Resin composition, photosensitive insulating adhesive film containing same and application

Abstract

The invention provides a resin composition, a photosensitive insulating adhesive film containing the same and application, and the resin composition comprises the following components in parts by weight: 30-60 parts of a photosensitive polymer; 10 to 30 parts of epoxy resin; 5 to 20 parts of an acrylic ester monomer; 0.5 to 5 parts of a photoinitiator; 0.05 to 1 part of a sensitizer; 10 to 40 parts of filler; the photoinitiator is prepared from a combination of 2-dimethylamino-2-(4-methyl) benzyl-1-[4-(4-morpholinyl) phenyl]-1-butanone and a phosphorus oxide type photoinitiator. The photosensitive insulating adhesive film prepared from the resin composition provided by the invention has relatively high glass transition temperature, relatively low CTE performance, excellent peel strength, relatively high photosensitive resolution and excellent easy-to-develop characteristic, and can meet the application requirements of the photosensitive insulating adhesive film.

Description

Technical Field

[0001] The invention belongs to the technical field of printed circuit boards and relates to a resin composition, a photosensitive insulating adhesive film containing the resin composition and applications thereof. Background Art

[0002] As electronic information products are mainly oriented towards the design trend of being light, thin, short and multifunctional in the future, the printed circuit substrate, as the main support for electronic components, is also constantly improving its technical level to provide high-density wiring, thin shape, fine aperture, multi-dimensional, etc. The substrate material determines the performance of the printed circuit substrate to a large extent, so it is urgent to develop a new generation of base materials.

[0003] Adhesive films without reinforcement materials or resin-coated copper foils are being developed and applied as a new generation of matrix materials because they can achieve thinner shapes, high-density wiring, fine pores, and multi-dimensional stereoscopic molding. Traditional insulating adhesive films are mainly formed by laser drilling to form connecting holes in applications, while photosensitive adhesive film materials can be formed by photoinduced holes, which is not only more efficient than laser drilling, but also can achieve smaller pores, and can be applied to higher-end fine line applications. In order to meet the requirements of heat resistance, inorganic fillers are generally added to photosensitive insulating adhesive film materials to improve the heat resistance, dimensional stability, and chemical resistance of the film materials. However, it is precisely because of the introduction of inorganic fillers that the peel strength of the film is negatively affected. In this field, how to improve the peel strength and photosensitive resolution of the film without reducing other properties is an important research direction. Summary of the invention

[0004] In view of the shortcomings of the prior art, the object of the present invention is to provide a resin composition, a photosensitive insulating adhesive film containing the same and applications thereof. The resin composition provided by the present invention can make the photosensitive insulating adhesive film prepared therefrom have a higher glass transition temperature and lower CTE performance, and at the same time have excellent peel strength, higher photosensitivity resolution and excellent easy-developability, which can meet the application requirements of the photosensitive insulating adhesive film.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] In a first aspect, the present invention provides a resin composition, wherein the resin composition comprises the following components in parts by weight:

[0007]

[0008] The photoinitiator includes a combination of 2-dimethylamino-2-(4-methyl)benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone (photoinitiator 379) and a phosphorus oxide photoinitiator;

[0009] The phosphorus oxide photoinitiator includes any one of diphenyl-(2,4,6-trimethylbenzoyl)phosphine oxide (photoinitiator TPO-L), (2,4,6-trimethylbenzoyl)di(p-tolyl)phosphine oxide (photoinitiator TMO), and phenyldi(2,4,6-trimethylbenzoyl)phosphine oxide (photoinitiator 819) or a combination of at least two thereof.

[0010] The resin composition provided by the present invention comprises a combination of a photosensitive polymer, an epoxy resin, an acrylate monomer, a photoinitiator, a sensitizer and a filler. Through the screening and coordinated compounding of specific components, especially the compounding of two specific photoinitiators, the photosensitive insulating adhesive film prepared from the resin composition has a higher glass transition temperature, a lower CTE performance, and at the same time has excellent peel strength, a higher photosensitivity resolution and excellent easy-to-develop properties.

[0011] In the present invention, the amount of the photosensitive polymer in the resin composition is calculated by weight, for example, 30 parts, 32 parts, 34 parts, 36 parts, 38 parts, 40 parts, 42 parts, 44 parts, 46 parts, 48 ​​parts, 50 parts, 52 parts, 54 parts, 56 parts, 58 parts or 60 parts, as well as specific points between the above points. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific points included in the range.

