A Foldable Circuit Structure Based on Dual-Material 3D Printing and Its Manufacturing Method

Abstract

The present invention discloses a foldable circuit structure based on dual-material 3D printing and a manufacturing method thereof. The method includes: dividing the foldable circuit structure into several circuit modules, and constructing a 3D printing model of each circuit module based on dual materials through computer-aided design software; adding magnets and electronic component embedding slots in the 3D printing model, using the improved Dijkstra algorithm to plan the optimal path of the circuit slots, and then adopting the free-form deformation three-dimensional structure design method to design the deformable regions; printing all the circuit modules, embedding the magnets and electronic components into the magnet and electronic component embedding slots respectively, and adding conductive materials in the circuit slots to connect the circuits; connecting each circuit module through the magnets to obtain the foldable circuit structure. The present invention simplifies the traditional welding and assembly processes, supports modular expansion and functional integration, is widely applicable to wearable devices, medical devices and intelligent electronic products, and has high production efficiency, customization and maintenance convenience.

Description

Technical Field

[0001] The present invention belongs to the technical field of additive manufacturing (3D printing), and relates to a foldable circuit structure and a manufacturing method thereof, and particularly relates to a foldable circuit structure based on dual-material 3D printing and a manufacturing method thereof. Background Art

[0002] With the development of human-computer interaction, smart wearables, and flexible electronic products, how to integrate circuits and intelligent components into deformable flexible structures has become an important trend in the design of modern technological products. Currently, most traditional flexible electronic products use processes such as laser cutting and electroplating, which require multiple complex steps in the production process, including precision welding, assembly, and testing, increasing the manufacturing cost and technical threshold.

[0003] Although existing manufacturing methods can achieve a certain degree of circuit integration and structural deformation, they still have the following limitations:

[0004] (1) Complex multi-process flow: It requires multiple steps of operation, which is not only time-consuming but also has extremely high requirements for processing accuracy;

[0005] (2) Limited material selection: It is difficult to combine soft and hard materials in the same product, resulting in insufficient mechanical properties or flexibility of the product;

[0006] (3) Difficult maintenance: Flexibile electronic devices manufactured traditionally are often difficult to be disassembled and reused modularly. Summary of the Invention

[0007] To solve the above technical problems, the present invention overcomes the deficiencies in the prior art and provides a foldable circuit structure based on dual-material 3D printing and a manufacturing method thereof. This method integrates flexible materials and rigid supports through dual-material 3D printing and modular design to achieve the structural strength and deformability of the product. The present invention covers four major steps: design, printing, embedding electronic components, and assembly, simplifying the production process of intelligent devices and having advantages such as high efficiency, modularity, and low cost.

[0008] The technical solution adopted by the present invention is as follows:

[0009] A manufacturing method of a foldable circuit structure based on dual-material 3D printing, comprising the following steps:

[0010] S1. Divide the foldable circuit structure into several circuit modules, and construct 3D printing models based on dual materials for each circuit module through computer-aided design software;

[0011] S2. Add magnets and electronic component embedding slots to the 3D printed models of each circuit module, use the improved Dijkstra algorithm to plan the optimal path of the circuit slots, and then use the free form deformation three-dimensional structure design method (FFD algorithm) to design the deformable regions;

[0012] S3. Use a dual-material 3D printing device to print all circuit modules according to the 3D printed models;

[0013] S4. Embed the magnets and electronic components into the magnet and electronic component embedding slots respectively, and add conductive materials in the circuit slots to connect the circuits;

[0014] S5. Connect each circuit module through magnets to obtain a foldable circuit structure.

[0015] Further, the specific steps of using the improved Dijkstra algorithm to plan the optimal path of the circuit slots are as follows:

[0016] 1) Convert the magnet and electronic component embedding slots into several nodes, select a node as the starting point, and set the initial distance, predecessor node, and priority queue of the nodes;

[0017] 2) Use the Dijkstra algorithm to plan the circuit slots and add a path crossing detection mechanism;

[0018] 3) If it is detected that the path has a crossing, execute the crossing handling strategy; otherwise, update the shortest path information of the nodes;

[0019] 4) Adopt a heuristic evaluation mechanism to guide the path to avoid the crossing area, and dynamically adjust the route weight according to the generated path to adapt to the complex layout;

[0020] 5) After the node traversal is completed, trace back from the end point to the starting point to obtain the optimal path.

