An intelligent monitoring and control system for laser cutting
By introducing a multi-module monitoring and analysis system into the laser cutting system, the problem of insufficient parameter monitoring in laser cutting technology is solved, precise cutting path control and temperature management are achieved, and cutting quality and production efficiency are improved.
Patent Information
- Application Number
- CN202510436426.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2045-04-09
AI Technical Summary
The existing laser cutting technology is insufficient in parameter monitoring and evaluation, which makes it difficult to accurately adjust process conditions, affect the stability and consistency of product quality, and lacks effective monitoring of temperature, which may lead to problems such as material deformation and excessive heat-affected zones.
The displacement monitoring module, temperature monitoring module, cutting speed monitoring module, power detection module, power analysis module and cutting quality analysis module are used to monitor and analyze the movement path, temperature, cutting speed, power fluctuation and cutting quality of the laser cutting head respectively. Through the comprehensive evaluation index evaluation, the cutting process can be evaluated to achieve accurate control and optimization of cutting parameters.
Ensure that the cutting head is accurately cut according to the design route, prevent overheating damage, improve cutting quality and efficiency, meet strict workpiece quality requirements, and improve the overall cutting process level and production efficiency.
Smart Images

Figure CN119952322B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of laser technology, in particular to an intelligent monitoring and control system for laser cutting. Background Art
[0002] With the continuous advancement of science and technology, the manufacturing industry has increasingly higher requirements for processing technology. Traditional mechanical cutting methods have problems such as low precision, low efficiency, and limited adaptability to materials. Lasers have the characteristics of high energy density and good directionality, which makes it possible to cut materials more accurately and efficiently.
[0003] In industrial production, in order to meet the manufacturing needs of complex-shaped parts, a technology that can cut flexibly and accurately is needed. Laser cutting came into being, which can achieve high-quality cutting of various metal and non-metal materials.
[0004] For example, the existing Chinese patent with the announcement number CN103659004B discloses a laser cutting pretreatment device, a laser cutting device and a laser cutting method. This solution performs local heating pretreatment on the workpiece to be cut on the workbench, and controls the heating beam position adjustment module to perform adjustment operations according to the cutting area of the cutting beam of the cutting laser generator on the cutting surface of the workpiece to be cut. This can effectively eliminate the internal stress in the workpiece to be cut and improve the yield rate of the cut product.
[0005] However, this solution has the following shortcomings: it mainly emphasizes that local heating pretreatment and precise adjustment of the heating beam position can effectively eliminate internal stress and improve the yield rate, while there is little mention of the detection and detailed analysis and evaluation of specific parameters in the cutting process. For example, there is no clear mention of the monitoring and evaluation of specific parameters such as heating temperature and cutting power. This may make it difficult to accurately grasp the optimal process conditions in actual operation and unable to accurately adjust the parameters according to different materials and situations, thereby affecting the stability and consistency of product quality.
[0006] For example, the existing Chinese patent application number 202110385118.0 discloses a laser cutting method and a laser cutting system. This solution determines the current laser cutting situation by monitoring the changes in the light intensity of the reflected laser during laser cutting to determine whether to adjust the laser cutting parameters. The laser cutting parameters can be adjusted more quickly to ensure the quality of laser cutting.
[0007] However, this solution has the following shortcomings: it ignores the temperature parameters of the cutting process. Temperature has an important impact on the performance of the material and the cutting quality. If the temperature is too high or too low, it may cause material deformation, excessive heat-affected zone, uneven cutting surface and other problems, affecting the quality of the final product. At the same time, the lack of temperature monitoring makes it impossible to accurately grasp the thermal state of the cutting process, making it difficult to carry out targeted temperature control and optimization. Summary of the Invention
[0008] In order to overcome the shortcomings of the background technology, an embodiment of the present invention provides a laser cutting intelligent monitoring and control system, which can effectively solve the problems involved in the above background technology.
[0009] The purpose of the present invention can be achieved through the following technical solutions: The present invention provides a laser cutting intelligent monitoring and control system, including: a displacement monitoring module for obtaining the moving path of the laser cutting head and analyzing its consistency with the reference moving path.
[0010] The temperature monitoring module is used to monitor the temperature of the laser cutting head, analyze temperature changes, and predict the time it takes for the laser cutting head to reach the preset maximum allowable temperature.
[0011] The cutting speed monitoring module is used to analyze the cutting speed compliance according to the cutting parameters of the laser cutting head. The cutting parameters include the average cutting speed and the cutting speed stability.
[0012] The power detection module is used to evaluate the power fluctuation of the laser cutting head and analyze the power smoothness between different working modes.
[0013] The power analysis module is used to obtain the power evaluation coefficient and provide feedback based on the power fluctuation and power switching smoothness of the laser cutting head.
[0014] The cutting parameter analysis module is used to comprehensively analyze the moving path consistency, temperature analysis results, cutting speed compliance and power evaluation coefficient, evaluate the cutting process evaluation index and provide feedback.
