Parallel seam welding method for repairing airtightness

Abstract

The application discloses a parallel seam welding airtight repair method, comprising the following steps: placing a device to be repaired upside down on an operation table, fixing the position of the device by a clamping device; starting a cutting device to cut and separate the device cover plate from the device shell; taking the cut device off the operation table, removing burrs and debris around the cutting edge, and prying open the device cover plate; installing a debris baffle above the chip inside the device, and the debris baffle is in contact with the inner side of the device shell around; sealingly connecting the debris baffle around and the inner side of the device shell with sealant; polishing the processed device upside down on a polisher, polishing the cover opening milling part flat, cleaning the debris on the debris baffle and the device shell, and taking off the sealant and the debris baffle after cleaning; after repairing the components and devices in the device shell, placing a new device cover plate on the device shell, and performing secondary parallel seam welding. The application can realize secondary parallel seam welding high airtightness repair.

Description

Technical Field

[0001] This invention relates to the field of connector welding technology, and specifically to a method for repairing the airtightness of parallel seam welds. Background Technology

[0002] As electronic devices continue to evolve towards miniaturization, high performance, and high reliability, the market demand for electronic components packaged using parallel seam welding technology has exploded. These components typically need to operate stably for extended periods in complex and variable working environments, such as high temperature, high humidity, strong electromagnetic interference, and even space radiation environments, where their airtightness requirements are almost stringent. However, in actual production processes, although the parallel seam welding process is relatively mature, due to the numerous complex and interrelated process parameters involved, including welding current, pulse width, electrode pressure, and welding speed, even under strict quality control systems, a certain percentage of products inevitably fail to meet airtightness standards.

[0003] Traditional repair methods often face numerous challenges. On the one hand, simple scrapping not only results in significant waste of raw materials and high costs, especially for components using rare metals or undergoing special processing, the burden is unbearable. On the other hand, directly using conventional soldering methods can easily lead to thermal stress problems due to localized overheating, damaging the fragile internal chip structure and causing complete component failure. Furthermore, it is difficult to accurately locate the leak and ensure that the repaired airtightness meets the initial design requirements. In addition, for some high-value, customized electronic components, the remanufacturing cycle is too long to meet urgent market demands. Common parallel seam soldering repair methods mainly include the following two types: 1) Mechanical opening and secondary soldering: This method uses a mechanical milling machine or other methods to open the cover, then grinds away the burrs at the opening. This grinding method easily generates debris that enters the device, causing short circuits and other problems; 2) Adhesive sealing: This method uses adhesive to wrap the leaking component, thereby achieving an airtight effect. It is only suitable for components with low environmental requirements.

[0004] Therefore, developing a parallel seam welding airtightness repair technology that does not damage the internal structure of the product has become an urgent task. Summary of the Invention

[0005] The purpose of this invention is to provide a method for repairing the airtightness of parallel seam welds. This method allows for repairing the parallel seam welds after opening the cover. The method is simple to operate, does not damage other electronic components inside the device, and can ensure the airtightness of the parallel seam welds.

[0006] To achieve the above objectives, the present invention is implemented using the following technical solution:

[0007] This application discloses a method for repairing the airtightness of parallel seam welds, including:

[0008] Step 1: Place the device to be repaired upside down on the worktable and fix its position using a clamping device; wherein the device includes a device shell, a device cover plate welded parallel to the device shell, and an internal chip located inside the device shell.

[0009] Step 2: Start the cutting device to cut and separate the device cover from the device housing;

[0010] Step 3: Remove the cut device from the worktable, remove the burrs and debris around the cutting edge, and pry open the device cover.

[0011] Step 4: Install the debris baffle above the chip inside the device, with the periphery of the debris baffle in contact with the inside of the device housing;

[0012] Step 5: Use sealant to seal the debris baffle to the inside of the device housing.

[0013] Step 6: Place the device processed in step 5 upside down on the grinder and grind it. After grinding the milled part of the cover open to be flat, clean the debris baffle and the debris on the device shell. After cleaning, remove the sealant and debris baffle.

