Chip removing device and chip production line

Abstract

The invention belongs to the technical field of semiconductors, and discloses a chip removing device and a chip production line. The chip removing device comprises a film scraping mechanism, a lower ejector pin mechanism, a film adhering mechanism and an upper ejector pin mechanism, the film scraping mechanism comprises a first driving assembly and a film scraping carrying table, and the first driving assembly can drive the film scraping carrying table to be switched between a film feeding position and a waste removing position and can change the position of the film scraping carrying table in the horizontal direction; the lower ejector pin mechanism is arranged on the lower side of the waste removing position and comprises a lower ejector pin and a first lifting driving part, and the first lifting driving part can drive the lower ejector pin to ascend; the mucous membrane mechanism comprises a second driving mechanism, a mucous membrane mounting piece and a mucous membrane, the mucous membrane is mounted on the mucous membrane mounting piece, and the lower side of the mucous membrane is viscous; the upper ejector pin mechanism comprises an upper ejector pin and a second lifting driving piece, and the second lifting driving piece can drive the upper ejector pin to descend. According to the chip removing device and the chip production line, the error rate in the chip removing process can be reduced, and the chip removing efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a chip rejecting device and a chip production line. Background Art

[0002] In the field of technology, semiconductor chips are developing rapidly, and industries and equipment related to semiconductor chips have also entered a mature stage. MinLED chip shipment inspection consists of two processes: inspection and selection. The appearance defect inspection of MinLED chips includes: twins, misaligned arrangement, skewed angles, vertical crystals, severe dirt, broken crystals, severe scratches on electrodes, special areas of photolithography, more gold, less gold. The general chip selection is to use the cam mechanism of the upper ejector to control the up and down movement of the suction nozzle to absorb the chip, and then the upper ejector structure puts the NG chip into the waste tray. Many similar equipment focuses on the chip detection function, such as self-developed algorithms and strong defect detection capabilities, but AOI does not have the high inspection requirements of the front-end process. Selection is the core of the entire equipment. There are many problems with the above chip selection methods.

[0003] The cam mechanism of the upper ejector controls the up and down movement of the nozzle to pick up the chip, and then puts the NG chip into the waste tray. This MinLED chip selection method has many problems, especially when the appearance defects of the chip are twins, broken crystals, and vertical crystals, then the nozzle will miss the chip, the chip is broken and not completely picked up, and the suction area is insufficient, resulting in failure. In addition, this selection method is inefficient and there is a probability that the picked chip will fall.

[0004] In addition, the traditional way of removing waste relies on adsorption to remove damaged chips. The upper ejector pin needs to be moved from the chip to the waste box, and then the negative pressure is removed, and the damaged chip falls into the waste box. This method has low working efficiency and time is wasted on the transfer of waste.

[0005] Therefore, it is urgent to design a chip rejection device and a chip production line to solve the above problems. Summary of the invention

[0006] An object of the present invention is to provide a chip rejection device, which can reduce the error rate in the chip rejection process and improve the efficiency of chip rejection, thereby shortening the chip rejection time.

[0007] Another object of the present invention is to provide a chip production line that can reduce the error rate in the chip rejection process, improve the efficiency of chip rejection, and shorten the chip rejection time.

[0008] To achieve this object, the present invention adopts the following technical solutions:

[0009] Chip rejection device, comprising:

[0010] The film enclosing mechanism comprises a first driving component and a film enclosing platform, wherein the film enclosing platform is used to carry and flatten a film sheet with a plurality of chips mounted on the upper side, and the first driving component can drive the film enclosing platform to switch between a film loading position and a waste rejection position and can change the position of the film enclosing platform in the horizontal direction;

[0011] A lower ejector mechanism is arranged at the lower side of the waste rejection position, the lower ejector mechanism comprises a lower ejector and a first lifting drive member, the first lifting drive member can drive the lower ejector to rise so that the head of the lower ejector abuts against the lower side of the diaphragm;

[0012] The mucosa mechanism comprises a second driving mechanism, a mucosa mounting member and a mucosa, wherein the mucosa is mounted on the mucosa mounting member and has a sticky lower side, and the second driving mechanism can drive the mucosa mounting member to switch between the position above the waste rejection position and the film unloading position;

[0013] An upper ejector mechanism is arranged on the upper side of the above-mentioned waste rejection position. The upper ejector mechanism includes an upper ejector and a second lifting drive member. The second lifting drive member can drive the upper ejector to descend so that the upper ejector can push against the mucosa and partially press the mucosa against the lower ejector and stick the chip.