[0015] The cutting quality analysis module is used to perform quality inspection on the workpiece after cutting and obtain the cutting quality evaluation coefficient. The quality parameters include dimensional accuracy and verticality.
[0016] Management database for storing reference movement paths of laser cutting heads and cutting workpiece design models.
[0017] Preferably, the specific analysis method of the displacement monitoring module is: the first step is to obtain a top-view image of the tip of the laser cutting head on the target part plane through a projection device, and obtain the projection point of the tip of the laser cutting head on the target part plane, select a number of cutting points according to the set interval, and obtain the projection point of the tip of the laser cutting head on the target part plane at each cutting point during cutting, establish a two-dimensional coordinate system according to the preset principles, and obtain the coordinates of the projection point of the tip of the laser cutting head on the target part plane at each cutting point during cutting, and record them as the position coordinates of each cutting point.
[0018] The second step is to sort the position coordinates of each cutting point in chronological order, and group adjacent cutting points into a group, which are recorded as each group of cutting points. According to the position coordinates of each group of cutting points, the moving path of the laser cutting head between each group of cutting points is simulated by the linear fitting method, which is recorded as the fitting moving path of each group of cutting points. The fitting moving paths of each group of cutting points are connected in sequence to form the moving path of the laser cutting head.
[0019] The third step is to read the reference moving path of the laser cutting head from the management database, compare the moving path of the laser cutting head with the reference moving path of the laser cutting head, obtain the overlapping length of the moving path of the laser cutting head and the reference moving path of the laser cutting head, and analyze and obtain the moving path matching coefficient of the laser cutting head.
[0020] Preferably, the specific analysis method of the temperature monitoring module is: select a number of time points during the cutting process of the target part according to the set interval length, record them as each time point, and detect the temperature of the laser cutting head at each time point through the temperature sensor, record them as ,in Indicates the The number of the time point, , Represents the number of time points, through the formula Get the temperature compliance of the laser cutting head , Indicates the preset maximum allowable temperature. The temperature compliance of the laser cutting head is compared with the preset temperature compliance threshold. If the temperature compliance of the laser cutting head is less than the preset temperature compliance threshold, it means that the temperature compliance of the laser cutting head is unqualified and an early warning is issued. Otherwise, it means that the temperature compliance of the laser cutting head is qualified.
[0021] Preferably, the specific analysis method of the time length when the laser cutting head reaches the preset maximum allowable temperature is as follows: adjacent time points are grouped as each group of time points, the temperature difference of each group of time points is obtained by subtracting the temperature of each group of time points, the set interval time length is obtained, and the temperature rise rate of each group of time points is obtained by dividing the temperature difference of each group of time points by the set interval time length, which is recorded as , Indicates the The number of the group time point, , and obtain the temperature of the laser cutting head at the current time point, recorded as , substitute it into the formula Get the estimated time for the laser cutting head to reach the preset maximum allowable temperature , Indicates the preset maximum allowable temperature, The number of groups representing the time points, which will provide feedback to the system on the estimated time it will take for the laser cutting head to reach the preset maximum allowable temperature.
[0022] Preferably, the specific analysis method of the cutting speed monitoring module is: according to the set time length, the cutting process of the target part is divided into several equal-length time periods, recorded as each time period, and the coordinates of the start time point and the end time point of each time period of the laser cutting head are obtained by the displacement sensor, recorded as , Indicates the The number of the time period, , through the formula Get the cutting length of the laser cutting head in each time period , and record the set duration as , substitute it into the formula Get the cutting speed of the laser cutting head in each time period , the average cutting speed of the laser cutting head in each time period is obtained by averaging the cutting speed of the laser cutting head, which is recorded as , substitute it into the formula Get the cutting speed stability of the laser cutting head , Indicates the number of time periods, and the cutting speed of the laser cutting head in each time period Substitute into the formula Get the cutting speed compliance of the laser cutting head , Indicates the preset reference cutting speed, They represent the weight factors of the preset cutting speed and cutting speed stability respectively.
[0023] Preferably, the specific analysis method for evaluating the power fluctuation of the laser cutting head is: using a power meter to monitor the power of the laser cutting head when cutting the target part in real time, and obtaining the power of the laser cutting head when it reaches each cutting point of the target part, which is recorded as the power of each cutting point of the laser cutting head. , Indicates the The number of the cutting point, , calculate the average power of each cutting point of the laser cutting head, and get the average power of the cutting point of the laser cutting head, which is recorded as , substitute it into the formula Get the power fluctuation degree of the laser cutting head , Indicates the number of cutting points.