[0021] Further, the crossing handling strategy includes the following three strategies:

[0022] 1) Re-plan the path to avoid the crossing point;

[0023] 2) By increasing the weight of the crossing path, the path is optimized in subsequent calculations;

[0024] 3) Layer the path at the physical level and avoid crossing by setting different layers.

[0025] Further, the path crossing detection mechanism is specifically: each time the distance from the current node to the adjacent node is calculated, it is detected whether the new path will cross the existing path.

[0026] Further, the specific steps of using the free form deformation three-dimensional structure design method to design the deformable regions are as follows:

[0027] 1) Select the target area to be deformed in the 3D printed model and generate a control point grid within the target area;

[0028] 2) Define the multi-resolution influence range of the control points and set the weights of the control points;

[0029] 3) Set deformation parameters for the control points and implement adjustments to the deformation intensity and direction;

[0030] 4) Use the interpolation algorithm to spread the displacement of the control points to the entire target area to make the deformation smooth and natural;

[0031] 5) Dynamically adjust the weights of the control points so that the weights of the control points are dynamically updated according to the moving distance of the control points;

[0032] 6) Set up a real-time feedback mechanism to display the deformation effect in real time.

[0033] Furthermore, in step S1, the design process of the 3D printed model further includes: designing the ratio of the flexible material to the rigid material and controlling the material thickness and distribution through pixelization technology.

[0034] Furthermore, in step S2, in the way of layer-by-layer stacking printing, embed the rigid material into the flexible material, and at the same time print out the circuit grooves, magnets and electronic component embedding grooves.

[0035] Furthermore, in step S3, the conductive material is conductive ink or conductive glue.

[0036] A foldable circuit structure based on dual-material 3D printing is obtained by using the above method.

[0037] Furthermore, in step S1, the design process of the 3D printed model further includes: designing the ratio of the flexible material to the rigid material and controlling the material thickness and distribution through pixelization technology.

[0038] Furthermore, in step S2, in the way of layer-by-layer stacking printing, embed the rigid material into the flexible material, and at the same time print out the circuit grooves, magnets and electronic component embedding grooves.

[0039] Furthermore, in step S3, the conductive material is conductive ink or conductive glue.

[0040] A foldable circuit structure based on dual-material 3D printing is obtained by using the above method.

[0041] Compared with the prior art, the beneficial effects of the present invention are:

[0042] (1) Process simplification: By integrating the three major steps of design, printing, and assembly into a 3D printing device, complex processes such as welding and cutting are not required, significantly reducing the production difficulty and cost.

[0043] (2) Flexibility and rigidity combination: Using dual-material 3D printing technology, a rigid support structure is embedded on a flexible substrate, ensuring both the flexible deformable function and providing the necessary mechanical strength, suitable for complex application scenarios.

[0044] (3) Modular design: Through the magnetic connection method, the detachability and reusability of electronic components and circuit modules are achieved, with high scalability and maintainability, suitable for devices with long-term use or function expansion.

[0045] (4) Quick response and customization: Users can quickly customize the design according to their needs, and through simple operations, the customization and rapid production of intelligent products can be achieved to meet personalized needs. Brief Description of the Drawings

[0046] Figure 1 It is a flowchart of the manufacturing method of a foldable circuit structure based on dual-material 3D printing in an embodiment of the present invention.

[0047] Figure 2 It is a schematic diagram of the design software interface and the embedding slots for magnets and electronic components and circuit slots planned by CAD in an embodiment of the present invention.

[0048] Figure 3 It is a connection demonstration diagram of a deformable circuit in an embodiment of the present invention.

[0049] Figure 4 It is a flowchart of the automated preparation of a 3D printing model in an embodiment of the present invention.

[0050] Figure 5 It is a diagram of an actual application case of a foldable circuit structure in an embodiment of the present invention.

[0051] Figure 6 It is a diagram showing different modules of a foldable circuit structure in an embodiment of the present invention.

[0052] Figure 7 It is a flowchart of the production of a foldable table lamp in an embodiment of the present invention. Detailed Embodiments

[0053] The technical solutions of the present invention will be further clearly and detailedly described below in conjunction with the drawings and specific examples.

