Injection molding apparatus, embedding device and method

By designing an embedding device adapted to inverted pins, and utilizing the synergistic effect of positioning, guiding, and pushing mechanisms, the problem of low embedding accuracy and efficiency of inverted pins is solved, enabling precise embedding of parts in injection molds and efficient production.

CN119952902BActive Publication Date: 2025-12-05SHENZHEN HUNTKEY ELECTRIC +1
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Patent Information

Application Number
CN202510168387.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-02-13
Publication Date
2025-12-05
Estimated Expiration
2045-02-13

AI Technical Summary

Technical Problem

Existing embedding devices cannot stably install inverted pins, resulting in low embedding accuracy and low production efficiency.

Method used

An embedding device is designed, comprising a positioning mechanism, a guiding mechanism, and a pushing mechanism. The positioning mechanism aligns with the injection mold, the guiding mechanism switches between a guiding position and a yielding position, and the pushing mechanism achieves precise positioning and pushing of the part, ensuring that the part is accurately embedded in the injection mold.

Benefits of technology

It improves the embedding accuracy and production efficiency of inverted pins, reduces the shaking and falling of parts during the embedding process, and enhances the overall production quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses an injection molding equipment, a burying device and a method. The burying device comprises a positioning mechanism, a guiding mechanism and a pushing mechanism. The positioning mechanism is used for positioning and aligning with an injection mold. The guiding mechanism can be positionally adjusted relative to the positioning mechanism to switch between a guiding position and a giving-up position. The pushing mechanism penetrates the guiding mechanism to push a material piece. When the guiding mechanism is in the guiding position, the material piece can be aligned with the injection mold through the positioning mechanism, and the material piece is guided by the guiding mechanism and pushed by the pushing mechanism to be pre-buried in the injection mold. The guiding mechanism is positionally adjusted relative to the positioning mechanism to give up the position and be separated from the material piece. At this time, the guiding mechanism is in the giving-up position, and the pushing mechanism pushes the material piece again to make it fully buried in the injection mold. The application has the effects of improving burying precision and improving production efficiency.
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Description

Technical Field

[0001] This application relates to the technical field of microelectronic packaging, and more specifically, to an injection molding device, embedding device, and method. Background Technology

[0002] Pins are common electronic connection components, including straight pins and inverted pins. Inverted pins are a special type of metal pin with an inverted structure designed to buckle during insertion, thus enhancing their impact resistance. Pin injection molding is a common process that achieves electrical connection by embedding the pin into plastic or other non-conductive materials. In actual production, the pin is usually first loaded into an embedding device, which then precisely pushes it into the injection mold.

[0003] The embedding device used in the existing technology is a unidirectional embedding device, which is suitable for straight pins. For embedding inverted pins, the unidirectional embedding device is not applicable because inverted pins are incompatible with the unidirectional embedding device. The inverted structure cannot stably mount the inverted pin on the unidirectional embedding device, causing irregular wobbling during insertion, which affects embedding accuracy and reduces production efficiency. Summary of the Invention

[0004] This application provides an injection molding equipment, embedding device, and method adapted for the injection molding and embedding of inverted pins, which can improve embedding accuracy and increase production efficiency.

[0005] In a first aspect, this application provides an embedding device, which adopts the following technical solution:

[0006] An embedding device, comprising:

[0007] Positioning mechanism, used for positioning and alignment with the injection mold;

[0008] A guiding mechanism, which is position-adjustable relative to the positioning mechanism, to switch between a guiding position and a yielding position;

[0009] A pushing mechanism passes through the guiding mechanism to push a part. The guiding mechanism is located at the guiding position. The part is carried and guided by the guiding mechanism. The part can be aligned with the injection mold through the positioning mechanism and pushed into the injection mold by the pushing mechanism. The guiding mechanism adjusts its position relative to the positioning mechanism to make room and disengage from the part. At this time, the guiding mechanism switches to the disengaged position, and the pushing mechanism pushes the part again to make it fully embedded in the injection mold.

[0010] Optionally, the positioning mechanism comprises a fixed plate, a positioning needle and a sliding plate, the positioning needle is arranged on the fixed plate, the sliding plate is arranged on the side of the fixed plate away from the positioning needle, and the sliding plate is in sliding connection with the fixed plate, and the guide mechanism is arranged on the sliding plate.

[0011] Optionally, the positioning mechanism further comprises two fixed seats and an elastic member, the two fixed seats are arranged on both sides of the fixed plate, and the two fixed seats are in fixed connection with both ends of the sliding plate; the elastic member is arranged between one end of the fixed plate and the fixed seat, and the sliding plate moves in the first direction to drive the fixed seat to move synchronously to compress the elastic member.

