Power supply device and electronic apparatus

Abstract

The invention discloses a power supply device and electronic equipment. The power supply device comprises a shell, a power circuit board, a magnetic device assembly, a heat dissipation assembly and a control circuit board, the shell is provided with a first cavity and a second cavity which are spaced from each other, and the first cavity and the second cavity are filled with a first heat conduction layer and a second heat conduction layer respectively; the power circuit board and the magnetic device assembly are respectively arranged on the first heat conduction layer and the second heat conduction layer; the heat dissipation assembly is arranged on the power circuit board; the control circuit board is arranged on the heat dissipation assembly. By means of the mode, the power supply device can effectively simplify material types and grading, improve the device layout density and integration degree, reduce the occupied space and simplify the production process, so that the production and manufacturing cost can be effectively reduced, and the production efficiency is improved; and the heat dissipation assembly is arranged between the power circuit board and the control circuit board for double-sided heat dissipation, so that the heat dissipation area and the heat dissipation efficiency can be greatly improved, and a better heat dissipation effect is achieved.

Description

Technical Field

[0001] The present application relates to the field of power supply technology, and in particular to a power supply device and an electronic device. Background Art

[0002] Nowadays, as an important component of electronic equipment, power supply devices are receiving more and more attention in the actual research and development and manufacturing of electronic products. For the product performance of power supply devices, their heat dissipation performance, integration and size are usually factors that cannot be ignored.

[0003] However, the power supply device in the related art has a variety of material types and grades, a complex production process, a low device layout density, and a low integration level, resulting in a large size and not conducive to heat dissipation. Summary of the invention

[0004] The power supply device and electronic device provided in the present application can solve the comprehensive problems in the prior art of the power supply device, namely, the large variety and grade of materials, the complex production process, the low device layout density and the low integration, resulting in a large volume and not conducive to the realization of heat dissipation.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a power supply device, wherein the power supply device includes: a shell, provided with a first cavity and a second cavity separated from each other, the first cavity and the second cavity are respectively filled with a first thermal conductive layer and a second thermal conductive layer; a power circuit board and a magnetic device assembly are respectively arranged on the first thermal conductive layer and the second thermal conductive layer; a heat dissipation assembly is arranged on the power circuit board and / or the magnetic device assembly; and a control circuit board is arranged on the heat dissipation assembly.

[0006] The gap between the heat dissipation component and the power circuit board and / or the magnetic device component is further filled with a third heat conduction layer; and / or the gap between the heat dissipation component and the control circuit board is further filled with a fourth heat conduction layer.

[0007] Among them, the shell is also provided with a first heat-conducting pipe corresponding to the first cavity and the second cavity, the heat dissipation assembly is provided with a second heat-conducting pipe, the first heat-conducting pipe is connected to the second heat-conducting pipe, the first heat-conducting layer is arranged in the gap between the first heat-conducting pipe and the power circuit board, and the second heat-conducting layer is arranged in the gap between the first heat-conducting pipe and the magnetic device assembly.

[0008] Among them, a heat conduction pipe is also provided on the shell, and a heat conduction sleeve is also provided corresponding to the heat conduction pipe of the heat dissipation component. The heat conduction sleeve is connected to the second heat conduction pipe and is sleeved on the outer wall of the heat conduction pipe. The heat conduction pipe is connected to the first heat conduction pipe.

[0009] The magnetic device assembly is also provided with a plug-in column, and the control circuit board is provided with a plug-in hole corresponding to the plug-in column, and the plug-in column is embedded in the plug-in hole to detachably connect the magnetic device assembly and the control circuit board.

[0010] The power supply device further comprises a screw-connecting assembly, and the power circuit board is connected to the magnetic device assembly via the screw-connecting assembly.

[0011] The power supply device further comprises a cover body, which is connected to the shell to form a receiving cavity, and the power circuit board, the magnetic device assembly, the heat dissipation assembly and the power circuit board are all arranged in the receiving cavity.

[0012] The magnetic device assembly includes a charger main transformer and a voltage conversion main transformer, and the charger main transformer and the voltage conversion main transformer share the same magnetic core.

