 may remain uncoated to enable light (such as a laser) to cure the color conversion layer of each well 1410. In particular, feature 1416 may be composed of a transparent material (such as glass). In one embodiment, the color conversion layer of each well 1410 is cured by a light source having a wavelength between about 365 nm and about 405 nm. In another embodiment, the wavelength of the light source depends on the type of photoinitiator used in the composition of the color conversion layer.

[0048] Fig.15 A cross-sectional side view of a color conversion array including metal features 1512, such as aluminum or silver features, is depicted. The height 1516 of each metal feature 1512 may be about 5 μm to about 50 μm, such as about 15 μm to about 20 μm. The metal features 1512 may be spaced apart by a distance 1514 between about 2 μm and about 80 μm, such as about 25 μm and about 35 μm. The width 1510 of the metal features 1512 may be about 1 μm to about 20 μm, such as about 3 μm to about 5 μm. Each of the metal features 1512 may have a base portion at an interface with a substrate 1506, such as a glass substrate having a thickness 1522 of about 1 μm to 100 μm. The base portion of each of the metal features 1512 may be spaced apart by a distance 1508 of about 0.5 μm to about 60 μm, such as about 20 μm to about 30 μm. Substrate 1506 may be coupled to second substrate 1502 via interposer 1504 such as double-sided adhesive, pressure sensitive adhesive, thermal release film, photosensitive release film, etc. In one embodiment, second substrate 1502 may be a carrier substrate such as a glass substrate having a thickness 1518 of about 200 μm to about 1 mm.

[0049] Fig.16 is a schematic top view of a backplate 1600 according to some embodiments. The backplate 1600 may include an active area 1602 and one or more fiducials 1604. The backplate 1600 may also include backplate circuitry (not shown). Fig.17 17 is a schematic top view of a color conversion array 1700 according to some embodiments. Color conversion array 1700 can include a laser cut outline 1702 and one or more fiducials 1704. One or more fiducials 1704 correspond to one or more fiducials 1604 of backplate 1600, which enables alignment of the laser cut outline 1702 portion of color conversion array 1700 relative to active area 1602 of backplate 1600.

[0050] Additional aspects

[0051] The present disclosure may include the following non-limiting aspects and / or embodiments:

[0052] Item A1. A color conversion array for a multicolor display, the color conversion array comprising: a plurality of features, each feature having a base and a distal end; a plurality of wells, each well defined within one or more of the plurality of features; a first color conversion layer, the first color conversion layer disposed within a first well of the plurality of wells to convert a first illumination into light of a first color; and a second color conversion layer, the second color conversion layer disposed within a second well of the plurality of wells to convert a second illumination into light of a second color, wherein the first major surface or the second major surface of the color conversion array is configured to be coupled to a backplane.

[0053] Clause A2. The color conversion array of Clause A1, wherein each feature disposed between two wells of the plurality of wells tapers from the base to the distal end of each feature, wherein a taper angle is from about 0 degrees to about 10 degrees.

[0054] Clause A3. The color conversion array of Clause A1 or Clause A2, wherein the color conversion array further comprises a fiducial, the fiducial of the color conversion array being configured to align with a fiducial disposed on the backplane.

[0055] Item A4. A color conversion array as described in any of Items A1 to A3, wherein the color conversion array further includes: a base portion, the base portion extending from the first major surface of the color conversion array to the base of a first recessed portion disposed within the color conversion array, the plurality of features extending from the base of the first recessed portion, and each of the plurality of wells being defined by the plurality of features and the base of the first recessed portion.

[0056] Clause A5. The color conversion array of Clause A4, further comprising a second recessed portion disposed radially outward from the first recessed portion, wherein a base of the second recessed portion is disposed between the second major surface and the base of the first recessed portion.

[0057] Clause A6. The color conversion array of any of Clauses A1 to A5, wherein the plurality of features are interconnected.

[0058] Clause A7. The color converting array of any of Clauses A1 to A6, further comprising a refractive material over the plurality of features.

[0059] Clause A8. The color conversion array of Clause A7, further comprising a base matrix disposed within each of the plurality of wells.

[0060] Clause A9. The color conversion array of any of Clauses A1 to A8, further comprising a polymer coupled to the first major surface of the color conversion array.

[0061] Clause A10. The color converting array of any of clauses A1 to A10, further comprising one or more layers above the first color converting layer and the second color converting layer.

[0062] Item B1. A multi-color display, comprising: a backplane having a backplane circuit; an LED die array, the LED die array being electrically integrated with the backplane circuit; a color conversion array, the color conversion array being coupled to the LED die array, the color conversion array comprising a plurality of features and a plurality of wells, each well being defined within one or more of the plurality of features, wherein the plurality of wells comprises a first well having quantum dots of a first color and a second well having quantum dots of a second color, wherein each feature is aligned with a gap between the LED die array; and a light refracting material, the light refracting material being disposed above the color conversion array.

