Mechanical hand for semiconductor cleaning equipment

Abstract

The application belongs to the technical field of semiconductor processing, in particular to a mechanical hand for semiconductor cleaning equipment, which comprises an adapter component, a cleaning component is arranged below the adapter component, a reflux component is arranged at the bottom of the cleaning component, the adapter component comprises a segmented connecting plate, a water injection tank is fixedly connected to the middle of the upper surface of the segmented connecting plate, and water pipes are uniformly fixed to the bottom of the inner cavity of the water injection tank. The device can sequentially arrange single wafer slices in the inside of the outer protective shell through the adapter component, then independently limit all wafer slices in a smaller area through the combined docking component and the drainage component, and uniformly clean through the water pipes. Since the wafer slices are not affected by the clamping effect at this time, the outer surface of the wafer slices can be completely cleaned without dead angles. The limiting area can ensure that the wafer will not continuously impact the inner wall of the flower basket after being subjected to strong impact force, thereby avoiding damage problems.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor processing technology, specifically a robotic arm for semiconductor cleaning equipment. Background Technology

[0002] Existing cleaning processes typically involve immersing or rinsing wafers with liquid chemicals such as acids, alkalis, and organic compounds to clean surface particles, remove reactive polymers, and etch surface films. After cleaning the wafer surface particles with chemical liquids, deionized water is usually used to rinse away the chemical liquids. The cleaning of semiconductor wafer surfaces requires the use of specific cleaning equipment. Manual cleaning is insufficient to meet the precision and cleanliness requirements. Therefore, robotic arms need to be installed in the cleaning equipment to replace manual operation.

[0003] When using a robotic arm to hold wafers for cleaning, the wafers need to be placed into a cleaning basket for cleaning. In order to ensure the cleaning effect, the rinsing force on the wafers inside the basket is relatively large. As a result, after being subjected to strong impact, the wafers move irregularly along the inner wall of the basket, constantly hitting the inner wall of the basket. This causes damage to both the wafers and the basket due to the impact force, so improvements are needed. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the technical solution adopted by this invention is: a robotic arm for semiconductor cleaning equipment, comprising a transfer component, a cleaning component disposed below the transfer component, and a reflux component disposed at the bottom of the cleaning component;

[0005] The adapter includes a segmented connecting plate. A water tank is fixedly connected to the middle of the upper surface of the segmented connecting plate. Water pipes are uniformly fixed to the bottom of the inner cavity of the water tank. Scaled slide cylinders are symmetrically arranged on the left and right sides of the upper surface of the segmented connecting plate. A guide support rod is slidably connected to the axis of the inner wall of the scaled slide cylinder. The scaled slide cylinder can display the advancement length of the guide support rod through its scale, thereby controlling the downward sliding height of the cleaning component. Adapter arms are rotatably connected to both sides of the segmented connecting plate. A propulsion slide cylinder is rotatably connected to the bottom end of the adapter arm. A crystal suction cup is slidably connected to the axis of the propulsion slide cylinder. Drainage pipes are uniformly fixed to the back of the inner cavity of the water tank. The water tank is filled with cleaning fluid from the outside through the drainage pipes, then pressurized by the internal pump, and discharged through the water pipes.

[0006] The cleaning component includes an outer protective shell, with guide slides evenly arranged on the inner wall of the outer protective shell, docking components evenly arranged on the top of the inner wall of the outer protective shell, and drainage components evenly arranged on the bottom of the inner wall of the outer protective shell. Each drainage component is restricted to a fixed area on the inner wall of the outer protective shell by the guide slides, and the drainage component can only slide up and down along the inner wall of the outer protective shell.

[0007] Furthermore, the return flow component includes a water storage platform, with a long guide tube fixedly connected to the upper surface of the platform. A connecting hose is evenly distributed at the top of the inner cavity of the platform, and the top end of the connecting hose is fixedly connected to the bottom of the inner cavity of the outer protective shell via a fixing port. The bottom end of the water supply pipe is fixedly connected to the top of the inner cavity of the outer protective shell via a fixing port. The top of the guide support rod is fixedly connected to the ceiling via a fixing plate. There are five drainage components, and the outer surface of each drainage component is slidably connected to the inner wall of the outer protective shell via a guide slide rod.