[0014] As an optional solution, the first driving assembly includes a first driving member and a second driving member, one of the first driving member and the second driving member can output movement in the X direction, and the other can output movement in the Y direction, the second driving member is connected to the output end of the first driving member, the film carrier is installed at the output end of the second driving member, and the Y direction is perpendicular to the X direction.

[0015] As an optional solution, the above-mentioned film carrier includes:

[0016] The carrier bottom plate is connected to the output end of the second driving member;

[0017] The clamping assembly comprises a first bottom plate, a film enclosing ring, a connecting piece and a pressing assembly, wherein the first bottom plate is connected to the upper side of the carrier bottom plate, the pressing assembly is connected to the lower side of the first bottom plate, the output end of the pressing assembly passes through the first bottom plate, the connecting piece is located on the upper side of the first bottom plate and connected to the output end of the pressing assembly, the film enclosing ring is provided with the flattened film sheet, and the pressing assembly can pull the connecting piece downward to clamp the film enclosing ring between the first bottom plate and the connecting piece;

[0018] A separation driving member is installed on the above-mentioned platform bottom plate. The above-mentioned separation driving member can output movement along the Z direction to abut against the lower side of the above-mentioned connecting member and overcome the pulling force of the above-mentioned pressing component to lift up the above-mentioned connecting member.

[0019] As an optional solution, the above-mentioned pressing component includes:

[0020] A linear bearing is connected to the lower side of the first bottom plate, and the inner shaft of the linear bearing is correspondingly connected to the connecting member;

[0021] A limiter connected to the lower end of the linear bearing;

[0022] The elastic member is sleeved on the outer circumference of the linear bearing, and one end of the elastic member abuts against the mounting flange of the linear bearing, and the other end abuts against the limiting member.

[0023] As an optional solution, the above-mentioned film carrier further includes a rotation drive assembly, the lower side of the above-mentioned first bottom plate is connected to a first shaft, the above-mentioned first shaft is pivotally connected to the above-mentioned carrier bottom plate, and the above-mentioned rotation drive assembly includes:

[0024] A rotating driving member is mounted on the above-mentioned carrier bottom plate and has an output shaft;

[0025] An idler wheel is pivotally connected to the platform bottom plate, and the centers of the rotation driving member, the idler wheel and the first bottom plate are arranged in a triangle;

[0026] The transmission belt is arranged around the output shaft, the idler wheel and the outer side of the first shaft and is tensioned by the three together.

[0027] As an optional solution, the chip rejection device further includes a visual detection mechanism, which is used to detect damaged chips and is communicatively connected with the first driving component.

[0028] As an optional solution, the upper ejector pin includes an upper ejector pin body and a first needle head, the upper ejector pin body is connected to the output end of the second lifting drive member, the first needle head is connected to the other end of the upper ejector pin body, and the head area of ​​the first needle head is smaller than the area of ​​the chip; and / or

[0029] The lower ejector pin comprises a lower ejector pin body and a second needle head. The lower ejector pin body is connected to the output end of the first lifting drive member. The second needle head is connected to the other end of the lower ejector pin body. The head area of ​​the second needle head is smaller than the area of ​​the chip.

[0030] As an optional solution, the upper ejector body and the first needle are in floating connection; and / or

[0031] The lower ejector body and the second needle head are in floating connection.

[0032] As an optional solution, the second driving mechanism includes:

[0033] a third driving member and a fourth driving member, wherein one of the third driving member and the fourth driving member can output motion in the Y direction, and the other of the third driving member and the fourth driving member can output motion in the X direction, and the fourth driving member is installed at the output end of the third driving member;

[0034] a fifth driving member connected to the output end of the fourth driving member, the fifth driving member being capable of outputting movement along the Z direction, the X direction, the Y direction and the Z direction being perpendicular to each other, and the mucosa mounting member being connected to the output end of the fifth driving member;

[0035] A manual slide has one side connected to the output end of the fourth driving member and the other side connected to the mucosal mounting member.

