Display substrate and preparation method thereof, display panel and display device

Abstract

The invention discloses a display substrate and a preparation method thereof, a display panel and a display device, and relates to the technical field of display. The display substrate comprises: a substrate; the supporting columns are arranged on the surface of one side of the substrate, and each supporting column is provided with a first surface close to the substrate and a second surface opposite to the first surface; wherein in any direction parallel to the substrate, the ratio of the width of the first surface to the width of the second surface is larger than or equal to 0.8 and smaller than or equal to 1.2, and the width of the first surface is larger than or equal to 0.8 micrometer and smaller than or equal to 3 micrometers.

Description

Display substrate and manufacturing method thereof, display panel, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a preparation method thereof, a display panel, and a display device. Background Art

[0002] With the development of display technology, the demand for display panel pixel density (PPI) is increasing. The resolution of display panels has gradually increased from 200 PPI to 500 PPI, 1000 PPI, and 1500 PPI. Even in the fields of augmented reality (AR) and virtual reality (VR), the resolution of display panels is required to reach 1000 PPI or even 2000 PPI or above. This places higher demands on the design and manufacturing of display panels.

[0003] Overview

[0004] The present disclosure provides a display substrate, comprising:

[0005] substrate;

[0006] A plurality of support pillars are arranged on one side surface of the base substrate, and the support pillars have a first surface close to the base substrate and a second surface opposite to the first surface;

[0007] In which, in any direction parallel to the base substrate, the ratio of the width of the first surface to the width of the second surface is greater than or equal to 0.8 and less than or equal to 1.2, and the width of the first surface is greater than or equal to 0.8 microns and less than or equal to 3 microns.

[0008] In some embodiments, the plurality of support pillars include a first support pillar and a second support pillar, the height of the first support pillar in the first direction is greater than the height of the second support pillar in the first direction, and the first direction is the direction of the base substrate pointing to the second surface of the support pillar.

[0009] In some embodiments, a light shielding layer is provided between the base substrate and the support pillars, and the light shielding layer includes a plurality of light shielding patterns;

[0010] The orthographic projection of at least one of the support pillars on the base substrate is located in one of the light-shielding pattern regions. In the orthographic projection on the base substrate, the support pillar is centrally arranged in the light-shielding pattern region that overlaps with the support pillar.

[0011] In some embodiments, the support column comprises:

[0012] An inner column and an outer column, wherein the outer column is arranged around the periphery of the inner column and is arranged close to the side of the support column, and the density of the outer column is less than that of the inner column.

[0013] In some embodiments, the support column comprises:

[0014] A plurality of sub-pillars stacked in sequence along a first direction, at least two of the sub-pillars having different characteristics, the characteristics comprising at least one of the following: a size of holes on a side surface of the sub-pillar, a density of holes on the side surface of the sub-pillar, a side tilt angle of the sub-pillar, and a size of the sub-pillar in a second direction, the side tilt angle being the angle between the side surface of the sub-pillar and the first direction, the first direction being the direction from the substrate to the second surface of the support pillar, and the second direction being perpendicular to the first direction;

[0015] Among them, the multiple sub-columns include a first sub-column, a second sub-column and a third sub-column, the first sub-column is arranged close to the base substrate, the third sub-column is arranged away from the base substrate, and the second sub-column is located between the first sub-column and the third sub-column.

[0016] In some embodiments, the size of the holes on the side of the second sub-column is greater than or equal to the size of the holes on the side of the first sub-column, and the size of the holes on the side of the first sub-column is greater than or equal to the size of the holes on the side of the third sub-column.

[0017] In some embodiments, the hole density on the side of the second sub-column is less than or equal to the hole density on the side of the first sub-column, and the hole density on the side of the first sub-column is less than or equal to the hole density on the side of the third sub-column.

[0018] In some embodiments, the side inclination angle of the second sub-column is less than or equal to the side inclination angle of the first sub-column, and the side inclination angle of the first sub-column is less than or equal to the side inclination angle of the third sub-column.

[0019] In some embodiments, the side inclination angle is greater than or equal to 0° and less than or equal to 30°.

[0020] In some embodiments, the size of the second sub-column in the second direction is smaller than or equal to the size of the first sub-column in the second direction, and the size of the first sub-column in the second direction is smaller than or equal to the size of the third sub-column in the second direction; or

[0021] The size of the first sub-column in the second direction is smaller than or equal to the size of the second sub-column in the second direction, and the size of the second sub-column in the second direction is smaller than or equal to the size of the third sub-column in the second direction.

[0022] In some embodiments, the support column includes at least one of the following:

[0023] a concave platform located at a surface edge of the support column away from the base substrate, the concave platform being recessed toward a side close to the base substrate; and

[0024] A fine slit is located near a position where the side surface of the support column intersects the first surface.

[0025] In some embodiments, in the orthographic projection on the base substrate, the ratio of the minimum distance between the edge of the support column and the edge of the shading pattern to the height of the support column in the first direction is greater than or equal to 1 / 1.2 and less than or equal to 1, and the first direction is the direction of the base substrate pointing to the second surface of the support column.

[0026] In some embodiments, the main material of the light-shielding layer is a metal material.

[0027] In some embodiments, in the orthographic projection on the base substrate, the minimum distance between the edge of the first support pillar and the edge of the light-shielding pattern is substantially equal to the minimum distance between the edge of the second support pillar and the edge of the light-shielding pattern.

[0028] In some embodiments, the height of the support pillar in the first direction is greater than or equal to 1.0 micrometer and less than or equal to 1.6 micrometer; and / or

[0029] The ratio of the size of the support column in the second direction to the height of the support column in the first direction is greater than or equal to 1 / 1.3;

[0030] The first direction is a direction from the base substrate to the second surface of the support pillar, and the second direction is perpendicular to the first direction.

[0031] In some embodiments, the first support column includes a third surface, which is the surface of the first support column facing away from the base substrate, the second support column includes a fourth surface, which is the surface of the second support column facing away from the base substrate, and the roughness of the third surface is less than or equal to the roughness of the fourth surface.

[0032] In some embodiments, the display substrate includes multiple sub-pixels, the number of sub-pixels located between two adjacent first support columns is greater than or equal to 10 and less than or equal to 20, and the number of sub-pixels located between two adjacent second support columns is greater than or equal to 1 and less than or equal to 2.

[0033] The present disclosure provides a display panel, comprising: a cell substrate, a liquid crystal layer, and a display substrate as described in any one of the preceding claims, wherein the liquid crystal layer is located between the cell substrate and the display substrate, and the support column is disposed close to the liquid crystal layer;

[0034] The cell-matching substrate includes a cell-matching substrate and a plurality of bosses located on a side of the cell-matching substrate close to the liquid crystal layer, and the plurality of bosses are respectively arranged opposite to different support pillars.

[0035] The present disclosure provides a display panel, comprising:

[0036] The display substrate according to any one of the preceding claims; and

[0037] There are a plurality of light-emitting devices, wherein in an orthographic projection on the base substrate, the support column is located between two adjacent light-emitting devices.

[0038] The present disclosure provides a display device, comprising:

[0039] The display panel according to any one of the preceding claims; and

[0040] A driving component is connected to the display panel and is used to drive the display panel to display an image.