[0013] Among them, the magnetic device assembly also includes a circuit substrate, a power factor correction inductor and a voltage conversion output differential mode inductor. The power factor correction inductor, the voltage conversion output differential mode inductor, the charger main transformer and the windings in the voltage conversion main transformer are all arranged in the circuit of the circuit substrate.

[0014] To solve the above technical problems, another technical solution adopted in the present application is: to provide an electronic device, wherein the electronic device includes a housing and a power supply device connected to the housing; wherein the power supply device is a power supply device as described in any one of the above items.

[0015] The beneficial effects of the present application are as follows: different from the prior art, the shell of the power supply device provided by the present application is provided with a first cavity and a second cavity spaced apart from each other, and the first cavity and the second cavity are respectively filled with a first heat-conducting layer and a second heat-conducting layer; the power circuit board and the magnetic device assembly are respectively arranged on the first heat-conducting layer and the second heat-conducting layer; the heat dissipation assembly is arranged on the power circuit board; and the control circuit board is arranged on the heat dissipation assembly, so that the power electronic components can be integrated on the power circuit board, and the devices involving the transmission and conversion of electromagnetic energy, such as transformers and inductors, can be integrated on the magnetic device assembly, and the same control circuit board can be used to realize signal control, so as to effectively realize charging and discharging, The number of circuit boards with power conversion function is reduced to 3, which greatly reduces the number of circuit boards, effectively simplifies the types and classification of materials, improves the device layout density and integration, thereby reducing the volume occupied, and simplifies the production process to effectively reduce the production cost and improve production efficiency; and by arranging the heat dissipation component between the power circuit board and / or the magnetic device component and the control circuit board for double-sided heat dissipation, and using the first heat conductive layer and the second heat conductive layer to dissipate the other side of the power circuit board and / or the magnetic device component away from the control circuit board, the overall heat dissipation area and heat dissipation efficiency can be greatly improved to achieve better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is an exploded schematic diagram of an embodiment of a power supply device of the present application;

[0017] Figure 2 yes Figure 1 A schematic diagram of the power supply device;

[0018] Figure 3 It is a schematic structural diagram of an embodiment of an electronic device of the present application. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0021] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0023] See also Figure 1 and Figure 2 ,in, Figure 1 is an exploded schematic diagram of an embodiment of a power supply device of the present application, Figure 2 yes Figure 1 In this embodiment, the power supply device 10 includes: a housing 11, a power circuit board 12, a magnetic device assembly 13, a heat dissipation assembly 14 and a control circuit board 15.

[0024] Among them, a power supply device 10 provided in the present application can be specifically applied in new energy electric vehicles to convert the AC power of the power grid into DC power to charge the power battery of the new energy electric vehicle, and at the same time, the power battery's electric energy can be converted into AC power to provide power for the external electrical load. Of course, in other embodiments, the power supply device 10 can also be specifically used in any other reasonable electronic mechanical equipment driven by electric energy, such as drones, intelligent robots, or industrial mechanical arms, and this embodiment does not limit this.

[0025] Specifically, the shell 11 is used to provide physical support and protection, and its material selection should take into account mechanical strength, corrosion resistance and thermal conductivity. The shell 11 is provided with a first cavity 101 and a second cavity 102 separated from each other. The first cavity 101 and the second cavity 102 are respectively filled with a first heat-conducting layer (not shown in the figure) and a second heat-conducting layer (not shown in the figure) for efficient heat conduction.

[0026] The power circuit board 12 is used to carry power electronic components to realize signal functions such as charging and discharging, and power conversion.

[0027] The magnetic device assembly 13 includes a transformer, an inductor, etc., which are used for transmitting and transforming electromagnetic energy to manage the heat generated thereby and prevent overheating from affecting performance.

[0028] The power circuit board 12 is arranged on the first heat-conducting layer to ensure that the heat generated by the power circuit board 12 can be quickly transferred to the first heat-conducting layer; the magnetic device assembly 13 is arranged on the second heat-conducting layer to transfer the heat generated by the magnetic device assembly 13 to the second heat-conducting layer.

