microphone
By separating the chip components in independent cavities in the microphone and dividing the areas with metal layers, the problem of chip heat affecting other devices is solved, and the effects of heat isolation and anti-RF interference are achieved.
Patent Information
- Application Number
- PCT/CN2024/086040
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-04-03
- Publication Date
- 2025-10-09
AI Technical Summary
In existing microphones, the heat of MEMS chips and AISC chips can easily affect the performance of other devices through heat conduction of the circuit board substrate or heat dissipation through air movement.
The chip components of the microphone are separated in an independent cavity, and a metal layer is set on the circuit board to surround the chip components. The chip area is divided by the metal layer to prevent heat from affecting other devices.
It effectively isolates the heat dissipation path of chip components, reduces the performance impact on other devices, and meets anti-RF interference and ventilation requirements.
Smart Images
Figure CN2024086040_09102025_PF_FP_ABST
Abstract
Description
microphone Technical Field
[0001] The utility model relates to the technical field of sound-to-electricity conversion, in particular to a new microphone. Background Art
[0002] A microphone is a circulator that converts sound into electronic signals. It mainly includes a housing, a circuit board that is surrounded by the housing to form multiple cavities, and a MEMS chip or multiple AISC chips respectively housed in the multiple cavities.
[0003] When multiple MEMS chips and multiple AISC chips in the related technology work together, the AISC chip will generate a lot of heat. This heat will be dissipated through the substrate of the circuit board or through the thermal movement of the air in the cavity. Both heat dissipation methods will affect the performance of other devices, especially devices that are easily affected by heat.
[0004] Therefore, it is necessary to provide a new microphone to solve the above problems. Technical issues
[0005] The purpose of the present invention is to provide a new microphone to solve the problem that the microphone of the related art easily affects the performance of other devices by heat conduction of the substrate of the circuit board or heat movement of the air to dissipate heat. Technical Solutions
[0006] In order to solve the above problems, the present invention provides a microphone, which includes a shell, a circuit board fixed to the shell and together forming a first cavity and a second cavity, a first chip assembly fixed to the side of the circuit board close to the shell and located in the first cavity, and a second chip assembly fixed to the side of the circuit board close to the shell and located in the second cavity; the first chip assembly includes a first AISC chip and a first MEMS chip, the second chip assembly includes a second AISC chip and a second MEMS chip, and the first cavity and the second cavity are connected to each other; the microphone also includes a first metal layer fixed to the side of the circuit board close to the shell and arranged around the first chip assembly and the second chip assembly respectively, and the shell is fixed to the side of the first metal layer away from the circuit board.
[0007] Preferably, the shell includes a shell with an annular structure and fixed to the first metal layer, a partition protruding from one side of the shell to the other side of the shell and fixed to the first metal layer, and a cover plate simultaneously covering the side of the shell away from the circuit board and the side of the partition away from the circuit board; the cover plate and the circuit board are respectively located on opposite sides of the shell and together form a cavity, and the partition divides the cavity into the first cavity and the second cavity; the microphone also includes a second metal layer simultaneously fixed to the side of the shell close to the circuit board and the side of the partition close to the circuit board, and / or a third metal layer simultaneously fixed to the side of the shell away from the circuit board and the side of the partition away from the circuit board, the second metal layer is adhered and fixed to the first metal layer, and the cover plate is covered on the side of the third metal layer away from the circuit board; the second metal layer fixed on the partition and / or the third metal layer fixed on the partition are provided with a notch, and the notch connects the first cavity and the second cavity.
[0008] Preferably, the second metal layer fixed on the partition and the third metal layer fixed on the partition are respectively provided with the notches.
[0009] Preferably, the total area of all the notches is less than 6400um 2 .
[0010] Preferably, the orthographic projections of the second metal layer and / or the third metal layer toward the circuit board respectively coincide with the first metal layer.
[0011] Preferably, the housing further comprises a through hole penetrating the partition and connecting the first cavity and the second cavity, and the area of the through hole is less than 6400 μm. 2 .
[0012] Preferably, the shell is rectangular, and the partition is formed by extending from a middle area on one side of the shell to a middle area on the other side thereof.
[0013] Preferably, the inner side of the shell close to the first cavity and the second cavity is a metal side wall.
[0014] Preferably, the first MEMS chip is fixed to a side of the first AISC chip away from the circuit board.
[0015] Preferably, a sound inlet hole is provided on the circuit board at a position corresponding to the second MEMS chip, and the sound inlet hole connects the second MEMS chip with the outside world. Beneficial effects
[0016] Compared with the prior art, the microphone of the present invention arranges the first AISC chip and the first MEMS chip in the first chip assembly in the first cavity, and arranges the second AISC chip and the second MEMS chip in the second chip assembly in the second cavity, and also fixes a first metal layer respectively surrounding the first chip assembly and the second chip assembly on the circuit board. In this way, the area of the first chip assembly and the area of the second chip assembly can be separated by the first metal layer to avoid the problem that the heat generated by the operation of the AISC chip affects the performance of other devices by heat conduction through the substrate of the circuit board or thermal movement of the air. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. Among them:
[0018] FIG1 is a schematic diagram of the three-dimensional structure of a microphone provided by an embodiment of the present utility model;
[0019] FIG2 is a schematic diagram of the exploded structure of a microphone provided by an embodiment of the present invention;
[0020] FIG3 is a cross-sectional view along line AA of FIG1 .