[0041] The present disclosure provides a method for preparing a display substrate, comprising:

[0042] providing a substrate;

[0043] A light-shielding layer and a plurality of supporting pillars are formed on one side of the base substrate, wherein the plurality of supporting pillars are arranged on a surface of the light-shielding layer facing away from the base substrate, and the light-shielding layer includes a plurality of light-shielding patterns. In the orthographic projection on the base substrate, different supporting pillars are located in different light-shielding pattern areas, and the overlapping support pillars have substantially the same shape as the light-shielding patterns. The plurality of supporting pillars include a first supporting pillar and a second supporting pillar, wherein the height of the first supporting pillar in the first direction is greater than the height of the second supporting pillar in the first direction, and the first direction is the direction from the base substrate to the light-shielding layer.

[0044] In some embodiments, the step of forming a light shielding layer and a plurality of support pillars on one side of the base substrate includes:

[0045] forming a light shielding film on one side of the base substrate;

[0046] forming a supporting film on a side of the light-shielding film facing away from the base substrate;

[0047] Using a patterning process, forming a mask pattern on a side of the support film facing away from the base substrate;

[0048] etching the support film not covered by the mask pattern to form a plurality of support patterns;

[0049] etching the light-shielding film not covered by the mask pattern to form a plurality of light-shielding patterns to obtain the light-shielding layer;

[0050] Laterally etching the plurality of support patterns to form third support pillars and fourth support pillars;

[0051] Covering the third support pillars, the mask pattern connected to the third support pillars, and the light shielding pattern connected to the third support pillars with a protective film on a side facing away from the base substrate;

[0052] removing the mask pattern connected to the fourth supporting pillar;

[0053] removing the protective film;

[0054] performing longitudinal etching on the fourth support column to obtain the second support column;

[0055] The mask pattern connected to the third supporting pillar is removed to obtain the first supporting pillar.

[0056] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below.

[0057] BRIEF DESCRIPTION OF THE DRAWINGS

[0058] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the following is a brief introduction to the drawings required for the description of the embodiments or related technologies. Obviously, the drawings described below are some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without inventive efforts. It should be noted that the scales in the drawings are for illustration only and do not represent the actual scale.

[0059] FIG1 exemplarily shows a schematic structural diagram of a display panel in the related art;

[0060] FIG2 exemplarily shows a schematic cross-sectional structure diagram of a display substrate provided by the present disclosure;

[0061] FIG3 exemplarily shows a schematic planar structural diagram of a display substrate provided by the present disclosure;

[0062] FIG4 exemplarily shows several planar structural schematic diagrams of light-shielding patterns and support pillars;

[0063] Figure 5 a shows a schematic diagram of a planar structure of a support column, and Figures b and c show two cross-sectional electron microscope images of the support column;

[0064] FIG6 exemplarily shows a schematic cross-sectional structure diagram of two display substrates;

[0065] FIG7 exemplarily shows a cross-sectional structural diagram of a support column;

[0066] FIG8 exemplarily shows a schematic cross-sectional structure diagram of a display panel in a first state;

[0067] FIG9 exemplarily shows a schematic cross-sectional structure diagram of a display panel in a second state;

[0068] FIG10 exemplarily shows a schematic cross-sectional structure diagram of a cell substrate;

[0069] 11 and 12 exemplarily show a schematic flow chart of a method for preparing a display substrate;

[0070] FIG13 exemplarily shows a schematic diagram of a planar structure of another display panel;

[0071] FIG14 exemplarily shows a schematic cross-sectional structure diagram of another display panel.

[0072] Detailed description

[0073] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure without making any creative efforts shall fall within the scope of protection of the present disclosure.

[0074] In the related art, as shown in Figure 1a, a liquid crystal display panel typically includes a color filter substrate 11 and an array substrate 12, as well as liquid crystal molecules 13 filled between the color filter substrate 11 and the array substrate 12. As shown in Figure 1b, the color filter substrate 11 includes a glass substrate Glass, a black matrix BM, color resist layers R / G / B, a planarization layer OC, and spacers PS, which are stacked in sequence. In a liquid crystal display panel, as shown in Figure 1a, spacers PS are disposed between the color filter substrate 11 and the array substrate 12 to support and uniformize the cell thickness between the color filter substrate 11 and the array substrate 12.

[0075] As shown in Figure 1 a, a layer of alignment film PI is usually provided on the surface of the color filter substrate 11 close to the liquid crystal layer. Since the alignment film PI is accumulated around the spacer PS and is affected by the morphology of the spacer PS, the liquid crystal molecules 13 around the spacer PS are oriented in disorder, resulting in light leakage around the spacer PS, as shown in Figure 1 c.

[0076] In the related art, in order to block light leakage around the PS, the size BM CD1 of the black matrix BM under the PS is usually widened. The size BM CD1 of the black matrix BM under the PS is calculated using the following formula:

[0077] Among them, PS CD1 is the maximum dimension of the spacer PS in a direction parallel to the plane of the glass substrate Glass, LLD1 is the maximum distance between the boundary of the light leakage area around the spacer PS and the spacer PS, that is, the light leakage distance, BM tol1 is the dimensional tolerance of the black matrix BM in a direction parallel to the plane of the glass substrate Glass, PS tol1 is the dimensional tolerance of the spacer PS in a direction parallel to the plane of the glass substrate Glass, and ol1 is the alignment tolerance between the spacer PS and the black matrix BM.

[0078] As can be seen from the above formula, the increased size of the black matrix BM to block light leakage around the spacers PS significantly impacts the aperture ratio of the display substrate, as shown in Figure 1 (d). Especially in high-PPI display substrates, the impact of the increased size of the black matrix BM on the aperture ratio cannot be ignored.

[0079] In order to solve the above problems, the present disclosure provides a display substrate, as shown in Figure 2, which includes: a base substrate 31; and a plurality of support columns 33, which are arranged on one side surface of the base substrate 31, and the support columns 33 have a first surface SF1 close to the base substrate 31, and a second surface SF2 arranged opposite to the first surface.

[0080] In which, in any direction parallel to the base substrate 31, the ratio of the width of the first surface SF1 to the width of the second surface SF2 is greater than or equal to 0.8 and less than or equal to 1.2, and the width of the first surface SF1 is greater than or equal to 0.8 microns and less than or equal to 3 microns.

[0081] In some embodiments, as shown in Figure 2, the multiple support pillars 33 include a first support pillar 331 and a second support pillar 332, and the height H1 of the first support pillar 331 in the first direction f1 is greater than the height H2 of the second support pillar 332 in the first direction f1. The first direction f1 is the direction from the base substrate 31 to the second surface SF2 of the support pillar 33.

[0082] In some embodiments, as shown in FIG2 or FIG3, a light shielding layer 32 is provided between the base substrate 31 and the support pillars 33. The light shielding layer 32 includes a plurality of light shielding patterns BP. The orthographic projection of at least one of the support pillars on the base substrate is located in one of the light shielding pattern regions.

[0083] Exemplarily, as shown in FIG. 2 or FIG. 3 , in the orthographic projection on the base substrate 31 , different support pillars 33 are located in different light-shielding pattern BP regions, and the shapes of the overlapping support pillars 33 and the light-shielding pattern BP are substantially the same.

[0084] Exemplarily, as shown in FIG. 2 or FIG. 3 , in the orthographic projection on the base substrate, the support pillar is centrally disposed in a light-shielding pattern region that overlaps with the support pillar.

[0085] As shown in Figure 2 or Figure 3, for the support column 33 and the light-shielding pattern BP whose orthographic projections on the base substrate 31 overlap with each other, the orthographic projection edge of the support column 33 is located within the orthographic projection edge of the light-shielding pattern BP, that is, the edge of the support column 33 is indented relative to the edge of the light-shielding pattern BP.