[0008] Furthermore, the drainage component includes a long base rod, with a drying inner unit fixedly connected to the middle of the inner wall of the long base rod via a receiving groove, and the top of the drying inner unit extending to the outside of the long base rod via a connecting groove. An inner roller is rotatably connected to the top of the inner wall of the long base rod, and a semi-circular docking shell is fixedly connected to the top of the outer surface of the long base rod. Drainage ends are symmetrically arranged on the left and right sides of the middle of the inner wall of the semi-circular docking shell. The upper part of the long base rod has three layers: the uppermost layer is used to control the rotation of the inner roller, the middle layer is used for ventilation via the connecting groove, and the lower layer is used to house the drying inner unit.

[0009] Furthermore, the bottom end of the long base rod is fixedly connected to the inner wall of the long guide tube, the outer surface of the long base rod is slidably connected to the bottom of the inner cavity of the outer protective shell, and the outer surface of the semi-circular docking shell is slidably connected to the outer surface of the guide slide rod through an arc-shaped groove. The drain end includes a pressure-sensitive slide sleeve, the outer surface of which is fitted with a spring washer, and the bottom of the inner cavity of the pressure-sensitive slide sleeve is slidably connected to a fixed patch plate through a slide groove. The end of the fixed patch plate away from the spring washer is fixedly connected to the inner wall of the semi-circular docking shell, and the outer surface of the pressure-sensitive slide sleeve is slidably connected to the side of the inner cavity of the semi-circular docking shell. A pressure sensor is provided at the circular end of the pressure-sensitive slide sleeve. When the pressure-sensitive slide sleeve slides out from inside the semi-circular docking shell due to hydraulic pressure, the pressure-sensitive slide sleeves between adjacent drain components will squeeze each other, thereby triggering the pressure sensor.

[0010] Furthermore, the docking component includes a semi-circular fixed shell. Symmetrical wall-mounted side plates are fixed to the left and right sides of the inner wall of the semi-circular fixed shell. An arc-shaped spring is fixedly connected to the outer surface of the wall-mounted side plate near the water supply pipe, and a pressing side plate is fixedly connected to the side of the arc-shaped spring near the water supply pipe. Embedded brush heads are evenly distributed on the outer surface of the pressing side plate. Push rod side cylinders are symmetrically arranged on both sides of the inner cavity of the semi-circular fixed shell through through-holes. The outer surface of the push rod side cylinder is fixedly connected to the outer surface of the semi-circular fixed shell via a clip. The output shaft of the push rod side cylinder extends into the interior of the arc-shaped spring, and the output shaft of the push rod side cylinder is fixedly connected to the inner wall of the pressing side plate.

[0011] Furthermore, the outer surface of the semi-circular fixed shell is fixedly connected to the top of the inner wall of the outer protective shell, the bottom end of the water supply pipe is fixedly connected to the top of the inner cavity of the semi-circular fixed shell, the outer surface of the extrusion side plate is slidably connected to the inner wall of the semi-circular fixed shell, and the outer surface of the push rod side cylinder output shaft is slidably connected to the inner cavity of the wall-attached side plate.

[0012] The beneficial effects of this invention are as follows:

[0013] 1. This device can sequentially arrange individual wafers inside the outer protective shell through the adapter component, and then independently confine all wafers in a small area through the combined docking component and drainage component, and perform unified cleaning through the water pipe. Since the wafers are not affected by the clamping effect at this time, their outer surface can be completely cleaned without dead corners. The limiting area can ensure that the wafers will not continuously hit the inner wall of the basket after being subjected to strong impact, thereby avoiding damage problems.

[0014] 2. During the rinsing of the wafers, the inner rollers at the bottom rotate continuously, causing the wafers to rotate. At this time, the actual angle at which the wafers are rinsed changes continuously, thus solving the problem of dead corners of the wafers not being effectively cleaned. At the same time, the environment in which the inner rollers are located is also cleaned by the drying unit below, preventing the inner rollers from being immersed in liquid and causing corrosion.

[0015] 3. During the rinsing of wafers, the discharged waste liquid is guided downward through the side opening of the pressure-sensitive sleeve and then collected by the water storage platform below. Therefore, after the rinsing work stops, the pressure-sensitive sleeve will automatically plug into the fixed patch plate to block the drain port. Then, the internal rollers and wafers are dried by the drying unit to avoid the problem of the damp wafers oxidizing rapidly in the air.

