Micro-LED (Light Emitting Diode) laser mass transfer and release material as well as preparation method and application thereof

Abstract

The invention provides a Micro-LED (Light Emitting Diode) laser mass transfer and release material as well as a preparation method and application thereof. The Micro-LED laser mass transfer and release material comprises the following components in percentage by mass: 10 to 30 percent of azobenzene group-containing compound, 10 to 30 percent of auxiliary resin, 0.1 to 5 percent of coupling agent and 0.05 to 2 percent of flatting agent. The specific composition of the Micro-LED laser mass transfer and release material is designed, and a compound containing an azobenzene group is further used, so that the technical problem that in the Micro-LED mass transfer process, the used laser mass transfer and release material is poor in adhesive force under a strong alkali condition and is not resistant to a high-temperature process, so that the release defect is caused is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of Micro-LED laser mass transfer materials, and specifically relates to a Micro-LED laser mass transfer release material and a preparation method and application thereof. Background Art

[0002] With the rapid development of display technology, Micro LED, as a new display technology, is widely regarded as a strong competitor for the next generation of display technology due to its advantages such as high brightness, low power consumption, long life and fast response time. Mass transfer is a key step in transferring Micro-LED chips from the growth substrate to the target substrate. This process requires high stability and precision transfer technology, and its efficiency and accuracy directly affect the performance and cost of the final product.

[0003] Traditional Micro LED mass transfer technology faces some challenges. In the manufacturing process of Micro LED, for example, the LLO process uses laser irradiation from the back to ablate the tiny layer of GaN through the transparent sapphire substrate to release the Micro LED chip. After this step, a strong alkali is used to remove the residual metal Ga. Due to the use of strong alkali and other reagents for cleaning and treatment, Micro-LED laser mass transfer materials have higher requirements for adhesion to the substrate under strong alkaline conditions. After the chip is transferred to the laser release layer and etched, high temperature will be generated. At this time, the chip on the release layer is prone to offset, which not only affects the transfer accuracy, but also reduces production efficiency.

[0004] Therefore, it is necessary to develop Micro-LED laser mass transfer release materials that have high adhesion under strong alkaline conditions, are resistant to high temperatures, can be firmly bonded to the chip, have defect-free bonding, and can achieve low-energy threshold laser release. Summary of the invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a Micro-LED laser mass transfer release material and its preparation method and application. The present invention designs the specific composition of the Micro-LED laser mass transfer release material and further uses a compound containing an azobenzene group to solve the technical problems of poor adhesion of the laser mass transfer release material used in the Micro-LED mass transfer process under strong alkaline conditions and release defects caused by the inability to withstand high temperature processes.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] In a first aspect, the present invention provides a Micro-LED laser mass transfer release material, wherein the Micro-LED laser mass transfer release material comprises the following components in percentage by mass:

[0008] Compounds containing azobenzene groups 10-30%;

[0009] Auxiliary resin 10-30%;

[0010] Coupling agent 0.1-5%;

[0011] Leveling agent 0.05-2%.

[0012] The present invention designs the specific composition of the Micro-LED laser mass transfer release material, and further uses azobenzene group-containing compounds to prepare a Micro-LED laser mass transfer release material that has high adhesion and high temperature resistance under strong alkaline conditions, can be firmly bonded to the chip, has defect-free bonding, and can achieve low-energy threshold laser release.

[0013] In the present invention, the compound containing azobenzene group is the main component of the material system, which has strong absorption performance for ultraviolet laser, and plays a role in better laser-induced release of micro-light-emitting diode chips; the auxiliary resin is a thermoplastic resin with a high glass transition temperature, which plays a role in improving the stability of the material receiving system and improving the rheological properties of the material; the coupling agent can significantly improve the adhesion between the receiving material and the substrate, and improve the bonding strength, durability and moisture-heat aging resistance of the receiving material; the flattening agent can reduce the surface tension of the receiving material, ensure the flatness and smoothness of the receiving material when spin-coated on the substrate, and improve TTV. In the present invention, through the coordination of various components, a Micro-LED laser mass transfer release material with excellent performance is prepared.

[0014] In the present invention, a Micro-LED laser mass transfer release material with excellent performance is prepared by designing the amount of the compound containing azobenzene groups in the Micro-LED laser mass transfer release material to be within a specific range. If the amount of the compound containing azobenzene groups is too small, the driving force for chip transfer is small when the Micro-LED laser mass transfer release material is subsequently used for chip transfer, and the chip may not be transferred; if the amount of the compound containing azobenzene groups is too large, the response to the laser is violent when the Micro-LED laser mass transfer release material is subsequently used for chip transfer, and chip displacement, tilting, and other phenomena are likely to occur.