[0036] A chip production line comprises the above-mentioned chip rejecting device.

[0037] The beneficial effects of the present invention are:

[0038] The present invention provides a chip rejection device, which is provided with a mucosa mechanism, when the second driving mechanism drives the mucosa to the rejection position, at the same time, the first driving component drives the film carrier to the rejection position, the first lifting driving member drives the lower ejector pin to reach below the rejection position, the second lifting driving member drives the upper ejector pin to reach above the mucosa and face the lower ejector pin, and the first driving component drives the film carrier to change its position in the horizontal direction so that the defective chip corresponds to the upper ejector pin and the lower ejector pin. At this time, the first lifting driving member drives the lower ejector pin to rise, and the second lifting driving member drives the upper ejector pin to fall, which is equivalent to the upper ejector pin and the lower ejector pin sandwiching the mucosa, the defective chip and the diaphragm therein. Since the sticky side of the mucosa contacts the defective chip, when the upper ejector pin and the lower ejector pin move away from each other, the defective chip is separated from the diaphragm and adheres to the mucosa, completing one rejection, and the first driving component horizontally adjusts the position of the film carrier again so that another defective chip corresponds to the upper ejector pin. The upper and lower ejector pins are aligned with each other, and the upper and lower ejector pins clamp the mucous membrane, the defective chip and the diaphragm again to complete the rejection of another defective chip. After performing multiple rejection operations, the defective chips on the current diaphragm are all adhered to the mucous membrane, and the second driving mechanism drives the mucous membrane mounting part to reach the film unloading position, and the mucous membrane or the mucous membrane mounting part is uniformly removed and replaced with a new one. At the same time, the first driving component drives the film carrier back to the upper film position to replace another diaphragm to be rejected. The rejection process in the prior art all adopts adsorption means, which adsorbs a defective chip and then transfers it to the waste box, and then returns to the adsorption position. For a diaphragm, there are many defective chips. The process of adsorption and transfer is easy to destroy good products and increase the operation time. The solution of this embodiment greatly saves the rejection time. At the same time, the adhesion method reduces the error rate and the impact on the good chips around the defective chip compared with the adsorption method.

[0039] The present invention also provides a chip production line, comprising the above chip rejection device. The chip production line can reduce the error rate in the chip rejection process, improve the efficiency of chip rejection, and shorten the chip rejection time by adopting the above chip rejection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a schematic structural diagram of a chip rejection device provided in an embodiment of the present invention;

[0041] Figure 2 is a structural schematic diagram of a membrane bracket mechanism provided in an embodiment of the present invention;

[0042] Figure 3 Schematic diagram of the structure of the film carrier provided by the embodiment of the present invention;

[0043] Figure 4 yes Figure 3 The enlarged view of point A in the middle;

[0044] Figure 5 is a structural schematic diagram of an upper ejector mechanism provided by an embodiment of the present invention;

[0045] Figure 6 is a schematic structural diagram of an upper ejector pin provided in an embodiment of the present invention;

[0046] Figure 7 is a structural schematic diagram of a lower ejector mechanism provided by an embodiment of the present invention;

[0047] Figure 8 is a schematic structural diagram of a mucosal mechanism provided by an embodiment of the present invention;

[0048] Fig. 9 yes Figure 8 Enlarged view of point B in the middle.

[0049] In the figure:

[0050] 10. film enveloping mechanism; 11. first driving assembly; 111. first driving member; 112. second driving member; 12. film enveloping stage; 121. stage bottom plate;

[0051] 122, clamping assembly; 1221, first bottom plate; 1222, membrane ring; 1225, connecting member; 1223, pressing assembly; 12231, linear bearing; 12232, limiting member; 12233, elastic member; 1224, first axis;

[0052] 123, separation drive member; 124, rotation drive assembly; 1241, rotation drive member; 1242, idler wheel; 1243, transmission belt;