[0012] Optionally, the guide mechanism comprises a mounting plate and a fixed table, the mounting plate is fixedly arranged on the sliding plate, the fixed table is fixedly arranged on the mounting plate, the fixed table is provided with a positioning groove for accommodating the material piece, and the fixed table and the mounting plate move in the first direction under the driving of the sliding plate to make the material piece separate from the positioning groove.

[0013] Optionally, the guide mechanism further comprises a plurality of limiting support columns, the plurality of limiting support columns are fixedly arranged on the end face of the mounting plate facing the injection mold, and the limiting support columns are used for making the mounting plate parallel to the mold surface of the injection mold.

[0014] Optionally, the pushing mechanism comprises a bearing plate, a ejector pin assembly and a reset assembly, the ejector pin assembly and the reset assembly are arranged on the bearing plate, the bearing plate moves towards the injection mold to drive the ejector pin assembly to push the material piece in the second direction, and the reset assembly is used for resetting the bearing plate to make the bearing plate move away from the injection mold.

[0015] Optionally, the ejector pin assembly comprises an ejector pin arranged in the second direction and a mounting seat, the mounting seat is fixedly arranged on the bearing plate, one end of the ejector pin is in fixed connection with the mounting seat, and the other end of the ejector pin is aligned with the material piece.

[0016] Optionally, the reset assembly comprises a mounting column and a reset member, the mounting column is fixedly arranged on the bearing plate, the reset member is sleeved on the outer peripheral wall of the mounting column, and the reset member is located between the bearing plate and the mounting plate.

[0017] The mounting plate is provided with an avoiding hole, one end of the mounting column away from the bearing plate penetrates through the avoiding hole, and the mounting column is in sliding connection with the mounting plate.

[0018] In the second aspect, the application provides a burying method, and the following technical scheme is adopted:

[0019] A burying method, comprising the following steps:

[0020] Mounting the material piece to the guiding mechanism;

[0021] Positioning to the injection mold, wherein the material piece is aligned with the injection mold by the positioning mechanism;

[0022] Pre-burying the material piece to the injection mold, wherein the guiding mechanism is located at the guiding position, the pushing mechanism penetrates the guiding mechanism to push the material piece, so that the end of the material piece close to the injection mold is located in the injection mold;

[0023] Fully burying the material piece to the injection mold, wherein the guiding mechanism is adjusted in position relative to the positioning mechanism, switches from the guiding position to the giving-way position, which aims to disengage from the material piece, and the pushing mechanism penetrates the guiding mechanism again to push the material piece to be fully buried in the injection mold.

[0024] In a third aspect, the application provides an injection molding device, which adopts the technical scheme as follows:

[0025] An injection molding device, comprising the burying device and the injection mold as described above.

[0026] As can be seen from the above technical scheme, the embodiments of the application have the following advantages: the material piece can be precisely positioned by aligning the material piece with the injection mold through the positioning mechanism, the guiding mechanism can be adjusted in position relative to the positioning mechanism to switch between the guiding position and the giving-way position, when the guiding mechanism is located at the guiding position, the material piece is carried and guided by the guiding mechanism, and is pushed by the pushing mechanism to be pre-buried in the injection mold, the guiding mechanism provides guidance for the material piece during the pushing process, preventing the material piece from shaking during the burying process, so that the end of the material piece is accurately buried in the injection mold, reducing the possibility of the material piece falling during the burying process, thereby improving the production efficiency; the guiding mechanism is adjusted in position relative to the positioning mechanism to give way to the position and disengage from the material piece, at this time the guiding mechanism switches to the giving-way position, aiming to release the limiting of the guiding mechanism on the material piece, and the pushing mechanism pushes the material piece again to be fully buried in the injection mold; through the two pushing processes of the pushing mechanism, the material piece can be accurately buried in the injection mold according to the preset trajectory, thereby improving the burying precision of the material piece. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments described in the application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0028] Figure 1 A structural schematic diagram of an injection molding device disclosed in the embodiments of the application;

[0029] Figure 2 An exploded view of the structure of the embedding device disclosed in the embodiments of the present application;

[0030] Figure 3 An exploded view of the structure of the embedding device disclosed in the embodiments of the present application;

[0031] Figure 4 An exploded view of the structure of the embedding device disclosed in the embodiments of the present application;

[0032] Figure 5 An exploded view of the structure of the embedding device disclosed in the embodiments of the present application;

[0033] Figure 6 An exploded view of the structure of the embedding device disclosed in the embodiments of the present application;

[0034] Figure 7 An exploded view of the structure of the embedding device disclosed in the embodiments of the present application;

[0035] Figure 8 An exploded view of the structure of the embedding device disclosed in the embodiments of the present application.