[0015] In the present invention, the mass percentage of the compound containing azobenzene group in the Micro-LED laser mass transfer release material can be 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28% or 30%, etc.

[0016] The mass percentage of auxiliary resin in Micro-LED laser mass transfer release material can be 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28% or 30%, etc.

[0017] The mass percentage of the coupling agent in the Micro-LED laser mass transfer release material can be 0.1%, 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5% or 5%, etc.

[0018] The mass percentage of the leveling agent in the Micro-LED laser mass transfer release material can be 0.05%, 0.1%, 0.2%, 0.4%, 0.6%, 0.8%, 1%, 1.2%, 1.4%, 1.6%, 1.8% or 2%, etc.

[0019] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. Through the following preferred technical solutions, the objectives and beneficial effects of the present invention can be better achieved and realized.

[0020] As a preferred technical solution of the present invention, the mass percentage of the azobenzene group in the azobenzene group-containing compound is 30-100%, for example, it can be 30%, 40%, 50%, 60%, 70%, 80%, 90% or 100%.

[0021] Preferably, the compound containing an azobenzene group is selected from any one or a combination of at least two of azobenzene, 4-aminoazobenzene, 4-hydroxyazobenzene, oxidized azobenzene, 2,2'-dihydroxyazobenzene, 4,4'-dihydroxyazobenzene, 4,4'-dibromoazobenzene, 4,4'-diaminoazobenzene, 3,3'-dihydroxyazobenzene, 4-(methylamino)azobenzene, 4-bromo-4'-hydroxyazobenzene, N,N'-diethyl-4-aminoazobenzene, 4-methoxyazobenzene, 3,3'-dimethylazobenzene, N,N-dimethyl-4-(p-tolyldiazenyl)aniline, 4-(dimethylamino)-2-methylazobenzene or 4-amino-4'-dimethylaminoazobenzene.

[0022] Preferably, the mass percentage of the compound containing azobenzene group in the Micro-LED laser mass transfer release material is 15-25%, for example, it can be 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24% or 25%, etc.

[0023] As a preferred technical solution of the present invention, the auxiliary resin is selected from styrene-N-phenylmaleimide-maleic anhydride graft copolymer, styrene maleic anhydride copolymer, polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polycarbonate (PC), polyimide (PI), polyetherimide (PEI), polyphenylene ether (PPE), polyethersulfone (PES), polytetrafluoroethylene (PTFE), polylactic acid (PLA), AURUM TM Any one or a combination of at least two of the resins.

[0024] Preferably, the glass transition temperature of the auxiliary resin is 80-160°C, for example, it can be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, 150°C or 160°C.

[0025] In the present invention, the test method of the glass transition temperature (Tg) of the auxiliary resin is: using differential scanning calorimetry (DSC), the glass transition characteristic temperature is determined by measuring the change of the specific heat capacity of the material with temperature. On the DSC curve, the glass transition is manifested as an endothermic or exothermic step, and the temperature average of the two intersections of the two extrapolated baselines before and after the step and the tangent at the inflection point of the curve is taken as Tg.

[0026] Preferably, the mass percentage of the auxiliary resin in the Micro-LED laser mass transfer release material is 15-25%, for example, it can be 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24% or 25%, etc.

[0027] As a preferred technical solution of the present invention, the coupling agent is selected from a silane coupling agent and / or a borate coupling agent.

[0028] Preferably, the silane coupling agent is selected from any one of γ-aminopropyltriethoxysilane, vinyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrichlorosilane, phenyltriethoxysilane, 3-(2,3-epoxypropyl)trimethoxysilane, 3-methacryloxypropyltrimethoxysilane or diphenyldimethoxysilane, or a combination of at least two thereof.

[0029] Preferably, the borate coupling agent is selected from any one of trimethyl borate, triethyl borate, triphenyl borate, triisopropyl borate, tributyl borate, tri(2-ethylhexyl) borate, trialkylene borate, tri(2-hydroxyethyl) borate, tri(3-hydroxypropyl) borate or tricyclohexyl borate, or a combination of at least two thereof.

[0030] Preferably, the mass percentage of the coupling agent in the Micro-LED laser mass transfer release material is 0.5-3%, for example, it can be 0.5%, 0.8%, 1%, 1.2%, 1.5%, 1.8%, 2%, 2.3%, 2.5%, 2.7% or 3%, etc.

