Glass wafer through hole machining equipment and control method thereof

Abstract

The invention relates to the technical field of glass wafer production and processing, in particular to glass wafer through hole processing equipment and a control method thereof.The glass wafer through hole processing equipment comprises a machine base, a machine cover is arranged on the periphery of the upper portion of the machine base, a mechanical arm is installed on one side of the upper portion of the machine base, and a three-dimensional driving part is installed on the rear side of the middle of the upper portion of the machine base; a bearing base is arranged in the middle of the upper portion of the machine base, and a cavity in the bearing base is open in four directions. Through distributed negative pressure formed by the annular exhaust pipe and the extension pipe, a uniform adsorption force field is formed on the bottom surface of the wafer, and deformation caused by local stress concentration is reduced; the radial elastic clamping of the silica gel clamp and the microscopic embedded positioning of the contact ball form a physical contact type error suppression system, thereby effectively counteracting wafer deformation caused by vacuum adsorption, and improving the positioning precision. The sliding seat and the linkage rod form parallelogram motion, synchronous symmetrical displacement is achieved through driving of the lead screw, and it is ensured that the center offset of the wafer is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of glass wafer production and processing, and in particular to a glass wafer through-hole processing device and a control method thereof. Background Art

[0002] Glass wafers are round precision thin sheets made of glass as the substrate. These wafers are processed through precision processes such as cutting, grinding, and polishing, and must undergo strict quality inspections to ensure that the surface flatness and thickness tolerance meet the requirements.

[0003] In the automated production process, the robotic arm cooperates with the vacuum adsorption device to complete the grasping and positioning of the wafer, but some processing defects are exposed in long-term operation: on the one hand, when the mechanical system is in continuous operation, problems such as joint wear and thermal expansion of components will gradually accumulate, causing the positioning accuracy to slowly decrease; on the other hand, the local stress generated by vacuum adsorption interacts with the wafer's own tiny deformation, further amplifying the position deviation. These hidden errors are particularly sensitive in high-precision processes such as laser drilling; when the actual position of the wafer deviates from the preset coordinates, it will cause defects such as misaligned through-hole arrangement and uneven apertures, affecting product yield. However, existing technologies rely on passive solutions such as regular shutdown calibration or strengthening component rigidity, which are difficult to solve the problem of error superposition in dynamic environments.

[0004] Therefore, it is urgent to design a glass wafer through-hole processing equipment and a control method thereof to solve the above-mentioned technical problems. Summary of the invention

[0005] In order to overcome the shortcomings of the above-mentioned prior art, the present invention provides a glass wafer through-hole processing equipment and a control method thereof to assist the positioning process of the glass wafer after adsorption, thereby realizing the through-hole processing process of the glass wafer more accurately and efficiently.

[0006] The technical implementation scheme of the present invention is: a glass wafer through-hole processing equipment, including an organic base, an organic cover is arranged on the outer periphery of the upper part of the base, a mechanical arm is installed on one side of the upper part of the base, a three-dimensional driving part is installed on the rear side of the middle part of the upper part of the base, a laser puncher is installed on the three-dimensional driving part, a bearing seat is arranged in the middle part of the upper part of the base, the cavity inside the bearing seat is designed to be open in four directions, protrusions are arranged on the four sides of the top plate of the bearing seat corresponding to the opening below, each protrusion has a slide groove, a processing table is arranged on the upper part of the top plate of the bearing seat, an adsorption component is loaded between the processing table and the top plate, each edge of the upper part of the processing table has an inclined groove, a motor is installed in the middle part of the upper part of the bearing seat, and guides are symmetrically arranged in the middle part of the lower part of the bearing seat. The guide frame is connected to the outside of the motor, a screw rod is rotatably arranged in the middle of the two guide frames, the screw rod is connected to the output shaft of the motor, a push plate is rotatably arranged outside the screw rod, the push plate is slidably connected to the guide frame, a slide seat is slidably installed in each slide groove of the protruding part of the bearing seat, a linkage rod is hinged at the lower part of each slide seat, a torsion spring is arranged in the hinge shaft at both ends of each linkage rod, a silicone clamp is slidably arranged on the upper part of each slide seat, the clamping end of each silicone clamp is designed to be inclined, the inclined part is in sliding contact with the inclined groove, a spring is arranged at the sliding connection between the silicone clamp and the slide seat, a ring seat is commonly arranged between the hinge shafts at the lower part of each linkage rod, the middle part of the ring seat is hollowed out, the push plate is in sliding contact with the ring seat, so that it moves in a straight line around the outside of the guide frame.

[0007] Preferably, it also includes a main control module and a touch screen. The main control module for centrally controlling the operation of various electrical components is installed on the inner side of the hood, and a touch screen is installed on the upper part of the hood and on one side of the main control module. The touch screen is electrically connected to the main control module.

[0008] Preferably, a temperature and pressure integrated unit is also included. A temperature and pressure integrated unit for real-time monitoring of processing temperature and environment is installed on the side of the upper part of the hood away from the touch screen, and the temperature and pressure integrated unit is electrically connected to the touch screen.