[0036] Legend of reference signs:

[0037] 1, embedding device; 11, positioning mechanism; 111, fixed plate; 1111, positioning hole; 112, positioning needle; 113, sliding plate; 1131, sliding hole; 114, fixed seat; 115, elastic member; 12, guide mechanism; 121, mounting plate; 1211, avoiding hole; 122, fixed table; 1221, positioning groove; 1222, first side surface; 1223, second side surface; 123, limiting support column; 124, first handle; 125, base support rod; 13, pushing mechanism; 131, bearing plate; 1311, through hole; 132, ejector pin assembly; 1321, ejector pin; 1322, mounting seat; 133, reset assembly; 1331, mounting column; 1332, reset member; 134, second handle;

[0038] 2, injection mold; 21, embedding hole; 22, device positioning hole. DETAILED DESCRIPTION

[0039] The present application will be further described in detail below with reference to the accompanying drawings.

[0040] The embodiments of the present application provide an injection equipment, an embedding device and a method, which are suitable for embedding inverted PIN needles, can improve embedding precision and production efficiency.

[0041] In order to make the person skilled in the art better understand the scheme of the present application, the technical scheme in the embodiments of the present application will be clearly and completely described in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the present application. In addition, the technical schemes of various embodiments can be combined with each other, but it must be based on the person skilled in the art can realize, when the combination of technical schemes appears contradictory or unachievable, it should be considered that the combination of technical schemes does not exist, and is not within the protection scope claimed by the present application.

[0042] The terms "first", "second", "third", "fourth" and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily indicate a particular order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not necessarily limit to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0043] Please refer to Figure 1 For an embodiment of the injection molding device in the embodiments of the present application, the injection molding device includes a burying device 1 and an injection mold 2, the injection mold 2 is provided with burying holes 21 and device positioning holes 22, the burying holes 21 are used for injection molding and burying of a material piece, and a plurality of burying holes 21 are provided, and the specific arrangement position of the burying holes 21 can be changed according to different products or mold structure designs; the device positioning holes 22 are provided with two, the two device positioning holes 22 are arranged along the length direction of the injection mold 2, that is, the two device positioning holes 22 are arranged along a first direction, and are used for positioning the burying device 1, the burying device 1 is close to the injection mold 2 along a second direction, so that the burying device 1 cooperates with the device positioning holes 22, and the material piece is accurately buried in the burying holes 21. In the embodiment, the material piece is a reverse-docking PIN, the first direction is the length direction of the injection mold 2, the second direction is the thickness direction of the injection mold 2, and the first direction and the second direction are perpendicular.

[0044] Please refer to Figure 1 and Figure 2For an embodiment of the embedding device 1 in the embodiments of the present application, the embedding device 1 comprises a positioning mechanism 11, a guiding mechanism 12 and a pushing mechanism 13, the positioning mechanism 11 is matched with the device positioning hole 22 for positioning alignment with the injection mold 2, the guiding mechanism 12 is positionally adjustable relative to the positioning mechanism 11 to switch between a guiding position and a giving-up position, and the pushing mechanism 13 penetrates the guiding mechanism 12 to push the material piece so that the material piece is embedded into the embedding hole 21 in the injection mold 2; wherein, when the guiding mechanism 12 is in the guiding position, the material piece is carried and guided by the guiding mechanism 12, the material piece can be aligned with the injection mold through the positioning mechanism 11 and is pre-embedded into the injection mold 2 by the pushing mechanism 13, the guiding mechanism 12 provides guidance for the material piece during the pushing process to prevent the material piece from shaking during the embedding process, so that the end of the material piece is accurately embedded into the injection mold 2, reducing the possibility of the material piece falling during the embedding process, thereby improving the production efficiency; the guiding mechanism 12 is positionally adjusted relative to the positioning mechanism 11 to give up the position and be separated from the material piece, at this time the guiding mechanism 12 is switched to the giving-up position, aiming to release the limiting of the guiding mechanism 12 on the material piece, and the pushing mechanism 13 pushes the material piece again to make it fully embedded into the injection mold. Through the two pushing processes of the pushing mechanism 13, the material piece can be accurately embedded into the injection mold 2 according to the preset trajectory, thereby improving the embedding accuracy of the material piece.

