Method of thinning a glass via a via

Abstract

The application relates to the technical field of glass, and provides a glass thinning and through hole method, which comprises the following steps: mounting glass in a tool, wherein the tool has a hollow region, and a thinning region and a through hole region of the glass are exposed by the hollow region; performing thinning treatment on the glass mounted in the tool, then dismounting the glass from the tool; performing laser drilling on the dismounted glass, then mounting the glass in the tool for through hole treatment, and completing the thinning and through hole of the glass. The tool with the hollow region is used for supporting and protecting the glass during the thinning treatment and the through hole treatment, so that the glass is prevented from being broken during the thinning treatment and the through hole treatment, and the yield of the thinning and through hole is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of glass, in particular to a glass thinning and via method. BACKGROUND

[0002] In the prior art, the method for preparing ultra-thin flexible via glass is complicated, which needs to thin the glass to ultra-thin by dispensing and bonding, then separate, laser drilling and via. When the glass is thinned to below 0.1 mm, it is difficult to stand in the basket, so that glass fragments are easily generated. Although dispensing and bonding can be used for thinning, the process is complicated and there is a risk of liquid leakage and separation of fragments. In addition, the thickness of the ultra-thin glass after via is about 30 μm~50 μm, and its flexibility is affected by the internal via, which easily leads to damage and low overall strength. Therefore, the yield of ultra-thin flexible via glass is low. SUMMARY

[0003] Therefore, it is necessary to provide a glass thinning and via method capable of improving the yield of ultra-thin flexible via glass.

[0004] The present application provides a glass thinning and via method, which comprises:

[0005] The glass is installed in a tool, the tool has a hollow area, and the thinning area and the via area of the glass are exposed by the hollow area;

[0006] The glass installed in the tool is thinned, and then the glass is disassembled from the tool;

[0007] The glass after disassembly is laser drilled, and then the glass is installed in the tool for via processing, thereby completing the thinning and via of the glass.

[0008] In some embodiments, the tool further comprises an inner milling area arranged circumferentially along the hollow area, and the edge area of the glass is arranged on the inner milling area.

[0009] Optionally, the inner milling depth of the inner milling area is 1 mm~2 mm.

[0010] Optionally, the width of the inner milling area is 16 mm~17 mm.

[0011] Optionally, the inner milling area is provided with a protective layer close to one side of the glass.

[0012] In some embodiments, the tool further comprises a plurality of locks arranged along the edge of the inner milling area, and the locks are used to fix the glass on the tool.

[0013] Optionally, the tooling further comprises a plurality of adjusting members connected with the lock, the adjusting members being configured to adjust the relative distance between the inner milling area and the lock.

[0014] Optionally, the tooling further comprises a plurality of safety lines, two ends of each of the safety lines being fixed to opposite sides of the hollowed area and being spaced apart from the glass; further optionally, the adjusting member is provided with a fixing hole, and the end of each of the safety lines is fixed to the fixing hole.

[0015] Optionally, the contact surface of the lock and the glass is provided with a protective pad.

[0016] In some embodiments, the thinning process comprises: sequentially performing a pretreatment and an etching treatment on the glass installed in the tooling.

[0017] In some embodiments, the pretreatment comprises: sequentially using an alkaline cleaning solution and an acid cleaning solution to clean the glass.

[0018] Optionally, the thickness of the glass after the pretreatment is reduced by 10 μm to 35 μm.

[0019] Optionally, the alkaline substance in the alkaline cleaning solution comprises at least one of sodium hydroxide, potassium hydroxide and lithium hydroxide.

[0020] Optionally, the mass concentration of the alkaline substance in the alkaline cleaning solution is 10% to 15%.

[0021] Optionally, the acid cleaning solution comprises sulfuric acid, hydrochloric acid, hydrofluoric acid and ammonium hydrogen fluoride; further optionally, the acid cleaning solution comprises, in terms of mass fraction: 65.6 parts to 76 parts of sulfuric acid, 0.72 parts to 3.6 parts of hydrochloric acid, 0.8 parts to 2 parts of hydrofluoric acid, 1 part to 3 parts of ammonium hydrogen fluoride, and 18 parts to 28.4 parts of water.

[0022] In some embodiments, the etching treatment comprises: using an etching thinning solution to etch and thin the pretreated glass.

[0023] Optionally, the etching thinning rate of the etching thinning solution on the glass is 3 μm / min to 6 μm / min.

[0024] Optionally, the thickness of the glass after the etching treatment is 0.05 mm to 0.15 mm.

[0025] Optionally, the etching thinning solution comprises hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water.

[0026] Further optionally, the etching thinning solution comprises, in terms of mass fraction:

[0027] hydrofluoric acid, 2.4-8 parts; sulfuric acid, 1.2-3.6 parts; phosphoric acid, 0.2-0.6 parts; ammonium fluoride, 2-5 parts; water, 25.2-66.8 parts.

[0028] In some embodiments, the via processing includes: sequentially performing pre-via, etching via and desalination cleaning on the glass.

[0029] Optionally, the etching via and the desalination cleaning are repeated on the glass to achieve the thinning via requirement.

[0030] Optionally, the thickness of the glass after the via processing is 0.03-0.1 mm; and the diameter of the via is 5-100 μm.

[0031] In some embodiments, the pre-via includes: cleaning the glass after the laser drilling by using an alkaline etching solution.

