Intelligent monitoring control system for laser cutting

By introducing an intelligent monitoring and control system into the laser cutting system, the problem of insufficient cutting parameter detection in the existing technology is solved, and comprehensive monitoring and evaluation of the laser cutting process is achieved, which improves the stability and consistency of cutting quality.

CN119952322AActive Publication Date: 2025-05-09JIE RUIXI INTELLIGENT EQUIP (JIANGSU) CO LTD

Patent Information

Application Number
CN202510436426.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-09
Publication Date
2025-05-09
Estimated Expiration
2045-04-09

AI Technical Summary

Technical Problem

The existing laser cutting technology lacks detailed detection and analysis and evaluation of cutting parameters during the cutting process, which makes it difficult to accurately grasp the optimal process conditions and affect the stability and consistency of product quality.

Method used

A laser cutting intelligent monitoring and control system is designed, including a displacement monitoring module, a temperature monitoring module, a cutting speed monitoring module, a power detection module, a power analysis module, a cutting parameter analysis module and a cutting quality analysis module. Through the comprehensive analysis of these modules, the evaluation index of the cutting process and the cutting quality evaluation coefficient of the workpiece are evaluated.

Benefits of technology

Comprehensive monitoring and evaluation of the laser cutting process is achieved, ensuring the precise movement path of the cutting head, reasonable temperature control, stable cutting speed and uniform power, thereby improving the stability and consistency of cutting quality.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The invention relates to the technical field of laser, in particular to a laser cutting intelligent monitoring control system which comprises a displacement monitoring module, a temperature monitoring module, a cutting speed monitoring module, a power detection module, a power analysis module, a cutting parameter analysis module, a cutting quality analysis module and a management database. According to the system, the moving path coincidence coefficient of the laser cutting head is obtained by tracking the moving path of the laser cutting head, the predicted duration for the laser cutting head to reach the preset maximum allowable temperature is predicted, and the cutting process evaluation index of the laser cutting head is obtained through analysis according to the temperature coincidence degree, the cutting speed stability degree and the power evaluation coefficient. And quality parameter detection is conducted on the cut workpiece, the cutting quality evaluation coefficient of the workpiece is obtained through analysis, the cutting accuracy and stability are improved, and the intelligent level and the automation degree of the whole laser cutting system are improved.
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Description

Technical Field

[0001] The invention relates to the field of laser technology, in particular to an intelligent monitoring and control system for laser cutting. Background Art

[0002] With the continuous advancement of science and technology, the manufacturing industry has higher and higher requirements for processing technology. Traditional mechanical cutting methods have problems such as low precision, low efficiency, and limited adaptability to materials. Lasers have the characteristics of high energy density and good directionality, which makes it possible to cut materials more accurately and efficiently.

[0003] In industrial production, in order to meet the manufacturing needs of complex-shaped parts, a technology that can cut flexibly and accurately is needed. Laser cutting came into being, which can achieve high-quality cutting of various metal and non-metal materials.

[0004] For example, the existing Chinese patent with the announcement number CN103659004B discloses a laser cutting pretreatment device, a laser cutting device and a laser cutting method. This solution performs local heating pretreatment on the workpiece to be cut on the workbench, and controls the heating beam position adjustment module to perform adjustment operations according to the cutting area of ​​the cutting beam of the cutting laser generator on the cutting surface of the workpiece to be cut. This can effectively eliminate the internal stress in the workpiece to be cut and improve the yield rate of the cutting product.

[0005] However, this solution has the following shortcomings: This solution mainly emphasizes that local heating pretreatment and precise adjustment of the heating beam position can effectively eliminate internal stress and improve the yield rate, while there is little mention of the detection and detailed analysis and evaluation of specific parameters in the cutting process. For example, there is no clear mention of the monitoring and evaluation of specific parameters such as heating temperature and cutting power, which may make it difficult to accurately grasp the optimal process conditions in actual operation, and it is impossible to accurately adjust the parameters according to different materials and situations, thus affecting the stability and consistency of product quality.

[0006] For example, the existing Chinese patent with application number 202110385118.0 discloses a laser cutting method and a laser cutting system. This solution determines the current laser cutting situation by monitoring the changes in the light intensity of the reflected laser during laser cutting to determine whether to adjust the laser cutting parameters. The laser cutting parameters can be adjusted more quickly to ensure the quality of laser cutting.

[0007] However, this solution has the following shortcomings: it ignores the temperature parameters of the cutting process. Temperature has an important influence on the performance of the material and the cutting quality. If the temperature is too high or too low, it may cause material deformation, excessive heat-affected zone, uneven cutting surface and other problems, affecting the quality of the final product. At the same time, the lack of temperature monitoring makes it impossible to accurately grasp the thermal state of the cutting process, making it difficult to carry out targeted temperature control and optimization. Summary of the invention

[0008] In order to overcome the shortcomings of the background technology, an embodiment of the present invention provides a laser cutting intelligent monitoring and control system, which can effectively solve the problems involved in the above-mentioned background technology.

[0009] The purpose of the present invention can be achieved through the following technical solutions: The present invention provides a laser cutting intelligent monitoring and control system, including: a displacement monitoring module for obtaining the moving path of the laser cutting head and analyzing its consistency with the reference moving path.

