Electronic equipment

Abstract

The invention provides electronic equipment, relates to the technical field of electronic equipment, and aims at thinning the electronic equipment and centering an outer end opening of a pickup channel. The electronic equipment comprises a screen, a middle frame, a pickup channel and a microphone. The screen includes a display surface. The middle frame and the pickup channel are arranged on one side, back to the display surface, of the screen. The pickup channel comprises a first channel section and a second channel section. The first end of the first channel section is located on the outer side face of the middle frame, the first channel section extends towards the middle of the middle frame from the first end to the second end of the first channel section, and the second end is closer to the screen than the first end in the direction perpendicular to the screen. The third end of the second channel section is connected with the second end, the second channel section extends in the direction away from the screen from the third end to the fourth end of the second channel section, and the fourth end penetrates through the surface, back to the screen, of the middle frame. The microphone is located on the side, back to the screen, of the middle frame, the microphone is provided with a pickup hole, and the pickup hole is communicated with the fourth end.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment with a sound pickup function. Background Art

[0002] At present, a microphone (MIC) is usually provided in the shell of electronic devices such as mobile phones and tablet computers. A sound pickup channel connecting the inside and outside of the shell is provided on the shell. The sound pickup hole of the MIC is connected to the sound pickup channel so that the sound signal of the external environment can enter the MIC through the sound pickup channel to achieve sound pickup.

[0003] In order to improve the feel and appearance of electronic devices, the thickness of electronic devices is required to be made thinner and thinner. At the same time, the opening of the sound pickup channel connected to the outside of the shell is usually set on the outer side of the shell. The opening is required to be arranged in the middle of the outer side along the thickness direction of the electronic device. However, in the prior art, these two requirements are often not met at the same time. Summary of the invention

[0004] The present application provides an electronic device, which can make the outer end opening of a sound pickup channel centered along the thickness direction of the electronic device while reducing the thickness of the electronic device.

[0005] To achieve the above objectives, the present application provides an electronic device, which includes a screen, a middle frame, a sound pickup channel and a microphone.

[0006] The screen comprises a display surface, and the middle frame and the sound pickup channel are both arranged on a side of the screen facing away from the display surface.

[0007] The sound pickup channel includes a first channel section and a second channel section. The first channel section has two ends, namely, a first end and a second end. The first end is located on the outer side of the middle frame. From the first end to the second end, the first channel section extends toward the middle of the middle frame, and along a direction perpendicular to the screen, the second end is closer to the screen than the first end. The second channel section has two ends, namely, a third end and a fourth end. The third end is connected to the second end. From the third end to the fourth end, the second channel section extends in a direction away from the screen, and the fourth end passes through the surface of the middle frame facing away from the screen.

[0008] The microphone is located on a side of the middle frame facing away from the screen. The microphone has a sound pickup hole, which is connected to the fourth end.

[0009] In this way, the sound signal outside the electronic device can enter the microphone through the sound pickup channel to be picked up by the microphone. Since the second end is closer to the screen than the first end, and the third end of the second channel section is connected to the second end, in this way, while ensuring that the outer end opening of the sound pickup channel is arranged in the center of the thickness direction of the electronic device on the outer side, the second channel section can be made closer to the screen. Under the premise that the length of the second channel section in the thickness direction of the electronic device is constant, the thickness of the middle frame can be reduced to facilitate the thinning of the electronic device. In this way, the electronic device can be made thinner while the outer end opening is arranged in the center.

[0010] Optionally, the middle frame may be a metal middle frame, and the material of the metal middle frame includes but is not limited to stainless steel, aluminum alloy, magnesium alloy and titanium alloy. The hardness of the metal material is relatively high, and the structural strength of the middle frame and even the electronic device can be ensured to prevent deformation under the premise of reducing the thickness of the middle frame.

[0011] Optionally, from the first end to the second end, the first channel section is closer to the screen. In this way, the length of the first channel section is shorter, which can increase the peak frequency of the microphone, improve the working frequency band of the microphone, and enhance the high-frequency performance of the microphone. In addition, the structure of the first channel section is simpler and more convenient to process.

[0012] Optionally, the first channel section includes a first straight channel section and a second straight channel section. The first straight channel section extends from the outer side of the middle frame to the middle part of the middle frame and is inclined toward the screen, and the second straight channel section is connected between one end of the first straight channel section facing the screen and the third end. The second straight channel section is parallel to the screen; or, from the first straight channel section to the second channel section, the second straight channel section is inclined toward the screen, and the inclination angle of the second straight channel section relative to the screen is smaller than the inclination angle of the first straight channel section relative to the screen. In this way, from the first end to the second end, the first channel section is in a state of arching in the direction away from the corner position of the surface of the middle plate facing away from the screen, thereby increasing the distance between the first channel section and the corner position, so that the molding yield of the first channel section can be guaranteed, and at the same time, there is no need to increase the thickness of the middle frame, so it is conducive to the thinning of the middle frame and even the electronic device, and at the same time, the accommodating capacity of the accommodating cavity can be guaranteed.

[0013] Optionally, the first straight channel section, the second straight channel section and the second channel section are all arranged in the middle frame. This structure is simple and the layout is reasonable.

[0014] On the basis of the above, optionally, the middle frame includes a middle plate and a frame arranged at the edge of the middle plate, and the surface of the frame facing away from the middle plate forms the above outer side surface. In the direction perpendicular to the screen, the distance from the surface of the frame facing away from the screen to the screen is greater than the distance from the surface of the middle plate facing away from the screen to the screen. The first straight channel segment is arranged on the frame, and at least a part of the second straight channel segment and the second channel segment are arranged on the middle plate. Specifically, a part of the second straight channel portion is arranged in the middle plate, and the other part is located in the frame. This layout is reasonable and easy to implement.

[0015] Optionally, the first straight channel segment is disposed in the middle frame, and one end of the first straight channel segment facing the screen passes through the surface of the middle frame facing the screen. The second channel segment is disposed in the middle frame, and the third end of the second channel segment passes through the surface of the middle frame facing the screen. The electronic device further includes a sealing ring, which is disposed between the screen and the middle frame, and the area surrounded by the sealing ring forms the second straight channel segment. In this way, under the premise that the length of the second channel segment along the thickness direction of the electronic device is constant, the thickness of the middle frame can be further reduced, so as to facilitate the thinning of the electronic device.

[0016] Optionally, the first channel segment includes a first straight channel segment, a second straight channel segment, and a third straight channel segment. The first straight channel segment extends from the outer side of the middle frame to the middle of the middle frame. The third straight channel segment extends from one end of the first straight channel segment facing the middle of the middle frame to the screen. The second straight channel segment extends from one end of the third straight channel segment facing the screen to the middle of the middle frame. In this way, from the first end to the second end, the first channel segment approaches the screen in a step-like manner, and the distance between the first channel segment and the above-mentioned corner position can also be increased while ensuring that the thickness of the middle plate remains unchanged, thereby ensuring the molding yield of the first channel segment.

[0017] Optionally, the first straight channel section, the second straight channel section, the third straight channel section and the second channel section are all arranged in the middle frame. This structure is simple and the layout is reasonable.

[0018] Optionally, the first straight channel segment and the third straight channel segment are arranged in the middle frame, and the end of the third straight channel segment facing the screen passes through the surface of the middle frame facing the screen. The second channel segment is arranged in the middle frame, and the third end of the second channel segment passes through the surface of the middle frame facing the screen. The electronic device also includes a sealing ring, which is arranged between the screen and the middle frame, and the area surrounded by the sealing ring forms the second straight channel segment. In this way, under the premise that the length of the second channel segment along the thickness direction of the electronic device is constant, the thickness of the middle frame can be further reduced, so as to facilitate the thinning of the electronic device.

[0019] Optionally, the second straight channel section penetrates the surface of the middle frame facing the screen to form an opening, and the screen covers the opening. In this way, the screen forms the side wall of the second straight channel section, and the thickness of the middle plate can be further reduced while ensuring the height of the second straight channel section along the thickness direction of the electronic device and the distance from the first channel section to the above-mentioned corner position, which is conducive to the thinning of the middle frame and even the electronic device.

[0020] Optionally, a sealing ring is provided between the screen and the middle frame, and the sealing ring is arranged around the opening. In this way, the airtightness of the second linear channel section can be ensured by means of the sealing ring.

[0021] Optionally, the first channel section and the second channel section are both arranged in the middle frame. The first channel section extends in a straight line, and from the first end to the second end, the first channel section is inclined toward the screen. In this way, from the first end to the second end, the first channel section continuously approaches the screen, and the shape of the sound pickup channel is simple and easy to process. Moreover, the length of the first channel section is as short as possible, which can increase the peak frequency of the microphone, improve the working frequency band of the microphone, and enhance the high-frequency performance of the microphone.

[0022] Optionally, the electronic device further includes a circuit board, which is located on a side of the middle frame facing away from the screen, and the circuit board is provided with a first through hole, which is opposite to and connected to the fourth end. The microphone is arranged on the circuit board, and the pickup hole of the microphone is connected to the first through hole. In this way, with the help of the circuit board, the microphone can be conveniently electrically connected to other electronic components such as a controller and a memory. Based on this, a first through hole is arranged on the circuit board, and the first through hole is opposite to and connected to the fourth end, and the pickup hole is connected to the first through hole. This layout is reasonable and can improve the compactness of the layout of electronic components in the electronic device.

[0023] Optionally, a dustproof net is provided between the middle frame and the circuit board, the dustproof net comprising a net body, at least part of which is located between the fourth end and the first through hole. In this way, the dustproof net can prevent foreign matter outside the electronic device from entering the microphone along the sound pickup channel, thereby ensuring the performance of the microphone and extending its service life.