[0024] Preferably, the specific analysis method of the power smoothness between different working modes is: reading the average power of the cutting point of the laser cutting head , according to the set trigger mode, the working mode is switched in sequence, recorded as each working mode, and several time points with equal time intervals are selected when the laser cutting head switches to each working mode, recorded as each monitoring time point. The power of the laser cutting head at each monitoring time point of each working mode is obtained by detecting with a power meter. The adjacent monitoring time points are grouped as a group. By subtracting the power of the laser cutting head at each group of adjacent monitoring time points of each working mode, the power change of the laser cutting head at each group of adjacent monitoring time points of each working mode is obtained, recorded as , Indicates the The number of the working mode, , Indicates the The number of the group monitoring time point, , substitute it into the formula Get the power stability of the laser cutting head in each working mode , Represents the number of monitoring time points, through the formula Get the power switching smoothness of the laser cutting head , Indicates the number of working modes.
[0025] Preferably, the specific analysis method of the power analysis module is: respectively read the power fluctuation degree of the laser cutting head , the power switching smoothness of the laser cutting head , substitute it into the formula Get the power evaluation coefficient of the laser cutting head , Respectively represent the weight factors of the preset power fluctuation degree and power switching smoothness, Represents a natural constant.
[0026] Preferably, the specific analysis method of the cutting parameter analysis module is: respectively reading the moving path matching coefficient and temperature matching degree of the laser cutting head , cutting speed compliance , power evaluation coefficient , substitute it into the formula Get the cutting process evaluation index of the laser cutting head , Indicates the moving path matching coefficient of the laser cutting head, They respectively represent the weight factors of the preset moving path matching coefficient, temperature compliance, cutting speed compliance, and power evaluation coefficient. The cutting process evaluation index of the laser cutting head is compared with the preset cutting process evaluation index threshold and fed back to the system.
[0027] Preferably, the specific analysis method of the cutting quality analysis module is as follows: in the first step, the target part after cutting is recorded as a cutting workpiece, an image of the cutting workpiece is acquired to obtain a cutting workpiece image, and three-dimensional modeling is performed for the cutting workpiece based on the cutting workpiece image, and the obtained three-dimensional model is recorded as a cutting workpiece three-dimensional model, and a cutting workpiece design model is read from a management database, and an overlapping volume of the cutting workpiece three-dimensional model and the cutting workpiece design model is obtained by overlapping the cutting workpiece three-dimensional model with the cutting workpiece design model, and recorded as the overlapping volume of the cutting workpiece and the design workpiece , extract the volume of the cutting workpiece design model, recorded as , through the formula Get the dimensional accuracy of the cut workpiece ;
[0028] The second step is to use the cutting surface of the workpiece as the detection surface and the adjacent plane of the detection surface as the reference surface. Place the verticality measuring instrument on the reference surface and the detection surface of the cut workpiece respectively, and read the verticality deviation value, which is recorded as , read the preset verticality deviation standard value from the management database, recorded as , through the formula Get the verticality of the cut workpiece .
[0029] The third step is to use the formula Get the cutting quality evaluation coefficient of the workpiece , Respectively represent the weight factors of preset dimensional accuracy and verticality, It represents a natural constant. The cutting quality evaluation coefficient of the workpiece is compared with the preset cutting quality evaluation coefficient threshold. If the cutting quality evaluation coefficient of the workpiece is greater than or equal to the preset cutting quality evaluation coefficient threshold, it means that the cutting quality evaluation coefficient of the workpiece is qualified. Otherwise, it means that it is unqualified, and feedback is given to the system.
[0030] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention obtains the moving path matching coefficient of the laser cutting head by tracking the moving path of the laser cutting head, which can ensure that the cutting head performs precise cutting according to the established design route, reduce waste and quality problems caused by path deviation, and is also conducive to achieving high-quality cutting of complex graphics.
[0031] 2. The present invention obtains the temperature compliance of the laser cutting head through the temperature of the laser cutting head at each time point, and can take cooling measures in time to prevent overheating damage. At the same time, it predicts the expected time for the laser cutting head to reach the preset maximum allowable temperature, which is convenient for advance planning and adjustment to avoid production interruption due to overheating.
[0032] 3. The present invention obtains the cutting process evaluation index of the laser cutting head according to the temperature compliance, cutting speed stability and power evaluation coefficient analysis, which is conducive to comprehensively evaluating the entire laser cutting process, facilitating timely discovery of problems and targeted adjustments and optimizations, thereby improving the overall cutting process level and production efficiency.
[0033] Fourth, the present invention detects the quality parameters of the workpiece after cutting and obtains the cutting quality evaluation coefficient of the workpiece through analysis, which helps to timely discover problems in the cutting process and better meet the strict requirements on the quality of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0035] Figure 1 This is a system module connection diagram of the present invention.
[0036] Figure 2 for Figure 1 Flowchart of the displacement monitoring module.
[0037] Figure 3 for Figure 1 Schematic diagram of the process of cutting quality analysis module. DETAILED DESCRIPTION
[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.
[0039] See also Figure 1 As shown, a laser cutting intelligent monitoring and control system includes a displacement monitoring module, a temperature monitoring module, a cutting speed monitoring module, a power detection module, a power analysis module, a cutting parameter analysis module, a cutting quality analysis module, and a management database.