[0086] For example, the dimension BP CD2 of the light shielding pattern BP along the second direction f2 can be calculated using the following formula:

[0087] The second direction f2 is perpendicular to the first direction f1, that is, the second direction f2 is any direction parallel to the plane of the substrate 31. PS CD2 is the maximum dimension of the support pillar 33 in the second direction f2, LLD2 is the maximum distance between the boundary of the light leakage area around the support pillar 33 and the support pillar 33, that is, the light leakage distance, BP tol2 is the dimensional tolerance of the light-shielding pattern BP in the second direction f2, PS tol2 is the dimensional tolerance of the support pillar 33 in the second direction f2, and ol2 is the alignment tolerance between the support pillar 33 and the light-shielding pattern BP.

[0088] The display substrate provided by the present disclosure has a support column 33 that is directly arranged on the surface of the light-shielding layer 32 facing away from the base substrate 31, and no film layers such as the filter layer 35 and the flat layer 36 are arranged between the support column 33 and the light-shielding layer 32. Therefore, the distance between the liquid crystal layer 82 and the light-shielding layer 32 in the display panel can be reduced (as shown in Figure 8), thereby reducing the diffusion range of the light leakage around the support column 33 in the horizontal direction (i.e., the second direction f2), that is, reducing the light leakage distance LLD2 in the above calculation formula, and then reducing the lateral size BP CD2 of the light-shielding pattern BP, reducing the decrease in the aperture ratio caused by blocking the light leakage around the support column 33, and improving the light transmittance of the display substrate.

[0089] For example, the light shielding layer 32 and the support pillars 33 can be formed using a self-alignment process. That is, the light shielding layer 32 and the support pillars 33 are exposed and etched using the same mask. Compared to a process in which the light shielding layer 32 and the support pillars 33 are photolithographically formed using different masks, the self-alignment process can save a mask step, simplify the manufacturing process, and reduce costs. In the self-alignment process, lateral etching can be used to indent the edges of the support pillars 33 relative to the edges of the light shielding pattern BP.

[0090] The self-alignment process can also avoid alignment between the light-shielding pattern BP and the support pillar 33, thereby eliminating the alignment tolerance ol2, further reducing the lateral size BP CD2 of the light-shielding pattern BP, further reducing the decrease in aperture ratio caused by light leakage around the support pillar 33, and improving the light transmittance of the display substrate.

[0091] Using the self-alignment process, the dimension BP CD2 of the light shielding pattern BP along the second direction f2 can be calculated using the following formula: According to the existing calculation of ol2=0.6 micron and PS tol2=0.5 micron, the display substrate provided by the present disclosure is prepared by using a self-alignment process, which can reduce the lateral dimension BP CD2 of the light-shielding pattern BP by 0.86 micron.

[0092] As the resolution of the display substrate increases, the size of each sub-pixel decreases. If the resolution is calculated based on 2000 PPI, the size of each pixel is, for example, 12.7 microns. Correspondingly, the size of each sub-pixel is 4.2 μm. Each sub-pixel must be equipped with necessary devices such as thin-film transistors (TFTs). Therefore, the aperture ratio of a high-resolution display substrate is relatively low. The display substrate provided by the present disclosure is conducive to achieving high resolution, such as above 2000 PPI, and can be applied to AR or VR display products with high resolution requirements.

[0093] For example, as shown in FIG3 , the width wa of each sub-pixel may be, for example, 4.2 μm, and the length wb may be, for example, 12.7 μm.

[0094] For example, as shown in FIG4 , the orthographic projection shape of the light-shielding pattern BP on the base substrate 31 may include at least one of the following: a circle (as shown in FIG4 a), an ellipse, a rounded shape, a polygon, or other regular or irregular shapes. The polygon may be, for example, a triangle, a rectangle (as shown in FIG4 b), a trapezoid, or other quadrilaterals, or a pentagon, a hexagon (as shown in FIG4 c), etc. The polygon may be, for example, a chamfered polygon (as shown in FIG4 c) or a non-chamfered polygon.

[0095] For example, the orthographic projection shape of the support pillar 33 on the base substrate 31 may include at least one of the following: a circle (as shown in FIG. 4 a), an ellipse, a rounded shape, a polygon, or other regular or irregular shapes. The polygon may be, for example, a triangle, a rectangle (as shown in FIG. 4 b), a trapezoid or other quadrilateral, or a pentagon, a hexagon (as shown in FIG. 4 c), etc. The polygon may be, for example, a chamfered polygon (as shown in FIG. 4 c) or a non-chamfered polygon.

[0096] Illustratively, the light shielding patterns BP and the supporting pillars 33 having the same shape may be manufactured by adopting a self-alignment process, as shown in FIG. 4 .

[0097] In some embodiments, as shown in FIG. 2 to FIG. 4 , in an orthographic projection on the base substrate 31 , the support pillar 33 is centrally disposed within a region of the light shielding pattern BP that overlaps with the support pillar 33 .

[0098] Illustratively, in the orthographic projection on the base substrate 31 , the different side edges of the support pillar 33 have substantially the same retraction amount relative to the edge of the light shielding pattern BP overlapping with the support pillar 33 , and the retraction amount shown in FIG. 2 to FIG. 4 is all d.

[0099] Exemplarily, as shown in FIG. 2 to FIG. 4 , the geometric center of the orthographic projection of the support pillar 33 on the base substrate 31 substantially coincides with the geometric center of the orthographic projection of the light shielding pattern BP on the base substrate 31 .

[0100] 5 , FIG. a shows a schematic planar structural diagram of a support column, FIG. b shows an electron microscope image of a cross section of a display substrate, and FIG. b shows an electron microscope image of a cross section of another display substrate.

[0101] In some embodiments, as shown in Figure 5, the support column 33 includes: an inner column 33N and an outer column 33W, the outer column 33W is arranged around the periphery of the inner column 33N, and the outer column 33W is arranged close to the side of the support column 33, and the density of the outer column 33W is less than the density of the inner column 33N.

[0102] Exemplarily, as shown in FIG. 5 b or FIG. 5 c , the cross-sectional roughness of the outer cylinder 33W is greater than the cross-sectional roughness of the inner cylinder 33N.

[0103] Exemplarily, as shown in Figure a of Figure 5 , the outer cylinder 33W is an annular cylinder, which can be coaxially arranged with the inner cylinder 33N. The side of the outer cylinder 33W facing away from the inner cylinder 33N can be, for example, the side of the support column 33.

[0104] For example, as shown in FIG5 a, in an orthographic projection on the substrate 31, the radius w0 of the inner cylinder 33N is greater than the thickness W1 of the outer cylinder 33W. For example, the thickness W1 of the outer cylinder 33W may be greater than or equal to 50 nanometers and less than or equal to 100 nanometers.

[0105] For example, lateral etching can be used to indent the edges of the support pillars 33 relative to the edges of the light-shielding pattern BP. When the lateral indentation rate is 20 Å / s and the lateral indentation amount d is 0.8 μm, the etching time is approximately 400 seconds. During the long etching process, the bombardment of the support pillars 33 by the etching gas and the carbonization effect of the surface material cause a rough structure to form on the side surface of the support pillars 33. Therefore, the thickness W1 of the outer column 33W is related to the etching time. The longer the etching time, the greater the thickness W1 of the outer column 33W.

[0106] In this embodiment, the rough outer column 33W can prevent the etching gas from further etching inward, so the longer the etching time, the slower the etching rate, which is conducive to accurately controlling the indentation amount of the edge of the support column 33 relative to the edge of the light shielding pattern BP.