[0010] The temperature monitoring module is used to monitor the temperature of the laser cutting head, analyze temperature changes, and predict the time it takes for the laser cutting head to reach the preset maximum allowable temperature.

[0011] The cutting speed monitoring module is used to analyze the conformity of the cutting speed according to the cutting parameters of the laser cutting head. The cutting parameters include the average cutting speed and the stability of the cutting speed.

[0012] The power detection module is used to evaluate the power fluctuation of the laser cutting head and analyze the power smoothness between different working modes.

[0013] The power analysis module is used to obtain the power evaluation coefficient and provide feedback based on the power fluctuation and power switching smoothness of the laser cutting head.

[0014] The cutting parameter analysis module is used to comprehensively analyze the moving path consistency, temperature analysis results, cutting speed compliance and power evaluation coefficient, evaluate the cutting process evaluation index and provide feedback.

[0015] The cutting quality analysis module is used to perform quality inspection on the workpiece after cutting and obtain the cutting quality evaluation coefficient. The quality parameters include dimensional accuracy and verticality.

[0016] Management database for storing reference movement paths of laser cutting heads and cutting workpiece design models.

[0017] Preferably, the specific analysis method of the displacement monitoring module is as follows: the first step is to obtain a top-view image of the tip of the laser cutting head on the target part plane through a projection device to obtain the projection point of the tip of the laser cutting head on the target part plane, select a number of cutting points according to a set interval, and obtain the projection point of the tip of the laser cutting head on the target part plane at each cutting point during cutting, establish a two-dimensional coordinate system according to a preset principle, and obtain the coordinates of the projection point of the tip of the laser cutting head on the target part plane at each cutting point during cutting, which are recorded as the position coordinates of each cutting point.

[0018] In the second step, the position coordinates of each cutting point are sorted in chronological order, and adjacent cutting points are grouped as a group, recorded as each group of cutting points. According to the position coordinates of each group of cutting points, the moving path of the laser cutting head between each group of cutting points is simulated by the linear fitting method, recorded as the fitting moving path of each group of cutting points, and the fitting moving paths of each group of cutting points are connected in sequence to form the moving path of the laser cutting head.

[0019] The third step is to read the reference moving path of the laser cutting head from the management database, compare the moving path of the laser cutting head with the reference moving path of the laser cutting head, obtain the overlapping length of the moving path of the laser cutting head and the reference moving path of the laser cutting head, and analyze and obtain the moving path matching coefficient of the laser cutting head.

[0020] Preferably, the specific analysis method of the temperature monitoring module is: select a number of time points in the cutting process of the target part according to the set interval time, recorded as each time point, and detect the temperature of the laser cutting head at each time point through a temperature sensor, recorded as ,in Indicates The number of the time point, , Represents the number of time points, through the formula Get the temperature compliance of the laser cutting head , It indicates the preset maximum allowable temperature. The temperature compliance of the laser cutting head is compared with the preset temperature compliance threshold. If the temperature compliance of the laser cutting head is less than the preset temperature compliance threshold, it means that the temperature compliance of the laser cutting head is unqualified and an early warning is issued. Otherwise, it means that the temperature compliance of the laser cutting head is qualified.

[0021] Preferably, the specific analysis method for the time length of the laser cutting head to reach the preset maximum allowable temperature is: taking adjacent time points as a group, recording them as each group of time points, obtaining the temperature difference of each group of time points by subtracting the temperature of each group of time points, obtaining the set interval time length, and obtaining the temperature rise rate of each group of time points by dividing the temperature difference of each group of time points by the set interval time length, recorded as , Indicates The number of the group time point, , and obtain the temperature of the laser cutting head at the current time point, recorded as , substituting it into the formula Get the estimated time for the laser cutting head to reach the preset maximum allowable temperature , Indicates the preset maximum allowable temperature, The number of groups representing the time points provides feedback to the system on the estimated time it will take for the laser cutting head to reach the preset maximum allowable temperature.

[0022] Preferably, the specific analysis method of the cutting speed monitoring module is: according to the set time length, the cutting process of the target part is divided into a number of equal-length time periods, recorded as each time period, and the coordinates of the start time point and the end time point of each time period of the laser cutting head are respectively obtained by the displacement sensor, recorded as , Indicates The number of the time period, , through the formula Get the cutting length of the laser cutting head in each time period , and record the set duration as , substituting it into the formula Get the cutting speed of the laser cutting head in each time period , the average cutting speed of the laser cutting head in each time period is calculated to obtain the average cutting speed of the laser cutting head, which is recorded as , substituting it into the formula Get the cutting speed stability of the laser cutting head , Indicates the number of time periods, and the cutting speed of the laser cutting head in each time period Substitute into the formula Get the cutting speed compliance of the laser cutting head , Indicates the preset reference cutting speed, They respectively represent the preset cutting speed and the weight factors of the cutting speed stability.

