Offset monitoring method, device and equipment between onboard hole and copper disc layer and medium

Abstract

The invention is suitable for the technical field of circuit boards, and particularly relates to an offset monitoring method and device between an onboard hole and a copper disc layer, equipment and a medium. According to the method, after laser drilling is carried out on a carrier plate where a circular copper disc is pressed to form a first onboard circular ring hole, windowing is carried out on the periphery of the first onboard circular ring hole to obtain at least three windowing openings exposing out of an arc of the circular copper disc, and a first circle center coordinate of the circular copper disc is determined according to the at least three windowing openings; selecting at least three target points on an outer side arc of the first onboard circular ring hole, determining a second circle center coordinate of the first onboard circular ring hole according to the at least three target points, and determining a first deviation value between the first onboard circular ring hole and the copper disc according to the first circle center coordinate and the second circle center coordinate, the first deviation value is used for carrying out deviation monitoring on laser drilling, and the monitoring result is effectively quantified in a Kebang design mode, so that abnormity is discriminated, the product process monitoring mechanism and capability mastering are improved, and the qualified rate of products can be effectively improved.

Description

Technical Field

[0001] The present application is applicable to the technical field of circuit boards, and in particular, relates to a method, device, equipment and medium for monitoring the offset between a board-mounted hole and a copper disk layer. Background Art

[0002] At present, the offset inspection after drilling and pattern exposure in the multilayer board processing process is usually carried out by scanning each unit in the product through X-ray and AOI to check the hole offset. It can only qualitatively confirm whether the product has abnormal hole offset, but cannot quantify the value. In this process, the hole plate design size of the ball grid array (BGA) substrate or printed circuit board (PCB) multilayer board processing product processing process capability monitoring can only be qualitatively determined by the actual AOI hole offset. X-ray inspection or AOI scanning can only be carried out after the product processing is completed. If the offset accuracy is abnormal, the product will be directly scrapped.

[0003] In addition, concentric circles are added to the edge of the plate to check whether it is broken. Although this process can detect abnormalities during product processing, it is also unable to measure the specific offset value or the measurement value is inaccurate due to the small single aperture.

[0004] Therefore, how to quantify the offset of drilling during the circuit board processing so as to accurately adjust the processing process and improve the qualified rate of the circuit board has become an urgent problem to be solved. Summary of the invention

[0005] In view of this, the embodiments of the present application provide a method, device, equipment and medium for monitoring the offset between the board-mounted hole and the copper disk layer to solve the problem of how to quantify the offset of the drilling hole during the circuit board processing, so as to accurately adjust the processing process to improve the qualified rate of the circuit board.

[0006] In a first aspect, an embodiment of the present application provides a method for monitoring the offset between a board-mounted hole and a copper plate layer, comprising: After laser drilling is performed on the carrier plate of the pressed circular copper disk to form a first plate-mounted circular ring hole, a window is opened around the first plate-mounted circular ring hole to obtain at least three window openings through which the circular copper disk is leaked, and the first center coordinates of the circular copper disk are determined according to the at least three window openings; Select at least three target points on the outer arc of the first board-mounted circular hole, and determine the second center coordinates of the first board-mounted circular hole according to the at least three target points; A first deviation between the first onboard annular hole and the copper disk is determined according to the first circle center coordinate and the second circle center coordinate, and the first deviation is used for offset monitoring of laser drilling.

[0007] In one embodiment, after determining the first deviation between the first onboard annular hole and the copper disk according to the first circle center coordinates and the second circle center coordinates, the method further includes: detecting whether the first deviation is greater than a first threshold; If it is detected that the first deviation is greater than the first threshold, the first onboard annular hole is determined to be abnormal, and the abnormality is recorded in a statistical process control.

[0008] In one embodiment, after determining the second center coordinates of the first onboard circular hole according to at least three target points, the method further includes: Performing electroplating operation and outer layer patterning on the carrier in sequence to obtain a carrier with patterns; Laser drilling is performed in the outer layer pattern of the patterned carrier board to form a second plate-borne circular ring hole; The third center coordinates of the outer layer graphic are calculated based on the points on the arc of the outer layer graphic, and the fourth center coordinates of the second board-mounted circular hole are calculated based on the points on the outer arc of the second board-mounted circular hole; A second deviation between the second onboard annular hole and the outer layer pattern is determined according to the third circle center coordinate and the fourth circle center coordinate, and the second deviation is used for offset monitoring of laser drilling.