[0009] Preferably, the adsorption component includes an exhaust pipe, a vacuum pump and an extension tube. A ring-shaped exhaust pipe is installed in the middle of the upper inner part of the support seat, and a vacuum pump connected to the exhaust pipe is installed on the upper inner side of the support seat. The upper part of the exhaust pipe is symmetrically connected to a plurality of vertical extension tubes. Each extension tube passes through the upper inner part of the support seat and is placed inside the processing table. The suction end of the extension tube is flush with the upper surface of the processing table, and a filter is provided therein.

[0010] Preferably, it also includes a lifting plate, a matching piece, a push rod, two torsion springs and a contact ball. Lifting plates are hinged on both sides of the middle of the upper inner part of the support seat. The two lifting plates are in rotational contact with the push plate below. The two lifting plates are symmetrically hinged on both ends facing outwards with matching pieces. A push rod is hinged in the middle of each matching piece. Each push rod slides through the upper inner part of the support seat and the inside of the processing table. Two torsion springs are arranged at both ends of the hinge axis between each push rod and the corresponding matching piece. A contact ball is embedded in the upper inner part of each push rod and is rotatably arranged. The contact ball contacts the lower surface of the glass wafer.

[0011] Preferably, it also includes an air collecting hood, a push rack, a pressure relief push plate, an air pipe, an air outlet head, two springs and a dust collecting frame. Two air collecting hoods are installed on the upper part of the processing platform below the three-dimensional driving group. The two air collecting hoods are respectively located on both sides of one of the slide seats located between the two. The lower parts of the two air collecting hoods are slidably connected with a push rack. The cross bar at the lower part of the push rack is provided with an inclined surface that slides in contact with the lower part of the slide seat. A pressure relief push plate with an outer contour adapted to its inner wall is slidably arranged inside the air collecting hood. The lower parts of the two pressure relief push plates are connected to the rod-shaped part at the upper part of the push rack. The upper parts of the two air collecting hoods are both connected to the air pipe. The air outlet ends of the two air pipes are both connected to the air outlet head. Two springs are provided between the rod-shaped part and the lower part of the air collecting hood. One-way valve ports for gas circulation are installed on the upper side parts of the two air collecting hoods. A dust collecting frame is provided on the side of the upper part of the processing platform away from the two air outlet heads. Two dust inlet chambers are provided on the upper part of the dust collecting frame, and both correspond to the air outlet ends of the two air outlet heads.

[0012] Preferably, an environmental monitor, a purifier, an exhaust pipe and an air suction hood are further included. The environmental monitors are symmetrically installed on both sides of the upper part of the supporting seat. The environmental monitor is placed inside the processing table, and its detection end is flush with the processing table. A purifier is installed on the upper side of the machine cover. The exhaust end of the purifier is connected to the exhaust pipe, and the exhaust pipe is connected and runs through the side of the machine cover. The inlet end of the purifier is connected to the exhaust hood, and the exhaust hood is close to the processing table and above it.

[0013] A glass wafer through-hole processing control method is based on a glass wafer through-hole processing device and includes the following steps: S1. First, the gripper at the end of the robot arm grabs the glass wafer and transfers it to the surface of the processing table. The vacuum pump starts the exhaust program, and the extension tube forms a ring-shaped negative pressure area on the bottom surface of the wafer. The filter intercepts dust particles. The main control module starts the motor to reverse, and the corresponding screw rotates clockwise, so that the push plate slides down along the guide frame, and the push plate moves down to push the ring seat to move down synchronously along the outside of the guide frame, so that the linkage rod rotates and closes, and the slide seat is pulled by the linkage rod to slide toward each other along the slide groove. The moving speed is accurately controlled by the screw rod speed. The inclined part of the silicone clamp contacts the inclined groove to generate an oblique force, so that the silicone clamp compression spring slides up, and the slide seat continues to move inward. When the distance between the slide seats reaches the edge of the wafer diameter, the silicone clamp elastically deforms to generate a radial clamping force to position and clamp the glass wafer. S2. At the same time, the lifting plate and the pushing plate are separated from the rotational conflict, and rotate downward under the action of the second torsion spring, driving the matching part to rotate upward. The ejector rod is pulled upward by the matching part to slide, and the contact ball protrudes a small distance from the surface of the processing table and forms a multi-point contact support with the lower surface of the wafer. The contact ball sinks into the surface of the wafer under the action of negative pressure to form a micro positioning reference; S3. When the adsorption pressure is stable, the laser processing ready signal of the laser puncher is triggered, and the three-dimensional drive unit drives the laser puncher according to the spiral path, so that the laser pulse frequency dynamically matches the aperture, and the glass wafer is processed through the hole. While the slide seat slides, the inclined surface of the push frame crossbar is out of contact with the lower part of the slide seat, and the second spring is released to make the push frame rise. The pressure relief push plate is moved by the rising action of the push frame, so that the volume of the gas collection hood is expanded to generate negative pressure, and the dust-containing airflow is sucked in through the one-way valve port. The processing debris enters the air pipe with the airflow, and is ejected from the air outlet head, and the dust particles are captured by the dust collection frame; S4. When the environmental monitor detects that the particulate matter content or temperature of the processing environment increases, the main control module executes the dynamic adjustment program, triggers the purifier to start, and captures the suspended particles and hot air flow in the processing area through the suction hood, and discharges them from the exhaust pipe after purification by the multi-layer filter element. At the same time, according to the feedback data of the temperature and pressure integrated unit, if the temperature exceeds the threshold, the three-dimensional drive unit automatically reduces the moving speed of the laser drilling instrument and prolongs the pulse interval time to reduce heat accumulation; S5. After completing the current wafer through-hole processing, the main control module executes the reset command, the motor rotates forward to drive the lead screw to rotate counterclockwise, the push plate moves upward along the guide frame to push the ring seat upward synchronously, the linkage rod rotates in the opposite direction to drive the slide seat to slide outward and reset, the silicone clamp retracts under the action of spring 1 to release the clamping, the vacuum pump stops running, the negative pressure adsorption is released, the lifting plate is pushed upward by the push plate, and the push rod is driven downward through the matching parts, and the contact ball retracts into the processing table. At this time, the robot arm re-grabs the processed wafer and transfers it to the next process; S6. Finally, the main control module starts the self-test program. After inputting the next wafer processing parameters through the touch screen, the three-dimensional drive unit drives the laser puncher to perform empty movement calibration, uses the preset reference mark points on the edge of the processing table to perform coordinate compensation calculation, and updates the linkage mapping relationship between the robot arm grasping path and the laser positioning coordinates. At the same time, the pressure relief push plate compresses the gas in the gas collection hood during the reset process of the push frame, and sprays the residual dust into the collection frame to complete the processing cycle preparation.