[0023] Preferably, the specific analysis method for evaluating the power fluctuation of the laser cutting head is: the power of the laser cutting head when cutting the target part is monitored in real time by a power meter, and the power of the laser cutting head when it reaches each cutting point of the target part is obtained, which is recorded as the power of each cutting point of the laser cutting head , Indicates The number of the cutting points, , calculate the average power of each cutting point of the laser cutting head, and get the average power of the cutting point of the laser cutting head, which is recorded as , substituting it into the formula Get the power fluctuation degree of the laser cutting head , Indicates the number of cutting points.

[0024] Preferably, the specific analysis method of the power smoothness between the different working modes is: reading the average power of the cutting point of the laser cutting head , the working modes are switched in sequence according to the set trigger mode, which are recorded as each working mode. When the laser cutting head switches to each working mode, several time points with equal time intervals are selected, which are recorded as each monitoring time point. The power of the laser cutting head at each monitoring time point of each working mode is obtained by detecting with a power meter. The adjacent monitoring time points are grouped as a group. The power change of the laser cutting head at each group of adjacent monitoring time points of each working mode is obtained by subtracting the power of the laser cutting head at each group of adjacent monitoring time points of each working mode, which is recorded as , Indicates The number of the working mode. , Indicates The number of the group monitoring time point, , substituting it into the formula Get the power stability of the laser cutting head in each working mode , Represents the number of monitoring time points, through the formula Get the power switching smoothness of the laser cutting head , Indicates the number of working modes.

[0025] Preferably, the specific analysis method of the power analysis module is: respectively reading the power fluctuation degree of the laser cutting head , the power switching smoothness of the laser cutting head , substituting it into the formula Get the power evaluation coefficient of the laser cutting head , They represent the weight factors of the preset power fluctuation degree and power switching smoothness respectively. Represents a natural constant.

[0026] Preferably, the specific analysis method of the cutting parameter analysis module is: respectively reading the moving path matching coefficient and temperature matching degree of the laser cutting head , cutting speed compliance , Power evaluation coefficient , substituting it into the formula Get the cutting process evaluation index of the laser cutting head , Indicates the moving path matching coefficient of the laser cutting head, The weight factors respectively represent the preset moving path matching coefficient, temperature compliance, cutting speed compliance, and power evaluation coefficient. The cutting process evaluation index of the laser cutting head is compared with the preset cutting process evaluation index threshold and fed back to the system.

[0027] Preferably, the specific analysis method of the cutting quality analysis module is as follows: in the first step, the target part after cutting is recorded as a cutting workpiece, an image of the cutting workpiece is acquired to obtain a cutting workpiece image, and three-dimensional modeling is performed for the cutting workpiece according to the cutting workpiece image, and the obtained three-dimensional model is recorded as a cutting workpiece three-dimensional model, and a cutting workpiece design model is read from a management database, and an overlapping volume of the cutting workpiece three-dimensional model and the cutting workpiece design model is obtained by overlapping the cutting workpiece three-dimensional model with the cutting workpiece design model, and recorded as the overlapping volume of the cutting workpiece and the design workpiece. , extract the volume of the cutting workpiece design model, denoted as , through the formula Get the dimensional accuracy of the cut workpiece ;

[0028] In the second step, the cutting surface of the workpiece is used as the detection surface, and the adjacent plane of the detection surface is used as the reference surface. The verticality measuring instrument is placed on the reference surface and the detection surface of the cut workpiece respectively, and the value of the verticality deviation is read, which is recorded as , read the preset verticality deviation standard value from the management database, recorded as , through the formula Get the verticality of the cut workpiece .

[0029] The third step is to use the formula Get the cutting quality evaluation coefficient of the workpiece , Respectively represent the weight factors of preset dimensional accuracy and verticality, It represents a natural constant. The cutting quality evaluation coefficient of the workpiece is compared with the preset cutting quality evaluation coefficient threshold. If the cutting quality evaluation coefficient of the workpiece is greater than or equal to the preset cutting quality evaluation coefficient threshold, it means that the cutting quality evaluation coefficient of the workpiece is qualified. Otherwise, it means that it is unqualified, and feedback is given to the system.

[0030] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention obtains the moving path matching coefficient of the laser cutting head by tracking the moving path of the laser cutting head, thereby ensuring that the cutting head performs precise cutting according to the established design route, reducing waste and quality problems caused by path deviation, and is also conducive to achieving high-quality cutting of complex graphics.

[0031] 2. The present invention obtains the temperature compliance of the laser cutting head through the temperature of the laser cutting head at each time point, and can take cooling measures in time to prevent overheating damage. At the same time, the estimated time for the laser cutting head to reach the preset maximum allowable temperature is predicted, which is convenient for advance planning and adjustment to avoid production interruptions due to overheating.

[0032] 3. The present invention obtains the cutting process evaluation index of the laser cutting head according to the temperature compliance, cutting speed stability and power evaluation coefficient analysis, which is conducive to comprehensively evaluating the entire laser cutting process, facilitating timely discovery of problems and targeted adjustments and optimizations, thereby improving the overall cutting process level and production efficiency.

[0033] Fourth, the present invention detects the quality parameters of the workpiece after cutting and analyzes the cutting quality evaluation coefficient of the workpiece, which helps to timely discover problems in the cutting process and better meet the strict requirements on the workpiece quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0035] Figure 1 This is a system module connection diagram of the present invention.