[0024] Optionally, the mesh body includes a middle portion and an edge portion surrounding the middle portion, and the middle portion is located between the fourth end and the first through hole. The dustproof net also includes a first sealant layer, a second sealant layer and an elastic sealing layer. The first sealant layer is bonded between the edge portion and the middle frame. The second sealant layer is bonded between the edge portion and the elastic sealing layer. The elastic sealing layer is located between the second sealant layer and the circuit board. Based on this, the circuit board can be fixedly connected to the middle frame with the help of connectors such as screws to squeeze the elastic sealing layer and put the elastic sealing layer in a compressed state to achieve sealing and ensure the air tightness of the dustproof net.

[0025] Optionally, the circuit board is further provided with a second through hole, which is spaced apart from the first through hole; the microphone and the second channel section are located on the same side of the circuit board, and the sound pickup hole of the microphone is opposite to and connected to the second through hole. The electronic device also includes a sealing cover, which is located on the side of the circuit board facing away from the microphone and the second channel section, and the sealing cover and the circuit board form an airflow cavity, which is connected to both the first through hole and the second through hole. In this way, the first through hole, the airflow cavity and the second through hole form a U-shaped channel connected between the sound pickup channel and the sound pickup hole, and the sound signal outside the electronic device can be transmitted to the microphone via the sound pickup channel and the U-shaped channel in sequence, and the sound signal is further converted into an electrical signal with the help of the microphone. Moreover, in the direction perpendicular to the circuit board, the height of the sealing cover can be less than the height of the microphone, which is conducive to reducing the stacking thickness of the whole machine and realizing the thinning of the electronic device. In addition, since the microphone and the second channel section are located on the same side of the circuit board, and the second channel section is arranged on the middle plate, the back cover and the middle plate are respectively located on opposite sides of the circuit board, so the microphone and the back cover are respectively located on opposite sides of the circuit board. In this way, the microphone can be protected by the circuit board to prevent the microphone from being damaged by external force from the back cover, thereby eliminating the need to provide a special protective cover for the microphone.

[0026] Optionally, a surface of the middle frame facing away from the screen is provided with an avoidance groove, and the microphone is accommodated in the avoidance groove. In this way, by providing the avoidance groove, the circuit board can be closer to the middle frame, avoiding the overlap of the thickness of the microphone and the middle frame, thereby reducing the thickness of the electronic device, which is conducive to improving the portability and feel of the electronic device.

[0027] Optionally, the cross-sectional area of ​​the first through hole is greater than the cross-sectional area of ​​the second through hole. In this way, after the sound signal enters the accommodating cavity through the sound pickup channel, it can smoothly enter the airflow cavity through the first through hole and enter the sound pickup hole through the second through hole. Since the cross-sectional area of ​​the sound pickup hole is smaller, the cross-sectional area of ​​the second through hole opposite to the sound pickup hole is smaller, thereby increasing the contact area between the circuit board and the substrate of the microphone and ensuring the support stability. This layout is reasonable and has better performance.

[0028] Optionally, in a direction perpendicular to the circuit board, the height of the sealing cover is less than the height of the microphone. In this way, the stacking height of the electronic components on the side of the middle plate facing away from the screen can be reduced, which is conducive to reducing the stacking thickness of the whole device, and can achieve thinning of the electronic device, thereby improving the portability and feel of the electronic device.

[0029] Optionally, the sealing cover is made of metal. Specifically, the metal includes but is not limited to iron, iron alloy, copper, copper alloy, aluminum or aluminum alloy. The hardness of the metal is relatively high. Under the premise of ensuring the structural strength of the sealing cover, the wall thickness of the sealing cover can be reduced, so as to increase the height of the airflow cavity while reducing the height of the sealing cover.

[0030] Optionally, the sealing cover includes a top plate, a side plate and an annular bottom plate. The side plate is arranged around the edge of the top plate, the annular bottom plate is connected to one end of the side plate away from the top plate, and the annular bottom plate is connected to the circuit board. In this way, the sealing cover is roughly a cylindrical shell-like structure, and this structure is simple. Moreover, under the premise that the height of the sealing cover along the thickness direction of the electronic device is certain, a larger space can be formed inside, so as to ensure the volume of the airflow cavity when used in the electronic device and improve the peak frequency of the microphone.

[0031] Optionally, the annular bottom plate includes an inner edge, and one end of the side plate away from the top plate is located in the area surrounded by the annular bottom plate and connected to the inner edge. The sealing cover has a simple structure and can be formed by stamping, which is conducive to simplifying the difficulty of forming.

[0032] Optionally, an annular connection pad is provided on the circuit board, and the annular bottom plate is welded to the annular connection pad. In this way, the sealing cover and the circuit board are fixedly connected by welding, the connection is relatively stable, and the circumference of the annular bottom plate and the circumference of the annular connection pad can be welded, so that sealing can be achieved to a certain extent.

[0033] Optionally, the annular bottom plate further includes an outer edge, and a sealant is provided on a side of the outer edge away from the inner edge, and the sealant is bonded to both the outer edge and the circuit board.

[0034] Optionally, the side plate includes a first arcuate side plate, a second arcuate side plate, a first transition plate, and a second transition plate. The first arcuate side plate is located on a side of the first through hole away from the second through hole and extends along the circumference of the first through hole, the second arcuate side plate is located on a side of the second through hole away from the first through hole and extends along the circumference of the second through hole, and the radius of the arcuate inner wall surface of the first arcuate side plate is greater than the radius of the arcuate inner wall surface of the second arcuate side plate. The two ends of the first arcuate side plate along the circumference of the first through hole are respectively the first end and the second end, and the two ends of the second arcuate side plate along the circumference of the second through hole are respectively the third end and the fourth end. The first transition plate is connected between the first end and the third end, and the second transition plate is connected between the second end and the fourth end. In this way, the shape of the sealing cover is roughly spindle-shaped, with a larger internal space at one end of the spindle-shaped structure and a smaller internal space at the other end. The end with the larger internal space is connected to the first through hole with a larger diameter, and the end with the smaller internal space is connected to the second through hole with a smaller diameter. This layout is reasonable, which can reduce the volume of the sealing cover while helping to increase the peak frequency of the microphone.

[0035] Optionally, the first transition plate and the second transition plate are both flat plates, and the first transition plate is tangent to the first end of the first curved side plate and the third end of the second curved side plate, and the second transition plate is tangent to the second end of the first curved side plate and the fourth end of the second curved side plate. In this way, the structure of the side plate is simple, easy to process, and conducive to reducing costs, and the internal airflow cavity has a smooth transition to each position around the circumference, which can reduce noise.

[0036] Optionally, both the first through hole and the second through hole are circular holes. The center line of the circle corresponding to the first arc-shaped side panel is collinear with the center line of the circle of the first through hole, and the center line of the circle corresponding to the second arc-shaped side panel is collinear with the center line of the circle of the second through hole. Along the radial direction of the first through hole, the distance between the arc-shaped inner wall surface of the first arc-shaped side panel and the inner wall surface of the first through hole is the first distance; along the radial direction of the second through hole, the distance between the arc-shaped inner wall surface of the second arc-shaped side panel and the inner wall surface of the second through hole is the second distance; the second distance is equal to the first distance. In this way, the layout is reasonable and can minimize the board area occupied by the sealing cover on the circuit board, so as to help reduce the volume of the airflow cavity in the sealing cover, thereby helping to increase the peak frequency of the microphone.

[0037] Optionally, the electronic device is a folding screen device. In this way, while ensuring that the outer end opening of the sound pickup channel is centrally arranged, the thickness of the folding screen device can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A three-dimensional diagram of an electronic device in an unfolded state provided by some embodiments of the present application;

[0039] Figure 2 for Figure 1 A front view of the electronic device shown in a folded state;

[0040] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure of the electronic device shown along the AA direction;

[0041] Figure 4 A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0042] Figure 5 A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0043] Figure 6 for Figure 5 A top view of the middle frame shown;

[0044] Figure 7 A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0045] Figure 8A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0046] Fig. 9 A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0047] Fig.10 A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0048] Fig.11 A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0049] Fig.12 A schematic diagram of a cross-sectional structure of a MIC in an electronic device provided in some embodiments of the present application;

[0050] Fig.13 A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0051] Fig.14 for Fig.13 A partial enlarged view of area I in the electronic device shown;

[0052] Fig.15 A schematic cross-sectional structure diagram of an electronic device provided in some other embodiments of the present application;

[0053] Fig.16 for Fig.15 A schematic diagram of the cross-sectional structure of a sealing cover in the electronic device shown;

[0054] Fig.17 for Fig.15 A bottom view of a circuit board within the electronic device shown;

[0055] Fig.18 for Fig.15 A schematic cross-sectional view of the connection structure between the sealing cover and the circuit board in the electronic device shown;

[0056] Fig.19 for Fig.15 A top view of a sealed cover inside an electronic device is shown.