[0014] The beneficial effects of the present invention are as follows: 1. The present invention forms a uniform adsorption force field on the bottom surface of the wafer through the distributed negative pressure composed of the annular exhaust pipe and the extension tube, thereby reducing the deformation caused by local stress concentration; the radial elastic clamping of the silicone clamp and the microscopic embedded positioning of the contact ball form a physical contact error suppression system, which effectively offsets the wafer deformation caused by vacuum adsorption and improves the positioning accuracy; the slide seat and the linkage rod form a parallelogram motion, and realize synchronous symmetrical displacement through the screw drive to ensure that the center offset of the wafer is reduced.

[0015] 2. The present invention realizes vertical displacement of the ejector pin by disengaging and rotating the ejection plate and the push plate, and driving the mating part to rotate under the drive of the torsion spring 2, so that the contact ball is embedded in a small depth to form a micro positioning reference, which can further reduce the local deformation of the bottom surface of the wafer caused by vacuum adsorption.

[0016] 3. The present invention uses the negative pressure adsorption of the gas collecting hood and the linkage design of the pressure relief push plate to capture processing debris in real time during the laser processing process, and cooperates with the dust collection frame to avoid energy attenuation caused by laser lens contamination; the environmental monitor and the purifier work together to dynamically monitor and purify suspended particles in the processing area, which can reduce the impact of particle deposition on the optical system and improve the consistency of through-hole processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is an assembly schematic diagram of the present invention.

[0018] Figure 2 It is a three-dimensional structural schematic diagram of the machine base, mechanical arm, bearing base and other components of the present invention.

[0019] Figure 3 It is a schematic diagram of the three-dimensional structure of the three-dimensional driving part and the laser drilling device of the present invention.

[0020] Figure 4 It is a three-dimensional structural schematic diagram of the processing table, contact ball, gas collecting cover and other components of the present invention.

[0021] Figure 5 It is a schematic cross-sectional structural diagram of the processing platform and the environmental monitoring instrument of the present invention.

[0022] Figure 6 It is a three-dimensional structural schematic diagram of the linkage rod, vacuum pump, push frame and other components of the present invention.

[0023] Figure 7 It is a schematic diagram of the exploded structure of the motor, guide frame, lead screw and other components of the present invention.

[0024] Figure 8 It is a schematic cross-sectional view of the components of the present invention, including the linkage rod, torsion spring 1 and silicone clamp.

[0025] Fig. 9It is a three-dimensional structural schematic diagram of the processing table, the exhaust pipe, the lifting plate and other components of the present invention.

[0026] Fig.10 It is a three-dimensional structural schematic diagram of components such as the lifting plate, matching parts and the ejector rod of the present invention.

[0027] Fig.11 It is a three-dimensional structural schematic diagram of the processing table, gas collection hood, environmental monitoring instrument and other components of the present invention.

[0028] Fig.12 It is a three-dimensional structural schematic diagram of the sliding seat, gas collecting cover, pushing frame and other components of the present invention.

[0029] Fig.13 It is a schematic cross-sectional view of the gas collecting hood, push frame, pressure relief push plate and other components of the present invention.

[0030] Fig.14 It is a three-dimensional structural schematic diagram of the machine base, machine cover, bearing base and other components of the present invention.

[0031] The markings of the components in the attached drawings are as follows: 1. Machine base, 100. Main control module, 101. Temperature and pressure integrated unit, 102. Touch screen, 11. Machine cover, 12. Robotic arm, 13. Three-dimensional drive unit, 14. Laser puncher, 2. Bearing seat, 21. Processing table, 3. Motor, 31. Guide frame, 32. Screw rod, 33. Push plate, 34. Slide seat, 35. Linkage rod, 36. Torsion spring 1, 37. Silicone clamp, 38. Spring 1. 39. Ring seat. 4. Exhaust pipe. 41. Vacuum pump. 42. Extension pipe. 5. Lifting plate. 51. Fitting. 52. Push rod. 53. Torsion spring 2. 54. Contact ball. 6. Air collecting hood. 61. Push rack. 62. Pressure relief push plate. 63. Air pipe. 64. Air outlet. 65. Spring 2. 66. One-way valve port. 67. Dust collecting frame. 7. Environmental monitor. 71. Purifier. 72. Discharge pipe. 73. Air hood. DETAILED DESCRIPTION