[0036] Figure 2 for Figure 1 Schematic diagram of the flow chart of the displacement monitoring module.

[0037] Figure 3 for Figure 1 Schematic diagram of the process flow of the cutting quality analysis module. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] See also Figure 1 As shown, a laser cutting intelligent monitoring and control system includes a displacement monitoring module, a temperature monitoring module, a cutting speed monitoring module, a power detection module, a power analysis module, a cutting parameter analysis module, a cutting quality analysis module, and a management database.

[0040] The management database is connected to the displacement monitoring module, temperature monitoring module, cutting speed monitoring module, power analysis module, cutting parameter analysis module, and cutting quality analysis module; the power analysis module is connected to the temperature monitoring module, cutting speed monitoring module, and cutting parameter analysis module; and the power detection module is connected to the power analysis module.

[0041] The displacement monitoring module is used to obtain the moving path of the laser cutting head and analyze its consistency with the reference moving path.

[0042] See also Figure 2 As shown, the specific analysis method of the displacement monitoring module is as follows: the first step is to obtain a top view image of the tip of the laser cutting head on the plane of the target part through a projection device, extract the projection point of the tip of the laser cutting head on the plane of the target part at each cutting point during cutting, and simultaneously shoot the image of the laser cutting head in real time, identify the characteristic points of the cutting head to obtain the actual position information of the cutting head, cross-verify the actual position information of the cutting head with the position obtained by projection, calculate the deviation between the two and make corrections, and obtain the real-time position point of the tip of the laser cutting head on the plane of the target part; it can ensure that the laser cutting head and the target part are always in the same reference plane, and then establish a two-dimensional coordinate system according to the preset principle, and accurately obtain the real-time position point of the tip of the laser cutting head at each cutting point during cutting on the plane of the target part, which is recorded as the position coordinates of each cutting point.

[0043] It should be noted that the specific analysis method of the real-time position point of the laser cutting head tip on the target part plane is: obtain a top-view image of the laser cutting head tip on the target part plane through a projection device, obtain the projection point of the laser cutting head tip on the target part plane, select a number of cutting points according to the set interval, and preliminarily obtain the coordinates of the projection point of the laser cutting head tip on the target part plane at each cutting point during cutting.

[0044] The visual sensor continuously collects real-time images of the laser cutting head at a set frame rate, pre-makes a template image of the cutting head tip, searches for matching areas in the real-time image of the laser cutting head through a template matching method, determines the position of the cutting head tip, and converts it into the actual position coordinates of the cutting head in three-dimensional space based on the calibration parameters of the visual sensor.

[0045] The actual position coordinates of the cutting head in three-dimensional space are synchronized with the projection coordinates of the laser cutting head tip at each cutting point on the target plane in time and divided into subsets, for each subset, use it as a validation set, and the remaining subsets as training sets. On the training set, calculate its position deviation in the horizontal direction and vertical direction respectively. According to the calculated deviation, correct the coordinates of the projection point of the laser cutting head tip at each cutting point in the validation set on the target plane. Repeat this step to perform round of cross validation, we get The corrected coordinates of the group The average of the corrected coordinates is used to obtain the real-time position of the tip of the laser cutting head on the target plane.

[0046] The second step is to sort the position coordinates of each cutting point in chronological order, and group adjacent cutting points into a group, which are recorded as each group of cutting points. According to the position coordinates of each group of cutting points, the moving path of the laser cutting head between each group of cutting points is simulated by the linear fitting method, which is recorded as the fitting moving path of each group of cutting points. The fitting moving paths of each group of cutting points are connected in sequence to form the moving path of the laser cutting head. This can intuitively understand the movement of the cutting head, facilitate the analysis of its movement rationality and accuracy, and help to discover abnormalities or unreasonableness in the cutting path, and make timely corrections and optimizations.

[0047] It should be noted that the preset principle is to use the upper left corner vertex of the target part as the origin of the two-dimensional coordinate system, and the two adjacent sides of the target part as the horizontal axis and vertical axis of the two-dimensional coordinate system respectively, and the horizontal right direction is the positive direction of the horizontal axis, and the vertical downward direction is the positive direction of the vertical axis, so as to establish a two-dimensional coordinate system.

[0048] The third step is to read the reference moving path of the laser cutting head from the management database, compare the moving path of the laser cutting head with the reference moving path of the laser cutting head, obtain the overlapping length of the moving path of the laser cutting head with the reference moving path of the laser cutting head, and analyze and obtain the matching coefficient of the moving path of the laser cutting head; help to timely discover the deviation of the cutting path so as to take measures to correct it and improve the accuracy of cutting.

[0049] It should be noted that the specific analysis method of the matching coefficient of the moving path of the laser cutting head is: read the overlapping length of the moving path of the laser cutting head and the reference moving path of the laser cutting head, recorded as , substituting it into the formula Get the moving path matching coefficient of the laser cutting head ,in Indicates the total length of the preset reference moving path of the laser cutting head.

[0050] The temperature monitoring module is used to monitor the temperature of the laser cutting head, analyze temperature changes, and predict the time it takes for the laser cutting head to reach the preset maximum allowable temperature.