[0054] The present invention provides a manufacturing method of a foldable circuit structure based on dual-material 3D printing, including:

[0055] S1. Divide the foldable circuit structure into several circuit modules, and construct 3D printing models based on bimaterials for each circuit module through computer-aided design software; the 3D printing models use two types of materials, flexible materials and rigid materials. During the model construction process, design the ratio of flexible materials and rigid materials according to actual needs, and control the material thickness and distribution through pixelization technology.

[0056] S2. Add magnets and electronic component embedding slots to the 3D printing models of each circuit module, use the improved Dijkstra algorithm to plan the optimal path of the circuit slots, and then use the free-form deformation three-dimensional structure design method to design the deformable area;

[0057] The specific steps for using the improved Dijkstra algorithm to plan the optimal path of the circuit slots are as follows:

[0058] 1) Convert the magnets and electronic component embedding slots into several nodes, select a node as the starting point, and set the initial distance, predecessor node, and priority queue of the nodes;

[0059] 2) Use the Dijkstra algorithm to plan the circuit slots and add a path crossing detection mechanism;

[0060] 3) If it is detected that the path has a crossing, execute the crossing handling strategy; otherwise, update the shortest path information of the nodes;

[0061] 4) Use a heuristic evaluation mechanism to guide the path to avoid the crossing area, and dynamically adjust the route weight according to the generated path to adapt to complex layouts;

[0062] 5) After the node traversal is completed, trace back from the end point to the starting point to obtain the optimal path.

[0063] The path crossing detection mechanism is specifically: each time the distance from the current node to the adjacent node is calculated, detect whether the new path will cross the existing path.

[0064] The crossing handling strategy includes the following three strategies:

[0065] 1) Re-plan the path to avoid the crossing point;

[0066] 2) Optimize the path in subsequent calculations by increasing the weight of the crossing path;

[0067] 3) Layer the path at the physical level to avoid crossing by setting different layers.

[0068] The specific steps for using the free-form deformation three-dimensional structure design method to design the deformable area are as follows:

[0069] 1) Select the target area to be deformed in the 3D printing model and generate a control point grid within the target area;

[0070] 2) Define the multi-resolution influence range of the control points and set the weights of the control points;

[0071] 3) Set deformation parameters for the control points and implement the adjustment of the deformation intensity and direction;

[0072] 4) Use the interpolation algorithm to spread the displacement of the control points to the entire target area to make the deformation smooth and natural;

[0073] 5) Dynamically adjust the weights of the control points so that the weights of the control points are dynamically updated according to the moving distance of the control points;

[0074] 6) Set up a real-time feedback mechanism to display the deformation effect in real time.

[0075] S3. Use a dual-material 3D printing device to print all circuit modules according to the 3D printing model; specifically: by the way of layer-by-layer stacking, embed the rigid material into the flexible material, and simultaneously print out the circuit grooves, magnets and electronic component embedding grooves.

[0076] S4. Embed the magnets and electronic components into the magnet and electronic component embedding grooves respectively, and add conductive ink or conductive glue in the circuit grooves to connect the circuits;

[0077] S5. Connect the individual circuit modules through the magnets to obtain a foldable circuit structure.

[0078] Example 1

[0079] A manufacturing method of a foldable circuit structure based on dual-material 3D printing, the flowchart of which is as Figure 1 shown, including the following steps:

[0080] S1. As Figure 2As shown in the figure, the foldable circuit structure is divided into several circuit modules. The 3D printing models of each circuit module based on dual materials are constructed by computer-aided design software (CAD). Magnets and slots for embedding electronic components are added to the 3D printing models of each circuit module. The path of the circuit slot is planned and the deformable area is designed. Among them, the design process of the 3D printing model also includes: designing and adjusting the ratio of the flexible material and the rigid material according to specific requirements, and controlling the material thickness and distribution through pixelization technology. After adding magnets and slots for embedding electronic components to the 3D printing model, the improved Dijkstra algorithm is used to plan the optimal path of the circuit slot to ensure that the circuits do not cross each other. Then, the free-form deformation 3D structure design method is used to design the deformable area according to requirements. The above steps are all completed by the automated design software. Through the automated design software, users can quickly input design parameters and the number of models, automatically generate the 3D printing model of the deformable structure, and directly output the sliced file for printing through software calculation and optimization. The automated process simplifies the operation steps and is suitable for mass production and personalized customization. The automated design flow chart is as shown in Figure 3 the figure.