[0032] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0033] In addition, the terms "first", "second" and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. It should be noted that the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0034] Embodiment: A glass wafer through-hole processing device, such as Figure 1-Figure 9 and Fig.11 , Fig.12 and Fig.14As shown, it includes a base 1, which serves as the main frame of the equipment and provides structural support and installation reference. A cover 11 is provided on the outer periphery of the upper part of the base 1 by bolts. The cover 11 is a semi-open design, which can reduce environmental interference and ensure processing stability. A servo-driven mechanical arm 12 is installed on one side of the upper part of the base 1. The mechanical arm 12 is responsible for grabbing, transferring and placing glass wafers, and accurately positioning the wafers on the processing table 21 through the clamping claws. A three-dimensional driving part 13 is installed on the rear side of the middle of the upper part of the base 1. A laser puncher 14 is installed on the three-dimensional driving part 13 through a slide rail mechanism. The three-dimensional driving part 13 controls the precise movement of the laser puncher 14 in the X, Y and Z axis directions, and performs through-hole processing according to a preset spiral path. The laser puncher 14 emits high-energy laser pulses to perform through-hole processing on the glass wafer. A bearing seat 2 is provided in the middle of the upper part of the machine base 1 through bolts. The cavity inside the bearing seat 2 is designed to be open in four directions. The four sides of the top plate of the bearing seat 2 are provided with protrusions corresponding to the openings below. Each protrusion has a slide groove. A processing table 21 is provided on the upper part of the top plate of the bearing seat 2 through bolts. The processing table 21 is a wafer processing bearing surface. An adsorption component is loaded between the processing table 21 and the top plate. Each edge of the upper part of the processing table 21 is provided with an inclined groove. A motor 3 is installed in the middle of the upper part of the bearing seat 2. A guide frame 31 is symmetrically provided in the middle of the lower part of the bearing seat 2. The guide frame 31 is connected to the outside of the motor 3. A screw rod 32 is rotatably provided in the middle of the two guide frames 31. The screw rod 3 2 is connected to the output shaft of the motor 3, a push plate 33 is arranged for rotation outside the screw rod 32, the push plate 33 is slidably connected to the guide frame 31, the guide frame 31 and the screw rod 32 constitute a linear motion guide mechanism to ensure the stable displacement of the push plate 33, a slide seat 34 is slidably installed in each slide groove of the protruding part of the bearing seat 2, and a linkage rod 35 is hinged at the lower part of each slide seat 34, and the linkage rod 35 converts the linear motion of the push plate 33 into the radial clamping action of the slide seat 34, and a torsion spring 36 is arranged in the hinge shaft at both ends of each linkage rod 35, and a silicone clamp 37 is slidably arranged on the upper part of each slide seat 34, and the clamping end of each silicone clamp 37 is inclined, and the inclined part is in sliding contact with the inclined groove, and the silicone clamp 37 is connected to the inclined groove through the inclined part. The groove contacts the guide frame 31, causing its elastic deformation to generate radial clamping force to fix the edge of the wafer. A spring 38 is provided at the sliding connection between the silicone clamp 37 and the slide seat 34. A ring seat 39 is provided between the hinge shafts at the lower parts of each linkage rod 35. The motor 3 drives the lead screw 32 to rotate forward and reverse, and the push plate 33 slides along the guide frame 31, driving the ring seat 39 and the linkage rod 35 to move. The middle part of the ring seat 39 is hollowed out, and the push plate 33 slides in contact with the ring seat 39, causing it to move in a straight line around the outside of the guide frame 31. The push plate 33 converts the rotational motion of the lead screw 32 into displacement of the slide seat 34 by sliding in contact with the ring seat 39. The slide seat 34 slides along the bearing seat slot, and forms a parallelogram mechanism with the ring seat 39 through the linkage rod 35 to achieve synchronous symmetrical displacement.

[0035] like Figure 1 and Fig.14 As shown, it also includes a main control module 100 and a touch screen 102. The main control module 100 for centrally controlling the operation of various electrical components is installed on the inner side of the hood 11. The main control module 100 is a prior art, which can centrally control the robot arm 12, the three-dimensional drive unit 13, the laser puncher 14, the motor 3, the vacuum pump 41 and the purification system and other components, and execute the coordinate compensation algorithm and the dynamic adjustment program. The touch screen 102 is installed on the upper part of the hood 11 and on one side of the main control module 100. The touch screen 102 is electrically connected to the main control module 100, and the touch screen 102 realizes a human-computer interaction interface to input processing parameters and display real-time data.

[0036] like Figure 1 and Fig.14 As shown, a temperature-pressure integrated unit 101 is also included. The temperature-pressure integrated unit 101 for real-time monitoring of processing temperature and environment is installed on the upper side of the hood 11 away from the touch screen 102. The temperature-pressure integrated unit 101 is electrically connected to the touch screen 102. The temperature-pressure integrated unit 101 monitors temperature and pressure fluctuations and feeds back to the main control module 100 to dynamically adjust processing parameters.