[0009] In one embodiment, after determining the second deviation between the second onboard annular hole and the outer layer pattern according to the third circle center coordinate and the fourth circle center coordinate, the method further includes: detecting whether the second deviation is greater than a second threshold; If it is detected that the second deviation is greater than the second threshold, the second onboard annular hole is determined to be abnormal, and the abnormality is recorded in a statistical process control.

[0010] In one embodiment, it further comprises: Using laser drilling to form a first carrier plate center hole at the second center coordinate, the first carrier plate center hole is used for visual deviation observation before performing the electroplating operation and outer layer pattern production on the carrier plate in sequence to obtain the carrier plate with pattern; A second carrier plate center hole is formed at the fourth center coordinate by laser drilling, and the second carrier plate center hole is used for visual deviation observation after the second carrier plate circular ring hole is formed by laser drilling in the outer layer pattern in the patterned carrier.

[0011] In one embodiment, the laser drilling is to use inner holes of the same diameter to overlap and form a circular ring of the onboard circular ring hole, and the width of the circular ring is not less than 1.5 times the diameter of the inner hole.

[0012] In one embodiment, the diameter of the circular copper disk is set between 300 μm and 400 μm, and the diameter of the opening window is set to be greater than 100 μm.

[0013] In a second aspect, an embodiment of the present application provides a device for monitoring the offset between a board-mounted hole and a copper plate layer, comprising: A first circle center determination module is used to open windows around the first plate-mounted circular ring hole after laser drilling the carrier plate of the pressed circular copper disk to form a first plate-mounted circular ring hole, so as to obtain at least three open windows of the arc of the circular copper disk, and determine the first circle center coordinates of the circular copper disk according to the at least three open windows; A second circle center determination module, used to select at least three target points on the outer arc of the first onboard circular ring hole, and determine the second circle center coordinates of the first onboard circular ring hole according to the at least three target points; The first offset monitoring module is used to determine a first deviation between the first onboard circular hole and the copper disk according to the first circle center coordinate and the second circle center coordinate, wherein the first deviation is used to perform offset monitoring on the laser drilling.

[0014] In one embodiment, the deviation monitoring device further comprises: A first detection module, configured to detect whether a first deviation amount between the first onboard annular hole and the copper disk is greater than a first threshold after the first center coordinate and the second center coordinate are determined; The first abnormality determination module is used to determine that the first onboard annular hole is abnormal if it is detected that the first deviation is greater than the first threshold, and to record the abnormality through statistical process control.

[0015] In one embodiment, the deviation monitoring device further comprises: A pattern making module, for, after determining the coordinates of the second center of the first plate-borne circular ring hole according to at least three target points, sequentially performing electroplating operations and outer layer pattern making on the carrier board to obtain a carrier board with patterns; An outer layer drilling module, used for laser drilling in the outer layer pattern of the pattern carrier board to form a second board-mounted circular hole; A coordinate calculation module, used to calculate the third center coordinates of the outer layer graphic according to the points on the arc of the outer layer graphic, and calculate the fourth center coordinates of the second board-mounted circular hole according to the points on the outer arc of the second board-mounted circular hole; The second offset monitoring module is used to determine the second deviation between the second onboard annular hole and the outer layer pattern according to the third circle center coordinate and the fourth circle center coordinate, and the second deviation is used for offset monitoring of laser drilling.

[0016] In one embodiment, the deviation monitoring device further comprises: A second detection module, configured to detect whether the second deviation amount is greater than a second threshold value after determining the second deviation amount between the second onboard annular hole and the outer layer pattern according to the third circle center coordinates and the fourth circle center coordinates; The second abnormality determination module is used to determine that the second onboard circular hole is abnormal if it is detected that the second deviation is greater than the second threshold, and to record the abnormality through statistical process control.

[0017] In one embodiment, the deviation monitoring device further comprises: A first center hole making module, used for forming a first carrier center hole at the second center coordinate by laser drilling, wherein the first carrier center hole is used for visual deviation observation before performing the electroplating operation and outer layer pattern making on the carrier in sequence to obtain a carrier with patterns; The second center hole making module is used to form a second carrier center hole at the fourth center coordinate using laser drilling. The second carrier center hole is used to perform visual deviation observation after performing laser drilling in the outer layer pattern in the patterned carrier to form the second board circular ring hole.