[0107] In some embodiments, as shown in FIG. 5 b or FIG. 5 c , the support column 33 includes a recessed platform 51 located at a surface edge of the support column 33 away from the base substrate 31 , and the recessed platform 51 is recessed toward a side close to the base substrate 31 .

[0108] Exemplarily, as shown in the circular dotted frame in FIG. 5 , the recess 51 is located at a position where the surface of the support pillar 33 away from the base substrate 31 intersects the side surface of the support pillar 33 .

[0109] In some embodiments, as shown in the rectangular dashed box in FIG. 5 , the support pillar 33 includes a slit 52 , located near the intersection of the side surface of the support pillar 33 and the first surface SF1 .

[0110] In some embodiments, as shown in Figure 6, the support column 33 includes: a plurality of sub-columns 60 stacked in sequence along the first direction f1, at least two sub-columns 60 have different characteristics, and the characteristics include at least one of the following: the hole size on the side of the sub-column 60, the hole density on the side of the sub-column 60, the side inclination angle of the sub-column 60, and the size of the sub-column 60 in the second direction f2, the side inclination angle is the angle between the side of the sub-column 60 and the first direction f1, and the second direction f2 is perpendicular to the first direction f1.

[0111] The hole size on the side of the sub-column 60 refers to the diameter of the hole on the side of the sub-column 60. The hole density on the side of the sub-column 60 refers to the number of holes per unit area on the side of the sub-column 60.

[0112] For example, the pore size can be measured using an instrument such as a scanning electron microscope (SEM).

[0113] For example, the pore density can be measured using an instrument such as a specific surface area pore size analyzer, or can be calculated based on the ratio of the number of pores on the side surface of the sub-column 60 to the side surface area.

[0114] Exemplarily, as shown in Figure 6, the multiple sub-columns 60 include a first sub-column 61, a second sub-column 62 and a third sub-column 63. The first sub-column 61 is arranged close to the base substrate 31, the third sub-column 63 is arranged away from the base substrate 31, and the second sub-column 62 is located between the first sub-column 61 and the third sub-column 63.

[0115] In some embodiments, as shown in FIG6 , the hole size on the side of the second sub-pillar 62 is greater than or equal to the hole size on the side of the first sub-pillar 61 , and the hole size on the side of the first sub-pillar 61 is greater than or equal to the hole size on the side of the third sub-pillar 63 .

[0116] For example, the size of the holes on the side of the first sub-pillar 61 can be greater than or equal to 30 nanometers and less than or equal to 50 nanometers. The size of the holes on the side of the second sub-pillar 62 can be greater than or equal to 30 nanometers and less than or equal to 50 nanometers. The size of the holes on the side of the third sub-pillar 63 can be greater than or equal to 10 nanometers and less than or equal to 30 nanometers.

[0117] In a specific implementation, lateral etching can be used to indent the edge of the support column 33 relative to the edge of the shading pattern BP. During the etching process, since the top of the support column 33 is blocked by the mask pattern 114, the mask pattern 114 produces a shadow effect, so that a hole with a small aperture is formed on the side of the third sub-column 63 near the top. The etching effect is strongest in the middle part of the support column 33, so a hole with a large aperture is formed on the side of the second sub-column 62 near the middle. In addition, the shading pattern BP provided at the bottom of the support column 33 also produces a slight shadow effect, so the hole size on the side of the first sub-column 61 near the bottom is between the second sub-column 62 and the third sub-column 63.

[0118] In some embodiments, as shown in FIG6 , the hole density on the side of the second sub-pillar 62 is less than or equal to the hole density on the side of the first sub-pillar 61 , and the hole density on the side of the first sub-pillar 61 is less than or equal to the hole density on the side of the third sub-pillar 63 .

[0119] For example, the hole density on the side of the first sub-pillar 61 can be greater than or equal to 20 holes per square micron and less than or equal to 30 holes per square micron. The hole density on the side of the second sub-pillar 62 can be greater than or equal to 20 holes per square micron and less than or equal to 30 holes per square micron. The hole density on the side of the third sub-pillar 63 can be greater than or equal to 30 holes per square micron and less than or equal to 100 holes per square micron.

[0120] In some embodiments, the side surface inclination angle of the sub-column 60 is greater than or equal to 0° and less than or equal to 30°.

[0121] Exemplarily, as shown in FIG7 , the side tilt angle of the sub-column 60 may be the side tilt angle α of the first sub-column 61 , the side tilt angle β of the second sub-column 62 , or the side tilt angle γ of the third sub-column 63 .

[0122] In some embodiments, as shown in FIG. 7 , the side tilt angle β of the second sub-column 62 is less than or equal to the side tilt angle α of the first sub-column 61 , and the side tilt angle α of the first sub-column 61 is less than or equal to the side tilt angle γ of the third sub-column 63 .

[0123] Illustratively, the side tilt angle β of the second sub-column 62 is greater than or equal to 0° and less than or equal to 3°. In FIG7 , the side tilt angle β of the second sub-column 62 is 0°. The side tilt angle α of the first sub-column 61 is greater than or equal to 5° and less than or equal to 30°. The side tilt angle γ of the third sub-column 63 is greater than or equal to 5° and less than or equal to 30°.

[0124] In specific implementations, there are various relationships among the dimension W2 of the first sub-column 61 in the second direction f2, the dimension W3 of the second sub-column 62 in the second direction f2, and the dimension W4 of the third sub-column 63 in the second direction f2, which are exemplified below.

[0125] In some examples, as shown in Figure a in Figure 6, the dimension W3 of the second sub-column 62 in the second direction f2 is less than or equal to the dimension W2 of the first sub-column 61 in the second direction f2, and the dimension W2 of the first sub-column 61 in the second direction f2 is less than or equal to the dimension W4 of the third sub-column 63 in the second direction f2.

[0126] In this example, as shown in FIG6 a, the support column 33 is a structure with a narrow middle portion and wider top and bottom portions.

[0127] In other examples, as shown in Figure b in Figure 6, the dimension W2 of the first sub-column 61 in the second direction f2 is less than or equal to the dimension W3 of the second sub-column 62 in the second direction f2, and the dimension W3 of the second sub-column 62 in the second direction f2 is less than or equal to the dimension W4 of the third sub-column 63 in the second direction f2.

[0128] In this example, as shown in FIG6 b, the support column 33 is a structure that is wide at the top and gradually narrows downwards. The longitudinal cross-section (the cross-section parallel to the first direction f1) of the support column 33 is roughly trapezoidal, and the short side of the trapezoid is located close to the light shielding pattern BP.

[0129] For example, as shown in Figure b in Figure 6, the ratio of the dimension W4 of the third sub-column 63 in the second direction f2 to the dimension W2 of the first sub-column 61 in the second direction f2 is greater than or equal to 1. For example, the dimension W4 of the third sub-column 63 in the second direction f2 is 1 micron, and the dimension W2 of the first sub-column 61 in the second direction f2 can be greater than or equal to 0.8 microns, or less than 1 micron.

[0130] In some embodiments, in the orthographic projection on the base substrate 31, the ratio of the minimum distance d between the edge of the support column 33 and the edge of the light-shielding pattern BP (as shown in FIG. 4 ) to the height H of the support column 33 in the first direction f1 (as shown in FIG. 7 ) is greater than or equal to 1 / 1.2 and less than or equal to 1.

