Parallel seam welding air tightness repair method

Abstract

The invention discloses a parallel seam welding air tightness repair method which comprises the following steps: reversely buckling a device to be repaired on an operation table, and fixing the position of the device through a clamping device; starting a cutting device to cut and separate the device cover plate from the device shell; the cut device is taken down from the operation table, burrs and chippings on the periphery of the cut device are removed, and a device cover plate is pried open; a scrap blocking piece is installed above the chip in the device, and the periphery of the scrap blocking piece makes contact with the inner side of the device shell; the periphery of the chipping blocking piece is in sealed connection with the inner side of the device shell through sealant; the processed device is inversely buckled on a grinding machine to be ground, after the uncovering milling part is ground to be flat, chippings on a chipping blocking piece and a device shell are removed, and the sealant and the chipping blocking piece are taken off after the chipping blocking piece and the device shell are removed; after the components in the device shell are repaired, a new device cover plate is placed on the device shell, and secondary parallel seam welding is carried out. According to the invention, high-airtightness repair of secondary parallel seam welding can be realized.

Description

Technical Field

[0001] The invention relates to the technical field of connector welding, and in particular to a parallel seam welding airtightness repair method. Background Art

[0002] As electronic devices continue to develop in the direction of miniaturization, high performance, and high reliability, the market demand for electronic components packaged using the parallel seam welding process has exploded. These components usually need to operate stably for a long time in complex and changeable working environments, such as high temperature, high humidity, strong electromagnetic interference, and even space radiation environments, and their airtightness requirements are almost harsh. However, in the actual production process, although the parallel seam welding process is relatively mature, it involves many complex and interrelated process parameters, including welding current, pulse width, electrode pressure, welding speed, etc. Even under a strict quality control system, a certain proportion of products with unqualified airtightness will inevitably appear.

[0003] Traditional treatment methods often face many difficulties. On the one hand, simple scrapping not only causes huge waste of raw materials and high costs, but is also unbearable for components that use rare metals or undergo special processing. On the other hand, if conventional soldering methods are used directly, it is very likely to cause thermal stress problems due to local overheating, thereby damaging the fragile internal chip structure and causing the components to fail completely. At the same time, it is also difficult to accurately locate the leaking parts and ensure that the airtightness after repair meets the initial design requirements. In addition, for some high-value, customized electronic components, the remanufacturing cycle is too long and cannot meet the urgent market demand. There are two common parallel seam welding repair methods: 1) Mechanical opening and secondary welding method, which uses a mechanical milling machine or other method to open the cover, and then grinds the burrs at the opening. This method is prone to debris entering the device during grinding, causing short circuits and other problems; 2) Glue coating plugging method, which uses colloid to wrap the leaking device to achieve the effect of airtightness, which is only suitable for devices with low requirements for the device environment.

[0004] In view of this, it is imperative to develop a parallel seam welding airtightness repair technology that does not damage the internal structure of the product. Summary of the invention

[0005] The purpose of the present invention is to provide a parallel seam welding airtightness repair method, which can realize the method of opening the cover for repair after parallel seam welding. The method is simple to operate, does not damage other electronic components inside the device, and can ensure the airtightness of the parallel seam welding again.

[0006] To achieve the above object, the present invention is implemented by adopting the following technical solutions: The present application discloses a parallel seam welding airtightness repair method, comprising: Step 1, turn the device to be repaired upside down on the operating table and fix the position of the device by a clamping device; wherein the device includes a device housing, a device cover plate connected to the device housing by parallel seam welding, and a device internal chip located in the device housing; Step 2, starting the cutting device to cut and separate the device cover from the device housing; Step 3: Remove the cut device from the operating table, remove the burrs and debris around the cutting, and pry open the device cover; Step 4: Install a debris blocking sheet above the chip inside the device, with the four sides of the debris blocking sheet in contact with the inner side of the device housing; Step 5: Use sealant to seal the periphery of the debris blocking piece to the inner side of the device housing; Step 6: Turn the device processed in step 5 upside down on a grinder and grind it. After the milling part of the cover is polished flat, clean the debris on the debris blocking piece and the device housing. After cleaning, remove the sealant and the debris blocking piece. Step 7: After repairing the components in the device housing, place the new device cover on the device housing and perform secondary parallel seam welding.