[0032] Optionally, the alkaline substance in the alkaline etching solution includes at least one of potassium hydroxide, sodium hydroxide and lithium hydroxide.

[0033] Optionally, the mass concentration of the alkaline substance in the alkaline etching solution is 15-30%.

[0034] Optionally, the temperature of the pre-via is 60-120°C, and the time is 80-300 min.

[0035] In some embodiments, the etching via includes: etching the glass after the pre-via by using an etching via solution.

[0036] Optionally, the etching rate of the etching via solution on the glass is ≤3 μm / min.

[0037] Optionally, the hole expansion size of the via in the glass after one etching via is 5-20 μm.

[0038] Optionally, the etching via solution includes hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water. Further optionally, the etching via solution includes, in terms of mass parts:

[0039] hydrofluoric acid, 4-12 parts; sulfuric acid, 3.6-12 parts; phosphoric acid, 0.6-2 parts; ammonium fluoride, 5-15 parts; water, 130.8-334 parts;

[0040] Optionally, ultrasonic treatment is performed in the process of the etching via; further optionally, the frequency of the ultrasonic treatment is 60-120 kHz.

[0041] In some embodiments, the desalination cleaning comprises: cleaning the etched glass via a desalination solution.

[0042] Optionally, the desalination solution comprises a sulfuric acid solution. Further optionally, the mass concentration of the sulfuric acid in the sulfuric acid solution is 75% to 80%.

[0043] Optionally, the temperature of the desalination cleaning is 40°C to 50°C, and the time is 3 minutes to 10 minutes.

[0044] Optionally, the desalination cleaning is performed via ultrasonic treatment. Optionally, the frequency of the ultrasonic treatment is 60 kHz to 120 kHz.

[0045] Compared with the prior art, the present application has at least the following beneficial effects:

[0046] The present application utilizes the tooling with the hollowed-out area to support and protect the glass during the thinning process and the via process, avoids the glass from being broken during the thinning process and the via process, and can thin and via the glass to obtain an ultra-thin via glass with a thickness of 30 μm or more, thereby effectively improving the yield of the thinning and via process. BRIEF DESCRIPTION OF DRAWINGS

[0047] Figure 1 A process flow diagram of a glass thinning and via method provided in an embodiment of the present application;

[0048] Figure 2 A tooling structure diagram provided in an embodiment of the present application;

[0049] Figure 3 A lock structure diagram provided in an embodiment of the present application;

[0050] Figure 4 A structure diagram of the glass assembled to the tooling provided in an embodiment of the present application.

[0051] In the structure diagram, 100 is the tooling, 110 is the hollowed-out area, 120 is the inner milling area, 121 is the protective layer, 130 is the lock, 131 is the protective pad, 140 is the adjusting piece, 141 is the fixing hole, 150 is the safety line, and 200 is the glass. DETAILED DESCRIPTION

[0052] In order to make the above objectives, characteristics and advantages of the present application more apparent, a detailed description of the specific embodiments of the present application is provided below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described and should not be construed as being limited thereto as such. It is to be understood that the terminology used herein is for the purpose of describing the present application and is not intended to be limiting.

[0053] In addition, the terms "first", "second", etc. are used only for the purpose of description and should not be construed as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0054] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the specification of the present application is only for the purpose of describing specific embodiments and is not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0056] In the conventional technology, the glass is thinned and viaed by the glass dispensing method. After the thinning and viaing process, the thickness and flexibility of the glass change, and the glass is prone to breakage when the adhesive film is removed, which seriously affects the yield of the glass. Moreover, it is difficult to achieve thinning and viaing of ultra-thin glass below 0.1 mm by the dispensing method.

[0057] Based on this, the present application provides a glass thinning and viaing method, as shown in Figure 1 The glass thinning and viaing method comprises:

[0058] The glass is installed in a tool, as shown in Figure 2 and Figure 4As shown, the tool 100 has a hollow area 110, and the thinning area and the through-hole area of the glass 200 are exposed by the hollow area 110.

[0059] The glass installed in the tool is thinned, and then the glass is removed from the tool;

[0060] The removed glass is laser drilled, and then the glass is installed in the tool for through-hole processing, and the thinning and through-hole processing of the glass are completed.

[0061] The present application uses a tool with a hollow area to support and protect the glass during thinning and through-hole processing, avoiding glass breakage during thinning and through-hole processing, and effectively reducing the probability of glass breakage during thinning and through-hole processing. The present application can thin and through-hole to obtain ultra-thin through-hole glass with a thickness of 30μm or more, effectively improving the yield of thinning and through-hole processing.

[0062] It can be understood that, as Figure 2 shown, the hollow area 110 in the tool 100 refers to an area without shielding, and the hollow area 110 can be seen from one side of the tool 100 to the other side, so that both sides of the glass 200 can be exposed in the hollow area 110.

[0063] In some embodiments, the tool can be a plate with a hollow area in the middle. Optionally, the thickness of the plate can be 4mm-6mm. Optionally, the material of the tool can be a corrosion-resistant material, for example, the material can be PP (polypropylene) or PC (polycarbonate).

[0064] In some embodiments, as Figure 2 shown, the tool 100 further includes an inner milling area 120 arranged circumferentially along the hollow area 110, and the edge area of the glass 200 is arranged on the inner milling area 120.