[0040] The management database is connected to the displacement monitoring module, temperature monitoring module, cutting speed monitoring module, power analysis module, cutting parameter analysis module, and cutting quality analysis module; the power analysis module is connected to the temperature monitoring module, cutting speed monitoring module, and cutting parameter analysis module; and the power detection module is connected to the power analysis module.
[0041] The displacement monitoring module is used to obtain the movement path of the laser cutting head and analyze its consistency with the reference movement path.
[0042] See also Figure 2 As shown, the specific analysis method of the displacement monitoring module is: the first step is to obtain a top-view image of the tip of the laser cutting head on the target part plane through a projection device, extract the projection point of the tip of the laser cutting head on the target part plane at each cutting point during cutting, and simultaneously shoot the image of the laser cutting head in real time, identify the characteristic points of the cutting head to obtain the actual position information of the cutting head, cross-verify the actual position information of the cutting head with the position obtained by projection, calculate the deviation between the two and correct it, and obtain the real-time position point of the tip of the laser cutting head on the target part plane; it can ensure that the laser cutting head and the target part are always in the same reference plane, and then establish a two-dimensional coordinate system according to the preset principle, and accurately obtain the real-time position point of the tip of the laser cutting head at each cutting point on the target part plane during cutting, which is recorded as the position coordinates of each cutting point.
[0043] It should be noted that the specific analysis method of the real-time position point of the tip of the laser cutting head on the target part plane is: obtain a top-view image of the tip of the laser cutting head on the target part plane through a projection device, obtain the projection point of the tip of the laser cutting head on the target part plane, select several cutting points according to the set interval, and preliminarily obtain the coordinates of the projection point of the tip of the laser cutting head on the target part plane at each cutting point during cutting.
[0044] The visual sensor continuously captures real-time images of the laser cutting head at a set frame rate, pre-produces a template image of the cutting head tip, and searches for matching areas in the real-time image of the laser cutting head through a template matching method to determine the position of the cutting head tip. The position is then converted into the actual position coordinates of the cutting head in three-dimensional space based on the calibration parameters of the visual sensor.
[0045] The actual position coordinates of the cutting head in three-dimensional space are synchronized with the projection coordinates of the laser cutting head tip at each cutting point on the target plane in time, and divided into subsets, for each subset, use it as a validation set, and the remaining subsets as training sets. On the training set, calculate the position deviation in the horizontal direction and the vertical direction respectively. According to the calculated deviation, the coordinates of the projection point of the laser cutting head tip at each cutting point in the validation set on the target plane are corrected. Repeat this step to perform rounds of cross validation, we get The corrected coordinates of the group The average of the corrected coordinates is used to obtain the real-time position of the laser cutting head tip on the target plane.
[0046] The second step is to sort the position coordinates of each cutting point in chronological order, and group adjacent cutting points into a group, which are recorded as each group of cutting points. According to the position coordinates of each group of cutting points, the moving path of the laser cutting head between each group of cutting points is simulated by the linear fitting method, which is recorded as the fitting moving path of each group of cutting points. The fitting moving paths of each group of cutting points are connected in sequence to form the moving path of the laser cutting head. This can intuitively understand the movement of the cutting head, facilitate the analysis of its movement rationality and accuracy, and help to discover abnormalities or unreasonableness in the cutting path, and make timely corrections and optimizations.
[0047] It should be noted that the preset principle is to use the upper left corner vertex of the target part as the origin of the two-dimensional coordinate system, and the two adjacent sides of the target part as the horizontal axis and vertical axis of the two-dimensional coordinate system respectively, and the horizontal right direction is the positive direction of the horizontal axis, and the vertical downward direction is the positive direction of the vertical axis, so as to establish a two-dimensional coordinate system.
[0048] The third step is to read the reference moving path of the laser cutting head from the management database, compare the moving path of the laser cutting head with the reference moving path of the laser cutting head, obtain the overlapping length of the moving path of the laser cutting head and the reference moving path of the laser cutting head, and analyze and obtain the moving path matching coefficient of the laser cutting head; help to timely discover the deviation of the cutting path so that measures can be taken to correct it and improve the accuracy of cutting.
[0049] It should be noted that the specific analysis method of the moving path matching coefficient of the laser cutting head is as follows: read the overlapping length of the moving path of the laser cutting head and the reference moving path of the laser cutting head, and record it as , substitute it into the formula Get the moving path matching coefficient of the laser cutting head ,in Indicates the total length of the preset reference moving path of the laser cutting head.
[0050] The temperature monitoring module is used to monitor the temperature of the laser cutting head, analyze temperature changes, and predict the time it takes for the laser cutting head to reach the preset maximum allowable temperature.