[0045] Please refer to Figures 2 to 4 The positioning mechanism 11 comprises a fixed plate 111, a positioning needle 112 and a sliding plate 113, the fixed plate 111 and the sliding plate 113 are cuboid-shaped and the length direction of the fixed plate 111 and the sliding plate 113 is consistent with the first direction, the fixed plate 111 and the sliding plate 113 are arranged in parallel, the positioning needle 112 is fixedly arranged on the fixed plate 111, the sliding plate 113 is arranged on the side of the fixed plate 111 away from the positioning needle 112, the sliding plate 113 is slidingly connected with the fixed plate 111, and the guiding mechanism 12 is arranged on the sliding plate 113. It can be understood that by controlling the embedding device 1 to move towards the injection mold 2 along the second direction, the positioning needle 112 is inserted into the device positioning hole 22, the positioning mechanism 11 is positioned relative to the injection mold 2, and the embedding device 1 is aligned with the injection mold 2. The sliding plate 113 is slidingly connected with the fixed plate 111 and can drive the guiding mechanism 12 to move relative to the injection mold 2 along the first direction.

[0046] Please refer to Figure 3 and Figure 4In the embodiment, the number of the positioning needles 112 is the same as the number of the device positioning holes 22, two positioning needles 112 are arranged, and the distance between the two positioning needles 112 is the same as the distance between the two device positioning holes 22; the fixed plate 111 is provided with a positioning fine hole 1111 for mounting the positioning needle 112, the positioning needle 112 is mounted on the fixed plate 111 through a positioning needle fixing seat and a guide sleeve, specifically, the positioning needle 112 is sleeved in the guide sleeve, the guide sleeve is sleeved in the positioning fine hole 1111, the positioning needle fixing seat is located above the guide sleeve, and the positioning needle fixing seat is fixed on the fixed plate 111 by screwing, so that the positioning needle 112 is fixedly mounted on the fixed plate 111. The tip portion of the positioning needle 112 faces the injection mold 2, the end portion of the positioning needle 112 penetrates the sliding plate 113, the sliding plate 113 is provided with a sliding through hole 1131, and the end of the positioning needle 112 is located in the sliding through hole 1131; when the sliding plate 113 is slid relative to the fixed seat 114 in the first direction, the positioning needle 112 moves in the sliding through hole 1131, the sliding through hole 1131 provides a space for the movement of the sliding plate 113 on one hand, and the two end portions of the sliding through hole 1131 limit the positioning needle 112 on the other hand, so as to limit the sliding plate 113 from sliding away from the fixed plate 111.

[0047] Further, in order to make the sliding plate 113 and the fixed plate 111 slip automatically reset, the positioning mechanism 11 further comprises two fixed seats 114 and elastic members 115, the two fixed seats 114 are arranged on both sides of the fixed plate 111, and the two fixed seats 114 are fixedly connected with both ends of the sliding plate 113; the elastic member 115 is arranged between one end of the fixed plate 111 and the fixed seat 114, and the sliding plate 113 moves along the first direction to drive the fixed seat 114 to move synchronously to compress or stretch the elastic member 115. The elastic member 115 is used to provide elastic force to the sliding plate 113 when the sliding plate 113 resets, and the two fixed seats 114 are used to limit the movement of the sliding plate 113 along the first direction to prevent the sliding plate 113 from being separated from the fixed plate 111. In the embodiment, the elastic member 115 is preferably a spring, and the two fixed seats 114 are respectively a left fixed seat 114 and a right fixed seat 114. The elastic member 115 is arranged on the left side of the fixed plate 111, i.e. between the left fixed seat 114 and the left end of the fixed plate 111; the right fixed seat 114 is in contact with the fixed plate 111 to limit the movement of the sliding plate 113 to the right side; specifically, one end of the elastic member 115 is installed in the left fixed seat 114 through the limiting hole arranged on the left fixed seat 114, and the other end of the elastic member 115 is installed on the fixed plate 111 through the limiting hole arranged on the left side of the fixed plate 111. When the sliding plate 113 moves along the first direction to the right side, the elastic member 115 is compressed, and according to the actual feedback of the human body, the elastic member 115 is arranged on the left side. When the sliding plate 113 is forced to move to the right side, the elastic member 115 is compressed through the fixed seat 114, which is relatively easy for the person, and when reset, the fixed seat 114 is driven by the elastic force of the elastic member 115 to move the sliding plate 113 to the left side to reset. In other embodiments, the elastic member 115 can be arranged on the right side of the fixed plate 111, i.e. between the right fixed seat 114 and the right end of the fixed plate 111.