[0065] The present application sets an inner milling area on the tool, which can arrange the glass on the inner milling area to realize the positioning and fixing of the glass, thereby improving the stability of the glass during processing.

[0066] It can be understood that the inner milling area 120 refers to an area where part of the tool 100 is removed, but the area does not pass through the tool 100, and the surface where the inner milling area 120 is located is lower than the surface of the tool 100.

[0067] It can be understood that the edge area of the glass is arranged on the inner milling area, that is, during the thinning and through-hole processing, the edge area of the glass is shielded by the inner milling area of the tool, and the etching speed is smaller than that of the glass in the hollow area, thereby forming a protrusion on the edge of the glass. The protrusion can improve the structural stability of the glass during processing, thereby avoiding reducing the probability of glass breakage.

[0068] It can be understood that the inner milling depth and width of the inner milling area in the tooling can be reasonably adjusted according to the size of the glass. Optionally, the inner milling depth of the inner milling area is 1mm-2mm, for example, it can be 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2.0mm. Optionally, the width of the inner milling area is 16mm-17mm, for example, it can be 16.0mm, 16.1mm, 16.2mm, 16.3mm, 16.4mm, 16.5mm, 16.6mm, 16.7mm, 16.8mm, 16.9mm or 17.0mm.

[0069] In some embodiments, as shown in Figure 1 Optionally, the protective layer 121 can be made of elastic material, for example, it can be fluororubber. Optionally, the thickness of the protective layer 121 can be 0.5mm-1mm.

[0070] In some embodiments, as shown in Figure 2 Optionally, the tooling 100 further comprises a plurality of buckles 130 arranged along the edge of the inner milling area 120, and the buckles 130 are used to fix the glass 200 on the tooling 100. It can be understood that the present application has specific requirements for the structure of the buckle, for example, the buckle comprises a fixed part arranged on the tooling, and a movable part arranged on the fixed part, the movable part can move around the fixed part, and the fixing and dismounting of the glass is realized by adjusting the movable part.

[0071] In some embodiments, as shown in Figure 3 Optionally, the tooling 100 further comprises a plurality of adjusting members 140, the adjusting members 140 are connected with the buckles 130, and the adjusting members 140 are used to adjust the relative distance between the inner milling area 120 and the buckles 130. Optionally, the adjusting member can be an adjusting knob, the adjusting knob is arranged on the tooling and fixedly connected with the buckle, and the relative distance between the buckle and the inner milling area 120 is adjusted by rotating the adjusting knob.

[0072] In some embodiments, as shown in Figure 2 and Figure 4As shown, the tooling 100 further comprises a plurality of safety lines 150, two ends of the safety lines 150 are fixed to opposite sides of the hollowed region 110 respectively, and are arranged to be spaced apart from the glass 200. Optionally, the distance between the safety lines 150 and the glass 200 can be 5mm-15mm. The safety lines are arranged on the tooling in the present application, which can prevent the deformation range of the glass from being too large during the thinning and through-hole processes, and achieve the protection of the glass, thereby avoiding the problems such as glass breakage, and sticking of the bayonet after slipping off and sticking to adjacent products.

[0073] In some embodiments, as shown in Figure 3 As shown, the adjusting member 140 is provided with a fixing hole 141, and the end of the safety line 150 is fixed to the fixing hole 141. The lock catch is arranged on the opposite side of the hollowed region, so that the safety line can be connected to the lock catch, thereby achieving the protection of the glass.

[0074] In some embodiments, the contact surface between the lock catch and the glass is provided with a protective pad. It can be understood that the protective pad has the same effect as the protective layer, which is to protect the glass.

[0075] In some embodiments, the thinning process comprises: sequentially performing pretreatment and etching treatment on the glass installed in the tooling.

[0076] The glass is sequentially pretreated and etched during the thinning process, the pretreatment can remove impurities such as oil stains on the surface of the glass, and can also repair defects on the surface of the glass, for example, can modify the concave points, scratches and micro-cracks on the surface of the glass, thereby avoiding the problems such as defect amplification and breakage during the etching process.

[0077] In some embodiments, the pretreatment comprises: sequentially using alkaline cleaning liquid and acidic cleaning liquid to clean the glass.

[0078] Optionally, the thickness reduction of the glass after the pretreatment is 10μm-35μm, for example, it can be 10μm, 15μm, 20μm, 25μm, 30μm or 35μm.

[0079] In some embodiments, the alkaline substance in the alkaline cleaning liquid comprises at least one of sodium hydroxide, potassium hydroxide and lithium hydroxide.

[0080] Optionally, the mass concentration of the alkaline substance in the alkaline cleaning liquid is 10%-15%.

[0081] Optionally, the temperature when the glass is cleaned with the alkaline cleaning liquid can be 40°C-50°C.

[0082] Optionally, the glass is cleaned with the alkaline cleaning solution, and the cleaning is assisted by ultrasonic treatment.

[0083] In some embodiments, the acidic cleaning solution includes sulfuric acid, hydrochloric acid, hydrofluoric acid, and ammonium hydrogen fluoride.

[0084] Optionally, the acidic cleaning solution includes, by mass fraction:

[0085] sulfuric acid, 65.6 parts to 76 parts; hydrochloric acid, 0.72 parts to 3.6 parts; hydrofluoric acid, 0.8 parts to 2 parts; ammonium hydrogen fluoride, 1 part to 3 parts; and water, 18 parts to 28.4 parts.