[0014] Step 7: After repairing the components inside the device housing, place the new device cover plate on the device housing and perform a second parallel seam weld.

[0015] In some embodiments, step 2, activating the cutting device to cut and separate the device cover from the device housing, includes:

[0016] The protruding end of the device contacts the cutting device, and the contact length is the length of the parallel seam weld. The upward feed depth of the cutting device is the thickness of the device cover plate.

[0017] In some embodiments, the feed depth of the milling cutter of the cover opening machine is 0.1~0.2mm, and the length of the extended end of the adjusting device is 0.1~0.2mm.

[0018] In some embodiments, the length and width of the debris baffle are the length and width corresponding to the inner cross-section of the device housing at a set height, and the thickness is 0.01 mm.

[0019] In some embodiments, the debris baffle is made of steel sheet.

[0020] In some embodiments, step 4, installing the debris baffle above the chip inside the device, with the periphery of the debris baffle contacting the inner side of the device housing, includes:

[0021] If there are steps inside the device housing and the installation and wear debris conditions are met, then the debris baffle should be installed at the step.

[0022] If there is no suitable step inside the device housing, install a soft pad inside the device housing, avoiding the blank space of the internal chip, and after raising it to the set height, install a debris baffle on the soft pad.

[0023] In some embodiments, the cutting device is a milling cutter.

[0024] In some embodiments, the clamping device is a lid opener pressure bar, which uses clamping force to fix the device on the operating table.

[0025] In some embodiments, the sealant is a quick-setting sealant.

[0026] According to the above technical solution, the beneficial effects of the present invention are as follows:

[0027] The rework method of this application seals the debris baffle around the device housing to the inside of the device housing, blocking the debris generated during the grinding of the solder joints of the device housing after the housing is opened, preventing the debris from entering the device, thereby achieving a rework process that does not contaminate the internal circuit of the device and achieving a rework with high airtightness of secondary parallel seam welding. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the device being positioned and opened on the opening machine in an embodiment of the present invention;

[0029] Figure 2 This is a schematic diagram of the internal structure of the device in an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of the installation of the debris baffle after the cover is opened in an embodiment of the present invention;

[0031] Figure 4 for Figure 3 Enlarged view of the area within the middle circle;

[0032] Figure 5 This is a schematic diagram showing the assembly sequence of the various components of the present invention.

[0033] The components include: clamping device 1, device housing 2, device cover plate 3, cutting device 4, operating table 5, internal chip 6, debris baffle 7, and sealant 8. Detailed Implementation

[0034] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0035] It should be noted that in the description of this invention, the terms "front," "rear," "left," "right," "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing the invention and do not require the invention to be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. The terms "front," "rear," "left," "right," "upper," and "lower" used in the description of this invention refer to the directions shown in the accompanying drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0036] A method for repairing the airtightness of parallel seam welds includes:

[0037] Step 1: Place the component to be repaired upside down on the workbench 5 and fix its position using the clamping device 1; wherein the component includes a component housing 2, a component cover plate 3 welded parallel to the component housing, and an internal chip 6 located inside the component housing; Step 2: Start the cutting device 4 to cut and separate the component cover plate 3 from the component housing 2; Step 3: Remove the cut component from the workbench, remove burrs and debris from the cutting area, and pry open the component cover plate 3; Step 4: Install the debris baffle 7 inside the component chip. Above the chip 6, and around the chip baffle 7, contact the inside of the device housing 2; Step 5: Use sealant 8 to seal the chip baffle 7 around the inside of the device housing 2; Step 6: Place the device processed in Step 5 upside down on a grinder and grind it. After grinding the milled part of the cover open to be smooth, clean the chip baffle 7 and the chip housing 2. After cleaning, remove the sealant 8 and the chip baffle 7; Step 7: After repairing the components inside the device housing, place the new device cover plate on the device housing and perform secondary parallel seam welding.