[0048] Please refer to Figure 2 and Figure 5The guiding mechanism 12 includes a mounting plate 121, a fixed table 122, a limiting support column 123, and a first handle 124. The mounting plate 121 is parallel to the sliding plate 113 and is fixedly connected to the sliding plate 113. The fixed table 122 and the limiting support column 123 are both provided in plurality. The fixed table 122 is fixedly arranged on the mounting plate 121 and is used for bearing and guiding the material piece. The limiting support column 123 is fixedly arranged on the end face of the mounting plate 121 facing the injection mold 2 and is used for making the mounting plate 121 parallel to the mold surface of the injection mold 2. The first handle 124 is arranged on the mounting plate 121 and is used for holding and conveniently controlling the mounting plate 121 to exert force on the mounting plate 121, so as to transmit power to the fixed table 122. In the embodiment, the fixed table 122 and the limiting support column 123 are both located on the end face of the mounting plate 121 facing the injection mold 2, that is, on the left side face of the mounting plate 121. The number of the fixed table 122 can be increased or decreased according to the number of different products, and is generally two to sixteen. The limiting support column 123 is provided in four to cooperatively ensure that the mounting plate 121 is parallel to the mold surface of the injection mold 2. The first handle 124 is located in the middle region of the end face of the mounting plate 121 away from the injection mold 2, that is, in the middle region of the right side face of the mounting plate 121. The fixed table 122 is arranged corresponding to the embedded hole 21, so as to facilitate the accurate embedding of the material piece arranged on the fixed table 122 into the embedded hole 21.

[0049] It can be understood that the positioning needle 112 is inserted into the device positioning hole 22, the end of the limiting support column 123 away from the mounting plate 121 is pressed against the mold surface of the injection mold 2, so that the mounting plate 121 is parallel to the mold surface of the injection mold 2, so as to keep the fixed table 122 perpendicular to the mold surface of the injection mold 2 and align with the embedded hole 21. By holding the first handle 124, force is exerted on the mounting plate 121 to move in the first direction, the mounting plate 121 drives the sliding plate 113 to move synchronously, so that the guiding mechanism 12 moves to the right as a whole, so that the guiding mechanism 12 can be positionally adjusted relative to the positioning mechanism 11, so that the guiding mechanism 12 is switched from the guiding position to the giving position. At this time, the fixed table 122 also moves to the right, aiming to be dislocated from the embedded hole 21, so as to release the limiting of the material piece by the fixed table 122.

[0050] Please refer to Figure 6 and Figure 7 The fixed table 122 is made of stainless steel and is processed by CNC precision machining process, which effectively prevents scratching of the product and improves the installation accuracy of the material piece, thereby improving the overall quality of the product. Specifically, the fixed table 122 is provided with a positioning groove 1221, and the positioning groove 1221 is provided with a first side face 1222 and a second side face 1223 along a second direction, as shown in Figure 6As shown. The component has an initial state, a pre-embedded state, and a fully embedded state. In the initial state, the component is located within the positioning groove 1221, and the first side surface 1222 is in contact with the component, as shown. Figure 7 As shown; when the part is pre-embedded, the second side 1223 contacts and presses against the part, and the end of the part near the injection mold 2 is located inside the injection mold 2; when the part is fully embedded, the part is detached from the positioning groove 1221, and the part is completely located inside the injection mold 2. In this embodiment, the positioning groove 1221 consists of an upper groove, a middle groove, and a lower groove. The upper groove is used to accommodate and position the upper end of the part, the middle groove is used to accommodate and position the undercut structure of the part, and the lower groove is used to accommodate and position the lower end of the part. By setting the positioning groove 1221 on the fixed platform 122, the positioning groove 1221 is adapted to the part, which can effectively fix the part. The positioning groove 1221, through the cooperation of the first side 1222 and the second side 1223, provides a correction effect for the dimensional accuracy of the part during the pushing process, preventing the part from shaking due to excessive distance during the embedding process, thereby improving the embedding accuracy and increasing production efficiency.

[0051] Understandably, when the guide mechanism 12 is in the guide position, the part is installed in the positioning groove 1221 of the fixed platform 122 and contacts the first side 1222. The part is precisely positioned by aligning with the injection mold 2 through the positioning mechanism 11. The push mechanism 13 pushes the part in the positioning groove 1221 from the initial state to the pre-embedded state along the second direction. At this time, the part contacts and presses against the second side 1223, and the end of the part near the injection mold 2 is located in the injection mold 2 to complete the pre-embedding. The guide mechanism 12 relative to the positioning mechanism 11 performs... Position adjustment involves applying force to the mounting plate 121, causing it to slide relative to the positioning mechanism 11 along the first direction. This allows the mounting plate 121 to move synchronously with the fixed platform 122, disengaging the part from the opening of the positioning groove 1221. This releases the second side 1223 from its restriction on the part, at which point the guide mechanism 12 switches to the yielding position. Subsequently, the pushing mechanism 13 pushes the part a second time, changing it from a pre-embedded state to a fully embedded state. At this point, the part is fully embedded in the injection mold 2, completing the embedding of the part.