[0081] The specific steps for using the improved Dijkstra algorithm to plan the optimal path of the circuit slot are as follows:

[0082] 1) Import the module design drawing:

[0083] Import the design drawing of the circuit module in Grasshopper to ensure the visualization of the layout of the circuit slot and components.

[0084] Use the CAD drawing or graphic file to define the starting point, ending point, and obstacle positions to help the Dijkstra algorithm identify the constraints in the path planning.

[0085] 2) Create nodes and connections:

[0086] Divide the circuit slot path into multiple nodes to represent the key points on the path.

[0087] Establish connections (edges) between each node and assign weights to each edge according to the distance or path complexity.

[0088] 3) Initialize the weight matrix:

[0089] Use the matrix tool in Grasshopper to set the weight matrix for the edges between each node and its adjacent nodes.

[0090] Ensure that the weight matrix can reflect the distance of the path and the difficulty of bypassing obstacles to help the Dijkstra algorithm identify the optimal path.

[0091] 4) Set the starting point and ending point:

[0092] Specify the starting and ending nodes in GH to clarify the starting and ending points of the circuit slot path.

[0093] Use the parameter components in GH to pass the starting and ending nodes to the calculation module of Dijkstra's algorithm.

[0094] 5) Implement Dijkstra's algorithm:

[0095] Import the optimized Dijkstra's algorithm script component in Grasshopper and calculate the shortest path by looping through the nodes.

[0096] For each node, check its weight (distance) to other adjacent nodes and update the shortest path information from the starting point to the ending point.

[0097] Integrate the path crossing detection mechanism into the algorithm: When updating the path each time, detect whether the new path crosses the existing path. If it crosses, increase the weight of this path or recalculate.

[0098] 6) Path optimization and adjustment:

[0099] Ensure that the path selection avoids crossing points and obstacles as much as possible through heuristic evaluation and dynamic adjustment strategies.

[0100] Dynamically update the path weight in GH, adjust the weight according to the path crossing situation, and ensure that the generated path is reasonable in the physical layout.

[0101] 7) Output the optimal path:

[0102] Output the finally generated optimal path to the curve or polyline component in GH for visual display in Rhino software.

[0103] Mark the position and direction of the circuit slot on the final path to ensure that the circuit design meets the requirements.

[0104] The cross-processing strategy includes the following three strategies:

[0105] 1) Re-plan the path to avoid crossing points;

[0106] 2) Optimize the crossing path by increasing its weight so that this path is optimized out in subsequent calculations;

[0107] 3) At the physical level, avoid crossing by hierarchical wiring.

[0108] The specific steps for designing the deformable area using the free-form deformation three-dimensional structure design method are as follows:

[0109] 1) Select the target deformable area:

[0110] Select the area to be deformed from the imported model.

[0111] Use components such as "SubSurface" or "Cull Pattern" to extract the parts of the model that need to be deformed, ensuring that the FFD algorithm is applied only to this area.

[0112] 2) Generate a control point grid:

[0113] Generate a control point grid within the target area. The control points will be used to drive the deformation.

[0114] Use components such as "Divide Surface" or "Populate Geometry" to divide the model surface into a uniform grid to generate control points. The density of the control points can be adjusted according to the size of the area and the deformation requirements.

[0115] 3) Define the multi-resolution influence range of the control points:

[0116] Set the multi-resolution influence range of the control points to achieve flexible deformation control at different scales.

[0117] Use the "Distance" component to calculate the distance from the control points to the model points, and set weights according to the distance. The weight is high in the close range and low in the far range.

[0118] 4) Dynamically adjust the weights of the control points:

[0119] Implement dynamic adjustment of the weights of the control points to ensure that the areas close to the control points are more significantly affected, while the influence on the areas far away gradually decreases.

[0120] Use the script for optimizing the FFD algorithm above to recalculate the weights of the control points in each iteration, so that the weights are dynamically updated according to the distance when the control points move.

[0121] 5) Set the deformation parameters:

[0122] Use the "Number Slider" component to set deformation parameters such as displacement, rotation, or scaling for the control points.

[0123] The slider allows real-time adjustment of the deformation intensity and direction to achieve fine control of the deformation effect in subsequent operations.

[0124] 6) Apply interpolation to calculate the deformation effect:

[0125] Use the interpolation algorithm to spread the displacement of the control points to the entire deformation area, ensuring a smooth transition of the influence of the control points within the target area.