[0037] like Figure 6 , Fig. 9 and Fig.11 As shown, the adsorption component includes an exhaust pipe 4, a vacuum pump 41 and an extension pipe 42. A ring-shaped exhaust pipe 4 is installed in the middle of the upper inner part of the support seat 2, and a vacuum pump 41 connected to the exhaust pipe 4 is installed on the upper inner side of the support seat 2. The exhaust pipe 4 generates negative pressure through the vacuum pump 41 to form a uniform adsorption force field on the bottom surface of the wafer. A plurality of vertical extension pipes 42 are symmetrically connected to the upper part of the exhaust pipe 4. Each extension pipe 42 passes through the upper inner part of the support seat 2 and is placed inside the processing table 21. The suction end of the extension pipe 42 is flush with the upper surface of the processing table 21, and a filter is provided therein. The extension pipe 42 transmits the negative pressure to the surface of the processing table 21, and the filter intercepts dust to prevent clogging.

[0038] like Figure 4 , Figure 6 and Figure 9-11As shown, it also includes a lifting plate 5, a matching piece 51, a push rod 52, a torsion spring 53 and a contact ball 54. The lifting plates 5 are hinged on both sides of the middle of the upper inner part of the bearing seat 2. The two lifting plates 5 are both in rotational contact with the push plate 33 below. The two lifting plates 5 are symmetrically hinged at both ends facing outward with matching pieces 51. The middle of each matching piece 51 is hinged with a push rod 52. Each push rod 52 slides through the upper inner part of the bearing seat 2 and the inside of the processing table 21. The two ends of the hinge axis of each push rod 52 and the corresponding matching piece 51 are provided with a torsion spring 53. The lifting plate 5 and the push plate 3 3 rotates and resists, and the matching piece 51 is driven to rotate by the torsion spring 53. A contact ball 54 is embedded in the upper part of each push rod 52 and is rotatable. The contact ball 54 contacts the lower surface of the glass wafer to form a micro positioning reference. When the push plate 33 moves downward, it is free from the resistance of the lifting plate 5. The lifting plate 5 rotates downward under the action of the torsion spring 53, driving the matching piece 51 to rotate upward. The push rod 52 moves upward to make the contact ball 54 protrude from the surface of the processing table 21. When the push plate 33 is reset, the lifting plate 5 is pushed upward and rotated, and the contact ball 54 retracts into the inside of the processing table 21.

[0039] like Figure 4 , Figure 6 and Figure 11-13 As shown, it also includes an air collecting hood 6, a push frame 61, a pressure relief push plate 62, an air pipe 63, an air outlet head 64, a spring 65 and a dust collecting frame 67. Two air collecting hoods 6 are installed on the upper part of the processing table 21 below the three-dimensional driving group. The two air collecting hoods 6 are respectively located on both sides of one of the slides 34 located between the two. The lower parts of the two air collecting hoods 6 are slidably connected with a push frame 61. The cross bar at the lower part of the push frame 61 is provided with an inclined surface that slides against the lower part of the slide 34. A pressure relief push plate 62 with an outer profile adapted to its inner wall is slidably provided inside the air collecting hood 6. The lower parts of the two pressure relief push plates 62 are connected to the rod-shaped part at the upper part of the push frame 61. The air collecting hood 6 is linked with the push frame 61 through the pressure relief push plate 62 to expand the volume to generate negative pressure and absorb processing debris in real time. The upper parts of the two air collecting hoods 6 are connected with air pipes 63. The air outlet ends of 63 are connected to air outlet heads 64, and a spring 2 65 is arranged between the rod-shaped portion and the lower part of the air collecting hood 6. The spring 2 65 provides a reset elastic force. When the slide seat 34 moves inward, its outer edge contacts the inclined surface of the cross bar of the push frame 61, pushing the push frame 61 to move downward, thereby compressing the spring 2 65. When the slide seat 34 is reset, the spring 2 65 releases the elastic force, and the push frame 61 moves upward to drive the pressure relief push plate 62 to expand the volume of the air collecting hood 6, generating negative pressure to absorb dust. The upper side parts of the two air collecting hoods 6 are both equipped with a one-way valve port 66 for gas circulation. A dust collecting frame 67 is arranged on the side of the upper part of the processing table 21 away from the two air outlet heads 64. Two dust inlet chambers are arranged on the upper part of the dust collecting frame 67, and both correspond to the air outlet ends of the two air outlet heads 64. The dust collecting frame 67 captures dust particles to avoid contamination of the laser lens.

[0040] like Figure 2As shown, it also includes an environmental monitor 7, a purifier 71, an exhaust pipe 72 and an air suction hood 73. The environmental monitors 7 are symmetrically installed on both sides of the upper part of the supporting seat 2. The environmental monitor 7 is placed inside the processing table 21, and its detection end is flush with the processing table 21. The purifier 71 is installed on the upper side of the machine cover 11. The environmental monitor 7 detects the concentration and temperature of particulate matter in the processing area in real time, triggering the purifier 71 to start. The exhaust end of the purifier 71 is connected to the exhaust pipe 72, and the exhaust pipe 72 is connected and runs through the side of the machine cover 11. The inlet end of the purifier 71 is connected to the air suction hood 73, and the air suction hood 73 is close to the processing table 21 and above it. The purifier 71 captures suspended particles and hot air flow through the air suction hood 73, and they are discharged from the exhaust pipe 72 after purification by the filter element.