[0007] In some embodiments, step 2, starting the cutting device to cut and separate the device cover from the device housing, comprises: The extended end of the device contacts the cutting device, the contact length is the length of the parallel seam welding, and the upward feeding depth of the cutting device is the thickness of the device cover plate.

[0008] In some embodiments, the feed depth of the milling cutter of the capping machine is 0.1-0.2 mm, and the length of the extended end of the adjusting device is 0.1-0.2 mm.

[0009] In some embodiments, the length and width of the debris blocking piece are the length and width corresponding to the inner cross-section of the device housing at a set height, and the thickness is 0.01 mm.

[0010] In some embodiments, the debris blocking piece is made of steel sheet.

[0011] In some embodiments, step 4, installing a debris barrier sheet above the chip inside the device, with the periphery of the debris barrier sheet in contact with the inner side of the device housing, includes: If there is a step inside the device housing and the installation and wear conditions are met, install the debris blocker at the step; If there is no suitable step in the device housing, install a soft pad in the device housing to avoid the blank space of the chip inside the device. After padding to a set height, install a debris blocker on the soft pad.

[0012] In some embodiments, the cutting device is a milling cutter.

[0013] In some embodiments, the clamping device is a cover opener pressure rod, which uses clamping force to fix the device on the operating table.

[0014] In some embodiments, the sealant is a quick-setting sealant.

[0015] According to the above technical solution, the beneficial effects of the present invention are: The repair method of the present application seals and connects the debris blocking piece to the inner side of the device housing on all sides, thereby blocking the debris generated during the grinding process of the weld bead of the device housing after the cover is opened, so that the debris does not enter the interior of the device, thereby achieving the rework process without pollution to the internal circuit of the device, and realizing high-airtightness rework of secondary parallel seam welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the positioning and opening operation of the device on the opening machine in the embodiment of the present invention; Figure 2 A schematic diagram of the internal structure of a device in an embodiment of the present invention; Figure 3 It is a schematic diagram of installing the debris blocking piece after the cover is opened in an embodiment of the present invention; Figure 4 for Figure 3 The enlarged schematic diagram of the middle circle; Figure 5 It is a schematic diagram of the assembly sequence of the various components of the present invention.

[0017] Among them, there are a clamping device 1, a device housing 2, a device cover plate 3, a cutting device 4, an operating table 5, a chip inside the device 6, a debris blocking sheet 7, and a sealant 8. DETAILED DESCRIPTION

[0018] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0019] It should be noted that in the description of the present invention, the directions or positional relationships indicated by the terms "front", "rear", "left", "right", "up", "down", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention rather than requiring the present invention to be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. The terms "front", "rear", "left", "right", "up", and "down" used in the description of the present invention refer to the directions in the accompanying drawings, and the terms "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively.

[0020] A parallel seam welding airtightness repair method, comprising: Step 1: Place the device to be repaired upside down on the operating table 5, and fix the device position by the clamping device 1; wherein the device includes a device housing 2, a device cover plate 3 connected to the device housing by parallel seam welding, and a device internal chip 6 located in the device housing; Step 2: Start the cutting device 4 to cut and separate the device cover plate 3 from the device housing 2; Step 3: Remove the cut device from the operating table, remove the burrs and debris around the cutting, and pry open the device cover plate 3; Step 4: Install the debris blocking sheet 7 on the internal chip of the device The chip 6 is above the chip block 7, and the four sides of the chip block 7 are in contact with the inner side of the device housing 2; step 5, use sealant 8 to seal the four sides of the chip block 7 with the inner side of the device housing 2; step 6, turn the device processed in step 5 upside down on a grinder, grind the milled part of the cover flat, clean the debris on the chip block 7 and the device housing 2, and remove the sealant 8 and the chip block 7 after cleaning; step 7, after the components in the device housing are repaired, place the new device cover on the device housing and perform secondary parallel seam welding.