[0029] The heat dissipation component 14 is arranged on the power circuit board 12 and / or the magnetic device component 13, and the control circuit board 15 is further arranged on a side surface of the heat dissipation component 14 away from the power circuit board 12; and the heat dissipation component 14 can specifically be in direct contact with the power circuit board 12 and / or the magnetic device component 13, and the control circuit board 15 or be connected thereto through a thermally conductive material; and the heat dissipation component 14 can specifically be a heat sink, a fan, a heat pipe or a liquid cooling system, etc., for dissipating the heat from the power circuit board 12 and / or the magnetic device component 13, and the control circuit board 15 from both sides, thereby ensuring that the heat generated by the power circuit board 12 and the control circuit board 15 can be dissipated through the heat dissipation component 14, and the present application does not limit this.

[0030] Among them, the control circuit board 15 is used to monitor and control the working status of the power circuit board 12 and the magnetic device assembly 13, so as to adjust one or more of any reasonable electrical signals such as voltage, current and control signals, so as to realize signal functions such as charging and discharging, and power conversion.

[0031] Furthermore, the interior of the magnetic core of the magnetic device assembly 13 may be filled with high-performance thermally conductive materials to connect to the thermally conductive layer and transfer to the water channel for heat dissipation.

[0032] The above method integrates various power electronic components into the power circuit board 12, and integrates transformers, inductors and other devices involved in the transmission and conversion of electromagnetic energy into the magnetic device assembly 13, and uses the same control circuit board 15 to realize signal control, thereby effectively reducing the number of circuit boards that realize charging and discharging and power conversion functions to 3, thereby greatly reducing the number of circuit boards, and effectively simplifying the types and classifications of materials, improving the device layout density and integration, so as to reduce the occupied volume, and simplify the production process to effectively reduce the production cost and improve production efficiency; and by arranging the heat dissipation assembly 14 between the power circuit board 12 and / or the magnetic device assembly 13 and the control circuit board 15 for double-sided heat dissipation, and using the first thermal conductive layer and the second thermal conductive layer to dissipate the other side of the power circuit board 12 and / or the magnetic device assembly 13 away from the control circuit board 15, the overall heat dissipation area and heat dissipation efficiency can be greatly improved to achieve better heat dissipation effect.

[0033] In some embodiments, a third thermal conductive layer (not shown) is also filled in the gap between the heat dissipation component 14 and the power circuit board 12 and / or the magnetic device component 13. The third thermal conductive layer can be specifically obtained by filling the gap between the heat dissipation component 14 and the power circuit board 12 and / or the magnetic device component 13 with any reasonable high thermal conductivity material such as thermal grease, thermal pad, etc., to ensure that the heat generated by the power circuit board 12 and / or the magnetic device component 13 can be quickly transferred from the heating element to the heat dissipation component 14. This application does not limit this.

[0034] In some embodiments, without changing the overall shape of the product, the length and width of the power circuit board 12 and the control circuit board 15 can be appropriately modified according to the application scenario requirements. The magnetic core of the magnetic device assembly 13 can also be filled with high-performance thermal conductive materials to connect to the thermal conductive layer and transfer to the water channel for heat dissipation, which is not limited in this application.

[0035] In some embodiments, a fourth thermal conductive layer (not shown) is further filled in the gap between the heat dissipation component 14 and the control circuit board 15. The fourth thermal conductive layer may be the same as the third thermal conductive layer or may be different from the third thermal conductive layer. The fourth thermal conductive layer is obtained by filling the gap between the heat dissipation component 14 and the control circuit board 15 with any reasonable high thermal conductivity material such as thermal grease and thermal pad to ensure that the heat generated by the control circuit board 15 can be quickly transferred from the heating element to the heat dissipation component 14. This application does not limit this.

[0036] In another embodiment, the heat dissipation component 14 can be spaced apart from the power circuit board 12 and the control circuit board 15, that is, heat is dissipated by air without filling a thermal conductive layer. This is determined by the actual application scenario and is not limited in this application.