[0131] In the orthographic projection on the base substrate 31 , the minimum distance d between the edge of the support pillar 33 and the edge of the light shielding pattern BP may be the amount d of indentation of the edge of the support pillar 33 relative to the edge of the light shielding pattern BP.

[0132] Because the height H of the support pillar 33 in the first direction f1 and the dimension W of the support pillar 33 in the second direction f2 affect the light leakage distance LLD2, the value of the indentation d is related to the height H of the support pillar 33 in the first direction f1 and the dimension W of the support pillar 33 in the second direction f2. If the height H of the support pillar 33 in the first direction f1 is 1.1 microns and the dimension W of the support pillar 33 in the second direction f2 is 4 microns, a indentation d of 0.8 microns is sufficient to block light leakage.

[0133] In a high-resolution display substrate (such as a resolution above 2000PPI), the size W of the support column 33 in the second direction f2 is much smaller than 4 microns, and the light leakage distance LLD2 is mainly determined by the height H of the support column 33 in the first direction f1. It has been verified that the ratio of the indentation amount d (i.e., the minimum distance between the edge of the support column 33 and the edge of the light-shielding pattern BP) to the height H of the support column 33 in the first direction f1 is greater than or equal to 1 / 1.2 and less than or equal to 1, which can block light leakage.

[0134] In some embodiments, as shown in FIG7 , the ratio of the dimension W of the support column 33 in the second direction f2 to the height H of the support column 33 in the first direction f1 is greater than or equal to 1 / 1.3, and the second direction f2 is perpendicular to the first direction f1. This prevents the support column 33 from falling off when subjected to external force.

[0135] Exemplarily, the light shielding pattern BP and the support pillar 33 are formed using a self-alignment process, and the size W of the support pillar 33 in the second direction f2 can be determined by the size of the light shielding pattern BP in the second direction f2 and the indentation d of the edge of the support pillar 33 relative to the edge of the light shielding pattern BP.

[0136] Exemplarily, the maximum dimension of the support pillar 33 in the second direction f2 is 1 micrometer, and the height H of the support pillar 33 in the first direction f1 is less than or equal to 1.3 micrometers.

[0137] In some embodiments, as shown in FIG. 7 , a dimension W of the support pillar 33 in the second direction f2 is greater than or equal to 0.8 micrometers and less than or equal to 3 micrometers, and the second direction f2 is perpendicular to the first direction f1 .

[0138] In a high-resolution display substrate, in order to ensure that the liquid crystal molecules 13 have a higher response speed, the thickness of the liquid crystal box is, for example, 1.6 microns. In this case, the height H of the support column 33 in the first direction f1 can be set to be greater than or equal to 1.0 microns and less than or equal to 1.6 microns.

[0139] In some embodiments, the main material of the light shielding layer 32 is a metal material. For example, the main material of the light shielding layer 32 is molybdenum, which can further reduce the depolarized light leakage of the display substrate.

[0140] In the present disclosure, the support column 33 may be a first support column 331 or a second support column 332 , which is not limited in the present disclosure.

[0141] In some embodiments, as shown in Figure 2, the first support column 331 includes a third surface S1, the third surface S1 is the surface of the first support column 331 facing away from the base substrate 31, the second support column 332 includes a fourth surface S2, the fourth surface S2 is the surface of the second support column 332 facing away from the base substrate 31, and the roughness of the third surface S1 (refer to the upper surface roughness of the support column 33 shown in Figure 5b) is less than or equal to the roughness of the fourth surface S2 (refer to the upper surface roughness of the support column 33 shown in Figure 5c).

[0142] Since the height H2 of the second support column 332 in the first direction f1 is smaller than the height H1 of the first support column 331 in the first direction f1, in a specific implementation, the surface of the second support column 332 facing away from the base substrate 31 can be longitudinally etched to form a height difference between the first support column 331 and the second support column 332. The etching can make the surface of the second support column 332 facing away from the base substrate 31, that is, the fourth surface S2, have a higher roughness.

[0143] In some embodiments, as shown in FIG. 3 , in the orthographic projection on the base substrate 31 , the minimum distance between the edge of the first support pillar 331 and the edge of the light-shielding pattern BP is approximately equal to the minimum distance between the edge of the second support pillar 332 and the edge of the light-shielding pattern BP.

[0144] As shown in FIG3 , the plurality of light-shielding patterns BP include a first light-shielding pattern BP1 and a second light-shielding pattern BP2 . In the orthographic projection on the base substrate 31 , the first support pillars 331 are located in the region of the first light-shielding pattern BP1 , and the second support pillars 332 are located in the region of the second light-shielding pattern BP2 .

[0145] In this embodiment, the minimum distance between the edge of the first support column 331 and the edge of the light-shielding pattern BP is the indentation of the edge of the first support column 331 relative to the edge of the first light-shielding pattern BP1; the minimum distance between the edge of the second support column 332 and the edge of the light-shielding pattern BP is the indentation of the edge of the second support column 332 relative to the edge of the second light-shielding pattern BP2.

[0146] As shown in FIG3 , in the orthographic projection on the base substrate 31 , the retraction amount of the edge of the first support pillar 331 relative to the edge of the first light-shielding pattern BP1 is equal to the retraction amount of the edge of the second support pillar 332 relative to the edge of the second light-shielding pattern BP2 .

[0147] Exemplarily, as shown in FIG. 3 , the orthographic projection shapes of the first light-shielding pattern BP1 and the second light-shielding pattern BP2 on the base substrate 31 are substantially the same, and the sizes are substantially the same.

[0148] Exemplarily, as shown in FIG3 , the orthographic projection size of the first support pillar 331 on the base substrate 31 and the orthographic projection shape of the second support pillar 332 on the base substrate 31 are substantially the same, and the sizes are substantially the same.

[0149] In some embodiments, the display substrate includes a plurality of sub-pixels arranged in an array. As shown in FIG. 2 or FIG. 3 , the plurality of sub-pixels may include a red sub-pixel R, a green sub-pixel G, and a blue sub-pixel B.

[0150] In some embodiments, the number of sub-pixels located between two adjacent first supporting columns 331 is greater than or equal to 10 and less than or equal to 20.

[0151] Exemplarily, the number of sub-pixels located between two adjacent first supporting columns 331 is 15, that is, one first supporting column 331 is provided for every 15 sub-pixels.

[0152] In some embodiments, the number of sub-pixels located between two adjacent second supporting columns 332 is greater than or equal to 1 and less than or equal to 2.

[0153] Exemplarily, the number of sub-pixels located between two adjacent second supporting columns 332 is 1, that is, one second supporting column 332 is provided for each sub-pixel.

[0154] For example, as shown in FIG2 , the display substrate may further include: a black matrix 34, a filter layer 35, a planarization layer 36, and a buffer layer 37, which are sequentially stacked between a base substrate 31 and a light shielding layer 32. The black matrix 34 is disposed close to the base substrate 31, and the light shielding layer 32 is disposed on a side of the buffer layer 37 facing away from the base substrate 31. The filter layer 35 may include, for example, a red filter pattern for the red sub-pixel R, a green filter pattern for the green sub-pixel G, and a blue filter pattern for the blue sub-pixel B.

[0155] Exemplarily, as shown in FIG3 , the orthographic projection of the light shielding layer 32 on the base substrate 31 overlaps with the orthographic projection of the black matrix 34 on the base substrate 31 .

[0156] Exemplarily, as shown in FIG3 , the orthographic projection of the light shielding layer 32 on the base substrate 31 is located within the orthographic projection range of the black matrix 34 on the base substrate 31 .