[0057] Reference numerals:

[0058] 100. Electronic equipment;

[0059] 10, screen; S0, display surface; 20, housing; 201, first housing; 202, second housing; 203, shaft mechanism;

[0060] A, middle frame; A1, middle plate; A2, frame; L1, first edge; L2, second edge; L3, third edge; L4, fourth edge; O, geometric center; K1, first boundary line; K2, second boundary line; K3, third boundary line; K4, fourth boundary line; A0, middle; m1, outer side; m2, first surface; m3, second surface; m4, third surface;

[0061] B. Back cover; C. Accommodation cavity;

[0062] 30, MIC; 30a, sound pickup hole; 31, housing; 32, substrate; 33, microphone chip; 34, integrated circuit;

[0063] 40, sound pickup channel; 40a, outer end opening; 41, first channel section; 411, first straight channel section; 412, second straight channel section; 413, third straight channel section; 42, second channel section; D1, first end; D2, second end; D3, third end; D4, fourth end;

[0064] 50. Protective cover;

[0065] 60. Circuit board; 61. First through hole; 62. Second through hole;

[0066] 70, dustproof net; 71, net body; 71a, middle part; 71b, edge part; 72, first sealing glue layer; 73, second sealing glue layer; 74, elastic sealing layer;

[0067] 80, sealing cover; 81, top plate; 82, side plate; 821, first arc-shaped side plate; x1, first end; x2, second end; 822, second arc-shaped side plate; x3, third end; x4, fourth end; 823, first transition plate; 824, second transition plate; 83, annular bottom plate; n1, inner edge; n2, outer edge; K, sealant;

[0068] 90. Airflow cavity. DETAILED DESCRIPTION

[0069] In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", and "fourth" may explicitly or implicitly include one or more of the features.

[0070] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0071] In the embodiments of the present application, unless otherwise specified, the description "parallel" means that approximately parallelism is allowed within a certain error range, and the error range can be a range of less than or equal to 5° relative to the absolute parallel deviation angle. The description "perpendicular" means that approximately perpendicularity is allowed within a certain error range, and the error range can be a range of less than or equal to 5° relative to the absolute perpendicular deviation angle. The description "collinear" means that approximately collinearity is allowed within a certain error range, and the error range can be a range of less than 0.1 mm relative to the absolute collinear deviation distance.

[0072] The present application provides an electronic device, which is a type of electronic device with a sound pickup function. Specifically, the electronic device includes but is not limited to mobile phones, tablet computers, laptop computers, desktop computers, large-screen display devices, vehicle-mounted devices, and smart wearable devices. Among them, smart wearable devices include but are not limited to smart watches, bracelets, smart glasses, smart clothes, etc. The embodiment of the present application is exemplified by taking the electronic device as a folding screen device, and the folding screen device can be, for example, a folding screen mobile phone.

[0073] See also Figure 1 , Figure 1 This is a stereoscopic diagram of an electronic device 100 in an unfolded state provided in some embodiments of the present application. When the electronic device 100 is in an unfolded state, a large screen display can be achieved to provide a better visual experience for the user.

[0074] The electronic device 100 is approximately in the shape of a rectangular flat plate in the unfolded state. Based on this, in order to facilitate the description of each embodiment below, an XYZ coordinate system is established for the electronic device 100 in the unfolded state, and the length direction of the electronic device 100 is defined as the X-axis direction, the width direction of the electronic device 100 is the Y-axis direction, and the thickness direction of the electronic device 100 is the Z-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here. In some other embodiments, the shape of the electronic device 100 in the unfolded state can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0075] See also Figure 1, the electronic device 100 includes a screen 10 and a housing 20 .

[0076] The screen 10 is used to display information such as images and videos. The screen 10 may be an organic light-emitting diode (OLED) screen, a micro organic light-emitting diode (MLD) screen, a quantum dot light-emitting diode (QLED) screen, or a liquid crystal display (LCD) screen.

[0077] The screen 10 includes a display surface S0 , through which a user can view an image or video displayed on the screen 10 .

[0078] The housing 20 is located on a side of the screen 10 facing away from the display surface S0 and is used to support the screen 10 .

[0079] Please continue reading Figure 1 The housing 20 includes a first housing 201 , a second housing 202 and a rotating shaft mechanism 203 .

[0080] The first housing 201 is used to carry a part of the screen 10, and the second housing 202 is used to carry another part of the screen 10. The hinge mechanism 203 is connected between the first housing 201 and the second housing 202, and is used to realize the relative rotation between the first housing 201 and the second housing 202, so as to support the screen 10 to rotate. Figure 1 The expanded state shown collapses to the collapsed state.

[0081] The first housing 201 can be arranged relative to the second housing 202 by Figure 1 In the unfolded state shown, the housing 202 is rotated away from the screen 10 (ie, folded outward) to fold into the folded state, and can also be rotated toward the screen 10 relative to the second housing 202 (ie, folded inward) to fold into the folded state.

[0082] This application is exemplified by the first housing 201 being folded inward relative to the second housing 202 to a folded state. Figure 2 , Figure 2 for Figure 1 The electronic device 100 is shown in a front view when it is in a folded state.

[0083] When the electronic device is in a folded state, the first housing 201 and the second housing 202 are stacked, and the size of the electronic device is small, making it easy to carry.

[0084] The first housing 201 and the second housing 202 may include a middle frame and a back cover. The screen 10 is carried on the middle frame, and the back cover is located on the side of the middle frame facing away from the screen 10. The back cover and the middle frame form a receiving cavity, which is used to receive electronic components such as a microphone (MIC) 30, a battery, a vibration motor, a speaker module, a camera module, etc.

[0085] The back cover of the first housing 201 and the back cover of the second housing 202 may be a physical back cover or a display screen, and the display surface of the display screen may be opposite to the display surface S0 of the screen 10. In this way, when the electronic device is in a folded state, a small screen display may be realized with the help of the display screen. Specifically, the display screen may be used for caller ID, message reminder display, time, weather, date, and memo display, etc.

[0086] In the above embodiment, the MIC 30 can be disposed in the first housing 201 or in the second housing 202. Figure 1 and Figure 2 In this embodiment and the following embodiments, the MIC 30 is disposed in the first housing 201 for exemplary description. Based on this, in order to facilitate the description of the following embodiments, the middle frame of the first housing 201 is marked as middle frame A, the back cover of the first housing 201 is marked as back cover B, and the internal accommodation cavity of the first housing 201 is marked as accommodation cavity C.

[0087] See also Figure 3 , Figure 3 for Figure 1 The cross-sectional structure diagram of the electronic device 100 along the AA direction is shown. The middle frame A is provided with a sound pickup channel 40 , and the sound signal outside the electronic device 100 can enter the inside of the electronic device 100 through the sound pickup channel 40 .

[0088] The sound pickup channel 40 has an opening at one end connected to the outside of the electronic device 100 as an outer opening 40a, and the outer opening 40a is located on the outer side m1 of the middle frame A. The outer side m1 of the middle frame A refers to the surface of the middle frame A away from the internal accommodation cavity C, and the outer side m1 is visible to the user.

[0089] In order to ensure the appearance of the electronic device 100 is neat and beautiful, the outer end opening 40a is required to be arranged in the center of the outer side m1 along the Z axis direction. In this way, the appearance of the electronic device 100 can be ensured to be neat and beautiful, especially when the outer side m1 is Figure 4 When the curved surface is shown, the user views the electronic device 100 from the display side of the electronic device 100, and the outer end opening 40a is invisible to the user, thereby ensuring the neat and beautiful appearance of the electronic device 100. The display side of the electronic device 100 refers to the side that the display surface S0 of the screen 10 faces and the side that the display surface of the display screen faces.

[0090] Based on the above, please refer to Figure 3 and Figure 4 MIC 30 is located on the side of the middle frame A facing away from the screen 10, and MIC 30 is accommodated in the accommodating cavity C. MIC 30 has a sound pickup hole 30a, and the sound pickup hole 30a is connected to the sound pickup channel 40. In this way, MIC 30 can pick up the sound signal from the sound pickup channel 40 to convert the sound signal into an electrical signal.

[0091] In order to prevent the impact force from the back cover B from affecting the MIC 30, please refer to Figure 3 and Figure 4 The electronic device 100 further includes a protective cover 00, which is disposed between the MIC 30 and the back cover B, and the protective cover 00 can be fixed on the middle frame A. In this way, the impact force from the back cover B first acts on the protective cover 00, and does not directly impact the MIC 30, so the performance of the MIC 30 can be guaranteed and the service life of the MIC 30 can be extended.

[0092] Please continue reading Figure 3 and Figure 4 , the sound pickup channel 40 extends along an L-shaped path, specifically, the sound pickup channel 40 includes a first channel section 41 and a second channel section 42, the first channel section 41 extends from the outer side m1 along the Y-axis direction to the middle of the middle frame A, and the second channel section 42 extends from one end of the first channel section 41 facing the middle of the middle frame A along the Z-axis direction to the direction away from the screen 10. Based on this, under the premise of ensuring that the outer end opening 40a is centered on the outer side m1, the thickness of the electronic device 100 can be twice the sum of the radius of the first channel section 41, the length of the second channel section 42, the thickness of the MIC 30, the thickness of the protective cover 00 and the thickness of the back cover B. This thickness is relatively large, which is not conducive to the thinning of the electronic device 100.

[0093] Therefore, the electronic device 100 cannot be made thinner while the outer end opening is centered.

[0094] To solve the above problems, see Figure 5 , Figure 5 The cross-sectional structure diagram of the electronic device 100 provided in some other embodiments of the present application is as follows. In this embodiment, the sound pickup channel 40 includes a first channel section 41 and a second channel section 42 .

[0095] Two ends of the first channel section 41 are respectively a first end D1 and a second end D2 .

[0096] The first end D1 is located on the outer side m1 of the middle frame A to form an outer end opening of the sound pickup channel 40. Figure 5The geometric center of the opening of the first end D1 can be arranged in the center of the outer side m1 along the Z-axis direction. In this way, the appearance of the electronic device 100 can be improved.

[0097] The first channel section 41 extends toward the middle of the middle frame A from the first end D1 to the second end D2 .

[0098] The middle of the middle frame A refers to the portion where the geometric center of the middle frame A in the XY plane is located. The middle of the middle frame A specifically refers to the portion surrounded by the boundaries formed when the four edges of the middle frame A are moved 1 / 2 times the distance toward the geometric center of the middle frame A.