[0053] 20. lower ejector mechanism; 21. lower ejector; 211. lower ejector body; 212. second needle head; 22. first lifting drive member;

[0054] 30. Mucosal mechanism; 31. Second driving mechanism; 311. Third driving member; 312. Fourth driving member; 313. Fifth driving member; 314. Manual slide; 32. Mucosal mounting member; 33. Mucosal membrane;

[0055] 40. upper ejector mechanism; 41. upper ejector; 411. upper ejector body; 412. first needle head; 42. second lifting drive member;

[0056] 50. Visual inspection agency. DETAILED DESCRIPTION

[0057] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0058] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0060] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0061] This embodiment provides a chip rejection device, which can reduce the error rate in the chip rejection process and improve the efficiency of chip rejection, thereby shortening the chip rejection time. Figure 1 and Figure 2 As shown, the chip rejection device includes a film enveloping mechanism 10, a lower ejector mechanism 20, a film sticking mechanism 30 and an upper ejector mechanism 40. The film enveloping mechanism 10 includes a first driving component 11 and a film enveloping platform 12. The film enveloping platform 12 is used to carry and flatten a film sheet with a plurality of chips mounted on the upper side. The first driving component 11 can drive the film enveloping platform 12 to switch between a film upper position and a waste rejection position and can change the position of the film enveloping platform 12 in the horizontal direction; the lower ejector mechanism 20 is arranged at the lower side of the waste rejection position, and the lower ejector mechanism 20 includes a lower ejector 21 and a first lifting drive member 22 (see Figure 7 ), the first lifting drive member 22 can drive the lower ejector 21 to rise so that the head of the lower ejector 21 abuts against the lower side of the film; the mucosa mechanism 30 includes a second driving mechanism 31, a mucosa mounting member 32 and a mucosa 33, the mucosa 33 is mounted on the mucosa mounting member 32 and has a sticky lower side, the second driving mechanism 31 can drive the mucosa mounting member 32 to switch between the upper waste rejection position and the film unloading position; the upper ejector mechanism 40 is arranged on the upper side of the waste rejection position, and the upper ejector mechanism 40 includes an upper ejector 41 and a second lifting drive member 42 (see Figure 5 and Figure 6 ), the second lifting drive member 42 can drive the upper ejector pin 41 to descend so that the upper ejector pin 41 can push against the mucosa 33 and make the local mucosa 33 press against the lower ejector pin 21 and stick the chip.

[0062] The chip rejection device is provided with the mucofilm mechanism 30. When the second driving mechanism 31 drives the mucofilm 33 to reach the rejection position, the first driving component 11 drives the film carrier 12 to reach the rejection position. The first lifting driving member 22 drives the lower ejector pin 21 to reach below the rejection position. The second lifting driving member 42 drives the upper ejector pin 41 to reach above the mucofilm 33 and face the lower ejector pin 21. The first driving component 11 then drives the film carrier 12 to change its position in the horizontal direction so that the defective chip is separated from the upper ejector pin 41 and The lower ejector pin 21 corresponds to the first lifting drive member 22. At this time, the lower ejector pin 21 is driven upward by the first lifting drive member 22, and the upper ejector pin 41 is driven downward by the second lifting drive member 42, which is equivalent to the upper ejector pin 41 and the lower ejector pin 21 sandwiching the mucous membrane 33, the defective chip and the film. Since the sticky side of the mucous membrane 33 contacts the defective chip, when the upper ejector pin 41 and the lower ejector pin 21 move away from each other, the defective chip is separated from the film and adheres to the mucous membrane 33, completing a waste rejection. The first driving component 11 horizontally adjusts the film carrier 12 again. The position makes another defective chip face the upper ejector pin 41 and the lower ejector pin 21, and the upper ejector pin 41 and the lower ejector pin 21 clamp the mucous membrane 33, the defective chip and the diaphragm again to complete the rejection of another defective chip. After performing multiple rejection operations, the defective chips on the current diaphragm are all adhered to the mucous membrane 33, and the second driving mechanism 31 drives the mucous membrane mounting member 32 to reach the unloading position, and the mucous membrane 33 or the mucous membrane mounting member 32 is uniformly removed and replaced with a new one. At the same time, the first driving component 11 drives the film carrier 12 back to the upper film position to replace another diaphragm to be rejected. The rejection process in the prior art all adopts adsorption means, which adsorbs a defective chip and then transfers it to the waste box, and then returns to the adsorption position. For a diaphragm, there are many defective chips. The process of adsorption and transfer is easy to destroy good products and increase the operation time. The solution of this embodiment greatly saves the rejection time. At the same time, the adhesion method reduces the error rate and the impact on the good chips around the defective chip compared with the adsorption method.