[0157] The present disclosure also provides a display panel, as shown in Figure 8, which includes: a box substrate 81, a liquid crystal layer 82, and a display substrate 83 provided in any embodiment, the liquid crystal layer 82 is located between the box substrate 81 and the display substrate 83, and the support column 33 is arranged close to the liquid crystal layer 82.

[0158] The cell substrate 81 includes a cell substrate 811 and a plurality of bosses PW located on a side of the cell substrate 811 close to the liquid crystal layer 82 . The plurality of bosses PW are respectively arranged opposite to different support pillars 33 .

[0159] Those skilled in the art will appreciate that the display panel provided by the present disclosure has the advantages of the above-mentioned display substrate 83 .

[0160] For example, the plurality of bosses PW include a first boss PW1 and a second boss PW2, wherein the first boss PW1 is disposed opposite to the first support column 331 and the second boss PW2 is disposed opposite to the second support column 332. The first boss PW1 and the second boss PW2 may have the same height in the first direction f1.

[0161] After the box substrate 81 and the display substrate 83 are aligned, as shown in FIG8 , the first boss PW1 contacts the first support column 331 to ensure the box thickness. In this case, the second support column 332 is suspended and has no contact with the second boss PW2.

[0162] When the display panel is subjected to external force, such as when being transported or pressed, as shown in Figure 9, the first boss PW1 and the first support column 331 are misaligned, and the second support column 332 will contact the second boss PW2, thereby playing an auxiliary supporting role to ensure that the display panel does not have scratches, black gaps and other defects.

[0163] Exemplarily, the ratio of the total surface area of ​​the support column 33 close to the box substrate 81 to the sub-pixel area is defined as the contact density. The contact density of the first support column 331 can be greater than or equal to 200 and less than or equal to 300, and the contact density of the second support column 332 can be 20,000, for example.

[0164] For example, as shown in FIG10 , the cell substrate 81 of each sub-pixel may further include: a thin film transistor TFT, an organic layer PL1, a pixel electrode PITO, an insulating layer 101, and a common electrode CITO, stacked between the cell substrate 811 and the boss PW. The thin film transistor TFT is disposed near the cell substrate 811 and includes an active layer ACT, a gate insulating layer GI, a gate Gate, an insulating layer 100, a source electrode SD, and a drain electrode CITO, stacked in sequence. The active layer ACT is disposed near the cell substrate 811. The source electrode SD and the drain electrode CITO are disposed on the same layer, and the pixel electrode PITO and the drain electrode CITO are connected via a via disposed in the organic layer PL1.

[0165] For example, the material of the active layer ACT may include semiconductor materials such as amorphous silicon, low-temperature polycrystalline silicon, or metal oxides. The metal oxides may include one or more of indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), indium tin zinc oxide (ITZO), indium gallium oxide (IGO), indium gallium zinc tin oxide (IGZTO), and rare earth-doped oxide (Ln-OS). The material of the active layer ACT may be amorphous, partially crystalline, single crystal, or polycrystalline, and the film layer may be a single layer or multilayer structure.

[0166] Exemplarily, the boss PW may be formed simultaneously with the thin film transistor TFT, the organic layer PL1 , the pixel electrode PITO, the insulating layer 101 and / or the common electrode CITO.

[0167] The present disclosure also provides a display panel, as shown in Figures 13 and 14, which includes: a display substrate as provided in any embodiment; and a plurality of light-emitting devices LD, wherein in the orthographic projection on the base substrate 31, the support column 33 is located between two adjacent light-emitting devices LD.

[0168] Those skilled in the art will appreciate that the display panel provided by the present disclosure has the advantages of the above-mentioned display substrate.

[0169] Exemplarily, the plurality of light emitting devices may include a red light emitting device LDR, a green light emitting device LDG, and a blue light emitting device LDB.

[0170] Exemplarily, the display panel includes a plurality of pixel units UT arranged in an array along row and column directions. The pixel unit UT includes at least one red light-emitting device LDR, at least one green light-emitting device LDG, and at least one blue light-emitting device LDB. In FIG13 , the pixel unit UT includes one red light-emitting device LDR, two green light-emitting devices LDG, and one blue light-emitting device LDB.

[0171] For example, the support column 33 may be located between the red light emitting device LDR and the blue light emitting device LDB, which is not limited in the present disclosure.

[0172] For example, a pixel definition layer PDL may be provided between the base substrate 31 and the support pillars 33 . The pixel definition layer PDL is used to form a plurality of pixel openings. The pixel openings are used to provide the light emitting devices LD.

[0173] For example, the heights of different support pillars 33 in the first direction f1 may be the same or different, which is not limited in the present disclosure.

[0174] For example, the light-emitting device LD can be an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a sub-millimeter light-emitting diode (Mini LED) or a micro light-emitting diode (Micro LED), etc.

[0175] The present disclosure also provides a display device, comprising: a display panel as provided in any embodiment; and a driving component connected to the display panel for driving the display panel to display an image.

[0176] Those skilled in the art will appreciate that the display device provided by the present disclosure has the advantages of the above-mentioned display panel.

[0177] The display device provided by the present disclosure can be: a display module, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a car display device, a smart watch, a fitness wristband, a personal digital assistant, or any other product or component with a display function.

[0178] Exemplarily, for a liquid crystal display panel, the display module may further include: a backlight module, located on the backlight side of the display panel, for providing backlight to the display panel.

[0179] The present disclosure also provides a method for preparing a display substrate, comprising:

[0180] Step S01: providing a base substrate 31 .

[0181] Step S02: A light shielding layer 32 and a plurality of support pillars 33 are formed on one side of a base substrate 31 to obtain a display substrate as shown in FIG2 or FIG3 . As shown in FIG2 and FIG3 , the plurality of support pillars 33 are disposed on a surface of the light shielding layer 32 facing away from the base substrate 31 . The light shielding layer 32 includes a plurality of light shielding patterns BP. In an orthographic projection onto the base substrate 31 , different support pillars 33 are located within different light shielding pattern BP regions, and the overlapping support pillars 33 have substantially the same shape as the light shielding patterns BP. The plurality of support pillars 33 include a first support pillar 331 and a second support pillar 332 . The height H1 of the first support pillar 331 in a first direction f1 is greater than the height H2 of the second support pillar 332 in the first direction f1 . The first direction f1 is the direction from the base substrate 31 toward the light shielding layer 32 .

[0182] The display substrate provided in any of the above embodiments can be prepared by using the preparation method provided in the present disclosure.

[0183] In some embodiments, as shown in FIG. 11 to FIG. 12 , step S02 may specifically include:

[0184] Step S101 : forming a light shielding film 111 on one side of the base substrate 31 .

[0185] For example, as shown in FIG11a, a black matrix 34 can be first formed on one side of the base substrate 31. Then, as shown in FIG11b, a filter layer 35 can be formed on the side of the black matrix 34 facing away from the base substrate 31. Then, as shown in FIG11c, a planarization layer 36 can be formed on the side of the filter layer 35 facing away from the base substrate 31. The planarization layer 36 can flatten the step difference on the surface of the filter layer 35 to ensure the uniformity of the subsequent etching of the light-shielding pattern BP and the support pillars 33. The filter layer 35 can be made of conventional materials or materials with a high color gamut and low film thickness.

[0186] In order to ensure that the planar layer 36 is not damaged in the subsequent etching process, as shown in Figure 11 d, a buffer layer 37 can be formed on the side of the planar layer 36 away from the substrate 31. The material of the buffer layer 37 can include, for example, silicon nitride, silicon oxide, etc.