[0012] In the present invention, the resin composition is calculated by weight, and the amount of epoxy resin used can be, for example, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts, 22 parts, 24 parts, 26 parts, 28 parts or 30 parts, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0013] In the present invention, the resin composition is measured in parts by weight, and the amount of acrylate monomer used can be, for example, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts or 20 parts, as well as specific points between the above points. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific points included in the range.

[0014] In the present invention, the amount of the photoinitiator in the resin composition is calculated by weight, and can be, for example, 0.5 parts, 0.8 parts, 1 parts, 2 parts, 3 parts, 4 parts or 5 parts, as well as specific points between the above points. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific points included in the range.

[0015] In the present invention, the resin composition is measured in parts by weight, and the amount of the sensitizer used can be, for example, 0.05 parts, 0.08 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts or 1 parts, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0016] In the present invention, the resin composition is measured in parts by weight, and the amount of filler used can be, for example, 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts, 22 parts, 24 parts, 26 parts, 28 parts, 30 parts, 32 parts, 34 parts, 36 parts, 38 parts or 40 parts, as well as specific points between the above points. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific points included in the range.

[0017] Preferably, the mass ratio of the 2-dimethylamino-2-(4-methyl)benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone to the phosphorus oxide photoinitiator is 1:(1-3), for example, 1:1.5, 1:2 or 1:2.5, as well as specific point values ​​between the above point values. Due to space limitations and for simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range. If the proportion of the phosphorus oxide photoinitiator is too low, the exposure effect is poor and the line is prone to fall off; if the proportion of the phosphorus oxide photoinitiator is too high, the resolution will be reduced.

[0018] Preferably, the total amount of the photoinitiator is 0.5-5wt.%, of the total amount of the resin composition, for example, it can be 0.5wt.%, 0.8wt.%, 1wt.%, 1.2wt.%, 1.4wt.%, 1.6wt.%, 1.8wt.%, 2wt.%, 2.2wt.%, 2.4wt.%, 2.6wt.%, 2.8wt.%, 3wt.%, 3.2wt.%, 3.4wt.%, 3.6wt.%, 3.8wt.%, 4wt.%, 4.2wt.%, 4.4wt.%, 4.6wt.%, 4.8wt.% or 5wt.%, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the said range.

[0019] Preferably, the sensitizer includes any one of ethyl p-dimethylaminobenzoate (EDB), bisimidazole (BCIM), 4-(4-methylphenylthio)benzophenone (BMS), isooctyl p-dimethylaminobenzoate (EHA), and 4-4-bis(diethylamino)benzophenone (MEK), or a combination of at least two thereof.

[0020] Preferably, the amount of the sensitizer is 0.05-1wt.% of the total amount of the resin composition, for example, it can be 0.05wt.%, 0.08wt.%, 0.1wt.%, 0.2wt.%, 0.3wt.%, 0.4wt.%, 0.5wt.%, 0.6wt.%, 0.7wt.%, 0.8wt.%, 0.9wt.% or 1wt.%, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0021] Preferably, the photosensitive polymer comprises a carboxyl polymer containing an unsaturated bond.

[0022] Preferably, the photosensitive polymer is prepared by reacting epoxy resin with acrylic monomer and then reacting with acid anhydride.

[0023] Preferably, the epoxy resin includes any one or a combination of at least two of bisphenol A epoxy resin, phosphorus-containing epoxy resin, MDI-modified epoxy resin, novolac epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin, naphthalene-containing epoxy resin, and alicyclic epoxy resin.

[0024] Preferably, the acrylate monomers include difunctional acrylates and / or multifunctional (trifunctional and above) acrylates.

[0025] Preferably, the filler is an inorganic filler and / or an organic filler, and an inorganic filler is more preferred.

[0026] Preferably, the inorganic filler includes any one of non-metallic oxides, metal oxides, metal hydroxides, metal nitrides, non-metallic nitrides, inorganic hydrates, inorganic salts, metal hydrates, and inorganic phosphorus, or a combination of at least two thereof.

[0027] Preferably, the inorganic filler includes any one or a combination of at least two of silicon dioxide, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate or mica.

[0028] Preferably, the silica may be any one of fused silica, crystalline silica, spherical silica, hollow silica, or a combination of at least two thereof, preferably spherical silica.