[0018] In one embodiment, the laser drilling is to use inner holes of the same diameter to overlap and form a circular ring of the onboard circular ring hole, and the width of the circular ring is not less than 1.5 times the diameter of the inner hole.

[0019] In one embodiment, the diameter of the circular copper disk is set between 300 μm and 400 μm, and the diameter of the opening window is set to be greater than 100 μm.

[0020] In a third aspect, an embodiment of the present application provides a computer device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method for monitoring the offset between the onboard hole and the copper disk layer as described in the first aspect when executing the computer program.

[0021] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for monitoring the offset between the board-mounted hole and the copper disk layer as described in the first aspect is implemented.

[0022] Compared with the prior art, the embodiments of the present application have the following beneficial effects: after laser drilling a carrier plate of a pressed circular copper disk to form a first plate-borne circular ring hole, the present application performs window openings around the first plate-borne circular ring hole to obtain at least three window openings of circular arcs through which the circular copper disk leaks out; based on the at least three window openings, the first center coordinates of the circular copper disk are determined; at least three target points are selected on the outer arc of the first plate-borne circular ring hole; based on the at least three target points, the second center coordinates of the first plate-borne circular ring hole are determined; based on the first center coordinates and the second center coordinates, the first deviation between the first plate-borne circular ring hole and the copper disk is determined; the first deviation is used for offset monitoring of laser drilling; the monitoring results are effectively quantified through the design of Cobon, thereby identifying anomalies, improving the product process monitoring mechanism and capability control, and effectively improving the product qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 This is a schematic diagram of an application environment of a method for monitoring the offset between a board-mounted hole and a copper disk layer provided in the first embodiment of the present application; Figure 2 It is a flow chart of a method for monitoring the offset between a board-mounted hole and a copper disk layer provided in the second embodiment of the present application; Figure 3 It is a schematic diagram of the principle of the monitoring method provided in Example 2 of the present application; Figure 4 It is a flow chart of a method for monitoring the offset between a board-mounted hole and a copper disk layer provided in the third embodiment of the present application; Figure 5 It is a structural schematic diagram of a device for monitoring the offset between a board-mounted hole and a copper disk layer provided in the fourth embodiment of the present application; Figure 6 It is a structural diagram of a computer device provided in Example 5 of the present application. DETAILED DESCRIPTION

[0025] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0026] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0027] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0028] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0029] It should be understood that the size of the serial numbers of the steps in the following embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0030] In order to illustrate the technical solution of the present application, a specific embodiment is provided below for illustration.

[0031] The first embodiment of the present application provides a method for monitoring the offset between a board-mounted hole and a copper plate layer, which can be applied to Figure 1In the application environment, the server is connected to the client, the client is used to collect corresponding data, and the client can be a microscope device, which is used to obtain the coordinates of the points on the arc. The server includes but is not limited to PDAs, desktop computers, notebook computers, ultra-mobile personal computers (UMPC), netbooks, cloud computer devices, personal digital assistants (PDA) and other computer devices.

[0032] See also Figure 2 , is a flow chart of a method for monitoring the offset between a board-mounted hole and a copper disk layer provided in Embodiment 2 of the present application, and the method for monitoring the offset between a board-mounted hole and a copper disk layer comprises the following steps: Step S201, after laser drilling the carrier board of the pressed circular copper disk to form a first board-mounted circular ring hole, opening windows around the first board-mounted circular ring hole to obtain at least three opening windows of the arc that leak out the circular copper disk, and determining the first center coordinates of the circular copper disk based on the at least three opening windows.

[0033] Step S202, selecting at least three target points on the outer arc of the first board-mounted circular hole, and determining the second center coordinates of the first board-mounted circular hole according to the at least three target points.

[0034] Step S203, determining a first deviation between the first plate-mounted annular hole and the copper plate according to the first circle center coordinates and the second circle center coordinates, wherein the first deviation is used for offset monitoring of laser drilling.