[0187] In this example, as shown in Figure 11e, the light shielding film 111 is provided on the side of the buffer layer 37 facing away from the base substrate 31. The light shielding film 111 may be 500 angstroms thick, made of molybdenum, and have a reflectivity of 60%.

[0188] Step S102 : forming a support film 112 on the side of the light shielding film 111 facing away from the base substrate 31 , as shown in FIG. 11 f .

[0189] For example, the support film 112 may be made of a photoreactive material or an acrylic material. After the support film 112 is formed, the support film 112 may be photocured to improve the adhesion of the support film 112.

[0190] Step S103 : using a patterning process to form a mask pattern 114 on the side of the support film 112 facing away from the base substrate 31 , as shown in FIG. 12 i .

[0191] Exemplarily, the material of the mask pattern 114 may be a metal material such as molybdenum, a metal oxide material such as indium tin oxide, or an inorganic insulating material such as silicon nitride or silicon oxide.

[0192] When the light shielding film 111 is made of molybdenum and the buffer layer 37 is made of silicon nitride or silicon oxide, in order to form an etching difference, the mask pattern 114 may be made of a metal oxide such as indium tin oxide.

[0193] Illustratively, in step S103, as shown in Figures g to i in Figure 11, a layer of indium tin oxide thin film 113 can be first formed on the side of the support film 112 facing away from the base substrate 31, and then the indium tin oxide thin film 113 is photolithographically processed using a mask to form a mask pattern 114.

[0194] Step S104: etching the support film 112 that is not covered by the mask pattern 114 to form a plurality of support patterns 115, as shown in FIG. 11 j.

[0195] For example, oxygen gas may be used as the etching atmosphere, and the etching time may be, for example, 50 seconds.

[0196] Step S105 : etching the light shielding film 111 that is not covered by the mask pattern 114 to form a plurality of light shielding patterns BP, thereby obtaining a light shielding layer 32 , as shown in FIG. 11 j.

[0197] For example, the etching atmosphere may be a mixture of oxygen and chlorine, and the etching time may be, for example, 40 seconds.

[0198] For example, the orthographic projections of the light-shielding pattern BP and the support pattern 115 on the base substrate 31 may completely overlap.

[0199] Step S106: Laterally etch the multiple support patterns 115 to form a third support column 333 and a fourth support column 334, as shown in Figure k in Figure 11, so that the third support column 333 and the fourth support column 334 are both indented relative to their respective corresponding shading patterns BP, and the indentation amount d is consistent, for example, both are 0.8 microns.

[0200] For example, oxygen gas may be used as the etching atmosphere, and the etching time may be, for example, 100 seconds.

[0201] Step S107: Covering the third support pillars 333, the mask patterns 114 connected to the third support pillars 333, and the light shielding patterns BP connected to the third support pillars 333 away from the base substrate 31 with a protection film 116, as shown in FIG. 11 .

[0202] For example, a layer of photoresist can be first formed on the display substrate after completing step S106, and then the photoresist is exposed and developed using a mask plate, retaining only the photoresist located on the third support column 333, the mask pattern 114 connecting the third support column 333, and the shading pattern BP connecting the third support column 333 away from the side of the base substrate 31, thereby forming a protective film 116.

[0203] It should be noted that, since the protection film 116 will be removed in a subsequent process, the mask used to form the protection film 116 will not affect the size of the light-shielding pattern BP, nor will it introduce additional alignment errors.

[0204] Step S108 : removing the mask pattern 114 connected to the fourth supporting pillars 334 , as shown in FIG. 11 .

[0205] For example, an etching process may be used to remove the mask pattern 114 on the fourth supporting pillar 334 .

[0206] Step S109 : removing the protective film 116 , as shown in FIG. 11 .

[0207] For example, in order to facilitate the removal of the protective film 116 , deep curing may not be performed during the formation of the protective film 116 .

[0208] Step S110 : performing longitudinal etching on the fourth support pillar 334 to obtain the second support pillar 332 , as shown in FIG. 11 p .

[0209] For example, the fourth supporting pillar 334 may be longitudinally etched by 0.5 micrometers to form a height difference of 0.5 micrometers between the second supporting pillar 332 and the first supporting pillar 331 .

[0210] Step S111 : removing the mask pattern 114 connected to the third supporting pillars 333 to obtain the first supporting pillars 331 , thereby obtaining the display substrate as shown in FIG. 2 .

[0211] For example, an etching process may be used to remove the mask pattern 114 on the third supporting pillar 333 .

[0212] For example, when the support film 112 is made of acrylic, the longitudinal etching rate is approximately 200 angstroms / second and the lateral etching rate is approximately 20 angstroms / second. Therefore, when the longitudinal etching depth is 0.5 microns, the etching time is 25 seconds. Because the lateral etching rate is much lower than the longitudinal etching rate, the lateral etching depth of the first support pillars 331 and the second support pillars 332 during the longitudinal etching process is only 0.05 microns, which can be ignored.

[0213] In this embodiment, a self-alignment process is used to fabricate the light-shielding pattern BP and support pillars 33. Specifically, the light-shielding layer 32 and support pillars 33 are exposed and etched using the same mask. Compared to processes where the light-shielding layer 32 and support pillars 33 are photolithographically etched using different masks, the self-alignment process saves a masking step, simplifies the fabrication process, and reduces costs. Lateral etching can be used during the self-alignment process to indent the edges of the support pillars 33 relative to the edges of the light-shielding pattern BP.

[0214] In addition, the self-alignment process can also avoid alignment between the light shielding pattern BP and the support pillar 33, thereby eliminating the alignment tolerance ol2, further reducing the lateral dimension BP CD2 of the light shielding pattern BP, and improving the aperture ratio and light transmittance of the display substrate.

[0215] In the present disclosure, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise clearly defined.

[0216] In the present disclosure, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation on the present disclosure.

[0217] As used herein, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, product, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, commodity, or apparatus that includes the element.

[0218] References herein to "one embodiment," "some embodiments," "exemplary embodiments," "one or more embodiments," "an example," "an example," "some examples," and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any one or more embodiments or examples in any suitable manner.

[0219] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any actual relationship or order between these entities or operations.

[0220] When describing some embodiments, the expressions "coupled" and "connected" may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0221] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0222] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0223] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0224] The use of "for" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0225] The use of "based on" or "according to" in this document is intended to be open and inclusive. A process, step, calculation, or other action based on one or more stated conditions or values ​​may, in practice, be based on other conditions or values ​​beyond the stated values. A process, step, calculation, or other action based on one or more stated conditions or values ​​may, in practice, be based on other conditions or values ​​beyond the stated values.

[0226] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0227] As used herein, "parallel", "perpendicular", "equal", and "flush" include the situations described and situations similar to the situations described, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two being equal is less than or equal to 5% of either one. "Flush" includes absolute equality and approximate flushness, wherein the acceptable deviation range of approximate flushness can be, for example, the distance between the two being flush is less than or equal to 5% of either one's size.

[0228] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0229] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0230] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. A display substrate, comprising: substrate substrate; A plurality of support columns are arranged on one side surface of the substrate, wherein the support columns have a first surface close to the substrate and a second surface opposite to the first surface; Wherein, in any direction parallel to the substrate, the ratio of the width of the first surface to the width of the second surface is greater than or equal to 0.8 and less than or equal to 1.2, and the width of the first surface is greater than or equal to 0.8 microns and less than or equal to 3 microns.