[0052] Please see Figure 2 and Figure 8The pushing mechanism 13 is located on the side of the mounting plate 121 away from the positioning mechanism 11, the pushing mechanism 13 comprises a bearing plate 131, a thimble assembly 132, a reset assembly 133 and a second handle 134, the bearing plate 131 is parallel to the mounting plate 121 and is located on the side of the mounting plate 121 away from the sliding plate 113, the thimble assembly 132 and the reset assembly 133 are arranged on the bearing plate 131, the bearing plate 131 moves towards the injection mold 2 to drive the thimble assembly 132 to push the material piece in the second direction, the reset assembly 133 is used for resetting the bearing plate 131 to move the bearing plate 131 away from the injection mold 2, the second handle 134 is fixedly arranged on the end face of the bearing plate 131 away from the mounting plate 121, and is used for conveniently outputting power to the bearing plate 131, and then transmitting the power to the thimble assembly 132. In the embodiment, the thimble assembly 132 is provided in multiple groups, the number of the thimble assembly 132 is the same as that of the fixed table 122, and the thimble assembly 132 is arranged in position with the fixed table 122; the reset assembly 133 is provided in multiple groups, and the multiple reset assemblies 133 are matched to provide greater reset force; the first handle 124 and the second handle 134 have a movement gap, the movement gap is used for providing space for the first handle 124 and the second handle 134, and facilitating operation of the first handle 124 and the second handle 134; the mounting plate 121 and the bearing plate 131 are provided with weight reduction holes, the weight reduction holes are used for reducing the overall weight of the guiding mechanism 12 and the pushing mechanism 13, thereby reducing the overall weight of the embedding device 1 and reducing the excessive physical exertion of personnel.

[0053] Please refer to Figure 8 The thimble assembly 132 comprises a thimble 1321 arranged in the second direction and a mounting seat 1322, the mounting seat 1322 is fixedly arranged on the bearing plate 131, one end of the thimble 1321 is fixedly connected with the mounting seat 1322, and the other end of the thimble 1321 is aligned with the material piece. When a leftward force is applied to the bearing plate 131 in the second direction, the bearing plate 131 drives the thimble 1321 to move leftward, the thimble 1321 slides along the positioning groove 1221 to drive the material piece to move, so that the material piece contacts and abuts against the second side surface 1223, and at this time, the material piece is switched from the initial state to the embedded state.

[0054] In the embodiment, each fixed table 122 is provided with two positioning grooves 1221, so that each fixed table 122 can mount two material pieces, each group of thimble assemblies 132 is provided with two thimbles 1321, the two thimbles 1321 are used for synchronously driving the corresponding two material pieces, more material pieces can be embedded at the same time, the embedding efficiency of the material pieces is further improved, and therefore the production efficiency is improved.

[0055] The reset assembly 133 comprises a mounting column 1331 and a reset piece 1332. The mounting column 1331 is fixedly arranged on the bearing plate 131. The reset piece 1332 is preferably a spring. The reset piece 1332 is sleeved on the outer peripheral wall of the mounting column 1331 and is located between the bearing plate 131 and the mounting plate 121. The mounting plate 121 is provided with a relief hole 1211. The end of the mounting column 1331 away from the bearing plate 131 penetrates through the relief hole 1211, and the mounting column 1331 is in sliding connection with the mounting plate 121 along the second direction. In this embodiment, the relief hole 1211 is a waist-shaped hole. The relief hole 1211 provides a relief space for the movement of the mounting plate 121 along the first direction. When the mounting plate 121 moves along the first direction, the mounting column 1331 moves in the relief hole 1211. The bearing plate 131 does not resist the mounting column 1331, so that the movements of the mounting plate 121 and the bearing plate 131 can be independent of each other.

[0056] It can be understood that the bearing plate 131 moves towards the injection mold 2 along the second direction, the bearing plate 131 compresses the reset piece 1332 to reduce the distance between the bearing plate 131 and the mounting plate 121, and the ejector pin assembly 132 moves along the second direction to push the feeding piece by the ejector pin 1321. After the first pushing is completed, the action force applied to the bearing plate 131 is released, the bearing plate 131 moves away from the injection mold 2 under the rebounding force of the reset piece 1332 to reset, and the bearing plate 131 drives the ejector pin assembly 132 to reset synchronously to prepare for the second pushing of the ejector pin assembly 132. By applying an action force to the mounting plate 121 along the first direction, the mounting plate 121 drives the fixed table 122 to move to the right, the fixed table 122 is separated from the feeding piece to release the limiting of the feeding piece, and then an action force is applied to the bearing plate 131 along the second direction again, so that the ejector pin assembly 132 pushes the feeding piece again, the feeding piece is switched from the pre-embedded state to the fully-embedded state, and the overall embedding of the feeding piece is completed.