[0031] As a preferred technical solution of the present invention, the leveling agent is selected from any one of acrylic leveling agents, fluorocarbon leveling agents or silicone leveling agents, or a combination of at least two of them.

[0032] Preferably, the acrylic leveling agent comprises a polyester-modified polydimethylsiloxane solution having an acrylate functional group, and the solvent is a xylene solvent.

[0033] Preferably, the fluorocarbon leveling agent comprises fluorocarbon modified polyolefin wax.

[0034] Preferably, the organosilicon leveling agent includes polyether-modified siloxane and / or polyether-modified polydimethylsiloxane.

[0035] Preferably, the mass percentage of the leveling agent in the Micro-LED laser mass transfer release material is 0.2-1.5%, for example, it can be 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%, 1.1%, 1.2%, 1.3%, 1.4% or 1.5%, etc.

[0036] As a preferred technical solution of the present invention, the Micro-LED laser mass transfer release material also includes 30-80% of solvent.

[0037] Preferably, the mass percentage of the solvent in the Micro-LED laser mass transfer release material is 30-80%, for example, it can be 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 60%, 75% or 80%, etc.

[0038] Preferably, the solvent is selected from any one of ketone solvents, aromatic hydrocarbon solvents, ether solvents, amide solvents, dimethyl sulfoxide or decalin, or a combination of at least two thereof.

[0039] Preferably, the ketone solvent includes any one of acetone, butanone, cyclohexanone or isophorone, or a combination of at least two thereof.

[0040] Preferably, the aromatic hydrocarbon solvent includes toluene and / or trimethylbenzene.

[0041] Preferably, the ether solvent includes any one of dioxane, 1,3-dioxolane, 2,2,4,4,5,5-hexamethyl-1,3-dioxolane, 2,2-dimethoxy-4-(trifluoromethyl)-1,3-dioxolane ether, tetrahydrofuran or a fluorinated hexacyclic coordination ether, or a combination of at least two thereof.

[0042] Preferably, the amide solvent includes dimethylformamide and / or N,N-dimethylacetamide;

[0043] Preferably, the number of the solvents is ≤4, for example, it can be 1, 2, 3 or 4.

[0044] In a second aspect, the present invention provides a method for preparing the Micro-LED laser mass transfer release material as described in the first aspect, the preparation method comprising the following steps:

[0045] The components of the Micro-LED laser mass transfer and release material are mixed evenly to obtain the Micro-LED laser mass transfer and release material.

[0046] As a preferred technical solution of the present invention, the preparation method comprises the following steps:

[0047] (1) uniformly mixing the compound containing an azobenzene group and the auxiliary resin;

[0048] (2) adding part of the solvent thereto and mixing;

[0049] (3) adding a coupling agent, a leveling agent, a solvent and the remaining solvent thereto, and mixing them to obtain the azobenzene group-containing compound.

[0050] As a preferred technical solution of the present invention, the mixing method in step (1) includes stirring, and the stirring speed is 90-110rpm, for example, it can be 90rpm, 92rpm, 94rpm, 96rpm, 98rpm, 100rpm, 102rpm, 104rpm, 106rpm, 108rpm or 110rpm, etc.

[0051] Preferably, the mixing method in step (2) includes stirring, and the stirring speed is 120-220rpm (for example, it can be 120rpm, 130rpm, 140rpm, 150rpm, 160rpm, 170rpm, 180rpm, 190rpm, 200rpm, 210rpm or 220rpm, etc.), and the time is 6-10h (for example, it can be 6h, 6.5h, 7h, 7.5h, 8h, 8.5h, 9h, 9.5h or 10.5h, etc.).

[0052] Preferably, the mixing method in step (3) includes stirring, and the stirring speed is 240-320rpm (for example, it can be 240rpm, 250rpm, 260rpm, 270rpm, 280rpm, 290rpm, 300rpm, 310rpm or 320rpm, etc.), and the time is 45-55h (for example, it can be 45h, 46h, 47h, 48h, 49h, 50h, 51h, 52h, 53h, 54h or 55h, etc.).

[0053] Preferably, step (3) further includes a post-treatment step after the mixing, and the post-treatment method includes standing and filtering.

[0054] Preferably, the filtering method comprises filtering in sequence using filter elements with pore sizes of 5 μm, 1 μm, 0.45 μm and 0.2 μm.