2. The display substrate according to claim 1, wherein: The plurality of support pillars include a first support pillar and a second support pillar, wherein a height of the first support pillar in a first direction is greater than a height of the second support pillar in the first direction, and the first direction is a direction from the base substrate to the second surface of the support pillar.

3. The display substrate according to claim 2, wherein: A light shielding layer is provided between the base substrate and the support pillar, wherein the light shielding layer comprises a plurality of light shielding patterns; The orthographic projection of at least one of the support pillars on the base substrate is located in one of the light-shielding pattern regions, and in the orthographic projection on the base substrate, the support pillar is centrally arranged in the light-shielding pattern region that overlaps with the support pillar.

4. The display substrate according to any one of claims 1 to 3, wherein: The support column comprises: An inner cylinder and an outer cylinder, wherein the outer cylinder is arranged around the periphery of the inner cylinder and is arranged close to the side of the support column, and the density of the outer cylinder is less than the density of the inner cylinder.

5. The display substrate according to any one of claims 1 to 4, wherein: The support column comprises: A plurality of sub-columns are stacked in sequence along a first direction, and at least two of the sub-columns have different characteristics, and the characteristics include at least one of the following: the size of the holes on the side of the sub-columns, the density of the holes on the side of the sub-columns, the side inclination angle of the sub-columns, and the size of the sub-columns in a second direction, wherein the side inclination angle is the angle between the side of the sub-columns and the first direction. The first direction is the direction from the substrate to the second surface of the support column, and the second direction is perpendicular to the first direction; Among them, the multiple sub-columns include a first sub-column, a second sub-column and a third sub-column, the first sub-column is arranged close to the base substrate, the third sub-column is arranged away from the base substrate, and the second sub-column is located between the first sub-column and the third sub-column.

6. The display substrate according to claim 5, wherein: The size of the hole on the side surface of the second sub-column is greater than or equal to the size of the hole on the side surface of the first sub-column, and the size of the hole on the side surface of the first sub-column is greater than or equal to the size of the hole on the side surface of the third sub-column.

7. The display substrate according to claim 5 or 6, wherein: The hole density on the side surface of the second sub-column is less than or equal to the hole density on the side surface of the first sub-column, and the hole density on the side surface of the first sub-column is less than or equal to the hole density on the side surface of the third sub-column.

8. The display substrate according to any one of claims 5 to 7, wherein: The side inclination angle of the second sub-column is less than or equal to the side inclination angle of the first sub-column, and the side inclination angle of the first sub-column is less than or equal to the side inclination angle of the third sub-column.

9. The display substrate according to any one of claims 5 to 8, wherein: The side inclination angle is greater than or equal to 0° and less than or equal to 30°.

10. The display substrate according to any one of claims 5 to 9, wherein: The size of the second sub-column in the second direction is smaller than or equal to the size of the first sub-column in the second direction, and the size of the first sub-column in the second direction is smaller than or equal to the size of the third sub-column in the second direction; or The size of the first sub-column in the second direction is smaller than or equal to the size of the second sub-column in the second direction, and the size of the second sub-column in the second direction is smaller than or equal to the size of the third sub-column in the second direction.

11. The display substrate according to any one of claims 1 to 10, wherein: The support column includes at least one of the following: a concave platform, located at a surface edge of the support column away from the substrate, the concave platform being concave toward a side close to the substrate; and A fine gap is located near the intersection of the side surface of the support column and the first surface.

12. The display substrate according to claim 3, wherein: In the orthographic projection on the base substrate, the ratio of the minimum distance between the edge of the support column and the edge of the shading pattern to the height of the support column in the first direction is greater than or equal to 1 / 1.2 and less than or equal to 1, and the first direction is the direction of the base substrate pointing to the second surface of the support column.

13. The display substrate according to claim 3 or 12, wherein: The main material of the light shielding layer is metal material.

14. The display substrate according to claim 3, 12 or 13, wherein: In the orthographic projection on the base substrate, the minimum distance between the edge of the first support pillar and the edge of the light-shielding pattern is substantially equal to the minimum distance between the edge of the second support pillar and the edge of the light-shielding pattern.

15. The display substrate according to any one of claims 1 to 14, wherein: The height of the support pillar in the first direction is greater than or equal to 1.0 micrometer and less than or equal to 1.6 micrometer; and / or The ratio of the size of the support column in the second direction to the height of the support column in the first direction is greater than or equal to 1 / 1.3; The first direction is a direction from the substrate to the second surface of the support column, and the second direction is perpendicular to the first direction.

16. The display substrate according to claim 2, wherein: The first support column includes a third surface, which is the surface of the first support column facing away from the substrate. The second support column includes a fourth surface, which is the surface of the second support column facing away from the substrate. The roughness of the third surface is less than or equal to the roughness of the fourth surface.

17. The display substrate according to claim 2 or 16, wherein: The display substrate includes a plurality of sub-pixels, wherein the number of sub-pixels between two adjacent first support columns is greater than or equal to 10 and less than or equal to 20, and the number of sub-pixels between two adjacent second support columns is greater than or equal to 1 and less than or equal to 2.

18. A display panel, comprising: A cell substrate, a liquid crystal layer, and a display substrate according to any one of claims 1 to 17, wherein the liquid crystal layer is located between the cell substrate and the display substrate, and the support column is arranged close to the liquid crystal layer; The box-matching substrate comprises a box-matching substrate and a plurality of bosses located on a side of the box-matching substrate close to the liquid crystal layer, and the plurality of bosses are respectively arranged opposite to different supporting columns.

19. A display panel, comprising: The display substrate according to any one of claims 1 to 17; as well as There are a plurality of light emitting devices, wherein in an orthographic projection on the substrate, the support column is located between two adjacent light emitting devices.

20. A display device, comprising: The display panel as claimed in claim 18 or 19; as well as A driving component is connected to the display panel and is used to drive the display panel to display an image.

21. A method for preparing a display substrate, comprising: providing a substrate base plate; A light-shielding layer and a plurality of supporting pillars are formed on one side of the base substrate, wherein the plurality of supporting pillars are arranged on a surface of the light-shielding layer facing away from the base substrate, wherein the light-shielding layer includes a plurality of light-shielding patterns, wherein in an orthographic projection on the base substrate, different supporting pillars are located in different light-shielding pattern regions, and the shapes of the overlapping supporting pillars and the light-shielding patterns are substantially the same, wherein the plurality of supporting pillars include a first supporting pillar and a second supporting pillar, wherein a height of the first supporting pillar in a first direction is greater than a height of the second supporting pillar in the first direction, and wherein the first direction is a direction from the base substrate to the light-shielding layer.

22. The preparation method according to claim 21, wherein The step of forming a light shielding layer and a plurality of support pillars on one side of the base substrate comprises: forming a light shielding film on one side of the base substrate; forming a supporting film on a side of the light shielding film away from the base substrate; Using a patterning process, a mask pattern is formed on a side of the support film away from the substrate; Etching the support film not covered by the mask pattern to form a plurality of support patterns; Etching the light-shielding film not covered by the mask pattern to form a plurality of light-shielding patterns to obtain the light-shielding layer; Transversely etching the plurality of support patterns to form a third support column and a fourth support column; Covering a protective film on the third support pillars, the mask pattern connected to the third support pillars, and the light shielding pattern connected to the third support pillars away from the base substrate; removing the mask pattern connected to the fourth supporting pillar; removing the protective film; Performing longitudinal etching on the fourth support column to obtain the second support column; The mask pattern connected to the third supporting column is removed to obtain the first supporting column.

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