[0016] 4. The extrusion side plates located inside the semi-circular fixed shell maintain a certain distance from the wafer under the thrust control of the push rod side cylinder. At the same time, in order to prevent the wafer from jumping excessively due to the impact of the liquid, the extrusion side plates on both sides limit the wafer. When the wafer rotates, the outer surface of the wafer will slide relative to the embedded brush head on the extrusion side plate, thereby further cleaning the impurities attached to the outer surface of the wafer. By controlling the distance of the extrusion side plates, the friction between the embedded brush head and the outer surface of the wafer can be changed, thereby making adaptive adjustments according to the actual thickness of the wafer. Attached Figure Description

[0017] Figure 1 This is the front view of the present invention;

[0018] Figure 2 This is a cross-sectional view of the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of the adapter component of the present invention;

[0020] Figure 4 This is a cross-sectional view of the cleaning component of the present invention;

[0021] Figure 5 This is a cross-sectional view of the cleaning component after the drainage component slides up in this invention;

[0022] Figure 6 This is a cross-sectional view of the drainage component of the present invention;

[0023] Figure 7 This is a schematic diagram of the structure of the drain end of the present invention;

[0024] Figure 8 This is a cross-sectional view of the docking component of the present invention.

[0025] In the diagram: 1. Adapter component; 2. Cleaning component; 3. Return component; 11. Segmented connecting plate; 12. Water tank; 13. Scale slide cylinder; 14. Guide support rod; 15. Water supply pipe; 16. Drainage pipe; 17. Adapter arm; 18. Propulsion slide cylinder; 19. Crystal suction cup; 21. Outer protective shell; 22. Guide slide rod; 31. Connecting hose; 32. Long guide cylinder; 33. Water storage base; 4. Docking component; 41. Semi-circular fixed shell; 42. Wall-mounted side plate; 43. Extrusion side plate; 44. Embedded brush head; 45. Push rod side cylinder; 5. Drainage component; 51. Long base rod; 52. Drying inner unit; 53. Connecting groove; 54. Inner roller; 55. Semi-circular docking shell; 56. Drainage end; 561. Pressure-sensing slide sleeve; 562. Spring washer; 563. Fixed patch plate. Detailed Implementation

[0026] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

[0027] Example 1, please refer to Figures 1-5 The present invention provides a technical solution: a robotic arm for semiconductor cleaning equipment, including a transfer component 1, a cleaning component 2 disposed below the transfer component 1, and a return component 3 disposed at the bottom of the cleaning component 2;

[0028] The adapter component 1 includes a segmented connecting plate 11. A water tank 12 is fixedly connected to the middle of the upper surface of the segmented connecting plate 11. A water supply pipe 15 is uniformly fixed to the bottom of the inner cavity of the water tank 12. A scale slide cylinder 13 is symmetrically arranged on the left and right sides of the upper surface of the segmented connecting plate 11. A guide support rod 14 is slidably connected to the axis of the inner wall of the scale slide cylinder 13. The scale slide cylinder 13 can display the pushing length of the guide support rod 14 through its scale, thereby controlling the sliding height of the cleaning component 2. An adapter arm 17 is rotatably connected to both the left and right sides of the segmented connecting plate 11. A push slide cylinder 18 is rotatably connected to the bottom end of the adapter arm 17. A crystal suction cup 19 is slidably connected to the axis of the push slide cylinder 18. A drainage pipe 16 is uniformly fixedly connected to the back of the inner cavity of the water tank 12. The water tank 12 adds cleaning liquid from the outside through the drainage pipe 16, and then pressurizes it through the internal pump body and discharges the cleaning liquid through the water supply pipe 15.

[0029] The cleaning component 2 includes an outer protective shell 21. Guide slide rods 22 are evenly arranged on the inner wall of the outer protective shell 21. A docking component 4 is evenly arranged on the top of the inner wall of the outer protective shell 21. Drainage component 5 is evenly arranged on the bottom of the inner wall of the outer protective shell 21. Each drainage component 5 is restricted to a fixed area on the inner wall of the outer protective shell 21 by the guide slide rods 22, and the drainage component 5 can only slide up and down along the inner wall of the outer protective shell 21.