[0041] A glass wafer through-hole processing control method is based on a glass wafer through-hole processing device and includes the following steps: S1. First, the gripper at the end of the robot arm 12 grabs the glass wafer and transfers it to the surface of the processing table 21. The vacuum pump 41 starts the exhaust program. The extension tube 42 forms a ring-shaped negative pressure area on the bottom surface of the wafer. The filter screen intercepts dust particles. The main control module 100 starts the motor 3 to reverse, and the corresponding screw 32 rotates clockwise, so that the push plate 33 slides downward along the guide frame 31, and the push plate 33 moves downward to push the ring seat 39 to move synchronously downward along the outside of the guide frame 31, so that the linkage rod 35 rotates and retracts. The slide seat 34 is pulled by the linkage rod 35 to slide toward each other along the slide groove. The moving speed is accurately controlled by the rotation speed of the screw 32. The inclined part of the silicone clamp 37 contacts the inclined groove to generate an oblique force, so that the silicone clamp 37 compresses the spring 38 to slide up, and the slide seat 34 continues to move inward. When the distance between the slide seats 34 reaches the edge of the wafer diameter, the silicone clamp 37 elastically deforms to generate a radial clamping force to position and clamp the glass wafer. S2. At the same time, the lifting plate 5 is separated from the rotational conflict with the pushing plate 33, and rotates downward under the action of the torsion spring 53, driving the matching piece 51 to rotate upward, and the ejector rod 52 slides upward under the traction of the matching piece 51, and the contact ball 54 protrudes a small distance from the surface of the processing table 21 and forms a multi-point contact support with the lower surface of the wafer, and the contact ball 54 sinks into the surface of the wafer under the action of negative pressure to form a micro positioning reference; S3. When the adsorption pressure is stable, the laser processing ready signal of the laser puncher 14 is triggered, and the three-dimensional driving unit 13 drives the laser puncher 14 along a spiral path, so that the laser pulse frequency dynamically matches the aperture, and the glass wafer is processed through a hole. While the slide 34 slides, the inclined surface of the cross bar of the push frame 61 is out of contact with the lower part of the slide 34, and the spring 2 65 is released to make the push frame 61 rise. The pressure relief push plate 62 is moved by the rising action of the push frame 61, so that the volume of the gas collecting hood 6 is expanded to generate negative pressure, and the dust-containing airflow is sucked in through the one-way valve port 66. The processing debris enters the air pipe 63 with the airflow, and is ejected from the air outlet head 64, and the dust particles are captured by the dust collecting frame 67; S4. When the environmental monitor 7 detects that the particulate matter content or temperature of the processing environment increases, the main control module 100 executes the dynamic adjustment program, triggers the purifier 71 to start, and captures the suspended particles and hot air flow in the processing area through the suction hood 73, and discharges them through the discharge pipe 72 after purification by the multi-layer filter element. At the same time, according to the feedback data of the temperature and pressure integrated unit 101, if the temperature exceeds the threshold, the three-dimensional drive unit 13 automatically reduces the moving speed of the laser drilling instrument 14 and prolongs the pulse interval time to reduce heat accumulation; S5. After the current wafer through-hole processing is completed, the main control module 100 executes the reset command, the motor 3 rotates forward to drive the screw 32 to rotate counterclockwise, the push plate 33 moves upward along the guide frame 31 to push the ring seat 39 to move upward synchronously, the linkage rod 35 rotates in the opposite direction to drive the slide seat 34 to slide outward and reset, the silicone clamp 37 retracts under the action of the spring 38 to release the clamping, the vacuum pump 41 stops running, the negative pressure adsorption is released, the lifting plate 5 is pushed upward by the push plate 33, and the push rod 52 is driven downward by the matching piece 51, and the contact ball 54 is retracted into the processing table 21. At this time, the robot arm 12 re-grasps the processed wafer and transfers it to the next process; S6. Finally, the main control module 100 starts the self-test program. After inputting the next wafer processing parameters through the touch screen 102, the three-dimensional drive unit 13 drives the laser puncher 14 to perform empty movement calibration, uses the preset reference mark points on the edge of the processing table 21 to perform coordinate compensation calculation, and updates the linkage mapping relationship between the grasping path of the robot arm 12 and the laser positioning coordinates. At the same time, the pressure relief push plate 62 compresses the gas in the gas collecting hood 6 during the resetting process of the push frame 61, and sprays the residual dust into the collection frame to complete the processing cycle preparation.

[0042] The above description is only an example of the present invention and is not intended to limit the present invention. Any equivalent substitutions made within the principles of the present invention should be included in the protection scope of the present invention. The contents not elaborated in detail in the present invention belong to the existing technologies known to those skilled in the art.