[0037] In some embodiments, a first heat-conducting pipe 111 is further provided at the bottom of the shell 11 corresponding to the first cavity 101 and the second cavity 102. The first heat-conducting pipe 111 runs through the first cavity 101 and the second cavity 102 of the shell 11 and is used to guide the flow of heat generated by the power circuit board 12 and the magnetic device assembly 13; the heat dissipation assembly 14 is provided with a second heat-conducting pipe, and the first heat-conducting pipe 111 is connected to the second heat-conducting pipe to form a complete heat conduction path to further improve the heat conduction efficiency.

[0038] Among them, the first heat-conducting layer is specifically arranged in the gap between the first heat-conducting pipe 111 and the power circuit board 12; the second heat-conducting layer is arranged in the gap between the first heat-conducting pipe 111 and the magnetic device assembly 13; the first heat-conducting layer and the second heat-conducting layer can be specifically made of materials with high thermal conductivity, such as thermal grease, thermal pads, etc., to ensure that heat can be quickly transferred from the heating element to the heat-conducting layer and the heat-conducting pipe 112.

[0039] In some embodiments, the first heat conducting pipe 111 and the second heat conducting pipe are used to accommodate coolant or cold water, and are connected to an external water pump and a circulation or drainage pipe, so that when the coolant or cold water in the first heat conducting pipe 111 and the second heat conducting pipe is driven by the water pump to circulate and discharged from the circulation or drainage pipe, the heat generated by the power circuit board 12, the magnetic device assembly 13 and the control circuit board 15 can be effectively taken away, so as to ensure that the power circuit board 12, the magnetic device assembly 13 and the control circuit board 15 can work well.

[0040] Among them, the shell 11 is also provided with a water inlet pipe 105 and a water outlet pipe 106, and the first heat-conducting pipe 111 is connected to the water outlet pipe 106 and the water inlet pipe 105, so as to be connected with an external water pump and a circulation or drainage pipe through the water inlet pipe 105 and the water outlet pipe 106 respectively, thereby forming a heat dissipation channel of the water pump, the water inlet pipe 105, a part of the first heat-conducting pipe 111, the second heat-conducting pipe, another part of the first heat-conducting pipe 111, the water outlet pipe 106, and the circulation or drainage pipe that are connected in sequence, so that the power circuit board 12, the magnetic device assembly 13 and the control circuit board 15 can be circulated and cooled through the heat dissipation channel.

[0041] In some embodiments, the first heat-conducting pipe 111 can specifically correspond to any reasonable linear setting such as a curve or a broken line on the side of the power circuit board 12 and the magnetic device assembly 13 facing the shell 11, so as to increase its heat dissipation area as much as possible and improve its heat dissipation efficiency; similarly, the second heat-conducting pipe can specifically correspond to any reasonable linear setting such as a curve or a broken line on the side of the control circuit board 15 facing the shell 11, so as to increase its heat dissipation area as much as possible and improve its heat dissipation efficiency, which is specifically determined by the actual heat dissipation scenario and is not limited in this application.

[0042] It is understandable that, through the reasonable spatial arrangement of the first heat-conducting pipe 111 and the second heat-conducting pipe, the heat can be effectively dissipated from the opposite sides of the power circuit board 12 and / or the magnetic device assembly 13, and the heat can be dissipated from the control circuit board 15 simultaneously, that is, a double-layer planar water channel design is adopted to achieve three-sided heat dissipation of the heat source, so that the heat dissipation area and efficiency are greatly increased, thereby ensuring a better heat dissipation effect and being able to greatly reduce the size of the entire machine.

[0043] In other embodiments, the second heat-conducting pipe can be specifically replaced by a liquid storage cavity of any reasonable shape, such as a rectangular parallelepiped or an irregular cube with a hollow interior and uniform thickness, for circulating cooling liquid or cold water to dissipate heat for the power circuit board 12 and / or the magnetic device assembly 13, and the control circuit board 15. The specific shape is determined by the actual application scenario and is not limited in this application.