[0086] In the present application, the sulfuric acid, hydrochloric acid, hydrofluoric acid, and ammonium hydrogen fluoride are used in combination to effectively repair defects on the surface of the glass and avoid defects from being enlarged and broken pieces from occurring during etching and thinning, thereby effectively increasing the degree of thinning of the glass.

[0087] It can be understood that after the alkaline cleaning solution is used to clean the glass, the glass is washed with water, and then the glass is cleaned with the acidic cleaning solution. After the glass is cleaned with the acidic cleaning solution, the glass is also washed with water to remove the cleaning solution remaining on the surface of the glass and avoid affecting the next operation.

[0088] In some embodiments, the etching treatment includes etching and thinning the pretreated glass using an etching and thinning solution. Optionally, the temperature of the etching treatment is 20°C to 40°C.

[0089] It can be understood that the pretreated glass can be etched and thinned multiple times to achieve the required thickness of the glass. Further, the glass can be washed with water after each etching and thinning to remove the etching and thinning solution adhered to the surface of the glass.

[0090] Optionally, the etching and thinning rate of the etching and thinning solution on the glass is 3 μm / min to 6 μm / min, for example, it can be 3.0 μm / min, 3.5 μm / min, 4.0 μm / min, 4.5 μm / min, 5.0 μm / min, 5.5 μm / min, or 6.0 μm / min.

[0091] Optionally, the thickness of the glass after the etching treatment is 0.05 mm to 0.15 mm, for example, it can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, or 0.15 mm.

[0092] Optionally, the etching and thinning solution includes hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride, and water.

[0093] Further optionally, the etching thinning solution comprises, in terms of mass fraction:

[0094] hydrofluoric acid, 2.4-8 parts; sulfuric acid, 1.2-3.6 parts; phosphoric acid, 0.2-0.6 parts; ammonium fluoride, 2-5 parts; water, 25.2-66.8 parts.

[0095] The etching thinning solution selected in the application, the cooperation of hydrofluoric acid, sulfuric acid, phosphoric acid and ammonium fluoride can uniformly etch and thin the glass, the phosphoric acid can play a buffering role and dissolve the silicate on the surface of the glass, the sulfuric acid can further dissolve the salt substances, ensure the uniform etching and thinning, and avoid the problem of uneven etching; in addition, the addition of a certain proportion of ammonium fluoride can play a role in assisting etching, thereby adjusting the reaction speed and dissolving the surface impurities, improving the thinning uniformity, and thereby reducing the probability of broken pieces of the thinned glass.

[0096] It can be understood that the glass is washed after etching treatment to avoid the influence of residual etching thinning solution on the next operation.

[0097] In some embodiments, the through hole processing comprises: sequentially preforming a through hole, etching a through hole and desalting cleaning on the glass.

[0098] The application sequentially performs preforming a through hole, etching a through hole and desalting on the glass after laser drilling, the preforming a through hole can make the glass reach a micro through hole state, and then the etching a through hole is performed to enlarge the hole, effectively improving the depth-width ratio of the through hole and the efficiency of the through hole, and the desalting cleaning can effectively remove the residual salt crystals on the surface of the glass and in the through hole, thereby avoiding affecting the through hole effect, ensuring the etching uniformity of the glass surface and the through hole surface, and improving the quality of the glass through hole.

[0099] Optionally, the etching a through hole and the desalting cleaning are repeatedly performed on the glass to meet the thinning through hole requirement. For example, the number of times of etching a through hole and desalting cleaning can be adjusted according to the diameter of the through hole, and can be repeated 4-8 times. The repeated mode can be: sequentially etching a through hole and desalting cleaning on the glass after preforming a through hole, if the through hole requirement is not met, etching a through hole and desalting cleaning on the glass again until the glass through hole meets the requirement.

[0100] In some embodiments, the thickness of the glass after the through hole processing is 0.03-0.1 mm, for example, it can be 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm or 0.10 mm.

[0101] In some embodiments, the diameter of the via after the via processing is 5 μm to 100 μm, for example, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm.

[0102] In some embodiments, the pre-via processing includes cleaning the glass after the laser drilling by using an alkaline etching solution.

[0103] Optionally, the alkaline substance in the alkaline etching solution includes at least one of potassium hydroxide, sodium hydroxide and lithium hydroxide.

[0104] Optionally, the mass concentration of the alkaline substance in the alkaline etching solution is 15% to 30%, for example, 15%, 16%, 18%, 20%, 22%, 24%, 26%, 28% or 30%.

[0105] Optionally, the temperature of the pre-via processing is 60°C to 120°C, for example, 60°C, 70°C, 80°C, 90°C, 100°C, 110°C or 120°C.

[0106] Optionally, the time of the pre-via processing is 80 min to 300 min.

[0107] The pre-via processing is performed as above, which can utilize the anisotropic vertical etching of the alkaline substance to pre-via the glass modified at the laser drilling, improve the aspect ratio of the via, and improve the via efficiency of the etching via.

[0108] In some embodiments, the etching via processing includes etching the glass after the pre-via processing by using an etching via solution.

[0109] In some embodiments, the temperature of the etching via processing is 20°C to 40°C, for example, 20°C, 22°C, 24°C, 26°C, 28°C, 30°C, 32°C, 34°C, 36°C, 38°C or 40°C.