[0063] Alternatively, if Figure 2As shown, the first driving component 11 includes a first driving member 111 and a second driving member 112. The first driving member 111 can output movement in the X direction, and the second driving member 112 can output movement in the Y direction. The second driving member 112 is connected to the output end of the first driving member 111, and the film carrier 12 is installed at the output end of the second driving member 112, and the Y direction is perpendicular to the X direction. Through the above arrangement, the movement adjustment of the film carrier 12 in the horizontal direction, as well as the adjustment of the waste rejection position and the film upper position can be achieved. In another embodiment, the first driving member 111 outputs movement in the Y direction, and the second driving member 112 outputs movement in the X direction, which can also achieve the above effect, which is not limited here. In this embodiment, the first driving member 111 and the second driving member 112 are both linear modules. In other embodiments, the first driving member 111 and the second driving member 112 can also be driving elements such as cylinders that can output linear motion, which are not limited here.

[0064] Alternatively, if Figure 3 As shown, the film carrier 12 includes a carrier bottom plate 121, a clamping assembly 122 and a separation drive member 123, the carrier bottom plate 121 is connected to the output end of the second drive member 112; the clamping assembly 122 includes a first bottom plate 1221, a film ring 1222, a connecting member 1225 and a pressing assembly 1223, the first bottom plate 1221 is connected to the upper side of the carrier bottom plate 121, the pressing assembly 1223 is connected to the lower side of the first bottom plate 1221, the output end of the pressing assembly 1223 passes through the first bottom plate 1221, and the connecting member 1 225 is located on the upper side of the first bottom plate 1221 and is connected to the output end of the pressing assembly 1223. A flattened diaphragm is provided on the membrane ring 1222. The pressing assembly 1223 can pull the connecting member 1225 downward to clamp the membrane ring 1222 between the first bottom plate 1221 and the connecting member 1225. The separation driving member 123 is installed on the carrier bottom plate 121. The separation driving member 123 can output movement along the Z direction to abut against the lower side of the connecting member 1225 and overcome the pulling force of the pressing assembly 1223 to lift the connecting member 1225. Through the above arrangement, when the encapsulation ring 1222 is installed, the output end of the separation driving member 123 extends out to lift the connecting member 1225, so that the distance between the connecting member 1225 and the first bottom plate 1221 is sufficient to extend an encapsulation ring 1222. After the encapsulation ring 1222 is placed on the first bottom plate 1221, the output end of the separation driving member 123 retracts, and under the action of the downward pressure of the pressing component 1223, the connecting member 1225 presses the encapsulation ring 1222 onto the first bottom plate 1221 and is fixed.

[0065] Optionally, two connecting members 1225 are provided, and each connecting member 1225 is correspondingly provided with a pressing component 1223 and a separation driving member 123 to ensure that the forces at both ends of the encapsulating ring 1222 are balanced when the encapsulating ring 1222 is pressed.

[0066] Alternatively, if Figure 3 and Figure 4 As shown, the pressing assembly 1223 includes a linear bearing 12231, a limiting member 12232 and an elastic member 12233. The linear bearing 12231 is connected to the lower side of the first base plate 1221, and the inner shaft of the linear bearing 12231 is correspondingly connected to the connecting member 1225; the limiting member 12232 is connected to the lower end of the linear bearing 12231; the elastic member 12233 is sleeved on the outer periphery of the linear bearing 12231, and one end abuts against the mounting flange of the linear bearing 12231, and the other end abuts against the limiting member 12232. It should be noted that the linear bearing 12231 in the figure is marked as a mounting part. The top of the moving end of the linear bearing 12231 is connected to the connecting member 1225, and the bottom is connected to the limiting member 12232. The elastic force of the elastic member 12233 forces the moving end of the linear bearing 12231 to move downward, thereby pressing the connecting member 1225 against the first base plate 1221. When the output end of the separation drive member 123 is extended, the moving end of the linear bearing 12231 is upward, and the elastic member 12233 is compressed.