[0057] Please refer to Figure 2 In order to place the embedding device 1 stably on the desktop, the end face of the mounting plate 121 away from the injection mold 2 is provided with a base support rod 125, the bearing plate 131 is provided with a through hole 1311, and the end of the base support rod 125 away from the mounting plate 121 penetrates through the through hole 1311. When the bearing plate 131 moves along the second direction, the through hole 1311 reserves a mounting space for the base support rod 125. In this embodiment, the number of the through holes 1311 is the same as and corresponds to the number of the base support rods 125. The base support rod 125 is provided with four rods, which are arranged at four corner positions of the mounting plate 121 respectively, so that the embedding device 1 can be placed stably on the desktop through the base support rod 125 after use.

[0058] The embedding device 1 is suitable for the embedding method, which comprises the following steps:

[0059] S1, install the material to the guide mechanism 12. Among them, the right hand holds the first handle 124 and the second handle 134, and the left hand puts the material into the positioning groove 1221 of the fixed table 122 in sequence to limit and fix the material, and the material contacts the first side surface 1222, so that the material is in the initial state;

[0060] S2, position to the injection mold 2, wherein the material is aligned with the injection mold 2 through the positioning mechanism 11.

[0061] S2-1, the positioning needle 112 is inserted into the device positioning hole 22, and the embedding device 1 is positioned relative to the injection mold 2 by the two positioning needles 112.

[0062] S1-2, the limiting support column 123 abuts against the mold surface of the injection mold 2, and the end of the limiting support column 123 away from the mounting plate 121 is flush with the surface of the injection mold 2, so as to realize that the mounting plate 121 is in parallel with the mold surface of the injection mold 2, and at this time the material is aligned with the embedding hole 21.

[0063] S3, pre-bury the material to the injection mold 2.

[0064] S3-1, the guide mechanism 12 is located at the guide position, and the material is carried and guided by the guide mechanism 12.

[0065] S3-2, the pushing mechanism 13 penetrates the guide mechanism 12 to push the material to the pre-burying state for the first time; wherein the embedding device 1 is held in the second direction to apply a force to drive the second handle 134 to compress the restoring member 1332 of the carrying plate 131, and simultaneously drive the needle assembly 132 towards the fixed table 122, the needle 1321 slides along the positioning groove 1221 to push the material to move, so that the material moves away from the first side surface 1222, the material contacts and abuts against the second side surface 1223, and the end of the material close to the injection mold 2 is located in the embedding hole 21 of the injection mold 2, at this time the material is switched from the initial state to the pre-burying state.

[0066] S3-3, reset the needle assembly 132; wherein the driving force on the second handle 134 is released, and the carrying plate 131 is reset under the rebounding force of the restoring member 1332, and at the same time the carrying plate 131 drives the needle assembly 132 to reset synchronously, preparing for the second pushing of the needle assembly 132.

[0067] S4, bury the material to the injection mold 2.

[0068] S4-1, the guide mechanism 12 is adjusted relative to the positioning mechanism 11 to switch from the guide position to the let position, which is intended to be separated from the material piece; wherein the left hand holds the second handle 134, the right hand holds the first handle 124, the first handle 124 is applied to the right along the first direction, the mounting plate 121 drives the sliding plate 113 and the fixed seat 114 to move to the right to compress the elastic element 115, so as to realize the whole driving guide mechanism 12 to move to the right; under the action of the positioning mechanism 11, the mounting plate 121 synchronously drives the fixed table 122 to slide along the first direction smoothly, the guide mechanism 12 switches from the guide position to the let position, the material piece is separated from the opening of the positioning groove 1221 and the fixed table 122, so as to separate the material piece to the outside of the positioning groove 1221, so that the fixed table 122 releases the limiting of the material piece.

[0069] S4-2, the push mechanism 13 is provided with the guide mechanism 12 to push the material piece to the full buried state; wherein the left hand holds the second handle 134, and the second handle 134 is applied to the second direction again to drive the second handle 134 to compress the reset element 1332, synchronously drive the needle assembly 132 to move towards the fixed table 122, the needle 1321 moves towards the material piece to push the material piece into the injection mold 2, until the material piece is completely buried in the buried hole 21 of the injection mold 2, at this time, the material piece is switched from the pre-buried state to the full buried state, and the burying of the material piece is completed.