[0099] For an example, see Figure 6 , Figure 6 for Figure 5 In the top view of the middle frame A shown in the figure, the edges of the middle frame A may include a first edge L1, a second edge L2, a third edge L3 and a fourth edge L4. At the same time, the geometric center of the middle frame A in the XY plane is marked as O, the distance from the first edge L1 to the geometric center O is the first distance d1, the distance from the second edge L2 to the geometric center O is the second distance d2, the distance from the third edge L3 to the geometric center O is the third distance d3, and the distance from the fourth edge L4 to the geometric center O is the fourth distance d4. The first edge L1 moves toward the geometric center O by 1 / 2 times the first distance d1 to form a first boundary line K1; the second edge L2 moves toward the geometric center O by 1 / 2 times the second distance d2 to form a second boundary line K2; the third edge L3 moves toward the geometric center O by 1 / 2 times the third distance d3 to form a third boundary line K3; the fourth edge L4 moves toward the geometric center O by 1 / 2 times the fourth distance d4 to form a fourth boundary line K4. Based on this, the middle portion A0 of the middle frame A refers to a portion of the middle frame surrounded by the first boundary line K1 , the second boundary line K2 , the third boundary line K3 and the fourth boundary line K4 .

[0100] Based on the above, please refer back to Figure 5 , along the direction perpendicular to the screen 10 (that is, the Z-axis direction), the second end D2 is closer to the screen 10 than the first end D1. That is, along the Z-axis direction, the distance from the second end D2 to the screen 10 is smaller than the distance from the first end D1 to the screen 10.

[0101] On the basis of the above, please continue to refer to Figure 5 The two ends of the second channel section 42 are respectively the third end D3 and the fourth end D4, and the third end D3 is connected to the second end D2. From the third end D3 to the fourth end D4, the second channel section 42 extends in a direction away from the screen 10. The fourth end D4 penetrates the surface of the middle frame A facing away from the screen 10 to form an inner end opening of the sound pickup channel 40.

[0102] Based on this, see Figure 5The MIC 30 is located on a side of the middle frame A facing away from the screen 10. Specifically, the MIC 30 may be located in the accommodating cavity C. The sound pickup hole 30a of the MIC 30 is connected to the fourth end D4.

[0103] In this way, the sound signal outside the electronic device 100 can enter the MIC 30 via the sound pickup channel 40 to be picked up by the MIC 30. Since the second end D2 is closer to the screen 10 than the first end D1, and the third end D3 of the second channel section 42 is connected to the second end D2, in this way, while ensuring that the outer end opening of the sound pickup channel 40 is arranged in the center of the outer side m1 along the Z-axis direction, the second channel section 42 can be made closer to the screen 10. Under the premise that the length of the second channel section 42 along the Z-axis direction is constant, the thickness of the middle frame A can be reduced to facilitate the thinning of the electronic device. In this way, the electronic device 100 can be made thinner while the outer end opening is arranged in the center.

[0104] The middle frame A is used as a supporting "skeleton" in the electronic device 100 to support the screen 10 and the electronic components in the accommodating cavity C. Therefore, the hardness of the middle frame A affects the overall structural strength of the electronic device 100. Based on this, after the thickness of the middle frame A is reduced, in order to ensure the structural strength of the middle frame A, in some embodiments, the middle frame A can be a metal middle frame, and the material of the metal middle frame does not include but is not limited to stainless steel, aluminum alloy, magnesium alloy and titanium alloy. The hardness of the metal material is relatively high, and the structural strength of the middle frame A and even the electronic device 100 can be ensured to prevent deformation under the premise of thinning the middle frame A.

[0105] The extension path of the first channel section 41 includes but is not limited to a straight path, a broken line path, a curved path, a partial section being a straight path and another partial section being a curved path, as long as the second end D2 is closer to the screen 10 than the first end D1.

[0106] Moreover, along the Z-axis direction, a portion of the middle section of the first channel section 41 may be closer to the screen 10 than the second end D2 , or may be farther away from the screen 10 than the first end D1 .

[0107] In some embodiments, see Figure 5 , from the first end D1 to the second end D2, the first channel section 41 approaches the screen 10. That is, in any two adjacent middle sections on the extension path of the first channel section 41, the middle section closer to the first end D1 is the first section, and the middle section closer to the second end D2 is the second section, and the second section is flush with the first section; or, along the Z-axis direction, the second section is closer to the screen 10 than the first section. Here, "flush" means that the distances from the two sections to the screen 10 along the Z-axis direction are approximately equal.

[0108] In this way, the length of the first channel section 41 is shorter, which can increase the peak frequency fh of the MIC 30, improve the working frequency band of the MIC 30, and enhance the high-frequency performance of the MIC 30. In addition, the structure of the first channel section 41 is simpler and the processing is more convenient.

[0109] In the above embodiment, from the first end D1 to the second end D2 , the first channel section 41 may approach the screen 10 continuously or in a step-wise manner.

[0110] In some embodiments, see Figure 5 , the first channel section 41 can extend along a straight line, and from the first end D1 to the second end D2, the first channel section 41 is inclined toward the screen 10. In this way, from the first end D1 to the second end D2, the first channel section 41 continuously approaches the screen 10, and the shape of the sound pickup channel 40 is simple and easy to process. Moreover, the length of the first channel section 41 is as short as possible, which can increase the peak frequency fh of the MIC 30, improve the working frequency band of the MIC 30, and enhance the high-frequency performance of the MIC 30.

[0111] Among them, see Figure 5 The inclination angle θ1 of the first channel section 41 toward the screen 10 may be greater than or equal to 0° and less than or equal to 60°. Specifically, the inclination angle θ may be 0°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55° or 60°.

[0112] In this way, under the premise that the length of the first channel section 41 in the Y-axis direction is constant, the height of the first channel section 41 in the Z-axis direction is relatively small, which is conducive to the thinning of the middle frame A and even the electronic device 100.

[0113] In some other embodiments, in order to make the first channel section 41 continuously approach the screen 10, the first channel section 41 may also extend along an arc, and the arc may be arched toward the screen 10 or toward the back cover B, and the present application does not make any specific limitation on this.

[0114] The first channel section 41 and the second channel section 42 may be disposed in the middle frame A, or may be partially disposed in the middle frame A and the other partially disposed between the middle frame A and the screen 10 . Figure 5 The first channel section 41 and the second channel section 42 are both arranged in the middle frame A for exemplary description.

[0115] For details, please continue to refer to Figure 5 The middle frame A includes a middle plate A1 and a frame A2. The frame A2 is arranged at the edge of the middle plate A1, and the surface of the frame A2 facing away from the middle plate A1 forms the outer side m1.

[0116] Please continue reading Figure 5 , in the direction perpendicular to the screen 10, the surface of the frame A2 facing away from the screen 10 is the first surface m2, and the surface of the middle plate A1 facing away from the screen 10 is the second surface m3. The distance from the first surface m2 to the screen 10 is greater than the distance from the second surface m3 to the screen 10. In this way, on the side of the middle frame A facing away from the screen 10, the middle plate A1 and the frame A2 form a groove, and the side of the groove facing away from the screen 10 forms an opening, and the back cover B covers the opening to form the above-mentioned accommodating cavity C with the middle plate A1 and the frame A2. In this way, there is no need to set a side frame at the edge of the back cover B, so the structure of the back cover B can be simplified.

[0117] Based on the above, please refer to Figure 5 A portion of the first channel section 41 is disposed on the frame A2, and another portion of the first channel section 41 and the second channel section 42 are disposed on the middle plate A1.

[0118] The sound pickup channel 40 has a reasonable layout and a simple structure.

[0119] Based on the above, please refer to Figure 5 The surface of the frame A2 facing the accommodating cavity C is the third surface m4, the third surface m4 is connected between the first surface m2 and the second surface m3, and the corner position between the third surface m4 and the second surface m3 is position P.

[0120] Based on this, the distance from the first channel segment 41 to the position P affects the molding yield of the first channel segment 41 , as well as the thickness of the middle frame A or the accommodating capacity of the accommodating cavity C.

[0121] Specifically, the shorter the distance between the first channel segment 41 and the position P, the less material of the middle frame between the first channel segment 41 and the position P, and the lower the structural strength. When the first channel segment 41 is formed through the hole-turning process, the middle frame is prone to local perforation or deformation, and thus the processing yield is low.

[0122] In order to ensure the yield, the distance between the first channel section 41 and the position P needs to be increased, so the second surface m3 needs to be moved downward, or the third surface m4 needs to be moved into the accommodating cavity C. This increases the thickness of the middle plate A1 and the thickness of the frame A2, which is not conducive to the thinning of the middle frame A, or compresses the volume of the accommodating cavity C, reducing the accommodating capacity of the accommodating cavity C.

[0123] To solve the above problems, see Figure 7 , Figure 7 The cross-sectional structure diagram of the electronic device 100 provided in some other embodiments of the present application is as follows: In this embodiment, the first channel segment 41 includes a first straight channel segment 411 and a second straight channel segment 412 .

[0124] The first straight channel section 411 extends from the outer side surface m1 of the middle frame A toward the middle of the middle frame A and is inclined toward the screen 10 .

[0125] The second straight channel segment 412 is connected between the end of the first straight channel segment 411 facing the screen 10 and the third end D3 , and the second straight channel segment 412 is parallel to the screen 10 .

[0126] In this way, please refer to Figure 7 From the first end D1 to the second end D2, the first channel section 41 is arched in the direction away from the position P, thereby increasing the distance between the first channel section 41 and the position P, thereby ensuring the molding yield of the first channel section 41, and at the same time, there is no need to increase the thickness of the middle plate A1 and the frame A2, which is conducive to the thinning of the middle frame A and even the electronic device, and at the same time can ensure the accommodating capacity of the accommodating cavity C.