[0021] The present application seals the debris blocking sheet 7 in steps 4 and 5 with the inner side of the device housing 2 to block the debris generated during the grinding process of the weld bead of the device housing 2 after the cover is opened, so that the debris does not enter the inside of the device, thereby achieving the rework process without contaminating the internal circuit of the device. If the debris enters the inside of the device, the expected effect cannot be achieved by opening the cover for rework.

[0022] More specifically, an embodiment of the present invention provides a parallel seam welding airtightness repair method, comprising: Step 1: Place the device to be repaired upside down on the operating table 5 and fix the device position by the clamping device 1. Figure 1 As shown; wherein, the device comprises a device housing 2, a device cover plate 3 connected to the device housing by parallel seam welding, and a device internal chip 6 located in the device housing; In some embodiments, in this step, the clamping device 1 is a lid opener pressure rod, and the device is fixed on the operating table by clamping force.

[0023] In some embodiments, the device housing and the device cover are both made of metal.

[0024] Step 2, starting the cutting device 4 to cut and separate the device cover plate 3 from the device housing 2; In some embodiments, in this step, starting the cutting device to cut and separate the device cover plate 3 from the device housing 2 includes: The extended end of the device contacts the cutting device 4, the contact length is the length of the parallel seam welding, and the cutting device 4 is fed upward to a depth equal to the thickness of the device cover.

[0025] Furthermore, the feed depth of the milling cutter of the capping machine is 0.1-0.2 mm, and the length of the extended end of the adjusting device is 0.1-0.2 mm.

[0026] In this embodiment, the feed depth of the milling cutter of the capping machine is 0.15 mm, and the length of the extended end of the adjusting device is 0.1 mm.

[0027] In some embodiments, the cutting device is a milling cutter.

[0028] Step 3: Remove the cut device from the operating table, remove the burrs and debris around the cutting, and pry open the device cover 3. Figure 2 As shown; In some embodiments, in this step, prying open the device cover 3 includes: Choose a pry bar or piece of metal as the prying tool; After determining the prying point, fit the pry tool to the edge of the device cover, apply even pressure to lift the device cover, and gradually expand the opening to pry open the device cover.

[0029] Step 4: Install the debris blocking sheet 7 above the chip 6 inside the device, and the debris blocking sheet 7 is in contact with the inner side of the device housing 2 around the periphery, such as Figure 3 As shown; In some embodiments, in this step, the debris blocking sheet 7 is installed above the chip 6 inside the device, and the four sides of the debris blocking sheet 7 are in contact with the inner side of the device housing 2, including: If there is a step inside the device housing and the installation and grinding conditions are met, the debris blocking sheet 7 is installed at the step; If there is no suitable step in the device housing, a soft pad is installed in the device housing to avoid the blank space of the chip 6 inside the device, and after padding to a set height, a debris blocking sheet 7 is installed on the soft pad.

[0030] In some embodiments, the length and width of the debris blocking piece 7 are the length and width corresponding to the inner cross section of the device housing 2 at a set height, and the thickness is 0.01 mm. Furthermore, the debris blocking piece 7 is made of steel sheet.

[0031] Step 5: Use sealant 8 to seal the debris blocking piece 7 around the inner side of the device housing 2. Figure 4 As shown; In this step, a sealant is used to surround the contact point between the debris blocking sheet 7 and the device housing 2 in a complete circle, and then cured using corresponding curing conditions.

[0032] In some embodiments, the sealant 8 is a quick-setting sealant. Quick-setting sealant is a fluid glue that can be quickly solidified at a temperature below 80°C or by other means. It has the characteristics of having fluid properties, a large damping coefficient, being able to solidify quickly, being able to be easily removed, and having a certain bonding and fixing ability. The main functions are: 1) sealing the gap between the debris baffle 7 and the device housing 2; 2) fixing the debris baffle 7 when grinding the device housing 2 (the device is ground upside down on the grinding disc of the grinder, in the form of dripping water), to ensure that the debris baffle 7 does not fall off.