Claims

1. A glass wafer through-hole processing device, comprising a base (1); wherein: The machine also includes a machine cover (11) arranged on the outer periphery of the upper part of the machine base (1), a mechanical arm (12) installed on one side of the upper part of the machine base (1), a three-dimensional driving part (13) installed on the rear side of the middle part of the upper part of the machine base (1), a laser drilling device (14) installed on the three-dimensional driving part (13), a bearing seat (2) arranged in the middle part of the upper part of the machine base (1), a cavity inside the bearing seat (2) having a four-way open design, protrusions are provided at the four sides of the top plate of the bearing seat (2) corresponding to the open part below, each protrusion has a slide groove, a processing table (21) is arranged on the upper part of the top plate of the bearing seat (2), an adsorption component is loaded between the processing table (21) and the top plate, and each edge of the upper part of the processing table (21) has an inclined groove, a motor (3) is installed in the middle part of the upper part of the bearing seat (2), a guide frame (31) is symmetrically arranged in the middle part of the lower part of the bearing seat (2), the guide frame (31) is connected to the outside of the motor (3), and the middle part of the two guide frames (31) is rotatably provided with The screw rod (32) is connected to the output shaft of the motor (3), a push plate (33) is rotatably arranged outside the screw rod (32), the push plate (33) is slidably connected to the guide frame (31), a slide seat (34) is slidably installed in each slide groove of the protruding part of the bearing seat (2), a linkage rod (35) is hinged at the lower part of each slide seat (34), a torsion spring (36) is arranged in the hinge shaft at both ends of each linkage rod (35), and a slide seat (34) is slidably arranged in the upper part of each slide seat (34). A silicone clamp (37) is provided, and the clamping end of each silicone clamp (37) is designed to be inclined. The inclined portion is in sliding contact with the inclined groove. A spring (38) is provided at the sliding connection between the silicone clamp (37) and the slide seat (34). A ring seat (39) is provided between the hinge shafts at the lower part of each linkage rod (35). The middle part of the ring seat (39) is hollowed out, and the push plate (33) is in sliding contact with the ring seat (39), so that it moves linearly around the outside of the guide frame (31).

2. The glass wafer through-hole processing equipment according to claim 1 is characterized in that: The invention also comprises a main control module (100) and a touch screen (102); the main control module (100) for centrally controlling the operation of various electrical components is installed on the inner side of the hood (11); the touch screen (102) is installed on the upper side of the hood (11) and on one side of the main control module (100); the touch screen (102) is electrically connected to the main control module (100).

3. The glass wafer through-hole processing equipment according to claim 2 is characterized in that: It also includes a temperature and pressure integrated unit (101). The temperature and pressure integrated unit (101) for real-time monitoring of processing temperature and environment is installed on a side of the upper part of the machine cover (11) away from the touch screen (102). The temperature and pressure integrated unit (101) is electrically connected to the touch screen (102).

4. A glass wafer through-hole processing device according to claim 3, characterized in that: The adsorption component comprises an exhaust pipe (4), a vacuum pump (41) and an extension pipe (42); an exhaust pipe (4) arranged in a ring is installed in the middle of the upper inner part of the support seat (2); a vacuum pump (41) connected to the exhaust pipe (4) is installed on the upper inner side of the support seat (2); a plurality of vertical extension pipes (42) are symmetrically connected to the upper part of the exhaust pipe (4); each extension pipe (42) passes through the upper inner part of the support seat (2) and is placed inside the processing table (21); an intake end of the extension pipe (42) is flush with the upper surface of the processing table (21), and a filter is provided therein.

5. The glass wafer through-hole processing equipment according to claim 4 is characterized in that: It also includes a lifting plate (5), a matching piece (51), a push rod (52), two torsion springs (53) and a contact ball (54). The lifting plates (5) are hinged on both sides of the middle of the upper inner part of the bearing seat (2). The two lifting plates (5) are rotatably opposed to the push plate (33) below. The two lifting plates (5) are symmetrically hinged on the outward ends of the two lifting plates (5). The middle part of each matching piece (51) is hinged with a push rod (52). Each push rod (52) slides through the upper inner part of the bearing seat (2) and the inside of the processing table (21). Two torsion springs (53) are arranged at both ends of the hinge axis between each push rod (52) and the corresponding matching piece (51). A contact ball (54) is embedded and rotatably arranged in the upper inner part of each push rod (52). The contact ball (54) contacts the lower surface of the glass crystal.

6. The glass wafer through-hole processing equipment according to claim 5 is characterized in that: It also includes an air collecting hood (6), a push frame (61), a pressure relief push plate (62), an air delivery pipe (63), an air outlet head (64), a second spring (65) and a dust collecting frame (67). Two air collecting hoods (6) are installed on the upper part of the processing table (21) below the three-dimensional driving group. The two air collecting hoods (6) are respectively located on both sides of one of the slide seats (34) located between the two. The lower parts of the two air collecting hoods (6) are slidably connected to the push frame (61). The cross bar at the lower part of the push frame (61) is provided with an inclined surface that slidably contacts the lower part of the slide seat (34). The air collecting hood (6) is slidably provided with a pressure relief push plate (62) whose outer contour is adapted to the inner wall thereof. The lower parts of the two pressure relief push plates (62) are connected to the rod-shaped parts of the upper part of the push frame (61), the upper parts of the two gas collecting hoods (6) are connected to the gas supply pipes (63), the gas outlet ends of the two gas supply pipes (63) are connected to the gas outlet heads (64), a spring 2 (65) is arranged between the rod-shaped parts and the lower part of the gas collecting hood (6), the upper side parts of the two gas collecting hoods (6) are installed with a one-way valve port (66) for gas circulation, and a dust collection frame (67) is arranged on the side of the upper part of the processing table (21) away from the two gas outlet heads (64), and two dust inlet chambers are arranged on the upper part of the dust collection frame (67), and both correspond to the gas outlet ends of the two gas outlet heads (64).