[0035] Among them, for BGA carrier board or PCB multilayer board, the following processing flow can be adopted: optical copper plate drilling → electroplating → pattern transfer → pressing → laser drilling → hole deviation inspection → electroplating → pattern → pattern deviation inspection.

[0036] The hole misalignment check is to execute the above steps S201 to S203, and the pattern misalignment check is to execute the subsequent steps S301 to S304. Of course, in one embodiment, there is no need to print patterns in the BGA carrier board or PCB multilayer board, so it is sufficient to execute the hole misalignment check.

[0037] In the hole deviation inspection, a circular copper pad (i.e. a circular copper plate) is designed for the inner layer graphics, and a window is opened at the edge of the circular copper pad to expose it when the outer layer laser drilling is performed. When measuring, a circle can be formed by selecting the four sides of the copper pad; then the outer layer laser drilling is designed to use the inner hole to drill a circular ring; a microscope can be used to measure the d value of the distance deviation between the center of the arc and the center of the inner copper pad, as well as the corresponding components dx and dy, which characterize the offset direction and degree of the laser drilling and the inner layer graphics.

[0038] It should be known that Cobond refers to a circuit board industry product with a surface window that exposes the bottom copper layer of the circuit; broken disk refers to the process of drilling holes in the circuit board processing, which requires the corresponding holes to be drilled on the copper disk formed after the pattern is exposed and etched. If the hole is drilled outside the copper disk or partially breaks out of the copper disk, it is called broken disk; alignment refers to the process of pattern transfer or laser drilling. There will be differences between the actual product and the theoretical design pattern due to the equipment processing accuracy or the expansion and contraction of the product itself. The difference between the theoretical design value of the pattern or hole and the actual value of the position of the pattern or hole is called alignment; pad is the copper disk produced after the pattern is exposed and etched.

[0039] like Figure 3 As shown, it is a schematic diagram of the principle of the monitoring method provided in Example 2 of the present application. Specifically, when measuring with a microscope, three points are taken from the arc edge of the copper plate exposed by the window to form a circle and the center coordinates are automatically generated. When measuring with a microscope, three points are taken from the arc edge of the circular ring hole to form a circle and the center coordinates are automatically generated. The center distance formed by the two center coordinates is the deviation. The dx value can be used to represent the deviation in the X (horizontal) direction, and the dy value can be used to represent the deviation in the Y (vertical) direction.

[0040] In the embodiment of the present application, after laser drilling is performed on the carrier plate of the pressed circular copper disk to form a first plate-borne circular hole, windows are opened around the first plate-borne circular hole to obtain at least three open windows of circular arc through which the circular copper disk leaks out, and the first center coordinates of the circular copper disk are determined based on the at least three open windows, and at least three target points are selected on the outer arc of the first plate-borne circular hole, and the second center coordinates of the first plate-borne circular hole are determined based on the at least three target points, and the first deviation between the first plate-borne circular hole and the copper disk is determined based on the first center coordinates and the second center coordinates. The first deviation is used for offset monitoring of laser drilling, and the monitoring results are effectively quantified through the design method of Cobon, so as to identify abnormalities, improve the product process monitoring mechanism and ability control, and effectively improve the product qualification rate.

[0041] In one embodiment, after determining the first deviation between the first plate-mounted annular hole and the copper plate according to the first circle center coordinate and the second circle center coordinate, the method further includes: Detecting whether the first deviation is greater than a first threshold; If it is detected that the first deviation is greater than the first threshold, the first onboard annular hole is determined to be abnormal, and the abnormality is recorded in the statistical process control.

[0042] The first threshold is a value set according to user needs, which can find the best data while ensuring efficiency and accuracy, so as to accurately identify anomalies and ensure product processing efficiency. Statistical Process Control (SPC) records the deviation value to control product process capability.

[0043] In one embodiment, the laser drilling is to use inner holes of the same diameter to perform overlapping drilling to form a ring of the onboard annular hole, and the width of the ring is not less than 1.5 times the diameter of the inner hole.

[0044] When using laser drilling, the core holes of the same diameter are used to design overlapping holes into an arc, the overlapping hole width is at least >1.5*core hole diameter, and the arcs are spliced ​​to form a ring.

[0045] In one embodiment, the diameter of the circular copper disk is set between 300 μm and 400 μm, and the diameter of the opening window is set to be greater than 100 μm.