[0055] It should be noted that the solvent added in step (2) accounts for 55-65% of the total mass of the solvent, for example, it can be 55%, 56%, 57%, 58%, 59%, 60%, 61%, 62%, 63%, 64% or 65%.

[0056] In a third aspect, the present invention provides an application of the Micro-LED laser mass transfer release material as described in the first aspect, wherein the Micro-LED laser mass transfer release material is used for laser mass transfer of Micro-LEDs.

[0057] Compared with the prior art, the present invention has the following beneficial effects:

[0058] (1) The present invention designs the specific composition of the Micro-LED laser mass transfer release material and further uses azobenzene group-containing compounds to solve the technical problems of poor adhesion of the laser mass transfer release material used in the Micro-LED mass transfer process under strong alkaline conditions and release defects caused by the inability to withstand high temperature processes.

[0059] (2) In the present invention, a Micro-LED laser mass transfer release material with excellent performance is prepared through the coordination of various components, and its glass transition temperature is ≥49°C, and the 100 grid grade after natron is 5B. After Micro-LED laser mass transfer is carried out using the Micro-LED laser mass transfer release material provided by the present invention, the chip transfer yield is ≥0.9635. DETAILED DESCRIPTION

[0060] For the convenience of understanding the present invention, the present invention lists the following embodiments. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0061] The sources of some components in the embodiments and comparative examples are shown in Table 1 below:

[0062] Table 1

[0063]

[0064] Example 1-Example 11, Comparative Example 1-Comparative Example 5

[0065] Example 1 to Example 11 and Comparative Example 1 to Comparative Example 5 respectively provide a Micro-LED laser mass transfer release material, and the composition of the Micro-LED laser mass transfer release material is shown in Table 2 and Table 3 below. The amount of each component in Table 2 and Table 3 is mass percentage.

[0066] The preparation method of the above-mentioned Micro-LED laser mass transfer release material is as follows:

[0067] (1) stirring and mixing the azobenzene group-containing compound and the auxiliary resin at a rotation speed of 100 rpm;

[0068] (2) adding part of the solvent (the added solvent accounts for 60 wt% of the total amount of the solvent), adjusting the speed to 150 rpm and stirring for 4 h, and then adjusting the speed to 200 rpm and stirring for 4 h to mix evenly;

[0069] (3) Add coupling agent, leveling agent and remaining solvent, stir and mix at 250 rpm for 24 hours, adjust the speed to 300 rpm and stir for 24 hours, let it stand for 24 hours, and filter with filter elements with pore sizes of 5 μm, 1 μm, 0.45 μm and 0.2 μm in sequence to obtain the Micro-LED laser mass transfer release material.

[0070] Table 2

[0071]

[0072]

[0073] Table 3

[0074]

[0075]

[0076] The performance of the Micro-LED laser mass transfer release materials provided in the above embodiments and comparative examples was tested, and the specific testing method is as follows:

[0077] (I) Glass transition temperature:

[0078] The Micro-LED laser mass transfer release material provided in the above embodiment and comparative example was spin-coated on a crystallized glass sheet, dried, and scraped, and the obtained film material was subjected to DSC test, wherein the spin-coating condition was 2000 rpm @ 30 s, and the drying condition was 120 ° C @ 10 min;

[0079] The glass transition temperature was tested according to the national standard GB / T 15022.2-5, wherein the experimental conditions were set on the differential scanning calorimeter, including a heating rate of 5°C / min, a nitrogen atmosphere, and a temperature range of -20 to 250°C.

[0080] (II) Grade of 100 cells after natron:

[0081] Before the 100-grid test, the Micro-LED laser mass transfer release material provided in the above embodiments and comparative examples is first spin-coated and dried on a sapphire substrate. The spin-coating conditions may be 2000 rpm @ 30 s, and the drying conditions may be 120 ° C @ 10 min. Then, the 100-grid test is performed. The 100-grid test is a test method for evaluating the surface adhesion of a material (national standard for 100-grid test: GB / T 9286-2021). The specific steps are as follows:

[0082] (1) Marking and caustic soda: Use a grid knife to mark 10×10 small grids of 1 mm×1 mm on the surface of the test sample. Each mark should be deep enough to reach the bottom layer of the paint. Then soak it in a potassium hydroxide solution with a mass concentration of 40% for 10 minutes.

[0083] (2) Cleaning: Use a brush to clean the debris from the test area;

[0084] (3) Tape test: Use 3M No. 600 tape or tape of equivalent strength to firmly stick to the small grid to be tested, and use an eraser to rub the tape vigorously to increase the contact area and strength between the tape and the tested area;

[0085] (4) Peeling: After standing for 4 minutes, grab one end of the tape and quickly tear it off in the vertical direction (90°). Perform the same test twice at the same location.