7. The glass wafer through-hole processing equipment according to claim 6 is characterized in that: It also includes an environmental monitor (7), a purifier (71), an exhaust pipe (72) and an air suction hood (73). The environmental monitors (7) are symmetrically mounted on both sides of the upper portion of the support base (2). The environmental monitors (7) are placed inside the processing table (21), and the detection end thereof is flush with the processing table (21). The purifier (71) is mounted on the upper side of the inner portion of the machine cover (11). The exhaust end of the purifier (71) is connected to the exhaust pipe (72), and the exhaust pipe (72) is connected to and passes through the side of the machine cover (11). The inlet end of the purifier (71) is connected to the air suction hood (73), and the air suction hood (73) is close to the processing table (21) and is located above it.

8. A method for controlling through-hole processing of a glass wafer, according to the glass wafer through-hole processing equipment of claim 7, characterized in that: The following steps are included: S1. First, the gripper at the end of the robot arm (12) grabs the glass wafer and transfers it to the surface of the processing table (21). The vacuum pump (41) starts the exhaust program, and the extension tube (42) forms a ring-shaped negative pressure area on the bottom surface of the wafer. The filter screen intercepts dust particles. The main control module (100) starts the motor (3) to reverse, and the corresponding screw rod (32) rotates clockwise, so that the push plate (33) slides downward along the guide frame (31), and the push plate (33) moves downward to push the ring seat (39) along the outside of the guide frame (31) synchronously downward. The sliding seat (34) is pulled by the linkage rod (35) to slide toward each other along the sliding groove, and the moving speed is precisely controlled by the rotation speed of the lead screw (32). The inclined portion of the silicone clamp (37) contacts the inclined groove to generate an oblique force, so that the silicone clamp (37) compresses the spring one (38) to slide upward, and the sliding seat (34) continues to move inward. When the distance between the sliding seats (34) reaches the edge of the wafer diameter, the silicone clamp (37) elastically deforms to generate a radial clamping force to position and clamp the glass wafer; S2. At the same time, the lifting plate (5) and the pushing plate (33) are separated from the rotational conflict and rotate downward under the action of the second torsion spring (53), driving the matching piece (51) to rotate upward. The lifting rod (52) is pulled upward by the matching piece (51) to slide upward. The contact ball (54) protrudes a small distance from the surface of the processing table (21) and forms a multi-point contact support with the lower surface of the wafer. The contact ball (54) sinks into the surface of the wafer under the action of negative pressure to form a micro positioning reference. S3. When the adsorption pressure is stable, the laser processing ready signal of the laser puncher (14) is triggered, and the three-dimensional driving unit (13) drives the laser puncher (14) along a spiral path, so that the laser pulse frequency dynamically matches the aperture, and through-hole processing is performed on the glass wafer. While the slide (34) slides, the inclined surface of the cross bar of the push frame (61) is out of contact with the lower part of the slide (34), and the spring 2 (65) is released to make the push frame (61) rise. The pressure relief push plate (62) is moved by the rising action of the push frame (61), so that the volume of the gas collecting hood (6) is expanded to generate negative pressure, and the dust-containing airflow is sucked in through the one-way valve port (66). The processing debris enters the air supply pipe (63) with the airflow, and is ejected from the air outlet head (64), and the dust particles are captured by the dust collection frame (67); S4. When the environmental monitor (7) detects that the particulate matter content or temperature of the processing environment increases, the main control module (100) executes a dynamic adjustment program to trigger the purifier (71) to start, and the suspended particles and hot air flow in the processing area are captured by the suction hood (73), and are discharged from the discharge pipe (72) after being purified by the multi-layer filter element. At the same time, according to the feedback data of the temperature and pressure integrated unit (101), if the temperature exceeds the threshold, the three-dimensional drive unit (13) automatically reduces the moving speed of the laser drilling device (14) and prolongs the pulse interval time to reduce heat accumulation; S5. After the current wafer through-hole processing is completed, the main control module (100) executes the reset command, the motor (3) rotates forward to drive the screw (32) to rotate counterclockwise, the push plate (33) moves upward along the guide frame (31) to push the ring seat (39) to move upward synchronously, the linkage rod (35) rotates in the opposite direction to drive the slide seat (34) to slide outward and reset, the silicone clamp (37) retracts under the action of spring 1 (38) to release the clamping, the vacuum pump (41) stops running, the negative pressure adsorption is released, the lifting plate (5) is pushed upward by the push plate (33), and the push rod (52) is driven downward by the matching piece (51), and the contact ball (54) is retracted into the processing table (21). At this time, the robot arm (12) re-grasps the processed wafer and transfers it to the next process; S6. Finally, the main control module (100) starts the self-check program. After inputting the next wafer processing parameters through the touch screen (102), the three-dimensional drive unit (13) drives the laser puncher (14) to perform an empty movement calibration, uses the preset reference mark points on the edge of the processing table (21) to perform coordinate compensation calculation, and updates the linkage mapping relationship between the grasping path of the robot arm (12) and the laser positioning coordinates. At the same time, the pressure relief push plate (62) compresses the gas in the gas collection hood (6) during the reset process of the push frame (61), and sprays the residual dust into the collection frame to complete the processing cycle preparation.

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