[0127] In the above embodiment, the first straight channel segment 411, the second straight channel segment 412 and the second channel segment 42 can all be arranged in the middle frame A, or a part of them can be arranged in the middle frame A and the other part can be arranged between the screen 10 and the middle frame A. Figure 7 The illustrated embodiment is illustrative in that the first straight channel segment 411 , the second straight channel segment 412 and the second channel segment 42 are all disposed in the middle frame A, which is not to be considered as a special limitation to the present application.

[0128] Based on the above embodiment, optionally, please refer to Figure 7 The first straight channel section 411 can be arranged in the frame A2, and at least a part of the second straight channel portion 412 can be arranged in the middle plate A1. Specifically, a part of the second straight channel portion 412 can be arranged in the middle plate A1, and another part can be arranged in the frame A2. This layout is reasonable and easy to implement.

[0129] In some other embodiments, see Figure 8 , Figure 8 Schematic diagram of the cross-sectional structure of the electronic device 100 provided for some other embodiments of the present application. In this embodiment, the first straight channel section 411 is arranged in the middle frame A. Specifically, at least a part of the first straight channel section 411 can be arranged in the frame A2. One end of the first straight channel section 411 facing the screen 10 passes through the surface of the middle frame A facing the screen 10. The second channel section 42 is also arranged in the middle frame A. Specifically, the second channel section 42 can be arranged in the middle plate A1. The third end D3 of the second channel section 42 passes through the surface of the middle frame A facing the screen 10.

[0130] On the basis of the above, please continue to refer to Figure 8The electronic device 100 further includes a sealing ring 50. The material of the sealing ring 50 includes but is not limited to glue, adhesive, foam, nitrile rubber, silicone rubber and fluorine rubber. The sealing ring 50 is arranged between the screen 10 and the middle frame A, and the area surrounded by the sealing ring 50 forms a second straight channel section 412. In this way, under the premise that the length of the second channel section 42 along the Z-axis direction is constant, the thickness of the middle frame A can be further reduced, so as to facilitate the thinning of the electronic device 100.

[0131] In some other embodiments, see Fig. 9 , Fig. 9 Schematic diagram of the cross-sectional structure of an electronic device 100 provided in some embodiments of the present application. Figure 7 The difference between the illustrated embodiment is that: in this embodiment, from the first straight channel segment 411 to the second channel segment 42, the second straight channel segment 412 is inclined toward the screen 10, and the inclination angle θ2 of the second straight channel segment 412 relative to the screen 10 is smaller than the inclination angle θ1 of the first straight channel segment 411 relative to the screen 10.

[0132] In this way, the first channel section 41 is also in a state of being arched away from the position P, which increases the distance between the first channel section 41 and the position P, thereby ensuring the molding yield of the first channel section 41. At the same time, there is no need to increase the thickness of the middle plate A1 and the frame A2, which is conducive to the thinning of the middle frame A and even the electronic device, and at the same time can ensure the accommodating capacity of the accommodating cavity C.

[0133] In the above embodiments, the first straight channel segment 411, the second straight channel segment 412 and the second channel segment 42 can all be arranged in the middle frame A, or a part of them can be arranged in the middle frame A, and the other part can be arranged between the screen 10 and the middle frame A. For example, the first straight channel segment 411 and the second channel segment 42 are arranged in the middle frame A, and the second straight channel segment 412 is surrounded by a sealing ring arranged between the screen 10 and the middle frame A. Fig. 9 The illustrated embodiment is illustrative in that the first straight channel segment 411 , the second straight channel segment 412 and the second channel segment 42 are all disposed in the middle frame A, which is not to be considered as a special limitation to the present application.

[0134] In some other embodiments, see Fig.10 , Fig.10 The cross-sectional structure diagram of the electronic device 100 provided in some embodiments of the present application is as follows: In this embodiment, the first channel segment 41 includes a first straight channel segment 411 , a second straight channel segment 412 and a third straight channel segment 413 .

[0135] The first straight channel section 411 extends from the outer side m1 of the middle frame A to the middle of the middle frame A.

[0136] The third straight channel segment 413 extends from one end of the first straight channel segment 411 facing the middle of the middle frame A toward the screen 10 .

[0137] The second straight channel segment 412 extends from the end of the third straight channel segment facing the screen 10 to the middle of the middle frame A.

[0138] So, see Fig.10 From the first end D1 to the second end D2, the first channel section 41 approaches the screen 10 in a stepped manner. On the premise of ensuring that the thickness of the middle plate A1 remains unchanged, the distance between the first channel section 41 and the position P can be increased, thereby ensuring the molding yield of the first channel section 41.

[0139] In the above embodiments, the first straight channel segment 411, the second straight channel segment 412, the third straight channel segment 413 and the second channel segment 42 can all be arranged in the middle frame A, or a part of them can be arranged in the middle frame A and the other part can be arranged between the screen 10 and the middle frame A. Fig.10 The illustrated embodiment is illustrative in that the first straight channel segment 411 , the second straight channel segment 412 , the third straight channel segment 413 and the second channel segment 42 are all arranged in the middle frame A, which is not to be regarded as a special limitation to the present application.

[0140] In some other embodiments, see Fig.11 , Fig.11 Schematic diagram of the cross-sectional structure of the electronic device 100 provided for some other embodiments of the present application. In this embodiment, the first straight channel segment 411 and the third straight channel segment 413 are arranged in the middle frame A. Specifically, the first straight channel segment 411 and the third straight channel segment 413 can be at least partially arranged in the frame A2. One end of the third straight channel segment 413 facing the screen 10 passes through the surface of the middle frame A facing the screen 10. The second channel segment 42 is also arranged in the middle frame A. Specifically, the second channel segment 42 can be arranged in the middle plate A1. The third end D3 of the second channel segment 42 passes through the surface of the middle frame A facing the screen 10.

[0141] On the basis of the above, please continue to refer to Fig.11 The electronic device 100 further includes a sealing ring 50. The material of the sealing ring 50 includes but is not limited to glue, adhesive, foam, nitrile rubber, silicone rubber and fluorine rubber. The sealing ring 50 is arranged between the screen 10 and the middle frame A, and the area surrounded by the sealing ring 50 forms a second straight channel section 412. In this way, under the premise that the length of the second channel section 42 along the Z-axis direction is constant, the thickness of the middle frame A can be further reduced, so as to facilitate the thinning of the electronic device 100.

[0142] exist Figure 7 , Fig. 9 or Fig.10On the basis of the illustrated embodiment, the second straight channel segment 412 may penetrate the surface of the middle frame A facing the screen 10 to form an opening a, and the screen 10 covers the opening a.

[0143] In this way, the screen 10 forms the side wall of the second straight channel section 412. On the premise of ensuring the height of the second straight channel section 412 in the Z-axis direction and the distance from the first channel section 41 to the position P, the thickness of the middle plate A1 can be further reduced, which is conducive to the thinning of the middle frame A and even the electronic device 100.

[0144] At the same time, with the help of the opening a, the difficulty of setting the sound pickup channel 40 can be simplified. Specifically, the sound pickup channel 40 can be processed by a computer numerical control (CNC) machine tool, and the CNC machine tool can perform operations such as hole turning and milling.

[0145] For example, Figure 7 The sound pickup channel 40 in the electronic device 100 shown in the figure can first be bored from the outer side m1 of the middle frame A to the middle of the middle frame A to form a first straight channel section 411; then, a second straight channel section 412 is milled from the surface of the middle frame A for connecting the screen 10 by a milling process, and the end of the second straight channel section 412 facing the outer side m1 is connected to the first straight channel section 411; finally, a hole is bored from the bottom surface of the end of the second straight channel section 412 away from the outer side m1 to the surface of the middle frame A facing away from the screen 10 to form a second channel section 42. This operation is simple and easy to implement.

[0146] Fig. 9 The sound pickup channel 40 in the electronic device 100 shown in the figure can be formed in the same manner as described above. Figure 7 The sound pickup channel 40 in the electronic device 100 is formed in the same manner, which will not be described in detail here.

[0147] Another example, for Fig.10 The sound pickup channel 40 in the electronic device 100 shown in the figure can firstly be bored from the outer side m1 of the middle frame A to the middle of the middle frame A to form a first straight channel section 411; secondly, a second straight channel section 412 is milled from the surface of the middle frame A for connecting the screen 10 by a milling process; then, a hole is bored from the bottom surface of the end of the second straight channel section 412 facing the outer side m1 to the first straight channel section 411 to form a third straight channel section 413; finally, a hole is bored from the bottom surface of the end of the second straight channel section 412 away from the outer side m1 to the surface of the middle frame A facing away from the screen 10 to form a second channel section 42. This operation is simple and easy to implement.

[0148] On the basis of the above, optional, please continue to refer to Figure 7 , Fig. 9 or Fig.10 A sealing ring 50 is provided between the screen 10 and the middle frame A. The material of the sealing ring 50 includes but is not limited to glue, adhesive, foam, nitrile rubber, silicone rubber and fluororubber. The sealing ring 50 is arranged around the opening a. In this way, the airtightness of the second linear channel section 412 can be ensured.

[0149] Based on any of the above embodiments, the second channel section 42 may extend along a straight line, or along a curve or a broken line. When the second channel section 42 extends along a straight line, the second channel section 42 may extend along the Z-axis direction, or may be inclined relative to the Z-axis direction. The present application is exemplified by the second channel section 42 extending along the Z-axis direction, which cannot be considered as a special limitation to the present application.