[0051] The specific analysis method of the temperature monitoring module is as follows: a number of time points are selected during the cutting process of the target part according to the set interval time, which are recorded as each time point, and the temperature of the laser cutting head at each time point is detected by the temperature sensor, which is recorded as ,in Indicates the The number of the time point, , Represents the number of time points, through the formula Get the temperature compliance of the laser cutting head , Indicates the preset maximum allowable temperature. The temperature compliance of the laser cutting head is compared with the preset temperature compliance threshold. If the temperature compliance of the laser cutting head is lower than the preset temperature compliance threshold, it means that the temperature compliance of the laser cutting head is unqualified and an early warning is issued. Otherwise, it means that the temperature compliance of the laser cutting head is qualified. This ensures that the temperature of the laser cutting head is within a safe range to avoid damage to the equipment or affecting the cutting quality due to excessive temperature.
[0052] The specific analysis method of the time length of the laser cutting head reaching the preset maximum allowable temperature is as follows: adjacent time points are grouped as each group of time points, the temperature difference of each group of time points is obtained by subtracting the temperature of each group of time points, and the set interval time length is obtained. The temperature rise rate of each group of time points is obtained by dividing the temperature difference of each group of time points by the set interval time length, which is recorded as , Indicates the The number of the group time point, , and obtain the temperature of the laser cutting head at the current time point, recorded as , substitute it into the formula Get the estimated time for the laser cutting head to reach the preset maximum allowable temperature , Indicates the preset maximum allowable temperature, The number of groups representing time points is used to provide feedback to the system on the estimated time it will take for the laser cutting head to reach the preset maximum allowable temperature. This allows for timely detection of abnormal temperature changes, such as rapid temperature rise, allowing for proactive response measures such as adjusting process parameters or suspending operations for cooling.
[0053] The cutting speed monitoring module is used to analyze the cutting speed compliance according to the cutting parameters of the laser cutting head. The cutting parameters include the average cutting speed and the cutting speed stability.
[0054] The specific analysis method of the cutting speed monitoring module is as follows: the cutting process of the target part is divided into several equal-length time periods according to the set time length, recorded as each time period, and the coordinates of the start time point and the end time point of each time period of the laser cutting head are obtained by the displacement sensor, recorded as , Indicates the The number of the time period, , through the formula Get the cutting length of the laser cutting head in each time period , and record the set duration as , substitute it into the formula Get the cutting speed of the laser cutting head in each time period , the average cutting speed of the laser cutting head in each time period is obtained by averaging the cutting speed of the laser cutting head, which is recorded as , substitute it into the formula Get the cutting speed stability of the laser cutting head , Indicates the number of time periods, and the cutting speed of the laser cutting head in each time period Substitute into the formula Get the cutting speed compliance of the laser cutting head , Indicates the preset reference cutting speed, They represent the weight factors of the preset cutting speed and the cutting speed stability respectively; the calculated cutting speed compliance can be compared with the preset standard to determine whether the actual cutting speed meets the requirements, so as to promptly discover possible problems and make adjustments to ensure high quality and high efficiency of the cutting operation.
[0055] It should be noted that, in a specific embodiment, It can be set to 0.4, It can be set to 0.6. The stability of cutting speed is directly related to the continuity and uniformity of the entire cutting process. If the speed is unstable, it may lead to uneven cutting surface quality, jagged edges and other problems, which will have a greater impact on the quality of the final product. Although cutting speed is also important, relatively speaking, as long as it is within a reasonable range, its impact may not be as critical as speed stability. It affects efficiency more. Stability has a more direct and decisive impact on cutting quality. Therefore, the weight corresponding to cutting speed stability is higher.
[0056] The power detection module is used to evaluate the power fluctuation of the laser cutting head and analyze the power smoothness between different working modes.
[0057] The specific analysis method for evaluating the power fluctuation of the laser cutting head is as follows: the power of the laser cutting head when cutting the target part is monitored in real time by a power meter, and the power of the laser cutting head when it reaches each cutting point of the target part is obtained, which is recorded as the power of each cutting point of the laser cutting head. , Indicates the The number of the cutting point, , calculate the average power of each cutting point of the laser cutting head, and get the average power of the cutting point of the laser cutting head, which is recorded as , substitute it into the formula Get the power fluctuation degree of the laser cutting head , Indicates the number of cutting points; it can timely understand the working status of the laser cutting head, ensure that it operates within the normal power range, and avoid cutting quality problems or equipment damage caused by abnormal power.