[0030] The return flow component 3 includes a water storage base 33, with a long guide tube 32 fixedly connected to the upper surface of the water storage base 33. A connecting hose 31 is evenly arranged on the top of the inner cavity of the water storage base 33, and the top end of the connecting hose 31 is fixedly connected to the bottom of the inner cavity of the outer protective shell 21 through a fixing port. The bottom end of the water supply pipe 15 is fixedly connected to the top of the inner cavity of the outer protective shell 21 through a fixing port. The top of the guide support rod 14 is fixedly connected to the ceiling through a fixing plate. There are five drainage components 5, and the outer surface of each drainage component 5 is slidably connected to the inner wall of the outer protective shell 21 through a guide slide rod 22.

[0031] When using this device to clean semiconductor wafers, the connecting arms 17 on both sides are rotated via the segmented connecting plate 11. The connecting arms 17 then use the extendable push slide 18 and the wafer suction cup 19 to hold the external wafer in place, and then rotate to... Figure 3 In the vertical position shown, the output shaft of the traction segment connecting plate 11 and the extension of the push slide 18 is pulled so that the wafer can be inserted into the drainage component 5 in the middle. Then, wafers are installed on the drainage components 5 on both sides to ensure that each drainage component 5 is equipped with a wafer.

[0032] After the feeding operation is completed, the guide support rod 14 pushes the scale slide cylinder 13 downward, pressing down the outer protective shell 21 through the segmented connecting plate 11. At this time, the outer protective shell 21 slides down relative to the drainage component 5, and the drainage component 5 merges with the docking component 4 above, as shown. Figure 5 As shown, after completing the preparation work, the water tank 12 pressurizes and discharges the cleaning solution inside the outer protective shell 21 directly through the water supply pipe 15. After the diversion effect of the water supply pipe 15, the cleaning solution is evenly distributed to each docking component 4 to clean the internal wafers. Then, the wastewater is discharged through the drainage component 5. At this time, the wastewater will flow to the bottom of the inner wall of the outer protective shell 21 and then flow back to the interior of the water storage base 33 through the connecting hose 31 to realize the wastewater recycling work.

[0033] Example 2, please refer to Figures 1-8 The present invention provides a technical solution: Based on embodiment one, the drainage component 5 includes a long bottom rod 51, the middle part of the inner wall of the long bottom rod 51 is fixedly connected to the drying inner unit 52 through the receiving groove, and the top of the drying inner unit 52 extends to the outside of the long bottom rod 51 through the connecting groove 53. The top of the inner wall of the long bottom rod 51 is rotatably connected to the inner roller 54, and the top of the outer surface of the long bottom rod 51 is fixedly connected to the semi-circular docking shell 55. The left and right sides of the middle part of the inner wall of the semi-circular docking shell 55 are symmetrically arranged with drainage ends 56. The upper part of the long bottom rod 51 is a three-layer area. The uppermost area is used to control the rotation of the inner roller 54, the middle layer is used for ventilation through the connecting groove 53, and the lower layer is used to house the drying inner unit 52.

[0034] The bottom end of the long bottom rod 51 is fixedly connected to the inner wall of the long guide tube 32, and the outer surface of the long bottom rod 51 is slidably connected to the bottom of the inner cavity of the outer protective shell 21. The outer surface of the semi-circular docking shell 55 is slidably connected to the outer surface of the guide slide rod 22 through an arc-shaped groove. The drain end 56 includes a pressure-sensing slide sleeve 561. A spring washer 562 is sleeved on the outer surface of the pressure-sensing slide sleeve 561. A fixed patch plate 563 is slidably connected to the bottom of the inner cavity of the pressure-sensing slide sleeve 561 through a slide groove. The end of the fixed patch plate 563 away from the spring washer 562 is fixedly connected to the inner wall of the semi-circular docking shell 55. The outer surface of the pressure-sensing slide sleeve 561 is slidably connected to the side of the inner cavity of the semi-circular docking shell 55. A pressure sensor is provided at the circular end of the pressure-sensing slide sleeve 561. When the pressure-sensing slide sleeve 561 slides out from the inside of the semi-circular docking shell 55 due to hydraulic action, the pressure-sensing slide sleeves 561 between adjacent drain components 5 will squeeze each other, thereby triggering the pressure sensor.