[0038] This application uses the debris baffle 7 in steps 4 and 5 to seal the inside of the device housing 2, blocking the debris generated during the grinding of the solder joints of the device housing 2 after opening the cover. This prevents debris from entering the device and thus ensures that the rework process does not contaminate the internal circuitry of the device. If debris enters the device, the rework process cannot achieve the desired effect.

[0039] More specifically, embodiments of the present invention provide a method for repairing the airtightness of parallel seam welds, comprising:

[0040] Step 1: Place the component to be repaired upside down on the operating table 5, and fix its position using the clamping device 1, such as... Figure 1 As shown; wherein, the device includes a device housing 2, a device cover plate 3 connected to the device housing by parallel seam welding, and a device internal chip 6 located inside the device housing;

[0041] In some embodiments, in this step, the clamping device 1 is a cover-opening machine pressure rod, which uses clamping force to fix the device on the operating table.

[0042] In some embodiments, both the device housing and the device cover are made of metal.

[0043] Step 2: Start the cutting device 4 to cut and separate the device cover plate 3 from the device housing 2;

[0044] In some embodiments, in this step, activating the cutting device to cut and separate the device cover plate 3 from the device housing 2 includes:

[0045] The protruding end of the device contacts the cutting device 4, and the contact length is the length of the parallel seam weld. The upward feed depth of the cutting device 4 is the thickness of the device cover plate.

[0046] Furthermore, the feed depth of the milling cutter of the cover opening machine is 0.1~0.2mm, and the length of the extended end of the adjusting device is 0.1~0.2mm.

[0047] In this embodiment, the feed depth of the milling cutter of the cover opening machine is 0.15mm, and the length of the extended end of the adjusting device is 0.1mm.

[0048] In some embodiments, the cutting device is a milling cutter.

[0049] Step 3: Remove the cut component from the worktable, remove burrs and debris from the cutting area, and pry open the component cover plate 3, as shown. Figure 2 As shown;

[0050] In some embodiments, in this step, prying open the device cover 3 includes:

[0051] Choose a pry bar or metal sheet as the pry tool;

[0052] After determining the pry point, place the pry tool against the edge of the device cover plate and apply pressure evenly to make the device cover plate lift up, gradually widening the opening to pry open the device cover plate.

[0053] Step 4: Install the debris baffle 7 above the chip 6 inside the device, ensuring that the periphery of the debris baffle 7 contacts the inner side of the device housing 2. Figure 3 As shown;

[0054] In some embodiments, in this step, the debris baffle 7 is mounted above the internal chip 6 of the device, and the periphery of the debris baffle 7 contacts the inner side of the device housing 2, including:

[0055] If there is a step inside the device housing and the installation and wear debris conditions are met, then the debris baffle 7 is installed at the step.

[0056] If there is no suitable step inside the device housing, install a soft pad inside the device housing, avoiding the blank space of the internal chip 6, and after raising it to the set height, install a debris baffle 7 on the soft pad.

[0057] In some embodiments, the length and width dimensions of the debris baffle 7 are the same as the length and width of the inner cross-section of the device housing 2 at a set height, and the thickness is 0.01 mm. Further, the debris baffle 7 is made of steel sheet.

[0058] Step 5: Use sealant 8 to seal the debris baffle 7 to the inside of the device housing 2. Figure 4 As shown;

[0059] In this step, sealant is used to surround the contact area between the debris baffle 7 and the device housing 2, and then cured under the corresponding curing conditions.

[0060] In some embodiments, the sealant 8 is a quick-setting sealant. A quick-setting sealant is a fluid adhesive that can rapidly solidify at temperatures below 80°C or by other methods. It is characterized by its fluid properties, high damping coefficient, rapid solidification, easy removal, and certain adhesive and fixing capabilities. Its main functions are: 1) sealing the gap between the debris baffle 7 and the device housing 2; 2) fixing the debris baffle 7 during grinding of the device housing 2 (the device is upside down on the grinding disc of the grinder for grinding, in a dripping manner), ensuring that the debris baffle 7 does not fall off.