[0067] In other embodiments, the pressing component 1223 may also be a spring cylinder, etc., which is not limited here.

[0068] In this embodiment, the separation driving member 123 is a cylinder. In other embodiments, the separation driving member 123 may also be other driving elements that can output linear motion, which is not limited here.

[0069] Alternatively, if Figure 3 As shown, the film carrier 12 also includes a rotation driving component 124, a first shaft 1224 is connected to the lower side of the first base plate 1221, the first shaft 1224 is pivoted to the base plate 121 of the carrier, and the rotation driving component 124 includes a rotation driving member 1241, an idler wheel 1242 and a transmission belt 1243, the rotation driving member 1241 is installed on the base plate 121 of the carrier, and has an output shaft; the idler wheel 1242 is pivoted to the base plate 121 of the carrier, and the rotation driving member 1241, the idler wheel 1242 and the center of the first base plate 1221 are arranged in a triangle; the transmission belt 1243 is surrounded by the outside of the output shaft, the idler wheel 1242 and the first shaft 1224 and is tensioned by the three. Through the above arrangement, the clamping assembly 122 can be rotated as a whole under the drive of the rotating drive member 1241. It should be noted that the chips on the diaphragm are generally arranged in a matrix form. When the arrangement direction of the chips is not parallel to the X direction and the Y direction after the membrane ring 1222 is installed, the rotating drive assembly 124 drives the rotation to achieve that the arrangement direction of the chips is parallel to the X direction and the Y direction. Subsequently, only the first drive member 111 and the second drive member 112 need to move.

[0070] The idler wheel 1242 serves to avoid the connecting member 1225 .

[0071] Optionally, gears are disposed on the outer side of the first shaft 1224, and gears are correspondingly disposed on the carrier bottom plate 121. The transmission belt 1243, the output shaft and the idler wheel 1242 are all in the form of gears, so that the transmission distance is more accurate.

[0072] Alternatively, if Figure 1 As shown, the chip rejection device also includes a visual inspection mechanism 50, which is used to detect damaged chips and is respectively connected to the upper ejector mechanism 40 and the lower ejector mechanism 20. Through the above configuration, after the film ring 1222 is installed, it is first inspected by the visual inspection mechanism 50, on the one hand to detect bad chips, and on the other hand to detect whether the film ring 1222 needs to be turned.

[0073] Alternatively, if Figure 5 and Figure 6 As shown, the upper ejector pin 41 includes an upper ejector pin body 411 and a first needle head 412. The upper ejector pin body 411 is connected to the output end of the second lifting drive member 42, and the first needle head 412 is connected to the other end of the upper ejector pin body 411. The head area of ​​the first needle head 412 is smaller than the area of ​​the chip. Through the above arrangement, the second lifting drive member 42 drives the upper ejector pin body 411 and the first needle head 412 to move up and down. At the same time, the area of ​​the first needle head 412 is smaller than the area of ​​the chip. When the first needle head 412 is pressed down, the first needle head 412 is prevented from affecting the chips around the chip, ensuring that the mucous membrane 33 can accurately adhere to the defective chip when the first needle head 412 is pressed down.

[0074] Alternatively, if Figure 7 As shown, the lower ejector pin 21 includes a lower ejector pin body 211 and a second needle head 212. The lower ejector pin body 211 is connected to the output end of the first lifting drive member 22, and the second needle head 212 is connected to the other end of the lower ejector pin body 211. The head area of ​​the second needle head 212 is smaller than the area of ​​the chip. Through the above arrangement, the first lifting drive member 22 drives the lower ejector pin body 211 and the second needle head 212 to move up and down. At the same time, the area of ​​the second needle head 212 is smaller than the area of ​​the chip. When the second needle head 212 rises, it is prevented from affecting the chips around the chip.