[0029] Preferably, the organic filler includes any one of polyphenylene ether filler (powder and / or microsphere), polytetrafluoroethylene filler (powder), polyetheretherketone filler, polyphenylene sulfide filler or polyethersulfone filler (powder), or a combination of at least two thereof.

[0030] Preferably, the median particle size (D50) of the filler is 0.01-5 μm, for example, it can be 0.05 μm, 0.1 μm, 0.5 μm, 1 μm, 2 μm, 3 μm or 4 μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, and 0.01-1 μm is further preferred.

[0031] In the present invention, the particle size is measured by using a Malvern laser particle size analyzer MS3000.

[0032] Preferably, the filler comprises a surface-treated filler.

[0033] Preferably, the surface treatment agent for the surface treatment includes any one of a silane coupling agent, an organosilicon oligomer, and a titanate coupling agent, or a combination of at least two of them.

[0034] Preferably, based on 100 parts by mass of the filler to be treated, the mass of the surface treatment agent is 0.1-5 parts, for example, it can be 0.1 parts, 0.2 parts, 0.5 parts, 0.8 parts, 1 parts, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts or 5 parts, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, and 0.5-3 parts is further preferred, and 0.75-2 parts is further preferred.

[0035] The “parts” and “parts by weight” involved in the present invention are all calculated based on solid content and do not include solvents, dispersants, etc.

[0036] A solvent may also be added to the above resin composition, and the amount of the solvent added is selected by a person skilled in the art based on experience and process requirements, so that the resin composition reaches a viscosity suitable for use, so as to facilitate coating of the resin composition, etc. The solvent in the resin composition will partially or completely evaporate during subsequent drying, semi-curing or complete curing.

[0037] The solvent of the present invention is not particularly limited, and specific examples thereof include alcohols such as methanol, ethanol, and butanol, ethers such as ethyl cellosolve, butyl cellosolve, ethylene glycol monomethyl ether, carbitol, and butyl carbitol, ketones such as acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and mesitylene, esters such as ethoxyethyl acetate and ethyl acetate, and nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone. The above solvents may be used alone or in combination of two or more thereof, and preferably aromatic hydrocarbon solvents such as toluene, xylene, and mesitylene are used in combination with ketone solvents such as acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone.

[0038] The resin composition provided by the present invention is prepared by the following method, which comprises: mixing and uniformly dispersing the components in the resin composition to obtain the resin composition.

[0039] In a second aspect, the present invention provides a photosensitive insulating adhesive film, wherein the material of the photosensitive insulating adhesive film includes the resin composition as described in the first aspect.

[0040] Preferably, the photosensitive insulating adhesive film is obtained by coating the resin composition on a release material and then drying and / or semi-curing the resin composition.

[0041] Preferably, the photosensitive insulating adhesive film is further provided with a protective film on a side away from the release material.

[0042] Preferably, the thickness of the photosensitive insulating adhesive film is 5-300μm, for example, it can be 5μm, 10μm, 30μm, 50μm, 80μm, 100μm, 130μm, 150μm, 180μm, 200μm, 230μm, 250μm, 280μm or 300μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, preferably 10-200μm, and further preferably 20-100μm.

[0043] In a third aspect, the present invention provides a metal foil-clad laminate, comprising one or at least two stacked photosensitive insulating adhesive films as described in the second aspect, and a metal foil located on one side or both sides of the stacked photosensitive insulating adhesive films.

[0044] Preferably, when a metal foil is provided on one side of the metal-clad laminate, a protective film covering the photosensitive insulating adhesive film is provided on the other side thereof.

[0045] Preferably, the metal foil is copper foil.

[0046] Preferably, in the metal foil-clad laminate, the total thickness of the photosensitive insulating adhesive film is 5-300μm, for example, it can be 5μm, 10μm, 30μm, 50μm, 80μm, 100μm, 130μm, 150μm, 180μm, 200μm, 230μm, 250μm, 280μm or 300μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, preferably 10-200μm, and further preferably 20-100μm.

[0047] Preferably, in the metal foil-clad laminate, the thickness of the metal foil is 1-105 μm, for example, it can be 1 μm, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm or 105 μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, preferably 3-35 μm, and further preferably 5-18 μm.

[0048] In a fourth aspect, the present invention provides a laminated printed circuit board, comprising at least one laminated photosensitive insulating film as described in the second aspect, and a circuit substrate located on one side or both sides of the laminated photosensitive insulating film, or a circuit substrate located on one side of the laminated photosensitive insulating film and a metal foil located on the other side.