[0051] The specific analysis method of the temperature monitoring module is: select a number of time points in the cutting process of the target part according to the set interval time, record them as each time point, and detect the temperature of the laser cutting head at each time point through the temperature sensor, record them as ,in Indicates The number of the time point, , Represents the number of time points, through the formula Get the temperature compliance of the laser cutting head , It indicates the preset maximum allowable temperature. The temperature compliance of the laser cutting head is compared with the preset temperature compliance threshold. If the temperature compliance of the laser cutting head is less than the preset temperature compliance threshold, it means that the temperature compliance of the laser cutting head is unqualified and an early warning is issued. Otherwise, it means that the temperature compliance of the laser cutting head is qualified. This can ensure that the temperature of the laser cutting head is within a safe range to avoid damage to the equipment or affect the cutting quality due to excessive temperature.

[0052] The specific analysis method of the time length of the laser cutting head reaching the preset maximum allowable temperature is as follows: adjacent time points are grouped as each group of time points, the temperature difference of each group of time points is obtained by subtracting the temperature of each group of time points, the set interval time length is obtained, and the temperature rise rate of each group of time points is obtained by dividing the temperature difference of each group of time points by the set interval time length, which is recorded as , Indicates The number of the group time point, , and obtain the temperature of the laser cutting head at the current time point, recorded as , substituting it into the formula Get the estimated time for the laser cutting head to reach the preset maximum allowable temperature , Indicates the preset maximum allowable temperature, Indicates the number of groups of time points, and provides feedback to the system on the estimated time it will take for the laser cutting head to reach the preset maximum allowable temperature. This allows for timely detection of abnormal temperature changes, such as rapid temperature rise, so that countermeasures can be prepared in advance, such as adjusting process parameters, suspending operations for cooling, etc.

[0053] The cutting speed monitoring module is used to analyze the conformity of the cutting speed according to the cutting parameters of the laser cutting head. The cutting parameters include the average cutting speed and the stability of the cutting speed.

[0054] The specific analysis method of the cutting speed monitoring module is as follows: the cutting process of the target part is divided into several equal-length time periods according to the set time length, recorded as each time period, and the coordinates of the start time point and the end time point of each time period of the laser cutting head are respectively obtained by the displacement sensor, recorded as , Indicates The number of the time period, , through the formula Get the cutting length of the laser cutting head in each time period , and record the set duration as , substituting it into the formula Get the cutting speed of the laser cutting head in each time period , the average cutting speed of the laser cutting head in each time period is calculated to obtain the average cutting speed of the laser cutting head, which is recorded as , substituting it into the formula Get the cutting speed stability of the laser cutting head , Indicates the number of time periods, and the cutting speed of the laser cutting head in each time period Substitute into the formula Get the cutting speed compliance of the laser cutting head , Indicates the preset reference cutting speed, They represent the weight factors of the preset cutting speed and the stability of the cutting speed respectively; the calculated cutting speed compliance can be compared with the preset standard to determine whether the actual cutting speed meets the requirements, so as to promptly discover possible problems and make adjustments to ensure high quality and high efficiency of the cutting operation.

[0055] It should be noted that, in a specific embodiment, It can be set to 0.4. It can be set to 0.6. The stability of cutting speed is directly related to the continuity and uniformity of the entire cutting process. If the speed is unstable, it may lead to uneven cutting surface quality, jagged edges and other problems, which will have a greater impact on the quality of the final product. Although cutting speed is also important, relatively speaking, as long as it is within a reasonable range, its impact may not be as critical as speed stability. It affects efficiency more. Stability has a more direct and decisive impact on cutting quality. Therefore, the weight corresponding to cutting speed stability is higher.

[0056] The power detection module is used to evaluate the power fluctuation of the laser cutting head and analyze the power smoothness between different working modes.

[0057] The specific analysis method for evaluating the power fluctuation of the laser cutting head is: the power of the laser cutting head when cutting the target part is monitored in real time by a power meter, and the power of the laser cutting head when it reaches each cutting point of the target part is obtained, which is recorded as the power of each cutting point of the laser cutting head , Indicates The number of the cutting points, , calculate the average power of each cutting point of the laser cutting head, and get the average power of the cutting point of the laser cutting head, which is recorded as , substituting it into the formula Get the power fluctuation degree of the laser cutting head , Indicates the number of cutting points; can timely understand the working status of the laser cutting head, ensure that it operates within the normal power range, and avoid cutting quality problems or equipment damage due to abnormal power.