[0110] In some embodiments, the etching rate of the etching via solution to the glass is ≤ 3 μm / min, for example, 0.3 μm / min, 0.6 μm / min, 0.9 μm / min, 1.2 μm / min, 1.5 μm / min, 1.8 μm / min, 2.1 μm / min, 2.4 μm / min, 2.7 μm / min or 3.0 μm / min.

[0111] In some embodiments, the size of the via in the glass after the etching via processing is performed once is 5 μm to 20 μm, for example, 5 μm, 6 μm, 8 μm, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm or 20 μm.

[0112] The etching rate and the hole expansion size of the etching via liquid are controlled in the application, so that the etching via process is uniformly carried out, and glass fragments caused by etching damage are avoided.

[0113] In some embodiments, the etching via liquid comprises hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water. Further optionally, the etching via liquid comprises, in terms of mass fraction:

[0114] hydrofluoric acid, 4 parts to 12 parts; sulfuric acid, 3.6 parts to 12 parts; phosphoric acid, 0.6 parts to 2 parts; ammonium fluoride, 5 parts to 15 parts; water, 130.8 parts to 334 parts.

[0115] The etching via liquid is selected in the application, and the etching via reaction is uniformly carried out through the cooperation of hydrofluoric acid, sulfuric acid, phosphoric acid and ammonium fluoride, so that the etching and via effect are improved. The phosphoric acid can play a buffering role, and cooperates with the sulfuric acid to dissolve silicates and other salt substances on the surface of the glass and in the hole, so that the etching uniformity is ensured; further, the ammonium fluoride is added to play an auxiliary etching role, to adjust the reaction speed and dissolve surface impurities, and to improve the etching effect.

[0116] In some embodiments, the etching via process is performed with ultrasonic treatment. Optionally, the frequency of the ultrasonic treatment is 60 kHz to 120 kHz, for example, which can be 60 kHz, 70 kHz, 80 kHz, 90 kHz, 100 kHz, 110 kHz or 120 kHz.

[0117] In some embodiments, the desalination cleaning comprises: cleaning the glass after the etching via with a desalination solution.

[0118] The desalination cleaning can ensure that the residual salt crystals on the surface of the glass and in the via are removed, so that the etching uniformity of the etching via is ensured.

[0119] In some embodiments, the desalination solution comprises a sulfuric acid solution. Optionally, the mass concentration of sulfuric acid in the sulfuric acid solution is 75% to 80%, for example, which can be 75%, 76%, 77%, 78%, 79% or 80%.

[0120] In some embodiments, the temperature of the desalination cleaning is 40°C to 50°C, for example, which can be 40°C, 41°C, 42°C, 43°C, 44°C, 45°C, 46°C, 47°C, 48°C, 49°C or 50°C.

[0121] In some embodiments, the time of the desalination cleaning is 3 min to 10 min, for example, which can be 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min or 10 min.

[0122] In some embodiments, the desalination cleaning process is assisted by ultrasonic treatment, and the frequency of the ultrasonic treatment is 60-120 kHz, for example, 60 kHz, 70 kHz, 80 kHz, 90 kHz, 100 kHz, 110 kHz or 120 kHz.

[0123] It can be understood that, in the process of thinning and through-hole processing, the glass can be cleaned to avoid the influence of residual cleaning solution on the next process. Optionally, ultrasonic treatment can be assisted during the cleaning process to improve the cleaning effect.

[0124] In some embodiments, the thickness of the glass before thinning and through-hole processing is 0.35-1 mm, for example, 0.4-0.6 mm.

[0125] Exemplarily, a method for thinning and through-hole processing of the above glass is provided, which comprises the following steps: Figure 1 As shown in the figure, the method comprises the following steps:

[0126] S1, mounting the glass in a tool, wherein the tool has a hollow area, and the thinning area and the through-hole area of the glass are exposed by the hollow area.

[0127] S2, pretreatment: sequentially cleaning the glass with alkaline cleaning solution and acidic cleaning solution, and the thickness of the pretreated glass is 10-35 μm;

[0128] S3, etching the pretreated glass in S2, comprising: etching and thinning the pretreated glass with etching and thinning solution, and the etching and thinning rate is 3-6 μm / min, and the thickness of the glass after etching is 0.05-0.15 mm;

[0129] S4, laser drilling: removing the glass in S3 from the tool and transferring it to a laser drilling device for laser drilling;

[0130] S5, pre-through-hole: cleaning the laser-drilled glass with alkaline etching solution;

[0131] S6, etching through-hole, comprising: etching the pre-through-hole glass with etching through-hole solution;

[0132] S7, desalination cleaning, comprising: cleaning the etched through-hole glass with desalination solution;

[0133] S8, repeating the etching through-hole and the desalination cleaning to achieve the requirements of thinning and through-hole processing, and then removing the glass from the tool to obtain the glass after thinning and through-hole processing.

[0134] The embodiments of the present application will be described in detail below with examples. It should be understood that these examples are only used to illustrate the present application and not used to limit the scope of the present application. The experimental methods in the following examples without specific conditions are preferred to refer to the guidance given in the present application, and can also be according to the experimental manual or conventional conditions in the art, or according to the conditions suggested by the manufacturer, or according to the experimental methods known in the art.

[0135] In the following examples, borosilicate glass with a size of 600 mm x 600 mm x 0.55 mm is used, and the thickness difference is ± 0.01 mm. The cleaning solution in the ultrasonic cleaning is 12% sodium hydroxide solution, and the temperature is set to 45°C.