[0044] In some embodiments, the shell 11 is further provided with a heat conducting pipe 112, which is connected to the first heat conducting pipe 111. The heat dissipation component 14 is further provided with a heat conducting sleeve 141 corresponding to the heat conducting pipe 112, which is connected to the second heat conducting pipe and is sleeved on the outer wall of the heat conducting pipe 112, so as to connect the first heat conducting pipe 111 with the second heat conducting pipe through the heat conducting pipe 112 and the heat conducting sleeve 141.

[0045] It can be understood that the heat pipe 112 and the heat sleeve 141 can be specifically perpendicular to the bottom of the shell 11, so as to pass through the plane where the power circuit board 12 and / or the magnetic device assembly 13 are located to connect with the second heat pipe in the heat dissipation assembly 14, so as to further dissipate the heat inside the shell 11 in a three-dimensional direction; and the heat pipe 112 can be specifically installed at a suitable position on the shell 11, especially in an area where heat is accumulated and is not easily dissipated, so as to strengthen the heat conduction path.

[0046] In some embodiments, in order to ensure the sealing of the connection between the thermal sleeve 141 and the heat pipe 112, a sealing ring 1411 is further provided at the position where the thermal sleeve 141 and the heat pipe 112 are connected, that is, the sealing ring 1411 is further sleeved on the outer wall of the thermal sleeve 141 to effectively ensure the sealing of the entire heat dissipation channel connection position.

[0047] In some embodiments, the magnetic device assembly 13 is also provided with a plug-in post 131, and specifically, at least two plug-in posts 131 are provided at the outer edge of the side of the magnetic device assembly 13 facing the control circuit board 15, and the control circuit board 15 is specifically provided with a plug-in hole 151 corresponding to each plug-in post 131, and the plug-in post 131 is embedded in the plug-in hole 151 to achieve a detachable connection between the magnetic device assembly 13 and the control circuit board 15 to simplify the production process.

[0048] In some embodiments, the plug post 131 and the plug hole 151 can specifically be conductive materials, so as to realize a detachable physical connection between the magnetic device assembly 13 and the control circuit board 15 to provide strength support, and at the same time, the magnetic device assembly 13 and the control circuit board 15 can be electrically connected to provide an electrical path for signal interaction between the two; the plug post 131 and the plug hole 151 can also be non-conductive materials, and the electrical connection between the magnetic device assembly 13 and the control circuit board 15 can be realized through another conductive line, which is specifically determined by the actual application scenario and is not limited in this application.

[0049] In some embodiments, the power supply device 10 further includes a screw-connecting assembly 17 , and the power circuit board 12 is detachably connected to the magnetic device assembly 13 via the screw-connecting assembly 17 .

[0050] The screw connection component 17 can be a conductor or a non-conductor. When the conductor is a conductor, the connection method realized by the screw connection component 17 is suitable for large current electrical connection, and can not only realize good electrical connection, but also provide good structural support strength.

[0051] In some embodiments, the magnetic device assembly 13 is further detachably connected to the housing 11 via a screw assembly 17 to provide strength support through the housing 11 .

[0052] In some embodiments, the power supply device 10 specifically also includes a cover body 16, which is connected to the shell 11 to form an internally enclosed accommodating cavity, that is, the sealing of the whole machine is formed by the combination of the shell 11 and the cover body 16. The power circuit board 12, the magnetic device assembly 13, the heat dissipation assembly 14 and the power circuit board 12 are all arranged in the accommodating cavity to protect each functional unit through the shell 11 and the cover body 16.

[0053] In some embodiments, the magnetic device assembly 13 may further include a charger main transformer (not shown) and a voltage conversion main transformer (not shown), and the charger main transformer and the voltage conversion main transformer share the same magnetic core, that is, the charger main transformer and the voltage conversion main transformer are integrated together using magnetic integration technology and planar transformer technology, and share the same transformer core, thereby reducing the number of magnetic devices and greatly reducing the size of the magnetic devices, and the power density of the whole machine can also be greatly improved.