[0046] Among them, the copper pad is designed at about 350um to facilitate the hole ring design and copper pad window opening and center deviation measurement. The inner copper pad window opening: use laser drilling with an aperture of more than 100um to open the window to facilitate edge selection during measurement or the copper layer expansion and contraction offset cannot capture the copper edge. like Figure 4 As shown, it is a flow chart of a method for monitoring the offset between a board-mounted hole and a copper plate layer provided in the third embodiment of the present application. After determining the second center coordinates of the first board-mounted circular hole according to at least three target points in step S202, the following steps are also included: Step S401, performing electroplating operation and outer layer pattern production on the carrier in sequence to obtain a carrier with patterns.

[0047] Step S402, laser drilling is performed in the outer pattern of the carrier board with patterns to form a second board-mounted circular hole.

[0048] Step S403, calculating the third center coordinates of the outer layer graphic according to the points on the arc of the outer layer graphic, and calculating the fourth center coordinates of the second board-mounted circular hole according to the points on the outer arc of the second board-mounted circular hole.

[0049] Step S404, determining a second deviation between the second plate-mounted annular hole and the outer layer pattern according to the third circle center coordinate and the fourth circle center coordinate, wherein the second deviation is used for offset monitoring of laser drilling.

[0050] Among them, the design of laser drilling uses the inner hole to drill a ring, and a circular copper pad is designed for the outer layer pattern. When measuring, the distance deviation between the center of the copper pad and the center of the ring is selected to measure the deviation of the outer layer pattern to the inner layer laser drilling, which represents the offset direction and offset degree of the laser drilling and the outer layer pattern. In one embodiment, after determining the second deviation between the second plate-mounted annular hole and the outer layer pattern according to the third circle center coordinate and the fourth circle center coordinate, the method further includes: Detecting whether the second deviation is greater than a second threshold; If it is detected that the second deviation is greater than the second threshold, the second onboard annular hole is determined to be abnormal, and the abnormality is recorded in the statistical process control.

[0051] In one embodiment, the method further comprises: A first carrier plate center hole is formed at the second center coordinate by laser drilling, and the first carrier plate center hole is used for visual deviation observation before performing electroplating operation and outer layer pattern production on the carrier plate in sequence to obtain a carrier plate with patterns; A second carrier plate center hole is formed at the fourth center coordinate by laser drilling, and the second carrier plate center hole is used for visual deviation observation after laser drilling is performed in the outer layer pattern of the patterned carrier plate to form the second plate-carrying circular hole.

[0052] Among them, a single hole with inner hole is designed at the center of the middle circle of the Colbond, which is convenient for personnel to visually check whether there is a concentric circle deviation, so that when conducting microscope spot inspection and measurement on some Colbonds, the remaining Colbonds can be visually inspected at the same time.

[0053] Corresponding to the offset monitoring method between the board-mounted hole and the copper disk layer in the above embodiment, Figure 5 The structural block diagram of the offset monitoring device between the board-mounted hole and the copper plate layer provided in the fourth embodiment of the present application is shown. The offset monitoring device is applied to Figure 1 The server in the embodiment is connected to the client, and the client is used to collect corresponding data. The client can be a microscope device, which is used to obtain the coordinates of the points on the arc. For ease of description, only the parts related to the embodiment of the present application are shown.

[0054] See also Figure 5 , the deviation monitoring device comprises: A first circle center determination module 51 is used to, after laser drilling a carrier plate of the pressed circular copper disk to form a first plate-mounted circular ring hole, open windows around the first plate-mounted circular ring hole to obtain at least three open windows of the arc that leak out of the circular copper disk, and determine the first circle center coordinates of the circular copper disk according to the at least three open windows; A second circle center determination module 52 is used to select at least three target points on the outer arc of the first board-mounted circular hole, and determine the coordinates of the second circle center of the first board-mounted circular hole according to the at least three target points; The first deviation monitoring module 53 is used to determine a first deviation between the first plate-mounted annular hole and the copper plate according to the first circle center coordinates and the second circle center coordinates, and the first deviation is used to perform deviation monitoring on the laser drilling.