[0126] In GH, use "Mesh Warp" to apply the interpolation calculation between the control point positions and the model points to the entire mesh to generate a continuous deformation effect.

[0127] 7) Implement a real-time feedback mechanism:

[0128] Utilize the "Preview" component in GH to let users observe the effects immediately when adjusting the control points by displaying the deformation results in real time.

[0129] After adjusting the control points and slider parameters, immediately feedback to the model to ensure that users can evaluate and fine-tune the deformation effect instantaneously.

[0130] 8) Export the deformed model:

[0131] Use "Bake" to save the finally deformed model into the Rhino software, which is convenient for further design or exporting 3D printing files.

[0132] Export the model in a format supported by 3D printing (such as STL) to complete the design of the optimized deformed area.

[0133] S2. As Figure 4 shown, use a dual-material 3D printing device to print all circuit modules according to the 3D printing model; specifically include: by the way of layer-by-layer stacking, print flexible materials (such as TPU, TPE, etc.) and rigid materials (such as PLA, PETG, etc.) respectively, embed the rigid materials into the flexible materials to achieve the elastic deformability and mechanical strength of the product. In this process, the circuit grooves, magnets, and electronic component embedding grooves are also formed synchronously.

[0134] After printing is completed, embed the magnets and electronic components into the magnet and electronic component embedding grooves respectively, and add conductive ink or conductive glue in the circuit grooves to connect the circuits to make it achieve electrical functions; the magnets are used for modular physical connection and circuit connection, and combine each module through magnetic force to achieve the functions of detachable and expandable.

[0135] Connect each circuit module through magnets to obtain a foldable circuit structure. Each module is assembled into a complete system through magnetic connection to ensure the stability of electrical and mechanical structure connections. According to the needs, users can detach and replace different modules to achieve rapid expansion and customization of functions. Finally, conduct functional tests to ensure that the product can still work properly under multiple deformation states.

[0136] The present invention simplifies the production process. By introducing dual-material 3D printing technology, it simplifies the manufacturing process of deformable intelligent circuits and reduces the dependence on processes such as welding and cutting. It improves manufacturing efficiency and product performance. By embedding rigid materials in flexible materials, it ensures that the product is flexible and deformable while having sufficient mechanical strength to adapt to various application scenarios. The present invention designs a system based on magnetic module connection, enabling the product to be disassembled, assembled, and expanded even after embedding the circuit, further improving the maintainability and scalability of the product. By reducing manufacturing costs and simplifying the production process, the present invention enables non-professional users to easily design and manufacture intelligent deformable electronic products, which have good popularity and market prospects.

[0137] As Figure 5 shown, the present invention can be widely applied to the following specific scenarios:

[0138] 1. Intelligent desktop devices: By using deformable circuit design and modular installation, products such as desktop lamps and smart speakers that can adaptively deform can be manufactured, facilitating users to adjust the device form according to their needs.

[0139] 2. Wearable electronic devices: Embedding sensors and displays in flexible circuits to manufacture wearable devices such as stretchable and bendable smart bracelets and smart gloves to meet the personalized needs of different users.

[0140] 3. Medical and health devices: Manufacturing intelligent flexible medical devices, combined with deformable design, to provide personalized medical detection and rehabilitation products for patients.

[0141] 4. Foldable electronic devices: By modular assembly and foldable design, manufacturing devices such as smart players and mobile phones with portability and function expandability.

[0142] Embodiment 2

[0143] As Figures 6-7 shown, a fast-foldable table lamp, prepared based on the method in Embodiment 1, its manufacturing process includes the following steps:

[0144] a) Input model: The user imports a file in a supported format (such as STL, STEP, etc.), as Figure 2 (a);

[0145] b) Geometric analysis: Read and generate the mesh data of the model to ensure that the attributes of each face and voxel are presented;

[0146] c) Slot generation: The user selects points on the model surface and inputs the radius, and the system automatically uses Boolean operations (such as difference set, intersection, etc.) to cut off a part of the model to create slots, as Figure 2 (b);

[0147] d) Circuit slot generation: When the user determines the positions of the electronic components and the magnets, the system uses the Dijkstra algorithm to plan the optimal path and automatically generates non-crossing circuit slot paths. This enables the user to avoid manual circuit design and improves production efficiency, as shown in Figure 2 (c);