[0054] In some embodiments, the magnetic device assembly 13 specifically also includes a circuit substrate (not shown in the figure), a power factor correction inductor (not shown in the figure) and a voltage conversion output differential mode inductor (not shown in the figure). The power factor correction inductor, the voltage conversion output differential mode inductor, the charger main transformer and the windings in the voltage conversion main transformer are all arranged in the circuit of the circuit substrate, that is, the power factor correction inductor, the voltage conversion output differential mode inductor, the charger main transformer and the windings in the voltage conversion main transformer are all formed by the copper foil in the circuit substrate to further reduce the space occupied by the magnetic device, improve the power density, and make the magnetic core surface area in the magnetic device assembly 13 large and the heat dissipation better.

[0055] In some embodiments, the magnetic device assembly 13 can also make appropriate changes to the shape of the magnetic core and the shape of the circuit substrate according to circuit performance, and can also use Litz wire to replace the copper foil in the circuit substrate to form a winding of a transformer or inductor. This application does not limit this.

[0056] In some embodiments, the power circuit board 12 specifically includes a power semiconductor device (not shown) and its related circuits. The power circuit board 12 is installed at the bottom of the housing 11 to achieve heat conduction from the power semiconductor device to the housing 11.

[0057] The power circuit board 12 mainly includes a secondary output side circuit of a voltage conversion main transformer, and the occupied area in the housing 11 is greatly reduced. The power circuit board 12 is connected to the housing 11 and the magnetic device assembly 13 respectively through a screw assembly 17.

[0058] Furthermore, semiconductor devices of the power circuit board 12 may be increased or decreased according to the output power and voltage level requirements.

[0059] In some specific embodiments, the power supply device 10 can be specifically an on-board power supply in a new energy electric vehicle, and can specifically be an on-board charger and an on-board DCDC (Direct Current) power supply combined into one to improve the integration and design into a complete whole product. The whole product is sealed by combining the shell 11 and the cover 16 to provide protection performance above IP67 (Ingress Protection Rating) level, meeting the protection level requirements of the on-board power supply.

[0060] The power supply device 10 also has an independent heat dissipation water channel, that is, the first heat-conducting pipe 111, the second heat-conducting pipe 112, the heat-conducting sleeve 141 and the heat dissipation component 14 constitute a three-dimensional heat-conducting channel, which is used to circulate cooling liquid to dissipate the heat generated by the power circuit board 12, the magnetic device component 13 and the control circuit board 15.

[0061] The magnetic device assembly 13 includes a power factor correction inductor, a charger main transformer, a voltage conversion main transformer and a voltage conversion output differential mode inductor. The power factor correction inductor and the voltage conversion output differential mode inductor are magnetic devices of independent modules, and the charger main transformer and the voltage conversion main transformer are magnetic integrated module magnetic devices. The magnetic device assembly 13 is connected to the control circuit board 15 by plug-in connection, and is connected to the housing 11 by screw connection.

[0062] The magnetic device assembly 13 has an electrical connection part, wherein the voltage conversion output differential mode inductor is electrically connected to the power circuit board 12, and the connection method is a screw connection method, which is suitable for large current electrical connection. The screw connection can not only achieve good electrical connection, but also provide good structural support strength.

[0063] The output side of the voltage conversion main transformer is directly connected to the voltage conversion output differential mode inductor on the magnetic device assembly 13. Specifically, the low voltage side output of the voltage conversion main transformer is directly connected to the voltage conversion output differential mode inductor through the copper foil inside the magnetic device assembly 13. The two ends of the power factor correction inductor are connected to the control circuit board 15 in a plug-in connection manner, which simplifies the production process.

[0064] In some embodiments, the power supply device 10 also includes a connector 18, which includes an AC (Alternating Current) input connector (not shown), an HV (Horizontal) output connector (not shown), a DCDC positive output connector (not shown), a signal connector (not shown) and an air release valve (not shown). The connector 18 is installed on the shell 11, and the position of the connector 18 on the shell can be appropriately changed according to the application scenario, and also includes a water inlet and a water outlet to realize the electrical connection between the inside of the whole machine, that is, the power circuit board 12, the magnetic device assembly 13 and the control circuit board 15 and the outside, as well as the sealing performance at the connector 18.