[0058] The specific analysis method of the power smoothness between the different working modes is: read the average power of the cutting point of the laser cutting head , the working modes are switched in sequence according to the set trigger mode, which are recorded as each working mode. When the laser cutting head switches to each working mode, several time points with equal time intervals are selected, which are recorded as each monitoring time point. The power of the laser cutting head at each monitoring time point of each working mode is obtained by detecting with a power meter. The adjacent monitoring time points are grouped as a group. The power change of the laser cutting head at each group of adjacent monitoring time points of each working mode is obtained by subtracting the power of the laser cutting head at each group of adjacent monitoring time points of each working mode, which is recorded as , Indicates The number of the working mode. , Indicates The number of the group monitoring time point, , substituting it into the formula Get the power stability of the laser cutting head in each working mode , Represents the number of monitoring time points, through the formula Get the power switching smoothness of the laser cutting head , Indicates the number of working modes;

[0059] The power analysis module is used to obtain the power evaluation coefficient and provide feedback based on the power fluctuation and power switching smoothness of the laser cutting head. The specific analysis method of the power analysis module is: read the power fluctuation degree of the laser cutting head respectively , the power switching smoothness of the laser cutting head , substituting it into the formula Get the power evaluation coefficient of the laser cutting head , They represent the weight factors of the preset power fluctuation degree and power switching smoothness respectively. Represents a natural constant; monitoring and analysis of power can ensure the stability and reliability of the cutting process, improve cutting quality, and detect power anomalies in time for easy adjustment and optimization.

[0060] It should be noted that, in a specific embodiment, It can be set to 0.6. It can be set to 0.4. The influence of power fluctuation may be relatively large. If the power fluctuation is large, it will directly affect the cutting quality. For example, it will cause uneven incisions and uneven heat-affected zones, which will seriously affect the final quality of the workpiece. Although the smoothness of power switching is also very important, its impact on the immediate effect of cutting may not be as direct and critical as the power fluctuation. It affects the convenience and efficiency of operation more. Therefore, the power fluctuation has a higher weight.

[0061] The cutting parameter analysis module is used to comprehensively analyze the moving path consistency, temperature analysis results, cutting speed compliance and power evaluation coefficient, evaluate the cutting process evaluation index and provide feedback.

[0062] The specific analysis method of the cutting parameter analysis module is: respectively reading the moving path matching coefficient and temperature matching degree of the laser cutting head , cutting speed compliance , Power evaluation coefficient , substituting it into the formula Get the cutting process evaluation index of the laser cutting head , Indicates the moving path matching coefficient of the laser cutting head, The weight factors respectively represent the preset moving path matching coefficient, temperature compliance, cutting speed compliance, and power evaluation coefficient. The cutting process evaluation index of the laser cutting head is compared with the preset cutting process evaluation index threshold and fed back to the system. Problems or deviations in the cutting process can be discovered in time so that adjustments and optimizations can be made quickly, thereby improving the overall cutting quality and effect.

[0063] It should be noted that, in a specific embodiment, It can be set to 0.3. It can be set to 0.3. It can be set to 0.2. It can be set to 0.2. An accurate moving path is crucial to ensure cutting accuracy and shape conformity. If the path does not match, it will directly lead to serious problems in cutting quality, such as shape deviation. Appropriate temperature control can ensure the performance of the material and the cutting effect. Too high or too low temperature may cause material deformation, excessive heat-affected zone and other problems. The degree of cutting speed conformity has a certain impact on cutting efficiency and quality, but it may be slightly inferior to the first two. However, unreasonable cutting speed will also bring problems such as poor incision quality. The impact of the power evaluation coefficient may be relatively small. Although power will affect cutting ability, its adjustment is relatively flexible within a certain range, and other factors are often more critical to the direct impact on the cutting process. Therefore, the weights corresponding to the moving path conformity coefficient and temperature conformity are higher, and the weights corresponding to the cutting speed conformity and power evaluation coefficient are lower.

[0064] It should be noted that the specific analysis method for feedback to the system is: reading the cutting process evaluation index of the laser cutting head, comparing the cutting process evaluation index of the laser cutting head with the preset cutting process evaluation index threshold, if the cutting process evaluation index of the laser cutting head is greater than or equal to the preset cutting process evaluation index threshold, then it means that the cutting process evaluation index of the laser cutting head is qualified; if the cutting process evaluation index of the laser cutting head is less than the preset cutting process evaluation index threshold, then it means that the cutting process evaluation index of the laser cutting head is unqualified, and it is fed back to the system.

[0065] The cutting quality analysis module is used to perform quality inspection on the workpiece after cutting and obtain the cutting quality evaluation coefficient. The quality parameters include dimensional accuracy and verticality.

[0066] See also Figure 3 As shown, the specific analysis method of the cutting quality analysis module is as follows: in the first step, the target part after cutting is recorded as a cutting workpiece, an image of the cutting workpiece is acquired to obtain a cutting workpiece image, and three-dimensional modeling is performed for the cutting workpiece according to the cutting workpiece image, and the obtained three-dimensional model is recorded as a cutting workpiece three-dimensional model, and a cutting workpiece design model is read from a management database, and an overlapping volume of the cutting workpiece three-dimensional model and the cutting workpiece design model is obtained by overlapping the cutting workpiece three-dimensional model with the cutting workpiece design model, which is recorded as the overlapping volume of the cutting workpiece and the design workpiece. , extract the volume of the cutting workpiece design model, denoted as , through the formula Get the dimensional accuracy of the cut workpiece It helps to timely discover dimensional deviation problems that may occur during the cutting process so that appropriate measures can be taken to improve and optimize, thereby improving the quality of the cut workpiece and the degree to which it meets the design requirements.