[0063] Clause B2. The multicolor display of clause B1, wherein a distal end of each feature is aligned with a gap between dies of the array of LED dies.

[0064] Clause B3. The multicolor display of clause Bl or B2, wherein a proximal end of each feature is aligned with a gap between dies of the array of LED dies.

[0065] Clause B4. A multicolor display as described in any of clauses B1 to B3, wherein each feature disposed between two wells of the plurality of wells tapers from the base to the distal end of each feature, wherein the taper angle is about 0 degrees to about 10 degrees.

[0066] Clause B5. The multicolor display of any of clauses B1 to B4, wherein the color conversion array further comprises a fiducial, the fiducial of the color conversion array being aligned with a fiducial disposed on the backplane.

[0067] Item C1. A multicolor display, the multicolor display comprising: a backplane having a backplane circuit; an array of LED dies electrically integrated with the backplane circuit; a color conversion array coupled to the array of LED dies, the color conversion array comprising: a base portion extending from a first major surface of the color conversion array to a base of a recessed portion disposed within the color conversion array, a plurality of features extending from the base of the recessed portion, and a plurality of wells, each of the plurality of wells being defined by the plurality of features and the base of the recessed portion, wherein the plurality of wells comprises a first well having quantum dots of a first color and a second well having quantum dots of a second color, wherein each feature is aligned with a gap between the array of LED dies; and a light refracting material disposed above a sidewall of the feature.

[0068] Clause C2. The multicolor display of Clause C1, wherein the base of the recess is transparent to light.

[0069] Clause C3. The multicolor display of clause C1 or clause C2, wherein each feature is mesa-shaped, wherein a distal end of each feature is substantially coplanar with a major surface of the color conversion array.

[0070] Clause C4. The multicolor display of any of clauses C1 to C3, wherein the light refracting material is a metal-containing material.

[0071] Clause C5. The multicolor display of any of clauses C1 to C4, wherein a top cross-section of at least one well is rectangular.

[0072] Item D1. A multicolor display, comprising: a backplane having a backplane circuit; an LED die array, the LED die array being electrically integrated with the backplane circuit; and a metal grid coupled to the LED die array, the metal grid comprising a plurality of features and a plurality of wells, each well being defined within one or more of the plurality of features, wherein the plurality of wells comprises a first well having quantum dots of a first color and a second well having quantum dots of a second color, wherein each feature is aligned with a gap between the LED die array.

[0073] Item E1. A method of forming a multicolor display device, the method comprising: etching a substrate to form an array including a plurality of wells and a plurality of features, each well being defined within one or more features of the plurality of features; coating the array with a refractive material; disposing a first color conversion layer within a first well of the plurality of wells; disposing a second color conversion layer within a second well of the plurality of wells to form a color conversion array; integrating the color conversion array with a backplane, the backplane comprising circuitry.

[0074] Clause E2. The method of Clause El, further comprising coupling the coated first major surface of the array to a base via a polymer.

[0075] Clause E3. The method of Clause E1 or Clause E2, further comprising dissolving the polymer with a solvent.

[0076] Clause E4. The method of any of Clauses E1 to E3, wherein the first color converting layer comprises red, blue, or green quantum dots.

[0077] Clause E5. The method of any of Clauses E1 to E4, further comprising spin coating a base matrix within the plurality of wells and over the plurality of features.

[0078] Clause E6. The method of any of Clauses E1 to E5, wherein integrating the color conversion array with the backplate comprises aligning fiducials of the color conversion array with fiducials of the backplate.

[0079] Clause E7. The method of any of Clauses E1 to E6, wherein integrating the color conversion array with the backplate comprises aligning distal ends of the plurality of features with gaps between individual LED dies.

[0080] Clause E8. The method of any of Clauses E1 to E7, wherein integrating the color conversion array with the backplate comprises aligning distal ends of the plurality of features with gaps between individual LED dies.

[0081] Clause E9. The method of any of clauses E1 to E8, wherein integrating the color conversion array with the backplate comprises aligning proximal ends of the plurality of features with gaps between individual LED dies.

[0082] Clause E10. The method of any of Clauses E1 to E9, wherein integrating the color conversion array with the backplate comprises at least partially penetrating gaps between adjacent LED dies with a portion of the plurality of features.

[0083] Clause E11. The method of any of Clauses E1 to E10, wherein disposing a first color converting layer within a first well of the plurality of wells comprises curing quantum dots of a first color by emitting light through a base of the first well.

[0084] Clause E12. The method of Clause E11, wherein disposing a first color converting layer within a first well of the plurality of wells comprises selectively depositing into the first well.

[0085] Item E13. A method as described in Item E11, wherein disposing the first color conversion layer within a first well among the multiple wells includes: depositing the first color conversion layer into the multiple wells; selectively curing the first color conversion layer within the first well among the multiple wells; and removing the uncured first color conversion layer from at least one other well among the multiple wells.