[0035] The docking component 4 includes a semi-circular fixed shell 41. Side plates 42 are symmetrically fixed to the left and right sides of the inner wall of the semi-circular fixed shell 41. An arc-shaped spring is fixedly connected to the outer surface of the side plate 42 near the water supply pipe 15, and a pressing side plate 43 is fixedly connected to the side of the arc-shaped spring near the water supply pipe 15. Embedded brush heads 44 are evenly distributed on the outer surface of the pressing side plate 43. Push rod side cylinders 45 are symmetrically arranged on both sides of the inner cavity of the semi-circular fixed shell 41 through through-holes. The outer surface of the push rod side cylinder 45 is fixedly connected to the outer surface of the semi-circular fixed shell 41 through a bracket. The output shaft of the push rod side cylinder 45 extends into the interior of the arc-shaped spring, and the output shaft of the push rod side cylinder 45 is fixedly connected to the inner wall of the pressing side plate 43.

[0036] The outer surface of the semi-circular fixed shell 41 is fixedly connected to the top of the inner wall of the outer protective shell 21, the bottom end of the water supply pipe 15 is fixedly connected to the top of the inner cavity of the semi-circular fixed shell 41, the outer surface of the extrusion side plate 43 is slidably connected to the inner wall of the semi-circular fixed shell 41, and the outer surface of the output shaft of the push rod side cylinder 45 is slidably connected to the inner cavity of the wall-attached side plate 42.

[0037] During the wafer cleaning process, the wafer is placed inside the semi-circular mating shell 55. When the semi-circular mating shell 55 is joined with the upper semi-circular fixing shell 41, the wafer is surrounded by the assembled circular shell and then rinsed clean by the cleaning fluid sprayed downwards from the water pipe 15. During this process, the inner roller 54 at the bottom starts to rotate, and drives the wafer to rotate through rolling friction, thereby changing the rinsing angle of the cleaning fluid. After the processing is completed, in order to avoid the inner roller 54 from being immersed in the liquid and causing corrosion, the drying unit 52 at the bottom performs water absorption and drying work on the area where the inner roller 54 is located through the connecting groove 53.

[0038] When the water supply pipe 15 is pressurized by injecting liquid into the combined circular shell, the pressure-sensing sleeves 561 located on both sides of the semi-circular docking shell 55 will slide outwards due to hydraulic pressure. At this time, the spring washer 562 on the outer surface of the pressure-sensing sleeve 561 is compressed, and when the pressure-sensing sleeve 561 slides outwards, the fixed patch plate 563 at the bottom always remains relatively fixed. Therefore, the notch at the bottom of the pressure-sensing sleeve 561 will gradually open, thereby guiding the flushed cleaning liquid downwards and discharging it out.

[0039] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A robotic arm for a semiconductor cleaning device, comprising a transfer component (1), a cleaning component (2) disposed below the transfer component (1), and a return component (3) disposed at the bottom of the cleaning component (2), characterized in that: The adapter (1) includes a segmented connecting plate (11), a water tank (12) is fixedly connected to the middle of the upper surface of the segmented connecting plate (11), a water supply pipe (15) is uniformly fixed to the bottom of the inner cavity of the water tank (12), and scale slide cylinders (13) are symmetrically arranged on the left and right sides of the upper surface of the segmented connecting plate (11). A guide support rod (14) is slidably connected to the axis of the inner wall of the scale slide cylinder (13). The segmented connecting plate (11) is rotatably connected to both the left and right sides by a transition arm (17), the bottom end of the transition arm (17) is rotatably connected to a propulsion slide (18), the axis of the propulsion slide (18) is slidably connected to a crystal suction cup (19), and the back of the inner cavity of the water injection tank (12) is uniformly fixedly connected to a drainage pipe (16). The cleaning component (2) includes an outer protective shell (21), the inner wall of the outer protective shell (21) is uniformly provided with guide slide rods (22), the top of the inner wall of the outer protective shell (21) is uniformly provided with docking components (4), and the bottom of the inner wall of the outer protective shell (21) is uniformly provided with drainage components (5).