[0067] In the second step, the cutting surface of the workpiece is used as the detection surface, and the adjacent plane of the detection surface is used as the reference surface. The verticality measuring instrument is placed on the reference surface and the detection surface of the cut workpiece respectively, and the value of the verticality deviation is read, which is recorded as , read the preset verticality deviation standard value from the management database, recorded as , through the formula Get the verticality of the cut workpiece ; It can help to find the verticality problem of the cutting surface in time so as to take measures to improve the cutting process and enhance the overall quality of the product.

[0068] The third step is to use the formula Get the cutting quality evaluation coefficient of the workpiece , Respectively represent the weight factors of preset dimensional accuracy and verticality, It represents a natural constant. The cutting quality evaluation coefficient of the workpiece is compared with the preset cutting quality evaluation coefficient threshold. If the cutting quality evaluation coefficient of the workpiece is greater than or equal to the preset cutting quality evaluation coefficient threshold, it means that the cutting quality evaluation coefficient of the workpiece is qualified. Otherwise, it means that it is unqualified. Feedback is given to the system. It can accurately measure the quality of the workpiece cutting, promote the optimization and continuous improvement of the production process, and ensure the stability of product quality.

[0069] It should be noted that, in a specific embodiment, It can be set to 0.6. It can be set to 0.4. Dimensional accuracy is directly related to whether the workpiece can be accurately assembled with other parts and used normally. If the dimensional accuracy is not up to standard, it may cause functional problems in the entire product or fail to assemble normally. Therefore, the weight corresponding to dimensional accuracy is higher.

[0070] This system obtains the moving path matching coefficient of the laser cutting head by tracking the moving path of the laser cutting head, predicts the estimated time for the laser cutting head to reach the preset maximum allowable temperature, and obtains the cutting process evaluation index of the laser cutting head according to the temperature compliance, cutting speed stability, and power evaluation coefficient analysis. The quality parameters of the workpiece after cutting are tested and the cutting quality evaluation coefficient of the workpiece is obtained through analysis, thereby improving the accuracy and stability of cutting and enhancing the intelligence and automation level of the entire laser cutting system.

[0071] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention and they are still covered by the protection scope of the present invention.

Claims

1. A laser cutting intelligent monitoring and control system, characterized in that: include: The displacement monitoring module obtains the movement path of the laser cutting head and analyzes its consistency with the reference movement path; The temperature monitoring module monitors the temperature change of the laser cutting head and predicts the time it takes for the laser cutting head to reach the preset maximum allowable temperature; Cutting speed monitoring module, which analyzes the conformity of cutting speed according to the average cutting speed and cutting speed stability of the laser cutting head; Power detection module, which evaluates the power fluctuation of the laser cutting head and analyzes the power smoothness between different working modes; The power analysis module analyzes the power evaluation coefficient and provides feedback based on the power fluctuation and power switching smoothness of the laser cutting head; The cutting parameter analysis module comprehensively evaluates the cutting process evaluation index and provides feedback based on the moving path consistency, temperature analysis results, cutting speed compliance and power evaluation coefficient; The cutting quality analysis module performs quality inspection on the workpiece after cutting and obtains the cutting quality evaluation coefficient. The quality parameters include dimensional accuracy and verticality. Manage the database to store the reference movement path of the laser cutting head and the design model of the cutting workpiece.

2. The laser cutting intelligent monitoring and control system according to claim 1 is characterized in that: The specific analysis method of the displacement monitoring module is: The first step is to obtain a top view image of the tip of the laser cutting head on the target part plane through a projection device, obtain the projection point of the tip of the laser cutting head on the target part plane, select a number of cutting points according to the set interval, respectively obtain the projection point of the tip of the laser cutting head on the target part plane at each cutting point during cutting, establish a two-dimensional coordinate system according to the preset principle, obtain the coordinates of the projection point of the tip of the laser cutting head on the target part plane at each cutting point during cutting, and record them as the position coordinates of each cutting point; The second step is to sort the position coordinates of each cutting point in chronological order, taking adjacent cutting points as a group, and record them as each group of cutting points. According to the position coordinates of each group of cutting points, the moving path of the laser cutting head between each group of cutting points is simulated by the linear fitting method, which is recorded as the fitting moving path of each group of cutting points. The fitting moving paths of each group of cutting points are connected in sequence to form the moving path of the laser cutting head. The third step is to read the reference moving path of the laser cutting head from the management database, compare the moving path of the laser cutting head with the reference moving path of the laser cutting head, obtain the overlapping length of the moving path of the laser cutting head and the reference moving path of the laser cutting head, and analyze and obtain the moving path matching coefficient of the laser cutting head.

3. The laser cutting intelligent monitoring and control system according to claim 1 is characterized in that: The specific analysis method of the temperature monitoring module is: According to the set interval duration, several time points are selected during the cutting process of the target part and recorded as each time point. The temperature of the laser cutting head at each time point is detected by a temperature sensor, and the temperature compliance of the laser cutting head is obtained by quantitative analysis of the temperature deviation. The temperature compliance of the laser cutting head is compared with the preset temperature compliance threshold. If the temperature compliance of the laser cutting head is less than the preset temperature compliance threshold, it means that the temperature compliance of the laser cutting head is unqualified and a warning is issued. Otherwise, it means that the temperature compliance of the laser cutting head is qualified.