[0136] Example 1

[0137] S1, install the glass in the tool, the tool has a hollow area, the thinning area and the through hole area of the glass are exposed by the hollow area, wherein the hollow area is 15 mm inwardly recessed from one side of the glass size, the depth of the inwardly milled area is 1.5 mm, the inwardly milled area is provided with a fluororubber protective layer with a thickness of 0.5 mm, and two locks are respectively and equally spaced on each wide side of the inwardly milled area, and three locks are respectively and equally spaced on each long side, the side of the lock contacting the glass is provided with a fluororubber protective pad with a thickness of 0.5 mm, the glass is installed and fixed in the tool by the lock, and a safety line is connected on the opposite two locks.

[0138] S2, pretreatment: first clean the glass with 12% sodium hydroxide solution at 45°C for 10 min to remove surface oil; then clean the glass with an acidic cleaning solution for 60 min to repair surface defects, the mass composition of the acidic solution includes: 80wt.% sulfuric acid 92 parts, 36wt.% hydrochloric acid 5 parts, 40wt.% hydrofluoric acid 2 parts, and ammonium hydrogen fluoride 1 part. After pretreatment, the thickness of the glass is thinned by 30 μm.

[0139] S3, etching treatment is performed on the pretreated glass in S2, including: using etching thinning solution to etch the pretreated glass at 33°C for three times, and ultrasonic cleaning for 10 min after each etching thinning, the thickness of the glass after etching treatment is 84 μm.

[0140] Among them, according to the mass fraction, the etching thinning solution includes: 40wt.% HF, 6 parts; 60wt.% H2SO4, 2 parts; 20wt.% H3PO4, 1 part; NH4F, 2 parts; and water, 45 parts. The etching thinning rate is 3.5 μm / min.

[0141] S4, laser drilling: the glass in S3 is detached from the fixture and transferred to a laser drilling device for laser drilling, wherein picosecond laser ultra-short pulse modification can be used, and the drilling pitch can be 220 pm. It can be understood that the drilling pitch can be adjusted according to different patterns, and different lasers are selected according to the modification requirements of different glasses.

[0142] S5, pre-drilling: the glass after laser drilling is installed on the fixture, and the glass is cleaned at 80°C for 120 min using a 20% potassium hydroxide solution, and then washed with water.

[0143] S6, etching through hole, including: etching through hole of the glass after pre-drilling using etching through hole liquid at 28°C, and the hole expansion size of the glass after one etching through hole is 10 pm.

[0144] According to the mass fraction, the etching through hole liquid includes: 40wt.%HF, 10 parts; 60wt.%H2SO4, 6 parts; 20wt.%H3PO4, 3 parts; NH4F, 5 parts; and water, 175 parts. The etching rate is 1.5 pm / min.

[0145] S7, desalination cleaning, including: ultrasonic cleaning of the glass after etching through hole using 80% sulfuric acid at 45°C for 3 min, and the ultrasonic frequency is 60 kHz.

[0146] S8, repeating steps S6 and S7 three times to achieve the requirement of thinning the through hole, and then the glass is detached from the fixture to obtain the glass after thinning the through hole, the thickness of the glass is 41 pm, and the inner / outer diameter of the through hole is 31-36 / 43-45 pm.

[0147] Example 2

[0148] The glass is thinned and drilled according to the method of example 1, the difference is that the acid solution cleaning in step S2 is not performed.

[0149] Example 3

[0150] The glass is thinned and drilled according to the method of example 1, the difference is that the etching thinning liquid in step S3 is replaced by etching liquid, and the etching liquid is mixed according to the volume ratio of 40wt.%HF and water 1:7.

[0151] Example 4

[0152] The glass is thinned and drilled according to the method of example 1, the difference is that step S5 is not performed.

[0153] Example 5

[0154] The glass was thinned and via-etched according to the method of Example 1, except that the via-etching solution in step S6 was replaced by a via-etching solution prepared by mixing 40 wt.% HF and water at a volume ratio of 1:20.

[0155] Example 6

[0156] The glass was thinned and via-etched according to the method of Example 1, except that the desalting treatment in step S7 was not performed.

[0157] Comparative Example 1

[0158] S1, thinning treatment: the glass was directly inserted into a basket, ultrasonic cleaned for 10 min, and then etched and thinned at 33°C using an etching solution in three rounds, with the final thickness of the glass being 80-95 μm, followed by ultrasonic cleaning for 10 min, and there were broken fragments with missing teeth. The etching solution was prepared by mixing 40 wt.% HF and water at a volume ratio of 1:7, and the etching rate was 3.5 μm / min.

[0159] S2, laser drilling: the glass treated in step S1 was laser drilled according to the corresponding drawing.

[0160] S3, via-etching: the glass treated in step S2 was inserted into a basket, and via-etching was performed at 28°C using a via-etching solution. The via-etching solution was prepared by mixing 40 wt.% HF and water at a volume ratio of 1:20, and the etching rate was 1.5 μm / min. The glass was thinned and via-etched.

[0161] Comparative Example 2

[0162] S1, the glass was bonded with a thick back plate having a thickness of 1.1 mm, and the UV hot melt adhesive was used for dispensing and curing bonding and edge bonding.