2. The robotic arm for semiconductor cleaning equipment according to claim 1, characterized in that: The return component (3) includes a water storage base (33), and a long guide tube (32) is fixedly connected to the upper surface of the water storage base (33). A connecting hose (31) is evenly arranged at the top of the inner cavity of the water storage base (33), and the top end of the connecting hose (31) is fixedly connected to the bottom of the inner cavity of the outer protective shell (21) through a fixing port.

3. The robotic arm for semiconductor cleaning equipment according to claim 2, characterized in that: The bottom end of the water pipe (15) is fixedly connected to the top of the inner cavity of the outer protective shell (21) through a fixed port. The top of the guide support rod (14) is fixedly connected to the ceiling through a fixed plate. There are five drainage components (5), and the outer surface of the drainage component (5) is slidably connected to the inner wall of the outer protective shell (21) through a guide slide rod (22).

4. The robotic arm for semiconductor cleaning equipment according to claim 3, characterized in that: The drainage component (5) includes a long bottom rod (51). The inner wall of the long bottom rod (51) is fixedly connected to the drying inner unit (52) through a receiving groove. The top of the drying inner unit (52) extends to the outside of the long bottom rod (51) through a connecting groove (53). The top of the inner wall of the long bottom rod (51) is rotatably connected to an inner roller (54). The top of the outer surface of the long bottom rod (51) is fixedly connected to a semi-circular docking shell (55). Drainage ends (56) are symmetrically arranged on the left and right sides of the inner wall of the semi-circular docking shell (55).

5. The robotic arm for semiconductor cleaning equipment according to claim 4, characterized in that: The bottom end of the long bottom rod (51) is fixedly connected to the inner wall of the long guide tube (32), the outer surface of the long bottom rod (51) is slidably connected to the bottom of the inner cavity of the outer protective shell (21), and the outer surface of the semi-circular docking shell (55) is slidably connected to the outer surface of the guide slide rod (22) through an arc-shaped groove.

6. The robotic arm for semiconductor cleaning equipment according to claim 5, characterized in that: The drain end (56) includes a pressure-sensitive sliding sleeve (561), and a spring washer (562) is fitted on the outer surface of the pressure-sensitive sliding sleeve (561). A fixed patch plate (563) is slidably connected to the bottom of the inner cavity of the pressure-sensitive sliding sleeve (561) through a sliding groove. The end of the fixed patch plate (563) away from the spring washer (562) is fixedly connected to the inner wall of the semi-circular docking shell (55). The outer surface of the pressure-sensitive sliding sleeve (561) is slidably connected to the side of the inner cavity of the semi-circular docking shell (55).

7. The robotic arm for semiconductor cleaning equipment according to claim 1, characterized in that: The docking component (4) includes a semi-circular fixed shell (41). The left and right sides of the inner wall of the semi-circular fixed shell (41) are symmetrically fixed with wall-adhering side plates (42). An arc-shaped spring is fixedly connected to the outer surface of the wall-adhering side plate (42) near the water supply pipe (15), and a squeezing side plate (43) is fixedly connected to the side of the arc-shaped spring near the water supply pipe (15). Embedded brush heads (44) are uniformly arranged on the outer surface of the squeezing side plate (43).

8. The robotic arm for semiconductor cleaning equipment according to claim 7, characterized in that: The inner cavity of the semi-circular fixed shell (41) is symmetrically provided with push rod side cylinders (45) through through openings on both sides. The outer surface of the push rod side cylinder (45) is fixedly connected to the outer surface of the semi-circular fixed shell (41) through a bracket. The output shaft of the push rod side cylinder (45) extends into the interior of the arc spring, and the output shaft of the push rod side cylinder (45) is fixedly connected to the inner wall of the extrusion side plate (43).

9. The robotic arm for semiconductor cleaning equipment according to claim 8, characterized in that: The outer surface of the semicircular fixed shell (41) is fixedly connected to the top of the inner wall of the outer protective shell (21), the bottom end of the water pipe (15) is fixedly connected to the top of the inner cavity of the semicircular fixed shell (41), the outer surface of the extrusion side plate (43) is slidably connected to the inner wall of the semicircular fixed shell (41), and the outer surface of the output shaft of the push rod side cylinder (45) is slidably connected to the inner cavity of the wall-mounted side plate (42).

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