[0055] Optionally, the deviation monitoring device further comprises: A first detection module is used to detect whether the first deviation amount is greater than a first threshold value after determining a first deviation amount between the first plate-mounted circular ring hole and the copper disk according to the first circle center coordinate and the second circle center coordinate; The first abnormality determination module is used to determine that the first onboard annular hole is abnormal if it is detected that the first deviation is greater than a first threshold, and to perform statistical process control to record the abnormality.

[0056] Optionally, the deviation monitoring device further comprises: A pattern making module, for determining the coordinates of the second center of the first plate-borne circular ring hole according to at least three target points, and then sequentially performing electroplating operations and outer layer pattern making on the carrier plate to obtain a carrier plate with patterns; The outer layer drilling module is used to perform laser drilling in the outer layer pattern of the pattern carrier board to form a second board-mounted circular hole; A coordinate calculation module, used to calculate the third center coordinates of the outer layer graphics according to the points on the arc of the outer layer graphics, and calculate the fourth center coordinates of the second board-mounted circular hole according to the points on the outer arc of the second board-mounted circular hole; The second offset monitoring module is used to determine the second deviation between the second board-mounted annular hole and the outer layer pattern according to the third circle center coordinate and the fourth circle center coordinate, and the second deviation is used to monitor the offset of the laser drilling.

[0057] Optionally, the deviation monitoring device further comprises: A second detection module is used to detect whether the second deviation amount is greater than a second threshold value after determining the second deviation amount between the second onboard annular hole and the outer layer pattern according to the third circle center coordinate and the fourth circle center coordinate; The second abnormality determination module is used to determine that the second onboard annular hole is abnormal if it is detected that the second deviation is greater than a second threshold, and to count the abnormalities in the process control record.

[0058] Optionally, the deviation monitoring device further comprises: A first center hole making module is used to form a first carrier center hole at the second center coordinate using laser drilling, and the first carrier center hole is used to perform visual deviation observation before performing electroplating operations and outer layer pattern making on the carrier in sequence to obtain a carrier with patterns; The second center hole making module is used to form a second carrier center hole at the fourth center coordinate using laser drilling. The second carrier center hole is used to perform laser drilling in the outer layer pattern of the patterned carrier to form a second board circular ring hole for visual deviation observation.

[0059] Optionally, the laser drilling is to use inner holes of the same diameter to perform overlapping drilling to form a ring of the onboard annular hole, and the width of the ring is not less than 1.5 times the diameter of the inner hole.

[0060] Optionally, the diameter of the circular copper disk is set between 300 μm and 400 μm, and the diameter of the opening window is set to be greater than 100 μm.

[0061] It should be noted that the information interaction, execution process and other contents between the above-mentioned modules are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0062] Figure 6 This is a schematic diagram of the structure of a computer device provided in Example 5 of this application. Figure 6 As shown, the computer device of this embodiment includes: at least one processor ( Figure 6 Only one is shown in the figure), a memory, and a computer program stored in the memory and executable on at least one processor, and when the processor executes the computer program, the steps in any of the above-mentioned embodiments of the mining method for entity enhancement rules are implemented. Those skilled in the art will understand that Figure 6 The above is only an example of a device and does not constitute a limitation on the entire vehicle computer device. The entire vehicle computer device may include more or less components than shown in the figure, or a combination of certain components, or different components.

[0063] The processor may be a CPU, or other general-purpose processors, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0064] The memory includes a readable storage medium, an internal memory, etc., wherein the internal memory may be the memory of a computer device, and the internal memory provides an environment for the operation of the operating system and computer-readable instructions in the readable storage medium. The readable storage medium may be a hard disk of a computer device, and in other embodiments, it may also be an external storage device of the computer device, for example, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the computer device. Further, the memory may also include both an internal storage unit of the computer device and an external storage device. The memory is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of a computer program, etc. The memory may also be used to temporarily store data that has been output or is to be output.

[0065] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0066] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0067] In the embodiments provided in the present application, it should be understood that the disclosed devices / control equipment and methods can be implemented in other ways. For example, the device / control equipment embodiments described above are merely schematic, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0068] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0069] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for monitoring the offset between a board-mounted hole and a copper plate layer, characterized in that: include: After laser drilling is performed on the carrier plate of the pressed circular copper disk to form a first plate-mounted circular ring hole, a window is opened around the first plate-mounted circular ring hole to obtain at least three window openings through which the circular copper disk is leaked, and the first center coordinates of the circular copper disk are determined according to the at least three window openings; Select at least three target points on the outer arc of the first board-mounted circular hole, and determine the second center coordinates of the first board-mounted circular hole according to the at least three target points; A first deviation between the first onboard annular hole and the copper disk is determined according to the first circle center coordinate and the second circle center coordinate, and the first deviation is used for offset monitoring of laser drilling.