[0033] Step 6, turn the device processed in step 5 upside down on a grinder and grind it. After the milling part of the cover is polished flat, clean the debris on the debris blocking sheet 7 and the device housing 2. After cleaning, remove the sealant 8 and the debris blocking sheet 7; In some embodiments, in this step, debris on the device debris blocking sheet 7 and the device housing 2 are cleaned: various debris (such as metal powder, oxides, etc.) may accumulate on the device surface during operations such as cutting and prying off the device cover. This step thoroughly removes these debris by using ultrasonic cleaning, compressed air blowing, wiping, etc. to ensure that the device surface is clean and free of contaminants. This is conducive to improving the welding quality between the new device cover and the device housing, and preventing foreign matter from affecting electrical performance or causing short circuits and other problems.

[0034] Preferably, cleaning is carried out in the form of a compressed air purge.

[0035] Step 7: After repairing the components in the device housing, place the new device cover on the device housing and perform secondary parallel seam welding, such as Figure 5 shown.

[0036] In summary, the parallel seam welding airtightness repair method of the present invention can realize the repair of parallel seam welding and reduce the scrap rate of devices.

[0037] It is known from common technical knowledge that the present invention can be implemented by other embodiments that do not deviate from its spirit or essential features. Therefore, the above disclosed embodiments are only illustrative in all respects and are not exclusive. All changes within the scope of the present invention or within the scope equivalent to the present invention are included in the present invention.

Claims

1. A parallel seam welding airtightness repair method, characterized in that: include: Step 1, turn the device to be repaired upside down on the operating table and fix the position of the device by a clamping device; wherein the device includes a device housing, a device cover plate connected to the device housing by parallel seam welding, and a device internal chip located in the device housing; Step 2, starting the cutting device to cut and separate the device cover from the device housing; Step 3: Remove the cut device from the operating table, remove the burrs and debris around the cutting, and pry open the device cover; Step 4: Install a debris blocking sheet above the chip inside the device, with the four sides of the debris blocking sheet in contact with the inner side of the device housing; Step 5: Use sealant to seal the periphery of the debris blocking piece to the inner side of the device housing; Step 6: Turn the device processed in step 5 upside down on a grinder and grind it. After the milling part of the cover is polished flat, clean the debris on the debris blocking piece and the device housing. After cleaning, remove the sealant and the debris blocking piece. Step 7: After repairing the components in the device housing, place the new device cover on the device housing and perform secondary parallel seam welding.

2. The parallel seam welding airtightness repair method according to claim 1, characterized in that: Step 2: Starting the cutting device to cut and separate the device cover from the device housing includes: The extended end of the device contacts the cutting device, the contact length is the length of the parallel seam welding, and the upward feeding depth of the cutting device is the thickness of the device cover plate.

3. The parallel seam welding airtightness repair method according to claim 2, characterized in that: The feed depth of the milling cutter of the capping machine is 0.1-0.2 mm, and the length of the extended end of the adjusting device is 0.1-0.2 mm.

4. The parallel seam welding airtightness repair method according to claim 2, characterized in that: The feed depth of the milling cutter of the capping machine is 0.15 mm, and the length of the extended end of the adjusting device is 0.1 mm.

5. The parallel seam welding airtightness repair method according to claim 1, characterized in that: The length and width of the debris blocking piece are the length and width corresponding to the inner cross section of the device housing at a set height, and the thickness is 0.01 mm.

6. The parallel seam welding airtightness repair method according to claim 1, characterized in that: The material of the debris blocking piece is a steel sheet.

7. The parallel seam welding airtightness repair method according to claim 1, characterized in that: Step 4: Install a debris shield above the chip inside the device, with the debris shield in contact with the inner side of the device housing around the periphery, including: If there is a step inside the device housing and the installation and wear conditions are met, install the debris blocker at the step; If there is no suitable step in the device housing, install a soft pad in the device housing to avoid the blank space of the chip inside the device. After padding to a set height, install a debris blocker on the soft pad.

8. The parallel seam welding airtightness repair method according to claim 1, characterized in that: The cutting device is a milling cutter.

9. The parallel seam welding airtightness repair method according to claim 1, characterized in that: The clamping device is a cover opener pressure rod, which uses the clamping force to fix the device on the operating table.

10. The parallel seam welding airtightness repair method according to claim 1, characterized in that: The sealant used is quick-setting sealant.

Images