[0150] The above embodiments introduce the structure of the sound pickup channel 40. The internal structure of the accommodating chamber C will be introduced below. The internal structure of the accommodating chamber C can be combined with the sound pickup channel 40 described in any of the above embodiments. Figure 7 The combination of the sound pickup channel 40 in the electronic device 100 is used as an example for description, which cannot be regarded as a special limitation to the present application.

[0151] As mentioned above, please refer to Figure 7 The MIC 30 is disposed in the accommodating cavity C. The MIC 30 has a sound pickup hole 30 a. The sound pickup hole 30 a is connected to the fourth end D4 of the sound pickup channel 40 .

[0152] There are many structural forms of MIC 30. In some embodiments, MIC 30 may be a micro-electro-mechanical system (MEMS) microphone. For example, a MEMS microphone may have the following structure:

[0153] See also Fig.12 , Fig.12 The cross-sectional structure diagram of the MIC 30 in the electronic device 100 provided in some embodiments of the present application. The MIC 30 includes a housing 31, a substrate 32, a microphone chip 33 and an integrated circuit 34.

[0154] The sound pickup hole 30a is arranged on the substrate 32, and the housing 31 and the substrate 32 enclose a cavity, and the cavity is connected to the sound pickup hole 30a. The microphone chip 33 and the integrated circuit 34 are fixed on the substrate 32 and are located in the cavity.

[0155] The microphone chip 33 includes a back plate 331 and a diaphragm 332. The back plate 331 and the diaphragm 332 are arranged parallel to each other and spaced apart to form a parallel plate capacitor. The end of the microphone chip 33 opposite to the parallel plate capacitor is an opening structure, which is connected to the sound pickup hole 30a. The integrated circuit 34 is electrically connected to the microphone chip 33.

[0156] In this way, the sound signal entering from the sound pickup channel 40 can enter the microphone chip 33 through the sound pickup hole 30a, causing the diaphragm 332 to vibrate, thereby changing the capacitance of the parallel plate capacitor and causing the integrated circuit 34 to output an electrical signal, thereby realizing sound-to-electricity conversion.

[0157] The MIC 30 is a bottom-opening MEMS microphone, which has a simple structure and is easy to manufacture.

[0158] See also Figure 7 The sound pickup hole 30a can be opposite to and directly connected to the fourth end D4. This structure is simple, and the moving path of the sound signal from the sound pickup channel 40 to the MIC 30 is shorter, which can increase the peak frequency fh of the MIC 30, improve the working frequency band of the MIC 30, and enhance the high-frequency performance of the MIC 30.

[0159] In other embodiments, other structures may be provided between the sound pickup hole 30a and the fourth end D4, and the other structures may be provided with a communication channel, through which the sound pickup hole 30a is communicated with the fourth end D4.

[0160] For examples, see Fig.13 , Fig.13 The cross-sectional structure diagram of the electronic device 100 provided in some other embodiments of the present application. In this embodiment, the electronic device 100 further includes a circuit board 60 .

[0161] The circuit board 60 is located on the side of the middle frame A facing away from the screen 10, and the circuit board 60 can be located in the accommodating cavity C. The circuit board 60 is provided with a first through hole 61, and the first through hole 61 can be a circular hole, an elliptical hole, a square hole, a triangular hole, etc., which is not specifically limited in the present application. The first through hole 61 is opposite to and connected to the fourth end D4.

[0162] Based on this, see Fig.13 , the MIC 30 can be disposed on the circuit board 60 , and the sound pickup hole 30 a is connected to the first through hole 61 .

[0163] In this way, the MIC 30 can be conveniently electrically connected to other electronic components such as a controller and a memory by means of the circuit board 60. Based on this, a first through hole 61 is provided on the circuit board 60, and the first through hole 61 is opposite to and connected to the fourth end D4, and the sound pickup hole 30a is connected to the first through hole 61. This layout is reasonable and can improve the compactness of the layout of electronic components in the electronic device.

[0164] Based on the above embodiments, in order to prevent foreign matter (such as dust, debris, etc.) outside the electronic device 100 from entering the MIC 30 along the sound pickup channel 40, in some embodiments, refer to Fig.14 , Fig.14 for Fig.13 The partially enlarged view of area I in the electronic device 100 shows that a dustproof net 70 is provided between the middle frame A and the circuit board 60 .

[0165] The dustproof net 70 includes a net body 71 , and the material of the net body 71 includes but is not limited to metal and plastic. At least a portion of the net body 71 is located between the fourth end D4 and the first through hole 61 .

[0166] In this way, the dustproof net 70 can prevent foreign objects outside the electronic device 100 from entering the MIC 30 along the sound pickup channel 40, thereby ensuring the performance of the MIC 30 and extending its service life.

[0167] In the above embodiments, in order to ensure the airtightness of the dustproof net 70, in some embodiments, please continue to refer to Fig.14 ,

[0168] The mesh body 71 includes a middle portion 71 a and an edge portion 71 b surrounding the middle portion 71 a. The middle portion 71 a is located between the fourth end D4 and the first through hole 61.

[0169] On the basis of the above, the dustproof net 70 further includes a first sealing glue layer 72 , a second sealing glue layer 73 and an elastic sealing layer 74 .

[0170] The first sealant layer 72 is bonded between the edge portion 71 b and the middle frame A, the second sealant layer 73 is bonded between the edge portion 71 b and the elastic sealant layer 74 , and the elastic sealant layer 74 is located between the second sealant layer 73 and the circuit board 60 .

[0171] The circuit board 60 can be fixedly connected to the middle frame A by means of connecting parts such as screws to squeeze the elastic sealing layer 74 and put the elastic sealing layer 74 in a compressed state to achieve sealing and ensure the air tightness of the dustproof net 70.

[0172] In the above embodiment, please refer to Fig.13MIC 30 can be located on the side of the circuit board 60 facing away from the second channel section 42, and the sound pickup hole 30a of MIC 30 is opposite to and connected with the first through hole 61. This structure is simple, and the moving path of the sound signal entering MIC 30 through the sound pickup channel 40 and the first through hole 61 is short, which can increase the peak frequency fh of MIC 30, improve the working frequency band of MIC 30, and enhance the high-frequency performance of MIC 30.

[0173] In some embodiments, other structures may be provided between the sound pickup hole 30 a of the MIC 30 and the first through hole 61 . The other structures are provided with a communication channel, and the sound pickup hole 30 a is communicated with the first through hole 61 via the communication channel.

[0174] For examples, see Fig.15 , Fig.15 The cross-sectional structure diagram of the electronic device 100 provided in some embodiments of the present application is shown in FIG. 1. In this embodiment, the circuit board 60 is further provided with a second through hole 62, and the second through hole 62 includes but is not limited to a circular hole, an elliptical hole, a square hole, a triangular hole, a pentagonal hole, and the like.

[0175] The second through hole 62 is spaced apart from the first through hole 61. Fig.15 The MIC 30 and the second channel section 42 are located on the same side of the circuit board 60 , and the sound pickup hole 30 a of the MIC 30 is opposite to and communicates with the second through hole 62 .

[0176] On the basis of the above, the electronic device 100 further includes a sealing cover 80. The sealing cover 80 is located on the side of the circuit board 60 facing away from the MIC 30 and the second channel section 42, and the sealing cover 80 and the circuit board 60 form an airflow cavity 90, which is connected to both the first through hole 61 and the second through hole 62.

[0177] In this way, the first through hole 61, the airflow cavity 90 and the second through hole 62 form a U-shaped channel connected between the sound pickup channel 40 and the sound pickup hole 30a, and the sound signal outside the electronic device 100 (such as Fig.15 As shown by the arrow in the figure, the sound signal can be transmitted to the MIC 30 via the sound pickup channel 40 and the U-shaped channel in sequence, and the sound signal can be further converted into an electrical signal with the help of the MIC 30.

[0178] Moreover, along the direction perpendicular to the circuit board 60, that is, the Z-axis direction, the height of the sealing cover 80 can be smaller than the height of the MIC 30, so compared with Fig.13 The solution shown is beneficial to reducing the stacking thickness of the entire device and can achieve a thinner electronic device 100 .

[0179] In addition, since the MIC 30 and the second channel section 42 are located on the same side of the circuit board 60, and the second channel section 42 is provided on the middle plate A1, and the back cover B and the middle plate A1 are respectively located on opposite sides of the circuit board 60, the MIC 30 and the back cover B are respectively located on opposite sides of the circuit board 60. Thus, the MIC 30 can be protected by the circuit board 60 to prevent the external force from the back cover B from damaging the MIC 30, and thus there is no need to provide a special protective cover for the MIC 30.

[0180] In some embodiments, see Fig.15 The surface of the middle frame A facing away from the screen 10 is provided with an avoidance groove Q, and the MIC 30 is accommodated in the avoidance groove Q. In this way, by providing the avoidance groove Q, the circuit board 60 can be closer to the middle frame A, and the thickness overlap between the MIC 30 and the middle frame A is avoided, so that the thickness of the electronic device 10 can be reduced, which is conducive to improving the portability and use feel of the electronic device 100.

[0181] In some embodiments, see Fig.15 , along a direction perpendicular to the circuit board 60 , that is, the Z-axis direction, a height H2 of the sealing cover 80 may be smaller than a height H1 of the MIC 30 .

[0182] In this way, the stacking height of the electronic components on the side of the middle plate A1 facing away from the screen 10 can be reduced. Fig.13 The solution shown is conducive to reducing the stacking thickness of the entire device, can achieve thinning of the electronic device 100, and improve the portability and handling of the electronic device 100.

[0183] In some embodiments, see Fig.15 , along the direction perpendicular to the circuit board 60, the height H2 of the sealing cover 80 may be greater than or equal to 0.4 mm and less than or equal to 0.9 mm. Specifically, the height H2 of the sealing cover 80 may be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm or 0.9 mm.