4. The laser cutting intelligent monitoring and control system according to claim 3 is characterized in that: The specific analysis method of the time taken for the laser cutting head to reach the preset maximum allowable temperature is: Adjacent time points are grouped as one group, recorded as each group of time points. The temperature difference of each group of time points is obtained by subtracting the temperature of each group of time points, and the set interval duration is obtained. The temperature rise rate of each group of time points is obtained by dividing the temperature difference of each group of time points by the set interval duration. The estimated time for the laser cutting head to reach the preset maximum allowable temperature is analyzed and calculated in combination with the temperature of the laser cutting head at the current time point, and the estimated time for the laser cutting head to reach the preset maximum allowable temperature is fed back to the system.

5. The laser cutting intelligent monitoring and control system according to claim 1 is characterized in that: The specific analysis method of the cutting speed monitoring module is: The cutting process of the target part is divided into several equal-length time periods according to the set duration, recorded as each time period. The coordinates of the start time point and the end time point of each time period of the laser cutting head are respectively obtained by the displacement sensor. The cutting length of the laser cutting head in each time period is calculated and analyzed by the spatial distance formula, and the cutting speed of the laser cutting head in each time period is analyzed in combination with the set duration. The average cutting speed of the laser cutting head in each time period is obtained by taking the average value, and the cutting speed stability of the laser cutting head and the cutting speed compliance of the laser cutting head are comprehensively analyzed.

6. The laser cutting intelligent monitoring and control system according to claim 2 is characterized in that: The specific analysis method for evaluating the power fluctuation of the laser cutting head is: The power of the laser cutting head when cutting the target part is monitored in real time by a power meter, and the power of the laser cutting head when it reaches each cutting point of the target part is obtained, which is recorded as the power of each cutting point of the laser cutting head. The power of each cutting point of the laser cutting head is averaged to obtain the average power of the cutting point of the laser cutting head, and then the power fluctuation degree of the laser cutting head is analyzed.

7. The laser cutting intelligent monitoring and control system according to claim 6 is characterized in that: The specific analysis method of the power smoothness between the different working modes is as follows: Read the average power of the cutting point of the laser cutting head, switch the working mode in sequence according to the set trigger mode, and record it as each working mode. When the laser cutting head switches to each working mode, select several time points with equal time intervals, and record them as each monitoring time point. The power of the laser cutting head at each monitoring time point in each working mode is obtained by detecting with a power meter. Adjacent monitoring time points are grouped as a group. The power change of the laser cutting head at each adjacent monitoring time point in each working mode is obtained by subtracting the power of the laser cutting head at each group of adjacent monitoring time points in each working mode, and then a comprehensive analysis is made of the power stability of the laser cutting head in each working mode and the smoothness of the power switching of the laser cutting head.

8. The laser cutting intelligent monitoring and control system according to claim 7 is characterized in that: The specific analysis method of the power analysis module is: The power fluctuation degree of the laser cutting head and the power switching smoothness of the laser cutting head are read respectively, and the power evaluation coefficient of the laser cutting head is calculated by the weighted fuzzy analysis algorithm.

9. The laser cutting intelligent monitoring and control system according to claim 1, characterized in that: The specific analysis method of the cutting parameter analysis module is: The moving path matching coefficient, temperature compliance, cutting speed compliance and power evaluation coefficient of the laser cutting head are read respectively, and the cutting process evaluation index of the laser cutting head is calculated by the weighted fuzzy analysis algorithm. The cutting process evaluation index of the laser cutting head is compared with the preset cutting process evaluation index threshold and fed back to the system.

10. The laser cutting intelligent monitoring and control system according to claim 1, characterized in that: The specific analysis method of the cutting quality analysis module is: In the first step, the target part after cutting is recorded as a cutting workpiece, an image of the cutting workpiece is acquired to obtain a cutting workpiece image, and a three-dimensional model is performed for the cutting workpiece according to the cutting workpiece image, and the obtained three-dimensional model is recorded as a cutting workpiece three-dimensional model, and a cutting workpiece design model is read from a management database, and an overlapping volume of the cutting workpiece three-dimensional model and the cutting workpiece design model is obtained by overlapping the cutting workpiece three-dimensional model with the cutting workpiece design model, which is recorded as the overlapping volume of the cutting workpiece and the design workpiece, and the volume of the cutting workpiece design model is extracted, and the dimensional accuracy of the cutting workpiece is analyzed by a ratio method; The second step is to use the cutting surface of the workpiece as the detection surface and the adjacent plane of the detection surface as the reference surface, place the verticality measuring instrument against the reference surface and the detection surface of the workpiece respectively, read the verticality deviation value, read the preset verticality deviation standard value from the management database, and quantitatively analyze the verticality of the workpiece through the verticality deviation situation; The third step is to analyze the cutting quality evaluation coefficient of the workpiece and compare it with the preset cutting quality evaluation coefficient threshold. If the cutting quality evaluation coefficient of the workpiece is greater than or equal to the preset cutting quality evaluation coefficient threshold, it means that the cutting quality evaluation coefficient of the workpiece is qualified, otherwise it means that it is unqualified, and feedback is given to the system.

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