[0058] The specific analysis method of the power smoothness between different working modes is: reading the average power of the cutting point of the laser cutting head , according to the set trigger mode, the working mode is switched in sequence, recorded as each working mode, and several time points with equal time intervals are selected when the laser cutting head switches to each working mode, recorded as each monitoring time point. The power of the laser cutting head at each monitoring time point of each working mode is obtained by detecting with a power meter. The adjacent monitoring time points are grouped as a group. By subtracting the power of the laser cutting head at each group of adjacent monitoring time points of each working mode, the power change of the laser cutting head at each group of adjacent monitoring time points of each working mode is obtained, recorded as , Indicates the The number of the working mode, , Indicates the The number of the group monitoring time point, , substitute it into the formula Get the power stability of the laser cutting head in each working mode , Represents the number of monitoring time points, through the formula Get the power switching smoothness of the laser cutting head , Indicates the number of working modes;
[0059] The power analysis module is used to obtain the power evaluation coefficient and provide feedback based on the power fluctuation and power switching smoothness of the laser cutting head. The specific analysis method of the power analysis module is: read the power fluctuation degree of the laser cutting head respectively , the power switching smoothness of the laser cutting head , substitute it into the formula Get the power evaluation coefficient of the laser cutting head , Respectively represent the weight factors of the preset power fluctuation degree and power switching smoothness, Represents a natural constant; monitoring and analysis of power can ensure the stability and reliability of the cutting process, improve cutting quality, and detect power anomalies in a timely manner, facilitating adjustment and optimization.
[0060] It should be noted that, in a specific embodiment, It can be set to 0.6, It can be set to 0.4. The influence of power fluctuation may be relatively large, because if the power fluctuation is large, it will directly have a significant impact on the cutting quality, such as uneven incisions, uneven heat-affected zones, etc., which seriously affect the final quality of the workpiece. Although the smoothness of power switching is also important, its impact on the immediate effect of cutting may not be as direct and critical as the power fluctuation. It affects the convenience and efficiency of operation more. Therefore, the power fluctuation has a higher weight.
[0061] The cutting parameter analysis module is used to comprehensively analyze the moving path consistency, temperature analysis results, cutting speed compliance and power evaluation coefficient, evaluate the cutting process evaluation index and provide feedback.
[0062] The specific analysis method of the cutting parameter analysis module is to read the moving path matching coefficient and temperature matching degree of the laser cutting head respectively. , cutting speed compliance , power evaluation coefficient , substitute it into the formula Get the cutting process evaluation index of the laser cutting head , Indicates the moving path matching coefficient of the laser cutting head, The weight factors respectively represent the preset moving path matching coefficient, temperature compliance, cutting speed compliance, and power evaluation coefficient. The cutting process evaluation index of the laser cutting head is compared with the preset cutting process evaluation index threshold and fed back to the system. Problems or deviations in the cutting process can be discovered in time so that adjustments and optimizations can be made quickly, thereby improving the overall cutting quality and effect.
[0063] It should be noted that, in a specific embodiment, It can be set to 0.3, It can be set to 0.3, It can be set to 0.2, It can be set to 0.2. An accurate moving path is crucial to ensuring cutting accuracy and shape conformity. If the path does not match, it will directly lead to serious problems in cutting quality, such as shape deviation. Appropriate temperature control can ensure the performance of the material and the cutting effect. Too high or too low temperature may cause material deformation, excessive heat-affected zone and other problems. The degree of cutting speed conformity has a certain impact on cutting efficiency and quality, but it may be slightly less than the first two. However, unreasonable cutting speed will also bring problems such as poor incision quality. The impact of the power evaluation coefficient may be relatively small. Although power will affect cutting ability, its adjustment is relatively flexible within a certain range, and other factors are often more critical to the direct impact on the cutting process. Therefore, the weights corresponding to the moving path conformity coefficient and temperature conformity are higher, and the weights corresponding to the cutting speed conformity and power evaluation coefficient are lower.
[0064] It should be noted that the specific analysis method of the feedback to the system is: reading the cutting process evaluation index of the laser cutting head, comparing the cutting process evaluation index of the laser cutting head with the preset cutting process evaluation index threshold value, if the cutting process evaluation index of the laser cutting head is greater than or equal to the preset cutting process evaluation index threshold value, it means that the cutting process evaluation index of the laser cutting head is qualified; if the cutting process evaluation index of the laser cutting head is less than the preset cutting process evaluation index threshold value, it means that the cutting process evaluation index of the laser cutting head is unqualified, and it is fed back to the system.
[0065] The cutting quality analysis module is used to perform quality inspection on the workpiece after cutting and obtain the cutting quality evaluation coefficient. The quality parameters include dimensional accuracy and verticality.
[0066] See also Figure 3 As shown, the specific analysis method of the cutting quality analysis module is as follows: in the first step, the target part after cutting is recorded as a cutting workpiece, an image of the cutting workpiece is acquired to obtain a cutting workpiece image, and three-dimensional modeling is performed for the cutting workpiece based on the cutting workpiece image, and the obtained three-dimensional model is recorded as a cutting workpiece three-dimensional model, and the cutting workpiece design model is read from the management database, and the overlapping volume of the cutting workpiece three-dimensional model and the cutting workpiece design model is obtained by overlapping the cutting workpiece three-dimensional model with the cutting workpiece design model, and recorded as the overlapping volume of the cutting workpiece and the design workpiece. , extract the volume of the cutting workpiece design model, recorded as , through the formula Get the dimensional accuracy of the cut workpiece It helps to timely discover dimensional deviation problems that may occur during the cutting process so that corresponding measures can be taken to improve and optimize them, thereby improving the quality of the cut workpiece and the degree to which it meets the design requirements.