[0148] e) Deformation structure generation: After all the slots are calculated, the user selects the positions that need to be deformed, and the system performs local or global deformation control on the three-dimensional geometry through the FFD deformation algorithm, as shown in Figure 2 (d);

[0149] f) The user designs different functional modules through the software, including control modules, output modules, sensing modules, power supply modules, and deformation modules. All module bases are fabricated by 3D printing, as shown in Figure 6 ;

[0150] g) The user can choose to use a paintbrush or a syringe to apply conductive ink to the circuit slots of each module, as shown in Figure 7 (c);

[0151] h) After the conductive ink dries, the user directly embeds the magnets and electronic components into the previously reserved slots, as shown in Figure 7 (d);

[0152] i) Then, simply assemble the required modules using magnets to make it operational, as shown in Figure 7 (e).

[0153] After considering the specification and practicing the disclosure herein, those skilled in the art will readily conceive of other embodiments of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and examples are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the claims.

[0154] It should be understood that the present application is not limited to the calculation process solutions described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A manufacturing method of a foldable circuit structure based on dual-material 3D printing, characterized in that, It includes the following steps: S1. Divide the foldable circuit structure into several circuit modules, and construct 3D printing models based on dual materials for each circuit module through computer-aided design software; S2. Add magnets and electronic component embedding slots to the 3D printing models of each circuit module, use the improved Dijkstra algorithm to plan the optimal path of the circuit slots, and then adopt the free-form deformation three-dimensional structure design method to design the deformable regions; S3. Use a dual-material 3D printing device to print all circuit modules according to the 3D printing models; S4. Embed the magnets and electronic components into the magnet and electronic component embedding slots respectively, and add conductive materials in the circuit slots to connect the circuits; S5. Connect the various circuit modules through magnets to obtain a foldable circuit structure; The specific steps for planning the optimal path of the circuit slots by using the improved Dijkstra algorithm are as follows: 1) Convert the magnet and electronic component embedding slots into several nodes, select a node as the starting point, and set the initial distance, predecessor node, and priority queue of the nodes; 2) Use the Dijkstra algorithm to plan the circuit slots and add a path crossing detection mechanism; 3) If it is detected that there is a path crossing, execute the crossing processing strategy; Otherwise, update the shortest path information of the nodes; 4) Adopt a heuristic evaluation mechanism to guide the path to avoid the crossing area, and dynamically adjust the route weight according to the generated path to adapt to the complex layout; 5) After the node traversal is completed, trace back from the end point to the starting point to obtain the optimal path; The crossing processing strategy includes the following three strategies: 1) Re-plan the path to avoid the crossing point; 2) Optimize the path in subsequent calculations by increasing the weight of the crossing path; 3) Layer the path at the physical level to avoid crossing by setting different layers; The path crossing detection mechanism is specifically: each time the distance from the current node to the adjacent node is calculated, it is detected whether the new path will cross the existing path.

2. The manufacturing method of a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that The specific steps for designing the deformable region by adopting the free-form deformation three-dimensional structure design method are as follows: 1) Select the target region to be deformed in the 3D printing model, and generate a control point grid in the target region; 2) Define the multi-resolution influence range of the control points and set the weights of the control points; 3) Set deformation parameters for the control points to adjust the deformation intensity and direction; 4) Use the interpolation algorithm to spread the displacement of the control points to the entire target region to make the deformation smooth and natural; 5) Dynamically adjust the weights of the control points so that the weights of the control points are dynamically updated according to the moving distance of the control points; 6) Set a real-time feedback mechanism to display the deformation effect in real time.

3. The manufacturing method of a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that, In step S1, the design process of the 3D printing model further includes: designing the ratio of the flexible material and the rigid material, and controlling the material thickness and distribution through pixelization technology.

4. The manufacturing method of a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that, In step S2, the rigid material is embedded into the flexible material by means of layer-by-layer stacking printing, and at the same time, the circuit slots, magnet and electronic component embedding slots are printed.

5. The manufacturing method of a foldable circuit structure based on dual-material 3D printing according to claim 1, characterized in that, In step S3, the conductive material is conductive ink or conductive glue.

6. A foldable circuit based on dual-material 3D printing, characterized in that, It is prepared by using the method according to any one of claims 1 to 5.

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