[0049] Compared with the prior art, the present invention has at least the following beneficial effects:

[0050] The resin composition provided by the present invention comprises a combination of a photosensitive polymer, an epoxy resin, an acrylate monomer, a photoinitiator, a sensitizer and a filler. Through the screening and coordinated compounding of specific components, especially the compounding of two specific photoinitiators, the photosensitive insulating adhesive film prepared from the resin composition has a higher glass transition temperature, a lower CTE performance, and at the same time has excellent peel strength, a higher photosensitivity resolution and excellent easy-to-develop properties. DETAILED DESCRIPTION

[0051] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0052] Preparation Example 1

[0053] In this preparation example, a photosensitive polymer is provided, and the preparation method comprises the following steps:

[0054] 100 parts of phenolic epoxy resin (HEXION, EPR627), 30 parts of acrylic acid monomer, and 0.5 parts of dimethylbenzylamine are heated at 100° C. for reaction for 6 hours, then cooled to 80° C., 50 parts of tetrahydrophthalic anhydride are added, reacted for 6 hours, and then cooled to room temperature to obtain a carboxyl polymer containing unsaturated bonds, that is, the carboxyl polymer containing unsaturated bonds is obtained.

[0055] Unless otherwise specified, the raw materials used in the following examples and comparative examples are as follows:

[0056] (1) Photosensitive polymer: provided in Preparation Example 1;

[0057] (2) Epoxy resin

[0058] Phenolic epoxy resin: HEXION, EPR627;

[0059] Biphenyl type epoxy resin: Nippon Kayaku, NC3000H;

[0060] Naphthalene-containing epoxy resin: DIC, HP4710;

[0061] (3) Acrylate monomers

[0062] HDDA: 1,6-hexanediol diacrylate;

[0063] Dipentaerythritol penta- / hexyl-acrylate;

[0064] (4) Filling

[0065] Silica: admatechs, 2050MB, median particle size (D50) 0.5 μm.

[0066] Example 1

[0067] A resin composition, wherein the specific components and usage of the resin composition are as follows: 30 parts of a photosensitive polymer, 10 parts of a phenolic epoxy resin, 14 parts of an acrylate monomer HDDA, 2.5 parts of a photoinitiator 379, 2.5 parts of a photoinitiator TPO-L, 1 part of a sensitizer BCIM, and 40 parts of a silica filler.

[0068] A build-up printed circuit board, the preparation method of which is as follows:

[0069] An appropriate amount of butanone solvent and the above resin composition were mixed and stirred for 2 hours to form a solution with a solid content of 65%.

[0070] The above solution was coated on the release film, dried, and then baked in a 120°C oven for 5 minutes to obtain a semi-cured photosensitive insulating adhesive film. The semi-cured photosensitive insulating adhesive film (thickness 40μm) and the browned PCB board were pressed and cured, the release film was torn off, and the surface was treated and copper electroplated to form a laminated printed circuit board with circuits.

[0071] Example 2

[0072] A resin composition, wherein the specific components and usage of the resin composition are as follows: 60 parts of a photosensitive polymer, 24.45 parts of a biphenyl epoxy resin, 5 parts of an acrylate monomer dipentaerythritol penta- / hexyl-acrylate, 0.25 parts of a photoinitiator 379, 0.25 parts of a photoinitiator TMO, 0.05 parts of a sensitizer EHA, and 10 parts of a silica filler.

[0073] A laminated printed circuit board, the preparation method of which is the same as that of Example 1.

[0074] Example 3

[0075] A resin composition, wherein the specific components and usage of the resin composition are as follows: 40 parts of a photosensitive polymer, 17.5 parts of a naphthalene-containing epoxy resin, 20 parts of an acrylate monomer HDDA, 1 part of a photoinitiator 379, 1 part of a photoinitiator 819, 0.5 parts of a sensitizer EDB, and 20 parts of a silica filler.

[0076] A laminated printed circuit board, the preparation method of which is the same as that of Example 1.

[0077] Comparative Example 1

[0078] A resin composition, wherein the specific components and usage of the resin composition are as follows: 40 parts of a photosensitive polymer, 17.5 parts of a naphthalene-containing epoxy resin, 20 parts of an acrylate monomer HDDA, 2 parts of a photoinitiator 379, 0.5 parts of a sensitizer EDB, and 20 parts of a silica filler.

[0079] A laminated printed circuit board, the preparation method of which is the same as that of Example 1.