[0067] The second step is to use the cutting surface of the workpiece as the detection surface and the adjacent plane of the detection surface as the reference surface. Place the verticality measuring instrument on the reference surface and the detection surface of the cut workpiece respectively, and read the verticality deviation value, which is recorded as , read the preset verticality deviation standard value from the management database, recorded as , through the formula Get the verticality of the cut workpiece It can help to promptly detect verticality problems of the cutting surface so that measures can be taken to improve the cutting process and enhance the overall quality of the product.
[0068] The third step is to use the formula Get the cutting quality evaluation coefficient of the workpiece , Respectively represent the weight factors of preset dimensional accuracy and verticality, It represents a natural constant. The cutting quality evaluation coefficient of the workpiece is compared with the preset cutting quality evaluation coefficient threshold. If the cutting quality evaluation coefficient of the workpiece is greater than or equal to the preset cutting quality evaluation coefficient threshold, it means that the cutting quality evaluation coefficient of the workpiece is qualified. Otherwise, it means that it is unqualified, and feedback is given to the system. It can accurately measure the quality of the workpiece cutting, promote the optimization and continuous improvement of the production process, and ensure the stability of product quality.
[0069] It should be noted that, in a specific embodiment, It can be set to 0.6, It can be set to 0.4. Dimensional accuracy is directly related to whether the workpiece can be accurately assembled with other parts and used normally. If the dimensional accuracy does not meet the standard, it may cause functional problems in the entire product or fail to assemble normally. Therefore, the weight corresponding to dimensional accuracy is higher.
[0070] This system obtains the moving path matching coefficient of the laser cutting head by tracking the moving path of the laser cutting head, predicts the expected time for the laser cutting head to reach the preset maximum allowable temperature, and obtains the cutting process evaluation index of the laser cutting head based on the temperature compliance, cutting speed stability, and power evaluation coefficient analysis. The quality parameters of the workpiece after cutting are tested and the cutting quality evaluation coefficient of the workpiece is obtained through analysis, thereby improving the accuracy and stability of cutting and enhancing the intelligence and automation level of the entire laser cutting system.
[0071] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention, which are still covered by the scope of protection of the present invention.
Claims
1. A laser cutting intelligent monitoring and control system, characterized in that: include: The displacement monitoring module obtains the movement path of the laser cutting head and analyzes its consistency with the reference movement path; The temperature monitoring module monitors the temperature changes of the laser cutting head and predicts the time it takes for the laser cutting head to reach the preset maximum allowable temperature; Cutting speed monitoring module, based on the average cutting speed of the laser cutting head and cutting speed stability Analyze the cutting speed compliance ; According to the set time The cutting process of the target part is divided into several equal-length time periods, recorded as each time period. The coordinates of the start and end time points of each time period of the laser cutting head are obtained by the displacement sensor, and the cutting length of the laser cutting head in each time period is calculated and analyzed by the spatial distance formula. , cutting speed of laser cutting head in each time period ,right Taking the average value, we get , and conduct a comprehensive analysis and ; , Indicates the The number of the time period, , Indicates the number of time periods; , Indicates the preset reference cutting speed, Respectively represent the weight factors of the preset cutting speed and cutting speed stability; Power detection module, which evaluates the power fluctuation of the laser cutting head and analyzes the power smoothness between different working modes; The specific analysis method of the power smoothness between different working modes is: reading the average power of the cutting point of the laser cutting head , according to the set trigger mode, the working mode is switched in sequence, recorded as each working mode, and several time points with equal time intervals are selected when the laser cutting head switches to each working mode, recorded as each monitoring time point. The power of the laser cutting head at each monitoring time point of each working mode is obtained by detecting with a power meter. The adjacent monitoring time points are grouped as a group. By subtracting the power of the laser cutting head at each group of adjacent monitoring time points of each working mode, the power change of the laser cutting head at each group of adjacent monitoring time points of each working mode is obtained, recorded as , Indicates the The number of the working mode, , Indicates the The number of the group monitoring time point, , substitute it into the formula Get the power stability of the laser cutting head in each working mode , Represents the number of monitoring time points, through the formula Get the power switching smoothness of the laser cutting head , Indicates the number of working modes; Power analysis module, based on the power fluctuation and power switching smoothness of the laser cutting head Analyze power evaluation coefficient and feedback; Read the power fluctuation of the laser cutting head separately and , , Respectively represent the weight factors of the preset power fluctuation degree and power switching smoothness, represents a natural constant; The power of each cutting point of the laser cutting head and average power Analyze the power fluctuation of the laser cutting head , , Indicates the The number of the cutting point, , Indicates the number of cutting points; Cutting parameter analysis module, comprehensive moving path fit, temperature analysis results, and , evaluate the cutting process evaluation index and feedback; Read the moving path matching coefficient of the laser cutting head respectively , temperature compliance , cutting speed compliance , power evaluation coefficient , , Respectively represent the preset moving path matching coefficient, temperature matching degree, cutting speed matching degree, and power evaluation coefficient weight factors. Compare with the preset cutting process evaluation index threshold and feed back to the system; Cutting quality analysis module, which performs quality inspection on the workpiece after cutting and obtains the cutting quality evaluation coefficient. The quality parameters include dimensional accuracy and verticality. Manage the database and store the reference movement path of the laser cutting head and the design model of the cutting workpiece.