[0075] Optionally, the upper ejector body 411 and the first needle 412 are connected in a floating manner; the lower ejector body 211 and the second needle 212 are connected in a floating manner. The above arrangement prevents the first needle 412 from exerting too much downward pressure on the mucosa 33, thereby damaging the mucosa 33, and prevents the second needle 212 from exerting too much supporting force on the diaphragm, thereby damaging the diaphragm.

[0076] In addition, the lower ejector body 211 also has an adsorption function for the diaphragm, which can prevent the diaphragm from moving during the waste rejection process, thereby affecting the precision of waste rejection. The above structures for realizing the floating function and the adsorption function are all existing technologies and will not be described in detail here.

[0077] Alternatively, if Figure 8 and Fig. 9 As shown, the second driving mechanism 31 includes a third driving member 311, a fourth driving member 312, a fifth driving member 313 and a manual slide 314. One of the third driving member 311 and the fourth driving member 312 can output movement in the Y direction, and the other can output movement in the X direction. The fourth driving member 312 is installed at the output end of the third driving member 311; the fifth driving member 313 is connected to the output end of the fourth driving member 312, and the fifth driving member 313 can output movement in the Z direction. The X direction, the Y direction and the Z direction are perpendicular to each other. The mucosa mounting member 32 is connected to the output end of the fifth driving member 313; one side of the manual slide 314 is connected to the output end of the fourth driving member 312, and the other side is connected to the mucosa mounting member 32. The above arrangement can realize the position movement of the mucosa 33 in the X direction, the Y direction and the Z direction. At the same time, the manual slide 314 can manually compensate the position of the mucosa 33.

[0078] It should be noted that the driving elements capable of outputting linear motion mentioned in this embodiment can be any one of a linear module, a cylinder or a linear motor, and are not limited here.

[0079] This embodiment also provides a chip production line, including the above chip rejection device. By adopting the above chip rejection device, the chip production line can reduce the error rate in the chip rejection process, improve the efficiency of chip rejection, and shorten the chip rejection time.

[0080] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A chip removal device, characterized in that: include: The film holding mechanism (10) comprises a first driving component (11) and a film holding platform (12), wherein the film holding platform (12) is used to hold and flatten a film sheet with a plurality of chips mounted on the upper side, and the first driving component (11) can drive the film holding platform (12) to switch between a film loading position and a waste rejection position and can change the position of the film holding platform (12) in the horizontal direction; A lower ejector mechanism (20) is arranged at the lower side of the waste rejection position, the lower ejector mechanism (20) comprises a lower ejector (21) and a first lifting drive member (22), the first lifting drive member (22) can drive the lower ejector (21) to rise so that the head of the lower ejector (21) abuts against the lower side of the diaphragm; The mucosa mechanism (30) comprises a second driving mechanism (31), a mucosa mounting member (32) and a mucosa (33), wherein the mucosa (33) is mounted on the mucosa mounting member (32) and has a sticky lower side, and the second driving mechanism (31) can drive the mucosa mounting member (32) to switch between the position above the waste rejection position and the film unloading position; An upper ejector mechanism (40) is arranged on the upper side of the waste rejection position, and the upper ejector mechanism (40) comprises an upper ejector (41) and a second lifting drive member (42), wherein the second lifting drive member (42) can drive the upper ejector (41) to descend so that the upper ejector (41) pushes against the mucosa (33) and causes a part of the mucosa (33) to be pressed against the lower ejector (21) and adhere to the chip.

2. The chip removal device according to claim 1, characterized in that: The first driving component (11) comprises a first driving member (111) and a second driving member (112), one of the first driving member (111) and the second driving member (112) can output movement in the X direction, and the other can output movement in the Y direction, the second driving member (112) is connected to the output end of the first driving member (111), and the film carrier (12) is installed at the output end of the second driving member (112), and the Y direction is perpendicular to the X direction.