[0080] Comparative Example 2

[0081] A resin composition, wherein the specific components and usage of the resin composition are as follows: 40 parts of a photosensitive polymer, 17.5 parts of a naphthalene-containing epoxy resin, 20 parts of an acrylate monomer HDDA, 2 parts of a photoinitiator 819, 0.5 parts of a sensitizer EDB, and 20 parts of a silica filler.

[0082] A laminated printed circuit board, the preparation method of which is the same as that of Example 1.

[0083] Comparative Example 3

[0084] A resin composition, wherein the specific components and usage of the resin composition are as follows: 30 parts of a photosensitive polymer, 10 parts of a phenolic epoxy resin, 14 parts of an acrylate monomer HDDA, 3 parts of a photoinitiator 379, 3 parts of a photoinitiator TPO-L, 1 part of a sensitizer BCIM, and 40 parts of a silica filler.

[0085] A laminated printed circuit board, the preparation method of which is the same as that of Example 1.

[0086] Comparative Example 4

[0087] A resin composition, wherein the specific components and usage of the resin composition are as follows: 40 parts of a photosensitive polymer, 17.5 parts of a naphthalene-containing epoxy resin, 20 parts of an acrylate monomer HDDA, 1 part of a photoinitiator 369 (2-benzyl-2-dimethylamino-1-(4-morpholinephenyl)butanone), 1 part of a photoinitiator 819, 0.5 parts of a sensitizer EDB, and 20 parts of a silica filler.

[0088] A laminated printed circuit board, the preparation method of which is the same as that of Example 1.

[0089] The photosensitive insulating adhesive film and the laminated printed circuit board provided in the above-mentioned embodiment and comparative example were subjected to performance tests, and the test method was as follows:

[0090] (1) Peel strength: The peel strength of the copper foil layer of the copper electroplating on the surface of the laminated printed circuit board is tested using the IPC-TM-650 2.4.9 method.

[0091] (2) CTE: After the semi-cured photosensitive insulating film is cured, the test is performed using the IPC-TM-650 2.4.24.5 method.

[0092] (3) Glass transition temperature Tg: After the semi-cured photosensitive insulating film is cured, it is tested using the IPC-TM-6502.4.25 method.

[0093] (4) Photosensitive resolution: The resin composition was applied to the entire surface of a 1.6 mm thick copper-filled FR-4 substrate by screen printing in a manner such that the dry film thickness was 20 μm, and dried at 80°C for 30 minutes and naturally cooled to room temperature. The substrate was exposed using a non-contact exposure device equipped with an ultra-high pressure mercury lamp (short arc lamp 5 kW) at the above-mentioned optimal exposure amount using a pattern with a line width of 100 μm in the light-shielded portion, and 1 mass % Na 2 CO 3 The aqueous solution was developed for 120 seconds under a spray pressure of 0.2 MPa and thermally cured at 150° C. for 60 minutes to prepare an evaluation sample. The line width of the blank of the obtained evaluation sample was measured using an optical microscope.

[0094] (5) Residual glue after development: Observe the residual glue after exposure and development under an optical microscope.

[0095] (6) Fine line reliability: The percentage of short circuits in the laminated printed circuit board after reflow soldering. When the percentage is greater than 90%, it is "excellent", when the percentage is less than 80%, it is "poor", and the rest is "good".

[0096] The performance test results are shown in Table 1.

[0097] Table 1

[0098]

[0099] It can be seen from Table 1 that the photosensitive insulating adhesive films provided in the embodiments of the present invention have higher peel strength (6.5-7.2N / cm), higher glass transition temperature (170-173°C), lower CTE performance (42-45ppm / °C), high photosensitivity resolution (20μm) and no residual adhesive after development, and excellent reliability of fine lines.

[0100] Compared with Example 3, Comparative Example 1 uses 2-dimethylamino-2-(4-methyl)benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone alone, and the peeling strength of the photosensitive insulating adhesive film provided by it is significantly reduced, the photosensitive resolution is deteriorated, and there are more problems of residual adhesive during development.

[0101] Compared with Example 3, Comparative Example 2 uses phosphorus oxide photoinitiator alone, and the peeling strength of the photosensitive insulating adhesive film provided by it is reduced, the photosensitive resolution is significantly deteriorated, and there are more problems of residual adhesive during development.