[0086] (5) Result evaluation: According to the peeling condition of the coating, the adhesion grade is evaluated according to the standard. Usually, the test results are expressed in numbers and letters to indicate the quality grade of adhesion;

[0087] Among them, the result level evaluation criteria of the hundred-grid test are as follows:

[0088] ISO Grade 0 / ASTM Grade 5B: The edges of the cut are completely smooth, without any peeling off the edges of the grid;

[0089] ISO Grade 1 / ASTM Grade 4B: There is small flakes at the intersection of the cuts, and the actual damage in the cross-cut area does not exceed 5%;

[0090] ISO Grade 2 / ASTM Grade 3B: The edges and / or intersections of the cuts are peeled off, with an area greater than 5% but less than 15%;

[0091] ISO Grade 3 / ASTM Grade 2B: Partial or large pieces of peeling along the edge of the cut, or a part of the grid is peeled off in one piece, and the peeled area exceeds 15% but less than 35%;

[0092] ISO Grade 4 / ASTM Grade 1B: Large flakes are peeled off from the cut edge, or some squares are partially or completely peeled off, with an area greater than 35% of the specification area but not exceeding 65%;

[0093] ISO Grade 5 / ASTM Grade 0B: Exceeds the previous grade.

[0094] (III) Chip transfer yield:

[0095] The ratio of chips that can light up after transfer to the total transferred chips. The chip transfer method refers to the chip mass transfer method provided in CN118366916A. The Micro-LED laser mass transfer release materials provided in the above embodiments and comparative examples are used to prepare the laser induced release layer.

[0096] The above performance test results are shown in Table 4 below:

[0097] Table 4

[0098]

[0099]

[0100] From the above content, it can be seen that the present invention solves the technical problems of poor adhesion of the laser mass transfer release material used in the Micro-LED mass transfer process under strong alkaline conditions and release defects caused by inability to withstand high temperature processes by designing the specific composition of the Micro-LED laser mass transfer release material and further using compounds containing azobenzene groups.

[0101] In the present invention, a Micro-LED laser mass transfer release material with excellent performance is prepared through the coordination of various components, the glass transition temperature of which is ≥49°C, and the 100 grid grade after natron is 5B. After Micro-LED laser mass transfer is carried out using the Micro-LED laser mass transfer release material provided by the present invention, the chip transfer yield is ≥0.9635.

[0102] It can be seen from Examples 1-4, Examples 8-11 and Comparative Examples 1-2 that the present invention controls the amount of the compound containing the azobenzene group within a specific range, further optimizes the amount of the compound containing the azobenzene group to 15-25wt%, thereby optimizing and improving the comprehensive performance of the Micro-LED laser mass transfer release material, especially improving the chip transfer yield after Micro-LED laser mass transfer, and the yield is ≥0.9986.

[0103] It can be seen from Examples 1-11 and Comparative Examples 1-5 that the present invention prepares a Micro-LED laser mass transfer release material with excellent performance by designing the amount of each component in the Micro-LED laser mass transfer release material within a specific range.

[0104] In summary, the present invention designs the specific composition of the Micro-LED laser mass transfer release material, and further prepares a Micro-LED laser mass transfer release material with excellent performance by using compounds containing azobenzene groups.

[0105] The applicant declares that the present invention illustrates the detailed process flow of the present invention through the above-mentioned embodiments, but the present invention is not limited to the above-mentioned detailed process flow, that is, it does not mean that the present invention must rely on the above-mentioned detailed process flow to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of various raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A Micro-LED laser mass transfer release material, characterized in that: The Micro-LED laser mass transfer release material includes the following components in percentage by mass:

2. The Micro-LED laser mass transfer release material according to claim 1, characterized in that: The mass percentage of the azobenzene group in the azobenzene group-containing compound is 30-100%; Preferably, the compound containing an azobenzene group is selected from any one or a combination of at least two of azobenzene, 4-aminoazobenzene, 4-hydroxyazobenzene, oxyazobenzene, 2,2'-dihydroxyazobenzene, 4,4'-dihydroxyazobenzene, 4,4'-dibromoazobenzene, 4,4'-diaminoazobenzene, 3,3'-dihydroxyazobenzene, 4-(methylamino)azobenzene, 4-bromo-4'-hydroxyazobenzene, N,N'-diethyl-4-aminoazobenzene, 4-methoxyazobenzene, 3,3'-dimethylazobenzene, N,N-dimethyl-4-(p-tolyldiazenyl)aniline, 4-(dimethylamino)-2-methylazobenzene or 4-amino-4'-dimethylaminoazobenzene; Preferably, the mass percentage of the compound containing azobenzene group in the Micro-LED laser mass transfer release material is 15-25%.