[0021] 100. Microphone; 1. Housing; 101. Shell; 102. Partition; 103. Cover; 104. First cavity; 105. Second cavity; 2. Circuit board; 201. Sound inlet; 3. First chip assembly; 301. First AISC chip; 302. First MEMS chip; 4. Second chip assembly; 401. Second AISC chip; 402. Second MEMS chip; 5. First metal layer; 6. Third metal layer; 7. Notch; 8. Pad; 9. Connecting wire. Modes for Carrying Out the Invention
[0022] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0023] An embodiment of the present invention provides a microphone 100, as shown in Figures 1 to 3, which includes a housing 1, a circuit board 2 fixed to the housing 1 and together enclosing a first cavity 104 and a second cavity 105, a first chip assembly 3 fixed to the side of the circuit board 2 close to the housing 1 and located in the first cavity 104, and a second chip assembly 4 fixed to the side of the circuit board 2 close to the housing 1 and located in the second cavity 105; the first chip assembly 3 includes a first AISC chip 301 and a first MEMS chip 302, the second chip assembly 4 includes a second AISC chip 401 and a second MEMS chip 402, and the first cavity 104 and the second cavity 105 are connected to each other.
[0024] The inner side of the housing 1 close to the first cavity 104 and the second cavity 105 is a metal sidewall. This design can meet the anti-radio frequency interference requirements of the microphone 100.
[0025] A sound inlet hole 201 is provided on the circuit board 2 at a position corresponding to the second MEMS chip 402 , and the sound inlet hole 201 connects the second MEMS chip 402 with the outside.
[0026] The first MEMS chip 302 is fixed to a side of the first AISC chip 301 away from the circuit board.
[0027] The first MEMS chip 302 and the first AISC chip 301 are each provided with a plurality of solder pads 8 on a side away from the circuit board 2. The first MEMS chip 302 and the first AISC chip 301 are electrically connected via a plurality of connecting wires 9, with the two ends of each connecting wire 9 connected to a corresponding solder pad 8 on the first MEMS chip 302 and a corresponding solder pad 8 on the first AISC chip 301. The circuit board 2 is also provided with a plurality of solder pads 8. The first AISC chip 301 and the circuit board 2 are electrically connected via a plurality of connecting wires 9, with the two ends of each connecting wire 9 connected to a corresponding solder pad 8 on the first AISC chip 301 and a corresponding solder pad 8 on the circuit board 2. The corresponding electrical connection method between the second MEMS chip 402, the second AISC chip 401, and the circuit board 2 is the same or similar to the electrical connection method between the first MEMS chip 302, the first AISC chip 301, and the circuit board 2, and will not be described in detail here.
[0028] Specifically, the housing 1 includes a ring-shaped shell 101 fixed to the first metal layer 5, a partition 102 protruding from one side of the shell 101 and extending to the other side of the shell 101 and fixed to the first metal layer 5, and a cover 103 covering both the side of the shell 101 away from the circuit board 2 and the side of the partition 102 away from the circuit board 2. The cover 103 and the circuit board 2 are located on opposite sides of the shell 101 and together form a cavity. The partition 102 separates the cavity into a first cavity 104 and a second cavity 105. This design can achieve physical isolation between the first chip assembly 3 and the second chip assembly 4 with different functions.
[0029] The housing 1 is rectangular, and the partition 102 is formed by extending from the middle area of one side of the housing 1 to the middle area of the other side thereof. Of course, the housing 1 can also be designed into other shapes, such as triangle, ellipse, trapezoid, etc., according to actual needs.
[0030] The housing 1 further includes a perforation penetrating the partition 102 and connecting the first cavity 104 and the second cavity 105; the area of the perforation is less than 6400 μm. 2 .
[0031] Specifically, the microphone 100 further includes a first metal layer 5 fixed to the side of the circuit board 2 near the housing 1 and surrounding the first chip assembly 3 and the second chip assembly 4. The housing 1 is fixed to the side of the first metal layer 5 away from the circuit board 2. In this way, the first metal layer 5 can separate the area of the first chip assembly 3 from the area of the second chip assembly 4.
[0032] The first metal layer 5 is a metal coating applied on the circuit board 2 .
[0033] Specifically, microphone 100 further includes a second metal layer fixed to both the side of housing 101 near circuit board 2 and the side of partition 102 near circuit board 2, and / or a third metal layer 6 fixed to both the side of housing 101 away from circuit board 2 and the side of partition 102 away from circuit board 2. The second metal layer is bonded to and fixed to the first metal layer 5, and a cover plate 103 is disposed over the side of the third metal layer 6 away from circuit board 2. The second metal layer and / or the third metal layer 6 fixed to partition 102 are provided with a notch 7, which connects first cavity 104 and second cavity 105. This design allows for the ventilation requirements of microphone 100 while reducing the number of perforations in housing 1, facilitating the design of back-end applications and saving costs.