[0163] S2, the glass with the bonded back plate in S1 was inserted into a basket, ultrasonic cleaned for 10 min, and then etched and thinned using the etching solution in Comparative Example 1 in three rounds, with the final thickness of the glass being 81-95 μm, followed by ultrasonic cleaning for 10 min, and there were liquid leakage and broken fragments.

[0164] S3, hot air separation and glue removal, the back plate was removed from the glass, and the glass was too thin to be blown and broken and to have glue removal fragments, and there was warping due to uneven thinning stress on the single side after separation.

[0165] S4, laser drilling: the glass was laser drilled according to the corresponding drawing;

[0166] S5, via-etching treatment: the glass treated in step S4 was inserted into a basket, cleaned, and then via-etched using the via-etching solution in Comparative Example 1, and cleaned, with the final thickness of the glass being 26-43 μm, and there were broken fragments with missing teeth.

[0167] Comparative Example 3

[0168] S1, after cleaning the glass, four sides were pasted with acid-resistant tape.

[0169] S2, the glass in S1 was inserted into a basket, ultrasonic cleaning was performed for 10 min, then etching thinning was performed using the etching solution in Comparative Example 1, in three rounds, the final thickness of the glass was 78 μm~94 μm; finally, ultrasonic cleaning was performed for 10 min, and there was a jump tooth phenomenon.

[0170] S3, laser drilling: the substrate was laser drilled according to the corresponding drawing.

[0171] S4, via processing: the glass treated in S3 was inserted into a basket, and was sequentially subjected to ultrasonic cleaning, via processing using the via solution in Comparative Example 1, and ultrasonic cleaning, the final thickness of the glass was 25 μm~45 μm, and there was a jump tooth damage.

[0172] The thinning and via processing methods of the above examples and comparative examples were evaluated, including:

[0173] (1) thinning breakage rate: the number of broken pieces after thinning was visually counted to calculate the breakage rate.

[0174] (2) via breakage rate: the number of broken pieces after via processing was visually counted to calculate the breakage rate.

[0175] (3) jump tooth and sticking pieces: the number of jump tooth and sticking pieces after via processing was visually counted.

[0176] (4) etching unevenness: visual inspection under a daylight lamp at 1000±200 lux.

[0177] (5) number and size of concave-convex points: the number of concave-convex points was visually inspected, and the size of the concave-convex points was detected using a two-dimensional measuring instrument.

[0178] (6) inner diameter and outer diameter of via and hole diameter range: a two-dimensional measuring instrument was used to test the minimum inner diameter, maximum inner diameter, minimum outer diameter and maximum outer diameter of the via, wherein the hole diameter range was the maximum inner diameter minus the minimum inner diameter.

[0179] The evaluation results are shown in Table 1.

[0180] Table 1

[0181]

[0182] Note: In the number of concave-convex points, more means that the number of concave-convex points is more than 15, and dense means that the number of concave-convex points is more than 30.

[0183] As shown in Table 1, the thinning, via breakage rate, and apparent, via effect of Example 1 of the present application are significantly better than those of Comparative Examples 1-3, avoiding the problem of breakage caused by the removal of adhesive film, and having good mass production capability and performance.

[0184] Therefore, the present application installs the glass into a tool for thinning and via formation, ensures smooth completion of the via formation of the ultra-thin glass, prevents breakage, and improves the yield of the batch production of the ultra-thin glass. Further, KOH is used for pretreatment and pre-via formation, the glass is brought to a micro-via state, and an optimized via liquid is used to bring the substrate to a preset specification. The via liquid formula and process are optimized to improve the via effect and ensure the via quality. Therefore, the method of the present application can realize the thinning and via formation of glass with a thickness of 30 μm or more, and can obtain an ultra-thin flexible via glass product.

[0185] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but it should be considered that any combination of the technical features is within the scope of the present disclosure, as long as the combination does not result in contradictions.

[0186] The above-described embodiments only express several implementation manners of the present application, and the description is specific and detailed, but it should not be considered as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these are within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims, and the description and drawings can be used to interpret the content of the claims.

Claims

1. A method of thinning a via in a glass, characterized by, The thinning and via hole method of the glass comprises: mounting the glass in a tool having a hollow region, and a thinning region and a via hole region of the glass being exposed by the hollow region; carrying out a thinning treatment on the glass mounted in the tool, and then dismounting the glass from the tool; carrying out a laser drilling on the dismounted glass, and then mounting the glass in the tool for a via hole treatment, and completing the thinning and via hole of the glass; wherein the tool further comprises an inner milling region arranged circumferentially along the hollow region, and an edge region of the glass is arranged on the inner milling region; the tool further comprises a plurality of locks arranged along edges of the inner milling region, and the locks are used for fixing the glass on the tool; the tool further comprises a plurality of adjusting members connected with the locks, and the adjusting members are used for adjusting relative distances between the inner milling region and the locks; the tool further comprises a plurality of safety lines, two ends of each of the safety lines are fixed on opposite sides of the hollow region and are arranged in a spaced manner with the glass, and fixing holes are arranged on the adjusting members, and the ends of the safety lines are fixed on the fixing holes.

2. The method of thinning a via of glass of claim 1, wherein, The inner milling depth of the inner milling region is 1mm-2mm.

3. The method of thinning a via of glass of claim 1, wherein, The width of the inner milling region is 16mm-17mm.

4. The method of thinning a via of glass of claim 1, wherein, A protective layer is arranged on a side of the inner milling region close to the glass.