3. The chip removal device according to claim 2, characterized in that: The film carrier (12) comprises: A carrier bottom plate (121) connected to the output end of the second driving member (112); A clamping assembly (122), comprising a first bottom plate (1221), a membrane ring (1222), a connecting piece (1225) and a pressing assembly (1223), wherein the first bottom plate (1221) is connected to the upper side of the carrier bottom plate (121), the pressing assembly (1223) is connected to the lower side of the first bottom plate (1221), the output end of the pressing assembly (1223) passes through the first bottom plate (1221), the connecting piece (1225) is located on the upper side of the first bottom plate (1221) and is connected to the output end of the pressing assembly (1223), the membrane ring (1222) is provided with the flattened membrane, and the pressing assembly (1223) can pull the connecting piece (1225) downward to clamp the membrane ring (1222) between the first bottom plate (1221) and the connecting piece (1225); A separation drive member (123) is installed on the carrier bottom plate (121), and the separation drive member (123) can output movement along the Z direction to abut against the lower side of the connecting member (1225) and overcome the pulling force of the pressing component (1223) to lift the connecting member (1225).

4. The chip removal device according to claim 3, characterized in that: The pressing assembly (1223) comprises: A linear bearing (12231) is connected to the lower side of the first base plate (1221), and the inner shaft of the linear bearing (12231) is correspondingly connected to the connecting member (1225); A stopper (12232) connected to the lower end of the linear bearing (12231); The elastic member (12233) is sleeved on the outer periphery of the linear bearing (12231), and one end of the elastic member abuts against the mounting flange of the linear bearing (12231), and the other end of the elastic member abuts against the limiting member (12232).

5. The chip removal device according to claim 3, characterized in that: The film carrier (12) further comprises a rotation drive assembly (124), the lower side of the first bottom plate (1221) is connected with a first shaft (1224), the first shaft (1224) is pivotally connected to the carrier bottom plate (121), and the rotation drive assembly (124) comprises: A rotating driving member (1241) is mounted on the carrier bottom plate (121) and has an output shaft; An idler wheel (1242) is pivotally connected to the carrier bottom plate (121), and the center of the rotation driving member (1241), the idler wheel (1242) and the first bottom plate (1221) are arranged in a triangle; The transmission belt (1243) is arranged around the outside of the output shaft, the idler wheel (1242) and the first shaft (1224) and is tensioned by the three.

6. The chip removal device according to any one of claims 1 to 5, characterized in that: The chip rejection device further comprises a visual detection mechanism (50), wherein the visual detection mechanism (50) is used to detect damaged chips and is communicatively connected with the first driving component (11).

7. The chip removal device according to any one of claims 1 to 5, characterized in that: The upper ejector pin (41) comprises an upper ejector pin body (411) and a first needle head (412), wherein the upper ejector pin body (411) is connected to the output end of the second lifting drive member (42), and the first needle head (412) is connected to the other end of the upper ejector pin body (411), and the head area of ​​the first needle head (412) is smaller than the area of ​​the chip; and / or The lower ejector pin (21) comprises a lower ejector pin body (211) and a second needle head (212); the lower ejector pin body (211) is connected to the output end of the first lifting drive member (22); the second needle head (212) is connected to the other end of the lower ejector pin body (211); and the head area of ​​the second needle head (212) is smaller than the area of ​​the chip.

8. The chip removal device according to claim 7, characterized in that: The upper ejector pin body (411) and the first needle head (412) are in floating connection; and / or The lower ejector pin body (211) and the second needle head (212) are floatingly connected.

9. The chip removal device according to any one of claims 1 to 5, characterized in that: The second driving mechanism (31) comprises: a third driving member (311) and a fourth driving member (312), wherein one of the third driving member (311) and the fourth driving member (312) is capable of outputting movement in the Y direction, and the other of the third driving member (311) and the fourth driving member (312) is capable of outputting movement in the X direction, and the fourth driving member (312) is installed at the output end of the third driving member (311); a fifth driving member (313) connected to the output end of the fourth driving member (312), the fifth driving member (313) being capable of outputting movement along the Z direction, the X direction, the Y direction and the Z direction being perpendicular to each other, and the mucosal mounting member (32) being connected to the output end of the fifth driving member (313); A manual slide (314) has one side connected to the output end of the fourth driving member (312) and the other side connected to the mucosal mounting member (32).

10. A chip production line, characterized in that: It comprises a chip removal device as described in any one of claims 1 to 9.

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