[0065] In some embodiments, the control circuit board 15 has a main power circuit of an on-board charger (not shown in the figure), a main power circuit of an on-board DCDC power supply (not shown in the figure), an EMC (Electromagnetic Compatibility) filter unit (not shown in the figure), a control circuit (not shown in the figure), an auxiliary power supply circuit (not shown in the figure), etc., with a high degree of integration, and there is no need to make separate PCBA (Printed Circuit Board Assembly) sub-boards such as AC input filter board and HV output filter board to improve power density, thereby effectively improving production efficiency and PCBA board layout density.

[0066] Among them, the shell 11 is specifically also provided with a third cavity 103 and a fourth cavity 104 corresponding to the EMC filter unit, and different filter components of the EMC filter unit are respectively arranged in the third cavity 103 and the fourth cavity 104; the bottom of the shell 11 is also provided with a surrounding plate, and the first cavity 101, the second cavity 102, the third cavity 103 and the fourth cavity 104 are separated by the surrounding plate.

[0067] The circuit substrate is fixed to the first cavity 101 by screws, and the bottom magnetic core in the charger main transformer and the voltage conversion main transformer and the first cavity 101 are filled with thermally conductive material to achieve conductive heat dissipation to the shell 11, and the top magnetic core in the charger main transformer and the voltage conversion main transformer and the heat dissipation component 14 are filled with thermally conductive material to achieve conductive heat dissipation to the heat dissipation component 14, and the semiconductor power devices in the power circuit board 12 are filled with thermally conductive material to achieve conductive heat dissipation to the heat dissipation component 14.

[0068] The heat dissipation assembly 14 is inserted into the heat pipe 112 through a heat conductive sleeve 141, and a sealing ring 1411 is installed on the heat conductive sleeve 141 to achieve sealing at the connection. The power circuit board 12 is installed in the first cavity 101 by screws, and the bottom of the first cavity 101 is filled with heat conductive material to achieve heat conduction and heat dissipation to the housing 11.

[0069] The above solution effectively reduces the number of PCBA boards and reduces the structural complexity and process difficulty of the whole machine by combining the on-board charger and the on-board DCDC into one. The power circuit board 12 and the magnetic device assembly 13 are located on the bottom surface of the whole machine housing 11, and the power circuit board 12 and the magnetic device assembly 13 are located below the control circuit board 15. The overall structure is a two-layer structure.

[0070] The housing 11 adopts a double-layer planar water channel design to achieve heat dissipation on three sides of the heat source, namely the power circuit board 12, the magnetic device assembly 13 and the control circuit board 15, greatly increasing the heat dissipation area and efficiency. The circuit board includes the power circuit board 12, the circuit substrate in the magnetic device assembly 13 and the control circuit board 15. The number of PCBA boards is reduced to 3, which greatly reduces the number of PCBA boards and improves production efficiency. The magnetic device assembly 13 adopts magnetic integration technology and planar transformer technology as a whole. The winding in the magnetic device assembly 13 is formed by the copper foil in the circuit substrate. The main transformer of the charger and the main transformer of the DCDC power supply are integrated together and share the same magnetic core, which greatly reduces the volume of the magnetic device, so that the power density of the whole machine can be greatly improved.

[0071] This application also provides an electronic device, see Figure 3 , Figure 3 1 is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention. In this embodiment, the electronic device 20 includes a housing 21 and a power supply device 22 connected to the housing 21 .

[0072] In some embodiments, the electronic device can specifically be any reasonable electronic mechanical device such as a new energy electric vehicle, a drone, an intelligent robot, etc., and this application does not limit this.

[0073] The power supply device 22 is specifically the power supply device 10 as described in any one of the above items. Figure 1-Figure 2 And the related text content will not be repeated here.