2. The laser cutting intelligent monitoring and control system according to claim 1, characterized in that: The specific analysis method of the displacement monitoring module is: The first step is to obtain a top view image of the laser cutting head tip on the target part plane through a projection device, obtain the projection point of the laser cutting head tip on the target part plane, select a number of cutting points according to the set interval, and obtain the projection point of the laser cutting head tip on the target part plane at each cutting point during cutting. According to the preset principle, a two-dimensional coordinate system is established to obtain the coordinates of the projection point of the laser cutting head tip on the target part plane at each cutting point during cutting, which are recorded as the position coordinates of each cutting point; The second step is to sort the position coordinates of each cutting point in chronological order, and group adjacent cutting points into groups, which are recorded as each group of cutting points. According to the position coordinates of each group of cutting points, the moving path of the laser cutting head between each group of cutting points is simulated by the linear fitting method, which is recorded as the fitting moving path of each group of cutting points. The fitting moving paths of each group of cutting points are connected in sequence to form the moving path of the laser cutting head. The third step is to read the reference moving path of the laser cutting head from the management database, compare the moving path of the laser cutting head with the reference moving path of the laser cutting head, and obtain the overlapping length of the moving path of the laser cutting head with the reference moving path of the laser cutting head. , the moving path matching coefficient of the laser cutting head is obtained by analysis , , Indicates the total length of the preset reference moving path of the laser cutting head.
3. The laser cutting intelligent monitoring and control system according to claim 1, characterized in that: The specific analysis method of the temperature monitoring module is: According to the set interval length, several time points are selected during the cutting process of the target part, which are recorded as each time point. The temperature of the laser cutting head at each time point is detected by the temperature sensor and recorded as ,in Indicates the The number of the time point, , Indicates the number of time points, and the temperature compliance of the laser cutting head is obtained by quantitative analysis of the temperature deviation. , , Indicates the preset maximum allowable temperature. The temperature compliance of the laser cutting head is compared with the preset temperature compliance threshold. If the temperature compliance of the laser cutting head is less than the preset temperature compliance threshold, it means that the temperature compliance of the laser cutting head is unqualified and an early warning is issued. Otherwise, it means that the temperature compliance of the laser cutting head is qualified.
4. The laser cutting intelligent monitoring and control system according to claim 1, characterized in that: The specific analysis method for evaluating the power fluctuation of the laser cutting head is: The power meter is used to monitor the power of the laser cutting head when cutting the target part in real time, and the power of the laser cutting head when it reaches each cutting point of the target part is obtained, which is recorded as the power of each cutting point of the laser cutting head. , calculate the average power of each cutting point of the laser cutting head to get the average power of the cutting point of the laser cutting head , and then analyze the power fluctuation of the laser cutting head .
5. The laser cutting intelligent monitoring and control system according to claim 1, characterized in that: The specific analysis method of the cutting quality analysis module is: In the first step, the target part after cutting is recorded as the cut workpiece, an image of the cut workpiece is acquired, and a three-dimensional model is generated for the cut workpiece based on the cut workpiece image. The obtained three-dimensional model is recorded as the cut workpiece three-dimensional model, and the cut workpiece design model is read from the management database. The cut workpiece three-dimensional model is overlapped with the cut workpiece design model to obtain the overlapping volume of the cut workpiece three-dimensional model and the cut workpiece design model, which is recorded as the overlapping volume of the cut workpiece and the design workpiece. The volume of the cut workpiece design model is extracted, and the dimensional accuracy of the cut workpiece is analyzed by the ratio method. The second step is to use the cutting surface of the workpiece as the test surface and the adjacent plane of the test surface as the reference surface. Place the verticality measuring instrument on the reference surface and the test surface of the workpiece respectively, read the verticality deviation value, read the preset verticality deviation standard value from the management database, and quantitatively analyze the verticality of the cut workpiece based on the verticality deviation situation. The third step is to analyze the cutting quality evaluation coefficient of the workpiece and compare it with the preset cutting quality evaluation coefficient threshold. If the cutting quality evaluation coefficient of the workpiece is greater than or equal to the preset cutting quality evaluation coefficient threshold, it means that the cutting quality evaluation coefficient of the workpiece is qualified, otherwise it means that it is unqualified, and feedback is given to the system.
Citation Information
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