[0102] Compared with Example 1, the amount of photoinitiator added in Comparative Example 3 is too much, resulting in an increase in the CTE of the photosensitive insulating adhesive film provided thereby, a deterioration in the photosensitivity resolution, and a large number of problems of residual adhesive during development.

[0103] Compared with Example 3, Comparative Example 4 replaces the photoinitiator 379 with other ketone photoinitiators 369. The peeling strength of the photosensitive insulating adhesive film provided by the comparative example is reduced, the photosensitive resolution is deteriorated, and there are more problems of residual adhesive during development.

[0104] The applicant declares that the present invention uses the above embodiments to illustrate the resin composition of the present invention, the photosensitive insulating film containing the same and the application thereof, but the present invention is not limited to the above embodiments, that is, it does not mean that the present invention must rely on the above embodiments to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of various raw materials of the product of the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A resin composition, characterized in that The resin composition comprises the following components in parts by weight: The photoinitiator includes a combination of 2-dimethylamino-2-(4-methyl)benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone and a phosphorus oxide photoinitiator; The phosphorus oxide photoinitiator includes any one of diphenyl-(2,4,6-trimethylbenzoyl)phosphine oxide, (2,4,6-trimethylbenzoyl)di(p-tolyl)phosphine oxide, and phenyldi(2,4,6-trimethylbenzoyl)phosphine oxide, or a combination of at least two thereof.

2. The resin composition according to claim 1, characterized in that The mass ratio of the 2-dimethylamino-2-(4-methyl)benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone to the phosphorus oxide photoinitiator is 1:(1-3); Preferably, the total amount of the photoinitiator is 0.5-5 wt.% of the total amount of the resin composition.

3. The resin composition according to claim 1 or 2, characterized in that The sensitizer includes any one of ethyl p-dimethylaminobenzoate, bisimidazole, 4-(4-methylphenylthio)benzophenone, isooctyl p-dimethylaminobenzoate, and 4-4-di(diethylamino)benzophenone, or a combination of at least two thereof; Preferably, the amount of the sensitizer is 0.05-1 wt.% of the total amount of the resin composition.

4. The resin composition according to any one of claims 1 to 3, characterized in that The photosensitive polymer includes a carboxyl polymer containing unsaturated bonds; Preferably, the photosensitive polymer is prepared by reacting epoxy resin with acrylic monomer and then reacting with acid anhydride.

5. The resin composition according to any one of claims 1 to 4, characterized in that The epoxy resin includes any one of bisphenol A epoxy resin, phosphorus-containing epoxy resin, MDI-modified epoxy resin, novolac epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin, naphthalene-containing epoxy resin, and alicyclic epoxy resin, or a combination of at least two of them.

6. The resin composition according to any one of claims 1 to 5, characterized in that The acrylic acid ester monomers include bifunctional acrylic acid esters and / or multifunctional acrylic acid esters.

7. The resin composition according to any one of claims 1 to 6, characterized in that The filler is an inorganic filler and / or an organic filler, and an inorganic filler is further preferred; Preferably, the inorganic filler includes any one or a combination of at least two of silicon dioxide, aluminum hydroxide, aluminum oxide, talc, aluminum nitride, boron nitride, silicon carbide, barium sulfate, barium titanate, strontium titanate, calcium carbonate, calcium silicate or mica; Preferably, the organic filler includes any one of polyphenylene ether filler, polytetrafluoroethylene filler, polyetheretherketone filler, polyphenylene sulfide filler or polyethersulfone filler, or a combination of at least two thereof; Preferably, the median particle size of the filler is 0.01-5 μm, more preferably 0.01-1 μm.

8. A photosensitive insulating film, characterized in that: The material of the photosensitive insulating film comprises the resin composition according to any one of claims 1 to 7; Preferably, the photosensitive insulating adhesive film is obtained by coating the resin composition on a release material and then drying and / or semi-curing the resin composition; Preferably, the photosensitive insulating adhesive film is further provided with a protective film on a side away from the release material.

9. A metal foil-clad laminate, characterized in that: The metal foil-clad laminate comprises one or at least two stacked photosensitive insulating adhesive films as claimed in claim 8, and metal foil located on one side or both sides of the stacked photosensitive insulating adhesive films.

10. A build-up printed circuit board, characterized in that: The laminated printed circuit board includes at least one laminated photosensitive insulating film as described in claim 8, and a circuit substrate located on one side or both sides of the laminated photosensitive insulating film, or a circuit substrate located on one side of the laminated photosensitive insulating film and a metal foil located on the other side.

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