5. The method of thinning a via of glass of claim 1, wherein, A protective pad is arranged on a contact surface of the lock and the glass.

6. The glass thinning via method of any of claims 1-5, wherein, The thinning treatment comprises: sequentially carrying out a pretreatment and an etching treatment on the glass mounted in the tool.

7. The method of thinning a via of glass of claim 6, wherein, The pretreatment comprises: sequentially using an alkaline cleaning solution and an acid cleaning solution to clean the glass.

8. The method of thinning a via of glass of claim 7, wherein, The thickness reduction of the glass after the pretreatment is 10μm-35μm.

9. The method of thinning a via of glass of claim 7, wherein, The alkaline substance in the alkaline cleaning solution comprises at least one of sodium hydroxide, potassium hydroxide and lithium hydroxide.

10. The method of thinning a via of glass of claim 7, wherein, The mass concentration of the alkaline substance in the alkaline cleaning solution is 10%-15%.

11. The method of thinning a via of glass of claim 7, wherein, The acid cleaning solution comprises sulfuric acid, hydrochloric acid, hydrofluoric acid and ammonium hydrogen fluoride.

12. The method of thinning a via of glass of claim 11, wherein, According to mass fraction, the acid cleaning solution comprises: sulfuric acid, 65.6-76 parts; hydrochloric acid, 0.72-3.6 parts; hydrofluoric acid, 0.8-2 parts; ammonium hydrogen fluoride, 1-3 parts; and water, 18-28.4 parts.

13. The method of thinning a via of glass of claim 6, wherein, The etching treatment comprises: using an etching thinning solution to etch and thin the glass after the pretreatment.

14. The method of thinning a via of glass of claim 13, wherein, The etching thinning rate of the etching thinning solution to the glass is 3μm / min-6μm / min.

15. The method of thinning a via of glass of claim 13, wherein, The thickness of the glass after the etching treatment is 0.05mm-0.15mm.

16. The method of thinning a via of glass of claim 13, wherein, The etching thinning solution comprises hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water.

17. The method of thinning a via of glass of claim 16, wherein, According to mass fraction, the etching thinning solution comprises: hydrofluoric acid, 2.4-8 parts; sulfuric acid, 1.2-3.6 parts; phosphoric acid, 0.2-0.6 parts; ammonium fluoride, 2-5 parts; and water, 25.2-66.8 parts.

18. The method of thinning a via of a glass according to any one of claims 1-5, wherein, The via hole treatment comprises: sequentially carrying out a pre-via hole, an etching via hole and a desalination cleaning on the glass.

19. The method of thinning a via of glass of claim 18, wherein, The etching via hole and the desalination cleaning are repeatedly carried out on the glass to achieve the thinning and via hole requirement.

20. The method of thinning a via of glass of claim 18, wherein, The thickness of the glass after the through hole processing is 0.03mm~0.1mm; the diameter of the through hole is 5μm~100μm.

21. The method of thinning a via of glass of claim 18, wherein, The pre-through hole includes: cleaning the glass after the laser drilling by using an alkaline etching solution.

22. The method of thinning a via of glass of claim 21, wherein, The alkaline substance in the alkaline etching solution includes at least one of potassium hydroxide, sodium hydroxide and lithium hydroxide.

23. The method of thinning a via of glass of claim 21, wherein, The mass concentration of the alkaline substance in the alkaline etching solution is 15%~30%.

24. The method of thinning a via of glass of claim 21, wherein, The temperature of the pre-through hole is 60℃~120℃, and the time is 80min~300min.

25. The method of thinning a via of glass of claim 18, wherein, The etching through hole includes: etching the glass after the pre-through hole by using an etching through hole solution.

26. The method of thinning a via of glass of claim 25, wherein, The etching rate of the etching through hole solution to the glass is ≤3μm / min.

27. The method of thinning a via of glass of claim 25, wherein, The size of the through hole in the glass after one etching through hole is 5μm~20μm.

28. The method of thinning a via of glass of claim 25, wherein, The etching through hole solution includes hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water.

29. The method of thinning a via of glass of claim 28, wherein, According to the mass fraction, the etching through hole solution includes: Hydrofluoric acid, 4~12 parts; sulfuric acid, 3.6~12 parts; phosphoric acid, 0.6~2 parts; ammonium fluoride, 5~15 parts; water, 130.8~334 parts.

30. The method of thinning a via of glass of claim 25, wherein, The etching through hole process is performed by ultrasonic treatment.

31. The method of thinning a via of glass of claim 30, wherein, The frequency of the ultrasonic treatment is 60kHz~120kHz.

32. The method of thinning a via of glass of claim 18, wherein, The desalination cleaning includes: cleaning the glass after the etching through hole by using a desalination solution.

33. The method of thinning a via of glass of claim 32, wherein, The desalination solution includes a sulfuric acid solution.

34. The method of thinning a via of glass of claim 33, wherein, The mass concentration of sulfuric acid in the sulfuric acid solution is 75%~80%.

35. The method of thinning a via of a glass of claim 32, wherein, The temperature of the desalination cleaning is 40℃~50℃, and the time is 3min~10min.

36. The method of thinning a via of glass of claim 32, wherein, The desalination cleaning process is performed by ultrasonic treatment.

37. The method of thinning a via of glass of claim 36, wherein, The frequency of the ultrasonic treatment is 60kHz~120kHz.

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