[0070] S4-3, the needle assembly 132 is reset; wherein the driving force of the second handle 134 is released, the bearing plate 131 is reset under the rebounding force of the reset element 1332, and the bearing plate 131 drives the needle assembly 132 to reset after operation.

[0071] S5, separate the burying device 1 from the injection mold 2; wherein the burying device 1 is held and pulled out the positioning needle 112 outwardly in parallel, until the positioning needle 112 is separated from the device positioning hole 22, so that the burying device 1 is separated from the injection mold 2; the spring element releases the left spring force to reset the fixed table 122, and the burying cycle of the material piece is completed.

[0072] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An implant device, characterized by The application relates to a pre-embedding device and a pre-embedding method. The device comprises a positioning mechanism for positioning alignment with an injection mold, a guide mechanism capable of position adjustment relative to the positioning mechanism, the guide mechanism being arranged on the sliding plate to switch between a guide position and a giving-up position; the guide mechanism comprises a mounting plate fixedly arranged on the sliding plate and a fixed table fixedly arranged on the mounting plate, the fixed table being provided with a positioning groove for accommodating a material piece, the fixed table and the mounting plate moving along a first direction under the driving of the sliding plate to make the material piece leave the positioning groove; a pushing mechanism penetrating through the guide mechanism to push the material piece, the guide mechanism being in the guide position, the material piece being carried and guided by the guide mechanism, the material piece being aligned with the injection mold by the positioning mechanism and being pushed by the pushing mechanism to be pre-embedded into the injection mold; the guide mechanism is adjusted in position relative to the positioning mechanism to give up the position and leave the material piece, at this time the guide mechanism switches to the giving-up position, and the pushing mechanism pushes the material piece again to make it fully embedded into the injection mold. The positioning mechanism further comprises a fixed plate, and a positioning needle arranged on the fixed plate, the sliding plate being arranged on the side of the fixed plate away from the positioning needle and being in sliding connection with the fixed plate.

2. An implant device according to claim 1, wherein The positioning mechanism further comprises two fixed seats arranged on the two sides of the fixed plate and in fixed connection with the two ends of the sliding plate, and an elastic piece arranged between one end of the fixed plate and the fixed seat, the sliding plate moving along the first direction to drive the fixed seat to move synchronously to compress the elastic piece.

3. An implant device according to claim 2, wherein, The guide mechanism further comprises a plurality of limiting support columns fixedly arranged on the end face of the mounting plate facing the injection mold, the limiting support columns being used to make the mounting plate parallel to the mold surface of the injection mold.

4. An implant device according to claim 2, wherein, The pushing mechanism comprises a carrying plate, a ejector assembly and a reset assembly, the ejector assembly and the reset assembly being arranged on the carrying plate, the carrying plate moving towards the injection mold to drive the ejector assembly to push the material piece along a second direction, and the reset assembly being used to reset the carrying plate to move away from the injection mold.

5. An implant device according to claim 1, wherein The ejector assembly comprises an ejector fixedly arranged on the carrying plate along the second direction, one end of the ejector being in fixed connection with the mounting seat, and the other end of the ejector being aligned with the material piece.

6. An implant device according to claim 5, wherein, The reset assembly comprises a mounting column fixedly arranged on the carrying plate and a reset piece sleeved on the peripheral wall of the mounting column and located between the carrying plate and the mounting plate.

7. An implant device according to claim 5, wherein The mounting plate is provided with an avoiding hole, one end of the mounting column away from the carrying plate penetrating through the avoiding hole, and the mounting column being in sliding connection with the mounting plate. The pre-embedding method comprises the following steps of installing a material piece to a guide mechanism.

8. A method of embedding, characterized by ​ ​ Positioning to the injection mold, wherein the material piece is aligned with the injection mold by the positioning mechanism; Pre-embedding the material piece to the injection mold, wherein the guide mechanism is in the guide position, the pushing mechanism is arranged through the guide mechanism to push the material piece, so that the end of the material piece close to the injection mold is located in the injection mold; Fully embedding the material piece to the injection mold, wherein the guide mechanism is adjusted in position relative to the positioning mechanism, and is switched from the guide position to the giving position to be separated from the material piece, and the pushing mechanism is arranged through the guide mechanism to push the material piece again so that it is fully embedded into the injection mold.

9. An injection molding apparatus characterized by comprising: The injection mold comprises the embedding device according to any one of claims 1 to 7.

Citation Information

Patent Citations

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