[0061] Step 6: Place the device processed in step 5 upside down on the grinder and grind it. After grinding the milled part of the cover open to be flat, clean the debris baffle 7 and the debris on the device shell 2. After cleaning, remove the sealant 8 and the debris baffle 7.

[0062] In some embodiments, this step involves cleaning debris from the device debris baffle 7 and the device housing 2: During operations such as cutting or prying open the device cover, various debris (such as metal powder, oxides, etc.) may accumulate on the device surface. This step thoroughly removes these debris using ultrasonic cleaning, compressed air blowing, wiping, or other methods to ensure the device surface is clean and free of contaminants. This helps improve the welding quality between the new device cover and the device housing, preventing foreign objects from affecting electrical performance or causing short circuits.

[0063] The preferred cleaning method is to use compressed air to blow it out.

[0064] Step 7: After repairing the components inside the component housing, place the new component cover plate onto the component housing and perform a second parallel seam weld, such as... Figure 5 As shown.

[0065] In summary, the parallel seam weld hermetic repair method of the present invention can realize the repair of parallel seam welds and reduce the scrap rate of components.

[0066] As is known from common technical knowledge, this invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones. All modifications within the scope of this invention or its equivalents are included in this invention.

Claims

1. A parallel seam-welded hermetic rework method, characterized by, The application relates to a device repairing method. Step 1: a device to be repaired is inverted on an operation table, and the device is fixed on the operation table by a clamping device, wherein the clamping device is a cover opening machine pressing rod, and the device is fixed on the operation table by clamping force; wherein the device comprises a device shell, a device cover plate connected to the device shell by parallel seam welding, and a device internal chip in the device shell; Step 2: a cutting device is started to cut and separate the device cover plate from the device shell; the cutting device is a milling cutter; Step 3: the cut device is taken off from the operation table, burrs and chippings around the cutting edge are removed, and the device cover plate is pried open; Step 4: a chipping baffle is installed above the device internal chip, and the periphery of the chipping baffle is in contact with the inner side of the device shell; Step 5: sealing glue is used to seal and connect the periphery of the chipping baffle and the inner side of the device shell; Step 6: the device after step 5 is inverted on a grinding machine for grinding, the grinding position of the cover opening milling is ground flat, chippings on the chipping baffle and the device shell are cleaned, and the sealing glue and the chipping baffle are removed after cleaning; Step 7: after repairing the components in the device shell, a new device cover plate is placed on the device shell, and secondary parallel seam welding is carried out.

2. The parallel seam-weld hermetic rework method according to claim 1, characterized in that, Step 2: the device extending end is in contact with the cutting device, the contact length is the length of the parallel seam welding, and the feeding depth of the cutting device is the thickness of the device cover plate. The feeding depth of the cutting device milling cutter is 0.1-0.2 mm, and the adjusting device extending end length is 0.1-0.2 mm.

3. The parallel seam-weld hermetic rework method according to claim 2, characterized in that, The feeding depth of the cutting device milling cutter is 0.15 mm, and the adjusting device extending end length is 0.1 mm.

4. The parallel seam-weld hermetic rework method according to claim 2, characterized in that, The length and width dimensions of the chipping baffle are the length and width corresponding to the inner section of the device shell at a set height, and the thickness is 0.01 mm.

5. The parallel seam-weld hermetic rework method according to claim 1, characterized in that, The material of the chipping baffle is a steel sheet.

6. The parallel seam-weld hermetic rework method according to claim 1, characterized in that, Step 4: the chipping baffle is installed above the device internal chip, and the periphery of the chipping baffle is in contact with the inner side of the device shell, comprising:

7. The parallel seam-weld hermetic rework method according to claim 1, characterized by, If the device shell has a step and meets the installation and grinding conditions, the chipping baffle is installed at the step; If the device shell does not have a suitable step, a soft pad is installed at a blank position avoiding the device internal chip in the device shell, and the chipping baffle is installed on the soft pad after the soft pad is padded to a set height. The sealing glue is quick-setting sealing glue.

8. The parallel seam-weld hermetic rework method of claim 1, wherein, ​

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