2. The method for monitoring the offset between the board-mounted hole and the copper plate layer according to claim 1, characterized in that: After determining the first deviation between the first onboard annular hole and the copper disk according to the first circle center coordinates and the second circle center coordinates, the method further includes: detecting whether the first deviation is greater than a first threshold; If it is detected that the first deviation is greater than the first threshold, the first onboard annular hole is determined to be abnormal, and the abnormality is recorded in a statistical process control.

3. The method for monitoring the offset between the board-mounted hole and the copper plate layer according to claim 1 or 2, characterized in that: After determining the second center coordinates of the first onboard circular hole according to at least three target points, the method further includes: Performing electroplating operation and outer layer patterning on the carrier in sequence to obtain a carrier with patterns; Laser drilling is performed in the outer layer pattern of the patterned carrier board to form a second plate-borne circular ring hole; The third center coordinates of the outer layer graphic are calculated based on the points on the arc of the outer layer graphic, and the fourth center coordinates of the second board-mounted circular hole are calculated based on the points on the outer arc of the second board-mounted circular hole; A second deviation between the second onboard annular hole and the outer layer pattern is determined according to the third circle center coordinate and the fourth circle center coordinate, and the second deviation is used for offset monitoring of laser drilling.

4. The method for monitoring the offset between the board-mounted hole and the copper plate layer according to claim 3, characterized in that: After determining the second deviation between the second onboard annular hole and the outer layer pattern according to the third circle center coordinate and the fourth circle center coordinate, the method further includes: detecting whether the second deviation is greater than a second threshold; If it is detected that the second deviation is greater than the second threshold, the second onboard annular hole is determined to be abnormal, and the abnormality is recorded in a statistical process control.

5. The method for monitoring the offset between the board-mounted hole and the copper plate layer according to claim 3, characterized in that: Also includes: Using laser drilling to form a first carrier plate center hole at the second center coordinate, the first carrier plate center hole is used for visual deviation observation before performing the electroplating operation and outer layer pattern production on the carrier plate in sequence to obtain the carrier plate with pattern; A second carrier plate center hole is formed at the fourth center coordinate by laser drilling, and the second carrier plate center hole is used for visual deviation observation after the second carrier plate circular ring hole is formed by laser drilling in the outer layer pattern in the patterned carrier.

6. The method for monitoring the offset between the board-mounted hole and the copper plate layer according to claim 1, characterized in that: The laser drilling is to use inner holes of the same diameter to overlap and form a circular ring of the plate-mounted circular hole, and the width of the circular ring is not less than 1.5 times the diameter of the inner hole.

7. The method for monitoring the offset between the board-mounted hole and the copper plate layer according to claim 1, characterized in that: The diameter of the circular copper disk is set between 300 μm and 400 μm, and the diameter of the opening window is set to be greater than 100 μm.

8. A device for monitoring the deviation between a board-mounted hole and a copper plate layer, characterized in that: include: A first circle center determination module is used to open windows around the first plate-mounted circular ring hole after laser drilling the carrier plate of the pressed circular copper disk to form a first plate-mounted circular ring hole, so as to obtain at least three open windows of the arc of the circular copper disk, and determine the first circle center coordinates of the circular copper disk according to the at least three open windows; A second circle center determination module, used to select at least three target points on the outer arc of the first onboard circular ring hole, and determine the second circle center coordinates of the first onboard circular ring hole according to the at least three target points; The first offset monitoring module is used to determine a first deviation between the first onboard circular hole and the copper disk according to the first circle center coordinate and the second circle center coordinate, wherein the first deviation is used to perform offset monitoring on the laser drilling.

9. A computer device, characterized in that: The computer device includes a processor, a memory, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method for monitoring the offset between the board-mounted hole and the copper disk layer as described in any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for monitoring the offset between the board-mounted hole and the copper disk layer as claimed in any one of claims 1 to 7 is implemented.

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