3. The Micro-LED laser mass transfer release material according to claim 1 or 2, characterized in that: The auxiliary resin is selected from styrene-N-phenylmaleimide-maleic anhydride graft copolymer, styrene maleic anhydride copolymer, polyetheretherketone, polyphenylene sulfide, polycarbonate, polyimide, polyetherimide, polyphenylene ether, polyethersulfone, polytetrafluoroethylene, polylactic acid, AURUM TM Any one or a combination of at least two of the resins; Preferably, the glass transition temperature of the auxiliary resin is 80-160°C; Preferably, the mass percentage of the auxiliary resin in the Micro-LED laser mass transfer release material is 15-25%.

4. The Micro-LED laser mass transfer release material according to any one of claims 1 to 3, characterized in that: The coupling agent is selected from silane coupling agent and / or borate coupling agent; Preferably, the silane coupling agent is selected from any one or a combination of at least two of γ-aminopropyltriethoxysilane, vinyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrichlorosilane, phenyltriethoxysilane, 3-(2,3-glycidoxypropyl)trimethoxysilane, 3-methacryloxypropyltrimethoxysilane or diphenyldimethoxysilane; Preferably, the borate coupling agent is selected from any one of trimethyl borate, triethyl borate, triphenyl borate, triisopropyl borate, tributyl borate, tri(2-ethylhexyl) borate, trialkylene borate, tri(2-hydroxyethyl) borate, tri(3-hydroxypropyl) borate or tricyclohexyl borate, or a combination of at least two thereof; Preferably, the mass percentage of the coupling agent in the Micro-LED laser mass transfer release material is 0.5-3%.

5. The Micro-LED laser mass transfer release material according to any one of claims 1 to 4, characterized in that: The leveling agent is selected from any one of acrylic leveling agent, fluorocarbon leveling agent or silicone leveling agent or a combination of at least two thereof; Preferably, the acrylic leveling agent comprises a polyester-modified polydimethylsiloxane solution having an acrylate functional group, and the solvent is xylene; Preferably, the fluorocarbon leveling agent comprises fluorocarbon modified polyolefin wax; Preferably, the organosilicon leveling agent comprises polyether-modified siloxane and / or polyether-modified polydimethylsiloxane; Preferably, the mass percentage of the leveling agent in the Micro-LED laser mass transfer release material is 0.2-1.5%.

6. The Micro-LED laser mass transfer release material according to any one of claims 1 to 5, characterized in that: The Micro-LED laser mass transfer release material also includes a solvent; Preferably, the mass percentage of the solvent in the Micro-LED laser mass transfer release material is 30-80%; Preferably, the solvent is selected from any one of ketone solvents, aromatic hydrocarbon solvents, ether solvents, amide solvents, dimethyl sulfoxide or decalin, or a combination of at least two thereof.

7. A method for preparing a Micro-LED laser mass transfer release material according to any one of claims 1 to 6, characterized in that: The preparation method comprises the following steps: The components of the Micro-LED laser mass transfer and release material are mixed evenly to obtain the Micro-LED laser mass transfer and release material.

8. The preparation method according to claim 7, characterized in that: The preparation method comprises the following steps: (1) mixing a compound containing an azobenzene group and an auxiliary resin; (2) adding part of the solvent thereto and mixing; (3) adding a coupling agent, a leveling agent, a solvent and the remaining solvent thereto, and mixing them to obtain the azobenzene group-containing compound.

9. The preparation method according to claim 8, characterized in that: The mixing method in step (1) includes stirring, and the stirring speed is 90-110 rpm; Preferably, the mixing method in step (2) comprises stirring, and the stirring speed is 120-220 rpm and the time is 6-10 h; Preferably, the mixing method in step (3) comprises stirring, and the stirring speed is 240-320 rpm and the time is 45-55 h; Preferably, step (3) further includes a post-treatment step after the mixing, and the post-treatment method includes standing and filtering.

10. An application of the Micro-LED laser mass transfer release material according to any one of claims 1 to 6, characterized in that: The Micro-LED laser mass transfer release material is used for laser mass transfer of Micro-LED.

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