[0086] Clause E14. The method of Clause E13, wherein selectively curing comprises scanning a laser spot along a raster path and selectively turning on the laser when aligned with the base of the first well.

[0087] Clause E15. The method of Clause E13, wherein removing the uncured first color-converting layer comprises washing the uncured first color-converting layer from at least one of the wells in the plurality of wells with a solvent such as isopropyl alcohol.

[0088] Item F1. A method of forming a multi-color display device, the method comprising: depositing a plurality of metal features above a substrate to form a metal grid comprising a plurality of wells, each well being defined within or between one or more of the plurality of features; disposing a first color conversion layer within a first well of the plurality of wells; disposing a second color conversion layer within a second well of the plurality of wells to form a color conversion array; and integrating the color conversion array with a backplane, the backplane comprising circuitry.

Claims

1. A color conversion array for a multicolor display, the color conversion array comprising: a plurality of features, each feature having a base and a distal end; a plurality of wells, each well being defined within one or more of the plurality of features; a first color conversion layer disposed within a first well of the plurality of wells to convert the first illumination into light of a first color; as well as A second color conversion layer is disposed within a second well of the plurality of wells to convert the second illumination into light of a second color, wherein the first major surface or the second major surface of the color conversion array is configured to be coupled to a backplane.

2. The color conversion array of claim 1, wherein each feature disposed between two wells of the plurality of wells tapers at a taper angle from the base to the distal end of each feature, wherein the taper angle is from about 0 degrees to about 10 degrees.

3. The color conversion array of claim 1, wherein the color conversion array further comprises a fiducial, the fiducial of the color conversion array being configured to align with a fiducial disposed on the backplane.

4. The color conversion array of claim 1 , further comprising: a base portion extending from the first major surface of the color conversion array to a base of a first recessed portion disposed within the color conversion array, the plurality of features extending from the base of the first recessed portion, each of the plurality of wells being defined by the plurality of features and the base of the first recessed portion.

5. The color conversion array of claim 4, further comprising a second recessed portion disposed radially outward of the first recessed portion, wherein a base of the second recessed portion is disposed between the second major surface and the base of the first recessed portion.

6. The color conversion array of claim 1, wherein the plurality of features are interconnected.

7. The color conversion array of claim 1, further comprising a refractive material over the plurality of features.

8. The color conversion array of claim 7, further comprising a base matrix disposed within each of the plurality of wells.

9. The color conversion array of claim 1, further comprising a polymer coupled to the first major surface of the color conversion array.

10. The color converting array of claim 1, further comprising one or more layers above the first color converting layer and the second color converting layer.

11. A multicolor display, comprising: A backplane, wherein the backplane has a backplane circuit; LED bare die array, the LED bare die array is electrically integrated with the backplane circuit; a color conversion array coupled to the array of LED dies, the color conversion array comprising a plurality of features and a plurality of wells, each well being defined within one or more of the plurality of features, wherein the plurality of wells comprises a first well having quantum dots of a first color and a second well having quantum dots of a second color, wherein each feature is aligned with a gap between the array of LED dies; as well as A light refracting material is disposed above the color conversion array.

12. The multicolor display of claim 11, wherein a distal end of each feature is aligned with a gap between dies in the array of LED dies.

13. The multicolor display of claim 11, wherein a proximal end of each feature is aligned with a gap between dies in the array of LED dies.

14. The multicolor display of claim 12, wherein each feature disposed between two wells of the plurality of wells tapers at a taper angle from a base of each feature to the distal end, wherein the taper angle is from about 0 degrees to about 10 degrees.

15. The multi-color display of claim 11, wherein the color conversion array further comprises a fiducial, the fiducial of the color conversion array being aligned with a fiducial disposed on the backplane.

16. A multicolor display, comprising: A backplane, wherein the backplane has a backplane circuit; LED bare die array, the LED bare die array is electrically integrated with the backplane circuit; A color conversion array is coupled to the LED die array, the color conversion array comprising: a base portion extending from the first major surface of the color conversion array to a base of a recessed portion disposed within the color conversion array, a plurality of features extending from the base of the recessed portion, and a plurality of wells, each well of the plurality of wells being defined by the plurality of features and the base of the recess, wherein the plurality of wells comprises a first well having quantum dots of a first color and a second well having quantum dots of a second color, wherein each feature is aligned with a gap between the array of LED dies; as well as A light refracting material is disposed over the sidewalls of the feature.

17. A multi-color display as claimed in claim 16, wherein the base of the recessed portion is transparent to light.

18. The multicolor display of claim 16, wherein each feature is mesa-shaped, wherein a distal end of each feature is substantially coplanar with a major surface of the color conversion array.

19. The multicolor display of claim 16, wherein the light refracting material is a metal-containing material.

20. The multi-color display of claim 16, wherein a top cross-section of at least one well is rectangular.

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