[0184] In this way, the height H2 of the sealing cover 80 is moderate, which can reduce the thickness of the whole device while ensuring the height of the airflow cavity 90, increase the peak frequency fh of the MIC 30, improve the working frequency band of the MIC 30, and enhance the high-frequency performance of the MIC 30.

[0185] In some embodiments, please refer to Fig.15 The wall thickness of the sealing cover 80 may be greater than or equal to 0.08 mm and less than or equal to 0.3 mm. Specifically, the wall thickness of the sealing cover 80 may be 0.08 mm, 0.1 mm, 0.15 mm, 0.18 mm, 0.2 mm, 0.25 mm, 0.28 mm or 0.3 mm.

[0186] In this way, the wall thickness of the sealing cover 80 is moderate, which can ensure the height of the airflow cavity 90 while ensuring the structural strength of the sealing cover 80, thereby increasing the peak frequency fh of the MIC 30, improving the working frequency band of the MIC 30, and enhancing the high-frequency performance of the MIC 30.

[0187] In some embodiments, the sealing cover 80 may be made of metal. Specifically, the metal includes, but is not limited to, iron, iron alloy, copper, copper alloy, aluminum or aluminum alloy. The hardness of the metal is relatively high. Under the premise of ensuring the structural strength of the sealing cover 80, the wall thickness of the sealing cover 80 can be reduced, so as to increase the height of the airflow chamber 90 while reducing the height of the sealing cover 80.

[0188] In other embodiments, the sealing cover 80 may also be made of plastic. Specifically, the plastic includes but is not limited to polycarbonate (PC), PC+glass fiber and ABS plastic (acrylonitrile butadiene styrene plastic). Plastic is easy to mold and inexpensive, which is conducive to cost saving.

[0189] The following embodiments are described on the basis that the sealing cover 80 is made of metal, which is not to be considered as a special limitation to the present application.

[0190] Based on the above embodiments, the sealing cover 80 may be in the shape of a spherical shell, a cylindrical shell, or the like.

[0191] In some embodiments, see Fig.16 , Fig.16 for Fig.15 The schematic diagram of the cross-sectional structure of the sealing cover 80 in the electronic device 100 shown in FIG. 8 is a schematic diagram of the cross-sectional structure of the sealing cover 80, which includes a top plate 81, a side plate 82 and an annular bottom plate 83. The side plate 82 is arranged along the edge of the top plate 81. The annular bottom plate 83 is connected to one end of the side plate 82 away from the top plate 81, and the annular bottom plate 83 is connected to the Fig.15 The circuit board 60 in the embodiment of the present invention.

[0192] In this way, the sealing cover 80 is roughly a cylindrical shell structure, which is simple in structure. Moreover, under the premise that the height of the sealing cover 80 in the Z-axis direction is constant, a larger space can be formed inside to ensure the volume of the airflow cavity when applied in the electronic device 10 and increase the peak frequency fh of the MIC 30.

[0193] In the above embodiment, the side plate 82 can be perpendicular to the top plate 81, and the annular bottom plate 83 can be parallel to the top plate 81. This structure is simple and convenient to process.

[0194] In other embodiments, the side plate 82 and the annular bottom plate 83 may also be inclined relative to the top plate 81. The present application is illustrated by taking the example that the side plate 82 is perpendicular to the top plate 81 and the annular bottom plate 83 is parallel to the top plate 81, which cannot be regarded as a special limitation on the present application.

[0195] The annular bottom plate 83 may be connected to the circuit board 60 by gluing or by welding.

[0196] In some embodiments, see Fig.17 , Fig.17 for Fig.15 The bottom view of the circuit board 60 in the electronic device 100 is shown. The circuit board 60 is provided with an annular connection pad 63, and the annular bottom plate 83 is welded to the annular connection pad 63.

[0197] In this way, the sealing cover 80 and the circuit board 60 are fixedly connected by welding, the connection is relatively stable, and the circumference of the annular bottom plate 83 and the circumference of the annular connecting pad 63 can be welded, so that sealing can be achieved to a certain extent.

[0198] In addition, the first through hole 61 and the second through hole 62 can balance the air pressure inside and outside the airflow cavity 90 , thereby preventing the sealing cover 80 from being desoldered due to heating of the air inside the airflow cavity 90 during welding of the sealing cover 80 on the circuit board 60 .

[0199] Specifically, the annular bottom plate 83 can be welded on the annular connecting pad 63 by using surface mounted technology (SMT). In this way, welding efficiency can be improved and assembly cost can be reduced.

[0200] The top plate 81, the side plate 82 and the annular bottom plate 83 can be integrally formed, and can be specifically integrally formed by metal stamping, casting and other processes. In other embodiments, the top plate 81, the side plate 82 and the annular bottom plate 83 can also be formed separately and fixedly connected by welding and other methods, which is not specifically limited in this application.

[0201] The annular bottom plate 83 includes an inner edge n1 and an outer edge n2 . The inner edge n1 faces the area surrounded by the annular bottom plate 83 , and the outer edge n2 is away from the area surrounded by the annular bottom plate 83 .

[0202] On the basis of the above, optional, please refer back to Fig.16 The end of the side plate 82 away from the top plate 81 is located in the area surrounded by the annular bottom plate 83 and connected to the inner edge n1. The sealing cover 80 has a simple structure and can be formed by stamping, which is conducive to simplifying the difficulty of forming.

[0203] In some other embodiments, the end of the side panel 82 away from the top panel 81 may also be connected to the outer edge n2 of the annular bottom panel 83, or connected to the middle part between the outer edge n2 and the inner edge n1. The following embodiments are further introduced on the basis that the end of the side panel 82 away from the top panel 81 is connected to the inner edge n1, which cannot be regarded as a special limitation on the present application.

[0204] In some embodiments, see Fig.18 , Fig.18 for Fig.15 The cross-sectional structure diagram of the connection structure between the sealing cover 80 and the circuit board 60 in the electronic device 100 is shown. A sealant K is provided on the side of the outer edge n2 away from the inner edge n1, and the sealant K is bonded to the outer edge n2 and the circuit board 60. The sealant K includes but is not limited to glue.

[0205] In this way, the sealing cover 80 can be secondary sealed and reinforced by means of the sealant K to avoid air leakage at the connection gap between the annular bottom plate 83 and the circuit board 60.

[0206] In some embodiments, please refer back to Fig.15 , the cross-sectional area of ​​the first through hole 61 can be larger than the cross-sectional area of ​​the second through hole 62. In this way, after the sound signal enters the accommodating cavity C from the sound pickup channel 40, it can smoothly enter the airflow cavity 90 through the first through hole 61, and enter the sound pickup hole 30a from the second through hole 62. Since the cross-sectional area of ​​the sound pickup hole 30a is small, the cross-sectional area of ​​the second through hole 62 opposite to the sound pickup hole 30a is small, thereby increasing the contact area between the circuit board 60 and the substrate 32 of the MIC 30, ensuring the support stability. This layout is reasonable and has better performance.

[0207] Based on the above embodiments, in some embodiments, please refer to Fig.19 , Fig.19 for Fig.15 The top view of the sealing cover 80 in the electronic device 100 is shown. In this embodiment, the side plate 82 includes a first arc-shaped side plate 821, a second arc-shaped side plate 822, a first transition plate 823 and a second transition plate 824.

[0208] The first arc-shaped side plate 821 is located at a side of the first through hole 61 away from the second through hole 62 and extends along the circumference of the first through hole 61. The second arc-shaped side plate 822 is located at a side of the second through hole 62 away from the first through hole 61 and extends along the circumference of the second through hole 62.

[0209] The radius r1 of the arc-shaped inner wall surface of the first arc-shaped side plate 821 is greater than the radius r2 of the arc-shaped inner wall surface of the second arc-shaped side plate 822 .

[0210] On the basis of the above, please continue to refer to Fig.19The two ends of the first arc-shaped side plate 821 along the circumference of the first through hole 61 are respectively the first end x1 and the second end x2, and the two ends of the second arc-shaped side plate 822 along the circumference of the second through hole 62 are respectively the third end x3 and the fourth end x4. The first transition plate 823 is connected between the first end x1 and the third end x3, and the second transition plate 824 is connected between the second end x2 and the fourth end x4.

[0211] In this way, the shape of the sealing cover 80 is roughly spindle-shaped, with a larger internal space at one end of the spindle-shaped structure and a smaller internal space at the other end. The end with the larger internal space is connected to the first through hole 61 with a larger diameter, and the end with the smaller internal space is connected to the second through hole 62 with a smaller diameter. This layout is reasonable and can reduce the volume of the sealing cover 80 while helping to increase the peak frequency fh of the MIC 30.

[0212] In the above embodiment, the first transition plate 823 and the second transition plate 824 may be flat plates or curved plates.

[0213] In some embodiments, see Fig.19 The first transition plate 823 and the second transition plate 824 are both flat plates, and the first transition plate 823 is tangent to the first end x1 of the first arc-shaped side plate 821 and the third end x3 of the second arc-shaped side plate 822. The second transition plate 824 is tangent to the second end x2 of the first arc-shaped side plate 821 and the fourth end x4 of the second arc-shaped side plate 822.

[0214] In this way, the side plate 82 has a simple structure and is easy to process, which is beneficial to reducing costs.

[0215] In some embodiments, the first through hole 61 and the second through hole 62 may be round holes. The sound wave and airflow are transmitted more smoothly in the round holes, and the sound pickup effect of the MIC 30 is better.

[0216] Based on the above examples, please refer to Fig.19 The center line of the first arc-shaped side plate 821 is collinear with the center line of the first through hole 61 , and the center line of the second arc-shaped side plate 822 is collinear with the center line of the second through hole 62 .