[0074] The beneficial effects of the present application are as follows: different from the prior art, the shell of the power supply device provided by the present application is provided with a first cavity and a second cavity spaced apart from each other, and the first cavity and the second cavity are respectively filled with a first heat-conducting layer and a second heat-conducting layer; the power circuit board and the magnetic device assembly are respectively arranged on the first heat-conducting layer and the second heat-conducting layer; the heat dissipation assembly is arranged on the power circuit board; and the control circuit board is arranged on the heat dissipation assembly, so that the power electronic components can be integrated on the power circuit board, and the devices involving the transmission and conversion of electromagnetic energy, such as transformers and inductors, can be integrated on the magnetic device assembly, and the same control circuit board can be used to realize signal control, so as to effectively realize charging and discharging, The number of circuit boards with power conversion function is reduced to 3, which greatly reduces the number of circuit boards, effectively simplifies the types and classification of materials, improves the device layout density and integration, thereby reducing the volume occupied, and simplifies the production process to effectively reduce the production cost and improve production efficiency; and by arranging the heat dissipation component between the power circuit board and / or the magnetic device component and the control circuit board for double-sided heat dissipation, and using the first heat conductive layer and the second heat conductive layer to dissipate the other side of the power circuit board and / or the magnetic device component away from the control circuit board, the overall heat dissipation area and heat dissipation efficiency can be greatly improved to achieve better heat dissipation effect.

[0075] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A power supply device, characterized in that: The power supply device comprises: A housing is provided with a first cavity and a second cavity spaced apart from each other, wherein the first cavity and the second cavity are filled with a first heat-conducting layer and a second heat-conducting layer respectively; A power circuit board and a magnetic device assembly are respectively arranged on the first heat-conducting layer and the second heat-conducting layer; A heat dissipation component, arranged on the power circuit board and / or the magnetic device component; A control circuit board is arranged on the heat dissipation component.

2. The power supply device according to claim 1, characterized in that: The gap between the heat dissipation component and the power circuit board and / or the magnetic device component is further filled with a third heat-conducting layer; and / or the gap between the heat dissipation component and the control circuit board is further filled with a fourth heat-conducting layer.

3. The power supply device according to claim 1, characterized in that: The shell is also provided with a first heat-conducting pipe corresponding to the first cavity and the second cavity, the heat dissipation component is provided with a second heat-conducting pipe, the first heat-conducting pipe is communicated with the second heat-conducting pipe, the first heat-conducting layer is provided in the gap between the first heat-conducting pipe and the power circuit board, and the second heat-conducting layer is provided in the gap between the first heat-conducting pipe and the magnetic device component.

4. The power supply device according to claim 3, characterized in that: The shell is also provided with a heat conducting pipe, and the heat dissipation assembly is also provided with a heat conducting sleeve corresponding to the heat conducting pipe. The heat conducting sleeve is connected to the second heat conducting pipe and is sleeved on the outer wall of the heat conducting pipe. The heat conducting pipe is connected to the first heat conducting pipe.

5. The power supply device according to claim 1, characterized in that: The magnetic device assembly is also provided with a plug-in post, and the control circuit board is provided with a plug-in hole corresponding to the plug-in post. The plug-in post is embedded in the plug-in hole to detachably connect the magnetic device assembly and the control circuit board.

6. The power supply device according to claim 1, characterized in that: The power supply device further comprises a screw connection assembly, through which the power circuit board is connected to the magnetic device assembly.

7. The power supply device according to claim 1, characterized in that: The power supply device further comprises a cover body, wherein the cover body is connected to the shell to form a receiving cavity, and the power circuit board, the magnetic device assembly, the heat dissipation assembly and the power circuit board are all arranged in the receiving cavity.

8. The power supply device according to any one of claims 1 to 7, characterized in that: The magnetic device assembly includes a charger main transformer and a voltage conversion main transformer, and the charger main transformer and the voltage conversion main transformer share the same magnetic core.

9. The power supply device according to claim 8, characterized in that: The magnetic device assembly also includes a circuit substrate, a power factor correction inductor and a voltage conversion output differential mode inductor. The power factor correction inductor, the voltage conversion output differential mode inductor, the charger main transformer and the windings in the voltage conversion main transformer are all arranged in the circuit of the circuit substrate.

10. An electronic device, characterized in that: The electronic device comprises a housing and a power supply device connected to the housing; Wherein, the power supply device is the power supply device as described in any one of claims 1-9.

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