[0034] The second metal layer and the third metal layer 6 are metal coatings coated on the housing 101 and the partition 10 respectively.
[0035] The orthographic projections of the second metal layer and / or the third metal layer 6 toward the circuit board 2 respectively coincide with the first metal layer 5 .
[0036] The total area of all notches 7 is less than 6400um 2 .
[0037] In this embodiment, only the third metal layer 6 fixed on the partition 102 is provided with the notch 7. Of course, according to actual needs, only the second metal layer fixed on the partition 102 may be provided with the notch 7, or both the second metal layer fixed on the partition 102 and the third metal layer 6 fixed on the partition 102 may be provided with the notch 7.
[0038] As another optional embodiment of the cover plate 103, a fourth metal layer corresponding to the first metal layer 5 is fixed to the area of the cover plate 103 near the circuit board 2 and corresponding to the first metal layer 5. The fourth metal layer is fixed to the third metal layer 6 on the side away from the cover plate 103. This design can cooperate with the first metal layer 5 to better separate the area of the first chip assembly 3 from the area of the second chip assembly 4.
[0039] The microphone 100 of this embodiment fixes the first AISC chip 301 and the first MEMS chip 302 in the first chip assembly 3 in the first cavity 104, respectively, and sets the second AISC chip 401 and the second MEMS chip 402 in the second chip assembly 4 in the second cavity 105, respectively. A first metal layer 5 that surrounds the first chip assembly 3 and the second chip assembly 4 is also fixed on the circuit board 2. In this way, the area of the first chip assembly 3 and the area of the second chip assembly 4 can be separated by the first metal layer 5 to avoid the problem that the heat generated by the operation of the AISC chip affects the performance of other devices by heat conduction through the substrate of the circuit board 2 or thermal movement of the air.
[0040] The above is only an embodiment of the present invention. It should be pointed out that those skilled in the art can make improvements without departing from the inventive concept of the present invention, but these improvements are all within the scope of protection of the present invention.
Claims
1. A microphone comprising a housing, a circuit board fixed to the housing and forming a first cavity and a second cavity with the housing, a first chip assembly fixed to a side of the circuit board near the housing and located in the first cavity, and a second chip assembly fixed to a side of the circuit board near the housing and located in the second cavity; the first chip assembly comprises a first AISC chip and a first MEMS chip, the second chip assembly comprises a second AISC chip and a second MEMS chip, and the first cavity and the second cavity are connected to each other; characterized in that The microphone further includes a first metal layer fixed to a side of the circuit board close to the housing and respectively surrounding the first chip assembly and the second chip assembly. The housing is fixed to a side of the first metal layer away from the circuit board.
2. The microphone according to claim 1, wherein The shell includes a shell with an annular structure and fixed to the first metal layer, a partition protruding from one side of the shell to the other side of the shell and fixed to the first metal layer, and a cover plate that is simultaneously covered on the side of the shell away from the circuit board and the side of the partition away from the circuit board; the cover plate and the circuit board are respectively located on opposite sides of the shell and together form a cavity, and the partition divides the cavity into the first cavity and the second cavity; the microphone also includes a second metal layer that is simultaneously fixed to the side of the shell close to the circuit board and the side of the partition close to the circuit board, and / or a third metal layer that is simultaneously fixed to the side of the shell away from the circuit board and the side of the partition away from the circuit board, the second metal layer is adhered and fixed to the first metal layer; the cover plate is covered on the side of the third metal layer away from the circuit board; the second metal layer fixed on the partition and / or the third metal layer fixed on the partition are provided with a notch, and the notch connects the first cavity and the second cavity.
3. The microphone according to claim 2, wherein The second metal layer fixed on the partition and the third metal layer fixed on the partition are respectively provided with the notches.
4. The microphone according to claim 2, wherein The total area of all the notches is less than 6400um 2 .
5. The microphone according to claim 2, wherein The orthographic projections of the second metal layer and / or the third metal layer toward the circuit board respectively coincide with the first metal layer.
6. The microphone according to claim 2, wherein The housing further includes a through hole that passes through the partition and connects the first cavity and the second cavity, and the area of the through hole is less than 6400um 2 .
7. The microphone according to claim 2, wherein The shell is rectangular, and the partition is formed by extending from a middle area on one side of the shell to a middle area on the other side thereof.
8. The microphone according to claim 1, wherein The inner side of the shell close to the first cavity and the second cavity is a metal side wall.
9. The microphone according to claim 1, wherein The first MEMS chip is fixed to a side of the first AISC chip away from the circuit board.
10. The microphone according to claim 1, wherein A sound inlet hole is provided on the circuit board at a position corresponding to the second MEMS chip, and the sound inlet hole connects the second MEMS chip with the outside world.
Citation Information
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