[0217] Along the radial direction of the first through hole 61 , the distance between the arc-shaped inner wall surface of the first arc-shaped side plate 821 and the inner wall surface of the first through hole 61 is a first distance M1 .

[0218] Along the radial direction of the second through hole 62 , the distance between the arc-shaped inner wall surface of the second arc-shaped side plate 822 and the inner wall surface of the second through hole 62 is a second distance M2 .

[0219] The second distance M2 is equal to the first distance M1. It should be noted that the second distance M2 is equal to the first distance M1 but is not limited to being absolutely equal to the first distance M1. When the absolute value of the difference between the second distance M2 and the first distance M1 is within the range of 0 mm-0.1 mm, the second distance M2 can be considered equal to the first distance M1.

[0220] In this way, the layout is reasonable and can minimize the board area occupied by the sealing cover 80 on the circuit board 60 , so as to reduce the volume of the airflow cavity 90 in the sealing cover 80 , thereby facilitating the improvement of the peak frequency fh of the MIC 30 .

[0221] In some embodiments, please refer to Fig.19 , the first distance M1 and the second distance M2 can be greater than or equal to 0.2 mm, and less than or equal to 0.5 mm. Specifically, the first distance M1 and the second distance M2 can be 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm. In this way, the first distance M1 and the second distance M2 are moderate, and can take into account both the volume of the sealing cover 80 and the peak frequency fh of the MIC 30.

[0222] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0223] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: A screen, wherein the screen comprises a display surface; A middle frame, the middle frame being arranged on a side of the screen facing away from the display surface; A sound pickup channel, the sound pickup channel is located on the side of the screen facing away from the display surface, and the sound pickup channel includes a first channel section and a second channel section; wherein, The two ends of the first channel section are respectively a first end and a second end, the first end is located on the outer side of the middle frame, and from the first end to the second end, the first channel section extends toward the middle of the middle frame, and along a direction perpendicular to the screen, the second end is closer to the screen than the first end; The two ends of the second channel section are respectively a third end and a fourth end, the third end is connected to the second end, the second channel section extends from the third end to the fourth end in a direction away from the screen, and the fourth end passes through a surface of the middle frame facing away from the screen; A microphone is located on a side of the middle frame facing away from the screen, and has a sound pickup hole connected to the fourth end.

2. The electronic device according to claim 1, characterized in that: From the first end to the second end, the first channel section approaches the screen.

3. The electronic device according to claim 2, characterized in that: The first channel section includes a first straight channel section and a second straight channel section; The first straight channel segment extends from the outer surface of the middle frame to the middle of the middle frame and is inclined toward the screen, and the second straight channel segment is connected between one end of the first straight channel segment facing the screen and the third end; The second straight channel section is parallel to the screen; or, From the first straight channel segment to the second channel segment, the second straight channel segment is inclined toward the screen, and an inclination angle of the second straight channel segment relative to the screen is smaller than an inclination angle of the first straight channel segment relative to the screen.

4. The electronic device according to claim 3, characterized in that: The first straight channel segment is disposed in the middle frame, and one end of the first straight channel segment facing the screen passes through a surface of the middle frame facing the screen; The second channel section is disposed in the middle frame, and the third end of the second channel section passes through the surface of the middle frame facing the screen; The electronic device further comprises: A sealing ring is arranged between the screen and the middle frame, and the area surrounded by the sealing ring forms the second straight channel section.

5. The electronic device according to claim 3, characterized in that: The first straight channel section, the second straight channel section and the second channel section are all arranged in the middle frame.

6. The electronic device according to claim 2, characterized in that: The first channel section includes a first straight channel section, a second straight channel section and a third straight channel section; The first straight channel section extends from the outer side of the middle frame to the middle part of the middle frame; The third straight channel segment extends from one end of the first straight channel segment facing the middle of the middle frame toward the screen; The second straight channel segment extends from an end of the third straight channel segment facing the screen toward the middle of the middle frame.

7. The electronic device according to claim 6, characterized in that: The first straight channel segment and the third straight channel segment are arranged in the middle frame, and one end of the third straight channel segment facing the screen passes through the surface of the middle frame facing the screen; The second channel section is arranged in the middle frame, and the third end of the second channel section passes through the surface of the middle frame facing the screen; The electronic device further comprises: A sealing ring is arranged between the screen and the middle frame, and the area surrounded by the sealing ring forms the second straight channel section.

8. The electronic device according to claim 6, characterized in that: The first straight channel segment, the second straight channel segment, the third straight channel segment and the second channel segment are all arranged in the middle frame.

9. The electronic device according to claim 5 or 8, characterized in that: The second straight channel section passes through a surface of the middle frame facing the screen to form an opening, and the screen covers the opening.

10. The electronic device according to claim 9, characterized in that: A sealing ring is provided between the screen and the middle frame, and the sealing ring is arranged around the opening.

11. The electronic device according to claim 2, characterized in that: The first channel section and the second channel section are both arranged in the middle frame; The first channel section extends along a straight line, and from the first end to the second end, the first channel section is inclined toward the screen.

12. The electronic device according to any one of claims 1 to 11, characterized in that: Also includes: A circuit board, the circuit board is located on a side of the middle frame facing away from the screen, the circuit board is provided with a first through hole, and the first through hole is opposite to and connected to the fourth end; The microphone is arranged on the circuit board, and the sound pickup hole of the microphone is communicated with the first through hole.

13. The electronic device according to claim 12, characterized in that: A dustproof net is provided between the middle frame and the circuit board, wherein the dustproof net comprises a net body, and at least a portion of the net body is located between the fourth end and the first through hole.

14. The electronic device according to claim 13, characterized in that: The net body comprises a middle portion and an edge portion surrounding the middle portion, wherein the middle portion is located between the fourth end and the first through hole; The dustproof net also includes a first sealant layer, a second sealant layer and an elastic sealant layer; the first sealant layer is bonded between the edge portion and the middle frame; the second sealant layer is bonded between the edge portion and the elastic sealant layer; the elastic sealant layer is located between the second sealant layer and the circuit board.

15. The electronic device according to any one of claims 12 to 14, characterized in that: The circuit board is further provided with a second through hole, and the second through hole is spaced apart from the first through hole; the microphone and the second channel section are located on the same side of the circuit board, and the sound pickup hole of the microphone is opposite to and connected to the second through hole; The electronic device further comprises: A sealing cover is located on a side of the circuit board facing away from the microphone and the second channel section, and the sealing cover and the circuit board form an airflow cavity, and the airflow cavity is connected to both the first through hole and the second through hole.

16. The electronic device according to claim 15, characterized in that: A surface of the middle frame facing away from the screen is provided with an avoidance groove, and the microphone is accommodated in the avoidance groove.

17. The electronic device according to claim 15 or 16, characterized in that: A cross-sectional area of ​​the first through hole is greater than a cross-sectional area of ​​the second through hole.

18. The electronic device according to any one of claims 15 to 17, characterized in that: In a direction perpendicular to the circuit board, a height of the sealing cover is smaller than a height of the microphone.

19. The electronic device according to any one of claims 15 to 18, characterized in that: The sealing cover is made of metal.

20. The electronic device according to any one of claims 15 to 19, characterized in that: The sealing cover comprises a top plate, a side plate and an annular bottom plate; The side plate is arranged along the edge of the top plate, the annular bottom plate is connected to one end of the side plate away from the top plate, and the annular bottom plate is connected to the circuit board.

21. The electronic device according to claim 20, characterized in that: The annular bottom plate comprises an inner edge, and one end of the side plate away from the top plate is located in the area surrounded by the annular bottom plate and is connected to the inner edge.

22. The electronic device according to claim 21, characterized in that: The annular bottom plate further comprises an outer edge, and a sealant is provided on a side of the outer edge away from the inner edge, and the sealant is bonded to both the outer edge and the circuit board.

23. The electronic device according to any one of claims 20 to 22, characterized in that: The side plate comprises a first arc-shaped side plate, a second arc-shaped side plate, a first transition plate and a second transition plate; The first arc-shaped side plate is located on a side of the first through hole away from the second through hole and extends along the circumference of the first through hole, the second arc-shaped side plate is located on a side of the second through hole away from the first through hole and extends along the circumference of the second through hole, and the radius of the arc-shaped inner wall surface of the first arc-shaped side plate is greater than the radius of the arc-shaped inner wall surface of the second arc-shaped side plate; Two ends of the first arc-shaped side plate along the circumference of the first through hole are respectively a first end and a second end, and two ends of the second arc-shaped side plate along the circumference of the second through hole are respectively a third end and a fourth end; The first transition plate is connected between the first end and the third end, and the second transition plate is connected between the second end and the fourth end.

24. The electronic device according to claim 23, characterized in that: The first transition plate and the second transition plate are both flat plates, and the first transition plate is tangent to the first end of the first arcuate side plate and the third end of the second arcuate side plate, and the second transition plate is tangent to the second end of the first arcuate side plate and the fourth end of the second arcuate side plate.

25. The electronic device according to claim 24, characterized in that: The first through hole and the second through hole are both circular holes; The center line of the circle corresponding to the first arc-shaped side plate is collinear with the center line of the circle of the first through hole, and the center line of the circle corresponding to the second arc-shaped side plate is collinear with the center line of the circle of the second through hole; Along the radial direction of the first through hole, the distance between the arc-shaped inner wall surface of the first arc-shaped side plate and the inner wall surface of the first through hole is a first distance; along the radial direction of the second through hole, the distance between the arc-shaped inner wall surface of the second arc-shaped side plate and the inner wall surface of the second through hole is a second distance; The second distance is equal to the first distance.

26. The electronic device according to any one of claims 1 to 25, characterized in that: The electronic device is a folding screen device.

Images